Organic Solderability Preservative (OSP)

The OSP process selectively applies a flat, anti-oxidation film onto the exposed copper
urfaces of the PWB to preserve the solderability of the copper. This coating reacts with the
copper in an acid and water mixture to form the nearly invisible protective organic coating. OSP
processes can be based on benzimidazole chemistries that deposit thicker coatings, or on
benzotriazoles and imidazoles chemistries which deposit thinner coatings. The thicker OSP
coatings, which are evaluated in this CTSA, can withstand a minimum of three and up to as many
as five thermal excursions while still maintaining coating integrity. Coating thicknesses of 0.1 to
0.5 microns (4 to 20 microinches) are typical for the thicker coatings, as opposed to the
monomolecular layer formed by the thinner OSPs.
The process is typically operated in a horizontal, conveyorized mode but can be modified
o run in a vertical, non-conveyorized mode. OSP processes are compatible with SMT, flip chip,
and BGA technologies, as well as with typical through hole components. The OSP surface finish
cannot be wirebonded. OSP surfaces are compatible with all solder masks, can withstand 3 to 4
hermal excursions during assembly, and have a shelf life of up to one year; extended shelf life
imes may result in a degradation of the coating.
A flow diagram of the process baths in a typical OSP process is presented in Figure 2-5,
ollowed by a brief description of each of the process steps.
ep 1: Cleaner: Surface oils and solder mask residues are removed from the exposed
pper surfaces in a cleaner solution. The acidic solution prepares the surface to
sure the controlled, uniform etching in subsequent steps.
ep 2: Microetch: The microetch solution, typically consisting of dilute hydrochloric or
furic acid, etches the existing copper surfaces to further remove any remaining
ntaminants and to chemically roughen the surface of the copper to promote
ating adhesion.
ep 3: Air Knife: An air knife removes excess water from the panel to limit oxidation
mation on the copper surfaces prior to coating application. This step also
nimizes drag-in of sulfates, which are harmful to the OSP bath.
 ep 4: OSP: A protective layer is formed selectively on the exposed copper surfaces by
e OSP in an acidic aqueous bath. The deposited protective layer chemically
onds to the copper, forming an organometallic layer that preserves the
lderability of the copper surface for future assembly (Mouton, 1997).
ep 5: Air Knife: An air knife removes excess OSP from the panel and promotes even
oating across the entire PWB surface. The air knife also minimizes the chemical
sses through drag-out from the OSP bath.
ep 6: Dry: A warm-air drying stage cures the OSP coating and helps to remove any
sidual moisture from the board.
 OSP reaction mechanism
Organic film is formed by azole compound in OSP material.
WPF106A and WPF15 have benz-imidazole , KESTER markets the two
compounds, namely imidazole and triazole.
N N N

R R N

NH NH
NH
benz-imidazole imidazole triazole
*note: R means branched chain, and is different between each OSP materials

eaction mechanism
azole compounds adsorption (2) Hydrogen(proton) elimination
on exposed copper surface and dehydration
N N N
N N N
R R R + H2
R R R
N- N- N-
NH NH NH Cu+ Cu+ Cu+

copper land copper land

 OSP reaction mechanism
chelate formation (4) Organic film formation

N: N: N: N: N: N:

R R R R R R
N- N- N- N
N N
Cu+ Cu+ Cu+ Cu++ Cu++ Cu++

copper land N: N:
N:

R R R
N N N
Cu+ Cu+ Cu+

copper land

Copper chelate is formed by Cu2+ in OSP mater

or Copper surface on PWB
Organic Solderability Preservatives (OSP, Anti-tarnish)
Of the OSP compounds, the two that are predominant in the industry are benzotriazole and substituted benzimidazole. The
former of these has been utilized both in the metal finishing industry as a true anti-tarnish for hardware plating, and to a
lesser degree, in the electronics industry for limited heat cycle solder applications on bare copper. The more recently
Developed substituted benzimidazole compounds have the advantage of withstanding multiple heat cycles typically found in
mixed technology PCB assembly operations (surface mount and through hole soldering). This advantage is primarily due to th
coating thickness that is achieved with the substituted compounds, ranging from 5 to 20 microinches1 (0.1 - 0.5 microns), as
compared to only a monomolecular layer formed with the benzotriazole materials.

In general, OSPs are considered the low cost, high volume alternative, particularly when applied to surface mount technology
due to the excellent surface coplanarity of pads. The cost advantage of the process becomes quite apparent to the board
fabricator. For example, facilities and maintenance expenses are only a fraction of the operating cost for the anti-tarnish
process as compared to HASL. The process does not involve heating and delivering the high volume air or maintaining a
molten pot of solder. Losses due to rework and rejected product from the HASL process are substantial and prevent a
decrease in the cost of manufacturing. An OSP application system eliminates this waste and allows for flexibility to pass the
savings on to the customer.
The cost advantage to the assembler lies primarily in the yield improvements of the component attachment process. Surface
mount pad planarity is a technical hurdle that HASL will never overcome, especially for fine pitch devices due to the extreme
variation in coating thickness. This non-uniform solder thickness can range from 30-1500 microinches (0.75 - 37.5 microns)
depending upon pad geometry and orientation within the panel. In contrast, an OSP coated board provides a surface finish
topography equivalent to the plated copper. This allows for improved component placement; furthermore, it will help move
the assembler towards finer pitch devices and denser circuits as the limiting factor for fine pitch assembly now becomes the
ability to deposit the solder paste.

It must be emphasized that implementing an OSP process may require a re-characterization of the assembly operation; a
number of issues must be addressed. For example, the number of thermal cycles a product may see in the assembly process
can reduce the operating window for soldering. If excessive, it may be determined that soldering in an inert atmosphere is
required in the reflow process, wave solder, or both. Typically, OSP suppliers advertise up to five thermal cycles can be
achieved in open air without detrimental effects to solderability. Developing a partnership with the board shop and supplier is
an important consideration during the implementation phase.

A second assembly process consideration when using OSP technology surrounds the type and activity of the flux used in
each of the assembly operations. Table 1 illustrates the results of an engineering evaluation used to benchmark OSPs in
comparison to HASL coated PCBs at one customer site. It was apparent in the evaluation that the OSPs performed differently
depending upon the type of flux used. A wide range of responses were found spanning from excellent surface mount
solderability with OA or RMA type solder pastes, to relatively poor filling of holes with a low solids (2%) no clean wave
solder flux that was not designed for soldering to OSP coated pads.