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A1
641
OP
A1
642
OPA1641
OPA1642
OPA1644
OP
A1
64
Burr-Brown Audio
www.ti.com
High-Performance, JFET-Input
AUDIO OPERATIONAL AMPLIFIERS
Check for Samples: OPA1641, OPA1642, OPA1644
FEATURES
DESCRIPTION
234
APPLICATIONS
are
V+
Pre-Output Driver
IN-
OUT
IN+
V-
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SoundPlus is a trademark of Texas Instruments Incorporated.
BLU-RAY is a trademark of Blu-Ray Disc Assocation.
All other trademarks are the property of their respective owners.
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
UNIT
40
10
mA
(2)
VS
V
Continuous
Operating Temperature, TA
55 to +125
Storage Temperature, TA
65 to +150
Junction Temperature, TJ
+150
3000
1000
100
ESD Ratings
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10mA or less.
Short-circuit to VS/2 (ground in symmetrical dual-supply setups), one amplifier per package.
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
SO-8
O1641A
MSOP-8
DGK
1641
O1642A
SO-8
MSOP-8
DGK
1642
SO-14
O1644AG4
TSSOP-14
PW
O1644A
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
OPA1641
OPA1642
OPA1644
www.ti.com
CONDITIONS
MIN
TYP
MAX
UNIT
AUDIO PERFORMANCE
Total Harmonic Distortion +
Noise
THD+N
Intermodulation Distortion
IMD
0.00005
126
dB
G = +1, VO = 3VRMS
SMPTE/DIN Two-Tone, 4:1 (60Hz and 7kHz)
0.00004
128
dB
0.00008
122
dB
0.00007
123
dB
MHz
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
G = +1
11
SR
G = +1
20
V/ms
VO = 1VP
3.2
MHz
G = 10
600
ns
f = 1kHz
126
dB
f = 20Hz to 20kHz
4.3
mVPP
f = 10Hz
nV/Hz
f = 100Hz
5.8
nV/Hz
f = 1kHz
5.1
nV/Hz
f = 1kHz
0.8
fA/Hz
NOISE
Input Voltage Noise
Input Voltage Noise Density
en
In
OFFSET VOLTAGE
Input Offset Voltage
vs Power Supply
VOS
VS = 18V
3.5
mV
VS = 2.25V to 18V
0.14
mV/V
IB
VCM = 0V
20
pA
IOS
VCM = 0V
20
pA
PSRR
VCM
CMRR
(V)-0.1
VCM = (V) 0.1V to (V+) 3.5V, VS = 18V
120
(V+)3.5
126
dB
1013 || 8
|| pF
1013 || 6
|| pF
INPUT IMPEDANCE
Differential
VCM = (V) 0.1V to (V+) 3.5V
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
(1)
(2)
AOL
120
134
dB
114
126
dB
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
Voltage Output Swing from Rail
VO
Output Current
(V)+0.2
(V+)0.2
(V)+0.35
(V+)0.35
IOUT
ZO
Short-Circuit Current
ISC
Source
ISC
Sink
CLOAD
+36
mA
30
mA
POWER SUPPLY
Specified Voltage
VS
Quiescent Current
(per amplifier)
IQ
2.25
IOUT = 0A
1.8
18
2.3
mA
TEMPERATURE RANGE
Specified Range
40
+85
Operating Range
55
+125
Thermal Resistance
qJA
SO-8
138
C/W
MSOP-8
180
C/W
SO-14
97
C/W
TSSOP-14
135
C/W
PIN ASSIGNMENTS
OPA1641
SO-8, MSOP-8
(TOP VIEW)
NC
(1)
OPA1644
SO-14, TSSOP-14
(TOP VIEW)
(1)
NC
-In
V+
+In
Out
V-
NC
Out A
-In A
2
A
OPA1642
SO-8, MSOP-8
(TOP VIEW)
-In A
+In A
V-
A
B
Out D
13
-In D
+In A
12
+In D
V+
11
V-
+ In B
10
+ In C
(1)
OUT A
14
V+
Out B
-In B
+In B
-In B
-In C
Out B
Out C
OPA1641
OPA1642
OPA1644
www.ti.com
100nV/div
100
10
1
0.1
10
100
1k
10k
Time (1s/div)
100k
Frequency (Hz)
Figure 1.
