Documente Academic
Documente Profesional
Documente Cultură
Issue 13
October 2008
Disclaimers
It is the responsibility of the user of this document to verify that it is the most current edition.
Any document printed from the Document Control System is an uncontrolled copy.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 Classification= OPEN
i
Cover: ISSUE 13 October 2008.COVER The cover shows the city of Tucson, AZ, USA as a
local storm generates multiple lightning strikes.
Lightning strikes are the ultimate in large scale Electro-Static Discharges. They induce huge
electrical impulses on electrical distribution networks. These impulses find their way into our
products. Mitigation of these types of stresses in the form of gas discharge tubes, earth grounds/
shields, spark gaps, and fast acting solid state on board protector diodes are a portion of the
methods we take to ensure the reliable operation of our products.
CONTENTS
SCOPE..................................................................................................................................................... 5
PREFACE................................................................................................................................................ 5
HISTORY & ACKNOWLEDGEMENTS................................................................................................. 5
REASONS FOR REISSUE....................................................................................................................... 6
INTRODUCTION.................................................................................................................................... 7
Critical Factors for Managing a Successful ESD Control Program ......................................................... 8
Alcatel-Lucent ESD Program Elements................................................................................................. 8
ALCATEL-LUCENT ESD POLICY ........................................................................................................ 9
Policy................................................................................................................................................... 9
Intent.................................................................................................................................................... 9
Responsibilities .................................................................................................................................... 9
ALCATEL-LUCENT ESD LEADERSHIP TEAM MISSION STATEMENT ......................................... 10
BASIC ESD CONCEPTS....................................................................................................................... 11
Definition ........................................................................................................................................... 11
Causes of ESD.................................................................................................................................... 11
Triboelectric Charging........................................................................................................................ 12
Static Potential.................................................................................................................................... 12
Static Charge ...................................................................................................................................... 12
ESD FAILURE MODELS...................................................................................................................... 14
Introduction........................................................................................................................................ 14
Human Body Model ........................................................................................................................... 14
Charged-Device Model (CDM) by Direct Contact ............................................................................... 16
CDM by Static Induction .................................................................................................................... 17
Machine Model (MM) ........................................................................................................................ 18
SOURCES OF ESD DAMAGE.............................................................................................................. 19
Environmental Conditions................................................................................................................... 19
Device Sensitivity............................................................................................................................... 19
Static Shock........................................................................................................................................ 22
ESD in clean rooms and its Effects on IC Wafers ................................................................................ 22
ESD EFFECTS....................................................................................................................................... 23
ESD CONTROL REQUIREMENTS AND TECHNIQUES .................................................................... 24
Introduction........................................................................................................................................ 24
Designed-In Protection ....................................................................................................................... 24
Basic Rules for ESD Control............................................................................................................... 24
Static-Safe .......................................................................................................................................... 25
Antistatic Property.............................................................................................................................. 25
Static Conductors and Nonconductors ................................................................................................. 25
Surface Resistivity.............................................................................................................................. 25
Conductive Materials.......................................................................................................................... 26
Static-Dissipative Materials ................................................................................................................ 26
System Level Testing.......................................................................................................................... 26
Device Testing.................................................................................................................................... 26
ESD CONTROL REQUIREMENTS SPECIFIED BY CLASS................................................................ 27
1.0
Work Area Classification......................................................................................................... 27
2.0
Personnel Training Program .................................................................................................... 30
3.0
Personnel Certification ............................................................................................................ 30
4.0
Auditing.................................................................................................................................. 30
5.0
Statistical Process Control ....................................................................................................... 30
6.0
Production Equipment Certification ........................................................................................ 31
7.0
Personnel Grounding............................................................................................................... 32
8.0
Flooring, Finishes, Carpeting and Mats.................................................................................... 34
9.0
Transporting Products.............................................................................................................. 35
10.0 ESD Grounding Requirements and Methods ............................................................................ 37
11.0 Static-Generating Material Control .......................................................................................... 38
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 Classification= OPEN
iii
LIST OF FIGURES
Figure 1 - Separated Roll of Cellophane Tape .................................................................................. 11
Figure 2 - Equivalent Circuit of Human Body Model ......................................................................... 15
Figure 3 - Equivalent Circuit of Charged-Device Model.................................................................... 17
Figure 4 - ESD by Induction................................................................................................................ 18
Figure 5 - Effects of ESD Caused Failures........................................................................................ 23
LIST OF TABLES
Table A - Triboelectric Series for Some Common Materials ............................................................ 13
Table B - Typical Electrostatic Voltages............................................................................................. 15
Table C - Typical Charge Generators ................................................................................................ 20
Table D - Device Sensitivity ................................................................................................................ 20
Table E - HBM...................................................................................................................................... 21
Table F - CDM...................................................................................................................................... 21
Table G - ESD Control Requirements Specified by Class................................................................ 29
SCOPE
This Electrostatic discharge control Handbook is the controlling document for the Alcatel-Lucent
Electrostatic Discharge (ESD) Control program and applies to all facets of our business. Minimum
requirements are established here for proper ESD control techniques. This handbook is intended for
engineering, management, and training personnel, and shall be used to implement local ESD
programs. Further details are contained in the Alcatel-Lucent ESD Inspection Guide.
PREFACE
This handbook defines and describes Electrostatic Discharge (ESD) and its effects on electronic
devices. ESD causes are explored, numerous sources of static charges found at the workplace are
identified, and how these charges threaten sensitive electronic devices are discussed. General
requirements are specified for controlling ESD damage, and detailed instructions are given for each
technique.
This handbook supports Alcatel-Lucent policy, which states that each organization shall use proper
ESD control measures when handling ESD sensitive products and that all-new design shall be
qualified for adequate designed-in ESD protection. Alcatel-Lucent recognizes that special procedures
and methods may be required for certain personnel, including the physically impaired, and may not be
covered in this document. The local ESD coordinator shall develop the necessary procedures and
methods to ensure compliance with the intent of this document.
Section 1 Work area Classification has been updated to be in alignment with QMS
instructions.
2)
Section 3.1 has been updated to reflect ESD training re-certification is to be at a minimum
of every two years (Issue 12 guidance was every year).
3)
4)
Added Open Classification to this document for compliance with the October 20 directive
for classification marking of documents.
5)
The following sections had verbiage changed with out any substantive changes for
alignment with QMS L2-09:
6.1
7.4
7.5
8.1
9.2
INTRODUCTION
Electrostatic Discharge (ESD) poses a serious problem to industries that use electronic devices. Many
devices are highly sensitive to damage from the discharge of static electricity, which usually cannot be
seen or felt. ESD affects many components such as diodes, transistors, integrated circuit devices,
metal-oxide-semiconductors (MOS), optoelectronic devices (lasers and photodiodes), surface acoustic
wave (SAW) filters, and film passive components, etc. ESD can also damage semiconductor wafers
and integrated circuit photo-masks. These damaging effects are well documented. Device failures do
not always occur immediately; often, the component is only slightly weakened or altered, but is less
able to withstand subsequent ESD exposure and may constitute a reliability problem.
