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OPA2334
OPA335
OPA2335
OPA3
35
OPA2
OPA2
334
335
OPA23
35
DESCRIPTION
0.050
0.045
0.025
0.020
0.015
0.010
Absolute Value;
Centered Around Zero
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
Population
0.040
TRANSDUCER APPLICATIONS
TEMPERATURE MEASUREMENT
ELECTRONIC SCALES
MEDICAL INSTRUMENTATION
BATTERY-POWERED INSTRUMENTS
HANDHELD TEST EQUIPMENT
0.005
0.035
APPLICATIONS
0.030
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ELECTROSTATIC
DISCHARGE SENSITIVITY
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these, or any other conditions beyond those specified,
is not implied. (2) Input terminals are diode-clamped to the power-supply
rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
SOT23-6
DBV
40C to +125C
OAOI
"
"
"
"
OPA334AIDBVT
OPA334AIDBVR
MSOP-10
DGS
40C to +125C
BHE
"
"
"
"
OPA2334AIDGST
OPA2334AIDGSR
SOT23-5
DBV
40C to +125C
OAPI
"
"
"
"
SO-8
40C to +125C
OPA335
"
"
"
"
OPA335AIDBVT
OPA335AIDBVR
OPA335AID
OPA335AIDR
SO-8
40C to +125C
OPA2335
"
"
"
"
MSOP-8
DGK
40C to +125C
BHF
"
"
"
"
OPA2335AID
OPA2335AIDR
OPA2335AIDGKT
OPA2335AIDGKR
Rails, 100
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
Shutdown Version
OPA334
"
OPA2334
"
Non-Shutdown Version
OPA335
"
OPA335
"
OPA2335
"
OPA2335
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATIONS
OPA335
Out
+In
OPA2334
OPA335
5
V+
In
NC(1)
NC(1)
Out A
In
V+
In A
+In
Out
NC(1)
10 V+
9
Out B
In B
A
+In A
3
B
SOT23-5
+In B
Enable A
Enable B
SO-8
MSOP-10
OPA2335
OPA334(2)
OAOI
V+
Out A
V 2
Enable
In A
+In 3
In
+In A
Out 1
A
B
V+
Out B
In B
+In B
SOT23-6
SO-8, MSOP-8
SBOS245D
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = 40C to +125C.
At TA = +25C, VS = +5V, RL = 10k connected to VS /2, and VOUT = VS /2, unless otherwise noted.
OPA334AI, OPA335AI
OPA2334AI, OPA2335AI
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
Long-Term Stability(1)
Channel Separation, dc
CONDITION
VOS
dVOS /dT
PSRR
VCM = VS /2
TYP
1
0.02
1
MAX
UNITS
V
V/C
V/V
0.05
2
IOS
70
1
120
en
in
1.4
20
IB
NOISE
Input Voltage Noise, f = 0.01Hz to 10Hz
Input Current Noise Density, f = 10Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
MIN
VCM
CMRR
VCM = VS /2
(V) 0.1
110
INPUT CAPACITANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain, Over Temperature AOL
Over Temperature
110
110
V/V
200
400
pA
nA
pA
VPP
fA/ Hz
130
(V+) 1.5
V
dB
1
5
pF
pF
130
130
dB
dB
2
1.6
MHz
V/s
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
OUTPUT
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Short-Circuit Current
Capacitive Load Drive
GBW
SR
G = +1
RL = 10k, Over Temperature
RL = 100k, Over Temperature
ISC
CLOAD
SHUTDOWN
tOFF
tON(2)
VL (shutdown)
VH (amplifier is active)
Input Bias Current of Enable Pin
IQSD
POWER SUPPLY
Operating Voltage Range
Quiescent Current: OPA334, OPA335
IQ
Over Temperature
OPA2334, OPA2335 (totaltwo amplifiers)
Over Temperature
15
100
1
50
50
See Typical Characteristics
s
s
V
V
pA
A
5.5
350
450
700
900
V
A
A
A
A
+125
+150
+150
C
C
C
C/W
C/W
C/W
1
150
0
0.75 (V+)
+0.8
5.5
50
2.7
IO = 0
285
IO = 0
570
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
JA
SOT23-5, SOT23-6 Surface-Mount
MSOP-8, MSOP-10, SO-8 Surface-Mount
40
40
65
200
150
mV
mV
mA
NOTES: (1) 500-hour life test at 150C demonstrated randomly distributed variation approximately equal to measurement repeatability of 1V. (2) Device requires
one complete cycle to return to VOS accuracy.
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25C, VS = +5V, RL = 10k connected to VS /2, and VOUT = VS /2, unless otherwise noted.
