FIB MANUAL

1. Mount sample,
2. Click exchange button on keyboard, reply yes to popup.
3. On Airlock: click pump>>open
4. Switch to camera view..gate valve opens
5. Attach rod to sample holder and insert and retract rod
6. Unclick OPEN, click close..(wait for gate to close)
7. Unclick PUMP, unclick close
8. Click purge..unclick purge to stop flow of nitrogen
9. Remove exchange rod..replace with plug
10.
Click resume button and OK on screen
11.
Scanning >> Dynamic focus

preparing the system

12.
Turn EHT ON..in gun panel set EHT=5 KV
13.
APERTURE tab>>60 m check the high current box
14.
Click on FIB toolbar launch FIB control panel.(confirm that FIB
pressure< 7.5*10-8 torr.
15.
Turn on FIB GUN
16.
SEM>>DETECTORS>>SIGNAL A = SE2
17.
View image in SEM mode (At this point keep it 10 mm or far
18.
Find a reference feature on the SEM image that will be easy to refind if moved away from the current field of view, and center it using
the X-Y joystick (or by pressing Ctrl+Tab, and clicking on the feature
with the ensuing small cross cursor)
19.
Eccentricize the stage by changing the tilt angles and focusing
on a region and using M buttons..start with 10o and try out 20..and
finally tilt the stage to 54ocheck at other angles if not
centralized..repeat the above procedure. (now u cannot use Yjoystick..it will disturb)
20.
Check the track Z box
Once sample is at 54o it must be raised in order to achieve coincidence
between SEM and FIB. Before the coincident point alignment make FIB beam
shift to 0 and of SEM
21.
22.

Go to WD=5.2mm using CAM lens, set focus

FIB>>Mill>>use probe current =80pA

23.
Toggle between SEM, FIB and coincide them
24.
To correct the focus of milling current use 80 pA reference
current

Alignment procedure for FIB currents

1.
2.
3.
4.

At WD=5mm SEM region far away from ROI.

FIB>>imaging current >> 80pA,,,,FIB beam shift = 0
Put cross-hair using milling at 300pA/700pA for 50 sec
Do the best focus using focus knob
(u have to shift
something)
5. Do the same for other milling currents like 150 pA to 6.5 nA (to check
all currents)
Milling and chunk preparation
1. Deposit Pt to avoid Ga implantationoutgas Pt if there is *
Go to options check the box: when milling switch to
.. Chunk preparation:
2. Dwell time = 0.4 s , Milling pixel resolution = 1024 x 768 for ..pixel FF
= 50% for Pt..Gas ID =PtDeposition mode
3. Choose ROI current = 80pA focus, choose geometry to mill.
4. 1st box: L X B = 4*20 m
Tilt angle = 24o .Mill for time 1st box: 4*20 m6.5 nA/2*100s (for
L=2m)
5. Select Compu+Rotate>>put R=180o with track Z option checked
6. 2nd box: 2*20 m
6.5nA/100s (for L=2 m)
7. 3rd box: cut one of the end (RIGHT) of the chunk u prepared.
Chunk Preparation 2nd method:
1.
2.
3.
4.
5.

Deposition of a 20 x 2 m-width Pt or W protective layer

(A) milled a first 4 x 22 m trench (6.5 nA/3*100s) under the
Pt-strip in FIB view. Take into account the beam tail of the milling current,
Tilt to 24 Adjust the region of interest using X, Y and Z,
(B) milled a second 2 x 22 m trench (6.5 nA/2*100s) above the Pt-strip
in FIB view,
6. cut the wedge on the right,
7. (C) Tilt to 0, glue the micromanipulator to the wedge,

8. (D) cut the wedge on the left and lift-out.microtip; i = 80pA; gas wait
time = 5sec
Micromanipulation
1. Switch on >> Decrease mag
2. Rotate CCW the retract button and focus at WD=5mm
3. Stage WD = 5.3...use high scan speedtake micromanipulator to
right end of chunk>>press a little >> glue it using Pt
4. Cut the other side of chunk>> retract it>> u r done with chunk
5. Better to cut the end of W tip (you prepared) to smoothen it>> Go to
15o to shape your tip before putting the chunk
6. Use 40 pA to put chunk on tip
7. Gas wait time = 7 sec

Annular Milling
1.
2.
3.
4.

Set tilt angle around 8-15 degrees around 10

FIB>>Batch tab>>feature mill (u can draw what u want)
Start at around 1.5nA or higher..(use ESB camera during milling)
Each time decrease the radius and update the background in feature
mill
5. At 30kV=milling; at 2kV= cleaning

Unloading the sample

25.
Lower Z stage to far away Turn EHT of
26.
FIB>>turn of
27.
Put rod on..click Exchange>>yes
28.
Press PUMP>>>OPEN
29.
Insert rod >>pull it>>put it
30.
Press open>>press close (wait to fully close) and press PUMP (to
deactivate pump)
31.
Press purge and open the airlock (when pressure is atm. Pressr)
32.
Press Purge to turn of N2
33.
Remove sample from airlock, close airlock . click RESUME
Exchange
34.
Click File>>log of

Facts and other notes:

1. Pixel FF for Pt=50%, for W=70%

2. Angle between Ga imaging and SEM is 54o so we tilt stage to this angle
to make surface perpendicular to FIB
3. On using higher currents for milling sharpness of hole created
decreases., also the amount depends on surface of the sample
4. Freeze the scan to avoid Ga implantation
5. There are two types of implantations: EBID (electron beam induced
deposition and IBID)
6. Dwell time = 0.4 s , Milling pixel resolution = 1024 x 768 for Pt..Gas
P=

3
2 3

L=0.87 L

Shortcuts:
1. To make your ROI horizontal, u can use blue cross right icon to FIB
2. Ctrl+Shift+Tab = centralize and zoom ur desired ROI.
3. Storing locations: Stage >> store/reach >> add posit 1>> roam in the
city>> double click to reach there again
Cases:
1. If FIB camera fail to give images:
2. Turn of FIB >> Turn of EHT >> In airlock >> close chamber valve >>
open the same
3. In FIB click on Power of >> then switch on everything again.

Notes: For CIGS use low energy Ga beam around 5 keV for the final ionmilling stage. W tips apex diameter must be close to chunks around 2 m.
When cutting chunks on tip use deposition mode.

Final cleaning:
Change current to 2 kV 30
In SEM window switch to SEM+FIB