7020 SM 021031

SERVICE MANUAL
MODEL : G7020/W7020
GSM Phone
SERVICE MANUAL
MODEL : G7020/W7020
P/N : MMBD0019001
OCTOBER, 2002
REVISED HISTORY
DATE
ISSUE
CONTENTS OF CHANGES
September/2002
ISSUE 1
Initial Release
S/W VERSION
The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
phones.
-1-
Table Of Contents
1. INTRODUCTION .................................. 3
6.3
6.4
6.5
6.6
1.1 Purpose ............................................... 3

1.2 Regulatory Information ........................ 3
1.3 Abbreviations ....................................... 5
7. STAND ALONE TEST AND TEST

POINTS ................................................ 62
2. PERFORMANCE ................................. 7
2.1 H/W Features ...................................... 7
2.2 Technical Specification ........................ 8
7.1 Testing Setup .................................... 62

7.2 Testing Points .................................... 64
3. TECHNICAL BRIEF ......................... 12
8. DISASSEMBLY INSTRUCTION
Receiver ............................................ 12
Synthesizer ........................................ 15
Transmitter ........................................ 18
13 MHz Clock .................................... 21
Power Supplies and Control Signals
........................................................... 22
3.6 Digital Baseband(DBB) Processor
........................................................... 23
3.7 Analog Baseband(ABB) Processor
........................................................... 27
3.1
3.2
3.3
3.4
3.5
.................................................................
77
9. BLOCK DIAGRAM ........................... 85

9.1 Main Board ..................................... 85
9.2 FPCB .............................................. 86
9.3 RF ................................................... 87
10. Circuit Diagram .............................. 89

10.1 BB Circuit ...................................... 89
10.2 RF Circuit ...................................... 94
4. SEVICE S/W AND CALIBRATION

.................................................................
Tx Trouble ......................................... 54
Voice Function Trouble ..................... 56
Display Function Trouble ................... 58
Other Function Trouble ..................... 60
37
11. PCB LAYOUT .................................. 95
4.1 Service S/W ....................................... 37

4.2 Calibration ......................................... 40
11.1 TOP .............................................. 95

11.2 BOTTOM ...................................... 96
5. DOWNLOAD ...................................... 45
12. EXPLODED VIEW &
REPLACEMENT PART LIST
5.1 Download Setup ................................ 45

5.2 Download Procedure ......................... 46
...............................................................
97
12.1 Exploded View .............................. 97

12.2 Accessories .................................. 99
12.3 Replacement Parts ..................... 100
6. TROUBLE SHOOTING ................... 51

6.1 Rx Trouble (EGSM) ........................... 52
6.2 Rx Trouble (DCS) .............................. 53
-2-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the phones.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your companys employees, agents, subcontractors, or person
working on your companys behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use
of common-carrier telecommunication service of facilities accessed through or connected to it. LGE
will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the phones or compatibility with
the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Theref ore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.
E. Notice of Radiated Emissions

The phones complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
-3-
1. INTRODUCTION
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

An the phones may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
information is ESD handling:
sign. Following
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
-4-
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC
BB
BER
CC-CV
CLA
DAC
DCS
dBm
DSP
EEPROM
EL
ESD
FPCB
GMSK
GPIB
GPRS
GSM
IPUI
IF
LCD
LDO
LED
The phones
LGE
OPLL
PAM
PCB
PGA
PLL
PSTN
RF
RLR
RMS
RTC
SAW
SIM
SLR
SRAM
STMR
Automatic Power Control

Baseband
Bit Error Ratio
Constant Current Constant Voltage
Cigar Lighter Adapter
Digital to Analog Converter
Digital Communication System
dB relative to 1 milliwatt
Digital Signal Processing
Electrical Erasable Programmable Read-Only Memory
Electroluminescence
Electrostatic Discharge
Flexible Printed Circuit Board
Gaussian Minimum Shift Keying
General Purpose Interface Bus
General Packet Radio Service
Global System for Mobile Communications
International Portable User Identity
Intermediate Frequency
Liquid Crystal Display
Low Drop Output
Light Emitting Diode
GSM Phone
Electronics
Offset Phase Locked Loop
Power Amplifier Module
Printed Circuit Board
Programmable Gain Amplifier
Phase Locked Loop
Public Switched Telephone Network
Radio Frequency
Receiving Loudness Rating
Root Mean Square
Real Time Clock
Surface Acoustic Wave
Subscriber Identity Module
Sending Loudness Rating
Static Random Access Memory
Side Tone Masking Rating
-5-
1. INTRODUCTION
TA
TDD
TDMA
UART
VCO
VCTCXO
WAP
Travel Adapter
Time Division Duplex
Time Division Multiple Access
Universal Asynchronous Receiver/Transmitter
Voltage Controlled Oscillator
Voltage Control Temperature Compensated Crystal Oscillator
Wireless Application Protocol
-6-
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item
Feature
Comment
Li-Polymer, 760mAh(820 mAh)

Standard Battery
Size: 44
68.6
5.6 mm
Weight: 22 g
Extended Battery
T.B.D.
AVG TCVR Current
Min: 150mA(Pwr Level 19), Max: 300mA(Pwr Level 5)
Standby Current
< 4.1 mA
Talk time
Min : 2hr30min (2hr40min)
@760(820)mAh
Max : 5hr(5hr20min)
Stand by time
Up to 200 hours
@820mAh
Charging time
2 hours
RX Sensitivity
GSM, EGSM: -108 dBm, DCS: -107 dBm
TX output power
GSM, EGSM: 33(32.5) dBm (Level 5)

DCS: 30(29.5) dBm (Level 0)
GPRS compatibility
Class 10(This only applies to G7020)
SIM card type
Plug-In SIM 3V/5V
Display
Main : 65K Color-STN(128X160)

Sub : Mono(96X64)
Status Indicator : 7-color LED
Key Pad :
Status Indicator & KeyPad
0 ~ 9, #, *, Navigation Key, Up/Down Side Key

Side Key, Confirm Key, Record Key
Send Key, END/PWR Key
ANT
Fixed Type
EAR Phone Jack
Ear-Mic connector
PC Synchronization
Yes
Speech coding
EFR/FR
Data and Fax
Yes
Vibrator
Yes
Speaker
Yes
Voice Recording
Yes
C-Mic
Yes
Receiver
Yes
Travel Adapter
Yes
Options
Hands-free kit, CLA, Data Kit
-7-
2. PERFORMANCE
2.2 Technical Specification

Item
Description
Specification
GSM
TX: 890 + n
RX: 935 + n
Frequency Band
0.2 MHz
0.2 MHz (n = 1 ~ 124)
EGSM
TX: 890 + (n - 1024)
RX: 935 + (n - 1024)
DCS
TX: 1710 + (n-512)
Rx: 1805 + (n-512)
Phase Error
RMS < 5 degrees

Peak < 20 degrees
Frequency Error
< 0.1 ppm
0.2 MHz
0.2 MHz (n = 975 ~ 1024)
0.2 MHz
0.2 MHz (n = 512 ~ 885)
GSM, EGSM
Level
Power
33 dBm
Power Level
Toler.
Level
Power
Toler.
2dB
13
17 dBm
3dB
31 dBm
3dB
14
15 dBm
3dB
29 dBm
3dB
15
13 dBm
3dB
27 dBm
3dB
16
11 dBm
5dB
25 dBm
3dB
17
9 dBm
5dB
10
23 dBm
3dB
18
7 dBm
5dB
11
21 dBm
3dB
19
5 dBm
5dB
12
19 dBm
3dB
Level
Power
Toler.
DCS
Level
Power
30 dBm
2dB
14 dBm
3dB
28 dBm
3dB
12 dBm
4dB
26 dBm
3dB
10
10 dBm
4dB
24 dBm
3dB
11
8 dBm
4dB
22 dBm
3dB
12
6 dBm
4dB
20 dBm
3dB
13
4 dBm
4dB
18 dBm
3dB
14
2 dBm
5dB
16 dBm
3dB
15
0 dBm
5dB
-8-
Toler.
2. PERFORMANCE
Item
Description
Specification
GSM, EGSM
Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz).
Max. dBc
100
+0.5
200
-30
250
-33
400
-60
600 ~ 1,200
-60
1,200 ~ 1,800
-60
1,800 ~ 3,000
-63
3,000 ~ 6,000
-65
6,000
-71
Offset from Carrier (kHz).
Max. dBc
100
+0.5
200
-30
250
-33
400
-60
600 ~ 1,200
-60
1,200 ~ 1,800
-60
1,800 ~ 3,000
-65
3,000 ~ 6,000
-65
6,000
-73
DCS
GSM, EGSM
Output RF Spectrum
(due to switching transient)
Spurious Emissions
Offset from Carrier (kHz)
Max. (dBm)
400
-19
600
-21
1,200
-21
1,800
-24
Offset from Carrier (kHz)
Max. (dBm)
400
-22
600
-24
1,200
-24
1,800
-27
GSM
Conduction, Emission Status

Conduction, Emission Status
-9-
2. PERFORMANCE
Item
Description
Bit Error Ratio
RX Level Report Accuracy
10
SLR
11
12
13
Specification
GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
3 dB
8
Frequency (Hz)
Max.(dB)
Min.(dB)
100
-12
200
300
-12
1,000
-6
2,000
-6
3,000
-6
3,400
-9
4,000
Frequency (Hz)
Max.(dB)
Min.(dB)
100
-12
200
300
-7
500
-5
1,000
*
0
-5
3,000
-5
3,400
-10
4,000
Sending Response
RLR
3 dB
2 3 dB
Receiving Response
* Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.
14
STMR
13
15
Stability Margin
> 6 dB
16
5 dB
dB to ARL (dB)
Level Ratio (dB)
-35
17.5
-30
22.5
-20
30.7
-10
33.3
33.7
31.7
10
25.5
Sending Distortion
17
Side tone Distortion
Three stage distortion < 10%
18
System frequency (13 MHz) tolerance
2.5 ppm
- 10 -
2. PERFORMANCE
Item
Description
Specification
19
32.768KHz tolerance
30 ppm
20
Ringer Volume
At least 80 dB under below conditions:

1. Ringer set as ringer.
2. Test distance set as 50 cm
21
Charge Voltage
Fast Charge : < 500 mA

Slow Charge: < 60 mA
22
Antenna Display
23
Battery Indicator
24
Low Voltage Warning
25
Forced shut down Voltage
26
Battery Type
27
Travel Charger
Antenna Bar Number
Power
5
4
3
2
1
0
Batter Bar Number
-85 dBm ~
-90 dBm ~ -86 dBm
-95 dBm ~ -91 dBm
-100 dBm ~ -96 dBm
-105 dBm ~ -101 dBm
~ -105 dBm
Voltage
0
1
2
3
~ 3.62 V
3.62 ~ 3.73 V
3.73 ~ 3.82 V
3.82 V ~
3.5
3.62
0.03 V (Call)
0.03 V (Standby)
3.35
0.03 V
1 Li-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 760 mAh(820 mAh)
Switching-mode charger
Input: 100 ~ 240 V, 50/60 Hz
Out put: 5.2 V, 600 mA
- 11 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Receiver
The receiver part consists of a dual band(GSM & DCS) antenna switch, two RF SAW filters, a
external dual RF VCO and a transceiver IC(TRF6150). All active circuits for a complete receiver
chain with the exception of RF VCO are contained in the transceiver IC(TRF6150).
The TRF6150 chip set has direct conversion structure, so the received RF signal is directly
converted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz), which contains
two LNAs and three direct conversion demodulators for E-GSM, DCS and PCS. The demodulated I
and Q signals pass two base band AGC amplifiers and a channel filter, which are on both I and Q
signal paths. The RF front-end circuit is shown Fig. 3-1.
Figure 3-1. RF front-end circuit.
- 12 -
3. TECHNICAL BRIEF
3.1.1 RF front end

RF front end consists of an antenna, a dual band antenna switch, two RF SAWs and two LNAs for
E-GSM, DCS band, which are contained in the transceiver IC (TRF6150).
The RF received signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are input via the
antenna or coaxial connector. An antenna matching circuit is between the antenna and the
connector.
VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. When the
RX path is turned on, the received RF signal, which has passed through the dual band antenna
switch, is filtered by an appropriate RF SAW filter for better stop band rejection. The filtered RF
signal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a direct
conversion demodulator. This process is thecsame both GSM and DCS.
The logic and current is given below. Table 3-1.
Table 3-1. The logic and current
VC1
VC2
GSM TX
2.7 V
0V
DCS TX
0V
2.7 V
GSM/DCS RX
0V
0V
3.1.2 Demodulator and Baseband Processing

IF stage is not necessary in this system because the receiver is based on direct conversion
architecture. So the RX LO frequency is the same as input radio frequency. The amplified signal at
LNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BB
signals. The BB I&Q signals pass via two integrated baseband amplifiers with digitally
programmable gain and two fully integrated baseband channel filters to the baseband A/D
converters which is contained in baseband chipset. Fig.3-2 shows RX path block diagram.
3.1.3 DC offset compensation

The transceiver IC(TRF6150) is based on direct-conversion architecture. This implies that a
parasitic DC offset may appear at the output of the IQ demodulator. To reduce the static offset due
to components mismatch and LO self-mixing, the IC includes a hardware DC offset compensation
circuit on both I and Q base band paths. The transceiver IC uses a divider by 2 for LO generation in
EGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LO
radiation. In addition, a quadrature demodulator gain mismatch calibration system is used to reduce
the signal distortion.
- 13 -
3. TECHNICAL BRIEF
Figure 3-2. RX path block diagram.

Table 3-2. Gain and Noise Figure of RX path.
Gain(dB)
NF(dB)
Ant. switch
RF SAW Filter
I,Q demodulator(LNA+Mixer)
GSM
-0.6
-2.5
26
DCS
-0.7
-3.2
23
GSM
DCS
3.5
Table 3-3. Total Gain and Noise Figure of RX path.
GSM, EGSM
DCS
Total Gain
22.9 dB
19.1 dB
- 14 -
Total Noise Figure

7.2 dB
8.2 dB
3. TECHNICAL BRIEF
3.2 Synthesizer
The TRF6150 includes two synthesizer parts. Two synthesizers consist of an IF synthesizer, which
is an integer-N synthesizer, and a RF synthesizer, which is a fractional-N synthesizer. The TRF6150
is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. So, synthesizers
use a number of techniques to improve lock time, making them well suited to GPRS.
The main fractional-N synthesizer (RF synthesizer), which includes a RF VCO with external tank
circuits, is necessary for both transmitting and receiving operation. The RF VCO works only when
the transmitting operation is on. The main fractional-N synthesizer has frequency band from 1294
MHz to 1356 MHz. Output frequency of the RF VCO is set by the factional number, prescaler and
counter. An buffer amplifier follows the RF VCO. The purpose of the buffer is to give reverse
isolation and prevent any frequency pulling of the VCO when the transceiver is powered UP and
DOWN.
A dual band external VCO, which uses the PLL block of the main fractional-N synthesizer, is
necessary for transmitting and receiving operation. The dual band means that it can support GSM,
DCS frequency operation. For transmitting operation, the OPLL block of the TRF6150 directly
modulates the dual band external VCO with I and Q signals. For receiving operation, the external
VCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSM
Rx. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by
2 for DCS Rx operation before entering into the direct conversion mixer.
The auxiliary integer-N synthesizer (IF synthesizer), which includes an IF VCO with external tank
circuits, is necessary for transmitting operation only. The IF VCO has a frequency band from 832
MHz to 858 MHz. Output frequency of IF VCO is settled by prescaler and counter. The fractional
counter in the RF synthesizer just differs from the IF synthesizer. The IF VCO is also followed by a
buffer amplifier, which is to give reverse isolation and prevent any frequency pulling of the VCO
when the transceiver is powered UP and DOWN.
A fixed reference frequency of 1.3MHz for Rx (or 2.6MHz for Tx) is generated by a reference divider
from the external applied 13 MHz crystal oscillator.
The phase frequency detector with charge pump provides programmable output current, which
could drive the capability and the pulse width.
The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wire
interface.
Table 3-4. 3-wire BUS of Synthesizer in the TRF6150
CLK
DATA
EN
Pin Number
11
12
13
Description
Serial clock input to the synthesizer
Serial data input to the synthesizer
Input latches the serial data transferred to the synthesizer
- 15 -
3. TECHNICAL BRIEF
Figure 3-3. Synthesizer internal Block Diagram.
- 16 -
3. TECHNICAL BRIEF
The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.
The frequency setting equations of the IF and RF frequencies are as follows.
is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and
is the output
frequency of the RF VCO (the main fractional-N synthesizer). The frequency band of the RF VCO is from
1294MHz to 1356 MHz, and the frequency band of the IF VCO is from 832MHz to 858Mhz, which
frequency bands are for the transmitting operation only.
Figure 3-4. Synthesizer Circuit.

