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Data Sheet
FN3138.16
Features
Multiple Drivers
- 10V Output Swing for 5V lnput
- 300 Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/s Maximum Slew Rate
Multiple Receivers
- 30V Input Voltage Range
- 3k to 7k Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Pb-free Available (RoHS compliant)
Applications
Any System Requiring RS-232 Communication Ports
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
LEADS
HIN232
+5V
4 Capacitors
No/No
16
HIN236
+5V
4 Capacitors
Yes/Yes
24
HIN237
+5V
4 Capacitors
No/No
24
HIN238
+5V
4 Capacitors
No/No
24
HIN239
2 Capacitors
No/Yes
24
HIN240
+5V
4 Capacitors
Yes/Yes
44
HIN241
+5V
4 Capacitors
Yes/Yes
28
PART
NUMBER
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2004, 2005, 2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
FUNCTION
Power Supply Input 5V 10%.
V+
Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V.
V-
GND
C1+
C1-
C2+
C2-
TIN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead.
TOUT
RIN
ROUT
EN
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed
in a high impedance state.
SD
Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
transmitters are shut off.
NC
FN3138.16
September 26, 2008
PART
MARKING
TEMP. RANGE
(C)
PKG.
DWG. #
PACKAGE
HIN232CB*
232CB
0 to +70
16 Ld SOIC
M16.3
HIN232CBZ*
(Note)
HIN232CBZ
0 to +70
16 Ld SOIC
(Pb-free)
M16.3
HIN232CP
HIN232CP
0 to +70
16 Ld PDIP
E16.3
HIN232CPZ
(Note)
HIN232CPZ
0 to +70
16 Ld PDIP**
(Pb-free)
E16.3
HIN232IB*
HIN232IB
-40 to +85
16 Ld SOIC
M16.3
HIN232IBZ*
(Note)
HIN232IBZ
-40 to +85
16 Ld SOIC
(Pb-free)
M16.3
HIN232IP
HIN232IP
-40 to +85
16 Ld PDIP
E16.3
HIN232IPZ
(Note)
HIN232IPZ
-40 to +85
16 Ld PDIP**
(Pb-free)
E16.3
HIN236CB
HIN236CB
0 to +70
24 Ld SOIC
M24.3
HIN236CBZ
(Note)
HIN236CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN237CB*
HIN237CB
0 to +70
24 Ld SOIC
M24.3
HIN237CBZ*
(Note)
HIN237CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CB*
HIN238CB
0 to +70
24 Ld SOIC
M24.3
HIN238CBZ*(Note)
HIN238CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN238CP
HIN238CP
0 to +70
24 Ld PDIP
E24.3
HIN238IB
HIN238IB
-40 to +85
24 Ld SOIC
M24.3
HIN238IBZ
(Note)
HIN238IBZ
-40 to +85
24 Ld SOIC
(Pb-free)
M24.3
HIN239CB*
HIN239CB
0 to +70
24 Ld SOIC
M24.3
HIN239CBZ*
(Note)
HIN239CBZ
0 to +70
24 Ld SOIC
(Pb-free)
M24.3
HIN239CP
HIN239CP
0 to +70
24 Ld PDIP
E24.3
HIN239CPZ
(Note)
HIN239CPZ
0 to +70
24 Ld PDIP**
(Pb-free)
E24.3
HIN240CN
HIN240CN
0 to +70
44 Ld MQFP
Q44.10X10
HIN240CNZ*
(Note)
HIN240CNZ
0 to +70
44 Ld MQFP
(Pb-free)
Q44.10X10
HIN241CA
HIN241CA
0 to +70
28 Ld SSOP
M28.209
HIN241CAZ
(Note)
HIN241CAZ
0 to +70
28 Ld SSOP
(Pb-free)
M28.209
HIN241CB*
HIN241CB
0 to +70
28 Ld SOIC
M28.3
HIN241CBZ*
