LED Lamp SolderingHandling

Cree High-Brightness LED
Soldering & Handling

Features
The purpose of this document is to provide customers and users with a clear understanding about the ways to use
our LED lamps appropriately.
Description
Generally, LEDs can be used the same way as other general-purpose semiconductors. When using Crees Lamps,
the following precautions must be taken to protect the LED.
P2 and P4 LEDs
1. Cleaning

Dont use unspecified chemical liquids to clean the LED; the chemical could harm the LED. When washing is
necessary, please wipe the LED with alcohol at normal room temperature and dry at normal room temperature
for 15 minutes before use.
The influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the way the
LEDs are mounted. Ultrasonic cleaning should be pre-qualified to ensure this will not cause damage to the
LEDs.
01 Rev 20
e: CLD-CTAP0
Application Not
2. Forming

During leads forming, the leads should be bent at a point at least 3 mm from the base of the package.
Dont form the leads during or after soldering. If forming is required, this must be done before soldering.
Avoid stressing the LED package during leads forming.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the
LEDs.
3. Storage

25C and <40%RH in proper package
4. Soldering

A minimal cathode pad area of 0.18 0.18 inches squared is recommended for P2 LEDs and 0.18 0.18
inches squared 2 for P4 LEDs.
Soldering LEDs at not less than 3 mm from the base of the package and below the tie-bar is recommended.
The LED soldering specification is shown below (suitable for both leaded solder & lead-free solder).
Subject to change without notice.

www.cree.com/ledlamps
Manual Soldering
Solder Dipping
Soldering iron
35 W max
Preheat
110C max
Temperature
300C max
Preheat Time
60 seconds max
Solder-bath
temperature
260C Max
Soldering time
3 seconds max
Dipping time
3 seconds max
Position
Not less than 3 mm from the base of

the package.
Position
Not less than 3 mm from the base of the

package.
Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.
The recommended wave soldering is as below:
Document No.: CREE-05-0057

Rev. NO. :
16
300
laminar wave
Temperature
250
200
150
100
Fluxing
50
30
0
Prehead
Pre-heat
10
20
30
40
50
Solder = Sn63-Pb37
Solder
60
70
Times(sec)
80
90
100
110
120
Solder = Lead-free
Peak Preheat Temperature

100~110C.
Peak preheat temperature
100~110C
Peak Preheat Temperature 100~110C.
Total Preheat time 50~

60preheat
second.time
Total
Total
Preheat time 50~ 60 second.
50~60
seconds
Peak Profile Fit Temperature

235C
(max 245C).
Peak profile
temperature
260C
(max)
Peak
Profile Temperature 260C (max)
Dwelldo
time
Dwell Time above 200C
not above
excess200C
3s.
Do not
exceed
3 above
seconds
Dwell
Time
200C do not excess 3s.
sheet)parts, refer to product spec)

(For individual parts,(For
referindividual
to productparts,
spec)refer to the product
(Fordata
individual
lead-free
solder
differentSolder
solder
conditions.
Please
contact
usfor
for details.
Different lead-free
Solder
is inrequires
need of different
conditions.
Please
contact
with us
* Different
the details.
Do not apply any stress to LED package particularly when heated.
The LEDs must not be re-used once it has been extracted from PCB.
After soldering the LEDs, the package should be protected against mechanical shock or vibration until the LEDs reached
Precautions must be taken as mechanical stress on LED may be caused by PCB warpage or from the clinching and
40C or below.
cutting of the LED leads.
When clamping of LEDs during soldering is required, it is important to ensure no mechanical stress exerted on the LEDs.
Lead cutting must be performed at normal room temperature. Lead cutting at elevated temperature may lead to LED
Copyright failures.
2011-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc.
24.
CLD-CTAP-001
Rev 20 and Surge current
Electrostatic
Discharge
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
Do not apply any stress to the LED package, particularly when heated.
The LEDs must not be re-used once they have been extracted from PCB.
After LED soldering, the package should be protected against mechanical shock or vibration until the LEDs have
reached 40C or below.
Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching
and cutting of the LED leads.
When clamping of LEDs during soldering is required, it is important to ensure no mechanical stress is exerted on
the LEDs.
Lead cutting must be performed at normal room temperature. Lead cutting at an elevated temperature may lead
to LED failures.
5. Electrostatic Discharge and Electrical Overstress