It is essential that everyone in the product life cycle (design & development, manufacturing, integration,
distribution, installation, and repair) be concerned with ESD. The Alcatel-Lucent procedure for ESD
sensitive products is Hands Off. It prohibits anyone from directly contacting ESD sensitive products
for any reason (or at any time) without taking appropriate ESD precautions.
Alcatel-Lucent is striving to eliminate device failure caused by ESD damage. By reducing the failure
rate of individual components, we enhance the reliability of our products, which in turn improves
customer satisfaction. It is necessary to understand ESD and its inherent dangers before successful
control techniques can be put into practice. This handbook provides an awareness of ESD concepts
and specific instructions for combating ESD induced failures.
Since these instructions are considered minimum requirements and preferred ranges are stated
throughout this document, Alcatel-Lucent organization specific (local) and supplier requirements may
be more stringent. Engineering analysis must be performed when defining local requirements that are
outside the preferred ranges. The documentation of work area classification is the responsibility of local
and supplier engineering and is defined under Work Area Classification.
This document is not to be considered an in-depth knowledge base for ESD education, and does not
purport to replace certified ESD Training Courses.
Intent
ESD is known to affect electronic components and systems in a variety of ways and is heavily influenced by
technology, design and handling techniques. Therefore, we will strive for continual improvement in
prevention techniques, employee awareness and designed-in-protection at all levels of our company. It is
our intention to maintain Alcatel-Lucent as a World Class leader in ESD control and design.
This will require the adherence to appropriate design standards as well as controlling the environment
around which electronic products are designed, manufactured, transported, and used. To satisfy this intent,
we will need to comply with documents such as the Alcatel-Lucent ESD Control Handbook, the AlcatelLucent ESD Inspection guide, and all appropriate Alcatel-Lucent product specifications and best current
practices. We will strive to provide products and services that are sufficiently ESD robust in design and free
of any latent ESD handling defects to give our customers significant economic advantages in their market.
Responsibilities
Each business group president, entity head, and senior staff officer is responsible for:
Communicating the policy and seeing that it is carried out effectively
Providing adequate support and resources.
Each member of management is responsible for:
Ensuring adequate design qualification of our product offerings
Setting the example by always complying with the handling procedures in the Alcatel-Lucent ESD
Control Handbook
Communicating our ESD policy to each employee, visitor and supplier
Clarifying specific responsibilities for ESD prevention, awareness and design
Establishing effective ESD process controls
Ensuring consistent compliance with the Alcatel-Lucent ESD policy and initiating corrective action if
needed
Implementing and reviewing specific ESD improvement programs
Providing education and training in ESD awareness and prevention for employees.
The Alcatel-Lucent ESD Leadership Team is responsible for overall leadership and direction of the ESD
program.
Please refer to page 42 for a current listing of the Alcatel-Lucent ESD Leadership Team members.
Causes of ESD
Static charge is generated whenever two different materials come into contact or are rubbed together
and then separated, such as an unrolling cellophane tape as shown in Figure 1 Separated Roll of
Cellophane Tape.
Triboelectric Charging
Static charge accumulation, known as triboelectric charging, results from the transfer of electrons from
one material to another. Table A - Triboelectric Series for Some Common Materials shows the
triboelectric series of some common materials. Note that static electricity is a surface phenomenon,
and static charge accumulates only on the outer surface of an object, not throughout the object.
Generally, static charge accumulation can occur between any two materials. These materials may be
solids, liquids or gases, so static electricity is always present. To understand the static charge behavior
of materials, their relative positions in the triboelectric series must be determined. The polarity (+ or -)
of the static charge generated on each of the materials and the relative magnitude of the charge can
be obtained from Table A - Triboelectric Series for Some Common Materials. The farther apart the
materials are located in the series, the greater the magnitude of the charge. Also, a material at the top
of the scale acquires a positive charge with respect to any material below it. A classic example is
rubbing a glass rod with wool. The glass assumes a positive charge and the wool a negative charge.
Many materials in Table 'A' are commonly used in electronics manufacturing.
Static Potential
The accumulated electrical charge causes a static potential to develop. The static potential is not with
respect to ground, but is a potential difference between any two different objects. ESD occurs when the
accumulated charge is transferred to another object with a different electric potential.
Static Charge
The potential difference between two separated objects can be modeled as the voltage between the
charged plates of a capacitor. With a given charge (Q), the static potential (V) developed between two
materials depends on the capacitance (C) between these two materials, such that Q=CV. For a given
charge (Q), C and V depend on the environment and may vary, but the product CV remains constant.
TABLE A
TRIBOELECTRIC SERIES
FOR SOME COMMON MATERIALS
+
POLARITY
Acquires a more
positive charge
MATERIALS
Acetate
Human Hair
+
Nylon
Wool
Fur
Lead
Silk
Aluminum
Paper
Polyurethane
Cotton
Wood
Steel
Hard rubber
Acetate Fiber
MYLAR*
Epoxy Glass
Nickel, Copper, Silver
Brass, Stainless Steel
Synthetic Rubber
Acrylic
Polystyrene Foam
Polyurethane Foam
Saran wrap
Polyester
Polyethylene
Polypropylene
PVC
Acquires
a more
TEFLON*
negative charge
Silicone Rubber
* Registered trademark of E.I. Du Pont De Nemours.
Table A - Triboelectric Series for Some Common Materials
Figure 2 - Equivalent Circuit of Human Body Model. In the current industry standard, the HBM
equivalent circuit contains a 1500-ohm resistor and a 100-picofarad (pF) capacitor. These components
represent the effective resistance and capacitance of the human body. (Other resistance and
capacitance values have been used in the past for example, 300 to 10 kilohms and 100 to 400 pF.)
The contact resistance is usually less than 5 ohms. Another important element of the event is the
dynamic resistance of the discharge arc, which is typically 100-200 ohms. Compared to the chargeddevice model (CDM), the HBM is a slow event (rise time = 10 nanoseconds, width = 150
nanoseconds).
The HBM equivalent circuit usually assumes that the discharge occurs to a single lead while one or
more leads are connected to ground. Although this circuit does exist, the more likely circuit
arrangement is a discharge path through a land with all other leads floating. An HBM discharge
through a device to ground is usually more damaging than an HBM discharge through a floating
device.
TABLE B
TYPICAL ELECTROSTATIC VOLTAGES (VOLTS)
RELATIVE HUMIDITY
EVENT
10%
40%*
55%
Walking across carpet
35,000
Walking across vinyl floor
12,000
Motion of bench worker
6,000
Removing DIPs* from plastic tubes
2,000
Removing DIPs from vinyl trays
11,500
Removing DIPs from STYROFOAM
14,000
Removing bubble pack from PWBs
26,000
Packing PWBs in foam-lined box
21,000
* Dual in-line packages
Registered trademark of Dow Chemical Co.