(Note)
HIN241CBZ
0 to +70
28 Ld SOIC
(Pb-free)
M28.3
HIN241IB
HIN241IB
-40 to +85
28 Ld SOIC
M28.3
HIN241IBZ
(Note)
HIN241IBZ
-40 to +85
28 Ld SOIC
(Pb-free)
M28.3
*Add -T suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN3138.16
September 26, 2008
HIN232
(16 LD PDIP, SOIC)
TOP VIEW
16 VCC
C1+ 1
15 GND
V+ 2
C1- 3
14 T1OUT
C2+ 4
13 R1IN
C2- 5
12 R1OUT
11 T1IN
T2OUT 7
10 T2IN
V-
T3OUT
24 T4OUT
T1OUT
23 R2IN
T2OUT
22 R2OUT
R1IN
21 SD
R1OUT
20 EN
T2IN
19 T4IN
T1IN
18 T3IN
GND
17 R3OUT
VCC
16 R3IN
9 R2OUT
R2IN 8
C1+ 10
14 C2-
C1- 12
13 C2+
+5V
1F
+5V
+
16
1F
1
NOTE 1
+
3
4
NOTE 1
T1IN
T2IN
R1OUT
+
5
11
10
VCC
C1+
C1C2+
C2-
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
+5V
400k
+5V
400k
V+
NOTE 1
T1
14
1F
T1IN
V- 6
+
T2
12
13
9
10
VCC
C1+
+
+5V TO 10V
12
C1- VOLTAGE DOUBLER
13
C2+
+
+10V TO -10V
14
VOLTAGE INVERTER
C2+5V
400k
7
T1
+5V
400k
T2
18
+5V
400k
T3
19
+5V
400k
T4
NOTE 1
T2IN
T1OUT
T3IN
T2OUT
R1IN
T4IN
R1OUT
R2IN
15
EN
NOTE:
1F
1F
T1OUT
T2OUT
T3OUT
T4OUT
R1IN
5k
23
R2IN
5k
17
20
24
R2
R3OUT
V- 15
22
5k
R2
11
R1
R2OUT
V+
5k
R1
R2OUT
15 V-
V+ 11
16
5k
R3
R3IN
21
SD
FN3138.16
September 26, 2008
(Continued)
HIN238
(24 LD PDIP, SOIC)
TOP VIEW
HIN237
(24 LD SOIC)
TOP VIEW
T3OUT 1
24 T4OUT
T2OUT 1
24 T3OUT
T1OUT 2
23 R2IN
T1OUT 2
23 R3IN
T2OUT 3
22 R2OUT
R1IN
21 T5IN
R1OUT 5
T2IN
R2IN
20 T5OUT
T1IN
R1OUT 6
19 T3IN
T1IN
18 T3IN
R1IN
18 T2IN
GND
17 R3OUT
GND
17 R4OUT
VCC
16 R3IN
VCC
16 R4IN
15 V-
C1+ 10
T2IN
T3IN
T4IN
T5IN
10
C1+
+
12
C113
C2+
+
14
C2-
14 C2-
V+ 11
14 C2-
C1- 12
13 C2+
C1- 12
13 C2+
+5V
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400k
6
T2
+5V
400k
T3
+5V
400k
19
21
11
V+
T1
+5V
400k
1F
VCC
+5V
400k
7
18
15 V-
V+ 11
T1IN
20 T4OUT
19 T4IN
+5V
1F
21 T4IN
C1+ 10
1F
22 R3OUT
R2OUT 4
+
1F
1F
1F
+
T1OUT
T1IN
T2OUT
T2IN
T3OUT
T3IN
T4OUT
T4IN
10
C1+
+
12
C113
C2+
+
14
C2-
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
V- 15
+
T1
+5V
400k
T2
18
19
+5V
400k
T3
+5V
400k
T4
21
20
T5OUT
20
22
R1IN
3
R2IN
5k
R2
23
R2IN
22
23
R3IN
R3OUT
5k
R2
5k
R3
17
T4OUT
5k
R2OUT
R2OUT
T3OUT
7
R1
R1IN
5k
R1
1F
T2OUT
24
R1OUT
R1OUT
1F
T1OUT
T5
11
V+
+5V
400k
5
T4
24
VCC
16
R3IN
R3OUT
5k
R3
17
16
R4IN
R4OUT
5k
R4
8
FN3138.16
September 26, 2008
NC
NC
R5IN
R5OUT
T3IN
T4IN
R4OUT
21 R2IN
R4IN
22 R2OUT
VCC 4
EN
23 T2IN
GND 3
SD
24 T1IN
R1IN 2
NC
R1OUT 1
T5OUT
HIN240
(44 LD MQFP)
TOP VIEW
HIN239
(24 LD PDIP, SOIC)
TOP VIEW
44 43 42 41 40 39 38 37 36 35 34
33
2
32
NC
V+ 5
20 T2OUT
T5IN
C1+ 6
19 T1OUT
R3OUT
31
NC
C1- 7
18 R3IN
R3IN
30
V-
17 R3OUT
T4OUT
29
C2-
16 T3IN
T3OUT
28
C2+
T1OUT
27
C1-
T2OUT
26
V+
NC
25
C1+
NC
NC
NC
NC
NC
24
10
11
23
12 13 14 15 16 17 18 19 20 21 22
NC
NC
NC
R2IN
VCC
13 T3OUT
R4IN 12
GND
14 EN
R1IN
R4OUT 11
R1OUT
15 NC
T1IN
R5IN 9
R5OUT 10
T2IN
V- 8
R2OUT
Pinouts
