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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 64, NO. 4, APRIL 2015
I. I NTRODUCTION
Fig. 1.
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MAI-KHANH et al.: NEAR-FIELD MAGNETIC SENSING SYSTEM WITH HIGH-SPATIAL RESOLUTION AND APPLICATION
Fig. 2.
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the relationship of the magnetic flux through the coil and the
coils voltage, Vcoil . Current I of the wire produces magnetic
flux B as BiotSavart law: B = (0 I /2)X ln(r + Y /r ).
If the coil is in a perpendicular direction to the magnetic plane
of the wire, one can write
0
r + Y dI
d B
= N
X ln
(1)
dt
2
r dt
where 0 is the vacuum permeability. If I = I0 sin(2 f 0 t)
Vcoil = N
r +Y
I0 f cos(2 f 0 t).
(2)
r
To enhance Vcoil , increments of both N and X can be
applied but the former confronts the limitation of the number
of metal layers in a determined CMOS technology process
while the latter can offer easily multi-increment in Vcoil .
Therefore, we proposed a magnetic pick-up coil with a larger
size of X = 500 m and Y = 100 m, five times bigger than
that in [18] and [19], to allow more magnetic flux through
the coil, as shown in Fig. 3. The Si-substrate under the coil is
removed by applying an FIB process to avoid eddy currents
and enhance both inductance L and quality factor Q of the
coil [19]. Quality factor of a coil is defined as
Vcoil = N0 X ln
Q = 2
(E mag E elec )
E loss
(3)
where E mag and E elec are peak magnetic and electric energies
stored, respectively, and E loss is the energy loss per cycle [21].
Q is detailed as a product of ideal quality factor (ideal-Q),
substrate loss factor, and self-resonance factor [22]. Ideal-Q
accounts for the magnetic energy stored and the ohmic loss
in series resistance of the coil while self-resonance factor
depends on the increment of electric energy stored. Substrate
loss factor represents the energy dissipated in the Si-substrate.
Note that both substrate loss factor and self-resonance factor
are less than 1. The removal of the Si-substrate under the
coil eliminates the loss on the resistive Si-substrate, reduces
coil-substrate coupling capacitors, and enhances the coils selfinductance. Fig. 4 shows the improvement on L and Q of the
coil when its Si-substrate is removed. The improvement on
L enhances the magnetic energy E mag stored in the coil. The
Si-substrate removal reduces peak electric energy and hence
enhances the quality factor Q of the coil.
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 64, NO. 4, APRIL 2015
Fig. 5. Periodic rectangular pulse signal x(t) and its harmonic amplitude
function cn in a case of duty cycle D = 1/6. A wideband amplifier is required
due to the existence of sufficient amplitude harmonics.
+
n=1
= D A +
cn cos(nt)
+
2A
n=1
sin(n D)cos(nt)
(4)
(5)
MAI-KHANH et al.: NEAR-FIELD MAGNETIC SENSING SYSTEM WITH HIGH-SPATIAL RESOLUTION AND APPLICATION
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Fig. 7. Calibration setup diagram with a real-time microphotograph for calibration. Details of connection cables between computer and other equipment
are omitted.
Fig. 9. Results of the flatness and magnetic scanning on an MS line with
h thickness. The flatness map including relative surface roughness values is
then used in the magnetic scan step to keep the liftoff constant. Note that the
resolution of the flatness scan must be higher or equal to the magnetic scan
resolution.
Fig. 8.
Calibration setup picture and the base PCB with the probe chip.
fed to the computer for monitoring and controlling the calibration process. The distance of the laser original point (LOP) to
any surfaces below can be measured by the laser camera but
the gap between LOP and the probe head should be calculated
by the first calibration step.
The first step of the calibration is to find the gap in z-axis
from LOP to the probe chip head. This step is performed only
once by measuring the distance hz from LOP to the metal
block surface and then manually finding the gap h0 between
the probe chip head and the block surface as depicted in Fig. 7.
Therefore, the gap between LOP and the probe head is the
result of (hz h0). To measure h0, the probe arm is gradually
lowered close to the flat surface of the metal block as shown in
Fig. 8 so that the chip head and the metal block surface can be
in range of the fixed camera and observed on the display. Then,
h0 is measured manually based on the mesh on the display.
Camera position is fixed and the camera lens is set together
with an appropriate distance resolution corresponding to the
display mesh; for example, 20 m/div, as shown in Fig. 7.
From now, the gap between LOP and the probe chip head is
saved and used to calculate the liftoff of the probe chip head
to the surface of any DUTs by the laser.
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 64, NO. 4, APRIL 2015
Fig. 12.
Fig. 10. Two measurement setups using network analyzer and spectrum
analyzer to measure the gain between the probe chip output and the
MS-line input and the probe output versus MS-line positions.
Fig. 11.
Measured gain between the probe output and the MS-line input.
Fig. 13. (a) Scan setup on FPGA. (b) FPGA floorplanning. (c) Scanned
magnetic cartography of the whole FPGA surface.
MAI-KHANH et al.: NEAR-FIELD MAGNETIC SENSING SYSTEM WITH HIGH-SPATIAL RESOLUTION AND APPLICATION
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TABLE I
M AGNETIC C ARTOGRAPHY S CANNED BY MT-545 C OMMERCIAL P ROBE
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 64, NO. 4, APRIL 2015
TABLE II
M AGNETIC C ARTOGRAPHY S CANNED BY THE P ROPOSED P ROBE
TABLE III
33-mm2 S CANNED M AGNETIC C ARTOGRAPHY OF THE
S-B OX 1 A REA BY THE P ROPOSED P ROBE
MAI-KHANH et al.: NEAR-FIELD MAGNETIC SENSING SYSTEM WITH HIGH-SPATIAL RESOLUTION AND APPLICATION
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TABLE IV
C OMPARISON W ITH O THER W ORKS
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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, VOL. 64, NO. 4, APRIL 2015