Printed wiring boards
15,000
5,000
600
700
4,000
5,000
20,000
11,000
7,500
3,000
400
400
2,000
3,500
7,000
5,500
IC
Work Surface
Device
Body
Current Pulse
See JEDEC Standard No. 625-A/NOTE The recommended minimum humidity is 40% R.H.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 15 of
52
The CDM equivalent circuit used to describe this phenomenon is illustrated in Figure 3. It contains a
device capacitance (1-60 pF, depending on the package type). Note that human body capacitance and
resistance are not considered in the CDM. In addition, device inductance ranges from 5 to 50
nanohenries, and contact resistance is still 0.1 to 5 ohms. The device resistance of 50 to 300 ohms,
while not considered in the HBM, now has a more significant role in the CDM; it has a considerable
effect on the series-LCR circuit formed by the device.
Device
Contact Resistance
Current Pulse
Environmental Conditions
Grounded conductive materials provide a path for electron flow that prevents a charge buildup. In a humid
environment, moisture absorbed on the surface of any object will provide a similar leakage path, resulting in
low static potential. In dry conditions, such as a heated building in wintertime or in a naturally arid climate,
the leakage rate no longer equals the rate of static generation, and large static potentials can result. Table B
- Typical Electrostatic Voltages shows the effect of relative humidity on static generation. As relative
humidity increases from 10 to 55 percent, static potentials decrease dramatically (in one case by more than
a factor of 10). Results of this type vary under different test conditions and with different materials. The effect
of humidity is less for materials that do not absorb water, such as TEFLON .
Heating or drying operations remove conductive moisture from both the item and the ambient air, resulting in
a greater tendency for materials to charge. The application of a nonconductive coating will increase the
likelihood of static charging. In a typical environment, higher speeds of moving machinery and conveyors
have increased the occurrences of material separation. When material separation is combined with the more
prevalent use of nonconductive and nonabsorbent materials, static electricity problems are increased.
Device Sensitivity
Many electronic components are sensitive to electrostatic discharge. The degree of sensitivity is determined
by the device circuit design and structure. Packaging can also affect sensitivity, particularly to the chargeddevice model.
All semiconductor devices including discrete transistors and diodes, optoelectronic devices (photodiodes,
LEDs and lasers), and integrated circuits are sensitive to ESD. Other devices, such as SAW filters and thinand thick-film resistors, may be sensitive. The fine-line designs of integrated circuits (both bipolar and MOS),
with shallow junctions and thin insulators, are particularly vulnerable. While the particular technology used to
build a device strongly influences its intrinsic sensitivity, the effective sensitivity is also a function of the
attention paid to ESD protection by the device designer. The MOS circuits with unprotected gates may fail at
20 volts. However, depending on performance criteria, varying degrees of protection may be built into the
device. Protection circuit designs are available that can provide ESD withstand ratings of 8,000 volts (HBM)
and 3,000 volts (CM). Most semiconductor devices used in the electronics industry today vary to less than
250 volts and up to 8, 000 volts (HBM), however high speed devices can be damaged by ESD events as low
as 40 volts. There is no consensus on wafer level ESD sensitivity, but there have been some documented
cases of ESD damage to wafers during integrated circuit fabrication.
TABLE C
ITEM
Work Surfaces
Chairs
Clothing
Floors
Packaging Materials
Manufacturing
Processes
Table D is based on published values of ESD sensitivity for various technologies. It is important to note that
device technology is not a good indictor of ESD sensitivity. The growth of high-speed electronics and
photonics is increasing the number of devices with low ESD withstand voltages.
TABLE D (NOTE)
DEVICE SENSITIVITY
RANGE OF ESD SENSITIVITY
DEVICE TYPE
(VOLTS)
MOSFET
100-200
GaAsFET
100-300
EPROM
100-2,500
OP AMP
100-2,500
CMOS
250-3,000
Schottky Diodes, TTL
300-2,500
Film Resistors (Thick, Thin)
300-3,000
Bipolar Transistors
100-7,000
Photodiodes
100-1,000
Note: Do not use this table as a source for device information. This table
is not comprehensive. It is intended to show ranges only.
Table D - Device Sensitivity
Table F - CDM
Charge Device Model
(Per ESD STM5.3.1-1999)
Class
Voltage Range
Class
Class 0
Class 1A
Class 1B
Voltage Range
Class 2
Class 3A
Class 3B
8000 volts
Static Shock
People are a prime source of device-damaging electrostatic potentials. Activities such as walking
or working at a bench can generate thousands of volts of static potential. When a charged person
handles a static-sensitive device, the component may be damaged by either a direct HBM
discharge or become charged and susceptible to a subsequent CDM event. A person cannot
feel static discharge until the potential approaches 3,000 volts; however, many commonly
used devices are subject to damage at less than 500 volts. See Table D - Device Sensitivity.
Note: "If an individual experiences a "felt static discharge" while working in or passing through an
ESD sensitive area, that is a prime indication that there are serious ESD control problems in that
area and immediate corrective action must be implemented."
the wafer and the contacting object are grounded. During transportation and storage, devices on
wafers should be protected from accidental contact.
ESD EFFECTS
A sudden discharge of static electricity from a finger or other conductor can destroy static-sensitive
devices or micro-circuitry. Often, the spark is neither felt nor heard, but the damage is done. An
electronic device exposed to static discharge may not be affected and may work perfectly throughout a
normal cycle. It may function normally for a while, but because of degradation in the internal layers, its
life expectancy may be reduced. This is a latent type of device-operating failure (DOF). The ESD event
causes a device weakness that degrades and causes failure with continued use.
The device is simply weakened and is less able to withstand the next event. The ESD damage can
also be cumulative, causing a damaged device to function intermittently, alternating between normal
functioning and erratic behavior. These types of defects are difficult to identify. Figure 5 illustrates ESD
caused failures within the structure of a device. Another important effect of ESD is on operating
equipment. The conducted and radiated energy from an ESD event can be misinterpreted by an
operating system as valid data. This often results in temporary errors in transmission or data
processing. In more severe cases, equipment may experience major service interruptions, such as
dropped telephone calls or may shut down completely and require a manual restart.
ESD Damage
ESD Damage
Designed-In Protection
The most efficient way to protect microelectronic circuit elements is to build protective circuitry
into the device during its manufacture. Protection diodes, field oxide transistors and resistors may
be built using the same process steps that produce the operational circuit elements. Protection
circuitry design is a trade-off among several factors, most notably device performance, device
manufacturing constraints (that is, mask levels and material properties) and device handling (ESD
control). The protection circuit must respond to the ESD transient faster than the device being
protected. Although significant device protection can be obtained by designed-in circuitry, no
device manufacturer has been able to eliminate the problems of ESD damage. For this reason,
additional protective handling measures are also needed.
Electronics technology trends are forcing devices to operate at considerably higher speeds.
