Documente Academic
Documente Profesional
Documente Cultură
agrees exactly with the FEA result with square heat source; however the FEA result with
rectangular heat source is slightly lower than the analytical one. The difference of
thermal resistance between the substrates of 70 m and 350 m of copper is 1.31C/W
with the square heat source and 1.15C/W with the rectangular heat source. The
10 8
differences are only 0.74C and 0.65C with 0.56 W power input. A simulation of the
entire package shows the difference in the junction temperature is 0.025C, which is
much smaller than that of the analytical solution (see Figure 99). This is because
generated heat can spread in the GaN device and Al2O3 submount and flow through the
n-electrode. As mentioned previously, thick copper is not suitable for flip chip structure
because of its low etching resolution. Therefore, a thin copper layer is much better for
the AlN DBC substrate of UV LED.