Figure 2.
35
25
Maximum output
voltage range
without slew-rate
induced distortion
VS = 15V
30
20
15
VS = 5V
10
VS = 2.25V
140
CMRR
120
100
-PSRR
80
+PSRR
60
40
20
0
0
10k
100k
1M
10M
10
100
1k
10k
100k
1M
10M
100M
Frequency (Hz)
Frequency (Hz)
Figure 3.
Figure 4.
30
120
Gain
20
135
90
60
40
Phase
G = +10
Gain (dB)
80
Phase (degrees)
Gain (dB)
100
10
G = +1
0
45
20
-10
G = -1
0
-20
50 100
1k
10k
100k
1M
10M
0
100M
-20
100k
Frequency (Hz)
1M
10M
100M
Frequency (Hz)
Figure 5.
Figure 6.
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
0.0001
-120
G = +1
RL = 2kW
0.00001
VOUT = 3VRMS
BW = 80kHz
-140
10
100
-80
0.01
RSOURCE OPA1641
-120
0.0001
RSOURCE = 0W
0.00001
10
Frequency (Hz)
Figure 7.
Figure 8.
10k 20k
100
G = -1
RL = 2kW
-120
0.0001
G = +1
RL = 2kW
100
1k
-140
100k
10k
-100
0.00001
-80
+15V
RSOURCE OPA1641
RSOURCE = 600W
RL
-15V
0.001
RSOURCE
= 150W
0.0001
VOUT = 3VRMS
BW > 500kHz
0.00001
10
100
1k
INTERMODULATION DISTORTION vs
OUTPUT AMPLITUDE
0.0001
-120
G = -1, RL = 2kW
G = +1, RL = 2kW
-140
1
10
20
-80
G = +1
SMPTE/DIN
Two-Tone
4:1 (60Hz and 7kHz)
0.001
-100
DIM30
(3kHz square wave
and 15kHz sine wave)
0.0001
-120
CCIF Twin-Tone
(19kHz and 20kHz)
0.00001
-100
0.01
-80
Figure 10.
-140
0.1
10
20
Figure 11.
-140
100k
10k
Frequency (Hz)
0.001
0.1
-120
RSOURCE = 0W
Figure 9.
BW = 80kHz
1kHz Signal
RSOURCE = 0W
0.00001
-100
RSOURCE = 300W
Frequency (Hz)
0.01
-140
20k
G = +1
RL = 600W
10k
0.01
Total Harmonic Distortion + Noise (dB)
G = -1
RL = 600W
0.001
VOUT = 3VRMS
BW = 80kHz
VOUT = 3VRMS
BW > 500kHz
-100
RSOURCE = 600W
RSOURCE = 300W
RL
-15V
0.001
1k
Frequency (Hz)
1k
0.01
10
RSOURCE
= 150W
+15V
0.001
Figure 12.
OPA1641
OPA1642
OPA1644
www.ti.com
-90
NO PHASE REVERSAL
VS = 15V
VOUT = 3VRMS
G = +1
Output
-100
RL = 600W
5V/div
-80
-110
-120
+18V
RL = 2kW
OPA1641
Output
-18V
37VPP
Sine Wave
(18.5V)
-130
RL = 5kW
-140
100
10
1k
10k
Time (0.4ms/div)
100k
Frequency (Hz)
Figure 13.
Figure 14.
20mV/div
20mV/div
G = +1
CL = 100pF
+15V
OPA1641
-15V
RL
RI
= 2kW
RF
= 2kW
+15V
OPA1641
CL
CL
-15V
Time (100ns/div)
Time (100ns/div)
Figure 15.
Figure 16.
G = +1
CL = 100pF
2V/div
2V/div
G = -1
CL = 100pF
Time (400ns/div)
Figure 17.
Time (400ns/div)
Figure 18.
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
G = -10
G = -10
5V/div
5V/div
VIN
20kW
20kW
2kW
VIN
2kW
VOUT
OPA1641
OPA1641
VIN
VOUT
VIN
VOUT
Time (0.4ms/div)
40
Time (0.4ms/div)
Figure 19.
