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INTRODUCTION TO
INTEGRATED CIRCUIT
CHAPTER 1
By : Pn.Puteri Nadia Dayanie Bt Megat Sabri

Pn Puteri Nadia Dayanie Bt Megat Sabri

Learning Outcome
Understand

integrated circuit technology

Know the classification of integrated
circuit

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Revolution of handphone

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1.1.1 - What is Integrated Circuit

is

a miniaturized electronic circuit

(consisting mainly of semiconductor
devices, as well as passive components)
that has been manufactured in the
surface
of
a
thin
substrate
of
semiconductor material

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1.1.2 Function of IC

Miniaturization - is to replace many separate electronic

components to be a single component that can
perform high - level tasks such as amplification, signal
processing, or even sophisticated digital calculations as
in the case of microprocessors.

cost

reduction-

alternative

to

to

provide

gathering

relatively

huge

cheap

amount

of

semiconductor parts and electrical parts, and mounting

on a circuit board and soldered.

performance - is the lowered power consumption

which brings higher power efficiency.
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1.1.2 Application of Integrated Circuit

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Missile system
Television / radio / video
Computer
Work station
Server
Toys
Hand phone
Telecommunication
Robotic
Digital watch
Aerospace
Medical

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1.1.2 - Function of IC packages

PURPOSE
to cover the entire IC built by plastic containers,
ceramic and metal
FUNCTIONS
i.
allows the IC is connected and easy to use with
an electronic board
ii.
provide physical protection to the IC internal
structure such as gold wires, silicon chips and
circuits from damage or scratches
iii.
provide protection against moisture, gas and
chemicals that exist in the environment
iv. ensure that IC is in a form that can be marketed
v.
ensure that the IC in the form of an easy to use

1.1.3 - Comparison between IC and

discrete circuit

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Why silicon

Semiconductor devices are of two forms

(i)Discrete Units
(ii)Integrated Units
Discrete Units can be diodes,transistors,etc.
Integrated Circuits uses these discrete units to make one
device.
Integrated Circuits can be of two forms
(i)Monolithic-where transistors,diodes,resistors are
fabricated and interconnected on the same chip.
(ii)Hybrid-in these circuits, elements are discrete form
and others are connected on the chip with discrete
elements externally to those formed on the chip
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What is the main purpose of Integrated Circuit?

Make

things become smaller

Advantages: Easy to carry, save power, save cost,
number of discrete parts can be reduced, Circuit
boards can be smaller, less power, and cost less to
produce-increase performance.

Take Note!!
CMOS = Complementary Metal Oxide
Semiconductor
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1.1.3 - Advantages of using IC over

Discrete component (cont)
i.
ii.

iii.

iv.

Size: Sub-micron vs. millimeter/centimeter.

Speed and Power:
Smaller size of IC higher speed and lower
power = smaller parasitic resistances,
capacitances and inductances = less heat
cheaper power supplies (reduced system
cost)
Integrated circuit manufacturing is
versatile Simply change the mask to
change the design.
Light and easily replaceable

Introduction
My name is
Gordon Moore..
Intels co
finder..

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Moores Law
Moores

Law

The maximum number of transistors on a

chip doubles every 18 months.
This implies the chip on the transistor
has increase one million times in three
decades and has reached 30 million
transistors (in microprocessors)

1.1.5 Figure 1.1: Moores law of scaling. The number of transistors on a chip has been
increasing exponentially

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IC chip size and circuit complexity

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1.2 - Classification of Integrated

Circuits

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An integrated circuit (IC) consists of several interconnected

transistors, resistors, capacitors etc.,
All contained in one small package with external connecting
terminals.
The circuit may be entirely self-contained, requiring only
input and output connections and supply voltage to function.
Alternatively, a few external components may have to be
connected to make the circuit operative.
On the basis of fabrication techniques used, the ICs can be
divided into following three classes.

