Surface Mount Fuses Fundamentals

Surface-mount Fuses Fundamentals
Surface-mount Fuses
Fundamentals
Overview
TE Circuit Protection offers the widest selection of surface-mount
fuses available for addressing a broad range of overcurrent
protection applications. Helping
ng to prevent costly damage and
promote a safe environment
nt for electronic and electrical
equipment, our single-use chip fuses provide performance stability
to support applications with current
urrent ratings from .5A up to 20A.
TE Circuit Protection also offers
fers the telecom FT600 fuse for
telecommunications applications.
ons. This telecom fuse helps comply
with North American overcurrent
current protection requirements,
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),
and UL60950 3rd edition.
Multi-layer Design for Chip

hip Fuses
The multi-layer design has the
he benefit of exposing more fuse
fuse
element surface area to the glass-ceramic absorptio
absorption
on material.
m
mate
erial.
When the fuse elements open,
en, there is more material
mate
erial for
fo the
th
he
vaporizing fuse metals to absorb
efficient
orb into, resulting in
n a very
very ef
e
fiicie
ent
and effective quenching of the
e fuse arc.
Figure 1 compared the multi-layer
with
ayer design
desi
sig
gn of
of our SFF
S
SF
FF ffuses
usess w
ith
standard glass coated designs.
s. The glass
glasss coated
coatte
ed
d designs
d
de
esignss rely
re
ely on
the coating on only one side of the
fuse
element
absorb
e fu
se el
lem
mentt tto
oa
bso
orrb tthe
he
e
vaporizing fuse material when it op
opens.
Therefore,
much
pens. Th
herefo
ore
e,, tthere
here iss mu
uch
less absorption material available
fuse
metals.
ble to
t absorb
abs
ab
b orb
rb the
he ffu
use m
me
tal
a s.
s The
The
result can be prolonged arcing
possible
g and
dp
osssib
ble coating
n breach.
bre
each.
ch
h
Figure 2 shows how the absorption
orptiion characteristics
ch
hara
racte
eris
ri tic
iic
cs off the
he two
he
designs differ. The multi-layer design
desig
gn indicates
ind
dica
ate
t s a clean
clea
ean separation
ea
s paration
se
n
with the fuse element evenly
y diffusing
diffu
usin
ng into
into
o the
the surrounding
surro
oundiing
ceramic substrate. In the glass
ass coated
co
oate
te
ed design,
dessign, the
tthe element
element
diffusion takes place in a smalll portion
device
po
ortio
on off the
the dev
vice
e and
an
a
n is only
absorbed by the glass materiall dir
directly
above
re tly ab
rect
re
bove the
e area of failure.
Figure
F
igurre 1
Glass/Ceramic
G
lass/C
Ceramicc
Substrate
Subsstrate
e
Multiple
Multtiple Fuse
Elements
Ele
emen
nts
Multi-layer
M
ulti-laye
er Design
Substrate
Su
Material
M
Single Fuse Glass

Element Coating
Single-layer
Glass Coated Design
Sin
Figure
Figu
ure
e2
Fault Zones
Zone
11
Multi-layer Design
Single-layer
Glass Coated Design
Single-la
Wire-In-Air Design for 2410SFV

2410
0SFV
VF
Fuses
uses
DF
use which is very suitable
The 2410(6125) is a Wire-In-Airr SMD
Fuse
t ti
li ti
for secondary level over currentt protection
applications.
Figure 3 compared our straight wire element design 2410SFV
fuses with normal corrugating wire design fuse. The straight wire
element in air performs consistent fusing and cutting
characteristics together with excellent inrush current
withstanding capability.
Introduced PCB assembly technology into 2410SFV fuses design
and manufacture, we achieved on lead free completely and no
end cap falling off risk comparing with traditional ceramic body
with end cap fuse.
Figure 3
Glass fiber enforced
epoxy body
Straight wire element
Copper terminal
plated with Ni and Tin
Ceramic body
Corrugate wire element
End cap plated with Tin
75
Temperature Derating
A fuse is a temperature sensitive
nsitive device. Therefore, operating temperature will have an effect on fuse
f
performance and lifetime.
Operating temperature should
ould be taken into consideration when selecting the fuse currentt rating.
ra
ati
t ng. The
T Thermal Derating Curve for
surface mount fuses is presented
sented in Figure 4. Use it to determine the derating percentage
percenttage based
ba
ased on operating temperature and
apply it to the derated system
tem current.
Figure 4
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
2410 Series
S
Temper
e atu
er
ure
e Effect
Effect On
O Current Rating
Temperature
0
110
5
105
0
100
5
95
% De-rating
% De-rating
1206/0603/0402
06/0603/0402 Series
ure Effect on Current Rating
Temperature
0
90
5
85
0
80
5
75
0
70
5
65
0
60
5
55
-35
-15
25
45
65
85
5
1
105
05
5
125
1 5
145
5
0
50
-55
-35
Maximum
mum Operating Temperature
Tem
emperaturre (C)
em
(C))
-1
-15
15
25
45
65
85
105
125
Maximum
Maxiim
mum
mu
um Operating
u
Operating Temperature (C)
Pulse Cycle Derating

Figure
Fi
igure
e5
Surface-mount Fuse Pulse Derating Curve
100%
% of Minimum I2t
Once the I2t value for the a

application
pplica
ation waveform
ati
wa
ave
eform has
h s been
ha
been
b
en
determined, it must be derated
erated
db
based
ased
d on the
t e number
numberr off cycles
nu
cycle
ess
expected over the system lifetime.
ifetim
me.. Since
me.
Sinc
ce
e the
the stress
str
trress induced
indu
n ced by
by the
th
he
e
current pulse is mechanical
nature,
number
al in
nn
a ure,, tthe
atu
he num
mb
ber
be
e off ttimes tthe
he
stress is applied has significant
ficant
ntt bearing
n
bea
aring
ng on
n how
how
w much
muc
uc derating
uch
deratting
must be applied to the fuse
e rating.
ra
ating. Figure
Figu
gu
ure 5 presents
pre
re
esen
nttss the
the
e current
currrent
pulse derating curve for our surface-mount
su
urfa
ace-m
e oun
eou
u t chip
ch
c ip fuses
fuses up to
100,000 cycles.
10%
100
1000
10000
100000
Number of Pulses
Numbe
Selecting Surface-mount
ountt Fuses
Fus
ses
11
Fuse selection seems straightforward,

ghtforward, in that, you pick one which has a current rating just a bit higher
highe than your worstcase system
operating current. Unfortunately, its not that simple. There are derating considerations for operating current and application
temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or
spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as
knowing the nominal current drawn by the system.
Fuse Selection Flowchart

However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart
will help you select a fuse best suited for your application conditions.
Figure 6
Step 1
Determine Steady State
Fuse Current Rating
Step 2
Determine Pulse
Waveform by
Calculating I2t
Apply Standard Steady

State Derating (75%)
[Ifuse Isys/0.75]
Step 3
Apply Pulse
Cycle Derating
Step 7 Select Fuse Current Rating