- 17 -
3. TECHNICAL BRIEF
3.3 Transmitter
The Transmitter part contains TRF6150 active parts, PAM, coupler, dual schottky diode and dual
band VCO. The TRF6150 active parts consist of the vector modulator and offset phase-locked loop
block (OPLL) including down-converter, phase detector, and APC IC for power control. The VCO
feed the output frequencies into PAM and TRF6150 for Tx local frequency. The peak output power
of the PAM is controlled by means of a closed feedback loop. A dual band directional coupler is
used to control the RF output from the PAM. The PAM outputs from the directional coupler pass to
the antenna connector via an integrated dual band antenna switch module.
Figure 3-5. Transmitter Block Diagram.
- 18 -
3. TECHNICAL BRIEF
3.3.1 Tx Modulator
The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator, where they are
modulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadrature
mixer inside the U604. The Tx LO signal(1294 1356 MHz, 426.4 MHz) is fed from the internal
main and aux.
VCO.
The modulator provides more than 40dBc of carrier and unwanted side-band rejection and
produces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets in
the I/Q BB signals caused by imperfections in the D/A converters. The Tx-Modulator implements a
quadrature modulator. The frequency input signal is split into two precise orthogonal carriers, which
are multiplied by the BB modulation signal IP/IN and QP/QN. It is used as reference signal for the
OPLL.
Figure 3-6. TX IF Modulator and OPLL Circuit.
- 19 -
3. TECHNICAL BRIEF
3.3.2 OPLL
The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with the
RF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM,
EGSM and DCS operation. The feedback signal passes to one port of the phase detector.
The GMSK reference signal from the Tx IF modulator passes via a second limiter to the other
input port of the phase detector. The phase detector generates an error current proportional to the
phase difference between the feedback signal from the down-converter and the `reference signal
from the Tx IF modulator. The error current is filtered by a second order low-pass filter to generate
an output voltage, which depends on the GMSK modulation and the desired channel frequency.
This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RF
channel is frequency modulated with the original GMSK data.
The center frequency of the transmit VCO is offset from the RF VCO frequency by 414.4MHz for
GSM ,EGSM and DCS operation.
3.3.3 Power Amplifier

The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to
1785 MHz). The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.5 dBm for
DCS for 3.5 V nominal battery use.
This module should be operated under the GSM burst pulse. To avoid permanent degradation, CW
operation should not be applied. To avoid the oscillation at no input power, before the input is cut
off, the control voltage Vapc should be control to less than 0.5 V. We have to improve thermal
resistance, the through holes should be layouted as many as possible on PCB under the module.
And to get good stability, all the GND terminals and the metal cap should be soldered to ground
plane of PCB.
Figure 3-7. Power Amplifier and its Control Part Circuits.
- 20 -
3. TECHNICAL BRIEF
3.3.4 PA Circuit and Control

The power amplifier control circuit ensures that the RF signal is regulated to the required limits of
operation. RF power is controlled by driving the power control pins of power amplifier and sensing.
The resultant RF output power via a directional coupler (N600). The RF sense voltage is peak
detected using an schottky diode of BAT15-099(D600). This detected voltage is compared to the
DAC voltage in the TRF6150 to control the output power.
An internal input signal (PA_LEVEL) from CALYPSO, digital BB chipset, (U200) is applied to the
APC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds a
portion of the RF output signal back to the APC IC and peak detector converts this signal to a low
frequency feedback signal that balances the amplifier when this signal equal to the RAMP input
signal level.
3.4 13 MHz Clock

The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal
Oscillator), which oscillates at a frequency of 13 MHz.
The 13MHz clock is used within the Synthesizer block of the TRF6150, BB Analog chip-set
(NAUCICA_CS), and Digital (CALYPSO). The inverter IC, SN74AHC1GU04 buffer the output to
NAUCICA_CS and CALYPSO.
Figure 3-8. VCTCXO Circuit.
- 21 -
3. TECHNICAL BRIEF
3.5 Power Supplies and Control Signals

Three Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (Regulator
R1, R2 R3). The Regulator R1 is used to provide DC power to the receiver, the transmitter and the
PA control loop of the TRF6150. The Regulator R2 is used to provide DC power to the DC offset
compensation circuit, the auxiliary synthesizer, the main synthesizer and VCOs. The Regulator R3
is used for the external Rx/Tx VCO. An external regulator is used to provide DC power to the
VCTCXO(U605).
Table 3-5. Regulator Specification
Regulator
Regulator R1, R2, R3
(These are all integrated
in the TRF6150)
ADP3330_2V85 (U605)
Voltage
Powers
2.8 V
0.1 V
Receiver, Transmitter,
Synthesizers, VCOs
2.85 V
0.5 V
VCTXO
Figure 3-9. External Regulator Circuit.
- 22 -
Enable Signal
RF_ENA, XO_ENA
3. TECHNICAL BRIEF
3.6 Digital Baseband (DBB) Processor
Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).
3.6.1 General Description

CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.
This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a MicroController core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit
SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS
gates.
The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.
CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG
boundary-SCAN).
- 23 -
3. TECHNICAL BRIEF
3.6.2 Block Description

CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA
bus standard as interface with their associated application peripherals.
CALYPSO is composed from the following blocks:
ARM7TDMIE : ARM7TDMI CPU core
DSP subchip
ARM peripherals:
General purpose peripherals
ARM Memory Interface for external RAM, Flash or ROM
4 Mbit Static RAM with write-buffer
Application peripherals
ARM General purposes I/O with keyboard interface and two PWM modulation signals
UART 16C750 interface (UART_IRDA) with
- IRDA control capabilities (SIR)
- Software flow control (UART mode).
UART 16C750 interface (UART_MODEM) with
- hardware flow protocol (DCD, CTS/RTS)
- autobaud function
SIM Interface.
TPU(Time Processing Unit) : Processing for GSM time base
TSP(Time Serial Port) : GSM data interface with RF and ABB
Memory Interface : External/Internal Memory Interface
nCS0 : FLASH1, 16bit access, 3 wait state
nCS1 : FLAHS2, 16bit access, 3 wait state
nCS2 : Ext SRAM, 16bit access, 3 wait state
nCS3 : Main LCD, Sub LCD, MIDI IC addressing, 8bit access, 3 wait state ( See Fig 3-2 )
nCS6 : Int SRAM, 32bit access, 0 wait state
* Calypso internal 39MHz machine 3wait state is necessary for the 80ns access because of 25ns
machine cycle. (25*4 = 100ns)
- 24 -
3. TECHNICAL BRIEF
Figure 3-6. Decoding Section Block Diagram
3.6.3 External Devices connected to memory interface

Table 3-6. External Device Spec connected to memory interface
Device
FLASH 1
FLASH 2
SRAM
MAIN LCD
SUB LCD
Melody IC
Interface SPEC
Maker
Name
Access
Time
TH50VPF5683BASB
Toshiba
TC58FVB641FT/XB
Toshiba
TH50VPF5683BASB
Toshiba
S6B0023/S6B0018
SDI
KS0723
SDI
YMU762
Yamaha
Write
Access
Time
80ns
80ns
70ns
TBD
60ns
50ns
Read
80ns
80ns
70ns
TBD
60ns
80ns
3.6.4 RF Interface (TPU, TSP block)

Calypso uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) with
GSM Time Base
Table 3-7. RF Interface Specification
TSP (Time Serial Port)
Resource
TSPDO
TSPEN0
TSPEN1
TSPACT00
TSPACT05
Interconnection
Description
ABB & RF main Chip
Control Data
ABB
ABB Control Data Enable Signal
RF main Chip
RF Control Data Enable Signal
TPU (Time Processing Unit) Parallel Port
RESET_RF
RF main Chip Reset Signal
PA_ON
Power Amp ON signal
- 25 -
3. TECHNICAL BRIEF
3.6.5 SIM interface

SIM interface scheme is shown in (Fig. 3-12).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump
in ABB enables 3V/5V SIM operation
Table 3-8. SIM Interface
SIM (Interface between DBB and ABB)
SIM card async/sync reset
SIM card power activation
SIM card bidirectional data line
SIM card reference clock
SIM_RST
SIM_PWCTRL
SIM_IO
SIM_CLK
Figure 3-12. SIM Interface
3.6.6 UART Interface

The phones has two UART Drivers as follow :
- UART1 : Hardware Flow Control / Fax&Data Modem
- UART2 : Handsfree Control / SW trace or IrDA Modem
Table 3-9. UART Interface Specification
Resource
TX_MODEM
RX_MODEM
CTS_MODEM
RTS_MODEM
GPIO 3
GPIO 2
TXD
RXD
CTS
RTS
DSR
DCD
TXIR_IRDA
TX_IRDA
RXIR_IRDA
RX_IRDA
SD_IRDA
TXIR_IRDA
TX
RXIR_IRDA
RX
SD_IRDA
UART MODEM(UART1)
Name
Note
Transmit Data
Receive Data
Clear To Send
Request To Send
Data Set Ready
Data Carrier Detect
UART IRDA(UART2)
Infra-Red Transmit Pulse
Transmit Data(UART2)
Infra-Red Receive Pulse
Receive Data(UART2)
IRDA transceiver ShutDown Mode
- 26 -
3. TECHNICAL BRIEF
3.6.7 GPIO map

In total 16 allowable resources, the phones is using 13 resources except 3 resources dedicated to
SIM and Memory. the phones GPIO(General Purpose Input/Output) Map, describing application,
I/O state, and enable level, is shown in below table.
Table 3-10. GPIO Map Table
I/O (0)
FOLDER
GPIO
Inactive
State
HIGH
(Open)
I/O (1)
MELODY_INT
GPIO
HIGH
LOW
I/O(2)
DCD
GPIO
LOW
HIGH
I/O (3)
DSR
GPIO
HIGH
LOW
I/O (4)
Sub_backlight
GPIO
LOW
HIGH
I/O (5)
SIM_PWCTL
SIM
I/O (6)
Jack_Detect
GPIO
LOW
HIGH
I/O (7)
LCD_RESET
GPIO
HIGH
LOW
I/O (8)
SPK_EN
GPIO
LOW
HIGH
I/O (9)
MELODY_RESET
GPIO
HIGH
LOW
I/O (10)
SUB_LED1
GPIO
LOW
HIGH
I/O (11)
SUB_LED2
GPIO
LOW
HIGH
I/O (12)
SUB_LED3
GPIO
LOW
HIGH
I/O (13)
HANDSFREE
GPIO
HIGH
LOW
I/O (14)
NBHE
MEMORY
I/O (15)
NBLE
MEMORY
I/O #
Application
I/O
Resource
State
Active
State
LOW
(Closed)
3.7 Analog Baseband (ABB) Processor

3.7.1 General Description
Nausica CS is Analog Baseband (ABB)Chip supports GSM900, DCS1800, GPRS Class 10 with
Digital Basband Chip(Calypso G2) Nausica_CS processes GSM modulation/demodulation and
power management operations.
Block Description
- Audio Signal Processing & Interface
- Baseband in-phase(I), quadrature(Q) Signal Processing
- RF interface with DBB (time serial port)
- Supply voltage regulation
- Battery charging control
- Switch ON/OFF
- 3V/5V SIM card Interface
- 4 internal & 5external ADC channels
- 27 -
3. TECHNICAL BRIEF
3.7.2 Audio Signal Processing & Interface

Audio signal processing is divided Uplink path and downlink path..
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format and
delivered to RF Chip. MICBIAS is 2.5Vlevel.
The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).
Figure 3-13. Audio Interface Block Diagram
3.7.3 Baseband Codec(BBC)

Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL).
BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) component and quadrature(Q) component with burst data from DBB. This modulated signal is
transmitted through RF section via air.
BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with input
analog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270KHz data rate
through BSP.
Figure 3-14. Baseband Codec Block Diagram

- 28 -
3. TECHNICAL BRIEF
3.7.4 Voltage Regulation(VREG)

There are 5 LDO(Low Drop Output) regulators in ABB chip.
The output of these 5 LDOs are as following table. (Figure 3-6) shows the power supply related
blocks of DBB/ABB and their interfaces in the phones.
Figure 3-15. Power Supply Scheme

Table 3-11. LDO Output Table
Output Voltage
Usage
VR1
1.8V
Digital Core of DBB
VR1B
2.0V
Digital Core of ABB
VR2
2.9V
Memory Interface of DBB
VR2B
2.9V
Digital I/Os of DBB & ABB
VR3
2.9V
Analog Block
3.7.5 ADC Channels

ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5
external ADC channel. This block operates charging process and other related process by reading
battery voltage and other analog values.
- 29 -
3. TECHNICAL BRIEF
Table 3-12. ADC Channel Spec

ADC 9 channels
Resource
Name
VCHG
VCHG
VBAT
VBAT
ICHG
ICHG
VBACKUP
VBACKUP
ADCIN1
Not Use
ADCIN2
BATT_Themister
Battery Detect
ADCIN3
RADIO_TEMP
Temperature Sensing
ADCIN4/TSCXP
Hook_Detect
HOOK_DETECT
ADCIN5/TSCYP
Not Use
Charging Management
Backup Battery
3.7.6 Charging
Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC
channel. Battery Block Indication and SPEC of the phones is as follow.
Figure 3-16. Battery Block Indication

1. Charging method : CC-CV
2. Charger detect voltage : 4.0V
3. Charging time : 2h
4. Icon stop current : 100mA
5. Charging current : 420mA
6. CV voltage : 4.2V
7. Cutoff current : 40mA
8. Full charge indication current (icon stop current) : 100mA
9. Recharge voltage : 4.16V
10. Low battery alarm
a. Idle : 3.62V
b. Dedicated : 3.50V
11. Low battery alarm interval :
a. Idle : 3min
b. Dedicated:1min
12. Switch-off voltage : 3.35V
13. Charging temperature adc range
a. ~ -2C : not charging operation.
b. -2C ~ 47C : charging.
c. 47C ~ : not charging operation.
- 30 -
3. TECHNICAL BRIEF
3.7.7 Switch ON/OFF

The phones Power State : Defined 4cases as follow
- Power-ON : mobile is powered by main battery or backup battery.
- Power-OFF : mobile isnt any battery.
- Switch-ON : mobile powered and waken up from switch-off state.
- Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).
To enter into Switch-ON state, one of following 4 condition is satisfied.
- PWR-ON
: pushed after a debouncing time of 30ms.
- ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin.
- IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin.
- CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.
3.7.8 Memories
64Mbit/32Mbit Flash/SRAM MCP + 64Mbit Flash
128Mbit Flash + 32Mbit SRAM
16 bit parallel data bus
ADD01 ~ ADD22
3.7.9 Display & FPC Interface

LCD module include:
Main LCD
128
160 65K Color STN LCD
Sub LCD
96
Main LCD Backlight
White LED illumination and AC/DC converter Module
Sub LCD Backlight
EL Backlight
7 color Indicator LED
KOHA HL006-W11
64 mono FSTN LCD
LCD module is connected to main board with 32 pin FPC and connected to Speaker, Receiver,
Vibrator with 8 pin FPC connector.
FPC Interface Between LCD module and Speaker, Receiver, Vibrator
FPC Interface Between LCD module and main board
- 31 -
3. TECHNICAL BRIEF
Table 3-13. FPC Interface Spec