Electrostatic discharge (ESD) or electrical overstress (EOS) may damage LEDs.
Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling the
LEDs.
All devices, equipment and machinery must be properly grounded.
It is recommended to perform electrical tests to screen out ESD failures at final inspection.
It is important to eliminate the possibility of electrical overstress during circuitry design.
6. Heat Management

Heat management of LEDs must be taken into consideration during the design stage of an LED application. The
current should be de-rated appropriately by referring to the de-rating curve included in each product specification.
The temperature surrounding the LED shouldnt be so high that it will make the LED fail when used in an application, and the temperature surrounding the LED in the application should conform to the de-rating curve in our LED
specification documents.
7. Other Notes

Care must be taken so that reverse voltage will not exceed the absolute maximum rating.
The leads are plated with solder. Leads will become tarnished if in contact hydrogen sulfide and other gaseous
chemicals. Precautions must be taken to maintain a clean storage atmosphere.
The power of high-brightness LEDs is very strong and may injure human eyes. Precautions must be taken such as
avoiding looking directly into lit LEDs.
3-mm conventional LEDs are not auto-insertable.
Copyright 2011-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
SMD LEDs
1. Cleaning

Dont use unspecified chemical liquids to clean an SMD LED; the chemical could harm the SMD LED. When washing is necessary, please wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
The influence of ultrasonic cleaning on the SMD LED depends on factors such as ultrasonic power and the way the
SMD LEDs are mounted. Ultrasonic cleaning should be pre-qualified to ensure this will not damage the SMD LED.
2. Moisture-Proof Packing

In order to prevent moisture absorption into the SMD LEDs during the transportation and storage, the LEDs are
packed in a moisture barrier bag. Desiccants and a humidity indicator are packed together with the SMD LEDs as
secondary protection. The humidity-indicator card indicaties the humidity within the SMD packing.
3. Storage

Do not open the sealed bag before you are ready to use the products.
Shelf life in the original sealed bag at the storage condition of < 40C and < 90% RH is 12 months. Baking is required whenever shelf life is expired.
Before opening the sealed bag, please check whether or not the bag leaked air.
After opening the sealed bag, the SMD LED must be stored under the condition 30C and 60%RH. Under
these conditions, the SMD LEDs must be used (subject to reflow) within 24 hours after bag opening, and baking is
required when exceeding 24 hours.
For baking, place the SMD LEDs in an oven at 80C5C and relative humidity <=10% RH for 24 hours.
Take the material out of the packaging bag for baking. Do not open the oven door frequently during the baking
process.
Please refer to the product specifications for more detailed information.
4. Soldering
Manual soldering by soldering iron

Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.
If manual soldering is necessary, the use of a soldering iron of less than 25 W is recommended, and the temperature of the iron must be kept at below 315C, with soldering time within 2 seconds.
The epoxy resin of the SMD LED should not contact the tip of the soldering iron.
No mechanical stress should be exerted on the resin portion of the SMD LED during soldering.
Handling of the SMD LED should be done when the package has been cooled down to below 40C or less. This is
to prevent LED failures due to thermal-mechanical stress during handling.
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
Reflow Soldering

The temperature profile for all Cree High-Brightness SMD LEDs (except CLV6A/CLX6A/CLVBA/CLMVB) is shown
below:
Temperature
Melting point
Pre-heat
Reflow
Cooling
Time
Solder
Average ramp-up rate
4C/second max.
Preheat temperature
150C~200C
Preheat time
120 seconds max.
Ramp-down rate
6C/second max.
Peak temperature
250C max.
Time within 5C of peak temperature
10 seconds max.
Duration above 217C
60 seconds max.
The temperature profile for CLV6A/CLX6A/CLVBA/CLMVB LEDs is shown below:
Temperature
Melting point
Pre-heat
Soak
Reflow
Cooling
Time
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
wn rate = 6C/s max.
Ramp-down rate = 6C/s max.
erature = 230C max.
Peak temperature = 250C max.
n 5C of actual Peak Temperature = 10s max.
Time within 5C of actual Peak Temperature = 10s max.
bove 183C is 60s max.
Duration above 217C is 60s max.

Solder
LP6-NPP1-01-N1
Low Lead-free
amp-up rate = 3C/s max.
mperature = 130C ~170C
me = 120s max.
wn rate = 6C/s max.
erature = 213C max.
Average ramp-up rate
4C/s max.
Preheat temperature
150C~200C
Preheat time
120 seconds max.
Ramp-down rate
6C/s max.
Peak temperature
235C max.
Time within 5C of peak temperature
10 seconds max.
Duration above 217C
45 seconds max.
n 3C of actual Peak Temperature = 25s max.
bove 200C is 40s max.