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.005
0.010
Absolute Value;
Centered Around Zero
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
Population
5.5V
2.7V
+125C
(V+)
+25C
(V+) 1
40C
+25C
(V) + 1
40C
+125C
(V)
1000
800
600
400
40C
+25C
200
0
10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
400
1000
350
100
VS = +5.5V
300
250
200
VS = +2.7V
150
100
50
0
10
40
20
20
40
60
80
100
40
120
20
40
60
80
100
120
Temperature (C)
Temperature (C)
20
SBOS245D
LARGE-SIGNAL RESPONSE
80
100
80
110
120
Gain
40
130
20
140
150
20
0.1
10
100
1k
10k
100k
1M
100
60
G = 1
CL = 300pF
90
Phase
Phase ()
AOL (dB)
120
160
10M
Time (5s/div)
Frequency (Hz)
200mV/div
G = +1
CL = 50pF
0
Input
10k
1V/div
SMALL-SIGNAL RESPONSE
+2.5V
Output
100
0
OPA335
2.5V
Time (25s/div)
Time (5s/div)
Input
0
0
10k
1V/div
+2.5V
100
Output
OPA335
200mV/div
140
2.5V
120
100
80
60
40
20
0
Time (25s/div)
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
www.ti.com
120
+PSRR
10.8
100
Frequency (kHz)
140
80
60
40
PSRR
10.7
10.6
10.5
10.4
10.3
10.2
20
10.1
10.0
10
100
10k
100k
1M
2.7
3.2
3.7
4.2
4.7
Frequency (Hz)
NOISE vs FREQUENCY
5.2
5.5
400nV/div
Noise (nV/Hz)
1000
1k
100
10
1
10
100
1k
10k
100k
10s/div
Frequency (Hz)
50
12
40
Overshoot (%)
45
11
10
35
30
25
20
15
10
5
0
40
10
20
50
80
110 125
10
Temperature (C)
100
1000
SBOS245D
Unity-gain
requires one
complete Auto-Zero
Cyclesee text.
4.0
Common-Mode Range (V)
100
0.01%
10
0.1%
3.5
Maximum Common-Mode
3.0
2.5
2.0
1.5
1.0
0.5
Minimum Common-Mode
0
0.5
1
1
10
100
2.7
3.2
Gain (V/V)
4.2
4.7
5.2
5.5
APPLICATIONS INFORMATION
The OPA334 and OPA335 series op amps are unity-gain
stable and free from unexpected output phase reversal. They
use auto-zeroing techniques to provide low offset voltage
and very low drift over time and temperature.
Good layout practice mandates use of a 0.1F capacitor
placed closely across the supply pins.
For lowest offset voltage and precision performance, circuit
layout and mechanical conditions should be optimized. Avoid
temperature gradients that create thermoelectric (Seebeck)
effects in thermocouple junctions formed from connecting
dissimilar conductors. These thermally-generated potentials
can be made to cancel by assuring that they are equal on
both input terminals.
Use low thermoelectric-coefficient connections (avoid dissimilar metals).
Thermally isolate components from power supplies or
other heat-sources.
Shield op amp and input circuitry from air currents, such as
cooling fans.
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can cause thermoelectric voltages of 0.1V/C or higher, depending on
materials used.
OPERATING VOLTAGE
The OPA334 and OPA335 series op amps operate over a
power-supply range of +2.7V to +5.5V (1.35V to 2.75V).
Supply voltages higher than 7V (absolute maximum) can
permanently damage the amplifier. Parameters that vary
over supply voltage or temperature are shown in the Typical
Characteristics section of this data sheet.
INPUT VOLTAGE
The input common-mode range extends from (V) 0.1V to
(V+) 1.5V. For normal operation, the inputs must be limited
to this range. The common-mode rejection ratio is only valid
within the valid input common-mode range. A lower supply
voltage results in lower input common-mode range; therefore, attention to these values must be given when selecting
the input bias voltage. For example, when operating on a
single 3V power supply, common-mode range is from 0.1V
below ground to half the power-supply voltage.
3.7
www.ti.com
Current-limiting resistor
required if input voltage
exceeds supply rails by
0.5V.
+5V
V+ = +5V
IOVERLOAD
10mA max
OPA335
VOUT
VOUT
OPA335
VIN
5k
VIN
RP = 40k
Op Amps V = Gnd
5V
Additional
Negative
Supply
LAYOUT GUIDELINES
Attention to good layout practices is always recommended.
Keep traces short. When possible, use a PCB ground plane
with surface-mount components placed as close to the device pins as possible. Place a 0.1F capacitor closely across
the supply pins. These guidelines should be applied throughout the analog circuit to improve performance and provide
benefits such as reducing the EMI (electromagnetic-interference) susceptibility.
SBOS245D
4.096V
REF3040
+5V
+
0.1F
R9
150k
R1
6.04k
R5
31.6k
D1
+5V
0.1F
R2
2.94k
+ +
R2
549
R4
6.04k
VO
OPA335
R6
200
K-Type
Thermocouple
40.7V/C
Zero Adj.