Pin #
NAME
Category
PWR
Description
VDD3.0V
/CS
Main Driver Chip Select
A(1)
Instruction/Data Identification(RS)
D0
D1
D2
D3
D4
D5
10
D6
11
D7
12
/WR
Main Driver Write Enable
13
/RES
Main & Sub LCD driver Reset
14
VSS
GND
Ground
15
LED_EN
BACKLIGHT
Main LCD backlight Enable

(Enable High)
16
VBACKUP
PWR
Backup Battery
17
I_LED1
BACKLIGHT
Indicator LED Enable 1(Enable High)
18
I_LED2
BACKLIGHT
19
I_LED3
BACKLIGHT
20
EL_EN
BACKLIGHT
Sub LCD EL backlight Enable

(Enable High)
21
VBAT
PWR
VBAT for White LED operation
22
SUB_CS
Sub LCD Chip Select1 (Low Enable)
23
CS2(A2)
Sub Interface
(Parallel)
24
VSS1
GND
Ground
25
VBAT1
PWR
VBAT for White LED operation
26
MOTOR
VIBRATOR
Vibrator Enable
27
REC(-)
28
REC(+)
29
SPK(-)
Speaker Negative
30
SPK(+)
Speaker Positive
MAIN
INTERFACE
Driver IC power supply
Data BUS
Sub LCD Chip Select2 (High Enable)
Receiver Negative
AUDIO
- 32 -
Receiver Positive
3. TECHNICAL BRIEF
3.7.10 KeyPad Switching & Scanning

Table 3-14. Keypad Map
KBC0
KBC1
KBC2
]
KBC3
KBC4
[CFM]
KBR0
[ ]
KBR1
[1]
[2]
[3]
[F4]
[Voice Memo]
KBR2
[4]
[5]
[6]
[F1]
[Vol Up]
KBR3
[7]
[8]
[9]
1[F2]
[Vol Down]
KBR4
[*]
[0]
[#]
[SEND]
[F3]
DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).
Figure 3-17. Keypad Scanning Scheme
- 33 -
3. TECHNICAL BRIEF
3.7.11 Audio
Figure 3-18. Audio Section Scheme
Uplink
The microphone is soldered to the main PCB. The uplink signal is passed to MICIP and MICIN pins
of Nausica_CS. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) through
switching IC(U404) and R401. The MICBIAS voltage path is switchable by control the U404.
When the headset is inserted, U400 outputs 2.8V high state and its input of U404(#1) and Calypso
(Jack_Detect). On detecting this 2.8V output, Calypso makes Nausica_CS switches the mic
amplifier path from main to auxiliary. In addition, this 2.8V output applied to U404(#1) and U404
switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.
Figure 3-19. Uplink Path

- 34 -
3. TECHNICAL BRIEF
Downlink
The downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset is
inserted and Calypso detects Jack_Detect signal(output of U400), Calypso makes Nausica_CS
switches the downlink path from EARP and EARN to AUXOP and AUXON.
Figure 3-20. Downlink Path
Speaker Phone
In speakerphone mode, Calypso makes SPK_EN to 2.8V and EARP signal is passed to speaker
through MIDI IC(U403).
3.7.12 KeyPad and Main LCD back-light Illumination

There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and
Main LCD Back-light respectively, which are driven by KEYLIGHT line from Calypso.
Figure 3-21. KeyPad and Main LCD Back-light Scheme

- 35 -
3. TECHNICAL BRIEF
3.7.13 Sub_LCD EL Illumination

In Sub-LCD EL illumination, there is an EL driver in FPCB Board, which is driven by
SUB_BACKLIGHT line from Calypso(GPIO4).
Figure 3-22. Sub-LCD EL Illumination
3.7.14 Indicator Illumination

Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED consists of
Red LED, Green LED and Blue LED. The combination of these LEDs makes 7 colors
Figure 3-23. Indicator LED Illuination

In the case of power off mode(ON_OFF=Low), if TA is inserted, R509 is connected to VCHG and
I_LED1(Red LED) is turned-on. In other cases(ON_OFF=High), Multi-color LED is controlled by
SUB_LED1, SUB_LED2 and SUB_LED3 signal of Calypso
- 36 -
4. SERVICE S/W AND CALIBRATION

4.1 Service S/W
4.1.1 Overview
This service S/W is used for Calibration and Standalone test.
4.1.2 Hardware and software environment

- More than 486 computer
- 16Mbyte RAM
- Remained more than 10Mbyte in Hard Disk Memory
- Under Microsoft windows 98 or more than
4.1.3 Software installation

Unzip the phones service software provided where folder you want there are some files extracted in
that folder. Start Setup.exe in Service software setup folder. RampTable.dat, default transmit
ramping table, and rf_original_L300.epm, default calibration data, are located in window system
folder so that these files are loaded automatically, if you execute LaputaService.exe.
4.1.4 Common Properties of Service Software

When you execute this program, youll see the below user interface window titled
LAPUTA_Service Tool in figure 4-1. The LAPUTA_Service Tool has five main frames.
Figure 4-1. LAPUTA Service Tool

- 37 -
A. Target system frame

This is for initializing the target phone. When you use this program to test the phones, you have
to initialize target at first. To initialize target phone, select target (the phones is default) and COM
port used at your computer and then click the Initialize button. If target initializing is ended
successfully, the box in red below the initialize button will turn into green.
B. Rx AGC Test frame

At this part, you can control receiver path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel. You can change the
value by clicking arrow button by one step or just entering the number directly.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- AGC Value Setting
You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.
- Power Measurement
The number means channel index according to pre-defined ARFCN. There are 12 pre-defined
ARFCNs within Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button to
change number, you can see TCH and BCH ARFCN changed automatically.
PM window displays the power level measured in baseband chip. PM value is useful to
calculate the received absolute power. The unit of PM is dBd.
- PM Start
You can measure Rx power that target received from test equipment. When you click this
button the result of power measurement displayed at PM blank in Power Measurement frame.
You can measure PM for all 12-channel indexes by changing Number and clicking PM Start.
- Calculate
You have to do this work after measuring PM for all 12-channel indexes. When you click this
button, service software calculate the calibration data from measured 12 PM data.
- Standalone
This button makes target operate in Rx mode continuously. Target will be operated under the
condition that you set. During continuous receiving mode, label of Standalone button is
changed to Stop. If you want stop receiving mode operating, click this button one more.
- 38 -
C. Tx APC Test frame

At this part, you can control transmit path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- Power Level Setting
First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequency
that you selected before. Then select the Level and adjust the DAC value. Level means
GSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value is
a factor to determine output power. Its variable range is 0 to 1023.
- Uplink Normal Burst test
You can also control the traffic slot number be using by changing TCS value. Because GSM
has 8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. You
can send all data 0, or 1 or repeating of 1010. But it is good to you to using the default value
because data format doesnt affect to RF characteristics.
- Test
Transmitting is started when you click this button. During Transmitting, label of Test button is
changed to Stop. If you want stop transmitting, click this button one more.
D. RF Parameter Download frame

- Saving epm file into Flash
When you have a epm file, contains calibrated data, and you want to download into target
Flash, check Flash and click File Download button. Then you can see RF parameters Save
window. Select epm file you want to save into Flash then click Open. During saving file into
Flash, The statement bar indicating download process is displayed under the RF Parameter
Download frame. As successfully ending download, information box will be appeared. Click Ok.
- Saving Cal. Data to Flash
After Rx or Tx calibration, you can save the calibration results into Flash and epm file. Check
Flash and click Calib Save button. Then you can see RF parameters Save window. Write the
file name and click Save button.
E. User Command and Results frame

Whenever you click button or make some event in service software, every ordered event is
displayed in this frame. You can also see calibration results here.
F. Ramp Shape button

This button is for burst shape table. But it is deactivated in service software.
- 39 -
4.2 Calibration
4.2.1 Overview
All tuning operations of the phone are carried out using the service software. The service software
turns the phone into the locals mode, in which the phone can be outwardly controlled via the test
Jig.
The calibration values of the phone reside on the Flash. The contents of the Flash can be read by
the service software and saved as a file. This is advisable when there is need to retain that
information, e.g. in view of replacement of the circuit. The program also enables writing the default
parameters on the Flash, in which case all calibration steps should be carried out. The service
software cant control the equipment, so only manual calibration process is possible.
4.2.2 Equipment List

Table 4-1. Calibration Equipment List.
Equipment for Calibration
Wireless Communication
Test Set
RS-232 Cable and Test JIG
RF Cable
Power
Service SW (LAPUTA)
Test SIM Card
PC(for Software Installation)
Type / Model
HP8960,HP8922, CMU200, any other call equipmen
Pentium II class above 300MHz
- 40 -
Brand
4.2.3 Equipment Setup
+
-
Figure 4-2. Calibration Equipment Setup
- 41 -
4.2.4 Calibration Steps

A. RX Calibration
In order for the RSSI measurements to be within the GSM specifications, some calibration is
necessary. Also, due to AGC implementation, some AGC specific constants need calibration. In
total, three calibrations are required per receive band, AGC calibration, channel compensation
and temperature compensation. Of these, temperature compensation is not needed in
replacement of the circuit. In AGC calibration the reference power fed into the phone via
permanent antenna connector is 74dBm. In channel compensation, the channel numbers in Rx
band are;
E-GSM band : 0, 40, 124, 975, and 1023.
DCS band
: 512, 574, 636, 700, 760, 822 and 885.
- Procedure
a) Initialize phone by clicking Initialize button.
b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment 0, same
with phone.
c) Set the power of GSM test equipment 74dBm.
d) Click the PM Start button, then the value, received power by phone, is displayed in PM
measurement window at service software.
e) Change the BCH and TCH of phone by clicking the Number button and set the channel
(BCH & TCH) of equipment to be same.
f) Click the PM Start button.
g) Repeat above procedure until the displayed number in Power Measurement window is 12.
h) Click the Calculate button, then the service software calculate the channel compensation
parameters.
i) Saving updated calibration data into phone by clicking Calib Saving button.
NOTE
If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels for
DCS1800, the service software reports, Please execute after measuring the PM.
B. TX Calibration
In order for the Tx power to be within the GSM specifications for each Tx level, some calibration
is necessary. In total, four calibrations are required per transmit band, power calibration, channel
compensation, temperature compensation and low voltage compensation. Of these, temperature
compensation and low voltage compensation are not needed in replacement of the circuit and
channel compensation is not needed because the transmit power is in GSM specification with
enough margin.In power compensation, the channel numbers used in Tx band are;
E-GSM band : 62.
DCS band
: 699.
And the target powers in dBm for each power level are;
- 42 -
Table 4-2. Tx targer powers

Power level
GSM
DCS
29
28
26
24
22
32
20
31
18
29
16
27
14
25
12
10
23
10
11
21
12
19
13
17
14
15
15
13
16
11
17
18
19
-Procedure
a) Initialize phone by clicking Initialize button.
b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you
have to match test equipments BCH and TCH ARFCN with this value. For each power level,
adjust the DAC value to get target power and click Test button. Then you can see the output
power displayed on test equipment.
c) Saving updated calibration data into phone by clicking Calib Saving button.
- 43 -
4.2.5 Test JIG Operation

Table 4-3. JIG Power
Description
Power Supply
Usually 4.0 V
DC Adaptor
9.5V, 500mA
Table 4-4. JIG DIP Switch

Switch Number
Name
Description
Switch 1
RPWRON
In ON state, phone is awaked.
Switch 2
HF_DETECT
Turn on for AUDIO TEST.
Switch 3
Power Supply
Power is provided for phone from Power Supply.
Switch 4
D.C power
Power is provided for phone from DC adaptor.
Table 4-5. LED Description

LED Number
Name
Description
LED 1
POWER
Power is provided for Test Jig
LED 2
CHARGER
Indicate charging state of the Phone Battery with Travel

Charger.
LED 3
UART IRDA
Indicate date transfer state through the UART IRDA.
LED 4
UART MODEM
Indicate date transfer state through the UART MODEM.
- Operation
1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in
general.
2) Set the Power Supply 4.0V. Also DC adapter may be used.
3) Set the 3rd of DIP SW ON state. In case of DC adapter, set 4th ON state.
4) Press the Phone power key. If the Remote Power On is used, switch the 1st of Dip Switch ON.
- 44 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
5.1.1 Download Equipment
1) Data Kit
2) Desktop or Notebook PC
3) Download Monitor Program
4) The phones mobile phone
- 45 -
5. DOWNLOAD
5.2 Download Procedure

5.2.1 General Purpose
This document gives a guideline for upgrading software of the phones using UART port.
5.2.2 Download Environment

In order to download software of the phones, the following working environments should be
prepared: the phones Data Link Kit, DK-10G that is connected to COM1 or COM2 serial port in the
Desktop or Notebook PC.
The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC.
Target SW* downloaded to the phones mobile phone.
Note : Target SW* means any necessary software to be downloaded to the mobile phone.
Warning
You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are provided
from LGE. Otherwise downloading process wont properly
- 46 -
5. DOWNLOAD
5.2.3 Download Procedure

A. Unzip the phones UART Download monitor program(monitor 663.zip) in PC.
B. Execute monitor663.exe. And then select the Target Menu shown in Figure 5-1. Then, choose
Connect in the Target Menu.
Figure 5-1.
C. A table will be displayed as shown in Figure 5-2. Then press the arrow-button and choose a
correct serial port. And press OK button.
Figure 5-2.
- 47 -
5. DOWNLOAD
D. As the following window shown in Figure 5-3. is displayed, connect the phones Phone to Data
Link Kit, DK-10G and power on the phones. If the connection is succeeded, the following screen
will show the contents as shown in Figure 5-4.
Figure 5-3.
Figure 5-4.
- 48 -
5. DOWNLOAD
E. Click on Flash on the top menu and select Get type item as shown in Figure 5-4. and select
Erase and Program Appli Only+Boot item as shown in Figure 5-5.
Figure 5-5.
F. Finally choose the target SW that you want to download. And then you can see the following
window in Figure 5-6.
Figure 5-6.
- 49 -
5. DOWNLOAD
G. If the downloading procedure is succeeded, then the following window is shown.
Figure 5-7.
- 50 -
6. TROUBLE SHOOTING
6. TROUBLE SHOOTING
Figure 6-1. shows a measurement set-up.
Figure 6-1. Measurement set-up
- 51 -
6. TROUBLE SHOOTING
6.1 Rx Trouble (EGSM)
- 52 -
6. TROUBLE SHOOTING
6.2 Rx Trouble (DCS)
- 53 -
6. TROUBLE SHOOTING
6.3 Tx Trouble
U200 : CALYPSO
(BB Digital Main Chip)
U201 : NAUSICA CS
(BB Analog Main Chip)
U601 : PAM (PF08122B)
U604 : RF Main Chip (TRF6150)
U600 : TXVCO (ENFVZ4LO7)
U603 : Antenna S/W
(SHS-M090B)
N600 : Directional coupler
(LDC15D 190A0007A)
D600 : Shottky Diode
(BAT 15-099)
- 54 -
6. TROUBLE SHOOTING
- 55 -
6. TROUBLE SHOOTING
6.4 Voice Function Trouble

A. Receiver
B. Speaker
- 56 -
6. TROUBLE SHOOTING
C. Microphone
- 57 -
6. TROUBLE SHOOTING
6.5 Display Function Trouble

A. LCD
- 58 -
6. TROUBLE SHOOTING
B. Indicator LED
- 59 -
6. TROUBLE SHOOTING
6.6 Other Function Trouble

A. Vibrator
- 60 -
6. TROUBLE SHOOTING
B. Charger
- 61 -
7. STAND ALONE TEST AND TEST POINTS

7.1 Testing Set-up
7.1.1 Received RF Level and Checks
This section shows the typical RF levels expected throughout the receiver path. A block diagram
showing the locations of the RF measurement points and levels is shown in Figure 7-3.
Receiver Testing Set-up

To check the receiver the following conditions have to be set:
1. On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm at
either: 947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testing
the DCS RX path.
2. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Receiver
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Figure 7-2. and compares your measurements with those shown in the diagram. If there are any
major difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the receiver circuit:
1. The Control Signal of Antenna switch (see Figure 7-9,10,11 )
2. Vreg 1,2,3 (see Figure 7-7 )
3. 2V85_VCTCXO (see Figure 7-8)
4. 13MHz(see Figure 7-12)
5. CLK, DATA, EN (see Figure 7-13)
6. RX IP, IN, QP, QN (see Figure 7-16,19)
7. Vtune(see Figure 7-17,18)
- 62 -
7.1.2 Transmitted RF Level and Checks

This section shows the typical RF levels expected throughout the transmitter path. A block diagram
showing the locations of the RF measurement points and levels is shown in Figure 7-5.
Transmitter Testing Set-up

To check the transmitter the following conditions have to be set:
1. Configure the testing equipments as Figure equipment setup.
2. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode).
3. Set the BCH and TCH ARFCN 62 for EGSM900 or 700 for DCS1800 on GSM/DCS test
equipment.
4. Set the DC power supply 4.0volts.
5. Initialize target on service software.
6. Set TCH and BCH value to be same with GSM/DCS test equipment on service software.
7. Select GSM or DCS mode on service software.
8. Set DAC 600 for EGSM900 or 700 for DCS1800 on service software.
9. Click Test.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Transmitter
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Fig. 7-4 and compare your measurements with those shown in the diagram. If there are any major
difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the transmitter circuit:
1. The Control Signal of Antenna Switch(see Figure 7-9, 10, 11)
2. Vreg 1,2,3 (see Figure. 7-7)
3. 2V85_VTCXO (see Figure. 7-8)
4. 13 MHz (see Figure. 7-12)
5. PA_ON, PA_LEVEL, Vapc (see Figure. 7-14)
6. TX IP, IN, QP, QN (see Figure. 7-15)
- 63 -
7.2 Testing Points

7.2.1 RF components (Component Side)
N600
D600
SW600
U603
U607
BPF600
U601
D601
BPF601
U602
U604
U605
U600
U606
U629
D602
Figure 7-1. RF components (Component Side).