The units in the graphs below are in millimeters (mm).
nded solder pad design for heat dissipation (2-pin SMD LED):
LM1 series recommended solder-pad design for heat dissipation:
7.0
0.5
7.5
4.5
2.6
1.5

Rev. NO. :
16
Recommended solder pad design for heat dissipation (4-pin SMD LED)
6/9
LM4 & LM2 series recommended solder-pad
design for heat dissipation:
7.5
0.5
4.5
Recommended solder pad design for heat dissipation (4-pin SMD LED of CLV1A & CLA1A series)
0.5
0.5
4.5
1.5
1.1
3.3
7.0
2.6
0.4
0.5
1.1
0.4
3.3
2.6
3.3
1.5
2.5
CLD-CTAP-001 9.5
Rev 20
1.5
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
0.4
3.3
1.1
1.1
2.6
2.6
3.3
0.4
3.3
0.4
3.3
4.5
1.5
1.1
LV1 & LA1 & LVB series recommended solder-pad design for heat dissipation:
Recommended solder pad design for heat dissipation (4-pin SMD LED of CLV1A & CLA1A series)
Recommended solder pad design

(4-pin SMD LED of CLV1A & CLA1A series)
0.5for heat dissipation 0.5
4.5 & CLA1A series)

Recommended
solder pad design
0.5 for heat dissipation (4-pin SMD LED of CLV1A
0.5
0.5
0.5
9.5
2.6
1.1
1.5
2.5
2.6
2.6
7.0
1.5
1.1
2.59.5
1.5 3
1.5
7.0
2.5
4.5
3.3
0.5
3.3
3.3
7.0
1.5
0.4
4.51.5
0.5 4
1.1
0.5
0.4
0.4
Recommended solder pad design for heat dissipation (Side SMD)

9.5design for heat dissipation:
LS1 series recommended solder-pad
Recommended solder pad design for heat dissipation
10.0 (Side SMD)
4.2
4.6
Recommended solder
pad design for heat dissipation (Side SMD)
10.0
4.2 1.7
10.0
1.7
4.5
4.2
0.8
3.7
3.7
0.8
1.7
4.5
4.5
4.5
4.5
4.6
3.7
4.6
4.5
0.8
0.8
0.8
0.8 SMD )
Recommended solder pad design for heat dissipation (6-pin
8.4
Recommended solder pad design for heat dissipation (6-pin SMD )
LP6 series recommended solder-pad design for heat dissipation:
6
1
8.4
Recommended solder pad design for heat dissipation

(6-pin SMD )
3.0
DETAIL A
3.0
Note:
Note:
Metal area at 1, 2, 3 should not
2.0 1.6 2.0
2.0 1.6 2.0
2.0 1.6 2.0
6.6
0.5
6.6
0.5
8.4
6.6
0.5
be less
each for
Metal area
at 1,than
2,Note:
3 40mm
should not
2
heat
dissipation.
be less sufficient
than 40mm
each
for at 1, 2, 3 should not
Metal
area
2
sufficient heat dissipation.
be less than 40mm each for
4
NOTE:3
3.0
DETAIL A 2
A
Metal area on 1 2 3 should not be less than 40mm for efficient
NOTE: heat dissipation
DETAIL A
2
Metal area on 1 2 3 should not be lessA than 40mm for efficient
NOTE:
heat dissipation
2
Metal area on 1 2 3 should not be less than 40mm for efficient
heat dissipation
7/9
7/9
7/9
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778

Rev. NO. :
16
LM6 series recommended solder-pad design for heat dissipation:
Rev. NO. :
16
Recommended solder pad design for heat dissipation (Small 6-pin SMD LM6 series )
Recommended solder pad design 9.4
for heat dissipation (Small 6-pin SMD LM6
series
Rev.
NO.) :
16
9.4
0.80 0.80
ecommended solder1 pad design for heat dissipation

