HONTON

www.szhonton.com

ICS-R490 BGA rework station

Operation Manual

SHENZHEN HONTON ELECTRONICS TECHNOLOGY CO.,LTD

Address: San Tin Tin Building, 4th Floor, Boulevard of Jiang, Bao'an,
Shenzhen, GuangDong,China.
TEL:0755-33801901/03

400 6420 299

http://www.szhonton.com

FAX:0755-33801902

Email:htbga@163.com

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Table of Contents

(A) introduce the basic functions of machine parameters and

(B) the combination of machine parts
(C) of the function of each machine introduction and operation precautions
(D) of the machine operating system and Features
(E) BGA solder frequently asked questions
(F) reference temperature curve
(Vii) technical support contact

Dear Customer:
Thank you for choosing our newest BGA rework equipment, device with
the industry's most advanced integrated intelligent control system-ICS
(Intelligent Control System) adds intelligent temperature control system
and intelligent fault detection and wide voltage Intelligent energy-saving
function and mute function. K-type thermocouple imported closed-loop
control system can automatically compensate for temperature control
in order to achieve more precise temperature control; is a sufficient
guide the industry's advanced equipment. Will bring you more intuitive
to use and more comfortable feel.

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(A) introduce the basic functions of machine parameters and

(A) of the machine parameters and basic functions introduced
Basic parameters of the machine:
1 Power: Single phase 220V AC 50/60HZ 4KVA
2 Total power: 4000W
The upper heating power: 800W
Bottom heating power: 800W at the bottom of infrared heating power: 2400W Standby power: 10W
3 temperature control mode: High-precision K-type thermocouple closed-loop control, with electronic
temperature compensation.
4.PCB positioning mode: V-groove + Z fonts universal fixture pairs of Y-direction adjustment
5 PCB size: MIN 10mm * 10mm MAX 350mm * 400mm
6. Infrared Preheating area: 210mm * 340mm
Machine Dimensions: (or so) wide and 580mm * (before and after) long 580mm high 650mm
Machine weight: Net weight 35KG
New features:
A: the world's most advanced "intelligent control system (Intelligent control system), referred to as" ICS
", BGA rework desoldering more humane, more simple, more intelligent.
B: The superior fault alarm function, the following fault detection and alarm control system integration:
1: K-type thermocouple open circuit detection and fault alarm protection. So that the temperature out of
control, such as temperature overshoot fault no longer occurs.
2: up and down the hot air fan fault detection and fault alarm protection. Heater burnout phenomenon
as history, to maximize the protection of machinery and personal safety.
3: heater fault detection and fault alarm, the machine's real-time status at a glance.
C: upper and lower blast volume electronic smart speed. Ask each group to different temperature curve
to match the different wind speed, improve repair efficiency, enhance the repair success rate. Exempt
from the tedious and repetitive traditional machine mechanical wind speed adjustment.
D: double-Y direction PCB clamping bracket to meet the larger PCB fixed.
Basic functions:
1 Precision imported raw materials (PLC. heater) precise control of BGA desoldering process.
2 The machine uses the independent control of three-zone temperature control is more accurate. The first
temperature zone. Second temperature zone can be set in paragraph 8 liters (down) 8 segments constant
temperature control, which can store 10 groups of temperature curve. The third zone warm-up, independent
temperature control to ensure fully preheat the PCB during the soldering process,
3 Selection of imported high-precision thermocouples, precise temperature detection.
4 walk alone the temperature curve in the upper heating and bottom heating, cross-flow fan rapid cooling
principle to ensure that the PCB during the soldering process, will not be deformed.
5 demolition welding and welding finished 20 seconds ahead of progressive alarm with a vacuum suction pen,
convenient desoldering suction trips to the BGA
6 PCB positioning using a V-shaped slot, flexible and convenient removable universal fixture, PCB protection.
For large thermal capacity of PCB and other high temperature requirements of lead-free soldering and so can
easily handle.
Hot air Tsui 360 degree rotation, easy to replace. With a variety of size of hot air nozzle, special requirements
can be customized for notebook computer motherboard, desktop computers, motherboards, and other
large-scale circuit board repair, and cell phone motherboard micro maintenance of the chip

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(B) Introduce the basic functions of the machine

1: head heater limit rod. (To prevent head heater crushed PCB)
2: head heater. (Temperature zone)
3: The head heater adjust the handle up and down. (Adjustable up and down position)
4: LED lights. (Increase the brightness of the work area)
5: head heater, hot air nozzle. (Can be replaced according to different chip size)
6: Infrared heating panels warm-up area. (Third zone)
7: PCB clamping bracket. (Fixed PCB board with a holding device)
8: PCB clamping bracket locking screw. (Tighten the right side of the PCB clamping
bracket)
9: The display and control buttons. (Show and set parameters)
10: the upper heater, locking handle and move around.
11: the upper part of the heater cable
12: the lower part of the heater and wind mouth. (Second temperature)
13: shaped plate fixture and tighten the screws.
14: shaped plate fixture. (Clamping irregular PCB, such as notebook panels)
15: plywood jig and move around to tighten the screws.