(use higher value between Step 1 and Step 6)
76
Step 4
Apply Pulse
Temperature
Derating
Apply
Temperature Derating
[Ifuse Isys/0.75/Ktemp]
Step 5
Apply Derating
for Variance in
the Circuit
Steady State
Fuse Current
Rating
Step 6
Select Fuse Current
Rating for Pulse
Environment
Step 8 Check Voltage Rating
NEW
Pulse Tolerant chip fusess has high inrush current

withstand capability and provide
ovide overcurrent protection
on DC power systems. Silver
er fusing element, monolithic
and multilayer design provides
vides strong arc suppression
characteristics.
These RoHS-compliant surface-mount
ace-mount devices facilitate
e
the development of more reliable, high performance
performanc
ce
consumer electronics such
ch as laptops, multimedia
multi
time
ti
m dia
devices, cell phones, and other
ther portable electronics.
electro
onics
s.
Benefits
Surface-mount Fuses Pulse Tolerant Chip Fuses
Surface-mount Fuses
Pulse
se Tolerant
T l
t Chip
Chip Fuses
F
Features
High inrush current withstanding

capability
tand
ding
gc
apa
pability
y
Lead free materials and RoHS compliant
Ceramic Monolithic structure

ure
Halogen free
(refers to: Br900ppm, Cl900
Cl900ppm, Br+Cl1500ppm)
Silver fusing element and silve

silver
er termination
term
mina
nation with
nickel and tin plating
Monolithic, multilayer design
Excellent temperature stability

bility
High-temperature performance
performanc
Strong arc suppression characteristics
-55C to +125C operating temperature range
11
Applications
Laptops
Printers
Game systems
Digital cameras
DVD players
LCD monitors
Cell phones
Portable electronics
Scanners
77
Table FP1 Clear Time

e Characteristics for Pulse Tolerant Chip Fuses
% of rated current
100%
Clear time at 25C

4 hours (min.)
200%
1 seconds (min.)
60 seconds (max
(max.)
max
m
ma
a .)
1000%
0.0002 second (min.)
0.02 seconds
dss ((max.)
max
ax.)
Table FP2 Typical Electrical

ectrical Characteristics an
and
nd D
Dimensions
ime
ension
ns forr P
Pulse
uls
se T
Tolerant
oleran Chip Fuses
0603 (1608 mm) Pulse
e Tolerant Chip Fuses
s
Typical
T
ypica
Electrical
El
lectrica
al Ch
Characteristics
ara
D
Part
P
art Number
Nu
umbe
mb r
Shape and Dimensions

mm (Inch)
B
mm
in
Min
Max
Min
Ma
ax
Max
in
Min
x
Max
Mn
Min
Max
1.45
1.75
0.65
0.9
95
0.95
0.2
21
0.21
0.51
0.51
0
.65
5
0.65
0.95
5
(0.057) (0.069)
(0.03
37)
(0.026) (0.037)
(0.008
(0
0 ) (0.020)
08
(0.0
020)
(0.008)
(0.02
26) (0.037)
(0.
0 037)
(0.026)
Ratted
d
Rated
Current
Curren
re t
(A)
Nominal
Nomin
Nominal
I2t
Cold DC
DCR
(A2sec)
()*
Max.
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFP100F/32-2
06
060
603
3S
3SF
S P100F/3
32-2
2
1.
1.0
0
0.210
0.080
32
50
0603SFP150F/32-2
0603SF
SFP150F/
F//32-2
1.5
0.101
0.11
32
50
0603SFP200F/32-2
0603SF
SFP20
200F/32-2
20
2.0
0.057
0.24
32
50
0603SFP250F/32-2
0603S
3S
SFP250F/32-2
2.5
0.042
0.56
32
50
0603SFP300F/32-2
0
06
060
6 3SFP300F/32-2
3.0
0.030
0.72
32
50
0603SFP350F/32-2
3.5
0.022
1.10
32
50
0603SFP400F/32-2
4.0
0.018
2.08
32
50
0603SFP450F/32-2
4.5
0.014
2.63
32
50
0603SFP500F/32-2
5.0
0.013
3.25
32
50
1206 (3216 mm) Pulse

e Tolerant
Toler
e antt Chip
Chi
h p Fuses
Typical
Typica
Electrical Chara
Characteristics
Max.
Interrupt Ratings
D
A
11
Part Number
mm (Inch)
mm
in
Min
Max
Min
Max
Min
Max
Min
Max
3.00
3.40
0.77
1.17
0.26
0.76
1.40
1.80
(0.118) (0.134)
(0.030) (0.046)
(0.010) (0.030)
(0.055) (0.071)
Rated
Current
(A)
Nominal Nominal
I2t
Cold DCR
(A2sec)
()*
Voltage
(VDC)
Current
(A)
1206SFP100F/63-2
1.0
0.340
0.11
63
50
1206SFP150F/63-2
1.5
0.150
0.33
63
50
1206SFP200F/63-2
2.0
0.090
0.80
63
50
1206SFP250F/32-2
2.5
0.070
1.19
32
50
1206SFP300F/32-2
3.0
0.035
1.35
32
50
1206SFP350F/32-2
3.5
0.029
1.84
32
50
1206SFP400F/32-2
4.0
0.023
2.74
32
50
1206SFP450F/32-2
4.5
0.021
3.20
32
50
1206SFP500F/32-2
5.0
0.017
5.50
32
50
* Measured at 10% of rated current and 25C ambient temperature.

Melting I2t at 0.001 sec clear time.
78
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses Pulse Tolerant Chip Fuses
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Figure FP1
4.5
A
5.0
A
A
3.0
4.0
A
2. 5
3.5
A
2. 0
1.5
A
1.0
A
0603SFP Average Time Current Curves

100
10
Clear Time (s)
0.1
0.01
0.001
0.0001
1
10
0
100
Current
C
urrr
rrent (A)
rre
(A)
A)
Figure FP2
0603SFP
06
060
03SF
3 P I2T vs. t Curves
10,000
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1000
11
1.5A
1.0A
I2t (A2s)
100
10
0.1
0.01
0.0001
0.001
0.01
0.1
10
100
Time (s)
Note: Curves are nominal
HF Halogen Free
79
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Contd
Figure FP3
A
2. 5
3.0
A
3.5
A
4.0
A
4.5
A
5.0
A
A
2. 0
1.0
A
1.5
A
1206SFP Average Time Current Curves

10,000
Clear Time (s)
100
0.01
0.001
10
100
Current (A)
(A))
Figure FP4
1206SFP I2T vs. t Curves
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
10,000
11
I2t (A2s)
100
0.01
0.0001
0.01
Time (s)
Please go to page 97 for more information for Pulse Tolerant Chip Fuses.
80
HF Halogen Free
100
10,000
Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses
Surface-mount Fuses
0603 Very Fast-Acting Chip Fuses
NEW
Very Fast-acting chip fuses help provide overcurrent

protection on systems using
ng DC power sources up to
c, multilayer design provides
32VDC. The fuses monolithic,
the highest hold current in the smallest footprint,
reduces diffusion-related aging, improves product
reliability and resilience, and
d enhances high-temperature
performance in a wide range
ge of circuit designs.
urface-mount devices offer
strong arc suppression characteristics
racteristics and facilitate the
development of more reliable,
eliable, high performance
e
ch as laptops, multimedia
multimediia
ther portable electronics.
electroni
nics
ni
c .
Benefits
Features
F
eattures
Very fast acting at 200% and 30

300%
00%
% overloads
o erload
ov
ads
ad
Lead
Excellent inrush current withs

withstanding
capability
stand
ding
gc
ap
pab
bil
i ity
y at
at
high overloads
Halogen free
Thin body for space limiting

ng applications
app
plic
cation
ns
Glass ceramic monolithic structure

stru
uctu
ure
e
performanc
Silver fusing element and silve

silver
er termination
terminatio
on with
nickel and tin plating
temperature range
-55C to +125C operating tem