4 (Small 6-pin SMD LM6 series )
1.65
4
4.0
2
3
4.0
4.0
1.65
5
1.65
0.35 0.35
5
6
6
Note:
Metal
Note:area at 1, 4, 6 should not
2
be
lessarea
thanat16mm
fornot
Metal
1, 4, 6each
should
0.80
9.4
2
Note:
sufficient
heat16mm
dissipation.
be less than
each for
Metal
area
at
1,
4,
6
should
not
4.70
4.70
0.35
9.4
4.70
ecommended solder pad design for heat dissipation (Small 6-pin SMD LU6 series
1.65
[14]
1.65
Note:
Metal
Note:area at 1, 2, 3 should not
2
be
lessarea
thanat16mm
fornot
Metal
1, 2, 3each
should
0.80
0.35 0.35
1.65
2
Note:
sufficient
heat16mm
dissipation.
be less than
each for
Metal
area
at
1,
2,
3
should
not
4.70
4.70
0.35
1.8 1.8
9.5
4.0
9.4
4
4
5
4 5
6
5 6
4.0 4.0
9.5 9.5
1
1
2
1 2
3
2 3
0.80 0.80
4.0

[14]
Recommended solder
pad design for heat dissipation
(Small 6-pin SMD LU6 series
)
3
6
LU6 series recommended solder-pad design for heat dissipation: [14]
Recommended solder pad4.0
design 9.4
for heat dissipation (Small 6-pin SMD LU6 series
)
4.0
4.70
Recommended solder pad design for heat dissipation ( Small Top SMD)
Recommended solder pad design for heat 9.3

dissipation ( Small Top SMD)
1.8
4.4
Small-top SMD LM3 series recommended

solder-pad design for heat dissipation:
9.3
4.4
commended solder pad design for heat dissipation ( Small Top SMD)
1.55
4.4 1.55
1.55
1.3
2.2
4.0
1.3
2.2 2.2
4.0 4.0
9.3
1.3
1.3
Recommended solder pad design for heat dissipation ( Mini side 0.8mm SMD)
1.3
Recommended solder pad design

side 0.8mm SMD)
1.0for heat dissipation ( Mini3.8
1.3
1.0
3.8
1.0
commended solder pad design for heat dissipation ( Mini side 0.8mm SMD)
1.0
3.8
1.0
1.4
1.4
0.9 0.9
1.0
Modification is not recommended on SMD LED after soldering. If modification cannot be avoided, the modifications must
0.9
be
pre-qualified
to avoid
damagingon
SMD
LED.
Modification
is not
recommended
SMD
LED after1.4
soldering. If modification cannot be avoided, the modifications must
Reflow
soldering
should
not
be
done
more
than
one
time.
be pre-qualified to avoid damaging SMD LED.
dification
is not recommended
SMD
LEDthan
afterone
soldering.
No
stress
should
be
exerted
the
package
during
soldering.
Reflow
soldering
should
not on
beon
done
more
time. If modification cannot be avoided, the modifications must
pre-qualified
to
avoid
damaging
SMD
LED.
PCB
should
not
be
wrapped
after
soldering;
this
is
to
allow natural cooling of the PCB board and SMD LED.
No stress should be exerted on the package during soldering.
Copyright
2011-2014
All rights
The information in this document is subject to change without notice. Cree
flow
should
not be Cree,
done
more
thanreserved.
oneistime.
PCBsoldering
should
not
be
wrapped
afterInc.
soldering;
this
to
allow natural cooling of the PCB board and SMD LED.
portant
Notes
(Small
Toppackage
& Miniduring
side 0.8mm
SMD product)
stress should
be exerted
on the
soldering.
8
CLD-CTAP-001 Rev 20
B should notNotes
be wrapped
afterTop
soldering;
this
is to0.8mm
allow natural cooling
of the PCB board and SMD LED.
mportant
& Mini
side
The packaging
sizes(Small
of these
SMD
products
are verySMD
smallproduct)
and the Resin is still soft after solidification. Users
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
2.2
4.0
1.3
1.3
Mini side 0.8-mm SMD LS8 series recommended solder-pad design for heat dissipation:
Recommended solder pad design for heat dissipation ( Mini side 0.8mm SMD)
1.0
3.8
1.0
0.9
1.4 No.: CREE-05-0057

Document
Rev.
NO.
:
17
Document No.:
CREE-05-0057
Modification is not recommended on SMD LED afterRev.