Figure 20.
SMALL-SIGNAL OVERSHOOT
vs CAPACITIVE LOAD (100mV Output Step)
SMALL-SIGNAL OVERSHOOT
vs CAPACITIVE LOAD (100mV Output Step)
G = +1
35
45
ROUT = 0W
RI = 2kW
+15V
40
ROUT
+15V
OPA1641
RL
ROUT
35
CL
OPA1641
CL
-15V
Overshoot (%)
Overshoot (%)
30
25
ROUT = 24W
20
15
ROUT = 51W
30
ROUT = 24W
-15V
25
20
ROUT = 51W
15
10
10
0
0
ROUT = 0W
RF = 2kW
G = -1
100 200 300 400 500 600 700 800 900 1000
100 200 300 400 500 600 700 800 900 1000
Figure 21.
Figure 22.
70
-0.2
60
10kW
AOL (mV/V)
-0.4
-0.6
2kW
-0.8
+IB
50
40
30
20
-IB
10
0
-1.0
-10
-1.2
-40
-IOS
-20
-15
10
35
60
85
-40
-15
Figure 23.
10
35
60
85
Temperature (C)
Temperature (C)
Figure 24.
OPA1641
OPA1642
OPA1644
www.ti.com
VS = 18V
2.0
+IB
-IB
2
0
IQ (mA)
IOS
-2
1.5
1.0
-4
-6
0.5
-8
Common-Mode Range
-10
-18
-12
-6
12
0
-40 -25 -10
18
20
Figure 25.
50
65
80
95
110 125
Figure 26.
2.00
60
1.75
50
1.50
ISC-SOURCE
40
ISC (mA)
1.25
IQ (mA)
35
Temperature (C)
1.00
0.75
30
ISC-SINK
20
0.50
0.25
10
VOUT = Midsupply
(includes self-heating)
0
0
12
16
20
24
28
32
36
-50
-25
25
50
75
100
125
Temperature (C)
Figure 27.
Figure 28.
18.0
17.5
16.5
100
16.0
-40C +25C
+85C
ZO (W)
17.0
+125C
-16.0
10
-16.5
-17.0
-17.5
1
-18.0
0
10
20
30
40
50
10
100
1k
Figure 29.
10k
100k
1M
10M
100M
Frequency (Hz)
Figure 30.
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
APPLICATION INFORMATION
The OPA1641, OPA1642, and OPA1644 are
unity-gain stable, audio operational amplifiers with
very low noise, input bias current, and input offset
voltage. Applications with noisy or high-impedance
power supplies require decoupling capacitors placed
close to the device pins. In most cases, 0.1mF
capacitors are adequate. The front-page drawing
shows a simplified schematic of the OPA1641.
OPERATING VOLTAGE
EO
1k
100
OPA1641
Resistor Noise
10
2
1
100
1k
10k
100k
1M
NOISE PERFORMANCE
Figure 31 shows the total circuit noise for varying
source impedances with the operational amplifier in a
unity-gain configuration (with no feedback resistor
network and therefore no additional noise
contributions). The OPA1641, OPA1642, and
OPA1644 are shown with total circuit noise
calculated. The op amp itself contributes both a
voltage noise component and a current noise
component. The voltage noise is commonly modeled
as a time-varying component of the offset voltage.
The current noise is modeled as the time-varying
component of the input bias current and reacts with
the source resistance to create a voltage component
of noise. Therefore, the lowest noise op amp for a
given application depends on the source impedance.
For low source impedance, current noise is negligible,
and voltage noise generally dominates. The
OPA1641, OPA1642, and OPA1644 family has both
low voltage noise and extremely low current noise
because of the FET input of the op amp. As a result,
the current noise contribution of the OPA164x series
is negligible for any practical source impedance,
which makes it the better choice for applications with
high source impedance.