R3
60.4
IIN
R1
IIN
R1
+5V
+2.5V
Photodiode
Photodiode
OPA343
OPA343
2.5V
C1
1M
1M
C1
+5V
+2.5V
R2
R2
OPA335
C2
OPA335
C2
40k(1)
2.5V
5V
a. Split Supply.
b. Single Supply.
VEX = +2.5V
VEX
R1 = 105
R1
Select R1 so bridge
output VCMmax.
+5V
R R
R R
300
Bridge
VOUT
OPA335
@ VS = 2.7V,
VCMmax = 1.2V
R2
+2.7V
OPA335
R1
VOUT
R2
VREF
VREF
www.ti.com
R2
R1
R1
R2
+5V
VREF
G=1+
+5V
1/2
OPA2335
R R
R R
1/2
OPA2335
R2
R1
VOUT
R3(1)
40k
5V
11.5k
+5V
5V
FS = 0.63V
Load
50mV
Shunt
OPA335
R3(1)
40k
RS
ADS1100
I2C
1k
G = 12.5
5V
(PGA Gain = 8)
5V FS
10
SBOS245D
R1
4.12k
C1
56pF
+5V
C2
0.1F
R3
100
Photodiode
2pF
VOUT
OPA353
R2(1)
2k
C3
1nF
1MHz Bandwidth
VOS 10V
5V
C4
10nF
Photodiode
Bias
+5V
R7
1k
C6
0.1F
C7
1F
R4
100k
R6
49.9k
OPA335
R5(1)
40k
C5
10nF
5V
NOTE: (1) Pull-down resistors to allow accurate swing to 0V.
www.ti.com
11
PACKAGE DRAWINGS
DBV (R-PDSO-G6)
PLASTIC SMALL-OUTLINE
0,95
6X
6
0,50
0,25
0,20 M
1,70
1,50
0,15 NOM
3,00
2,60
Gage Plane
3,00
2,80
0,25
0 8
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-5/G 01/02
NOTES: A.
B.
C.
D.
12
SBOS245D
DGS (S-PDSO-G10)
0,50
10
0,08 M
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0 6
5
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073272/B 08/01
NOTES: A.
B.
C.
A.
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13
DBV (R-PDSO-G5)
PLASTIC SMALL-OUTLINE
0,50
0,30
0,95
5
0,20 M
1,70
1,50
0,15 NOM
3,00
2,60
Gage Plane
3,00
2,80
0,25
0 8
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-4/G 01/02
NOTES: A.
B.
C.
D.
14
SBOS245D
D (R-PDSO-G**)
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
8
0.010 (0,25)
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
0.010 (0,25)
0 8
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.004 (0,10)
PINS **
0.004 (0,10)
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047/E 09/01
NOTES: A.
B.
C.
D.
www.ti.com
15
0,65
8
0,08 M
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0 6
4
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073329/C 08/01
NOTES: A.
B.
C.
D.
16
SBOS245D
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
OPA2334AIDGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2334AIDGST
ACTIVE
VSSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2334AIDGSTG4
ACTIVE
VSSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
BHE
OPA2335AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKRG4
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKT
ACTIVE
VSSOP
DGK
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDGKTG4
ACTIVE
VSSOP
DGK
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
BHF
OPA2335AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA334AIDBVR
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVRG4
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVT
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA334AIDBVTG4
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OAOI
OPA335AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDBVR
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
Addendum-Page 1
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
OPA335AIDBVRG4
ACTIVE
SOT-23
DBV
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDBVT
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDBVTG4
ACTIVE
SOT-23
DBV
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
OAPI
OPA335AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
OPA335AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OPA
335
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
Samples
www.ti.com
10-Jun-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2335 :
Military: OPA2335M
NOTE: Qualified Version Definitions:
Addendum-Page 3
31-Dec-2013
Device
OPA2334AIDGSR
VSSOP
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2334AIDGST
VSSOP
DGS
10
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDGKR
VSSOP
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDGKT
VSSOP
DGK
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2335AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA334AIDBVR
SOT-23
DBV
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA334AIDBVT
SOT-23
DBV
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA335AIDBVR
SOT-23
DBV
3000
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
OPA335AIDBVT
SOT-23
DBV
250
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
OPA335AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
31-Dec-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2334AIDGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
OPA2334AIDGST
VSSOP
DGS
10
250
210.0
185.0
35.0
OPA2335AIDGKR
VSSOP
DGK
2500
366.0
364.0
50.0
OPA2335AIDGKT
VSSOP
DGK
250
366.0
364.0
50.0
OPA2335AIDR
SOIC
2500
367.0
367.0
35.0
OPA334AIDBVR
SOT-23
DBV
3000
180.0
180.0
18.0
OPA334AIDBVT
SOT-23
DBV
250
180.0
180.0
18.0
OPA335AIDBVR
SOT-23
DBV
3000
180.0
180.0
18.0
OPA335AIDBVT
SOT-23
DBV
250
180.0
180.0
18.0
OPA335AIDR
SOIC
2500
367.0
367.0
35.0
Pack Materials-Page 2
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