Sometimes, speed and other performance criteria may restrict the full use of available protection
strategies. The need to use these limited protection schemes should be recognized and
communicated early to the manufacturers and users of the devices, so that protection may be
built in at the circuit pack and system level and so that the need for special handling techniques
may be anticipated. This is especially critical for ultra sensitive (Class 0, see Work Area
Classification) devices, since standard control procedures are not sufficient and the use of some
automated assembly techniques may not be allowed. Circuit pack level protection techniques
include shielding, conformal coating, special connector designs, guard rings and component
placement.
The design of completed systems must also take into account disruptions caused by ESD.
Corrective measures include shielding and circuit board layout considerations typical of noise
suppression techniques. The ESD sensitivity information is required in product design information
for each new microelectronic device, circuit pack or system.
B.
C.
D.
Static-Safe
Static-safe conditions or materials provide adequate protection for the product sensitivity in the
intended application. However, the ideal material often does not exist and it is virtually impossible
to prevent some degree of charging. Therefore, trade-offs are generally involved. Engineering
judgment is necessary to consider these trade-offs and to determine if a material condition is
static-safe.
A static-safe environment for electronic components and assemblies involves:
Controlling static buildup whenever possible.
Eliminating charges wherever they exist. How these charges are removed depends on
whether the charged object is a conductor or nonconductor.
Grounding all conductors, including people, in the workplace. Dissipative mats should be
used on benches and/or floors. Operators should use ESD protection devices as
indicated in ' 7.0- Personnel Grounding procedures, or follow local ESD Coordinator
instructions. These steps will ensure that static potentials within the system remain at
zero. Handling and grounding techniques, combined with an awareness program
designed to enlighten personnel about the hazards of ESD, are the most effective
methods for eliminating ESD damage.
Antistatic Property
This property refers to the prevention of triboelectric charge generation. It will effectively minimize
the production of a static charge when materials come in contact and are separated. This
property is not a dependent function of material resistivity or of static decay performance. In other
words, a material could be conductive or static-dissipative and not antistatic.
Surface Resistivity
For steady current flowing along a surface, surface resistivity is defined as the ratio of the electric
field (volts/meter) to the surface current density (amps/meter). The unit of surface resistivity is
ohms per square, to emphasize that for a uniform current density surface resistivity equals the
ratio of the voltage drop across a square region of any size to the total current flowing through the
space. Two categories of surface resistivity characterize most ESD combative materials. These
are:
4
Conductive Materials
Conductive materials may or may not be antistatic and are the quickest to dissipate charge. They are
used to shield some highly sensitive products. However, they do offer an element of considerable risk
of ESD damage based on the charged-device model. Therefore, always avoid contact between the
conductors of a static-sensitive product and conductive surfaces. If this contact is a process
requirement, use every precaution to ensure that the product is not charged before contacting a
conductive surface, and that the conductive surface is grounded. When a charged product touches a
conductive surface, the rapid discharge may result in ESD damage. Conductive packaging materials
for shipment are generally not used because of higher costs, and few products require shielding for
either handling or shipment.
Static-Dissipative Materials
In general, static-dissipative materials are preferred to conductive materials because charge
dissipation occurs at a safe rate neither too fast nor too slow. Both categories have application when
properly used. For example, tote boxes could be lined with dissipative material on the inside where
they contact the product, but be conductive on the outside for rapid charge dissipation or shielding.
Device Testing
The ESD sensitivity ratings are assigned to devices using standard HBM and CDM test methods.
These methods are described in Specification X-19435 (see Appendix B). The data provided by these
methods is the ESD withstand voltage. The ESD withstand voltage is the highest voltage that a given
device can accept and still operate according to its own specification. It is important that the equipment
used to simulate the HBM and CDM pulses meet the requirements of X-19435. Variations as great as
6:1 in reported withstand voltages have been reported for improperly calibrated equipment. The
method and machine specifications in X-19435 are similar to MIL STD 883, Method 3015.7 and ESD
Association S5.1.
1.0
Not all devices (and consequently, assemblies) are equally sensitive to ESD damage. Some
require more protection than others. In a given area, the ESD withstand voltage of the most
sensitive component determines the type of protection required. Consequently, circuit pack
assemblies are to be classified according to the most sensitive component. Classifications should
be based on tested withstand-voltage data, per Specification X-19435 (see Appendix B). In the
absence of such data, classifications may be subjectively based on factory or field data. However,
the use of estimated thresholds should be minimized.
The engineering organization shall determine and document the classifications for a given work
area so that the correct preventive measures are specified.
The ESD classification shall be documented and kept with accordance to records section 12
locally or for each work area. It is preferred that the ESD classification be posted on the ESD safe
area signs. If the ESD safe area has a single classification, it can be put at the entrance to an
ESD safe area. If there are multiple Classes of ESD areas within an ESD safe area, the specific
areas shall be marked appropriately.
The following method should be used to determine the work area classification.
Method 1
Method 1 consists of reviewing the Bill of Material (BOM), and identifying the
ESD threshold voltage of the most sensitive ESD device. This method is used
primarily during an assembly process, where the components are handled
and/or exposed to a potential ESD event.
Note 5: Classifications should be based on tested ESD threshold voltage
data, per Specification X-19435.
Method 2
Method 2 consists of reviewing or obtaining the design classification of the
finished product. For example, a circuit pack in its finished state may have
been designed (ESD protection circuitry) to withstand ESD voltages higher
than its assembled components.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 27 of 52
Method 3
If ESD Classification of a product is not known, it shall be handled as Class 0
product until determined by the local ESD Coordinator.
1.1
The ESD classification shall be documented locally for a facility, or for each work area. Example;
an EMS may state that all areas handling ESD sensitive devices shall be established to meet the
minimum withstand-stand voltage of the most sensitive component used in that facility.
1.2
Warning Signs
Standard warning signs such as ESD Protection Required in This Area shall be posted as
necessary. Local standards may specify the location and format of the sign.
TABLE G
ESD CONTROL REQUIREMENTS SPECIFIED BY CLASS
ITEM
CONTROL REQUIREMENTS
(NOTE 2)
1.0
2.0
3.0
4.0
5.0
6.0*
7.0
8.0
9.0*
9.1*
9.2*
9.2*
9.3*
9.3*
10.0*
11.0*
12.0*
13.0*
14.0
15.0
0-249
250-499
500-999
1,000-1999
2,000-7999
R
R
R
R
R
R
R
R
R
R
R
R
NP
R
R
R
R
R
S
R
R
R
R
R
R
R
R
S
R
R
R
R
R
R
R
R
R
S
S
R
R
R
R
R
R
R
R
S
R
S
R
R
R
R
R
R
R
S
S
R
R
R
R
R
R
R
R
S
R
S
R
R
R
R
R
S
S
S
S
R
R
R
R
R
R
R
R
S
R
S
R
R
R
R
R
S
S
S
S
R
3B
NONE
> 8000
NOTE 1: Control requirements are described in more detail on the following pages.
NOTE 2: R = Always required when used.
S = Required when specified by Engineering.
NP = Not Permitted for Class 0 CDM sensitive devices.