11
RoHS compliant and lead-free

-free
e materials
matte
terials
Symmetrical design with marking
markin
ing on
on both sides
(optional)
Applications
Laptops
Printers
Game systems
Digital cameras
DVD players
LCD monitors
Cell phones
Scanners
81
Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses
% of rated current
100%
Clear time at 25C

4 hours (min.)
200%
0.01 second (min.)
5 seconds (max.)
300%
0.001 second (min.)
0.2 seconds (max.)
ectrical Characteristics and Dimensions for

or Very
or
ry
y Fast-Acting
Fast-Ac
Fa
Table FV2 Typical Electrical
Chip Fuses
0603 (1608 mm) Very
y Fast-Acting Chip Fuses
Typical
Typ
yp
y
pica
cal El
ca
Electrical
lectrrical Cha
Characteristics
aracter
D
Nominal
Nomina
al
Cold
Co
old D
DC
DCR
CR
()*
(
)*
No
Nominal
I2t
(A2sec)
Voltage
(VDC)
Current
(A)
0603SFV050F/32-2
0603S
3SFV05
3S
50F/32
2-2
0.5
0.5
0.860
0.86
60
0.0093
0.0
32
50
0603SFV075F/32-2
0603S
SFV07
75F/32
2-2
0.8
0.8
0.450
0.450
50
0.0191
0.0
32
50
0603SFV100F/32-2
0603S
SFV10
00F/32
2-2
1.0
1.0
0.280
0.280
0.0360
0.0
32
50
0603SFV125F/32-2
0
060
60
03S
SFV12
25F/32
2-2
1.3
0.205
0.205
0.0630
0.0
32
35
0603SFV150F/32-2
0
60
03S
SFV15
50F/32
2-2
1.5
0.143
0.143
0.0950
0.0
32
35
Max
Max
x
0603SFV175F/32-2
060
03SFV17
V17
75F/32
2-2
1.8
1.8
0.095
0.09
095
95
0.1400
0.
32
35
0.95
0603SFV200F/32-2
060
03SFV20
V20
00F/32
2-2
2.0
2.0
0.073
0.2100
0.2
32
35
0603SFV250F/32-2
060
03SF
S V25
50F/
F//32
3 2
32-
2.5
0.046
0.3000
0.3
32
35
0603SFV300F/32-2
060
03S
SFV30
00F/3232 2
3.0
0.039
0.4600
0.4
32
35
0603SFV350F/32-2
060
03S
SFV350F/3232 2
3.5
0.028
0.7300
0.7
32
35
0603SFV400F/32-2
060
06
603S
60
SFV400F/3232--2
4.0
4.0
0.023
1.1500
1.
32
35
0603SFV450F/32-2
0
060
3S
SFV450F/
0F
F//32-2
F
4.5
0.019
1.6800
1.6
32
35
0603SFV500F/32-2
0603
3S V
3SF
V50
V5
50
5
00F/32-2
5.0
0.015
2.6200
2.6
32
35
Par
art Nu
ar
art
mb
ber
Part
Number

mm (Inch)
B
A
Min
mm
in
B
Max
1.45
1.75
Min
0.22
C
Max
ax
0.48
48
Min
0.21
1
D
Max
ax
ax
0.51
0.
51
Min
Miin
M
n
0.65
65
6
5
Max. Interrupt Ratings
Rated
R
ated
Currentt
(A
((A)
A
(0.057) (0.069) (0.009) (0.019)

19) (0.008)
(0..008) (0.020)
(0
0.0
020) (0.025)
(0.0
025) (0.037)
(0.03
37
3
7)
* Me
Measured
easured at 10% of rated current and 25C
Figure FV1-FV2 Family

ily Pe
Performance
erffor
orma
m nce C
Curves
urv
ves for Very Fast-Acting Chip Fuses
Figure FV1
Figure FV2
0603SFV Average
erage
eT
Time
ime Cur
C
Cu
Current
urre
rren
re
e t Curves
0603SFV It vs. t Curves
0.0
5A
0.7
5
1.0 A
0
1. 2 A
5
1.5 A
1.7 0A
2.05 A
2. 5 0 A
3.0 0A
3.5 0A
4.0 0A
4.5 0A
5.0 0A
0A
11
100
1000
5.00A
4.50A
4.00A
3.50A
3.00A
2.50A
2.00A
1.75A
1.50A
1.25A
1.00A
0.75A
0.05A
100
10
10
It (As)
Clear Time (s)
0.1
0.1
0.01
0.01
0.001
0.001
0.0001
1
10
Current (A)
100
0.0001
0.0001
Please go to page 97 for more information for Very Fast-Acting Chip Fuses.
82
HF Halogen Free
0.001
0.01
0.1
Time (s)
10
Fast-acting chip fuses help provide

rovide overcurrent protection
on systems using DC power
er sources up to 63VDC. The
fuses monolithic, multilayerr design provides the highest
hold current in the smallest footprint, reduces diffusionrelated aging, improves product
resilience,
duct reliability and resilience
ce,
ce
e
and enhances high-temperature
ature performance in a wide
wid
de
range of circuit designs.
devices
offer
urface-mount
nt devi
nt
vice
vi
es of
o
ffer
e
strong arc suppression characteristics
racterist
sttics and facilitate
fa
aciliita
tate the
t e
th
development of more reliable,
eliablle, high
high performance
pe
erforma
man
ma
nce
ch ass laptops,
lap
pto
ops,, multimedia
mul
u time
edia
a
ther portable
portabl
ble electronics.
electro
ronics
s.
Benefits
Surface-mount Fuses Fast-Acting Chip Fuses
Surface-mount
rface-mount
rface
f
mountt Fuses
F
Fast-Acting
st-Acting
st
tA
Acting
ti g Chip
Chip Fuses
F
Features
Small size with high-current

ratings
nt ra
ating
gs
Excellent temperature stability

bility
Halogen free
High reliability and resilience

(refers to: Br900ppm,

Br900ppm Cl900
11
Applications
Laptops
Printers
Game systems
Digital cameras
DVD players
LCD monitors
Cell phones
Scanners
83
Table FF1 Clear Time

e Characteristics for Fast-Acting Chip Fu
Fuses
uses
% of rated current
100%
Clear time at 25C

4 hours min.
250%
5 seconds max.
400%
0.05 seconds max.
Table FF2
Typical Electrical
ectrical Characteris
Characteristics,
sti
tics
c , Dimen
Dimensions
e siions
en
s and Re
Recommended
eco
ommended Pad Layout for
Fast-Acting
g Chip Fuses
0402 (1005mm) Fast-Acting

