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MUN5113, DTA144EE,
DTA144EM3, NSBA144EF3
Digital Transistors (BRT)
R1 = 47 kW, R2 = 47 kW
http://onsemi.com
PIN CONNECTIONS
PIN 3
COLLECTOR
(OUTPUT)
PIN 1
BASE
(INPUT)
R1
R2
PIN 2
EMITTER
(GROUND)
MARKING DIAGRAMS
Symbol
Max
Unit
CollectorBase Voltage
VCBO
50
Vdc
CollectorEmitter Voltage
VCEO
50
Vdc
SC59
CASE 318D
STYLE 1
XXX MG
G
SOT23
CASE 318
STYLE 6
XX MG
G
IC
100
mAdc
VIN(fwd)
40
Vdc
VIN(rev)
10
Vdc
XX MG
G
SC70/SOT323
CASE 419
STYLE 3
XX M
SC75
CASE 463
STYLE 1
XX M
SOT723
CASE 631AA
STYLE 1
XM 1
SOT1123
CASE 524AA
STYLE 1
XXX
M
G
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 2 of this data sheet.
Package
Shipping
6C
SC59
(PbFree)
MMUN2113LT1G, SMMUN2113LT1G*
A6C
SOT23
(PbFree)
MMUN2113LT3G, NSVMMUN2113LT3G*
A6C
SOT23
(PbFree)
MUN5113T1G, SMUN5113T1G*
6C
SC70/SOT323
(PbFree)
MUN5113T3G
6C
SC70/SOT323
(PbFree)
DTA144EET1G
6C
SC75
(PbFree)
DTA144EM3T5G
6C
SOT723
(PbFree)
NSBA144EF3T5G
SOT1123
(PbFree)
Device
MUN2113T1G, SMUN2113T1G*
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable.
300
250
(1) SC75 and SC70/SOT323; Minimum Pad
(2) SC59; Minimum Pad
(3) SOT23; Minimum Pad
(4) SOT1123; 100 mm2, 1 oz. copper trace
(5) SOT723; Minimum Pad
200
(1) (2) (3) (4) (5)
150
100
50
0
50
25
25
50
75
100
125
150
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2
Symbol
Max
Unit
230
338
1.8
2.7
mW
PD
mW/C
(Note 1)
(Note 2)
RqJA
540
370
C/W
Thermal Resistance,
(Note 1)
Junction to Lead (Note 2)
RqJL
264
287
C/W
TJ, Tstg
55 to +150
246
400
2.0
3.2
mW
Thermal Resistance,
Junction to Ambient
PD
mW/C
(Note 1)
(Note 2)
RqJA
508
311
C/W
Thermal Resistance,
(Note 1)
Junction to Lead (Note 2)
RqJL
174
208
C/W
TJ, Tstg
55 to +150
202
310
1.6
2.5
mW
Thermal Resistance,
Junction to Ambient
PD
mW/C
(Note 1)
(Note 2)
RqJA
618
403
C/W
Thermal Resistance,
(Note 1)
Junction to Lead (Note 2)
RqJL
280
332
C/W
TJ, Tstg
55 to +150
200
300
1.6
2.4
mW
Thermal Resistance,
Junction to Ambient
PD
(Note 1)
(Note 2)
mW/C
RqJA
600
400
C/W
TJ, Tstg
55 to +150
260
600
2.0
4.8
mW
PD
(Note 1)
(Note 2)
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3
mW/C
RqJA
480
205
C/W
TJ, Tstg
55 to +150
Symbol
Max
Unit
254
297
2.0
2.4
mW
PD
(Note 3)
(Note 4)
mW/C
RqJA
493
421
C/W
RqJL
193
C/W
TJ, Tstg
55 to +150
Symbol
Min
Typ
Max
100
500
0.1
50
50
80
140
0.25
1.2
0.8
3.0
1.6
0.2
4.9
Unit
OFF CHARACTERISTICS
CollectorBase Cutoff Current
(VCB = 50 V, IE = 0)
ICBO
ICEO
IEBO
V(BR)CBO
V(BR)CEO
nAdc
nAdc
mAdc
Vdc
Vdc
ON CHARACTERISTICS
hFE
VCE(sat)
Vi(off)
Vi(on)
VOL
VOH
Vdc
Vdc
Vdc
Vdc
Vdc
Input Resistor
R1
32.9
47
61.1
Resistor Ratio
R1/R2
0.8
1.0
1.2
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4
kW
TA = 25C
VCE(sat), COLLECTOREMITTER
VOLTAGE (V)
25C
75C
0.1
0.01
0
10
20
30
IC, COLLECTOR CURRENT (mA)
TA = 75C
25C
10
40
25C
100
10
IC, COLLECTOR CURRENT (mA)
100
f = 10 kHz
lE = 0 A
TA = 25C
7
6
5
4
3
2
1
TA = 75C
25C
25C
10
1
0.1
0.01
VO = 5 V
0.001
0
0
10
50
20
30
40
VR, REVERSE VOLTAGE (V)
VO = 2 V
TA = 25C
25C
75C
0.1
0
100
10
10
9
100
10
20
30
40
IC, COLLECTOR CURRENT (mA)
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5
50
10
IC/IB = 10
150C
25C
VCE(sat), COLLECTOREMITTER
VOLTAGE (V)
150C
0.1
55C
100
10
VCE = 10 V
0.01
1
0
10
20
30
40
0.1
50
10
100
100
f = 10 kHz
IE = 0 A
TA = 25C
5
4
3
2
1
0
150C
55C
10
25C
1
0.1
0.01
VO = 5 V
0.001
0
10
20
30
40
50
12
16
20
24
100
55C
55C
25C
10
150C
VO = 0.2 V
0.1
0
10
20
30
40
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6
50
28
SC59
CASE 318D04
ISSUE H
