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Volume 6, Issue 11, Nov 2015, pp. 145-153, Article ID: IJMET_06_11_017
Available online at
http://www.iaeme.com/IJMET/issues.asp?JType=IJMET&VType=6&IType=11
ISSN Print: 0976-6340 and ISSN Online: 0976-6359
IAEME Publication
1. INTRODUCTION
Electronic devices are strategic devices such as radars, communication sets, and
amplifiers, twts controls which are used in aircraft, space vehicles, missiles and
ground stations. The use of these devices in strategic and military application is
rapidly increasing and these equipments are becoming more and more sophisticated.
They demand a great deal of mechanical design skill for achieving sound and reliable
products. The equipments are liable at higher temperatures. Thermal design has
become a crucial contribution in increasing the life of the equipment. There are many
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2. DESIGN METHODOLOGY
A PCB consumes electrical power for its electrical functionality. Rest of the power is
dissipated as heat energy due to its very low efficiency.
PCB consisting of various active components which generates different heat
loads. Varying from 0.1W to 5.27W.This PCB temperature is to be maintained below
85oc for safe and reliable operation of component in the atmospheric condition of
35oC temperature.
Forced air convection cooling mechanism is inadequate for high power
applications even though it is simple and mostly preferred thermal management
option for electronic applications. An heat sink with dimensions is shown in Fig.1.
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Given
Heat load/dissipation 19.5
Base size
Assumptions
The ambient temperature of air is TA = 35C
Surface Temperature TF = 75C
Thickness of fin =1.5
Heat transfer coefficient =4
Average temperature (or) film temperature TF (Ts+TA)/2
(75+35)/2=55C
The properties of dry air at 35C from heat and mass transfer data book by
C.P.KOTHANDARAMAM are,
Density ( ) 1.0755
Thermal conductivity (k)
Coefficient of viscosity ( )
Prandtl number (Pr) 0.7215
= 2/ (Ts+TA) 0.0030
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DESIGN CONSTRAINT
The surface temperature of components should not exceed 85C
Where,
g= Acceleration due to gravity = 9.81
L=Base length = 233.3
= 0.2333
Therefore,
=1.0197 107
Optimum Fin Spacing =
7.68
FIN HEIGHT
The heat dissipation through Natural convection is given as
Where, =Heat dissipated = 19.5w
= Natural convention heat transfer coefficient = 4
=Total area
Therefore,
But A
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HEATFLUX
Where,
= heat dissipation in
= base area in
Therefore,
FIN HEIGHT
For calculating the fin height, first the total fin area must be calculated which is
obtained from the total area.
The total are can be obtained using the relation:
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SELECTION OF FAN
Volume flow rate = no of slots X height of fin X fin spacing X velocity of air.
=
1
.
= 2118.88
Pressure difference[Pa]
140
120
100
80
60
40
20
0
0
10
12
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Iterations: 129
CPU time: 2281 s
5. Calculation Mesh
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24
4
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Figure 5 Air flow Direction in PCB-Enclosure with Fan and Heat sink.
6. CONCLUSION
The results of the simulation of natural convection at ambient conduction is 88C.
Then by forced convection using a heat sink and fan of 7cfm the temperature is
reduced to 50C which is under allowable limits. The temperature is reduced by 43%.
Therefore the PCB is working under a given temperature range of 85oC. From this we
can say that the component is desirable in working for a given Heat sink design.
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