-Acting Chip F
Fuses
use
es
Shape and
Dimensions
Inch (mm)
4
0.0200.004
(0.510.10))
Typical
Typ
T
ypica
al El
Electrical
lectric
riical Character
ric
Characteristics
0.0390.004
(1.000.
10)
0.
0
1
10
(1.000.10)
Nominal
Cold DCR
()*
No
Nominal
I2t
(A2sec)
Voltage
(VDC)
Current
(A)
0402SFF050F/24
040
02SF
SFF050F/24
4
0.50
0.50
0.380
0.0043
0.0
24
35
0402SFF075F/24
0
040
02S
SFF075F/24
4
0.75
0.210
0.0076
0.0
24
35
0402SFF100F/24
0
040
04
4 2S
SFF100F/
F/2
/24
1.00
1.00
0.120
0.0170
0.0
24
35
0.063
3
(1.60)
(1.60
0)
0402SFF150F/24
0402S
SFF15
150F/24
1.50
0.056
0.0490
0.0
24
35
0.016
(0.40
(0.40)
0)
0402SFF200F/24
0402
2SFF200F/24
2.00
0.035
0.0700
0.0
24
35
0402SFF300F/24
040
402SFF300F/24
40
3.00
0.021
0.1250
0.1
24
35
0402SFF400F/24
4.00
0.014
0.2
0.2250
24
35
Par
rt Nu
N
mbe
be
ber
e
Part
Number
0.0200.
00
0
0 004
0.0200.004
(0.510.10)
(0.510.
10
0 10)
0.004
0.0100.004
0.10)
(0.250.10)
Recommended
Pad Layout
Inch (mm)
Ratted
Rated
Current
Curr
rentt
(A
(A)
A)
0.028
8
(0.70)
(0
0.70
0)
0)
0.024
(0.60)
0603 (1608mm) Fast-Acting

Actting
gC
Chip
hip Fuse
Fuses
es
Typical Electrical Character
Characteristics
Shape and
Dimensions
Inch (mm)
0.0310.006
(0.800.15)
Nominal
Cold DCR
()*
No
Nominal
I2t
(A2sec)
Voltage
(VDC)
Current
(A)
0603SFF050F/32
0.50
0.485
0.0
0.0029
32
50
0603SFF075F/32
S
0.75
0.254
0.0064
32
50
0603SFF100F/32
1.00
0.131
0.0160
32
50
0603SFF150F/32
1.50
0.059
0.0300
32
35
0603SFF200F/32
2.00
0.044
0.0600
32
35
0603SFF250F/32
2.50
0.032
0.1150
32
35
0603SFF300F/32
3.00
0.025
0.1900
32
35
0603SFF350F/32
3.50
0.024
0.2950
32
35
0603SFF400F/32
4.00
0.018
0.4000
32
35
0603SFF500F/32
5.00
0.013
0.7000
32
35
0603SFF600F/24
6.00
0.010
1.1250
24
35
Part Number
1206SFF050F/63
Rated
Current
(A)
0.50
Nominal
Cold DCR
()*
0.730
Nominal
I2t
(A2sec)
0.0021
Voltage
(VDC)
63
Current
(A)
50
1206SFF075F/63
0.75
0.513
0.0052
63
50
1206SFF100F/63
1.00
0.220
0.0120
63
50
1206SFF150F/63
1.50
0.120
0.0250
63
50
1206SFF175F/63
1.75
0.100
0.0450
63
50
1206SFF200F/63
2.00
0.050
0.0700
63
50
1206SFF250F/32
2.50
0.035
0.1400
32
50
1206SFF300F/32
3.00
0.031
0.2200
32
50
1206SFF400F/32
4.00
0.022
0.3800
32
45
0.173
(4.40)
1206SFF500F/32
5.00
0.015
0.6000
32
45
0.059
(1.50)
1206SFF600F/32
6.00
0.013
1.0000
32
50
1206SFF700F/32
7.00
0.011
1.7500
32
50
1206SFF800F/32
8.00
0.008
2.5000
32
50
1206SFF600F/24
6.00
0.013
1.0000
24
45
1206SFF700F/24
7.00
0.011
1.7500
24
45
1206SFF800F/24
8.00
0.008
2.5000
24
45
Part Number
0.0310.006
(0.800.15)
(0 800 15)
0.0140.006
(0.360.15)
Recommended
Pad Layout
Inch (mm)
0.110
(2.80)
0.024
(0.60)
11
Rated
Current
(A)
0.0630..006
0.0630.006
(1.600
0.15)
(1.600.15)
0.039
(1.00)
0.043
(1.09)
1206 (3216mm) Fast-Acting Chip Fuses

Typical Electrical Characteristics
Shape and
Dimensions
Inch (mm)
0.0630.008
(1.600.20)
0.1260.008
(3.200.20)
0.0430.008
(1.100.20)
0.0200.010
(0.510.25)
Recommended
Pad Layout
Inch (mm)
0.071
(1.80)
0.057
(1.45)

84
HF Halogen Free
Figure FF1
Figure FF2
0402SFF
040
0
40
02SFF I
It
t vs. t Curves
2. 0
A
3.0
4.0A
A
0.5
A
0.7
5
1.0 A
1.5A
A
0402SFF Average
e Time Current Curves
1000
10
4.0A
3.0A
2.0A
1.5A
100
0
1.0A
0.75A
0.5A
IItt (As)
(As)
A s)
Clear-Time (s)
10
0
0.1
0.1
1
0.01
Surface-mount Fuses Fast-Acting Chip Fuses
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
0.01
01
0.001
0.1
10
0.001
0
.001
0.001
100
10
00
0.01
Current
urrentt (A)
(A)
A)
0.1
10
Time (s)
Figure FF3
Figure FF4
0.5
A
0.7
5
1.0 A
A
1.5
2 . 0A
2. 5 A
3.0A
3. A
4.5A
5.00A
6 .0A
A
0603SFF Average
e Tim
Time
me Cur
Cu
Current
re
ent Curve
en
Curves
es
0603SFF It vs. t Curves
10
10000
11
6.0A
5.0A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
0.75A
1000
10
0.5A
It (As)
Clear-Time (s)
100
0.1
0.1
0.01
0.01
0.001
0.1
10
Current (A)
HF Halogen Free
100
0.001
0.001
0.01
0.1
10
Time (s)
85
Figure FF1-FF6 Family

ily Performance Curves for Fast-Acting Chip Fuses
Fus
ses
Figure FF5
Contd
Figure FF6
6
1206SFF Average
erage Time Current Curves
0.5
A
0.7
5
1.0 A
A
1.5
1.7 A
2.05 A
2. 5 A
3.0A
4.0A
5.0A
6 .0A
7.0 A
8 .0A
A
1206SFF
120
206S
SFF It vs. t Curves
10000
10
8.0A
7.0A
6.0A
5.0A
4.0A
3.0A
2.5A
2.0A
1.75A
1.5A
1.0A
1000
10
000
1
100
0.5A
It (As)
Clear-Time (s)
0.75A
10
0.1
0.1
0.1
0.01
0.01
0.001
0.1
10
0.001
0.001
100
Please go to page 97 for more

e iinformation
nforrmation for Fast-Acting Chip Fuses.
11
86
HF Halogen Free
0.01
0.1
Time (s)
Tim
Current
Cu
urren
en
nt (A)
(A)
10
The monolithic multilayer design of the TE Circuit

Protection high-current-rated chip fuses helps to
provide some of the highest current ratings available in
the
1206
size
and
enhances
nhances
high-temperature
performance in a wide range

ange of circuit protection
designs. The devices small
all size, high reliability and
strong arc suppression characteristics make them
High-Current Rated Chip Fuses
Surface-mount Fuses
High-Current-Rated Chip Fuses
suitable for overcurrent protection

otection of power supplies,
servers, communications equipment,
quipment, voltage regulator
modules, and other high-current,
rrent, small size applications.
Benefits
Glass ceramic monolithic structure
provides
struc
ctu
ure
r p
pr
rov
vide
id
des st
sstability
tabilitty
in application cycling
Features
F
eaturres
Lead
Lead ffree
rre
ee materials and RoHS compliant
Halogen
Hallogen free
High-current rating in a small

mall package
pa
ackage
ge allows
ws more
ws
mo
m
ore
e
efficient use in system space
ace
Monolithic multilayer design
Strong arc suppression in overcurrent

ove
erc
currrent
n conditions
co
ondit
itions
performanc
(refers
((r
refers to: Br900ppm, Cl900
11
temperature range
Applications
Communications equipment
ent
Voltage regulator modules
Power supplies
Servers
87
Table FH1 Clear Time

e Characteristics for High-Current-Rated Chip
pF
Fuses
uses
1206SFH Series
% of rated current
100%
250%
Table FH2
Clearr time at 25C

