ORIENTAL INSTITUTE OF SCIENCE & TECHNOLOGY

Raisen Road, Thakral Nagar, Bhopal

(Approved by A.I.C.T.E, New Delhi & Govt of M.P.,
Affiliated to Rajiv Gandhi Proudyogiki Vishwavidyalaya, Bhopal.)

Session 2009-10
MINOR PROJECT REPORT ON
Lpg Detector
Submitted in partial fulfilment of the requirements for the award of the degree of
BACHELOR OF ENGINEERING in Electronics & Communication
Engineering of Rajiv Gandhi Proudyogiki Vishwavidyalaya, Bhopal
BY:
DEEPALI RATHORE
DEEPIKA JHA
DIVYA RANI
LIJO K. JOHN
(VI Semester)
DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

PRINCIPAL
Prof. N.K. MITTAL
GUIDED BY:
Mr. Abhishek Mishra
Lecturer, EC Department.

APPROVED BY:
Prof.S.G.KERHALKER
H.O.D. EC Department

DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

(NBA Accredited)
ORIENTAL INSTITUTE OF SCIENCE & TECHNOLOGY
BHOPAL
Affiliated to Rajiv Gandhi Technical University
Bhopal, M.P.

STUDENTS DECLARATION
We hereby declare that the work which is being presented in the project entitled Lpg
Detector in the partial fulfilment of the requirements for the degree of BACHELOR
OF ENGINEERING in Electronics & Communication engineering of RAJIV GANDHI
PROUDYOGIKI VISHWAVIDYALAYA, Bhopal is an authentic record of our work
carried out under the guidance of

Mr.Abhishek Mishra
Project Guide,
Electronics & Communication Department

Prof. S.G. Kerhalker

Head of the Department,
Electronics & Communication Department

DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

(NBA Accredited)
ORIENTAL INSTITUTE OF SCIENCE & TECHNOLOGY
BHOPAL
Affiliated to Rajiv Gandhi Technical University
Bhopal, M.P.

CERTIFICATE

This is to certify that the work being presented in the project entitled Lpg Detector
carried out by Deepika Jha, Deepali Rathore, Divya Rani & Lijo K. John is an
authentic record and the declaration made by the students is correct to the best of
my knowledge.

Prof. S.G. Kerhalker

Head of the Department,
Electronics & Communication Department

Prof. N.K.Mittal
Principal,
O.I.S.T. Bhopal

ACKNOWLEDGEMENT

We sincerely offer our heartfelt gratitude to our honourable HOD

Prof.
S.G.KERHALKER who provided his utmost support in the successful completion of
this project. His continuous encouragement made our task a pleasant job with
cheerful smile.
This is a small gesture and gratitude that we can express for help rendered to us by
our guide Mr. Abhishek Mishra (Project In charge) Lecturer in department of
Electronics & Communication, O.I.S.T. Bhopal, for suggesting and exhibiting
keen interest in our project.
We are also thankful to the faculties of Electronics Department who helped us and
advised us at each step of our project.

Submitted By:
Deepali Rathore
Deepika Jha
Divya Rani
Lijo K. John
B.E., VI Semester,
Electronics & communication Engineering
O.I.S.T. Bhopal.

PREFACE

Today our country is passing through a critical stage employment is very

scarce, growing number of educated people remain unemployed for long time.
Our government is trying to do its best to provide employment, but the
government has its own limitation. So self-employment is very important aspect
according to present situation.
To provide one with suitable guidance in this direction, project work has
been included in our curriculum of the pre-final year of engineering course. This
project work reflects the theoretical and practical knowledge gained by the
student during their studentship in the institute. It deals with an important aspect
in the curriculum of a student in that the student should be able to design on his
own the whole aspects of the component taken at hand and be able to suggest
new ideas to manufacture a given component on the basis of economically
justified ground in the light of improved techniques.
Being a student of pre-final year Electronics & Communication
Engineering we have selected Lpg Detector unit which is used to sense the lpg
gas and warn by alarm.

CONTENTS
1. INTRODUCTION
2. PRINCIPLE AND WORKING OF Lpg Detector
3. CIRCUIT DIAGRAM OF Lpg Detector
4. BLOCK DIAGRAM OF Lpg Detector
5. DESCRIPTION OF COMPONENTS
6. PCB LAYOUT
7. MERITS AND DEMERITS OF Lpg Detector
8. FUTURE ENHANCEMENTS OF Lpg Detector
9. BIBLIOGRAPHY

WHY DO WE NEED A PROJECT?

A student especially technical student is expected to do some experimentation

and research work on the subject, which he studies in the class textbook during
the course of his studies. Such an effort when well organised with a definite aim
or purpose is called a project.
The object of a project is to envelope technical thinking and to induce the student
to make an ordinary analysis to the situation following at hand so as to search a
definite conclusion.
By doing project student displays his spirit of inquiring, creating & criticizing
way of solving a problem through understanding of existing situation,
independent thinking and ability to understand basic fast.