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1.2.1 - Classification of Integrated

Circuits
Fabrication Technique

1.2.1 - Classification of Integrated Circuits

Thin film technology and thick film technology offer greater design freedom with respect to physical realization of
passive components, resistors and capacitors, in the sense that
greater range of component values, closer tolerances and lower
temperature coefficients can be achieved.
Monolithic
integrated circuits, all circuit components, both active and passive
elements and their interconnections are manufactured into or on
top of a single chip of silicon.
identical circuits are required in very large quantities and hence
provides lowest per-unit cost and highest order of reliability.
Hybrid
separate component parts are attached to a ceramic substrate
and interconnected by means of either metallization pattern or wire
bonds. This technology is more adaptable to small quantity custom
circuits.
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HYBRID

Hybrid - Multichip IC
the circuit is fabricated by interconnecting a number of
individual chips.
The active components are diffused transistors or diodes. The
passive components may be group of diffused resistors or
capacitors on a single chip, or they may be thin-film
components. Wiring or a metalized pattern provides
connections between chips
widely used for high power audio amplifier applications from 5
W to more than 50 W
. The structure of a hybrid Like thin- and thick-film ICs, hybrids
ICs usually have better performance than monolithic ICs.
Although the process is too expensive for mass production,
multi-chip techniques are quite economical for small quantity
production and are more often used as prototypes for
monolithic ICs.
Based upon the active devices employed the ICs can be
classified as bipolar ICs using bipolar active devices (BJT) and
unipolar ICs using unipolar active devices like FET.
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Monolithic

The word monolithic is derived from the Greek monos,

meaning single and lithos, meaning stone.
Thus monolithic circuit is built into a single stone or single crystal
i.e. in monolithic ICs, all circuit components, (both active and
passive) and their interconnections are formed into or on the
top of a single chip of silicon.
This type of technology is ideal for manufacturing identical ICs
in large quantities and, therefore, provides lowest per unit cost
and highest order of reliability.
Monolithic ICs are by far the most common type of ICs used in
practice, because of mass production, lower cost and higher
reliability.

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THIN- FILM

These devices are larger than monolithic ICs but smaller than discrete circuits.
These ICs can be used when power requirement is comparatively higher. With a
thin-or thick-film IC, the passive components like resistors and capacitors are
integrated, but the transistors and diodes are connected as discrete components to
form a complete circuit. Therefore, commercially available thin- and thick-film
circuits are combination of integrated and discrete components. The essential
difference between the thin- and thick-film ICs is not their relative thickness but the
method of deposition of film. Both have similar appearance, properties and general
characteristics.
Thin-film ICs -are fabricated by depositing films of conducting material on the
surface of a glass or ceramic base. By controlling the width and thickness of the
films, and by using different materials selected for their resistivity, resistors and
conductors are fabricated.
Thick-film ICs - referred to as printed thin-film circuits. In their manufacturing process
silk-screen printing techniques are used to create the desired circuit pattern on a
ceramic substrate. The screens are actually made of fine stainless steel wire mesh,
and the inks are pastes having conductive, resistive, or dielectric properties. After
printing, the circuits are high temperature-fired in a furnace to fuse the films to the
substrate. Thick-film passive components are fabricated in the same way as those in
thin-film circuits. As with thin-film circuits, active components are added as separate
devices . A portion of thick-film circuit is given in figure. ICs produced by thin-or thick
film techniques have the advantages of forming passive components with wider
range and better tolerances, better isolation between their components, greater
flexibility in circuit design and of providing better high-frequency performance than
monolithic ICs. However, such ICs suffer from the drawbacks of larger physical size,
comparatively higher cost and incapability of fabrication of active components .

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1.2.2 Comparison on integrated

circuit fabrication method

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1.2.3 Monolithic Fabrication Method

1.
2.
3.
4.
5.
6.
7.
8.
9.