FN3138.16
September 26, 2008
(Continued)
+5V
+5V
4
6
1F
+
7
(NOTE)
T1IN
T2IN
T3IN
R1OUT
C1-
+10V TO -10V
VOLTAGE INVERTER
+5V
400k
24
23
+5V
400k
T2
16
+5V
400k
T3
13
2
EN
21
T1IN
T2OUT
T2IN
T3OUT
T3IN
R1IN
T4IN
R2IN
+5V
400k
14
T2
+5V
400k
T3
+5V
400k
38
T4
+5V
400k
2
T5
37
T5IN
R1OUT
R3IN
5k
11
R4IN
5k
9
R5IN
R4OUT
3
EN
T3OUT
T4OUT
T5OUT
R1IN
R2IN
5k
4
R3IN
5k
39
40
R4IN
5k
36
T2OUT
5k
42
T1OUT
10
R4
R5OUT
17
13
5k
1F
41
R3
35
R5
1F
30
16
R3OUT
V-
R2
12
10
R2OUT
V+
26
R1
18
R5
T1OUT
5k
17
14
1F
1F
5k
22
R4
R5OUT
V- 8
20
R3
R4OUT
19
R2
R3OUT
V+
T1
R1
R2OUT
1F
VCC
C1+
19
25
V
CC
C1+
+
+5V TO 10V
27
C1- VOLTAGE DOUBLER
28
C2+
+10V TO -10V
+
29
VOLTAGE INVERTER
C2+5V
T1
400k
15
5k
43
R5IN
SD
18
HIN241
(28 SOIC, SSOP)
TOP VIEW
T3OUT 1
28 T4OUT
T1OUT 2
27 R3IN
T2OUT 3
26 R3OUT
R2IN 4
25 SD
R2OUT 5
24 EN
T2IN 6
23 R4IN
T1IN 7
22 R4OUT
R1OUT 8
21 T4IN
R1IN 9
20 T3IN
GND 10
19 R5OUT
VCC 11
18 R5IN
C1+ 12
17 V-
V+ 13
16 C2-
C1- 14
15 C2+
FN3138.16
September 26, 2008
(Continued)
+5V
1F
1F
T1IN
T2IN
T3IN
T4IN
R1OUT
11
12
VCC
C1+
+
+5V TO 10V
14
C1- VOLTAGE DOUBLER
15
C2+
+
+10V TO -10V
16
VOLTAGE INVERTER
C2+5V
400k
7
T1
+5V
400k
T2
20
+5V
400k
T3
21
+5V
400k
T4
EN
+ 1F
T1OUT
T2OUT
T3OUT
T4OUT
R1IN
5k
R2IN
5k
26
27
R3IN
5k
22
23
R4IN
5k
19
24
V- 17
28
R4
R5OUT
1F
R3
R4OUT
R2
R3OUT
13
R1
R2OUT
V+
18
5k
R5
25
R5IN
SD
10
FN3138.16
September 26, 2008
Thermal Information
JC (C/W)
16 Ld PDIP Package*
90
24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
70
16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
95
44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . .
80
Maximum Junction Temperature (Plastic Package) . . . . . . . +150C
Maximum Storage Temperature Range . . . . . . . . . .-65C to +150C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Temperature Range
HIN2xxcx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to +70C
HIN2xxIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
2. Only HIN239. For V+ > 11V, C1 must be 0.1F.
3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
PARAMETER
MIN
(Note 5)
TYP
MAX
(Note 5)
UNITS
HIN232
10
mA
HIN236-HIN238, HIN240-HIN241
15
mA
HIN239
0.4
mA
HIN239
5.0
15
mA
10
0.8
TEST CONDITIONS
SUPPLY CURRENTS
No Load,
TA = +25C
No Load,
TA = +25C
TA = +25C
TIN
2.0
EN, Shutdown
2.4
TIN = 0V
15
200
IOUT = 1.6mA
0.1
0.4
IOUT = -1.0mA
3.5
4.6
-30
+30
RECEIVER INPUTS
RS-232 Input Voltage Range VIN
Receiver Input Impedance RIN
VIN = 3V
3.0
5.0
7.0
0.8
1.2
1.7
2.4
0.2
0.5
1.0
FN3138.16
September 26, 2008
PARAMETER
TEST CONDITIONS
MIN
(Note 5)
TYP
MAX
(Note 5)
UNITS
120
kbps
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching)
RL = 3k
400
ns
250
ns
RS-232 to TTL
0.5
30
V/s
V/s
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT
10
300
10
mA
NOTE:
4. Limits established by characterization and are not production tested.
5. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
VOLTAGE DOUBLER
C1+
S1
VOLTAGE INVERTER
S2
V+ = 2VCC
VCC
+
GND
C1-
S3
C1
S4
S5
C2+
GND
+
C3
VCC
S6
GND
S7
C2-
C2
S8
C4
V- = -(V+)
RC
OSCILLATOR
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN239), feature low power consumption, and
meet all ElA RS-232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the voltage
doubler and the voltage inverter. Each section is driven by a
two-phase, internally generated clock to generate +10V and
-10V. The nominal clock frequency is 16kHz. During phase
one of the clock, capacitor C1 is charged to VCC . During
phase two, the voltage on C1 is added to VCC , producing a
signal across C3 equal to twice VCC . During phase one, C2 is
also charged to 2VCC , and then during phase two, it is
10
FN3138.16
September 26, 2008
Receivers
V+
VCC
VCC
400k
300
RXIN
TXIN
TOUT
ROUT
5k
GND
V-
FIGURE 3. RECEIVER
FIGURE 2. TRANSMITTER
TIN
OR
RIN
TOUT
OR
ROUT
VOL
VOL
tPHL
tPLH
tPHL + tPLH
2
11
FN3138.16
September 26, 2008
1F
V- SUPPLY VOLTAGE
TA = +25C
12
12
10
0.47F
8
0.10F
6
4
TRANSMITTER OUTPUTS
OPEN CIRCUIT
10
V+ (VCC = 5V)
8
6
V+ (VCC = 4.5V)
V- (VCC = 4.5V)
V- (VCC = 5V)
0
3.0
4.0
3.5
4.5
VCC
5.0
5.5
6.0
10
15
20
25
30
35
|ILOAD| (mA)
1F
C1
1 C1+
1F
C3
2 V+
1F +
C2 -
+
3k
1F C4
T2
OUTPUT
1 C1+
VCC 16
2 V+
GND 15
3 C13k
3 C1-
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
TTL/CMOS OUTPUT
T1 OUTPUT
6 V-
T1IN 11
TTL/CMOS INPUT
7 T2OUT
T2IN 10
TTL/CMOS INPUT
8 R2IN
R2OUT 9
TTL/CMOS OUTPUT
VCC 16
GND 15
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
6 V-
T1IN 11
7 T2OUT
T2IN 10
8 R2IN
R2OUT 9
RS-232
30V INPUT
12
FN3138.16
September 26, 2008
+5V
The HIN2xx may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where 12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
C2 +
1F TD
RTS
5
11
RS-232
INPUTS AND OUTPUTS
+
T1
14
T2
7
13
R1
15
14
T2
10
+ C2
1F
T1
11
12
13
RD
9
HIN232
TTL/CMOS RTS
INPUTS AND
12
RD
OUTPUTS
R2
9
CTS
HIN232
CTS
10
TTL/CMOS
INPUTS AND
OUTPUTS
2
4
TD
16
1
C1 +
1F -
C1 +
1F -
R2
R1
15
16
2
C3
C4
6
V- V+
2F
2F
2
16
+5V
RS-232
INPUTS AND OUTPUTS
HIN232
C1 +
1F DTR
TTL/CMOS
INPUTS AND
OUTPUTS
DSRS
5
T1
11
14
T2
10
12
7
13
DCD
R1
R2
R1
15
+ C2
1F
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
13
FN3138.16
September 26, 2008
TRANSISTOR COUNT
V+
238
T3OUT T4OUT
R3OUT
R3IN
T5IN
R2IN
SHUTDOWN
R2OUT
EN
T2IN
T5OUT
T1IN
R4IN
R1OUT
R4OUT
R1IN
T4IN
GND
T3IN
R5OUT
VCC
R5IN
C1+
14
V+
C1-
C2+
C2-
V-
FN3138.16
September 26, 2008
N
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-
SYMBOL
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
MILLIMETERS
MIN
MAX
MIN
MAX
A1
0.015
NOTES
0.210
5.33
0.39
A2
0.115
0.195
2.93
4.95
0.014
0.022
0.356
0.558
B1
0.045
0.070
1.15
1.77
8, 10
0.008
0.014
0.204
0.355
0.735
0.775
18.66
19.68
D1
0.005
0.13
0.300
0.325
7.62
8.25
E1
0.240
0.280
6.10
7.11
0.100 BSC
2.54 BSC
eA
0.300 BSC
7.62 BSC
eB
0.430
10.92
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
0.115
0.150
2.93
3.81
16
16
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