INTRODUCTION
Here is a simple LPG detector in which we are using lpg sensor mq-2 which give
as analogue output with respect to gas level . in our circuit opam358 are using as
comparator when the out of LPG sensor is greater than 2.5 v then its off the
transistor. By default if gas is not present transistor is in on stage by this
transistor. If the transistor (BC547) is on then relay is in on state and buzzer is
connected to its NC contact so the buzzer is off. When the gas level is high then
transistor is off and relay is off and buzzer is sounded. When the level is less than
comparator is high and transistor is off.

LIST OF COMPONENTS USED

 TRANSFORMER
DIODES
RESISTORS
CAPACITOR
Mq2 (lpg Sensor )
358
Trim pot
LED

COMPONENTS DESCRIPTION
1. TRANSFORMER
The transformer is static electoral machine that transforms one alternating
current stem into another of different voltage & current. However, power remains
the same during the transformation. The transformers play a major part in the
transmission and distribution of ac power.

PRINCIPLE
A transformer consists of laminated magnetic core forming the magnetic frame.
Primary and secondary coils are wound upon the two cores of the magnetic
frame, linked by the common magnetic flux, when an alternating voltage is
applied across the primary coil. A current flows in producing the magnetic flux in
the transformer core.

2. RESISTANCES
The resistance are heat dissipating elements and in the electronic circuits they are
mostly used for either controlling the currents in the circuit or developing a
voltage drop across it which could be utilized for so many applications. There are
various types of resistances which can be classified according to a number of
factors depending upon
Material used for fabricating a resistance
Wattage and physical size
Intended application
Ambient temperature rating
Cost
Basically the resistor can be splitted into the following four parts with the
construction view point
Base
Resistance element
Terminals
Protective means
The following characteristics are inherent in all resistances and may be
controlled by design considerations and choice of material i.e. Temperature coefficient, Voltage co-efficient of resistance high frequency characteristics power
rating and reseating tolerance voltage rating of resistors resistances may be
classified as
1. Fixed
2. Semi variable
3. Variable Resistances
We have used carbon resistances.

3. CAPACITORS

The fundamental relation for the capacitance between two flat plates separate be a
dielectric material is given by C = 0.08854 KA where
C = capacitance in p.f
K = dielectric constant
A = area per plate in square cm.
D = distance between two plates in cm.
Design of capacitor is connected with the relation of the proper dielectric material
with particular type of application. The dielectric material used for capacitors may be
grouped in the various classes like Mica Glass air ceramic paper aluminium
electrolytic etc. the value of capacitance never remains constant except under
certain filled condition it changes with temperature frequency and aging. The
capacitance value marked with capacitor strictly applies only at specified room
temperature and at low frequencies.

4. DIODES
It is a two terminal device consisting of a P-N junction formed either in GE or SI
crystal. The P and N type regions are referred to as anode and cathode
respectively.
Commercially available diodes usually have some means to indicate which lead is P
and which lead is N. Standard notations consists the number proceeded by IN such
as In 240 & 250. Here 240 and 250 correspond to colour band.

5. ZENER DIODE
A Zener diode is a type of diode that permits current in the forward direction like a
normal diode, but also in the reverse direction if the voltage is larger than the
breakdown voltage known as "Zener knee voltage" or "Zener voltage". The device
was named after Clarence Zener, who discovered this electrical property.
A conventional solid-state diode will not allow significant current if it is reversebiased below its reverse breakdown voltage. When the reverse bias breakdown
voltage is exceeded, a conventional diode is subject to high current due to
avalanche breakdown. Unless this current is limited by external circuitry, the diode
will be permanently damaged. In case of large forward bias (current in the direction
of the arrow), the diode exhibits a voltage drop due to its junction built-in voltage
and internal resistance. The amount of the voltage drop depends on the
semiconductor material and the doping concentrations.
A Zener diode exhibits almost the same properties, except the device is specially
designed so as to have a greatly reduced breakdown voltage, the so-called Zener
voltage.

ZENER DIODES

USES OF ZENER DIODES

Zener diodes are widely used to regulate the voltage across a circuit. When
connected in parallel with a variable voltage source so that it is reverse biased, a
Zener diode conducts when the voltage reaches the diode's reverse breakdown
voltage. From that point it keeps the voltage at that value.