(B) the combination of machine parts

(1) The head of ejector assembly

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(2)shaped plateas sembly fixture.

(3) the lower nozzle assembly screw thimble

(4) PCB assembly thimble screw.

(C)of the function of each machine introduction and operation

precautions
Step 1: Select to set a good temperature curve.
Step two: Select the appropriate hot-air nozzle to the center of the upper and lower temperature zone
aligned.
See below

The third step: the transferred zone on the top position, holding good the bad plate welded to be
demolished, the area transferred to the nozzle temperature on the edge of the chip from about a
distance of about 3-5MM.

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Transferred to the next zone to withstand the wind the mouth of the thimble lower PCB, pay attention
to avoid the lower component. Figure:

Step Four: Press the start button for 2-3 seconds, the machine starts, observe the ball changes, such
as a ball can not start the melting temperature to extend the pause button time.

(D) part of the operating system and machine control

functions introduced
I. Introduction panel buttons and display contents
Curve
Name field

Curve
number field

Curve indicates
the current column

Machine status
indication bar

Cursor keys
X4
Run time
remaining
indicator bar

Set / confirm key

Parameter
display area

Status indicator

Fan speeding
dicator bar

Lights on /
off
Password

The first column

input field /
current
temperature

indicates the set

temperature zone

Run /
Pause

Stop /
Exit

indicator bar

1: Introduction display
Item column

Display content

Curve Name field

Each curve is representative of the IC with a model

named user choose to use

Curve number field

The machine can remember 0-9 a total of ten commonly

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used parameters for the user to choose

Machine status indication bar

Indicates the current working state machine, a total of

"Settings", "Run," "pause", "cool", "stop" the five states

Column indicates the current

Displays the current operating curve segment number,

number of curve segments

including the 1-8 segment elevation and temperature

phase

Run time remaining indicator bar

Running time remaining display unit for the second

Fan speed indicator bar

The current fan speed display, 0-9, were Ten Speed

Password input field or the

1: In the set state when the password input field

current temperature indicator

2: In the running for the first, second, third zone of the

measured temperature

The first column indicates the set

temperature zone

The current time zone of the first set temperature

Parameter display area

The current curve setting parameters, such as rising

slope, constant temperature, constant time.