4 hours (min.)
5 seconds
econds (max.)
Typical Electrical
ectrical Characteristics, D
Dimensions
im
men
nsiions
sa
and
nd Re
nd
Recommended
eco
omm
mmended Pad Layout for
High-Current-Rated
ent-Rated Chip Fuses
1206 (3216mm) High-Current-Rated

Current-Rated Chip
p Fuse
Fuses
es
Shape and
Dimensions
Inch (mm)
0.0630.008
(1.600.20)
Typ
Typical
picall E
Electrical
lectrical
Characteristics
Cha
ha
aracteristics
Rate
ed
Nominal
Rated
Nominal
N
Curren
en
nt
Current
Cold DCR
I2t
(A))
()*
(A2sec)
0.1260.008
0.1260.00
08
(3.200.20)
(3.2
3.2
200.20
0)
Part
Par
rt Number
Nu
umbe
m r
0.0380.008
0.03
380
0.008
(0.970.20)
(0..970.
0 20)
2
Voltage
(VDC)
Current
(A)
1206SFH100F/24
120
06SFH100F/
0F 24
10
0.010
24
100
120
206SFH120F/
0F 24
24
1206SFH120F/24
12
12
0.008
14
24
100
12
206SFH15
50F/24
1206SFH150F/24
15
0.005
26
24
100
12
206SF
FH200F/24
1206SFH200F/24
20
0.003
56
24
100
* Mea
sured at 10% of rated current and 25C ambien
Measured
ambient temperature.
Melting
0.0200.010
0.0200.
01
10
(0.510.25)
(0.51
0.25)
Recommended
Pad Layout
Inch (mm)
Max.
Interrupt Ratings
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
Figure FH1-FH2 Family

ily Pe
P
Performance
erfformance Curves for High-Current-Rated Chip Fuses
Fus
Figure FH1
Figure FH2
1206SFH Average Time Current Curves
A
1206SFH It vs. t Curves
20
10
A
12
A
15
A
11
10
10000
20A
15A
12A
10A
1000
It (As)
Clear Time (s)
0.1
0.01
100
10
0.001
10
100
Current (A)
1000
1
0.001
Please go to page 97 for more information for High-Current-Rated Chip Fuses.

88
HF Halogen Free
0.01
0.1
Time (s)
10
Surface-mount Fuses Slow-Blow Chip Fuses
Surface-mount Fuses
Slow-Blow Chip Fuses
Available in industry standard
rd 1206 and 0603 chip sizes,
TE Circuit Protections slow-blow
low-blow chip fuses help
provide
overcurrent
protection
tection
on
systems
that
experience large and frequent

ent current surges as part of
their normal operation.
The slow-blow chip fuses monolithic, multilayer design
helps provide some of the
he highest current ratings
available in the 1206 and 0603
603 footprints and enhancess
high-temperature performance
nce in a wide range of circuit
circu
uit
protection designs. The devices small size,
size
e, high
hig
gh
reliability and strong arc suppression charac
characteristics
cterisstic
ti s
make them suitable for overcurrent
rcurrent protection
protec
cti
tio
tion
on
n of power
po
ower
supplies, capacitor filter banks, LCD
Crystal
D ((Liquid
Liqu
uid
d Cr
C
rys
ysta
al
Display) backlight inverters,
ters, electric
ele
lectrric motors
mot
o o
orrs and
and
d
portable electronics.
Benefits
Features
Time-delayed design prevents

openings
ventts nuisance
nuissanc
n eo
pe
enings
in pulsed and high inrush current
applications
currrent a
ppl
p ic
catio
ons
ns

Halogen free
Small size with high-current

nt rati
rratings
a ing
gs
haract
c er
eristiics
Monolithic multilayer design
11
performanc
temperature range
Applications
Small motors systems
Power over Ethernet (POE)
Computer drives
Test equipment
Displays
Input power ports
POL converter protection
Printers
89
Table FS1 Clear Time

e Characteristics for Slow-Blow Chip Fuses
0603SFS Series
% of rated current
100%
200%
300%
800%(1.0A-1.5A)
800%(2.0A-5.0A)
Table FS2
1206SFS Ser
Series
rie
ies
Clear
ar time at 25C
4 hours (min.)
1 second (min.)
0.1
1 second (min.)
120 seconds (max.)

3 seconds (max.)
0.0005
5 second (min.) 0.05 seconds (max.)
0.001
1 second (min.) 0.05 seconds (max.))
% of rated
d ccurrent
urrent
100%
10
100
1
0 %
200%
%
300%
%
800
800%(1.0A-1.5A)
0%(1
(1
1.0A-1.5
0
5A))
800%(2.0A-8.0A)
800
0%((2.0A-8.0
0A))
C
Clear
lear time at 25C
4 hou
hours (min.)
1 seco
second (min.)
0.1
1 seco
second (min.)
120 seconds (max.)

3 seconds (max.)
0.0016
16 seco
second (min.) 0.05 seconds (max.)
0.0
0.
0
0.002
.002 seco
second (min.) 0.05 seconds (max.)
Typical Electrical
ectrical Characteri
Characteristics,
istic
is
cs, D
Dimensions
iim
men
men
e siions
s and
d Re
Recommended
eco
ommend
ded Pad Layout for
Slow-Blow
w Chip Fuses
0603 (1608mm) Slow-Blow

-Blow Chip Fuses
s
Shape and
Dimensions
Inch (mm)
0.0310.006
.006
(0.800.15)
0.15)
0.0630.006
0.0630.
3 006
30
6
(1.600.15)
(1.600.
00
0 15)
Pa
art Number
Numbe
mbe
b r
Part
0.0310.0
006
0.0310.006
1
(0.800.15)
Max.
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFS100F/32
06
603SF
SFS100F/32
SF
1.0
0.200
0.093
32
50
0603SFS150F/32
060
603SFS150F/32
60
1.5
0.100
0.18
32
50
0603SFS200F/32
2.0
0.052
0.32
32
50
0603SFS250F/32
2.5
0.041
0.63
32
50
0.110
0.1
110
(2.8
(2.80)
80)
0603SFS300F/32
3.0
0.031
0.87
32
50
0.0
0.024
024
(0.60)
(0.6
60)
0603SFS350F/32
3.5
0.021
1.20
32
50
0603SFS400F/32
4.0
0.017
2.30
32
50
0603SFS450F/32
4.5
0.015
2.70
32
50
0603SFS500F/32
5.0
0.013
3.20
32
50
0.0140.006
0.014
40.006
40
(0.360.15)
(0.3
360.15)
Recommended
Pad Layout
Inch (mm)
Typical Electric
Electrical
Characteristic
Characteristics
Nominal
Rated
Nominal
I2t
Current
Cold DCR
(A)
()*
(A2sec)
0.039
0.03
.0 9
(1.00)
(1.0
((1
1 0)
0.043
43
(1.09)
9)
1206 (3216mm) Slow-Blow