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
HE
DIM
A
A1
b
c
D
E
e
L
HE
E
2
b
e
MILLIMETERS
NOM
MAX
1.15
1.30
0.06
0.10
0.43
0.50
0.14
0.18
2.90
3.10
1.50
1.70
1.90
2.10
0.40
0.60
2.80
3.00
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
MIN
1.00
0.01
0.35
0.09
2.70
1.30
1.70
0.20
2.50
A1
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.4
0.094
1.0
0.039
0.8
0.031
SCALE 10:1
mm
inches
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7
MIN
0.039
0.001
0.014
0.003
0.106
0.051
0.067
0.008
0.099
INCHES
NOM
0.045
0.002
0.017
0.005
0.114
0.059
0.075
0.016
0.110
MAX
0.051
0.004
0.020
0.007
0.122
0.067
0.083
0.024
0.118
SOT23 (TO236)
CASE 31808
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
0.25
e
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
10
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
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8
mm
inches
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
SC70 (SOT323)
CASE 41904
ISSUE N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
D
e1
DIM
A
A1
A2
b
c
D
E
e
e1
L
HE
HE
1
b
e
A
0.05 (0.002)
0.30
0.10
1.80
1.15
1.20
0.20
2.00
MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.70 REF
0.35
0.40
0.18
0.25
2.10
2.20
1.24
1.35
1.30
1.40
0.65 BSC
0.38
0.56
2.10
2.40
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
A2
MIN
0.80
0.00
A1
SOLDERING FOOTPRINT*
0.65
0.025
0.65
0.025
1.9
0.075
0.9
0.035
0.7
0.028
SCALE 10:1
mm
inches
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9
MIN
0.032
0.000
0.012
0.004
0.071
0.045
0.047
0.008
0.079
INCHES
NOM
0.035
0.002
0.028 REF
0.014
0.007
0.083
0.049
0.051
0.026 BSC
0.015
0.083
MAX
0.040
0.004
0.016
0.010
0.087
0.053
0.055
0.022
0.095
SC75/SOT416
CASE 463
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
E
2
3
b 3 PL
0.20 (0.008)
DIM
A
A1
b
C
D
E
e
L
HE
1
M
HE
0.20 (0.008) E
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
A
L
MILLIMETERS
MIN
NOM MAX
0.70
0.80
0.90
0.00
0.05
0.10
0.15
0.20
0.30
0.10
0.15
0.25
1.55
1.60
1.65
0.70
0.80
0.90
1.00 BSC
0.10
0.15
0.20
1.50
1.60
1.70
A1
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
mm
inches
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10
INCHES
NOM MAX
0.031 0.035
0.002 0.004
0.008 0.012
0.006 0.010
0.063 0.067
0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
MIN
0.027
0.000
0.006
0.004
0.059
0.027
SOT723
CASE 631AA
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
X
D
A
b1
Y
E
1
HE
2
2X
2X
C
0.08 X Y
SIDE VIEW
TOP VIEW
3X
DIM
A
b
b1
C
D
E
e
HE
L
L2
3X
MILLIMETERS
MIN
NOM
MAX
0.45
0.50
0.55
0.15
0.21
0.27
0.25
0.31
0.37
0.07
0.12
0.17
1.15
1.20
1.25
0.75
0.80
0.85
0.40 BSC
1.15
1.20
1.25
0.29 REF
0.15
0.20
0.25
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
L2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.40
2X
0.27
PACKAGE
OUTLINE
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
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11
SOT1123
CASE 524AA
ISSUE C
X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
Y
1
TOP VIEW
A
DIM
A
b
b1
c
D
E
e
HE
L
L2
HE
SIDE VIEW
3X
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
L2
MILLIMETERS
MIN
MAX
0.34
0.40
0.15
0.28
0.10
0.20
0.07
0.17
0.75
0.85
0.55
0.65
0.35
0.40
0.95
1.05
0.185 REF
0.05
0.15
0.08 X Y
e
2X
3X
b1
BOTTOM VIEW
SOLDERING FOOTPRINT*
1.20
3X
0.34
0.26
0.38
2X
0.20
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLCs product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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12
DTA144E/D