2: Key Features
Item column

Press the function key

Run / Pause

Start or pause the operation of the machine

Stop / Exit

Stop the machine running or exit setting mode

Lights on / off

Lights on or off

Set / confirm key

Enter setup mode or to set parameters to determine

the

Move the cursor / key addition and

subtraction

Move the current cursor position or the current value

plus or minus

Two common operations Functions

(I): set and modify parameters
For the user to modify the current parameters: such as constant temperature, platform time, the slope
of temperature rise, or the curve of the name, you must first set the machine to "set" state, in order to
carry out related operations, detailed steps are as follows:
A: by (ii) Stop / Exit button, set the machine to "stop" state.
B: Press (D) Set / confirm button, setting the machine to: "Set" state.
C: the fan speed changes: (can not enter a password)
In the "Set" state, if the user only need to modify the fan speed, it can not enter a password, press
repeatedly v "right" to move the cursor to fan speed indicator bar, and then (d) Set / confirm button,
the cursor so that high bright as then (v) "down key", you can adjust the fan speed.
Fan speed of 0-9 were ten, of which 9 is the wind speed maximum, minimum 1, 0 to stop. Prohibit any
fan speed set to "0"
D: curve number modification: (can not enter a password)
Machine in the "stop" state, according to (d) to enter the "Settings" state, if the user only needs to
modify the current curve number, can not enter a password, according to (v) "the key" to move the
cursor to the column curve number, then (iv) Set / confirm button, so when the cursor is
highlighted, then (v) "arrow keys" to modify the current curve number.
E: Modify the curve parameters (password must be entered before operational)
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1: All in the password input box is highlighted, move the cursor by (v) / plus or minus key "up" "down"
"left" "right" in the password input box enter the password "123456", then (iv) Set / confirm key, such
as password input box displays "OK" indicates that the password entered successfully. Then enter the
parameters can be modified, or (iv) and then set / confirm key, repeat steps 1. Until the password is
entered successfully.
2: (v) the cursor / subtraction key "up" "down" "left" "right", move the cursor to the need to modify the
value of the position, according to (d) Set / confirm button, highlighting the need to modify the value,
then Move the cursor by (v) / plus or minus key "on", "next" was changed to the desired value.
3: When a temperature rise of a number of the slope is set to 0, it means the end of the curve.
Note:
1: When the screen display when the cursor is half the height of the text, such as, this time can only
move the cursor (v) / plus or minus keys to move the cursor position.
2: When the screen shows the cursor is changed to the text height, for example, that the current value
of the cursor can be modified. Available at this time (v) the cursor / keys to set the value plus or minus
size.
(Ii) The operating status of the set
A: (i) in the stopped state, press RUN / PAUSE two - three seconds, you can start the machine running,
(vi) status indicator "RUN" LED flashes once per second, the machine automatically move the line to
set the curve. run remaining time indication bar under the curve parameters, automatically
calculate the total run time, and start the countdown, the current curve segment number field has
been run to automatically update the number of curve segments, when the "1-8" section of the figure
highlighted , this means that the curve in the current number of heating stages, and "segment" is
highlighted, then the number of the current temperature in the platform stage. a zone set
temperature indicator bar shows the current curve of the set temperature, password input field /
current temperature indicator bar shows, in order "first zone" "second zone" "third zone" of the
measured the temperature.
B: When the curve to run to the final thirty seconds, the machine will automatically issue a warning
tone to alert the user, and with the remaining time will be shortened, a warning tone becomes more
rapid, run to the end when sounding loudly. Automatic machine to "cool" status, stop heating, cooling
fan cooled three minutes and the vacuum pump working one minute, remaining time indicator bar
started running three-minute countdown,
C: (i) when the state is in the running to run / pause button, set the machine to pause, (vi) status
indicator "RUN" LED flashes twice per second, the machine will automatically maintai n the current
temperature, run time remaining indicator bar stop the countdown.
D: In the suspended state, then i run / pause, resume to normal operation. (Vi) status indicator "RUN"
LED flashes once per second.
E: (ii) when the state is in the running to stop / exit button for two seconds, to stop the operation of the
machine automatically to "cool" status in the "cool" state, the cross-flow fan to cool for three minutes,
while vacuum pump work one minute, three minutes after the machine is automatically set to stop, the
user can start the next cycle of work.
(Iii) The lights on / off
Press to turn on / off LED lights.

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Note: 1: The machine has been the experience under the BGA rework, set the relevant values of the
upper and lower limits, to minimize the customer's misuse. Detailed parameters are as follows
1: the first, second, third, three-zone temperature slope of 0-6 degrees / sec.
2: first and second zone temperature is 30 to 320 degrees.
3: The third zone temperature of 30 to 200 degrees.
4: first, second, third, three-zone platform time from 0 to 250 seconds.
Two: During operation, when the machine detects abnormal temperature line, it will display the
appropriate warning information, (vi) The status indicator of "ERR" indicator light, and sound an alarm,
the machine will automatically stop in the state, after troubleshooting can continue to run.

