CERAMIC PACKAGES

Addison Engineering stocks over 3.5 million ceramic packages and in excess of
one-million metal alloy lids.

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CERAMIC PACKAGES
These includes

side braze

pin grid array

leadless/leaded chip carriers

flatpacks

headers

Cerdip

cerpac.

Our large inventory allows you to select from a variety of different

configurations.
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CERAMIC PACKAGES
Side Braze
Our side braze packages come in many different lead
counts and cavity sizes. The cavities can be with gold or
without.
They were made by either Kyocera or NTK and
purchased directly from them or from one of the many
users of their products worldwide.
They make a great package for use in production or
as test vehicles for your dies.

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CERAMIC PACKAGES
Pin Grad Array

A pin grid array, often abbreviated PGA, is a type of

integrated circuit packaging. In a PGA, the package is
square or rectangular, and the pins are arranged in a
regular array on the underside of the package

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CERAMIC PACKAGES
Chip Carriers
A chip carrier is one of several kinds of surface mount technology packages for
integrated circuits.

Leadless chip carriers

leaded chip carriers

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CERAMIC PACKAGES
HEADERS
Headers offer single piece construction for added strength and resistance to
stress. The absence of sidewalls help to facilitate circuit installation, as well as
inspection and test accessibility

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CERAMIC PACKAGES
CERDIP
In ceramic (CERDIP) packages, an epoxy or grout is used to hermetically seal the
two halves together, providing an air and moisture tight seal to protect the IC die
inside.

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CERAMIC PACKAGES
METAL ALLOY LIDS
Metal Alloy Lids are used primarily with Cerquad packages that require a glass or Bstaged epoxy coated seal. These lids are used on various multilayer packages where
temperature constraints after die attach require a low temperature lid seal.

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CERAMIC PACKAGES
FLATPACKS
Flatpacks is a Printed-circuit-board surface-mount-component package. Flat package
(FP). A rectangular or square package with leads parallel to base plane attached on two
opposing sides of the package periphery.

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CERAMIC PACKAGES

CERAMIC PACKAGE ASSEMBLY

Addison Engineering can also handle your assembly requirements. We provide fast turn
assembly services, from precision wafer dicing, through die attach, wire bond, and seal
plus test and burn-in. Our staff can free up your valuable engineering resources by taking
your assembly from prototype through full production volumes.

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CERAMIC PACKAGES

Addison Engineering provides Ceramic Packages that are available with a wide range of
characteristics (specifications) to select from.

Thank You

Visit Our Website www.addisonengineering.com