NOTE 3 Sections 8-13 (Flooring, floor finishes and Mats through Extraordinary Measures) are processspecific and may not apply to all applications.
* Applies to CDM ESD events.
See Section 9.2 for further explanation.
See Section 9.3 for further explanation
Table G - ESD Control Requirements Specified by Class
2.0
The success of ESD control programs depends on all personnel understanding ESD principles. A
personnel training program is required for engineers, operators, installers, and management
personnel. It is the responsibility of Top Management or its delegates (e.g., ESD engineering
and/or training organization) to develop and implement the local ESD training program. ESD
bulletins are part of ESD training and shall be issued as necessary. The ESD Training program
may be provided in a classroom environment or as a web base course.
3.0
Personnel Certification
All Alcatel-Lucent employees who have contact with ESD-sensitive components and assemblies
shall undergo an ESD Certification Training Program that leads to knowledge of proper
requirements and handling techniques. This knowledge and behavior shall be tested by a
verifiable and valid testing method, which will be used to verify the accuracy of the employee's
ESD safety knowledge.
Electronic Component Suppliers and EMS shall have established an ESD Certification Training
Program that is in compliance with a recognized industry standard or in accordance with the
Lucent ESD Handbook.
3.1
Re-certification Interval
Re-certification is required Bi-annually (once every 2 years) with a 45-day grace period. Your
organization may require re-certification more often.
4.0
Auditing
Within Alcatel-Lucent locations where ESD sensitive components are present, a system for
auditing compliance to ESD procedures shall be established for all ESD sensitive areas. The
Alcatel-Lucent ESD Inspection Guide or equivalent procedures should be used as a reference for
establishing an auditing program. For locations, where an equivalent procedure has not been
established, the Lucent Management Systems document for ESD Auditing shall be utilized.
rd
For 3 party audits of suppliers and EMS, the X-Spec 21381 shall be used.
5.0
Where appropriate, statistical process control techniques shall be applied to control the ESD
process. Techniques such as control charts or trend charts may be used. Determining factors for
deciding the level of statistical process controls includes:
The type of work being performed (continuous assembly production verse laboratory
areas)
The level of compliance (work area classification)
The number of employees requiring ESD certification
The type of materials/products and the type of ESD monitoring equipment
5.1
A process control layout or equivalent shall be developed or adopted for local use. The
procedures used and the frequencies applied may be established locally and may be based on
either manufacturing recommendations or experience. For instance, in a manufacturing
environment, wrist straps and conductive footwear should be tested daily and tablemats should
be tested at least monthly.
5.2
The process control methods shall include both visual inspections and electrical tests to verify
that the ESD process complies with the Alcatel-Lucent Electrostatic Discharge Control Handbook.
Root cause analysis, preventive corrective action, and corrective action shall be employed, as
necessary, to maintain compliance with ESD process requirements.
Procedures such as proper use of tote trays, the control of static-generating materials and proper
grounding of personnel must be periodically inspected and the results recorded as required.
Control products, such as wrist straps, heel straps, tote boxes, dissipative table mats, and ESD
grounds must be periodically tested for proper operation and the recorded as required
6.0
The use of automated facilities makes the ESD qualifications of handling, test, and other
manufacturing equipment increasingly important. These facilities must be designed with two
purposes in mind. One is to prevent damage to the items being manufactured or handled. The
other consideration is to protect the facility from ESD damage or malfunction.
6.1
(7) ESD protective tools such as static bags must be made available.
7.0
Personnel Grounding
Personnel are required to be properly grounded whenever they touch a sensitive component or
assembly. Grounding is not required when sensitive items are in approved transporting
containers (tote boxes, IC tubes, factory packaging, etc.). An assembly that has failed applicable
system level tests or is untested is considered sensitive while in operation. In these instances, a
personnel grounding is required during operations such as system test.
7.1
Overall Requirements
The method used for grounding personnel must include either a wrist strap and/or footwear.
When seated, each operator must wear a wrist strap connected to a grounding system. When
standing, conductive footwear may be used with conductive or dissipative flooring and floor
finishes as an alternative. The grounding system (typically equipment ground) must be common
to all ESD control facilities (tabletops, chairs, floor mats and wrist straps), and be connected to
common ground with 1 ohm resistance (See section 10 for more detail).
7.2
Wrist Straps
The sole purpose of wrist straps is to ground personnel. Tested and properly grounded wrist
straps are the first line of defense against ESD damage. Typically, the standard ESD straps are
made of cloth, plastic or metal. These types of straps are flexible wristbands with minimum of a
1-megohm resistor in the ground cords.
The wrist straps must contact the skin to be effective. Continuity from point of connection to
ground must always be maintained. ESD wrist straps and cords are to be considered a unit and
must be assigned to and used by one employee. The wrist strap/cord must be connected to a an
ESD constant monitor system or tested on each entry to an ESD Sensitive area Testing of the
wrist strap assembly must be performed by the use of a calibrated wrist strap checker with results
of the test indicated in a logbook. If found defective the wrist strap/cord defective part must be
replaced and verified to function properly before entering the ESDS area. The owner of the wrist
strap must report the defective finding to the local ESD coordinator. The coordinator will
determine what appropriate steps will be taken to verify if any product was impacted by the
defective wrist strap from the time of the previous passing test. If necessary, the coordinator will
provide guidance for remediation of the situation.
When tested from the fingertip using an approved EOS/ESD Checker, wrist straps resistance
must measure within an acceptable range of 750 kilohms to 10 megohms.
In addition to the standard wrist straps, installation groups utilize Self-Testing ESD Wrist Straps
such as the R-4987C. The self-checking wrist straps are only available through the Installation
Organization (see Section 15.)
Note: At the release of the ESD Handbook, Alcatel-Lucent does not recognize the use of
Wireless ESD Wrist Straps.
7.3
Footwear
Several Types of conductive footwear are available all of which must be used with conductive or
dissipative flooring. Always wear conductive footwear on both feet and comply with local safety
standards.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 32 of 52
When tested using an approved EOS/ESD Checker, the footwear resistance must measure
within an acceptable range of 750 kilohms to 10 megohms.
7.4
All personnel handling ESD Sensitive products/components must wear a properly operating
grounded wrist strap while seated in both Non-ESD Safe and ESD Safe Chairs. Seated work
positions may consist of non-ESD safe, ESD safe chairs or in cases where there is a mix of
chairs the mandatory wrist strap requirement applies to both. The following process and
equipment requirements shall apply for the use of chairs at work positions requiring ESD
protection measures.
7.5
8.0
8.1
8.2
Floor Finishes/Carpeting
Floor finishes and carpeting are typically both dissipative and antistatic and are more forgiving
11
5
11
because of antistatic properties (< 10 ohms). Finishes shall be between 1x10 and 10 ohms.