soldering.
cannot be avoided, the modifications must
NO. : If modification
17
be pre-qualified to avoid damaging SMD LED.
ded solder LA6

pad design for heat
dissipation (LA6 solder-pad
series)
design
for heat dissipation:
Reflow series
solderingRecommended
should not be done
more than
one time.
nded solder pad design for heat dissipation (LA6 series)
No stress should be exerted on the package during soldering.
PCB should not be wrapped after soldering; this is to allow natural cooling of the PCB board and SMD LED.
5. Important Notes (Small Top & Mini side 0.8mm SMD product)
The packaging sizes of these SMD products are very small and the Resin is still soft after solidification. Users
are required to handle with care, never touch the Resin surface of SMD products.
To avoid damaging the products surface and interior device , it is recommended to choose special Nozzle to
8/9
ded solder pad design for heat dissipation (LB6 series)
LB6
series
solder-pad
design for heat dissipation:
nded solder
pad design
for recommended
heat dissipation (LB6
series)
ded solder pad design for heat dissipation (LT6B series)
nded solder pad design for heat dissipation (LT6B series)
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
ded solder pad design for heat dissipation (LT6B series)
LT6B series recommended solder-pad design for heat dissipation:

Rev. NO. :
17
ended solder pad design for heat dissipation (LMVB series)
CLMVB series recommended solder-pad design for heat dissipation:

9/11
on is not recommended on SMD LED after soldering. If modification cannot be avoided, the modifications must
alified to avoid damaging SMD LED.
not
Modification
an
SMD
ldering should
be done more of
than
one
time.LED is not recommended after soldering. If modification cannot be avoided, the modifications
must
be during
pre-qualified
should be exerted
on the
package
soldering. to avoid damaging the SMD LED.
uld not be wrapped after soldering; this is to allow natural cooling of the PCB board and SMD LED.
Reflow soldering should not be done more than one time.
nt Notes
(Small
& Mini
side 0.8mm
SMD on
product)
No Top
stress
should
be exerted
the package during soldering.
kaging sizes of these SMD products are very small and the Resin is still soft after solidification. Users
The PCB should not be wrapped after soldering to allow natural cooling down to 40.
red to handle with care, never touch the Resin surface of SMD products.
damaging the products surface and interior device , it is recommended to choose special Nozzle to
SMD products during the process of SMT production . If handling is necessary, it should take more
o pick up these products . The following two methods are necessary :

Fig. 1a : For Small Top SMD .
Fig. 1b : For Mini side 0.8mm SMD .
10
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778

Rev. NO. :
16
5. Important Notes (small-top and mini-side 0.8-mm SMD products)

up SMD
products
during
theproducts
processare
of SMT
production
. If resin
handling
is necessary,
it should take Users
more are
The pick
packaging
sizes
of these
SMD
very small
and the
is still
soft after solidification.
required
to to
handle
with
care.
Never touch
the resintwo
surface
of SMD
products. :
careful
pick up
these
products.
The following
methods
are necessary
To avoid damaging the products surface and interior device, it is recommended to choose a special nozzle to pick
up the SMD products during the process of SMT production. If handling is necessary, take special care when picking up these products. The following two methods are necessary:
Fig. 1a: For Small Top SMD
Fig. 1b: For Mini side 0.8mm SMD
nozzle
SMDFor
Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two
For example: CLA1B

For figure
silicone-covered
SMD LEDs,
it is recommended to use non-metallic nozzles. Cree and several of Crees customsize for reference
:
ers have had success using nozzles fabricated from Teflon or from 90d urethane.
a.) Circular Nozzle: inner diameter: 1.8mm+/-0.05mm, outer diameter: 2.3mm+/-0.05mm.
b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.
6. Electrostatic Discharge and Surge current
Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of surge current during circuitry design
7. Heat Management
Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The
current should be de-rated appropriately by referring to the de-rating curve attached on each product specification.
Data is subject to change without prior notice.

Items to notice before opening the bag:

1. Check the shelf life (counting from the FQC stamping date on the product label). If the shelf life is over 12
months, re-baking is required.
2. Record the lot number of the SMD product to aid investigation.
11
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
3. Avoid external damage to the packaging bag after product is taken out of the box. For example, many SMD products are stacked without box; re-packing with bubble plastic bag for protection is recommended.
4. Before opening the vacuum-sealed bag, check for air leakage.
5. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to
re-pack conveniently for product not to be used within 24 hours.
12
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
Items to notice after opening the bag:

1. Check the color of the humidity-indication card (30% RH) at the time of opening the vacuum-sealed bag. If
the color is slight green or blue, baking is required before usage.
Normal
Color change
2. Record the date and time on the reel.
3. The product should be used within 24 hours.

4. If SMD products cant be used within 24 hours, they should be re-packed in a vacuum-sealed bag. Before attempting to use again, baking is required.