FN3138.16
September 26, 2008
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-AD
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the MO Series Symbol List in Section 2.2 of
Publication No. 95.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
0.210
5.33
A1
0.015
0.39
A2
0.115
0.195
2.93
4.95
0.014
0.022
0.356
0.558
B1
0.045
0.070
1.15
1.77
0.008
0.014
1.230
1.280
D1
0.005
0.13
0.300
0.325
7.62
8.25
E1
0.240
0.280
6.10
7.11
0.204
31.24
0.100 BSC
eA
0.300 BSC
eB
0.115
0.430
0.150
24
0.355
32.51
2.54 BSC
7.62 BSC
10.92
2.93
3.81
24
6
7
4
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
16
FN3138.16
September 26, 2008
INDEX
AREA
0.25(0.010) M
B M
INCHES
E
-B1
L
SEATING PLANE
-A-
h x 45
-C-
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
0.0926
0.1043
2.35
2.65
A1
0.0040
0.0118
0.10
0.30
0.013
0.0200
0.33
0.51
0.0091
0.0125
0.23
0.32
0.3977
0.4133
10.10
10.50
0.2914
0.2992
7.40
7.60
B S
0.050 BSC
1.27 BSC
0.394
0.419
10.00
10.65
0.010
0.029
0.25
0.75
0.016
0.050
0.40
1.27
NOTES:
MILLIMETERS
16
0
16
8
7
8
Rev. 1 6/05
17
FN3138.16
September 26, 2008
INDEX
AREA
0.25(0.010) M
B M
INCHES
SYMBOL
-B1
L
SEATING PLANE
-A-
h x 45
-C-
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
0.0926
0.1043
2.35
2.65
A1
0.0040
0.0118
0.10
0.30
0.013
0.020
0.33
0.51
0.0091
0.0125
0.23
0.32
0.5985
0.6141
15.20
15.60
0.2914
0.2992
7.40
7.60
B S
0.05 BSC
1.27 BSC
0.394
0.419
10.00
10.65
0.010
0.029
0.25
0.75
0.016
0.050
0.40
1.27
NOTES:
MILLIMETERS
24
0
24
8
7
8
Rev. 1 4/06
18
FN3138.16
September 26, 2008
0.25(0.010) M
B M
INCHES
SYMBOL
-B-
L
SEATING PLANE
-A-
h x 45o
D
-C-
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
MILLIMETERS
MIN
MAX
NOTES
0.0926
0.1043
2.35
2.65
0.0040
0.0118
0.10
0.30
0.013
0.0200
0.33
0.51
0.0091
0.0125
0.23
0.32
0.6969
0.7125
17.70
18.10
0.2914
0.2992
7.40
7.60
0.05 BSC
0.394
0.01
0.029
0.016
0.050
8o
0o
0.419
1.27 BSC
NOTES:
MAX
A1
MIN
10.00
0.25
0.75
0.40
1.27
28
0o
10.65
28
7
8o
Rev. 0 12/93
19
FN3138.16
September 26, 2008
INDEX
AREA
0.25(0.010) M
B M
INCHES
E
GAUGE
PLANE
-B1
3
L
0.25
0.010
SEATING PLANE
-A-
D
-C-
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
0.078
2.00
A1
0.002
0.05
A2
0.065
0.072
1.65
1.85
0.009
0.014
0.22
0.38
0.004
0.009
0.09
0.25
0.390
0.413
9.90
10.50
0.197
0.220
5.00
5.60
A2
A1
B S
0.026 BSC
0.292
0.022
NOTES:
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
28
0
8.20
0.95
28
8
7
8
Rev. 2 6/05
20
FN3138.16
September 26, 2008
D1
-D-
INCHES
SYMBOL
-A-
-B-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.076
0.003
12o-16o
-C-
0.40
0.016 MIN
0.20
M
0.008
C A-B S
0o MIN
D S
b
A2 A1
0o-7o
b1
MILLIMETERS
MIN
MAX
NOTES
0.096
2.45
A1
0.004
0.010
0.10
0.25
A2
0.077
0.083
1.95
2.10
0.012
0.018
0.30
0.45
b1
0.012
0.016
0.30
0.40
0.515
0.524
13.08
13.32
D1
0.389
0.399
9.88
10.12
4, 5
0.516
0.523
13.10
13.30
E1
0.390
0.398
9.90
10.10
4, 5
0.029
0.040
0.73
1.03
44
44
0.032 BSC
0.80 BSC
Rev. 2 4/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
BASE METAL
WITH PLATING
MAX
0.13/0.17
0.005/0.007
12o-16o
MIN
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21
FN3138.16
September 26, 2008