Table 7-1. RF components
Reference
Reference
U604
RF main chipset
U600
Dual RF VCO
U603
Antenna Switch
U606
VCTCXO
U601
PAM
U602
Balun
N600
Coupler
BPF601
GSM RF SAW Filter
U607
NOR Gate
BPF600
DCS RF SAW Filter
U629
Inverter
SW600
Mobile Switch
U605
LDO
D600
Dual Schottky Diode
D601
Varactor Diode
D602
Varactor Diode
- 64 -
7.2.2 Test point of Rx Levels

3
2
1
2
5
6
Figure 7-2. Test point of Rx Levels.
- 65 -
Figure 7-3. Receiver RF Levels
GSM: CH.62, -60dBm

DCS: CH.699, -60dBm
- 66 -
7.2.3 Test point of TX Levels

6
13
12
11
10
1, 7
9
2, 8
3
Figure 7-4. Test point of TX Levels.
- 67 -
Figure 7-5. Transmitter RF Levels
GSM: Pwr LvI 5, Ch.62, -32dBm

DCS: Pwr LvI 0, Ch.700, -29dBm
- 68 -
7.2.4 Control signal test points

VC2
VC1
VAPC
I/Q
Regulator 2V85
LB_SW
13MHz
HB_SW
Vtune
TXRX_SW
PA_LEVEL
PA_ON
CLK, DATA, EN
Vtune
Figure 7-6. Control signal test points
- 69 -
Figure 7-7. 2V85_Vreg 1, 2, 3 Output
Figure 7-8. 2V85_VCTCXO Supply Voltage
- 70 -
Figure 7-9. Antenna S/W control voltage in EGSM_TX
VC1
VC2
Figure 7-10. Antenna S/W control voltage in DCS_TX
- 71 -
VC1
VC2
Figure 7-11. Antenna S/W control voltage in RX
Figure 7-12. 13MHz Clock
- 72 -
CLK
DATA
EN
Figure 7-13. CLK, DATA, EN
Figure 7-14. PA_ON, PA_LEVEL, VAPC (GSM Tx Level=7)
- 73 -
Figure 7-15. Tx I / Q Signal
Figure 7-16. Rx I / Q Signal
- 74 -
Figure 7-17. PA_ON, Vtune (U600 pin 13, GSM 1CH)
Figure 7-18. PA_ON, Vtune (U600 pin 13, DCS 512CH)
- 75 -
Figure 7-19. RX I/Q Signal(Extended)
- 76 -
1. Remove the battery and screws.
2
1
Figure 8-1. Removing Screws
- 77 -
2. Use a thin plastic sheet to slide and open the gap between front and rear covers, and detach
them carefully with both hands.
3. Then carefully remove the rear cover from the hooks as shown in Figure 8-2.
2
1
Figure 8-2. Disassembling covers

4. Unlock the PCB and remove other components as shown in Figure 8-3.
Figure 8-3. Unlocking and removing the PCB
- 78 -
5. Firstly, insert one side of FPCB carefully into the slot.

Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2
1
2
Figure 8-4. Assembly of PCB with the cover
- 79 -
6. Remove the antenna and use a sharp awl to push away the antenna-bushing.
Figure 8-5. Removing antenna-bushing
- 80 -
7. Use a tweezers to remove the battery locker.
1
1
2
Figure 8-6. Removing battery locker

8. When removing the side button from the main front, please see the insert-nut next to the button
and carefully remove it.
Insert-nut
Figure 8-7. Removing a side button
- 81 -
9. Push away the hinge to remove the folder.
Figure 8-8. Removing Folder

10. Remove the hinge, and detach screw caps by using a pin.
Figure 8-9. Removing hinge and screws
- 82 -
11. Use a thin plastic sheet to slide and open the gap between the folders.
Then detach them carefully with both hands.
Figure 8-10. Disassembling Folders
- 83 -
12. Finally detach the rest components as shown in Figure 8-11.
Figure 8-11. Disassembly of the rest components
- 84 -
9. BLOCK DIAGRAM
9. BLOCK DIAGRAM
9.1 Main Board
The phones is made up of two PCBs. In lower part of the folder, there is a main board. And in the
upper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.
Figure 9-1. Main Block diagram.
- 85 -
9. BLOCK DIAGRAM
9.2 FPCB
Figure 9-2. FPCB Block diagram.
- 86 -
9. BLOCK DIAGRAM
9.3 RF
Figure 9-3. RF Block diagram
- 87 -
9. BLOCK DIAGRAM
- 88 -
10. CIRCUIT DIAGRAM
10. CIRCUIT DIAGRAM