10
OPA1611
RS
OPA1641
OPA1642
OPA1644
www.ti.com
R2
2
2
O
R1
R2
= 1+
R1
R2
2
n
e +
2
2
R1
e1 + e2 + 1 +
R2
R1
es2
EO
RS
Where eS =
e1 =
e2 =
VS
R2
2
2
EO
R1
RS
= 1+
R2
R1 + RS
R2
en +
R 1 + RS
2
2
1
e + e2 +
R2
R 1 + RS
e s2
EO
VS
Where eS =
e1 =
e2 =
11
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
R2
SIGNAL DISTORTION
GAIN
GAIN
R3
Signal Gain = 1+
OPA1641
VO = 3VRMS
R2
R1
Distortion Gain = 1+
R2
R1 II R3
Generator
Output
R1
R2
R3
101
1kW
10W
11
101
100W
1kW
11W
Analyzer
Input
Audio Precision
System Two(1)
with PC Controller
(1)
Load
12
OPA1641
OPA1642
OPA1644
www.ti.com
PHASE-REVERSAL PROTECTION
R2
VOUT
OPA164x
VIN
13
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
ELECTRICAL OVERSTRESS
Designers often ask questions about the capability of
an operational amplifier to withstand electrical
overstress. These questions tend to focus on the
device inputs, but may involve the supply voltage pins
or even the output pin. Each of these different pin
functions have electrical stress limits determined by
the voltage breakdown characteristics of the
particular semiconductor fabrication process and
specific circuits connected to the pin. Additionally,
internal electrostatic discharge (ESD) protection is
built into these circuits to protect them from
accidental ESD events both before and during
product assembly.
It is helpful to have a good understanding of this
basic ESD circuitry and its relevance to an electrical
overstress event. Figure 35 illustrates the ESD
circuits contained in the OPA164x series (indicated
by the dashed line area). The ESD protection circuitry
involves several current-steering diodes connected
from the input and output pins and routed back to the
internal power-supply lines, where they meet at an
absorption device internal to the operational amplifier.
This protection circuitry is intended to remain inactive
during normal circuit operation.
14
www.ti.com
OPA1641
OPA1642
OPA1644
www.ti.com
(2)
TVS
RF
+V
+VS
OPA1641
RI
-In
(3)
RS
+In
Op-Amp
Core
Edge-Triggered ESD
Absorption Circuit
ID
VIN
Out
RL
(1)
-V
-VS
(2)
TVS
(1)
(2)
(3)
Figure 35. Equivalent Internal ESD Circuitry and Its Relation to a Typical Circuit Application
15
OPA1641
OPA1642
OPA1644
SBOS484B DECEMBER 2009 REVISED AUGUST 2010
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (April, 2010) to Revision B
Page
16
Page
Removed product-preview information for OPA1644 device packages throughout document ............................................ 2
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1641A
(4/5)
OPA1641AID
ACTIVE
SOIC
75
OPA1641AIDGKR
ACTIVE
VSSOP
DGK
2500
-40 to 85
1641
OPA1641AIDGKT
ACTIVE
VSSOP
DGK
250
-40 to 85
1641
OPA1641AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1641A
OPA1642AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1642A
OPA1642AIDGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
1642
OPA1642AIDGKT
ACTIVE
VSSOP
DGK
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
1642
OPA1642AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1642A
OPA1644AID
ACTIVE
SOIC
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1644A
OPA1644AIDR
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1644A
OPA1644AIPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1644A
OPA1644AIPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
O1644A
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
www.ti.com
18-Oct-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
26-Jan-2013
Device
OPA1641AIDGKR
VSSOP
DGK
OPA1641AIDGKT
VSSOP
DGK
OPA1641AIDR
SOIC
OPA1642AIDGKR
VSSOP
OPA1642AIDGKT
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
VSSOP
DGK
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA1642AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA1644AIDR
SOIC
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA1644AIPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
26-Jan-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA1641AIDGKR
VSSOP
DGK
2500
367.0
367.0
35.0
OPA1641AIDGKT
VSSOP
DGK
250
210.0
185.0
35.0
OPA1641AIDR
SOIC
2500
367.0
367.0
35.0
OPA1642AIDGKR
VSSOP
DGK
2500
367.0
367.0
35.0
OPA1642AIDGKT
VSSOP
DGK
250
210.0
185.0
35.0
OPA1642AIDR
SOIC
2500
367.0
367.0
35.0
OPA1644AIDR
SOIC
14
2500
367.0
367.0
38.0
OPA1644AIPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
Pack Materials-Page 2
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