V-I CHARACTERISTICS OF ZENER DIODE

6. Lm358

The Lm358 and Lm358 are integrated circuit operational amplifiers that combine the
advantages of high voltage PMOS transistors with high voltage bipolar transistors on a
single monolithic chip. The Lm358 and Lm358 BiMOS operational amplifiers feature gate
protected MOSFET (PMOS) transistors in the input circuit to provide very high input
impedance, very low input current, and high speed performance. The Lm358and
Lm358operate at supply voltage from 4V to 36V (either single or dual supply). These
operational amplifiers are internally phase compensated to achieve stable operation in unity
gain follower operation, and additionally, have access terminal for a supplementary external
capacitor if additional frequency roll-off is desired. Terminals are also provided for use in
applications requiring input offset voltage nulling. The use of PMOS field effect transistors
in the input stage results in common mode input voltage capability down to 0.5V below the
negative supply terminal, an important attribute for single supply applications. The output
stage uses bipolar transistors and includes built-in protection against damage from load
terminal short circuiting to either supply rail or to ground. The Lm358 and Lm358 are
intended for operation at supply voltages up to 36V (18V).

Lm358

9. LED

As there name indicated it is a forward biased P-N junction which emits visible light
when energized. Charge carrier recombination tacked place when electrons from the
N-side cross the junction and recombine with the heeds on the P side. Now electrons
Are in the higher conduction band on the N side whereas holes are in the lower
valance band on the P side. During recombination some of the energy difference is
given up in the form of heat and light (i.e. proton) in the case of semiconductor
materials like gallium arsenate (Ga As) Gallium phosphide (Gap) and Gallium arsenate
phosphide (GaAsP) a greater percentage of energy is released during recombination
and is given out in the form of light LED's emit no light when they are reverse biased.

PCB LAYOUT

P.C.B. MANUFACTURING PROCESS

It is an important process in the fabrication of electronic equipment. The design of PCBs
(Printed Circuit Boards) depends on circuit requirements like noise immunity, working
frequency and voltage levels etc. High power PCBs requires a special design strategy.
The fabrication process to the printed circuit board will determine to a large extent the
price and reliability of the equipment. A common target aimed is the fabrication of small
series of highly reliable professional quality PCBs with low investment. The target becomes
especially important for customer tailored equipments in the area of industrial electronics.
The layout of a PCB has to incorporate all the information of the board before one can go on
the artwork preparation. This means that a concept which clearly defines all the details of the
circuit and partly defines the final equipment, is prerequisite before the actual lay out can
start. The detailed circuit diagram is very important for the layout designer but he must also
be familiar with the design concept and with the philosophy behind the equipment.

BOARD TYPES:
The two most popular PCB types are:
1. Single Sided Boards
The single sided PCBs are mostly used in entertainment electronics where manufacturing
costs have to be kept at a minimum. However in industrial electronics cost factors cannot be
neglected and single sided boards should be used wherever a particular circuit can be
accommodated on such boards.
2. Double Sided Boards
Double-sided PCBs can be made with or without plated through holes. The production of
boards with plated through holes is fairly expensive. Therefore plated through hole boards
are only chosen where the circuit complexities and density of components does not leave any
other choice.

CHRONOLOGY
The following steps have been followed in carrying out the project.
1. Study the books on the relevant topic.
2. Understand the working of the circuit.
3. Prepare the circuit diagram.
4. Prepare the list of components along with their specification. Estimate the cost and procure
them after carrying out market survey.
5. Plan and prepare PCB for mounting all the components.
6. Fix the components on the PCB and solder them.
7. Test the circuit for the desired performance.
8. Trace and rectify faults if any.
9. Give good finish to the unit.
10.Prepare the project report.

DESIGN SPECIFICATION
(I) STEPS TAKEN WHILE PREPARING CIRCUIT
(A)

PCB DESIGNING
The main purpose of printed circuit is in the routing of electric currents and signal

through a thin copper layer that is bounded firmly to an insulating base material sometimes
called the substrate. This base is manufactured with an integrally bounded layer of thin
copper foil which has to be partly etched or removed to arrive at a pre-designed pattern to
suit the circuit connections or other applications as required.
The term printed circuit board is derived from the original method where a printed
pattern is used as the mask over wanted areas of copper. The PCB provides an ideal
baseboard upon which to assemble and hold firmly most of the small components.
From the constructors point of view, the main attraction of using PCB is its role as the
mechanical support for small components. There is less need for complicated and time
consuming metal work of chassis contraception except perhaps in providing the final
enclosure. Most straight forward circuit designs can be easily converted in to printed wiring
layer the thought required to carry out the inversion cab footed high light an possible error
that would otherwise be missed in conventional point to point wiring .The finished project is
usually neater and truly a work of art.
Actual size PCB layout for the circuit shown is drawn on the copper board. The board is then
immersed in FeCl3 solution for 12 hours. In this process only the exposed copper portion is
etched out by the solution.
Now the petrol washes out the paint and the copper layout on PCB is rubbed with a smooth
sand paper slowly and lightly such that only the oxide layers over the Cu are removed. Now
the holes are drilled at the respective places according to component layout as shown in
figure.