Procedures can be found in the ANSI/ESDA S7.1 Standard at:;
http://www.esda.org/standardlistings.html
8.3
Floor/Table Mats
Conductive and dissipative floor mats are used primarily to ground personnel through conductive
footwear. Floor mats are used as an anti-fatigue measure and/or to provide a dissipative surface
7
where there is no dissipative floor or floor finish available. Resistivity shall be less than 10 ohms
5
11
per square for ALL floor mats and resistivity for all table mats shall be between 1x10 and 10
ohms.
9.0
Transporting Products
When ungrounded personnel transport products, the products must be transported in static-safe
containers that include but are not limited to those specified in Table G (tubes, reels, bags, boxes,
etc.).
9.1
Carts
Carts must be metal, and product tote trays must be conductive or if plastic static dissipative and
all types shall be grounded during the direct handling of sensitive product. Grounding shall be
achieved by a ground cord (or an equivalent ground) while inserting or removing sensitive product
from the cart or tote tray.
New carts purchased should be equipped with a common ground point, typically a banana jack.
They should also be equipped with drag chains and/or conductive wheels when used in
conjunction with ESD Safe flooring. They must also have, grounded dissipative surfaces and
comply with local standards. They should be designed so that there is no direct contact between
the conductive elements of the cart and the conductors of ESD sensitive product.
Older carts that are not equipped with a common ground point can still be used by grounding the
tote trays individually during insertion and removal of ESD sensitive product. These carts should
also be equipped with drag chains such that 12 to 18 inches is in contact when used with
conductive flooring.
NOTE: While not preferred, when used in conjunction with an EOS/ESD approved flooring
system, drag chains are a substitute for ground cords. Ground cords (or equivalent) are
the preferred method for grounding for carts.
9.2
Static-Safe Packaging
All products containing ESD sensitive devices must be shipped/received in
ESD -safe packaging that is marked with an industry-standard Static
Awareness Symbol. (See Figure below the lettering is black on a yellow
background.) All packaging materials used for these items must be ESD safe.
The static awareness label identifies contents that are ESD sensitive and
require special handling precautions at the receiving end. ESD safe material
test specifications are defined in EIA No 541, Packing Materials Standards
for Protection of Electrostatic discharge Sensitive Devices, from the
Electronic Industries Association. All packaging materials must meet one of
the following criteria:
Use of Static Intercept packaging.
Initially qualified and periodically re-qualified based on local needs.
Verification from supplier of package adherence/certification and be
documented.
If none of the above criteria are met, a waiver should be requested. A one-half
inch air gap is a recommended technique for providing shielding protection for
ESD sensitive devices or assemblies. Static-dissipative packaging dunnage
often provides adequate spacing.
9.3 ESD Safe Trays, Tape and Reel, Tubes and Tote Boxes
Employees must load and unload sensitive products as determined by the area ESD
classification. In Class 0 and Class 1A areas, totes, Tape and Reel, or other containers, and carts
(conductive or ESD safe) must be properly grounded when being loaded or unloaded. In Class 0,
1A, 1B, and 1C areas, when unloading or loading metal trays, racks and other metal containers
that may contact the conductors of sensitive products, the containers must also be connected to
ground through an ESD safe surface or some other ground path.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 36 of 52
Tote boxes must meet the requirements of X-20938 (see Appendix B).
NOTE: Some Tape and reel packaging does not currently comply with packaging requirements
(per X-20775, see Appendix B) and should not be used.
NOTE: Tubes are not permitted for Class 0 CDM sensitive devices. This is because most tubes
charge devices enough to jeopardize Class 0 CDM sensitive devices.
These requirements apply only when handling sensitive products directly. In other words, the
containers may be transported or handled without grounding as long as personnel or equipment
does not contact the contents.
Method 1
Method 1 consists of grounding all of the workstations facilities, equipment, carts, shelves, work
surfaces, and personnel to the common ground, which is also referred to as the 'ESD common
point ground'. This type of grounding typically takes place through the use of the facility or earth
ground.
Method 2
Method 2 consists of grounding all of the workstations facilities, equipment, carts, shelves, work
surfaces, and personnel to the equipment ground which is connected to the earth electrical
ground connection (This connection is not the neutral supply line). This is now the preferred
ground connection method because all electrical equipment at the workstation is already
connected to this ground. Connecting the ESD control materials or equipment to the equipment
ground brings all components of the workstation to the same electrical potential.
Caution: If a soldering iron used to repair an ESDS item were connected to the electrical ground
and the surface containing the ESDS item were connected to an auxiliary ground, a difference in
electrical potential could exist between the iron and the ESDS item. This difference in potential
could cause damage to the item. Thus, any auxiliary grounds (water pipe, building frame, ground
stake) present and used at the workstation must be bonded to the equipment ground to minimize
differences in potential between the two grounds.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 37 of 52
material will not build up static charge. The surface of the material must be dissipative under all
humidity conditions and must always be grounded. Local engineering standards specify
installation procedures, including proper common point grounding methods.
Areas that incorporate mechanized transport systems are potential problems unless antistatic
belts and metal roller bushings are used. Gravity-fed flow racks with metal skate wheels should
be installed. In addition, all mechanized equipment used for moving material must be wired to
ground and proper materials selected to avoid triboelectric charging. Soldering irons and desoldering tools are also potential hazards. In some instances, soldering irons are not grounded
and may produce transients. Solder suckers that are not static-safe should never be allowed at
the workplace. The ESD sensitive devices are also susceptible to damage from electrical
overstress (OS) from vacuum solder suckers and similar equipment.
Applying or removing static-generating tape or labels can present significant risk and is permitted
but not recommended for ESD sensitive items. An engineering evaluation is necessary to
establish a safe means of application or removal of tape. Consideration should include the size of
the tape/label, type of adhesive, air ionization, grounding via static-dissipative conductive foam,
triboelectric charging of the PWB assembly and contact with conductors, etc.
until ready to insert into a bay. Otherwise, open all circuit packs at a static-safe work
position with wrist straps and dissipative tablemats.
5. Always store and transport circuit packs in Static Intercept static-dissipative packaging
or containers. Shielding is not required unless specified.
6. Keep all static-generating materials such as food
STYROFOAM containers away from all circuit packs.
wrappers,
plastics,
and
7. When removing circuit packs from a bay, immediately put them into static-dissipative
packages or containers.
8. Use only dissipative materials for shipment. Shielding is not required unless specified.
9. Whenever possible and reasonable, maintain relative humidity above 40%.
10. Some systems require system ESD protection for safe operation. Refer to the System
Operating Procedure for specifics
Team Champions:
- John Wronka: Director, Global Quality & Customer Satisfaction/CTO
- Marc Benowitz: Director CTO Reliability Engineering
- Richard Dela Fuente: Senior Manager, ALU QMS Project Lead/CTO
- Bill Reents: CMTS, CTO Reliability Engineering
Air Ionizers: Equipment that provides a charged atmosphere, consisting of both positive and
negative ions. Air ionizers neutralize static charge accumulation on insulators.
Bipolar Transistor: A device containing junction semiconductors that uses both positive (ptype) and negative (n-type) charge carriers.