10.1 BB Circuit
1
HSP103
HSP102
HSP101
1
VCC
GND
3
2
CLK
RST
7
6
LG_AMP_SIM
IO
VPP
J100
C109
100n/16V
(2012)
R100
20K
C103
150p
VCHG
C100
10u/16V
A_case
C101
22n
VR2B
4 6
ICTL
Q100
NDC652P
3
1 2 5
HSP100
SIM_CLK
SIM_RST
SIM_I_O
SIM_VDD
R117
0R
VBAT_2
D100
CRS08
5
2
A(3)
U101
SN74HC1GU04DCKR
VR2B
VBAT
R116
0.2R(1%)
(2012)
VR2B
VR2B
VR2B
R118
10K
GND
IN
A(2)
MAIN_CS
R123
0R
U103
NC7SZ32
SUB_CS
L100
BLM15AG100PN1
VCC_EXT
2 B0
A2 13
3 O0
B2 12
4 A1
O2 11
5 B1
A3 10
R122
10K
A(0)
6 O1
B3 9
7 GND
O3 8
R124
0R
VCHG VBAT
C
C104
10u
(2012)
VCC 14
ON_OFF
1 A0
R121
10K
Q101
RN1307
R119
0R
U102
HSP129
R120
0R
RPWRON
V102
P0402FC12C
OUT
FOLDER
MIDI_CS
P0402FC12C P0402FC12C
VBAT
MC74VHC126
VBACKUP
_CS3
V101
V100
C105
47p
L102
BLM15AG100PN1
L103
L104
MAIN_CS
A(1)
J102
LG_LCD_CON_30P
1
2
3
BLM15AG121PN1
BLM15AG121PN1
VDD_3.0V
MAIN_CS
A0 (D/I)
D(0:7)
AUXOP
AUXON
1
3
5
7
MAIN_BACKLIGHT
I_LED1
I_LED2
I_LED3
SUB_BACKLIGHT
SUB_CS
A(2)
RXD
RX
DTR
HANDSFREE
R111
1K
R112
47R MNR04
MOTOR
(REC_N) EARN
REC_P
SPKN
SPKP
RPWRON
1
3
5
7
TDO
TMS
TCK
TDI
L113
L114
BLM15AG121PN1
BLM15AG121PN1
12
13
14
L190
L124
BLM15AG121PN1
L115
L116
BLM15AG121PN1
BLM15AG121PN1
L117
L118
L119
L120
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
HSP121
HSP122
HSP120
HSP119
HSP118
HSP116
HSP117
HSP115
HSP114
HSP113
HSP112
HSP111
HSP110
HSP109
HSP108
HSP107
25
2
4
6
8
n.m
1
3
5
7
MNR04
LED_EN
VBACKUP
I_LED1
I_LED2
I_LED3
EL_EN
VBAT
22
23
24
25
26
27
28
29
30
C108
R114
47p
1M
PCM_TX
PCM_SYNC
PCM_CLK
PCM_RX
_WR
_RES
VSS
15
16
17
18
19
20
21
BLM15AG121PN1
DCD
R113
R109
220R
D0
D1
D2
D3
D4
D5
D6
D7
SUB_CS
CS2 (A2)
VSS1
VBAT1
MOTOR
RECREC+
SPKSPK+
HSP514
47R MNR04
16
1
AUXGND
12
GND2
19
GND1
HSP106
DCD
4.7R
4.7R
R110
2
4
6
8
11
9
8
7
HSP105
TDO
TMS
TCK
TDI
HSP104
POWER_ON
R107
R108
2
4
6
8
13
RXD
10
RX
3
DSR
2
HANDSFREE
1
3
5
7
_WR
LCD_RESET
AUX_IN
CTS
RTS
TX
TXD
HSP513
2
4
6
8
18
AUXOP
17
AUXON
R106
47R MNR04
HSP128
8
6
4
2
R105
100R
24
23
20
15
14
4
5
6
7
8
9
10
11
HSP134
HSP136
HSP135
HSP133
HSP130
HSP131
HSP132
HSP137
AUXI
CTS
RTS
TX
TXD
R104
10K
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
BLM15AG121PN1
HSP126
R103
MNR04
10K
21
BATT2
22
BATT1
L105
L106
L107
L108
L109
L110
L111
L112
HSP512
4
5
7
5
3
1
VCHG2
VCHG1
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
R102
33K
HSP127
26
27
BATT_TEMP
VR2B
R101
20K
C110
1uF
(1608)
C106 C107
47p 47p
F
R115
0R
J101
Section
LG-IO_CONN_24P
Date
Sign & Name
Designer
02.04.11
D.S.JUNG
Checked
02.04.11
N.S.KIM
Approved
LG
issue
- 89 -
Notice NO.
Data
Name
Electronics Inc
Model
Sheet/Sheets
1/6
Drawing
Name
BASEBAND INTERFACE
Drawing
No.
10. CIRCUIT DIAGRAM
2
R231
KEYLIGHT
PWT
10
12
11
0R
VR2B
LCD_RESET
JACK_DETECT
SUB_BACKLIGHT
DTR
DCD
MELODY_INT
FOLDER
A
R672
10K
A
XO_ENA
RF_ENA
SUB_LED2
SUB_LED3
SUB_LED1
MELODY_RESET
VDD_RTC
PCM_CLK
PCM_SYNC
PCM_RX
PCM_TX
C233
100p
CTS
RXD
TP222
R224
0R
C204
18p
GND
_WR
TDO
TCK
TDI
R220
10K
UPR
UPR
TMS
X200
MC-146
B
VBAT
R201
220K
TDO_ARM
R221
n.m
nBSCAN
R223
R222
TP221
C203
20P
10K
n.m
RX
TX
UPR
UPR
C202
20P
VBAT
RTS
TXD
RXIR_IRDA
TXIR_IRDA
SD_IRDA
RPWRON
VR2B
TP220
R202
R203
10K
10K
_WR
A14
VSSO
K7
L7
PWT_BU
PWL_LT
F2
C8
B8
A9
B9
C7
A7
B7
A8
B2
SDIO3
C4
SCLK3
B3
SRST3
VR2B
BDLQM
BDLQP
BDLIM
BDLIP
BULQM
BULQP
BULIM
BULIP
MICBIAS
AUXI
AGNDA1
MICIP
MICIN
EARP
EARN
AUXOP
AUXON
BUZZOP
SPK_EN
VAUX
VS2
VS1
SVDD
SDIO5
SCLK5
SRST5
VBAT_2
R208
20K
1n
C5
A6
B6
B5
A5
E6
D6
C6
F10
F8
F9
G8
BATT_TEMP
RADIO_TEMP
HOOK_DETECT
R209
R204
R205
R206
R207
390R
390R
390R
390R
N.C
F11
VDD_PLL
E14
GND_PLL
C11
E11
VDD_ANG
E12
GND_ANG
K2
J1
H3
E2
D3
H1
E1
H10
C1
D1
0R
_CS3
_CS2
_CS1
_CS0
SWITCH
FDBK
RESERVED
VR2IN
VR2SEL
VR1OUT
VR2OUT
VR3OUT
VR1BOUT
VR2BOUT
KBR(0)
KBR(1)
KBR(2)
KBR(3)
KBR(4)
FDP
KBC(4)
KBC(3)
KBC(2)
KBC(1)
KBC(0)
FWE
D202
1SS388
_BLE
_BHE
C223
100n
C224
100n
C225
100n
C226
100n
C222
2.2u
(2012)
C234
10u
(2012)
C227
100n
UPR
VBACKUP
VBAT
VCHG
ICTL
C219
10u
(2012)
C220
10u
(2012)
REFGND
R211
20K
VR2
MICIP
MICIN
EARP
EARN
AUXOP
AUXON
C215
220n
A3
A1
B1
A2
D4
B4
D5
C216
BGTR1
BGTR2
BGTR3
BGTR4
BGTR5
IBIAS
VREF
1u
(1608)
SIM_VDD
SIM_I_O
SIM_CLK
SIM_RST
VBACKUP
D200
1SS388
VCHG
ICTL
G4
G3
G2
H2
J2
G1
F4
C217
R226
n.m
100n
VDD_RTC
C218
R219
100n
120K
VBACKUP
U202
3
C221
10u
(2012)
C228
100n
C229
100n
C231
OUT
IN
GND
NC
2
4
C230
100n
S-817
100n
KBC(0:4)
VBAT
C3
J3
E5
E4
E3
F3
R229
D13
VDDS_RTC
D14
VDD_RTC
C14
GND_RTC
GND0
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
F1
N8
K1
P2
P4
P10
P13
G14
A10
A7
A2
B1
VDD0
VDD1
VDD2
VDD3
VDD4
VDD5
L14
VDDS_1_1
N5
VDDS_1_2
A5
B12
N14
P7
M1
E1
VDDS_MIF0
VDDS_MIF1
VDDS_MIF2
VDDS_MIF3
VDDS_2
A4
B6
G1
D1
A11
XD1_03_KBR0
XD1_04_KBR1
XD1_05_KBR2
XD1_06_KBR3
XD1_07_KBR4
K6
M6
P6
N6
L6
KBC4_XD1_02
KBC3_XD1_01
KBC2_XD1_00
KBC1_NIRQ
KBC0_NFIQ
0R
0R
VR3
C213
270p
QN
QP
IN
IP
0R
0R
0R
0R
MICBIAS
AUXI
UPR
K3
VCC1
D2
VCC2
G9
VCC3
VR1 VR2B V1B
R280
R281
R282
R283
K9
H7
J7
K8
J8
H9
H8
J9
J10
K10
UPR
VDD_RTC
33n
C206
E10
E9
E8
E7
D9
D8
C10
C9
1M
AFC
PA_LEVEL
C211
270p
J6
UDX
K6
UDR
F5
UEN
G13
F13
G10
G11
F14
CK13M
U201
NAUSICA_CS
K7
VDR
G6
VDX
G7
VFS
H6
VCK
N7
MCUDI
M7
MCUDO
M8
MCUEN0
P8
MCUEN1_I_O8
L8
MCUEN2_I_O13
SIM_IO
SIM_CLK
SIM_RST
SIM_CD_MAS0
SIM_PWCTRL_I_O5
TESTRESETZ
TEST1
TEST2
TEST3
TEST4
TDO
TDI
TCK
TMS
J5
BFSX
K5
BDX
G5
BFSR
H5
BDR
P14
VDX
N13
VDR
M13
VFSRX
N12
VCLKRX
ADD00
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
J4
K4
F1
B10
A10
OSCAS
PWON
RPWON
D7
RTC_ALARM
F7
INT1
H4
INT2
TP219
LCDSYNC
TSCYM
TSCXM
ADIN1
ADIN2
ADIN3
ADIN4_TSCXP
ADIN5_TSCYP
DAC
AFC
APC
AUXGND
D10
ON_OFF
F6
RESPWRONZ
B11
E10
D11
D10
C10
B10
E9
C205
A4
N2
I_O7_NRESET_OUT
P11
ARMCLK_BCLKR
M2
IDDQ
N3
I_O0_TPU_WAIT
P3
I_001_TPU_IDLE
L4
I_O2_IRQ4
M4
I_O3_SIM_RnW
H10
TSPDI_I_O4
N11
BCLKX_I_O6
A13
RFEN_NoPC
A12
TCXOEN
N1
niBOOT
L10
TXD_MCSI_1_09
M10
RXD_MCSI_1_010
K9
FSYNCH_MCSI_1_012
N10
CLK_MCSI_1_011
B9
E8
D9
A9
C9
C13
OSC32K_IN
B13
OSC32K_OUT
C12
CLK32K_OUT
R225
1M D201
1SS388
GRND1
GRND2
GRND3
_WR
_RD
TP206
K1
C2
G10
R227
R228
TP205
L11
BFSR
K10
BDR
P12
BFSX
M11
BDX
RnW_
nFOE_X_A3
F3
F2
G5
G4
G2
G3
H1
H3
H2
H4
H5
J1
J2
J3
J4
K3
K2
K4
J5
L1
L2
L3
D2
NEMU0_
NEMU1_
NBSCAN_
TDI
TDO
TCK
TMS
U200
CALYPSO
B2
E2
TP212
TP211
TP210
TP209
A(0)
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(19)
A(20)
A(21)
A(22)
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
TP214
A(0:22)
B7
D7
E7
D6
A6
C6
E6
C5
B5
D5
E5
B4
C4
D4
A3
B3
TP213
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
D(8)
D(9)
D(10)
D(11)
D(12)
D(13)
D(14)
D(15)
TP204
B14
INT4n_IT_WAKEUP
P1
EXT_FIQ
M3
EXT_IRQ
M5
P5
L5
K5
N4
D(0:15)
TP218
TP217
F10
ON_OFF
D12
nRESPWON
nBLE_I_O15
nBHE_I_O14
nFWE_X_A0
FDP_nIACK
TP208
TSPACT00
TSPACT01
TSPACT02
TSPACT03
TSPACT04
TSPACT05
TSPACT06
TSPACT07
TSPACT08
TSPACT09
TSPACT10
TSPACT11
E4
F5
E3
F4
VBACKUP
nCS3_
nCS2_
nCS1_
nCS0_
PA_ON
E13
CLKTCXO
F12
START_BIT_CLK13M_OUT
TP216
D3
C1
C3
C2
M12
M14
L12
L13
J10
K11
K13
K12
K14
J11
J12
J13
RESET_RF
TDI
TMS
TCK
TDO
HANDSFREE
END_ON_OFF
RPWRON
13MHZ
MCLK
TDR
TEN
H13
TSPEN0
H12
TSPEN1
H14
TSPEN2
G12
nSCS2_TSPEN3
EN
TX_MODEM
RTS_MODEM_TOUT
DSR_MODEM_LPG
RX_MODEM
CTS_MODEM_XF
C8
D8
B8
C7
A8
TX_IRDA
RX_IRDA
CLKOUT_DSP_SD_IRDA
X_A4_TXIR_IRDA
X_A1RXIR_IRDA
J14
TSPCLKX
H11
TSPDO
CLK
DATA
K8
SDO_INT10n
M9
SDI_SDA
P9
SCLK_INT1n
L9
NSCS0_SCL
N9
NSCS1_X_A2
ON_OFF
C
C232
KBR(0:4)
33u/6.3V
A-CASE
H
Section
Date
Sign & Name
Designer
02.04.11
D.S.JUNG
Checked
02.04.11
N.S.KIM
Approved
LG
issue
- 90 -
10
Notice NO.
Data
Electronics Inc
Name
11
Model
Sheet/Sheets
2/6
Drawing
Name
BASEBAND CHIPSET
Drawing
No.
12
10. CIRCUIT DIAGRAM
VR2
VR2
D(0:15)
A(1:22)
TP301
U301
U302
TC58FVB641
R302
0R
_CS1
G2
F2
E2
C2
D2
F3
E3
C3
D6
C6
E6
F6
D7
C7
E7
F7
G7
D3
E4
F5
F4
E5
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(19)
A(20)
A(21)
A(22)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
H2
CE_
J2
OE_
C5
WE_
H7
BYTE_
C4
RY_BY_
D4
WP_
D5
RESET_
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
VDD
TH50VSF4683
G3
K3
G4
K4
K5
G5
K6
G6
H3
J3
H4
J4
H5
J6
H6
J7
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
D(8)
D(9)
D(10)
D(11)
D(12)
D(13)
D(14)
D(15)
J3
G4
K4
H5
H6
K7
G7
J8
K3
H4
J4
K5
J7
H7
K8
H8
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
D(8)
D(9)
D(10)
D(11)
D(12)
D(13)
D(14)
D(15)
J5
J5
J6
K6
J9
G3
K2
VSS0
K7
VSS1
NC0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
A1
A2
A7
A8
B1
B7
B8
L1
L2
L7
L8
M1
M2
M7
M8
A1
A10
B1
B10
C1
F1
F10
G1
G10
L1
L10
M1
M10
C300
100n
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
VCCF
VCCS
DU_CIOS
VSS0
VSS1
NC0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
R301
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
G2
F2
E2
D2
F3
E3
D3
C3
C7
E7
F7
C8
D8
E8
F8
D9
G9
F4
E4
D7
E6
E9
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(19)
A(20)
A(21)
A(22)
R300
H2
CEF_
H3
OE_
C6
WE_
H9
BYTE_
0R
VR2
E5
RY_BY_
C5
WP_
D5
RESET_
LB_
UB_
CE1S_
CE2S_
DU
n.m
C4
D4
J2
D6
G8
_CS0
_RD
_WR
FDP
R303
0R
_BLE
_BHE
_CS2
R305
10K
C304
33n
C301
100n
F
Section
Date
Sign & Name
Designer
02.04.11
D.S.JUNG
Checked
02.04.11
N.S.KIM
Approved
LG
issue
- 91 -
Notice NO.
Data
Name
Electronics Inc
Sheet/Sheets
Model
3/6
Drawing
Name
MEMORY DEVICE
Drawing
No.
10. CIRCUIT DIAGRAM
VR3
R400
1K
2
5
MICBIAS
A
6
4
C401
10u
(2012)
C400
47p
1 3
JACK_DETECT
C402
47p
D401
KDS160E
U404
MAX4599
R401
2.4K
MICIP
C405
47p
C404
100n
C403
n.m
Microphone
MIC400
HSP401
HSP400
C407
47p
C406
47p
OB-22S40-C33
C408
100n
MICIN
R402
1.2K
C409
47p
C410
33p
VR3
VR3
R419
7.5K
VR3
R404
R405
18K
1M
EARN
REC_P
HSP402 HSP403
U400
MAX9075
5
C411
47p
JACK_DETECT
C
Receiver
EARN
C412
47p
1
4
R407
J400
9001-8905-040
C413
100n
1M
AUXI
AUX_IN
AUXOP
C414
47p
C427
47p
HSP404 HSP405 HSP406
R420
100R
HOOK_DETECT
4.7R
4.7R
4.7R
R408
R409
R410
V400
4
3
1
V401
Headset jack
C415
47p
VBAT
U401
1
2
3
4
SD_
CNIOSE
DELAY
ERROP_
GND SENSE_ADJ
VIN
VOUT
VCC_EXT
SI9182
C416
220n
P0402FC05C
P0402FC05C
8
7
6
5
C417
2.2u
(2012)
VR3
ON_OFF
D(0:7)
0R
R421
VIBRATOR
Speaker
U402
MAX4624
SPK_EN
C420
390p
C421
18p
U403
R422
V402 HSP4081
11
HPOUT-R
10
HPOUT-L
7
8
1
2
3
4
5
6
MCLK
SUB_LED1
MELODY_INT
MELODY_RESET
SPKP
SPKN
16
SPVSS
15
SPVDD
YMU762
CLK1
LED
-IRQ
-RST
NC
PLLC
10K
18
SPOUT2
17
SPOUT1
28
WR_
29
_CS
30
A0
31
_RD
32
IOVDD
_WR
MIDI_CS
A(1)
_RD
R417
12
EQ1
13
EQ2
14
EQ3
VREF
R450
150K
VDD
VSS
R416
82K
C422
47p
V403
HSP407 1
C423
47p
VR2B
P0402FC05C
P0402FC05C
D0
D1
D2
D3
D4
D5
D6
D7
MTR
EARP
C419
10n
R415
39K
27
26
25
24
23
22
21
20
19
R414
33K
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
C418
22n
n.m
F
R418
3.3K
C426
1n
Date
Sign & Name
Designer
02.04.11
D.S.JUNG
Checked
02.04.11
N.S.KIM
Section
C424
100n
C425
100n
Approved
LG
issue
- 92 -
Notice NO.
Data
Name
Electronics Inc
Sheet/Sheets
Model
4/6
Drawing
Name
AUDIO
Drawing
No.
10. CIRCUIT DIAGRAM
KEYPAD BACKLIGHT
D520
HSP500
HSP502
HSP501
HSP503
KBC(4)
DOME SWITCH
HSP504
SW502
KBR(1)
SW501
MAIL
SW505
4
SW506
5
SW507
6
SW508
F1
2
1
KBR(2)
SW504
3
SIDE_KEY
B
P0402FC12C
V407
2
1
KEYLIGHT
SW503
2
Q500
R500
1.5K
SW509
1
HSP515
P0402FC12C
V404
HSP505
MAIN LCD BACKLIGHT
1
2 VM
3 VU
4 VD
CO
HSP516
D519
D518
D517
D516
D515
D513
D514
D512
D511
D510
D509
D508
D507
D506
D505
D504
D503
D502
D501
HSMR-C197X21
KBC(3)
KBC(0)
KBR(0:4)
VBAT
KBC(2)
KBC(0:4)
D500
KBC(1)
3
5
HSP506
IMX9
R501
100K
R503
27R
R502
27R
HSP507
KBR(3)
P0402FC12C
V406
P0402FC12C
V405
HSP508
SUB LCD BACKLIGHT
SW514
8
SW510
7
MAIN_BACKLIGHT
SW511
9
SW512
F2
C
KBR(4)
R504
270R
R505
100K
HSP509
SW515
KBR(0)
VBAT
U502
MAX4599
OUT
180R
R531
62R
R532
27R
OUT
OUT
I_LED2
SW520
LEFT
I_LED1
IN
R509
10K
IN
GND
3 1
Q504
RN1307
GND
Q503
RN1307
GND
R512
10K
R513
10K
VBAT
VBAT
LOCKUP
L500
100N
VBAT
SW526
END-ON/OFF
C502
D521
ISS302
E
L502
100N
R516
33R
TXIR_IRDA
RXIR_IRDA
SD_IRDA
R518
0R
47K
SW500
A3212
MOTOR
U501
CIM-80S7B
1
2 LEDA
3 LEDK
4 TXD
5 RXD
6 SD
7 VCC
GND
R517
4.7R
PWT
n.m
3
R520
1.5K
Q506
2
VIBRATOR
2SC5585TL
1
C503
1u
(1608)
C504
100n
R533
R521
100K
F
Date
Sign & Name
Designer
02.04.11
D.S.JUNG
Checked
02.04.11
N.S.KIM
Section
Approved
LG
issue
PROTECTION
C505
100n
56p
VR2B
R519
SW524
CFM
HSP511
FOLDER SWITCH
FOLDER
SW523
DOWN
END_ON_OFF
Q502
RN1307
VR2B
SUB_LED3
SW522
UP
I_LED3
SW521
RIGHT
IN
VIBRATOR
ON_OFF
SUB_LED1
SUB_LED2
SW519
F3
R510
6.2K
R530
R508
10K
SW518
SEND
6
4
VCHG
SW517
#
HSP510
C500
100n
SW516
0
- 93 -
Notice NO.
Data
Name
Electronics Inc
Model
Sheet/Sheets
5/6
Drawing
Name
MMI
Drawing
No.
10. CIRCUIT DIAGRAM
10.2 RF Circuit
2
VBAT
C603
ANT600
ANT_PAD_LGX
C600 C601 C602
R600
18R
H_H_PWR
GND2
H_L_PWR
L_L_PWR
GND1
L_H_PWR
GND4
6
5
4
3
2
1
8
DCS
2 GSM
4 NC1
OUTN
NC2
OUTP
GND1
1
GND5
3
8
R605
68R
U602
LDB32942M05D-429
7
6
5
R607
100R
R606
100R
C608
47p
PIN_DCS
PIN_GSM
U601
PF08122B
47p
12p
L635
POUT_DCS 5
C609
POUT_GSM 4
SW600
MHC-173
L600
0R
1n
N600
4.7N LDC15D190A0007A
47p
L601
12n
6 5 4 3
C606
n.m
5 2 3
4
8
10
7 6 1
C613 C610
1.2p n.m
C611 C612
1.5p n.m
GND2
3
6
2
7 14
R608
51R
VBAT
R642
1K
C679
12p
VCC
CTL
R643
1M
R644
1.5K
R645
1K
C686
12p
C675
1n
C622
27p
C632
C633
4.7p
100n
R619
R623
n.m
R625
1K
C642
15p
L602
C645
7p
C648
C657
L603
100n
1
3
5
C646
L605
18N
100n
100n
C649
AN CAT
D601
HVC369B
3p
R638
2.2K(1%)
C678
n.m
C671
12n
(3216)
C660
L606
18N
L608
3.3N
C639
n.m
BPF601
SAFSD942MCL0T00R00
L633
3.3p 4
3.3N
2
3.3p 6
C640
n.m
L609
C691 1.2n
R634
9.76K(1%)
C658
C681
4.7p
L611
6.8N
C682
4.7p
3.9N
R635 C670
1K 1.2n
U607
NC7WZ02
C674
1n
(2012)
R641
390R(1%)
R647
3.3N
R674
680R
R673
270k
C684
n.m
C685
100n
TXRXSW
LBSW
HBSW
R648
2.2K
R675
4.7k
L612
6.8N
HBSW
TXRXSW
LB_LP
1
0
1
LB_HP
0
0
1
HB_LP
1
HB_HP
0
1
0
1
0
C683
100n
R646
2.2K
C698
100n
3
D602
HVB387BWK
F
Date
Sign & Name
0R
02.04.11
Y.M.CHO
Checked
02.04.11
D.H.KIM
n.m
Approved
Section
LG
3
LBSW
VREG3
Designer
8
7
issue
R626
1K
SAFSD1G84CB0T00R00
L632
2.7N
3.3N
4
2
2.7N
3
4
TH601
22K_NTC
R676
C662
3p
C673
5.6n
(1608)
RADIO_TEMP
R636
2.7K(1%)
TP610
R677
R624
620K
U629
SN74HC1GU04DCKR
C680
1n
13MHZ
OUT
GND
2
RESET_RF
QN
QP
IN
IP
C672
1.2n
(1608)
U606
VC-TCXO-208C
4
1
AFC
C628
1n
A1
VR3
C665
10n
R640
n.m
C627
1n
BPF600
C669
3
-ERR
R617
51R
C643
7p
100n
-SD
C664
2.2u
(2012)
C668
NR
100n
1K
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
OUT
C667
n.m
R679
n.m
TRF6150
A2
XO_ENA
R633
R637
R622
120R
C637
39p
VAPC
FILT
DETD
DETR
DCSLNAN
DCSLNAP
VCC3
PCSMIXN
PCSMIXP
GNDLNAN
VCC2
GSMLNAN
GSMLNAP
MAINVCO
VCC1
VCC8
CAT
RF_ENA
R678
0R
R632
0R
1
IN
C635
4.7u
U604
C666
C630
n.m
D600
BAT15-099
P-CASE
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
U605
ADP3330_2V85
2
100n
C623
100n
100n
C663
C661
2.2u
(2012)
GND
P-CASE
C629
27P
1
3
5
C647
VBAT
HB-SW
TXRX-SW
VCC10
MAINSPUP1
MAINCP
VBAT2
VREG2
APC
APCEN
VR4IN
CLK
DATA
EN
AUXCP
VCC9
CRF
1n
1K
1K
1K
100n
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1n
R629
R630
R631
R620
R621
C634
CLK
DATA
EN
VR2B
R616
n.m
R649
10R
100n
1K
1K
100n
1n
C641
R656
R657
R609
0R
RESETZ
QN
QP
IN
IP
VCC7
AUXVCOP
AUXVCON
RXMIXQP
RXMIXQN
RXMIXIP
RXMIXIN
TESTVCO
DECRXMIX
BIASREF
BANDGAP
C638
PA_LEVEL
PA_ON
C690
0.5p
13
12
11
9
5
3
1 7
C626
4.7u
LB-SW
VCC5
VREG3
VBAT3
R3
TXRXCP
R2
MAINSPUP2
GNDTXCP
VCC6
RXLOP
RXLON
VCC4
OMIXRF
VBAT1
VREG1
C687
2.2u
(2012)
C692
DCS_TX GND1
EGSM_TX GND2
GND3
GND4
DCS_RX GND5
EGSM_RX GND6
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
C636
33u/6.3V
A-CASE
2.2K
27p
27p
C615
12n
(3216)
C625
1n
(1608)
33R
1.2K
C624
2.2u
(2012)
n.m
C619
1n
R615
C620
C621
R610
0R
VBAT
U603
SHS-M090B
VC1
VC2
C614
330p
C604
27p
1
ANT
PWR_SW
DCS_SW
GSM_SW
VCC
GND3
VT
10p
1K
VAPC VDD1
VCTL
GND1
GND2 VDD2
8
9
10
11
12
13
TXRXSW
HBSW
LBSW
VREG3
R603
R604
470u
C605
12p
7
9
10
U600
ENFVZ4L07
R601
300R
R602
300R
- 94 -
Notice NO.
Data
Name
Electronics Inc
Model
Sheet/Sheets
6/6
Drawing
Name
RF MAIN
Drawing
No.
11. PCB LAYOUT
11. PCB LAYOUT

