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(5-1)
where
(5-2)
where x is the thickness of the plane. Using the thermal circuit shown in
Fig. 5-1b , Eq. (5-2) can be written in the form
(5-3)
where R is the thermal resistance (K/W).
is
constant with distance, as shown in Fig. 5-1a . For steady conduction, the
integrated form of (5-1) for a planar system with constant k and A is Eq. (5-2)
or (5-3). For the general case of variables k (k is a function of temperature)
and A (cylindrical and spherical systems with radial coordinate r, as sketched
in Fig. 5-2), the average heat-transfer area and thermal conductivity are
dened such that
(5-4)
For a thermal conductivity that depends linearly on T,
(5-5)
Denition
SI units
m2
Ac
Cross-sectional area
m2
Af
m2
tube
Ai
Ao
m2
A of
m2
attached = A o
AT
m2
A uf
m2
nned tube
A1
ax
Cross-sectional area of n
m2
sphere
bf
Height of n
B1
Bi
Biot number, hR /k
Specic heat
J/(kgK)
cp
J/(kgK)
Diameter
Di
Inner diameter
Do
Outer diameter
Fo
gc
Conversion factor
1.0 kgm/(Ns 2)
m2/s
Mass velocity,
G max
kg/(m2s)
kg/(m2s)
Graetz number = Re Pr
Heat-transfer coecient
W/(m2K)
W/(m2K)
W/(m2K)
hf
hf
W/(m2K)
W/(m2K)
hi
W/(m2K)
surface
ho
W/(m2K)
surface
h am
W/(m2K)
h lm
W/(m2K)
Thermal conductivity
W/(mK)
W/(mK)
Nu D
kg/s
Nu lm
Perimeter
pf
Fin perimeter
kPa
Pr
Prandtl number, /
Q /Q i
sphere
K/W or m
Ra x
Rayleigh number, T gx 3/
Re D
Reynolds number, GD /
W/m3
Cross-sectional area
m2
S1
Time
t sv
Saturated-vapor temperature
ts
Surface temperature
Temperature
K or C
Tb
section
Bulk mean temperature, (T b ,in + T b ,out)/2
TC
Tf
TH
Ti
Initial temperature
Te
Ts
Temperature of surface
surface
W/(m2K)
Volume
m3
VF
m/s
nned tubes
m/s
WF
kg/s
tube
zp
across n
Greek Symbols
m2/s
K1
surface
kg/(ms)
perpendicular to ow
P
Pressure drop
Pa
Temperature dierence
Temperature dierence
T am
1,0
approaches 0
1,
Emissivity of a surface
Dimensionless distance, r /R
/i
J/kg
(condensation)
kg/(ms)
Kinematic viscosity, /
m2/s
kg/m3
W/(m2K4)
N/m
vapor
Eciency of n
(5-6)
where
For cylinders and spheres, A is a function of radial position (see Fig. 5-2): 2
rL and 4 r 2, where L is the length of the cylinder. For constant k, Eq. (5-4)
becomes
(5-7)
and
(5-8)
Conduction with Resistances in Series A steady-state temperature prole
in a planar composite wall, with three constant thermal conductivities and no
source terms, is shown in Fig. 5-3a . The corresponding thermal circuit is
given in Fig. 5-3b . The rate of heat transfer through each of the layers is the
same. The total resistance is the sum of the individual resistances shown in
Fig. 5-3b :
(5-9)
Additional resistances in the series may occur at the surfaces of the solid if
they are in contact with a uid. The rate of convective heat transfer, between
a surface of area A and a uid, is represented by Newtons law of cooling as
(5-10)
where 1/(hA ) is the resistance due to convection (K/W) and the heat-transfer
coecient is h [W/(m2K)]. For the cylindrical geometry shown in Fig. 5-2, with
convection to inner and outer uids at temperatures T i and T o , with heattransfer coecients h i and h o , the steady-state rate of heat transfer is
(5-11)
where resistances R
and R
outer surfaces. The total resistance is again the sum of the resistances in
series.
(5-12)
where the emissivity of surface 2 is 2 = 0.76 and the Stefan-Boltzmann
constant = 5.67 108 W/(m2K4).
Referring to Fig. 5-4, the steady-state heat ux q (W/m2) through the wall is
and
(5-13)
The solutions to (5-13), for uniform S, are
(5-14)
where Bi = hR /k is the Biot number. For Bi << 1, the temperature in the
solid is uniform. For Bi >> 1, the surface temperature T (R ) = T .