Blow Chip Fuses
11
Shape and
Dimensions
Inch (mm)
0.0630.008
(1.600.20)
0.1260.008
(3.200.20)
Part Number
Current
(A)
1.0
0.360
0.11
63
50
1.25
0.200
0.22
63
50
1206SFS150F/63
1.5
0.150
0.23
63
50
1206SFS200F/63
2.0
0.088
0.63
63
50
1206SFS250F/32
2.5
0.065
0.90
32
50
1206SFS300F/32
3.0
0.034
1.20
32
50
1206SFS350F/32
3.5
0.028
1.60
32
50
0.173
(4.40)
1206SFS400F/32
4.0
0.024
2.20
32
50
0.059
(1.50)
1206SFS450F/32
4.5
0.020
3.60
32
50
1206SFS500F/32
5.0
0.016
5.30
32
50
1206SFS550F/24
5.5
0.014
6.40
24
50
1206SFS600F/24
6.0
0.011
8.50
24
60
1206SFS700F/24
7.0
0.010
10.00
24
60
1206SFS800F/24
8.0
0.009
16.90
24
60
0.071
(1.80)
0.057
(1.45)

Voltage
(VDC)
1206SFS125F/63
0.0200.010
(0.510.25)
90
Max.
Interrupt Ratings
1206SFS100F/63
0.0380.008
(0.970.20)
Recommended
Pad Layout
Inch (mm)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
()*
(A2sec)
HF Halogen Free
Surface-mount Fuses Slow-Blow Chip Fuses
Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses

Figure FS1
A
2. 5
3.0A
A
3.5
A
4.0
A
4.5
A
5.0
A
2. 0
1.5
A
1.0
A
0603SFS Average Time Current Curves

100
Clear Time (s)
10
0.1
0.01
0.001
10
10
100
Current
Cu
urrent (A)
Figure FS2
0603SFS
0
060
3SFS It vs. t Curves
10,000
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1000
11
1.0A
I2t (A2s)
100
10
0.1
0.01
0.001
0.01
0.1
10
100
Time (s)
HF Halogen Free
91
Figure FS1-FS4 Family

ily Performance Curves for Slow-Blow Chi
Chip
ip F
Fuses
us
ses
Contd
Figure FS3
A
A
3.0
3.5A
4.0 A
4.5A
5.0 A
5.5A
6 .0 A
7.0 A
A
8 .0
A
2. 5
2. 0
1. 2
5A
1.5
A
1.0
A
1206SFS Average Time Curren

Current
nt Cu
C
Curves
rv
ves
100
10
Clear Time (s)
0.1
0.01
0.001
10
1000
100
Current (A)
Figure FS4
1206SFS It vs. t Curves
100000
8.0A
7.0A
6.0A
5.5A
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.25A
1.0A
10000
11
1000
I2t (A2s)
100
10
0.1
0.01
0.001
0.01
0.1
Time (s)
Please go to page 97 for more information for Slow-Blow Chip Fuses.
92
HF Halogen Free
10
100
NEW
The 2410(6125) is Wire-in Air SMD Fuse which is very

suitable for secondary level
vel overcurrent protection
applications.
These lead-free surface mount devices offer more
reliability and have no end cap falling off risk. Straightt
wire element in air performs
orms consistent fusing and
an
nd
cutting characteristics.
Benefits
Surface-mount Fuses 2410 Very Fast-Acting Fuses
Surface-mount
rface mount Fuses
rface-mount
2410
0 Very
V yF
Fast-Acting
Fast
tA
Acting
ti g Fuses
F
Features
Very fast acting at 200% overload

overrloa
ad current
currrent
ntt level
n
Halogen free, RoHS compliant and 100% lead-free
Excellent inrush current withs

withstanding
capability
sta
t ndin
ng c
apability
Copper or copper alloy compo

composite fuse link
High reliability and resilience

nce
Fiberglass enforced epoxy fus

fuse body

haracteristics
Wide range of current rating
Copper terminal with nickel and tin plated

(with de-rating)
11
Applications
Industrial equipment
Power supplier
Game systems
LCD/PDP TV
Telecom system
White goods
Backlight inverter
Networking
Automotive
93
Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses
% of rated current
100%
Clear time at 25C

4 hours (min.)
200% (0.5A-10.0A)
0.01 second (min.)
5 seconds (max.)
200% (12.0A-20.0A)
0.01 second (min.)
20 seconds (max.)
Table SFV2
Typical Electrical Characteristics, Dimensions

sa
and
nd
d Reco
Recommended
omm
mme
en
nded Pad Layout for
2410 Very
ry Fast-Acting Fuses
2410 (6125 mm) Very Fast-Acting Fuse

mm (Inch)
Recommended Pad Layout

mm (Inch)
Min
Max
Min
n
Max
Max
Min
n
Max
Max
Min
iin
n
Max
Ma
ax
6.86
(0.270)
5.95
6.25
1.96
6
2.36
2.36
36
36
0.97
0
.97
1.73
1.
1
73
2.34
2.64
2.6
64
2.95
(0.116)
A
C
mm
m
in
(0.234) (0.246)
(0.246
46)
46
(0.077)
(0
0.07
77) (0.093)
(0.0
093)
(0.038)
(0
0.038
8) (0.068)
(0
0.068)
(0.092)
(0.092) (0.104)
(0
0.10
04)
3.15
(0.124)
1.96
(0.077)
Typ
y ical El
lecttriccal Characteristics
Charracteristticss
Typical
Electrical
Markin
ng
Marking
Code
e
Rated
ed
d
Rated
Cu
Cur
C
u rent
Current
(A)
Nom
min
inal
Nominal
Co d DC
Col
D
R
Cold
DCR
()*
*
()*
Nomina
al
Nominal
I2t
2
ec)
(A ssec)
(VAC)
(VDC)
0.5
0.2310
3 0
31
0.2310
0.10
250
125
2410SFV0.63FM/125-2
0.6
6
0.1740
0.1740
7 0
0.16
250
125
2410SFV0.75FM/125-2
0.8
8
0.1480
0.1
1480
0.23
250
125
2410SFV1.00FM/125-2
1.0
0.0930
0.0930
0.59
250
125
2410SFV1.25FM/125-2
1.3
0.0700
0.96
250
125
2410SFV1.50FM/125-2
1.5
0.0620
1.19
125
125
2410SFV2.00FM/125-2
2.0
2.0
0.0420
2.75
125
125
2410SFV2.50FM/125-2
2.5
0.0310
1.21
125
125
2410SFV3.00FM/125-2
3.0
0.0249
1.73
125
125
2410SFV3.15FM/125-2
3.2
0.0232
2.20
125
125
2410SFV3.50FM/125-2
3.5
0.0220
2.50
125
125
2410SFV4.00FM/125-2
4.0
0.0172
4.10
125
125
2410SFV5.00FM/125-2
5.0
0.0143
5.90
125
125
Part Number
2410SFV0.50FM/125-2
11
Voltage
2410SFV6.30FM/125-2
6.3
0.0100
12.50
125
125
2410SFV7.00FM/125-2
7.0
0.0094
14.20
125
125
2410SFV8.00FM/125-2
8.0
0.0086
20.30
125
125
2410SFV10.0FM/125-2
10.0
0.0066
29.20
125
125
2410SFV12.0FM/065-2
12.0
0.0053
49.20
65
65
2410SFV15.0FM/065-2
15.0
0.0038
102.50
65
65
2410SFV20.0FM/065-2
20.0
0.0034
126.20
65
65
94
HF Halogen Free
Current
(A)
50A @ 250VAC
50A @ 125VDC
300A @ 32VDC
50A @ 125VAC
50A @ 125VDC
300A @ 32VDC
35A @ 125VAC
50A @ 125VDC
300A @ 32VDC
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
Surface-mount Fuses 2410 Very Fast-Acting Fuses
Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses
Figure SFV1
1.0
0A
1. 2
1.55 A
0A
2. 0
2. 5 0 A
0
3.0 A
3.1 0A
3.55 A
4.0 0A
5.0 0A
0A
6.3
7.0 0A
0
8 .0 A
10 0A
.
12 0A
.
15 0A
.0A
20
.0A
3A
5A
0.7
0.6
0.5
0A
2410SFV Average Time Current Curves
100
10
Clear Time (s)
0.1
0.01
0.001
1
0.1
0
10
100
1000
Current
Curr
Cu
ent (A)
Figure SFV2
2410SFV I2T vs. t Curves
20.0A
15.0A
12.0A
10.0A
8.00A
7.00A
6.30A
5.00A
4.00A
3.50A
3.15A
3.00A
2.50A
2.00A
1.50A
1.25A
1.00A
0.75A
0.63A
0.50A
100,000
10,000
1000
I2t (A2s)
100
11
10
0.1
0.01
0.001
0.01
0.1
10
100
Time (s)
Please go to page 97 for more information for 2410 Fast-Acting Fuses.
HF Halogen Free
95
11
96
Surface-mount Fuses - Specifications for All Fuses
Specifications, Packaging Information, Agency Approvals and