11.1 TOP
- 95 -
11. PCB LAYOUT
11.2 BOTTOM
- 96 -
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 Exploded View
M28
M27
M31 M32
M30
M23
M22
M26
M20
M19
M29
M16
M11
M12
M13
M10
M18
M4
M17
M34
M15
M2
M8
M1
M14
M3
M9
M5
M7
M6
M35
M33
- 97 -
M21
M24
M25
< Parts List Of Exploded View >

No.
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
Location No.
Part No.
MWAF00 MWAF0005701
ACGJ00
ACGJ0016302
ACGJ0016301
ACGJ0016303
MHFD00
MHFD0002101
SVLM00
SVLM0003701
SUSY00
SUSY0006001
SACY00
SURY0004501
SJMY00
SJMY0002801
SBCL00
SBCL0001001
SACY00
SACY0004601
SACY01
SACY0004501
ACGH00
ACGH0006702
ACGH0006703
ACGH0006704
GMZZ00
GMZZ0003201
MCCH00 MCCH0003902
MCCH0003903
MCCH0003904
MBHY00
M15
M16
M17
MWAC00
ABGC00
ACGK00
M18
M19
MDAC00
MCCC00
M20
M21
M22
M23
M24
M25
ABGA00
ADCA00
SAKY00
SAFY00
SUMY00
MLEA00
M26
M27
MWAZ00
ACGM00
M28
SNGF00
M29
M30
ACFY00
MCCF00
M31
M32
GMZZ00
SBPP00
M33
M34
MTAE00
MCCZ00
M35
ACGG00
Description
WINDOW,LCD(SUB)
COVER ASSY,FOLDER(UPPER)
HINGE,FOLDER
LCD MODULE
SPEAKER
RECEIVER
VIBRATOR,MOTOR
BATTERY,CELL,LITHIUM
PCB ASSY,FLEXIBLE
PCB ASSY,FLEXIBLE
COVER ASSY,FOLDER(LOWER)
SCREW MACHINE
CAP,SCREW
CAP,SCREW
CAP,SCREW
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
Specification
G7020 G7028 Common use (ALL BRAND)
Color
Cobalt Blue
Metal Silver
Red
G7000 5 PHI
128*160, 96*64 ,32.05*40.20 ,39.5*58.7*6.4(t), 65K COLOR LCD
ASSY ,8 ohm,86 dB,15 mm,G7000 SPEAKER
3.0 V,80 mA,12*15 ,height 2.7+0.1T
3 V,1.2 mAh,COIN ,ASAHI BATTERY (ML414NB/F9D)
G7000 Receiver
G7000 LCD
Cobalt Blue
Metal Silver
Red
3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5
MBHY0003503
BUMPER
LG-510,511,512,common use for METALIC SILVER,diameter=2.4
MBHY0003505
MWAC0021401
ABGC0000701
ACGK0014702
ACGK0014703
ACGK0014704
MDAC0005001
MCCC0003502
MCCC0003501
MCCC0003503
ABGA0000901
ADCA0006001
SAKY0001101
SAFY0050102
SUMY0003503
MLEA0003802
MLEA0003803
MLEA0003804
MWAZ0001701
ACGM0011902
ACGM0011903
ACGM0011904
SNGF0000702
SNGF0000701
SNGF0000702
ACFY0000701
MCCF0002002
MCCF0002003
MCCF0002005
GMZZ0003201
SBPP0005103
SBPP0005102
SBPP0005104
MTAE0004901
MCCZ0002702
MCCZ0002703
MCCZ0002704
ACGG0021702
ACGG0021701
ACGG0021703
BUMPER
WINDOW,LCD
BUTTON ASSY,SIDE
COVER ASSY,FRONT
COVER ASSY,FRONT
COVER ASSY,FRONT
DECO,SIDE
CAP,EARPHONE JACK
CAP,EARPHONE JACK
CAP,EARPHONE JACK
BUTTON ASSY,DIAL
DOME ASSY,METAL
PCB ASSY,SIDEKEY
PCB ASSY,MAIN
MICROPHONE
LOCKER,BATTERY
LOCKER,BATTERY
LOCKER,BATTERY
WINDOW
COVER ASSY,REAR
COVER ASSY,REAR
COVER ASSY,REAR
ANTENNA,GSM,FIXED
ANTENNA,GSM,FIXED
ANTENNA,GSM,FIXED
CONTACT ASSY,ANTENNA
CAP,MOBILE SWITCH
CAP,MOBILE SWITCH
CAP,MOBILE SWITCH
SCREW MACHINE
BATTERY PACK,LI-POLYMER
TAPE,WINDOW(SUB)
CAP
CAP
CAP
COVER ASSY,FOLDER
COVER ASSY,FOLDER
COVER ASSY,FOLDER
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
LG-510,511,512,common use, diameter=2.4

65K COLOR (LG Brand)
G7000
Cobal Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
G7000
G7000 Pearl White Color
Cobalt Blue
Metal Silver
Red
OK key + i (English version)

G7000
G7000
65K color PCB ASSY MAIN
FPCB,-40 dB,6*1.8,TOLERANCE +-2
Cobalt Blue
Metal Silver
Red
G7000 IrDA
1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA

1.5 ,-2.5 dBd,P427 ,G7000 ANTENNA (PANTONE 427C)
1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA
G7000
LG-510,511,512
LG-510,511,512
LG-510,511,512
3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5
3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (CB)
3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (SV)
3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (RD)
G7020 G7028 Common use
Cobalt Blue
MetalSilver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
- 98 -
Sevice Remark
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
12.2 Accessories
Portable Handsfree
Travel Adapter
Cigar Lighter Adapter
Data-cable
< Accessories >

No.
2
2
2
2
Location No.
Part No.
SGEY00
SGEY0002901
SSAD00
SSAD0007806
SSAD0007807
SGCC00
SGCC0001802
SGDY00
SGDY0004401
Description
EAR PHONE/EAR MIKE SET
TRAVEL ADAPTOR,AC-DC
TRAVEL ADAPTOR,AC-DC
CIGARETTE LIGHT ADOPTER
DATACABLE
QTY
1
1
1
1
1
Specification
EG890B, G5200 3P EAR MIC (EM-412GS)
100-240V, 50/60 Hz,5.2 V,850 mA,CE (Europe: TA-20G)
100-240V, 50/60 Hz,5.2 V,850 mA,CE (Russian(CIS): TA-20GR)
CLA (CLA-20G)
(DK-20G)
- 99 -
Color
Service Remark
Yes
Yes
Yes
Yes
Yes
12.3REPLACEMENT PARTS
<Mechanic components>
Level Location No.
3
ABGA00
3
ACGG00
3
ACGG00
3
ACGG00
4
ACGH00
4
ACGH00
4
ACGH00
5
MBHY00
4
MCCH00
4
MCCH01
4
MCCH02
5
MCJH00
5
MDAF00
5
MDAF00
5
MDAF00
5
MDAH01
5
MFBB00
5
MPBG00
5
MPBJ00
5
MTAA00
5
MTAA00
5
MTAA00
5
MTAA01
5
MTAA01
5
MTAA01
5
MTAD00
4
ACGJ00
4
ACGJ00
4
ACGJ00
5
ADBY00
5
ADBY00
5
ADBY00
6
MDAE00
6
MDAE00
6
MDAE00
6
MFBC00
6
MTAA00
5
MCCZ00
5
MCCZ00
5
MCCZ00
5
MCJJ00
5
MCJJ00
5
MCJJ00
5
MDAE00
5
MDAY00
5
MIAA00
5
MICA00
5
MMAA00
5
MPBQ00
5
MPBZ00
5
MPFD00
5
MTAA00
5
MTAA01
5
MTAE00
5
MTAZ00
Part No.
MCJH0004203
MDAF0000702
MDAF0000703
MDAF0000704
MDAH0000201
MFBB0001901
MPBG0004801
MPBJ0003201
MTAA0006801
MTAA0006501
MTAA0006401
MTAA0006501
MTAA0006801
MTAA0006701
MTAD0010301
ADBY0001202
ADBY0001201
ADBY0001203
MDAE0009802
MDAE0009801
MDAE0009803
MFBC0001901
MTAA0016601
MCJJ0010202
MCJJ0010201
MCJJ0010203
MDAE0008403
MDAY0004201
MIAA0006701
MICA0001201
MMAA0000901
MPBQ0005501
MPBZ0017401
MPFD0001001
MTAA0015501
MTAA0015601
MTAZ0005401
Description
BUTTON ASSY,DIAL
COVER ASSY,FOLDER
COVER ASSY,FOLDER
COVER ASSY,FOLDER
BUMPER
CAP,SCREW
CAP,SCREW
CAP,SCREW
COVER,FOLDER(LOWER)
DECO,FOLDER(LOWER)
DECO,FOLDER(LOWER)
DECO,FOLDER(LOWER)
DECO,RECEIVER
FILTER,RECEIVER
PAD,LCD
PAD,MOTOR
TAPE,DECO
TAPE,DECO
TAPE,DECO
TAPE,DECO
TAPE,DECO
TAPE,DECO
TAPE,WINDOW
DECO ASSY
DECO ASSY
DECO ASSY
DECO,FOLDER(UPPER)
DECO,FOLDER(UPPER)
DECO,FOLDER(UPPER)
FILTER,SPEAKER
TAPE,DECO
CAP
CAP
CAP
COVER,FOLDER(UPPER)
COVER,FOLDER(UPPER)
COVER,FOLDER(UPPER)
DECO,FOLDER(UPPER)
DECO
INDICATOR,LED
INSERT,FRONT
MAGNET,SWITCH
PAD,LCD(SUB)
PAD
PLATE,GROUND
TAPE,DECO
TAPE,DECO
TAPE,WINDOW(SUB)
TAPE
QTY
1
1
1
1
1
1
1
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
1
Specification
Please refer to the 'Exploded View'
Service
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
N
N
N
G7000
N
G7000
N
G7000
N
G7000
N
G7000 RECEIVER
N
G7000 FOLDER(LOWER)
N
G7000 FRONT
N
G7000 FOLDER(LOWER)
N
G7000 RECEIVER
N
G7000 SIDE
N
NITTO No.5000NS (t=0.16)
N
Y
Y
Y
Y
PROJECTION ASSY (RUSSIA)
Y
Y
N
PROJECTION
N
N
G7010,G7020 COMMON USE
N
UPPER DECO(LEATHER ASSY)
N
Y
Y
Y
N
G7028 (EASTCOM BRAND)
N
N
W7020 LG-COLOR DISPLAY (RUSSIA)
N
G7020 G7028 Common use (SUS)
N
G7020 G7028 COMMON USE
N
LG-G510,511,512 common use, DIA = 1.7mm+2.3t
N
G7000 12x2x0.7t
N
G7010 & G7020 SUB LCD PAD
N
G7010, G7020 INDICATOR PAD (Common use)
N
G7010
N
G7020 folder uppper (Electro Forming) )
N
G7020 FOLDER UPPER SUS (#615 OR#668)
N
Y
G7000 MAGNET SWITCH
N
- 100 -
Color
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Remark
M20
M35
M11
M14
M13
Cobalt Blue
Metal Silver
Red
Pearl White
Metal Silver
Red
Pearl White
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
M2
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
M34
M33
Level Location No.