CMOS: An integrated circuit that uses complementary n-channel and p-channel metal oxide
semiconductor transistors.
Component: Any packaged or unpackaged electronic device or assembly of devices (such as a
multichip module) that is handled as a unit.
Common Point Ground: Defined as a "system or method for connecting two or more
grounding conductors to the same electrical potential."
Conductor: A material that allows a current of electrons to pass continuously along it or through
it when a voltage is applied. These materials exhibit low resistance.
Coulomb: The unit of quantity of electricity or charge. One coulomb is the quantity of charge
transferred by a current of 1 ampere in 1 second.
Dual In-line Package (DIP): An integrated circuit housing having two rows of pins..
Dissipative: Material exhibiting a surface of resistivity of 10 5 to < 10 12 ohms per square.
Dissipative materials bleed off charge at an optimal rate, neither two fast nor too slow.
For a more complete definition of terms used in the industry, refer to the EOS/ESD Glossary of Terms..
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 43 of 52
Electrostatic Field: The region surrounding an electrically charged object in which another
electrical charge can be induced and will exert a force.
EMS: Electronic Manufacturing Service (contract manufacture)
EOS: Electrical over stress.
EPROM: Erasable programmable read-only memory.
Electrostatic Discharge (ESD): A sudden transfer of charge between two objects.
Electrostatic-Discharge-Sensitive (ESDS): Term used to describe devices that, because
of their fine-line designs, are vulnerable to damage from electrostatic discharge.
Film Resistor: A resistor made by depositing of a resistive metal or compound onto a
substrate.
Laser: Device that converts electrical energy of mixed frequencies to one or more discrete
frequencies of highly amplified and coherent optical energy.
Latent Failure: Failure that occurs while using a device that has been previously weakened and
degraded by ESD exposure.
Ohms per Square: A unit of surface resistance. The surface resistance of a material is
numerically equal to the resistance between two electrodes forming opposite sides of a square.
The size of the square is immaterial.
Static-Safe: Conditions or materials that provide adequate protection for the product sensitivity
involved. (See the Static-Safe section for more information.)
Statistical Process Control: The application of statistical techniques to the control or
processes. Sometimes Statistical Process Control and Statistical Quality Control are used
synonymously.
Surface Resistivity: The ratio of DC electric field (V/meter) to surface current density
(amps/meter), measure in ohms per square.
Triboelectric: A term referring to static charge generated by friction or separation of materials.
Volt: The unit of electromotive force or potential. One volt sends a current of 1 ampere through a
resistance of 1 ohm.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 45 of 52
Wafer: A slice of semiconductor material that forms the starting substrate for active device
fabrication.
Title
91NJ1045
ISBN 0-442-00636-5
ISBN 0-442-23794-5
SC 500-001
X-19435
X-20775
X- 21386
801-001-109
X-20878
X-20938
X-21003
X-21015
X-21382
X-74545
For Lucent employees: additional ESD specifications may be found by going to the SCN
Supplier Management Portal (http://gcim.web.lucent.com/sle-cgi/uncgi/GCIM.ksh/07/00 )
APPENDIX C REFERENCES
Avery, L. R., Charged Device Model Testing: Trying to Duplicate Reality, EOS/ESD Symposium
Proceedings, 1987, pp. 88-92.
Biermann, G., A Statistical Method for the Detection of Gate Oxide Breakdowns due to Fast EOS
Events, such as ESD, on Power Devices, EOS/ESD Symposium Proceedings, 1993, pp. 143148.
Bossard, P. R., et al, ESD Damage From Triboelectrically charged Pins, EOS/ESD Symposium
Proceedings, 1980, pp. 17-22.
Carter, G., Streaming Potential ESD Shifts During Post Dicing High Pressure Spray Rinse
Operation, EOS/ESD Symposium Proceedings, 1991, pp. 50-58.
Chase, E., ESD Evaluation of EPROMS, EOS/ESD Symposium Proceedings, 1981, pp. 236241.
Chemelli, R. G., Unger, B. A., Bossard, P. R., ESD by Static Induction, EOS/ESD Symposium
Proceedings, 1983, EOS-5, pp. 29-36.
Colvin, J., The Identification and Analysis of Latent ESD Damage on CMOS Input Gates,
EOS/ESD Symposium Proceedings, 1993, pp. 109-116.
Dangelmayer, G. T., A Realistic and Systematic ESD Control Plan, EOS/ESD Symposium
Proceedings, 1984, pp. 1-6.
Dangelmayer, G. T., A Sysematic ESD Program Revisited, EOS/ESD Symposium Proceedings
1992, pp. 1-8.
Dangelmayer, G. T., ESD How Often Doe It Happen? EOS/ESD Symposium Proceedings,
1983, pp. 1-5.
Dangelmayer, G. T., ESD Program Management, ISBN 0-442-23794-4, Van Nostrand Reinhold,
1990.
Dangelmayer, G. T., and Jesby, E. S., Employee Training for Successful ESD Control,
EOS/ESD Symposium Proceedings, 1985, pp. 20-23
DeChiaro, L. F., Electro-Thermomigration in NMOS LSI Devices, IEEE Reliability Physics
Symposium
Proceedings, 1981, pp. 223-229.
DeChiaro, L. F., et al, Input ESD Protection Networks for Fineline NMOS Effects of Stressing
Waveform and Circuit Layout, IEEE Reliability Physics Symposium Proceedings, 1986, pp. 206214.
Diep, T., et al, PIN Photoelectors The ESD Bottleneck in Laser Packages, EOS/ESD
Symposium Proceedings, 1992, pp. 159-167.
Euzent, B. L., et al, Reducing Field Failure Rate with Improved EOS/ESD Design, EOS/ESD
Symposium Proceedings, 1991, pp. 59-64.
Franey, J., Renninger, R., Field-Induced ESD from CRTs: Its Cause and Cure, EOS/ESD
Symposium Proceedings, 1994, pp. 42-48.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 48 of 52
Franey J., Freund, R., A New Permanent ESD and Corrosion-Resistant Material, EOS/ESD
Symposium Proceedings, 1991, pp. 210-215.
Fukuda, Y., ESD Protection Network Evaluation by HBM and Charged Package Methos (CPM),
EOS/ESD Symposium Proceedings, 1986, pp. 193-199.
Himmel, R. P., the Effect of Static Electricity on Thick Film Resistors, Insulation/Circuits,
Sepember 1972, pp. 41-44.
Hyatt, H., et al, A Closer Look at the Human ESD Event, EOS/ESD Symposium Proceedings,
1981, pp. 1-8.
Jon, M. C., and Welsher, T. L., The Metallurgical Analysis of ESD Damage in 256K DRAMS,
EOS/ESD Symposium Proceedings, 1987, pp. 78-87.
Jon, M. C., and Welsher, t. L., An Experimental Investigation of the Electrostatic Discharge
(ESD) Mechanism in Packaged Semiconductor Devices, Journal of Electrostatics, vol. 32, No. 1,
January 1994, pp. 43-70.