(B)

LAYOUT DESIGN:

When designing the layout one should observe the minimum size (component body length
and weight). Before starting to design the layout we need all the required components in
hand so that an accurate assessment of space can be made. Other space considerations might
also be included from case to case of mounted components over the printed circuit board or
to access path of present components.
All common or earth lines should ideally be connected to a common line routed around the
perimeter of the layout. This will act as the ground plane. If possible try to route the outer
supply line to the ground plane. If possible try to route the other supply lines around the
opposite edge of the layout through the centre. The first set is tearing the circuit to eliminate
the crossover without altering the circuit detail in any way.
Plan the layout looking at the topside to this board. First this should be translated
inversely; later for the etching pattern large areas are recommended to maintain good copper
adhesion. It is important to bear in mind always that copper track width must be according to
the recommended minimum dimensions and allowance must be made for increased width
where termination holes are needed. From this aspect, it can become little tricky to negotiate
the route to connect small transistors.
There are basically two ways of copper interconnection patterns under side the board. The
first is the removal of only the amount of copper necessary to isolate the junctions of the
components to one another. The second is to make the interconnection pattern looking more
like conventional point wiring by routing uniform width of copper from component to
component.

(C)

ETCHING PROCESS:
Etching process requires the use of chemicals. Acid resistant dishes and running water

supply. Ferric chloride is mostly used solution but other etching materials such as
ammonium per sulphate can be used. Nitric acid can be used but in general it is not used due
to poisonous fumes.
The pattern prepared is glued to the copper surface of the board using a latex type of
adhesive that can be cubed after use. The pattern is laid firmly on the copper using a very
sharp knife to cut round the pattern carefully to remove the paper corresponding to the
required copper pattern areas. Then apply the resistant solution, which can be a kind of ink
solution for the purpose of maintaining smooth clean outlines as far as possible. While the
board is drying, test all the components.
Before going to next stage, check the whole pattern and cross check with the circuit
diagram. Check for any free metal on the copper. The etching bath should be in a glass or
Enamel disc. If using crystal of ferric- chloride these should be thoroughly dissolved in
water
to the proportion suggested. There should be 0.5 lt. of water for 125 gm of crystal.
To prevent particles of copper hindering further etching, agitate the solutions carefully
by gently twisting or rocking the tray.
The board should not be left in the bath a moment longer than is needed to remove
just the right amount of copper. In spite of there being a resistive coating there is no
protection against etching away through exposed copper edges. This leads to over etching.
Have running water ready so that etched board can be removed properly and rinsed. This
will halt etching immediately.

Drilling is one of those operations that call for great care. For most purposes a 0.5mm drill is
used. Drill all holes with this size first those that need to be larger can be easily drilled again
with the appropriate larger size.
(D) COMPONENT ASSEMBLY
From the greatest variety of electronic components available, which runs into
thousands of different types it is often a perplexing task to know which is right for a given
job.
There could be damage such as hairline crack on PCB. If there are, then they can be
repaired by soldering a short link of bare copper wire over the affected part.
The most popular method of holding all the items is to bring the wires far apart after
they have been inserted in the appropriate holes. This will hold the component in position
ready for soldering.
Some components will be considerably larger .So it is best to start mounting the smallest
first and progressing through to the largest. Before starting, be certain that no further drilling
is likely to be necessary because access may be impossible later.
Next will probably be the resistor, small signal diodes or other similar size
components. Some capacitors are also very small but it would be best to fit these afterwards.
When fitting each group of components mark off each one on the circuit as it is fitted so that
if we have to leave the job we know where to recommence.
Although transistors and integrated circuits are small items there are good reasons for
leaving the soldering of these until the last step. The main point is that these components are

very sensitive to heat and if subjected to prolonged application of the soldering iron, they
could be internally damaged.
All the components before mounting are rubbed with sand paper so that oxide layer is
removed from the tips. Now they are mounted according to the component layout.
(E) SOLDERING: This is the operation of joining the components with PCB after this operation the circuit will
be ready to use to avoid any damage or fault during this operation following care must be
taken.
A longer duration contact between soldering iron bit & components lead can exceed the
temperature rating of device & cause partial or total damage of the device. Hence before
soldering we must carefully read the maximum soldering temperature & soldering time for
device.
The wattage of soldering iron should be selected as minimum as permissible for that
soldering place.
To protect the devices by leakage current of iron its bit should be earthed properly.
We should select the soldering wire with proper ratio of Pb & Tn to provide the suitable
melting temperature.

Proper amount of good quality flux must be applied on the soldering point to avoid dry
soldering.

BIBLIOGRAPHY
BOOKS:

1) Electronic devices and circuit theory

2) Electronic projects.
3) Microelectronic circuits.
4) Electronic for you.

WEBSITES:
1) www.efy.com
2) www.nationalsemiconductor.com
3) www.icdescription.com