Security C

TSMC Secret

TSMC Technology and Innovation

Platform for Mobile Computing
Henry
y Hsieh
Director, Field Technical Support
November 2012
November,

2012 TSMC, Ltd

Agenda
z TSMC Technology
z Open Innovation PlatformTM
z Mobile Computing from TSMC+ARM
Collaboration

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret

TSMC Technology Roadmap

High
Performance

Security C
TSMC Secret

Technology for SoC and Mobile Computing

CLN65/
CLN65/
55GP

CLN28HP
(HKMG)

CLN40G
CLN28HPM
(HKMG)

CLN20SOC
(
)
(Planar)

CLN16FF
(FinFET
FinFET))

CLN10FF
(FinFET
FinFET))

CLN65/55LP

Low
P
Power

CLN28HPL
(HKMG)
CLN45/40LP
CLN28LP
(SiON
SiON))
CLN40LPG

Production

2013

2014

Box left edge: risk production. Right edge: no meaning

10nm preliminary subject to change

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

2015

2016

Complete
p
Solutions to Cover Various
Product Applications
Server
Networking

28HPM/HP
PC

P
Performa
ance

Tablet

Game Console
DTV

Smartphone

Portable
game
Wi l
Wireless
Digital Camera
eBook
PMP

28LP/HPL
Total Power

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret

N28 Tape
Tape-Out
Out and Production Status
z Fast 28nm adoption
p
by
y tape-out
p
#

Security C
TSMC Secret

TSMC FAB12

TSMC FAB15

z 28nm volume ramp since Q411

Q4 11

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

>220K production wafers have been shipped to customers

28nm accounted for 13% of total wafer revenues in Q3

Q312
12

Both F12 and F15 giga-fabs to support 28nm production

N20SoC Highlights

Security C
TSMC Secret

z N20SoC: A superior
p
planar
p
CMOS for mobile computing
p
g

High performance devices with 2nd generation gate-last HKMG

Advanced interconnect with 64nm pitch

Double Patterning allows 1.9X gate density improvement from

28nm 20nm

z Multiple Customers/IPs verified on N20 test chips

z On track for risk production with good yield
z EDA/Foundation IP ready and available
z Open Innovation Platform enabled the same level of
scaling as the past nodes

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

An Ecosystem for Innovation

Customer
Product
Roadmap

Design
Service

Security C
TSMC Secret

Mask
Making
/ OPC

Process
Definition

Wafer
Fabrication

Design
Enablement

Customer
Tape-out

Design
Productization

EDA
Enablement

Backend
Service
Test Chip
Validation
IP
Enablement

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Customer
Product
Launch

TSMCs OIP Makes It Happen

OIP
Ecosystem
Partners

$1.5B/ Year
TSMC
Design
Enablement
Team

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret

OIP Is In the ARM Connected Community

Security C
TSMC Secret

TSMC Open Innovation Platform (OIP)

ICC
Incubation
Centers of China

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

10

Better Life Drives Innovation

Future PC

Security C
TSMC Secret

Human-Centric

Tablet/Ultrabook
DT/NB

Perform
mance

>3.5GHz
>2.5GHz
2GHz

Future Phone

Smart phone

Basic Phone
>2.5G Hz
>1.5G Hz
300 MHz

Glassless 3D 4096 x 2048p

Full HD 1920 x 1080p
CRT TV SD 720 x 480i

1G Hz

40nm 28nm
40nm,

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

2G Hz

20SoC 16FinFET
20SoC,

Mobile

Visual

11

User Experience Drives Ubiquity

Security C
TSMC Secret

Anytime, Anywhere, Any Device

Notebook
Smart TV

Smartphone

Cloud
Computing

CPU/GPU
High-end BB/AP
Mainstream AP

Tablet
Desktop
Automotive
2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

12

Mobile Computing Drives Technology

and CPU/GPU
C /G
Advancement

Security C
TSMC Secret

z Higher speed at fixed power budget

z Technology migration to enable a wider product dynamic range

65nm

Tablet + Dock
=Notebook

28nm

Power (mW/core))

Tablet

40/45nm

Power Budget
20nm,
16FF

500

Smartphone

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

1,000

1,500

2,000

S
Speed
d (MHz)
(MH )

2,500

3,000

13

Soft-IP Alliance Program

g

Security C
TSMC Secret

Now
Soft-IP
Partners

Past
Low
Interaction

Soft-IP
Partners

Technology file
Enhanced libs
TSMC9000 QA

Tech
Optimized IP

TSMC
TSMC

Customer

ARMCustomer
joins TSMCs Soft-IP Alliance.
Optimized design
Faster Tape-out

z 10+ IP providers have assessed their RTL IP via the

TSMC 9000 IP program
z Soft-IP Kit 2.0 launched on Oct 16th
z ARM jjoins TSMCs Soft-IP Alliance
2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

14

ARM Cortex
Cortex-A9
A9 POP for TSMC 28HPM

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret

15

Maximize Performance Envelope

p via
TSMC 16FF & ARM V8 Collaboration
ARM v8 CPU @
16FinFET

Relative Perforrmance

A15 @
20SoC

1.5

A9 @
28HPM

Power Constrained @ 750mW

2011

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

2012

2013

Security C
TSMC Secret

16

Long
g History
y of TSMC+ARM Leadership
p

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret

17

Summary
z Mobile Computing
p
g drives innovations and
advanced technologies
z TSMC Open Innovation Platform is the 1st
ecosystem for 28nm volume production
z Early partnership and co-optimization with
ARM and lead customers to improve time to
market and maximize the benefits

2012
2012
TSMC, Ltd
Ltd

2011 TSMC,

Security C
TSMC Secret