Silicon wafer (substrate) preparation

Epitaxial growth
Oxidation
Photolithography
Diffusion
Ion implantation
Isolation technique
Metallization
Assembly processing & packaging

1.2.4 - Comparison between

different types of transistor

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P+

p
n+

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1.2.6 (characteristics)

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Bipolar high power and speed faster but high

cost and requires more area.
CMOS high density but low power and slower.
BiCMOS is the combination between Bipolar and
MOS transistor.

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1.2.6 (Explaination)

CMOS circuits utilize complementary MOSFETs, i.e;

NMOS and PMOS devices together in various patterns to
create functional blocks like AND or OR gates.
However the problem with these types of CMOS circuits
is that they are inherently low power circuits. They
cannot handle large currents.
So when your block needs to have a large fan out
(need to drive a large no of outputs, i.e; more current
required) which CMOS circuits fail.
That is why we use BiCMOS. They are very similar to
CMOS circuits except for the BJT(Bipolar Junction
Transistor) output stage.
BJTs are capable of carrying large currents, hence
BiCMOS circuits are used in cases of large current
requirements

Advantages of CMOS over Bipolar

Since CMOS device consumes less power than bipolar

counterpart, CMOS devices enables to pack more functions in
the same wafer using the same manufacturing technology,
thus reducing the manufacturing cost and running at faster
speed.
easier to design
high noise immunity and low static power consumption.

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Advantages of Bipolar over

CMOS
Switching

speed
Noise perfomance
Analog capability
Input/output speed

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Advantages of BiCMOS
Technology
Improved

speed over CMOS

Lower power dissipation than Bipolar
Flexible input/outputs
High performance analog
Latch up immunity

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1.2.7- IC Classification
There are two types of integrated circuit :Analog (linear)

filled with continuous analog signals

used in amplifiers, timers and oscillators such as light, temperature,

sound, electrical fields, and magnetic fields.
Because analog signals are continuous and represent far more values that
their digital counterparts they are more susceptible to being altered by
external forces (called noise)
i.

Digital (logic)
used in microprocessors and memories
Use binary mathematics to process "one" and "zero" signals through logic
gates, flip-flops, and multiplexers. Digital ICs can be generally be
classified into three types
1)
Processor (microprocessor, microcontroller, or DSP)
2)
Logic Gates
3)
Random Access Memory (RAM)

ii.

1.2.8 Analog IC
Operational

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Amplifier.

An operational amplifier is a direct coupled high gain amplifier

consisting of one or more differential amplifiers, followed by a level
translator and an output stage.

It is a versatile device that can be used to amplify ac as well as dc

input signals & designed for computing mathematical functions such
as addition, subtraction, multiplication, integration & differentiation

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Op-amp symbol
+5v
Non-inverting input
2
7

0utput
6

inverting input

4
-5v

1.2.8 Analog IC (contd)

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555 Timer

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1.2.8 Analog IC (contd)

555 Timer

The 555 timer is an integrated circuit specifically designed to

perform signal generation and timing functions.

Application of 555 timer

1.
2.
3.
4.
5.
6.
7.
8.
9.

astable multivibrator
monostable multivibrator
Missing pulse detector
Linear ramp generator
Frequency divider
Pulse width modulation
FSK generator
Pulse position modulator
Schmitt trigger

1.2.9 - Digital IC Determination

IC chips can be categorized into 2 main groups;

Memory
Microprocessor

Memory
Stored data in term of electric charge
Two types of memory ( Volatile and Non-Volatile)

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Volatile memory
Dynamic Random Access Memory, DRAM
S Random Access Memory, SRAM
Non Volatile Memory
Erasable Programmable Read Only
Memory, EPROM
FLASH

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1.2.9 - Digital IC Determination (contd)

Also called central processing unit (CPU) consists of 2

components;
a controller
arithmetic logic unit (ALU).

CPU is the brain of computers and other control

system.
2 types of architecture;
complete instruction set computer (CISC) IBM
compatible
reduced intruction set computer (RISC) Apple

The END..thAnK YOU

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