Part Numbering Systems for All Fuses
Table F1 Environmental Specifications for All Fuses
Operating temperature
-55C to +125C
Mechanical vibration
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Mechanical shock
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Thermal shock
Withstands 100 cycles from -65C to +125C when evaluated per Method 107 of MIL-STD-202
Resistance to soldering heat
Withstands 60 seconds at +260C when evaluated per Method 210 of MIL-STD-202
Solderability
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Moisture resistance
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Salt spray
Storage temperature
Storage humidity
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202

30C/ 85% RH
Per
e MIL-STD-202F
S
0 , Method
et od 106F
06
Table F2 Material Specifications

fications for All Fuses
Construction body material
Termination material
Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410)

Silver, Nickel, Tin
Fuse element
Silver(1206/0603/0402); Copper/Copper Alloy (2410)

0))
0
Figure F1 Thermal Derating

ting Current for All Fuses
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
2410
241
24
2
410 Series
Se
Temperature
Tem
mpe
eratture Effect
Efffect on
o Current Rating
110
0
105
5
11
100
0
95
5
90
0
De-rating
% DeDe
De ra
rrati
a ing
at
ng
% De-rating
1206/0603/0402
603/0402 Series
Temperature Effect
ffect on Current Rating
85
5
80
75
70
65
5
60
55
-35
-15
25
45
65
5
85
105
5
125
145
50
-55
-35
Maximum Operating
eratin
ng Temperature
Te
emp
pera
p
e atture
tu
u (C)
C
C
-15
25
45
65
85
105
125
Maximum Operating Temperature

T
(C)
Table F3 Electrical Specifications

cific
cation
ns fo
fforr All Fuses
Insulation resistance after opening
g
20,000
20,0
000 minimum @ rated voltage. Fuse clearing under low voltage condit
conditions may result in lower post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide
sufficient insulation resistance for circuit protection.
Current carrying capacity
Withstands 100% rated current at +25C ambient for 4 hours when evaluated per MIL-PRF-23419.
HF Halogen Free
97
Table F4 Packaging Information for All Fuses

Size
Reel Quantity
(pcs)
Reel Diameter
Reel Width
Carrier
Tape Size
Typ
ype
yp
Tape Type
Reels per Outside

Shi
Shipment Box
Outside Shipment
Boxes per Overpack
0402(1005)
10,000
178mm white plastic
9.0 0.5mm
8.00 0.10mm
Paper
Pape
a r
1 to 10
0603(1608)
4,000
178mm white plastic
9.0 0.5mm
8.00 0.10mm
Paper
Pa
1 to 10
0603SFV(1608)
6,000
178mm white plastic
9.0 0.5mm
8.00 0.10mm
m
Pa
Paper
perr
1 to 10
1206(3216)
3,000
178mm white plastic
9.0 0.5mm
8.00 0.
0.10mm
.10
10m
1
0mm
Pl
P
Plastic
asticc
1 to 10
2410(6125)
2,000
178mm white plastic
13.4 0.5mm
12.00
0 0.10mm
m
Pla
P
Plastic
laasticc
1 to 10
Figure F2 Recommended
nded Soldering Tempera
Temperature
atture
a
eP
Profile
ro
ofile
e fo
ffor
or A
All
lll F
Fuses
use
es
p
tp
Crittical Zone
Critical
e
TL to
o Tp
Tp
up
Ramp
am u
p
Temperature
Temperature
re
e
TL
tL
T
sMAX
Ts
T
sMINN
Ts
ts
s
Preheat
Prehe
eat
25
Ramp down
25C
Peak
t 25
5C to P
eakk
Time
Reflow
Profile
Reflo
e w Pro
eflo
file
Classification Reflow Prof

Profiles
file
es
Profile Feature
Average ramp up rate (TsMAX
o Tp)
AX to
Preheat
Temperature min. (TsMIN)
Temperature max. (TsMAX)
Time (tsMIN to tsMAX)
Time maintained above:
Temperature (TL)
11
1206/0603/0402
3C/second max.
2410
3C/second max
max.
150C
200C
60-180
60 180 seconds
150C
200C
40-100
40 100 seconds
217C
200C
Time (tL)
Peak/Classification temperature (Tp)
Time within 5C of actual peak temperature
60-150 seconds
260C max.
30-90 seconds
250C max.
Time (tp)
From 25C to preheating (150C)
Ramp down rate
20-40 seconds
8 minutes max.
4C/second max.
30-40 seconds
40-100 seconds
Natural cooling
Recommended conditions for hand soldering:

1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280C /10s or 350C / 3s.
98
HF Halogen Free
Dimension in inches (mm)