Two- and Three-Dimensional Conduction Application of the law of
conservation of energy to a three-dimensional solid, with the heat ux given
by (5-1) and volumetric source term S (W/m3), results in the following
equation for steady-state conduction in rectangular coordinates.
(5-15)
Similar equations apply to cylindrical and spherical coordinate systems.
Finite dierence, nite volume, or nite element methods are generally
necessary to solve (5-15). Useful introductions to these numerical techniques
are given in the General References and Sec. 3. Simple forms of (5-15)
(constant k, uniform S ) can be solved analytically. See Arpaci, Conduction
involving heat ow between two surfaces, each isothermal, with all other
surfaces being adiabatic, the shape factor approach is useful (Mills, Heat
(5-16)
The energy storage term is on the left-hand side, and and c are the density
(kg/m3) and specic heat [J/(kg K)]. Solutions to (5-16) are generally obtained
numerically (see General References and Sec. 3). The one-dimensional form
of (5-16), with constant k and no source term, is
(5-17)
where = k /(c ) is the thermal diusivity (m 2/s).
One-Dimensional Conduction: Lumped and Distributed Analysis The
one-dimensional transient conduction equations in rectangular (b = 1),
cylindrical (b = 2), and spherical (b = 3) coordinates, with constant k, initial
uniform temperature T i , S = 0, and convection at the surface with heattransfer coecient h and uid temperature T , are
(5-18)
The solutions to (5-18) can be compactly expressed by using dimensionless
variables: (1) temperature /i = [T (r ,t ) T ]/(T i T ); (2) heat loss
(5-19)
where A is the active surface area and V is the volume. The time scale for
the lumped problem is
(5-20)
Table 5-1. Fourier Coecients and Spatial Functions for Use in Eqs.
(5-21)
Geometry
A1
B1
S1
Plate
Cos(1)
Cylinder
J 0(1)
Sphere
The time scale is the time required for most of the change in / i or Q/Q i to
occur. When t =, /i = exp(1) = 0.368 and roughly two-thirds of the
possible change has occurred.
When a lumped analysis is not valid (Bi > 0.2), the single-term solutions to (518) are convenient:
(5-21)
where the rst Fourier coecients A 1 and B 1 and the spatial functions S 1
are given in Table 5-1. The rst eigenvalue 1 is given by (5-22) in conjunction
with Table 5-2. The one-term solutions are accurate to within 2 percent when
Fo > Foc . The values of the critical Fourier number Fo c are given in Table 5-2.
The rst eigenvalue is accurately correlated by (Yovanovich, Chap. 3 of
Rohsenow, Hartnett, and Cho, Handbook of Heat Transfer
, 3d ed., McGraw-
(5-22)
Equation (5-22) gives values of 1 that dier from the exact values by less
than 0.4 percent, and it is valid for all values of Bi. The values of 1,, 1,0, n ,
and Foc are given in Table 5-2.
Eq. (5-22) As an
example of the use of Eq. (5-22), suppose that we want 1 for the at plate
with Bi = 5. From Table 5-2, 1, = /2,
(5-22) gives
For Bi , A 1 in Table 5-1 is 2 and for = 0, S 1 in Table 5-1 is 1. Equation (521) becomes
Bi 0
Bi
Foc
Plate
1 /2
2.139
0.24
Cylinder
1 2.4048255
2.238
0.21
Sphere
2.314
0.18
When t = R 2/, the temperature ratio at the center of the plate ( = 0) has
decayed to exp( 2/4), or 8 percent of its initial value. We conclude that
/ units of time, or
(t )1/2.
One-Dimensional Conduction: Semi-innite Plate Consider a semiinnite plate with an initial uniform temperature T i . Suppose that the
temperature of the surface is suddenly raised to T ; that is, the heat-transfer
coecient is innite. The unsteady temperature of the plate is
(5-23)
where erf(z ) is the error function. The depth to which the heat penetrates in
1/2
(5-24)
where erfc(z ) is the complementary error function. Equations (5-23) and (524) are both applicable to nite plates provided that their half-thickness is
greater than (12t )1/2.
(5-25)
Similar products apply for solids with other geometries, e.g., semi-innite,
cylindrical rods.
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