Jon, M. C., Robinson-Hahn, D., and Welsher, T., Tape and Reel Packaging An ESD Concern,
EOS/ESD Symposium Proceedings, 1988, pp. 15-23.
Keller, J. K., Protection of Integrated Circuits from Destruction by Electrostatic Discharge, BTL
Electronics Letters, September 1978, pp. 9-12.
King, W. M., Dynamic Waveform Characteristics of Personnel Electrostatic Discharge,
EOS/ESD Symposium Proceedings, 1979, pp.78-87.
Kirk, W. J., Jr., et al, Eliminate Static Damage to Circuits, Electronic Design, March 29, 1976.
Lin, C. M., et al, Design and Test Results for a Robust CMOS VLSI Input Protection Network,
EOS/ESD Symposium Proceedings, 1986, pp. 188-192.
Lin, D. L., Jon, M. C., Off-Chip Protection: Shunting of ESD Current by Metal Fingers on
Integrated Circuits and Printed Circuit Boards, EOS/ESD Symposium Proceedings, 1994, pp.
279-285.
Lin, d. L., and Welsher, . L., ESD Stressing of Simulated Circuit Packs, EOS/ESD Symposium
ProceedingsI, 1990, pp. 61-73.
Lin, D. L., et al, On the Validity of ESD Voltage Thresholds Obtained Using Commercial HumanBody Model Simulators, 25th Annual Proceedings of the Reliability Physics Symposium, 1987,
pp. 77-84.
Maloney, T. J., Designing MOS Inputs and Outputs to Avoid Oxide Failure in the Charged Device
Model, EOS/ESD Symposium Proceedings, 1988, pp. 220-227.
Maloney, T. J., Integrated Circuit Metal in the Charged Device Model: bootstrap Heating, Melt
Damage and Scaling Laws. EOS/ESD Symposium Proceedings, 1992, pp. 129-134.
McFarland, W. Y., et al, Minimizing Electrostatic Damage on the DIMENSION PBX
Manufacturing Line, Western Electric Memorandum For Record, February 5, 1979.
McFarland, W. Y., Brin, R., Youve Implemented an ESD Program Whats Net? EOS/ESD
Symposium Proceedings, 1993, pp. 41-47.
Minear, r. L., and Dodson, G. A., Effects of Electrostatic Discharge on Linear Integrated Circuits.
IEEE Reliability Physics Symposium Proceedings, April 1977, pp. 138-143.
ALCATEL-LUCENT ESD CONTROL HANDBOOK ISSUE 13 CLASSIFICATION= OPENPage 49 of 52
Minear, R. L., and Dodson, G. A., The Phantom Emitter an ESD-Resistant Bipolar Transistor
Design and its Applications to Linear Integrated Circuits, EOS/ESD Symposium Proceedings,
September, 1979, pp. 188-192.
Pancholy, r. K., Gate Protection for CMOS/SOS, IEEE Reliability Physics Symposium
Proceedings, April 2977, pp. 132-136.
Pon, H., and Maloney, T. J., High Current ESD Damage to MOS I/O Structures Caused by
Charged Video Monitor Surfaces and Casings. EOS/ESD Symposium Proceedings, 1989, pp.
78-83.
Renninger, R. G., et al, A Field Induced Charged Device Model Simulator, EOS/ESD
Symposium Proceedings, 1989, pp. 59-71.
Renninger, R. G., Mechanisms of Charged-Device Model Electrostatic Discharges, EOS/ESD
Symposium Proceedings, 1991, pp. 127-143.
Renninger, R. G., et al, A Microwave-Bandwidth Waveform Monitor for Charged-Device Model
Simulators, EOS/ESD Symposium Proceedings, 1988, pp. 162-171.
Rickers, H. C., and Walker, R. C., Protecting Against Electrostatic Discharge Damage in
Semiconductors, RAC Reliability Workshop, 1976..
Schreier, L. A., Electrostatic Damage Susceptibility of Semiconductor Devices, IEEE Reliability
Physics Symposium Proceedings, 1978.
Smith, D. C., A New Type of Furniture ESD and its Implications, EOS/ESD Symposium
Proceedings, 2993, pp. 3-5.
Smith, D. C., High-Frequency Measurements and Noise in Electronic Circuits, ISBN 0-44200636-5, Van Nostrand Reinhold, 1993.
Smith, D. C., Techniques and Methodologies for Making System-Level ESD Response
Measurements for
Troubleshooting or Design Verification, EOS/ESD Symposium Proceedings, 1992, pp. 47-54.
Snavely, H. C., Generation of Electrostatic Potentials at Mass Solder Cleaning and a Solution to
the Problem, Western Electric Memorandum For Record, August 10, 1978.
Snow, L., Dangelmayer, G. T., A Successful ESD Training Program, EOS/ESD Symposium
Proceedings, 1994, pp. 1-12.
Speakman, T. s., A Model for Failure of Bipolar Silicon Integrated Circuits Subjected to
Electrostatic Discharge, IEEE Reliability Physics Symposium Proceedings, 1974.
Strauss, M. S., et al, Variations in Failure Modes and Cumulative Effects Produced by
Commercial Human-Body Model Simulators, EOS/ESD Symposium Proceedings, 1987, pp. 5963.
Tan, W. H., Minimizing ESD Hazards in IC Test Handlers and Automatic Trim/Form Machines,
EOS/ESD Symposium Proceedings, 1993, pp. 57-64.
Tanaka, M., et al, An Advanced ESD Test Method for Charged Device Model, EOS/ESD
Symposium Proceedings, 1992, pp. 76-87.
for
Network
Electromagnetic Compatibility for Industrial Process Measurement and Control Equipment, Part
2: electrostatic Discharge Requirements, IEC Standard, Pub. 801-2, Second Ed., 1991-04.
Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts,
Assemblies and Equipment, Department of Defense Handbook 263A, February 22, 1991 (MILHDBK-263).
Electrostatic Discharge Control in the Manufacture of Telecommunications Equipment, Bell
Communication Research, TA-TSY-000870, Issue 1, April 1988.
Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts,
Assemblies and Equipment, Department of Defense Standard 1686, December 31, 1992 (MILSTD-1686). EOS/ESD Symposium Proceedings, 1979-1994.
ESD Association Specifications, IEC 801-2, Second Edition, 1991.
ESD Protective Material & Equipment: A Critical Review, Reliability Analysis Center, Spring
1982 (Order No. SOAR-1).
Guide for Electrostatic Discharge Test Methodologies and Criteria for Electronic Equipment,
ANSI C63.16. Integrated Circuits A Users Guide, Western Electric, 1983.
Packaging Materials Standards for ESD-Sensitive Items, Electronic Industries Association EIA541, 1988.
Standard Test Methods for DC Resistance or Conductance of Insulating Materials, ASTM D257-92..
Generic Requirements For ESD Protective Workstation, BR-GR-1421-CORE Issue: 02 199506-01