Mark
0402 (1005)
0603 (1608)
1206 (3216)
0603SFV (1608)
2410 (6125)
E1
0.069 0.004
0.069 0.004
0.069 0.004
0.069 0.004
0.069 0.004
(1.75 0.10)
(1.75 0.10)
(1.75 0.10)
(1.75 0.10)
(1.75 0.10)
0.138 0.002
0.138 0.002
0.138 0.002
0.138 0.002
2
0.217 0.004
(3.50 0.05)
(3.50 0.05)
(3.50 0.05)
(3.50 0.05)
0.0
0
..05)
(5.50 0.10)
0.315 0.004
0.315 0.004
0.315 0.004
0.315
5 0.004
0.0
004
0.472 0.004
(8.00 0.10)
(8.00 0.10)
(8.00 0.10)
(8.00
((8
(8.
8 00 0.10)
(12.00 0.10)
P1
0.079 0.004
0.157 0.004
0.157 0.004
0.157
0.157 0.004
0.0
004
0.157 0.004
(2.00 0.10)
(4.00 0.10)
(4.00 0.10)
(4.00
(4.00 0.10)
0.10)
(4.00 0.10)
P0
0.157 0.004
0.157 0.004
0.157 0.004
0.157
0.157
57 0.004
5
0.0
004
0.157 0.004
(4.00 0.10)
(4.00 0.10)
(4.00 0.10)
0.1
10)
(4.00
00 0.10)
(4.00 0.10)
P2
0.079 0.002
0.079 0.002
0.079 0.002
0.0
002
2
0.079
79 0.002
0.0
002
0.079 0.004
(2.00 0.05)
(2.00 0.05)
(2.00
(2
2.00 0.05)
0.0
05)
(2.00
00 0.05)
0.0
05)
(2.00 0.10)
D0
0.059 0.004
0.059 0.004
0.059
0.059 0.004
0.0
0
004
4
0.059
59 0.004
0.0
004
0.059 0.004
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10
(1.50+0.10/-0.00)
0/-0.00
0)
(1
(1.50+0.10/-0.00)
1.50+
+0.1
10/-0
0.00)
(1.50+0.10/-0.00)
0.039
0.0
.03
.0
39 m
max
ax
0.61 0.004
0.010 0.002
0.039
0.039
39
9 0.004
0.112 0.004
D1
(1.00
(1
1.00
0m
max)
ax)
t
(1.55 0.10)
0.009
0.0
009 0.001
0.0
A0
0.026 0.004
0.039
0.0
03
39 0.004
0.0
004
0.071
0.0
071 0.004
0 04
0.0
4
(0.67 0.10)
(0.98
9 0.10)
98
0.10
0)
(1.80 0.10)
0.1
0
. 0)
(0.98 0.10)
(2.85 0.10)
B0
0.046 0.004
0.071
71 0.004
0.00
04
0.138
0.1
138
8 0.004
0 04
0.0
0.071 0.004
0.252 0.004
(1.17 0.10)
(1.80
( 80
(1.
0 0.10)
0.1
10)
(3.50
(3
3.50
0 0.10)
0. 0)
0.1
(1.80 0.10)
(6.40 0.10)
K0
0.025 0.004
0.037
0.0
. 37
7 0.003
0.050 0.004
0.0
004
0.024 0.003
0.093 0.004
(0.63 0.10)
(0.95
(0
0.95
5 0.08)
(1.27 0.10)
0.1
10)
(0.60 0.08)
(2.35 0.10)
(0.23
(0
0.23 0.02)
0.0
(0.25 0.05)
Table F5 Tape and Reel Specifications for All Fuses
Figure F3 Component Tape

e Dimensions
Dim
men
e siions ffor
or A
All
ll Fuses
Paper
P
aperr Carrier
Carrier Tape Specifications
P0
D0
11
P2
E1
F
W
B0
P1
D1
A0
K0
Plastic Carrier Tape Specifications

D0
P0
P2
E1
F
W
B0
D1
HF Halogen Free
P1
A0
K0
99
Figure F4 Reel Dimensions for All Fuses
Dimension
Description
Hub outer diameter
Dimension (mm)
Mark
1206/0603/0402
2410
60
60.2
Reel inside width
W1
13.4
Reel outside width
W2
11.4
16
Tape width
W2
8
W1
Agency Approvals for

or All Fuses
UL
File # E197536
97536
Part Numbering System

em for Fast-Acting, Slow
Slow-Blow
w-Blo
ow A
And
nd
d 060
0603
03 V
Very
ery Fa
Fast-Acting
ast
st--A
Acti
Chip Fuses
1206 SF F 400 F / 24
4 -2
Packag
Packaging
gin
ng
-2 = Tape
Tap
T
a e and
and Reel
Re
eel
Voltage
Vo
Volt
ttag
ag
ge Rating
Rating
R
24
4 = 24V
24
4 DC
Spe
Special
pe
p
ecia
ial
ia
a Code
Co
Code
F = RoHS
RoHS
HS
S Compliant
C mpliant
Com
nt
nt
FM = RoHS
RoHS Compliant
Comp
mpl
p iant + Marked
Marrked Part
Part
Rated
Current
Rat
ated
at
te
ed
dC
urrrent
urr
entt
050
0.50 Amps
05
50 = 0.
Amps
mps
400
40
00 = 4 Amps
Amps
Fuse
Fus
usse Blow
u
B
Blo
Bl
low Type
Type
pe
p
e
F = Fast
Fasst Acting
Act
ctt
cting
S = Slow
w Blow
Blow
11
SF = Surface Mount Fuse

Size
S e (1206, 0603, 0402)
Siz
Part Numbering System

em for High-Current-Rated Chip Fuses
1206 SF H 100 F / 24 -2
Packaging
-2 = Tape and Reel
Voltage Rating
24 = 24VDC
Special Code
F = RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
100 = 10 Amps
Fuse Blow Type
H = High Current
Size (1206)
100
HF Halogen Free
2410 SF V 6.30 FM / 125 -2
Packaging
-2 = Tape and Reel
Voltage Rating
125 = 125VDC
Special Code
F = RoHS Compliant
M = Marked Part
Rated Current
6.30= 6.30 Amps
Fuse Blow Type
V = Very Fast Acting
Fus
usse
Size (0.24*0.10
0 inch)
inch
h)
Part Numbering System for 2410 Very Fast-Acting Fuses
11
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and
test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies
(TE) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TEs only obligations
are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or
consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In
addition, TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without
notification to Buyer.
HF Halogen Free
101
11
102

Surface Mount Fuses Fundamentals

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Surface-mount Fuses Fundamentals

Multi-layer Design for Chip

Single Fuse Glass

Wire-In-Air Design for 2410SFV

Straight wire element

Pulse Cycle Derating

Once the I2t value for the a

Fuse selection seems straightforward,

Fuse Selection Flowchart

Apply Standard Steady

Step 7 Select Fuse Current Rating

Step 8 Check Voltage Rating

Pulse Tolerant chip fusess has high inrush current

Surface-mount Fuses Pulse Tolerant Chip Fuses

High inrush current withstanding

Lead free materials and RoHS compliant

Ceramic Monolithic structure

Silver fusing element and silve

Monolithic, multilayer design

Excellent temperature stability

Strong arc suppression characteristics

-55C to +125C operating temperature range

Table FP1 Clear Time

Clear time at 25C

0.0002 second (min.)

Table FP2 Typical Electrical

Shape and Dimensions

1206 (3216 mm) Pulse

* Measured at 10% of rated current and 25C ambient temperature.

RoHS Compliant, ELV Compliant

Surface-mount Fuses Pulse Tolerant Chip Fuses

0603SFP Average Time Current Curves

Clear Time (s)

Note: Curves are nominal

RoHS Compliant, ELV Compliant

1206SFP Average Time Current Curves

Clear Time (s)

Note: Curves are nominal

RoHS Compliant, ELV Compliant

Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses

Very Fast-acting chip fuses help provide overcurrent

Very fast acting at 200% and 30

Excellent inrush current withs

Thin body for space limiting

Monolithic, multilayer design

Glass ceramic monolithic structure

Silver fusing element and silve

(refers to: Br900ppm, Cl900

RoHS compliant and lead-free

Clear time at 25C

0.01 second (min.)

0.001 second (min.)

0.2 seconds (max.)

ectrical Characteristics and Dimensions for

Shape and Dimensions

Max. Interrupt Ratings

(0.057) (0.069) (0.009) (0.019)

Figure FV1-FV2 Family

0603SFV It vs. t Curves

Clear Time (s)

Note: Curves are nominal

RoHS Compliant, ELV Compliant

Fast-acting chip fuses help provide

Surface-mount Fuses Fast-Acting Chip Fuses