4
ACGK00
4
ACGK00
4
ACGK00
5
ABGC00
5
MCCC00
5
MCCC00
5
MCCC00
5
MCJK00
5
MCJK00
5
MCJK00
5
MDAC00
5
MDAG00
5
MDAG00
5
MDAG00
5
MICA00
5
MPBH00
5
MTAA00
5
MTAA01
4
GMZZ00
4
MGAD00
4
MHFD00
4
MTAB00
4
MTAB01
4
MTAB02
4
MWAC00
4
MWAF00
4
SACY00
5
SACY00
5
SBCL00
5
SJMY00
5
SPCY00
5
SUSY00
4
SACY01
5
ENBY00
5
ENBY01
5
SPCY00
4
SPCY00
4
SVLM00
3
ACGM00
3
ACGM00
3
ACGM00
4
ACFY00
5
MBIA00
3
MCCF00
3
MCCF01
3
MCCF02
5
MCIA00
4
MCJN00
4
MCJN00
4
MCJN00
4
MGAD00
4
MGAD01
4
MIDZ00
4
MIDZ01
4
MLEA00
Part No.
MCJK0006602
MCJK0006603
MCJK0006604
MDAG0000902
MDAG0000903
MDAG0000904
MICA0001201
MPBH0001101
MTAA0006401
MTAA0006701
MGAD0006001
MTAB0005101
MTAB0005001
MTAB0005201
SPCY0007304
ENBY0011001
ENBY0010901
SPCY0007202
SPCY0013401
MBIA0000301
MCCF0002002
MCCF0002003
MCCF0002005
MCIA0003701
MCJN0005402
MCJN0005403
MCJN0005404
MGAD0011901
MGAD0012001
MIDZ0008001
MIDZ0008101
Description
COVER ASSY,FRONT
COVER ASSY,FRONT
COVER ASSY,FRONT
BUTTON ASSY,SIDE
CAP,EARPHONE JACK
CAP,EARPHONE JACK
CAP,EARPHONE JACK
COVER,FRONT
COVER,FRONT
COVER,FRONT
DECO,SIDE
DECO,FRONT
DECO,FRONT
DECO,FRONT
INSERT,FRONT
PAD,MIKE
TAPE,DECO
TAPE,DECO
SCREW MACHINE
GASKET,SHIELD FORM
HINGE,FOLDER
TAPE,PROTECTION
TAPE,PROTECTION
TAPE,PROTECTION
WINDOW,LCD
WINDOW,LCD(SUB)
PCB ASSY,FLEXIBLE
RECEIVER
BATTERY,CELL,LITHIUM
VIBRATOR,MOTOR
PCB,FLEXIBLE
SPEAKER
PCB ASSY,FLEXIBLE
CONNECTOR,BOARD TO BOARD
PCB,FLEXIBLE
PCB,FLEXIBLE
LCD MODULE
COVER ASSY,REAR
COVER ASSY,REAR
COVER ASSY,REAR
CONTACT ASSY,ANTENNA
BUSHING,ANTENNA
CAP,MOBILE SWITCH
CAP,MOBILE SWITCH
CAP,MOBILE SWITCH
CONTACT,ANTENNA
COVER,REAR
COVER,REAR
COVER,REAR
GASKET,SHIELD FORM
GASKET,SHIELD FORM
INSULATOR
INSULATOR
LOCKER,BATTERY
QTY
1
1
1
1
1
1
1
1
1
1
2
1
1
1
4
1
1
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
LG-G510,511,512 common use, DIA = 1.7mm+2.3t

G7000 FRONT
G7000 FRONT
G7000 SIDE
G7000 10x5x1.5t
G7000 FOLDER UPPER PROTECTION TAPE
G7000 MAIN LCD WINDOW PROTECTION TAPE
G7000 sublcd window tape
POLYI ,0.3 mm,DOUBLE ,G7000 Receiver
30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (SOCKET)
30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER)
POLYI ,0.3 mm,DOUBLE ,G7000 LCD
FR-1 ,0.07 mm,DOUBLE ,GND FPCB
G7000 (KS-D-5101 C3603B ),
G7000
(2.8X7.5X0.3t)
(6.0X6.0X3.0t)
G7000 BB INSULATOR
G7000 RF INSULATOR
- 101 -
Service
Y
Y
Y
Y
Y
Y
Y
N
N
N
Y
N
N
N
N
N
N
N
Y
N
Y
Y
N
N
Y
Y
Y
Y
Y
Y
N
Y
Y
N
N
N
N
Y
Y
Y
Y
Y
N
Y
N
N
N
N
N
N
N
N
Y
Color
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Pearl White
Red
Cobalt Blue
Metal Silver
Red
Remark
M17
M16
M19
M18
Cobalt Blue
Metal Silver
Red
M12
M3
M15
M1
M9
M6
M8
M7
M5
M10
Cobalt Blue
Metal Silver
Red
M4
M27
M29
Cobalt Blue
Metal Silver
Red
M30
Cobalt Blue
Metal Silver
Red
Cobalt Blue
M25
Level Location No.

4
MLEA00
4
MLEA00
4
MPBH00
4
MSAZ00
4
MSAZ01
4
MSDB00
4
MWAZ00
3
ADCA00
3
GMZZ00
3
MLAK00
3
SAKY00
3
SUMY00
2
SBPP00
2
SBPP00
2
SBPP00
2
SNGF00
2
SNGF00
2
SNGF00
Part No.
MPBH0001201
MSAZ0007603
MSAZ0007602
MSDB0001701
MLAK0006301
Description
LOCKER,BATTERY
LOCKER,BATTERY
PAD,MIKE
SHEET
SHEET
SPRING,COIL
WINDOW
DOME ASSY,METAL
SCREW MACHINE
LABEL,MODEL
PCB ASSY,SIDEKEY
MICROPHONE
ANTENNA,GSM,FIXED
ANTENNA,GSM,FIXED
ANTENNA,GSM,FIXED
QTY
1
1
1
1
1
1
1
1
4
1
1
1
1
1
1
1
1
1
Specification
G7000 BACK
FDK Company(PE72 11.0*11.0*0.25t)
FDK Company (PE72 4.2*11.8 0.25t)
G7000
LG (30.5x21.54-1R)
- 102 -
Service
Y
Y
N
N
N
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Color
Metal Silver
Red
Remark
M26
M21
M31
Cobalt Blue
Metal Silver
Red
Cobalt Blue
Metal Silver
Red
M22
M24
M32
M28
< Main PCB >

Leve Location No.
3
SAFY00
4
SAFA00
5
BPF600
5
BPF601
5
BPF602
5
C100
5
C101
5
C103
5
C104
5
C105
5
C106
5
C107
5
C108
5
C109
5
C110
5
C118
5
C119
5
C120
5
C124
5
C202
5
C203
5
C204
5
C205
5
C206
5
C211
5
C213
5
C215
5
C216
5
C217
5
C218
5
C219
5
C220
5
C221
5
C222
5
C223
5
C224
5
C225
5
C226
5
C227
5
C228
5
C229
5
C230
5
C231
5
C232
5
C233
5
C234
5
C300
5
C301
5
C304
5
C400
5
C401
5
C402
5
C404
5
C405
5
C406
5
C407
5
C408
5
C409
5
C410
5
C411
5
C412
Part No.
SAFA0015702
SFSY0012301
SFSY0012201
SFSY0014101
ECTZ0003901
ECCH0000179
ECCH0000130
ECCH0000379
ECCH0000122
ECCH0000122
ECCH0000122
ECCH0000143
ECZH0003902
ECCH0000276
ECCH0000186
ECCH0000186
ECCH0000186
SEVY0004901
ECCH0000114
ECCH0000114
ECCH0000113
ECCH0000143
ECCH0000161
ECCH0000135
ECCH0000135
ECCH0001811
ECCH0000276
ECCH0000182
ECCH0000182
ECCH0000379
ECCH0000379
ECCH0000379
ECCH0000379
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000182
ECTZ0003101
ECCH0000128
ECCH0000379
ECCH0000182
ECCH0000182
ECCH0000161
ECCH0000122
ECCH0000379
ECCH0000122
ECCH0000182
ECCH0000122
ECCH0000122
ECCH0000122
ECCH0000182
ECCH0000122
ECCH0000189
ECCH0000189
ECCH0000189
Description
PCB ASSY,MAIN
PCB ASSY,MAIN,AUTO
FILTER,SAW
FILTER,SAW
FILTER,SAW
CAP,TANTAL,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
VARISTOR
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
Please refer to 'Exploded View'
65K color PCB ASSY MAIN AUTO
1842.5 MHz,2.0*2.5*1.0 ,SMD ,DCS BAND
942.5 MHz,2.0*2.5*1.0 ,SMD ,GSM BAND
897 MHz,2.0*2.0*1.8 ,SMD ,
10 uF,16V ,M ,STD ,ETC ,R/TP
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
150 pF,50V,J,SL,TC,1005,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
1 nF,50V,K,X7R,HD,1005,R/TP
0.1 uF,50V ,K ,X7R ,HD ,2012 ,R/TP
1 uF,10V,Z,Y5V,HD,1608,R/TP
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
5.6 V, ,SMD ,CAP=370pF+-30%
20 pF,50V,J,NP0,TC,1005,R/TP
20 pF,50V,J,NP0,TC,1005,R/TP
18 pF,50V,J,NP0,TC,1005,R/TP
33 nF,16V,K,X7R,HD,1005,R/TP
270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
100 pF,50V,J,NP0,TC,1005,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
33 nF,16V,K,X7R,HD,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP
680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP
680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP
- 103 -
Service Remark
Y
M23
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Leve Location No.

5
C413
5
C414
5
C415
5
C416
5
C417
5
C418
5
C419
5
C421
5
C422
5
C423
5
C424
5
C425
5
C426
5
C427
5
C428
5
C450
5
C500
5
C501
5
C502
5
C503
5
C504
5
C505
5
C600
5
C601
5
C602
5
C603
5
C604
5
C605
5
C608
5
C609
5
C611
5
C613
5
C614
5
C615
5
C619
5
C620
5
C621
5
C622
5
C623
5
C624
5
C625
5
C626
5
C627
5
C628
5
C629
5
C632
5
C633
5
C634
5
C635
5
C636
5
C637
5
C638
5
C641
5
C642
5
C643
5
C645
5
C646
5
C647
5
C648
5
C649
5
C657
5
C658
5
C660
5
C661
Part No.
ECCH0000182
ECCH0000122
ECCH0000122
ECCH0001811
ECCH0000379
ECCH0000179
ECCH0000155
ECCH0000113
ECCH0000122
ECCH0000122
ECCH0000182
ECCH0000182
ECCH0000143
ECCH0000122
ECCH0000143
ECCH0003401
ECCH0000182
ECCH0000143
ECCH0000124
ECCH0000276
ECCH0000182
ECCH0000182
ECCH0000122
ECCH0000111
ECCH0000143
ECTZ0003801
ECCH0000117
ECCH0000111
ECCH0000117
ECCH0000117
ECCH0000103
ECCH0000701
ECCH0000137
ECFD0000101
ECCH0000143
ECCH0000117
ECCH0000117
ECCH0000117
ECCH0000182
ECCH0000379
ECFD0000601
ECTZ0003401
ECCH0000143
ECCH0000143
ECCH0000117
ECCH0000181
ECCH0000182
ECCH0000182
ECTZ0003401
ECTZ0003101
ECCH0000120
ECCH0000182
ECCH0000182
ECCH0000112
ECCH0000108
ECCH0000108
ECCH0000182
ECCH0000182
ECCH0000182
ECCH0000104
ECCH0000182
ECCH0000180
ECCH0000180
ECCH0000379
Description
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
10 nF,16V,K,X7R,HD,1005,R/TP
18 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
56 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
47 pF,50V,J,NP0,TC,1005,R/TP
12 pF,50V,J,NP0,TC,1005,R/TP
470 uF,6.3V ,M ,L_ESR ,ETC ,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
12 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
1.5 pF,50V,C,NP0,TC,1005,R/TP
1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
8200 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP
4.7 uF,6.3V ,M ,STD ,2012 ,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
4.7 uF,6.3V ,M ,STD ,2012 ,R/TP
39 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
15 pF,50V,J,NP0,TC,1005,R/TP
7 pF,50V,D,NP0,TC,1005,R/TP
7 pF,50V,D,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
3 pF,50V,C,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
- 104 -
Service Remark
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Leve Location No.

5
C662
5
C663
5
C664
5
C665
5
C666
5
C667
5
C669
5
C670
5
C671
5
C672
5
C673
5
C674
5
C675
5
C679
5
C680
5
C681
5
C682
5
C683
5
C685
5
C686
5
C687
5
C690
5
C691
5
C692
5
C698
5
D100
5
D200
5
D201
5
D202
5
D401
5
D501
5
D502
5
D503
5
D505
5
D506
5
D507
5
D508
5
D511
5
D512
5
D513
5
D514
5
D517
5
D518
5
D519
5
D520
5
D521
5
D600
5
D601
5
D602
5
HSP402
5
J100
5
J101
5
J102
5
J400
5
L100
5
L102
5
L103
5
L104
5
L105
5
L106
5
L107
5
L108
5
L109
5
L110
Part No.
ECCH0000104
ECCH0000182
ECCH0000379
ECCH0000155
ECCH0000143
ECCH0000143
ECCH0000182
ECCH0000144
ECFD0000701
ECCH0000248
ECCH0000256
ECFD0000601
ECCH0000143
ECCH0000111
ECCH0000143
ECCH0000181
ECCH0000181
ECCH0000182
ECCH0000182
ECCH0000111
ECCH0000379
ECCH0000101
ECCH0000144
ECCH0000143
ECCH0000182
EDSY0005201
EDSY0010401
EDSY0010401
EDSY0010401
EDSY0009901
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDLH0004502
EDSY0005301
EDSY0010301
EDVY0001201
EDVY0001401
ERHY0000201
ENSY0007601
ENRY0000901
ENBY0010901
ENJE0002301
SFBH0007102
SFBH0007102
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
Description
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,FILM,MPP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
DIODE,SWITCHING
DIODE,SWITCHING
DIODE,VARIABLE CAP
DIODE,VARIABLE CAP
RES,CHIP
CONN,SOCKET
CONNECTOR,I/O
CONN,JACK/PLUG,EARPHONE
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
Service Remark
3 pF,50V,C,NP0,TC,1005,R/TP
Y
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Y
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
Y
10 nF,16V,K,X7R,HD,1005,R/TP
Y
Y
Y
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Y
1.2 nF,50V,K,X7R,HD,1005,R/TP
Y
Y
1.2 nF,50V,K,X7R,HD,1608,R/TP
Y
5.6 nF,50V,K,X7R,HD,1608,R/TP
Y
Y
Y
12 pF,50V,J,NP0,TC,1005,R/TP
Y
Y
4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Y
4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Y
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Y
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Y
12 pF,50V,J,NP0,TC,1005,R/TP
Y
2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP
Y
0.5 pF,50V,C,NP0,TC,1005,R/TP
Y
1.2 nF,50V,K,X7R,HD,1005,R/TP
Y
Y
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Y
SMD ,30 V,1.5 A,R/TP ,
Y
1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode
Y
Y
Y
ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
BLUE ,1608 ,R/TP ,0.35T
Y
SC-70 ,80 V,0.1 A,R/TP ,
Y
SOT-143 ,4 V,.11 A,R/TP ,Silicon Dual Schottky Diode
Y
UFP ,4.65 pF,R/TP ,diode capacitance:C1:4.65~5.15pF/C4:1.85~2.15pF
Y
CMPAK ,4.50 pF,R/TP ,diode capacitance:C1:4.50~5.00pF/C3:1.85~2.80pF
Y
0 ohm,1/16W,J,1005,R/TP
Y
6 PIN,ETC ,SOCKET ,2.54 mm,G7000 SIM CNT (2.4t)
Y
24 PIN,0.5 mm,ETC , ,
Y
30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER)
Y
3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD
Y
10 ohm,1005 ,Ferrite Bead
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
- 105 -
Leve Location No.