(E) BGA solder frequently asked questions

1, BGA How do you debug, find their own use of the curve?
BGA chip desoldering, is affected by a variety of environmental impact, air temperature, humidity,
indoor breeze flow, PCB thickness, PCB copper distribution. Can not be a curve in the country, a
variety of environments can be done welding, according to our statistics, only about 45% of customers
use our curve can not be adjusted. Our factory debugging environment for indoor 25 degrees.
Semi-closed debug room. Air humidity. Debugging material is generally notebook motherboard
Northbridge. So, when this problem occurs, we want to provide us with the actual situation based on
the curve, make the appropriate adjustments.
Testing method, the use of desktop or laptop Northbridge Northbridge (debug board using waste, but
requires PCB level, try not to be deformed, PCB no deterioration). Not recommended or smaller
notebook graphics chip temperature debugging.
The welding of the board, the use of clamps clamping formation, first observed in the fourth paragraph
of the complete set running time, observe the line of the test temperature from the temperature, the
ideal temperature is lead-free curve can reach 217 degrees, the curve has lead to 183 degrees. These
two temperatures is lead-free and lead-melting point materials. But this time the lower part of the chip
solder balls not melting, from the maintenance point of view, the ideal temperature is 235 degrees
lead-free, lead-200 degrees, then melted and then cooled ball will reach the ideal strength.
Lead-free solder, for example:
After the fourth paragraph of heating, the temperature does not reach 217 degrees, then according to
the size of the gap and improve the third, four temperature. For example: the measured temperature
reaches 205 degrees, then the hot air up and down independently adjustable by 10 degrees each. If a
big gap between the measured 195 degrees, 30 degrees is recommended to improve the bottom,
raise the upper 20 degrees, the upper temperature should not increase too much, so as to avoid
thermal shock of the chip is too large.
After heating, the fourth paragraph of the temperature reached 217 degrees, for the ideal state, if it is
over 220 degrees, will have to observe the fifth paragraph (maximum temperature above) before the
end of the chip to reach the maximum temperature. Advisable not to exceed 240 degrees. If more than
more, may be appropriate to lower the temperature of the fifth paragraph.
2, the welding, the bottom bracket on the PCB board thimble not always withstand the same time,
some feet to the top of the component, how do?
PCB on the bottom of the bracket has been designed thimble we can adjust the height by turning the
screw, according to the six foot level of the difference can be flexible to adjust the height of six feet.
Feet to the top component, may be appropriate to stagger 1-2mm.
3, the air volume control What is the role?
We provide nozzle sizes from 25mm to 40mm five kinds of specifications, even if the same
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temperature setting, using a different nozzle, the final heating temperature of the chip is different. The
smaller the nozzle, the higher the heat within the same unit, the chip temperature is higher, this is a
very simple truth, all the hot air welding equipment, are not escape this law. When the smaller chip
welding when using smaller nozzles, air volume control knob can be passed, the wind speed reduction,
say this greatly reduces the chance of explosion chip.
Of course, another way is to increase the appropriate distance from the nozzle to the chip, an
appropriate increase in 1-2mm, so the chip will greatly reduce the heat.
1, welding 775CPU seat to pay attention to what issues?
775 of the PCB copper distribution is very uneven, is near the outer half of the copper ground wire and
power distribution, on the inside of the half then all of the PCB signal line. According to our tests,
775CPU Block PCB temperature difference between the two largest copper can reach 20 degrees, it
is because a lot of ground and power supply copper PCB heat divergence to other locations.
775, direct plus welding (not removed, then welded directly once), you must use liquid flux.
775 When welding, be sure to remove the metal cover the new socket.
Nozzle selection must be appropriate to select and 775 within the frame of the same size plastic
nozzles.
When welding, be sure to keep holding fixture socket 775 can smooth. Do not bother, to be repeated
by adjusting the lower part of the nozzle to ensure that the top part of the 775 PCB level.
2, the choice of solder paste
Recommended to use environment-friendly liquid flux (for additional welding), or BGA special paste.
But notes that: BGA solder paste is a limitation of use, high temperature solder paste to preserve the
environment can easily lead to failure. Such as 30 degrees room temperature, direct sunlight, within
10 days of solder paste is completely degenerate. Solder paste deterioration, will be completely lost
flux effect. Please select the shady, cool place to store BGA solder paste.
3. BGA soldering cleaning
Recommend the use of a dedicated network of steel plate washer water with ultrasonic cleaning. After
a ball is not recommended to use recycled, once contaminated with dust and eyes can not see a small
amount of solder paste, the next time the plant will cause trouble. PCB recommends using clean cloth
dipped in clean water washer. Plant is completed. Do not allow hand-ball, sweat or grease
contamination after the failure may be caused by welding. Remember: the details determine success
or failure.
4. Explosion on chip chip issues and how to save
BGA chip soldering, I heard a slight crackling sound, w e may be called the explosive bridge, the
bridge explosion caused no more than two reasons: First, the air flow is uneven, a point the
temperature is too high, resulting in explosive bridge; second chip internal humidity, moisture, welding
process, rapid spillover of water vapor, resulting in short circuit or chip the copper circuit. PCB will
have this same problem, a serious damp layer PCB board likely to cause serious short and deformed.
So for some time longer to place the chip, the proposed drying operation, the drying is done using a
simple repair station on the chip temperature of 150 degrees, 15 minutes of heating time. Professional
approach is to use the oven at 100 degrees, the entire piece of board and chip for 10 hours of drying.
Chips stored in the indoor environment, even if the new chips will still absorb moisture from the air,
causing damage, so it is recommended to buy Cabinets (generally used to store drugs) to save the
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chip.
5, How to Take Glue chip?
If the use of temperature on the bottom line of BGA chip to test the temperature of 230 degrees, this
time, the ball has melted but why take the chip as usual approach, the chip holding forceps not get
down, because the adhesive of the chip, so hard Take, then force will take off point? No. Beca use the
pad on the tin has melted into a liquid state, while the glue is between perfusion in the ball and did not
stick on the pad of course not hard to take off points.

(F) reference temperature curve

it82801dbm

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it82845PM

it82801HBM

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it82945GM

ATI 7500

nvid g6150

www.szhonton.com

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amd

775cpu sck

479cpu sck

www.szhonton.com

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zhiqiu

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(G) after-sales support and contact

The whole year warranty, two-year service warranty thermostat.
Other accessories:
1, the nozzle does not provide warranty service.
2, CD-ROM does not provide warranty service. If damaged, please contact us for download.
Website http://www.szhonton.com
E-mail: htbga@163.com
Technology QQ: 611650545 QQ Group: 42738780
National Toll Free: 400--6420--299
(mechanical failure) 13922807635 (electrical failure)

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