Baking is required when the following conditions occur:

1. Shelf life has expired (over 12 months).
2. The vacuum-sealed bag has an air leak.
3. The humidity-indication card has change color at 30%RH at the time of opening the vacuum-sealed bag.
4. The vacuum-sealed bag has been opened, but the steps listed under Notice items after opening the bag
(above) have not been followed.
13
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
Baking method:
1. The SMD LED should not be baked within the packaging bag. The baking condition is 80C for 24 hours. The
oven door should not be opened frequently during the baking process.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
For small reels
For large reels
3. Re-baked products should cool down to 40C in the oven before being removed for use.
6. Electrostatic Discharge and Electrical Overstress

Electrostatic discharge (ESD) or electrical overstress (EOS) may damage an SMD LED.
Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling SMD
LEDs.
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of electrical overstress during circuitry design.
7. Heat Management
Heat management of SMD LEDs must be taken into consideration during the design stage of SMD LED applications.
The current should be de-rated appropriately by referring to the de-rating curve included in each product specification.
14
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
8. SMD Screen Product Moisture Sensitivity Level

Product Family
P/N
Moisture Sensitivity Level
CLX6A-FKB
CLX6B-FKB
CLX6C-FKB
CLX6D-FKB
CLV6A-FKB
CLV6B-FKB
CLV6D-FKB
SMD LEDs
CLMVB-DKA
CLMVB-FKA
5a
CLMVC-FKA
CLVBA-FKA
CLV1A-FKB
CLV1L-FKB
CLPPB-FKB
CLPPC-FKB
CLP6C-FKB
The information in this document is subject to change without notice.
15
CLD-CTAP-001 Rev 20
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778

LED Lamp SolderingHandling

Încărcat de

Informații document

Titlu original

Drepturi de autor

Formate disponibile

Partajați acest document

Partajați sau inserați document

Opțiuni de partajare

Vi se pare util acest document?

Este necorespunzător acest conținut?

Drepturi de autor:

Formate disponibile

LED Lamp SolderingHandling

Încărcat de

Drepturi de autor:

Formate disponibile

Cree High-Brightness LED

Soldering & Handling

Avoid stressing the LED package during leads forming.

25C and <40%RH in proper package

Subject to change without notice.

Not less than 3 mm from the base of

Not less than 3 mm from the base of the

The recommended wave soldering is as below:

Document No.: CREE-05-0057

Peak Preheat Temperature

Peak Preheat Temperature 100~110C.

Total Preheat time 50~

Peak Profile Fit Temperature

sheet)parts, refer to product spec)

Do not apply any stress to LED package particularly when heated.

5. Electrostatic Discharge and Electrical Overstress

Electrostatic discharge (ESD) or electrical overstress (EOS) may damage LEDs.

All devices, equipment and machinery must be properly grounded.

It is important to eliminate the possibility of electrical overstress during circuitry design.

3-mm conventional LEDs are not auto-insertable.

Please refer to the product specifications for more detailed information.

Average ramp-up rate

120 seconds max.

Time within 5C of peak temperature

Duration above 217C

The temperature profile for CLV6A/CLX6A/CLVBA/CLMVB LEDs is shown below:

wn rate = 6C/s max.

Ramp-down rate = 6C/s max.

erature = 230C max.

Peak temperature = 250C max.

n 5C of actual Peak Temperature = 10s max.

Time within 5C of actual Peak Temperature = 10s max.

bove 183C is 60s max.

Duration above 217C is 60s max.

amp-up rate = 3C/s max.

mperature = 130C ~170C

wn rate = 6C/s max.

erature = 213C max.

Average ramp-up rate

120 seconds max.

Time within 5C of peak temperature

Duration above 217C

n 3C of actual Peak Temperature = 25s max.

bove 200C is 40s max.

Document No.: CREE-05-0057

Recommended solder pad design

4.5 & CLA1A series)

Recommended solder pad design for heat dissipation (Side SMD)

Recommended solder pad design for heat dissipation

2.0 1.6 2.0

2.0 1.6 2.0

sufficient heat dissipation.

Document No.: CREE-05-0057

ecommended solder1 pad design for heat dissipation

be less than 16mm each for

be less than 16mm each for

sufficient heat dissipation.

sufficient heat dissipation.

Recommended solder pad design for heat 9.3

Small-top SMD LM3 series recommended

Recommended solder pad design

1.4 No.: CREE-05-0057

Modification is not recommended on SMD LED afterRev.