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The target audience is undergraduate chemical engineering and electronics and communication engineering students.
The focus will be on the various modules (equivalent to unit operations in traditional chemical engineering) relevant for chip m
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The course will start with an overviewImportant:
of the manufacturing
process.
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Bulk of the course will deal with understanding the individual processes and the tools used.
An overview of the MOS transistor structure and operation will be given so that the sequence of processes needed to create t
from that perspective.
The issues relevant for the industry such as process integration, testing and yield will be covered at the later stages of the cours
The analytical tools used in the semiconductor industry are different compared to the typical tools used in chemical industry.
Hence a brief overview of the relevant analytical tools and techniques will also be given.
Course contents:
Overview, Lithography, Deposition techniques (physical vapor deposition, chemical vapor deposition, electrochemical depositi
Removal methods (wet etching, dry etching, chemical mechanical planarization), front end of line (FEOL) basics, transistor str
Material modification methods (diffusion, ion implantation, oxidation), process integration, testing and yield, relevant tools and
S.No
Topics
Introduction:
No. of
Hours
1
PhotoLithography:
Lithography details:
1. Projection printing, dark field mask, positive resist and its advantages.
2. Process details including resist coating, pre-exposure bake, exposure,
soft bake, developing and hard bake.
3. Stepper vs scanner.
Course Description:
A hands-on introduction to the fundamentals of micro- and nano-fabrication processes with emphasis
on cleanroom practices. The physical principles of oxidation, optical lithography, thin film deposition,
etching and metrology methods will be discussed, demonstrated and practiced. Students will be trained
in cleanroom concepts and safety protocols. Sequential micro-fabrication processes involved in the
manufacture of microelectronic and photonic devices will be shown. Training in imaging and
characterization of micro- and nano-structures will be provided.
Textbook:
-Introduction to Microelectronic Fabrication, 2nd edition, Richard C. Jaeger, Prentice Hall (ISBN
0201444941)
-Fabrication Engineering at the Micro and Nanoscale, 3rd edition, Stephen A. Campbell, Oxford
University Press 2008 (ISBN-10: 0195320174)
Other References:
- VLSI Fabrication Principles, 2nd Edition, Sorabh K. Ghandhi, Wiley Interscience
- Process Engineering Analysis in Semiconductor Device Fabrication, Middleman and Hochberg,
McGraw Hill, 1993
Course Grading:
Weekly labs: 30%
Exam 1: 30%
Project: 40%
Grading Policy:
90% or above A
80% to 89% B
65% to 79% C
45% to 64% D
44% or below F
Topics
We will look into the following topics in the lecture series:
Oxidation & metrology
Physical Vapor Deposition (PVD)
The metal oxide semiconductor (MOS) capacitor
Syllabus (tentative)
Dates
(week beginning)
Topics
Links
Chapter
Week 1
Week 2
Safety Training
Safety Manual
Alarm Protocol
Online Scheduling
Week 3
Lithography
Week 4
Etching
Week 5
Deposition
Week 6
Thermal Oxidation
Week 7
Exam Revies
Labs
Dates
(week beginning)
Topics
Links
Lab 0
Introduction to Nanofab
Safety Manual
Alarm Protocol
Online Scheduling
Lab 1
Lab 2
pdf
pdf
Lab 3
pdf
pdf
Lab 4
RIE of Aluminum
Lab 5
Lab 6
Design of a Capacitor
Final Project
Here is a link to the final project description (pdf)
There is a forth final project. Detailes are provided here (pdf)