http://electroiq.

com/blog/2006/07/soc-vs-mcm-vs-sip-vs-sop/
Challenges and tradeoffs of SOC vs SIP (Challenges and Trade-offs of SOC vs SIP
SESSION 5)
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1358735
Past present and future
Timeline: http://www.computerhistory.org/semiconductor/timeline.html
http://www.mckinsey.com/~/media/mckinsey/dotcom/client_service/Semiconductors/
Issue%204%20Autumn%202014/PDFs/MoSC2014_Advancedpackaging_technologies_The_implications_for_first_movers_and_fast_followers.ashx
Process flow SIP
https://www.ll.mit.edu/mission/electronics/qiin/cmos-technology/3d-integration-ofCMOS.html
SOP paper
(2004 Electronic Components and Technology Conference)
http://users.ece.gatech.edu/~etentze/ECTC2004_Sundaram.pdf
System-on-a-Package (SOP) Substrate and Module with Digital, RF and Optical
Integration Venky Sundaram*, Rao Tummala, George White, Kyutae Lim, Lixi Wan,
Daniel Guidotti, Fuhan Liu, Swapan Bhattacharya, Raj M. Pulugurtha, Isaac Robin
Abothu, Ravi Doraiswami, Raghuram V. Pucha, Joy Laskar, Manos Tentzeris, G. K.
Chang, Madhavan Swaminathan Packaging Research Center, Georgia Institute of
Technology * vsunda@ece.gatech.edu, 404-894-9394, 404-894-3842 (Fax)

Packaging types images

http://web.ece.ucdavis.edu/~bbaas/116/notes/Handout.packaging.pdf
Presentation by Dr Jones FIU
http://web.eng.fiu.edu/~jonesweb/EML%204561-%20spring%2010/EML%204561-PackagingOverview-Electrical.pptx
web.eng.fiu.edu

System in Package trends

http://www.springer.com/cda/content/document/cda_downloaddocument/9783642285219-c2.pdf?SGWID=0-0-451338322-p174307159

TSV Manufacturing Yield and Hidden Costs for 3D IC Integration

http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5490828
978-1-4244-6412-8/10/$26.00 2010 IEEE
2010 Electronic Components and Technology Conference

New start
COGNETTI, C. The impact of semiconductor packaging technologies on system integration an overview.
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system BIST solution." VLSI Circuits (VLSIC), 2013 Symposium on. IEEE, 2013.
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Technology (VLSIT), 2013 Symposium on. IEEE, 2013.
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14. Chung-Hao Tsai; Jeng-Shien Hsieh; Monsen Liu; En-Hsiang Yeh; Hsu-Hsien Chen; Ching-Wen Hsiao;
Chen-Shien Chen; Chung-Shi Liu; Mirng-Ji Lii; Chuei-Tang Wang; Doug Yu, "Array antenna integrated
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