5
L111
5
L112
5
L113
5
L114
5
L115
5
L116
5
L117
5
L118
5
L119
5
L120
5
L124
5
L190
5
L500
5
L502
5
L600
5
L601
5
L602
5
L603
5
L605
5
L606
5
L608
5
L609
5
L610
5
L611
5
L612
5
L632
5
L633
5
L635
5
N600
5
Q100
5
Q101
5
Q500
5
Q502
5
Q503
5
Q504
5
Q506
5
R100
5
R101
5
R102
5
R103
5
R104
5
R105
5
R106
5
R107
5
R108
5
R109
5
R110
5
R111
5
R112
5
R114
5
R115
5
R116
5
R117
5
R118
5
R120
5
R121
5
R122
5
R123
5
R124
5
R150
5
R151
5
R152
5
R201
5
R202
Part No.
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
SFBH0007101
ELCH0005009
ELCH0005009
ECCH0000112
ELCH0005003
ELCH0005002
ELCH0005002
ELCH0001402
ELCH0001402
ELCH0001405
ELCH0005012
SFBH0007101
ELCH0001003
ELCH0001003
ELCH0001405
ELCH0001405
ELCH0005013
SCHY0000101
EQFP0003301
EQBN0007001
EQBN0004801
EQBN0007001
EQBN0007001
EQBN0007001
EQBN0007101
ERHY0000265
ERHY0000265
ERHY0000299
ERNR0000403
ERHY0000261
ERHY0000220
ERNR0000401
ERHY0000202
ERHY0000202
ERHY0000226
ERNR0000401
ERHY0000241
ERNR0000401
ERHY0000296
ERHY0000201
ERHY0001102
ERHY0000201
ERHY0000250
ERHY0000201
ERHY0000250
ERHY0000261
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000287
ERHY0000299
Description
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
CAP,CERAMIC,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
FILTER,BEAD,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
COUPLER,RF HYBRID
TR,FET,P-CHANNEL
TR,BJT,NPN
TR,BJT,NPN
TR,BJT,NPN
TR,BJT,NPN
TR,BJT,NPN
TR,BJT,NPN
RES,CHIP
RES,CHIP
RES,CHIP
RES,ARRAY,R
RES,CHIP
RES,CHIP
RES,ARRAY,R
RES,CHIP
RES,CHIP
RES,CHIP
RES,ARRAY,R
RES,CHIP
RES,ARRAY,R
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
Service Remark
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
100 nH,J ,1005 ,R/TP ,
Y
100 nH,J ,1005 ,R/TP ,
Y
15 pF,50V,J,NP0,TC,1005,R/TP
Y
12 nH,J ,1005 ,R/TP ,
Y
2.7 nH,S ,1005 ,R/TP ,
Y
2.7 nH,S ,1005 ,R/TP ,
Y
18 nH,J,1005,R/TP
Y
18 nH,J,1005,R/TP
Y
3.3 nH,S,1005,R/TP
Y
3.9 nH,S ,1005 ,R/TP ,
Y
Y
6.8 nH,J,1005,R/TP
Y
6.8 nH,J,1005,R/TP
Y
3.3 nH,S,1005,R/TP
Y
3.3 nH,S,1005,R/TP
Y
4.7 nH,S ,1005 ,R/TP ,
Y
19.0 dB,0.35 dB,24.0 dB,2.0*1.25*0.95 ,SMD ,DUAL COUPLER
Y
SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P- CHANNEL FET
Y
SC-70 ,0.1 W,R/TP ,
Y
SMT6 ,0.2 W,R/TP ,
Y
SC-70 ,0.1 W,R/TP ,
Y
SC-70 ,0.1 W,R/TP ,
Y
SC-70 ,0.1 W,R/TP ,
Y
EMT3 ,0.15 W,R/TP ,LOW FREQUENCY
Y
20K ohm,1/16W,J,1005,R/TP
Y
20K ohm,1/16W,J,1005,R/TP
Y
33000 ohm,1/16W ,J ,1005 ,R/TP
Y
10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP
Y
10K ohm,1/16W,J,1005,R/TP
Y
100 ohm,1/16W,J,1005,R/TP
Y
Y
4.7 ohm,1/16W,J,1005,R/TP
Y
4.7 ohm,1/16W,J,1005,R/TP
Y
220 ohm,1/16W,J,1005,R/TP
Y
Y
1K ohm,1/16W,J,1005,R/TP
Y
Y
1M ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
0.2 ohm,1/4W ,F ,2012 ,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
3.3K ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
3.3K ohm,1/16W,J,1005,R/TP
Y
10K ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
0 ohm,1/16W,J,1005,R/TP
Y
220K ohm,1/16W,J,1005,R/TP
Y
33000 ohm,1/16W ,J ,1005 ,R/TP
Y
- 106 -
Leve Location No.

5
R203
5
R204
5
R205
5
R206
5
R207
5
R208
5
R209
5
R211
5
R219
5
R220
5
R222
5
R225
5
R227
5
R228
5
R229
5
R231
5
R250
5
R280
5
R281
5
R282
5
R283
5
R300
5
R302
5
R303
5
R305
5
R400
5
R401
5
R402
5
R404
5
R405
5
R407
5
R408
5
R409
5
R410
5
R414
5
R415
5
R417
5
R418
5
R419
5
R420
5
R421
5
R450
5
R500
5
R501
5
R502
5
R503
5
R504
5
R505
5
R508
5
R509
5
R510
5
R512
5
R513
5
R516
5
R517
5
R518
5
R519
5
R520
5
R521
5
R530
5
R531
5
R532
5
R535
5
R600
Part No.
ERHY0000261
ERHY0000231
ERHY0000231
ERHY0000231
ERHY0000231
ERHY0000265
ERHY0000296
ERHY0000265
ERHY0000282
ERHY0000261
ERHY0000261
ERHY0000296
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000201
ERHY0000261
ERHY0000241
ERHY0006701
ERHY0000243
ERHY0000264
ERHY0000280
ERHY0000286
ERHY0000202
ERHY0000202
ERHY0000202
ERHY0000299
ERHY0000271
ERHY0000261
ERHY0000250
ERHY0000258
ERHY0000220
ERHY0000201
ERHY0000287
ERHY0000244
ERHY0000280
ERHY0000206
ERHY0000206
ERHY0000228
ERHY0000280
ERHY0000261
ERHY0000261
ERHY0006601
ERHY0000261
ERHY0000261
ERHY0000211
ERHY0000202
ERHY0000201
ERHY0000273
ERHY0000244
ERHY0000280
ERHY0000224
ERHY0008202
ERHY0000209
ERHY0000201
ERHY0000206
Description
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
10K ohm,1/16W,J,1005,R/TP
390 ohm,1/16W,J,1005,R/TP
390 ohm,1/16W,J,1005,R/TP
390 ohm,1/16W,J,1005,R/TP
390 ohm,1/16W,J,1005,R/TP
20K ohm,1/16W,J,1005,R/TP
1M ohm,1/16W,J,1005,R/TP
20K ohm,1/16W,J,1005,R/TP
120K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
1M ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
2400 ohm,1/16W ,J ,1005 ,R/TP
1.2K ohm,1/16W,J,1005,R/TP
18K ohm,1/16W,J,1005,R/TP
100K ohm,1/16W,J,1005,R/TP
200K ohm,1/16W,J,1005,R/TP
4.7 ohm,1/16W,J,1005,R/TP
4.7 ohm,1/16W,J,1005,R/TP
4.7 ohm,1/16W,J,1005,R/TP
33000 ohm,1/16W ,J ,1005 ,R/TP
39K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
3.3K ohm,1/16W,J,1005,R/TP
7.5K ohm,1/16W,J,1005,R/TP
100 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
220K ohm,1/16W,J,1005,R/TP
1.5K ohm,1/16W,J,1005,R/TP
100K ohm,1/16W,J,1005,R/TP
18 ohm,1/16W,J,1005,R/TP
18 ohm,1/16W,J,1005,R/TP
270 ohm,1/16W,J,1005,R/TP
100K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
6200 ohm,1/16W ,J ,1005 ,R/TP
10K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
33 ohm,1/16W,J,1005,R/TP
4.7 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
47K ohm,1/16W,J,1005,R/TP
1.5K ohm,1/16W,J,1005,R/TP
100K ohm,1/16W,J,1005,R/TP
180 ohm,1/16W,J,1005,R/TP
62 ohm,1/16W ,J ,1005 ,R/TP
27 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
18 ohm,1/16W,J,1005,R/TP
- 107 -
Service Remark
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Leve Location No.

5
R601
5
R602
5
R603
5
R604
5
R606
5
R607
5
R608
5
R609
5
R610
5
R615
5
R617
5
R620
5
R621
5
R622
5
R624
5
R625
5
R626
5
R629
5
R630
5
R631
5
R632
5
R634
5
R635
5
R636
5
R637
5
R638
5
R641
5
R642
5
R643
5
R644
5
R645
5
R646
5
R647
5
R648
5
R649
5
R656
5
R657
5
R672
5
R673
5
R674
5
R675
5
R677
5
R678
5
SPFY00
5
SW500
5
SW600
5
TH601
5
U101
Part No.
ERHY0000229
ERHY0000229
ECCH0000110
ERHY0000214
ERHY0000214
ERHY0000214
ERHY0000214
ERHY0000201
ERHY0000201
ERHY0000247
ERHY0000214
ERHY0000211
ERHY0000243
ERHY0000222
ERHY0006602
ERHY0000241
ERHY0000241
ERHY0000241
ERHY0000241
ERHY0000241
ERHY0000201
ERHY0008503
ERHY0000241
ERHY0008502
ERHY0000241
ERHY0008501
ERHY0000231
ERHY0000241
ERHY0000296
ERHY0000244
ERHY0000241
ERHY0000247
ELCH0001405
ERHY0000247
ERHY0000203
ERHY0000241
ERHY0000241
ERHY0000261
ERHY0000289
ERHY0000237
ERHY0000254
ERHY0000201
ERHY0000201
SPFY0031306
EUSY0129501
ENWY0000101
SETY0001201
EUSY0077201
Description
RES,CHIP
RES,CHIP
CAP,CERAMIC,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
INDUCTOR,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
RES,CHIP
PCB,MAIN
IC
CONN,RF SWITCH
THERMISTOR
IC
QTY
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
U102
EUSY0111901
IC
5
5
5
5
U103
U200
U201
U202
EUSY0100504
EUSY0116401
EUSY0116501
EUSY0122401
IC
IC
IC
IC
1
1
1
1
U301
EUSY0134901
IC
5
5
5
U302
U400
U401
EUSY0105201
EUSY0077701
EUSY0077602
IC
IC
IC
1
1
1
5
5
U402
U403
EUSY0077401
EUSY0111601
IC
IC
1
1
U404
EUSY0077301
IC
Specification
300 ohm,1/16W,J,1005,R/TP
300 ohm,1/16W,J,1005,R/TP
10 pF,50V,D,NP0,TC,1005,R/TP
51 ohm,1/16W,J,1005,R/TP
51 ohm,1/16W,J,1005,R/TP
51 ohm,1/16W,J,1005,R/TP
51 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
2.2K ohm,1/16W,J,1005,R/TP
51 ohm,1/16W,J,1005,R/TP
33 ohm,1/16W,J,1005,R/TP
1.2K ohm,1/16W,J,1005,R/TP
120 ohm,1/16W,J,1005,R/TP
620 Kohm,1/16W ,J ,1005 ,R/TP
1K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
9.76 Kohm,1/16W ,F ,1005 ,R/TP
1K ohm,1/16W,J,1005,R/TP
2.7 Kohm,1/16W ,F ,1005 ,R/TP
1K ohm,1/16W,J,1005,R/TP
2.2 Kohm,1/16W ,F ,1005 ,R/TP
390 ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
1M ohm,1/16W,J,1005,R/TP
1.5K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
2.2K ohm,1/16W,J,1005,R/TP
3.3 nH,S,1005,R/TP
2.2K ohm,1/16W,J,1005,R/TP
10 ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
1K ohm,1/16W,J,1005,R/TP
10K ohm,1/16W,J,1005,R/TP
270K ohm,1/16W,J,1005,R/TP
680 ohm,1/16W,J,1005,R/TP
4.7K ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
0 ohm,1/16W,J,1005,R/TP
FR-4 ,0.8 mm,MULTI-8 ,Ver1.3
SC-74A FIT ,3 PIN,R/TP ,HALL EFFECT SWITCH
ANGLE ,SMD ,0.5 dB,
NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES
SOT(DCK) ,5 PIN,R/TP ,
TSSOP ,14 PIN,R/TP ,
QUAD BUS BUFFER WITH 3_STATE CONTROL INPUTS
SC70 ,5 PIN,R/TP ,UHS 2-INPUT OR GATE
179GHH PBGA ,179 PIN,BK ,DIGITAL BB CHIP
100GGM PBGA ,100 PIN,BK ,ANALOG BB CHIP
SC-82AB ,4 PIN,R/TP ,CMOS LDO 1.8V OUTPUT/ 2.0 X 2.1
P-FBGA69 ,69 PIN,R/TP ,
64M FLASH 32M PSRAM / BOTTOM BOOT
P-TFBGA63 ,63 PIN,R/TP ,64 M-bit CMOS FLASH / 70 ns
SC70-5 ,5 PIN,R/TP ,
MSOP-8 ,8 PIN,R/TP ,
250mA CMOS LDO WIHT ERROR FLAG / 3.3V
SOT23-6 ,6 PIN,R/TP ,SPDT ANALOG SWITCH
32-PIN QFN ,32 PIN,R/TP ,
MA-3 / 40 TONES / FM + WAVEFORM TABLE
SC70-6/SOT23-6 ,6 PIN,R/TP ,
- 108 -
Service Remark
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Y
Y
Y
Y
Y
N
N
Y
N
N
Y
Y
Y
Y
Y
Leve Location No.
Part No.
Description
QTY
U501
EUSY0122301
IC
U502
EUSY0077301
IC
U600
EXSC0005101
VCO
U601
EUSY0100102
IC
U602
STMY0018201
TRANSFORMER,MATCHING
U603
SFAY0001201
FILTER,SEPERATOR
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
U604
U605
U606
U607
U629
V102
V400
V401
V402
V403
V404
V405
V406
V407
X200
EUSY0116701
EUSY0076701
EXSK0000801
EUSY0100503
EUSY0077201
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
SEVY0004901
EXXY0004601
IC
IC
VCTCXO
IC
IC
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
X-TAL
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Specification
SURFACE MOUNT ,7 PIN,R/TP ,
IRDA DATA 1.3 LOW POWER TRANSCEIVER / 115.2kb/s
SC70-6/SOT23-6 ,6 PIN,R/TP ,
1887 MHz, PPM, pF,SMD ,9.8*8.0*1.8 ,
QUAD VCO( TX/RX )897/921/1747/1885 QUAD
RF-K ,12 PIN,R/TP ,
RF POWER AMPLIFIER / E-GSM:55%, DCS1800:50%
8 PIN,SMD ,3.2*2.5*1.5mm DUAL
880/960 ,1710/1880 ,1.3 dB,1.5 dB,
30 dB,25 dB,ETC ,5.4*4.0*1.8 Antenna switch
S-PQFP ,64 PIN,R/TP ,RF TRANSCEIVER
SOT-23-6 ,6 PIN,R/TP ,
13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 ,
8-LEAD US8 ,8 PIN,R/TP ,UHS DUAL 2-INPUT NOR GATE
SOT(DCK) ,5 PIN,R/TP ,
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
5.6 V, ,SMD ,CAP=370pF+-30%
0.32768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,
- 109 -
Service Remark
Y
Y
VCO
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
- 110 -

7020 SM 021031

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7020 SM 021031

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SERVICE MANUAL

1.1 Purpose ............................................... 3

7. STAND ALONE TEST AND TEST

7.1 Testing Setup .................................... 62

3. TECHNICAL BRIEF ......................... 12

9. BLOCK DIAGRAM ........................... 85

10. Circuit Diagram .............................. 89

4. SEVICE S/W AND CALIBRATION

11. PCB LAYOUT .................................. 95

4.1 Service S/W ....................................... 37

11.1 TOP .............................................. 95

5.1 Download Setup ................................ 45

12.1 Exploded View .............................. 97

6. TROUBLE SHOOTING ................... 51

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

Automatic Power Control

Li-Polymer, 760mAh(820 mAh)

AVG TCVR Current

Min: 150mA(Pwr Level 19), Max: 300mA(Pwr Level 5)

Min : 2hr30min (2hr40min)

GSM, EGSM: -108 dBm, DCS: -107 dBm

GSM, EGSM: 33(32.5) dBm (Level 5)

Class 10(This only applies to G7020)

SIM card type

Plug-In SIM 3V/5V

Main : 65K Color-STN(128X160)

Status Indicator & KeyPad

0 ~ 9, #, *, Navigation Key, Up/Down Side Key

EAR Phone Jack

Data and Fax

Hands-free kit, CLA, Data Kit

2.2 Technical Specification

RMS < 5 degrees

< 0.1 ppm

Offset from Carrier (kHz).

Offset from Carrier (kHz).

Offset from Carrier (kHz)

Offset from Carrier (kHz)

Conduction, Emission Status

Bit Error Ratio

RX Level Report Accuracy

* Mean that Adopt a straight line in between 300 Hz

Level Ratio (dB)

Side tone Distortion

Three stage distortion < 10%

System frequency (13 MHz) tolerance

At least 80 dB under below conditions:

Fast Charge : < 500 mA

Low Voltage Warning

Forced shut down Voltage

Antenna Bar Number

Figure 3-1. RF front-end circuit.

3.1.1 RF front end

3.1.2 Demodulator and Baseband Processing

3.1.3 DC offset compensation

Figure 3-2. RX path block diagram.

Table 3-3. Total Gain and Noise Figure of RX path.

Total Noise Figure

Figure 3-3. Synthesizer internal Block Diagram.

Figure 3-4. Synthesizer Circuit.