Documente Academic
Documente Profesional
Documente Cultură
Multi-million Gate,
Multi-power/Voltage Domain Designs
Sarveswara Tammali, RTL Lead, TI
sarvesh@ti.com
Agenda
SoC design challenges
Trends of SoC integration past and current
Architecture based integration
Power management insertion
Design reuse in new era
Challenges and key benefits
Metrics
Future work
Conclusions
2
Productivity Challenge
8
Design reuse
2X more
productive
0
2005
2007
2009
2011
Productivity
must increase
4X in 6 years
Challenges
Hardware
IP Library
IP Selection
XLS2HDL
HDL file
5
TI
Autogen
IP library
(IP-XACT, etc.)
SoC testcases,
C library
Chip w/ IP
instance Info
IP
info
1Team-Genesis DB
Review
views
IP data (IP-XACT)
Connectivity information
xml
Translators
Underlying database
1Team-Genesis
GUI
TI architecture
tables
TI Autogen
TI wrappers + 1Team-Genesis
1Team-Genesis provides
Generators
Files
(RTL, etc)
IP Information
Automatically loads arch tables
Performs automated checks
IP-XACT Adoption @ TI
IP-XACT refers to a set of XML schemas defined by the SPIRIT
Consortium (www.spiritconsortium.org)
IPXACT Describes
IP boundary ( ports, direction, width, default value etc)
Registers
10
11
Design Re-use
Design re-use is critical factor in this SoC era
Faster time-to-market
Adding features to existing designs (Derivatives)
IP2
IP1
IP3
Design-1
mon
m
o
c
the ns
g
n
ctio
usi
Re- conne
Re-u
sing
con the com
nec
tion mon
s
IP1
IP2
Design-2
IP1
IP3
Design3
12
13
14
15
Profile of SoC
16
IP
Ports
# of busdefs
IP1
1200
145
IP2
890
115
IP3
645
43
SoC
Total # of
connections
(K)
Total # of
reused
connections
# of
instances
MM
effort
Savings
(MM)
SoC1
35
12
112
24 MM
12 MM
SoC2
50
34
180
14 MM
7 MM
SoC3
58
34
192
26 MM
15 MM
17
Future Work
Single flow for SoC integration and RTL quality
checks
Auto ECO ports addition for subchip hierarchies
Handling hierarchies better
18
Conclusions
Complexity, gap in productivity, cycle times are key
challenges of SoC design
IP-XACT and architecture based integration helped TI to
address above challenges
1Team-Genesis together with TI wrappers have enabled TI to
pioneer in this new era of integration
Key challenges include IP modeling and busdef alignment
New integration strategy started showing R&D efficiency but
more positive impact will be seen in next cycle of designs
Number of integration bugs reduced significantly over past
designs
Opportunity seen to reduce design verification effort
19
Acknowledgements
Acknowledges to team who supported flow
Satyam Pentakota (TII)
Subash C (TII)
Nitesh (TII)
20