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ANTENNA
A PROJECT REPORT
Submitted by
BACHELOR OF ENGINEERING
in
ELECTRONICS AND COMMUNICATION ENGINEERING
Project ID 4034
CERTIFICATE
Date:
This is to certify that the dissertation entitled "SIMULATING AND
MODELING OF MICROSTRIP ANTENNA has been carried out by
MINHAZ VAYADA (110770111022), ARTI PATEL (110770111004).
under my guidance in fulfilment of the degree of Bachelor of Engineering
in Electronics and Communication, 7th Semester of Gujarat Technological
University, Ahmadabad during the academic year 2014-15.
Guide:
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ACKNOWLEDGEMENT
Project work is something that cannot be completed by the blind efforts of an individual but it
is a constant inspiration and help of the people you work around.
We are heartily thankful to Mr. Raj Hakani whose encouragement, guidance and support
from the initial to this level enabled us for developing and understanding of the Project work.
We deeply acknowledge support of our respected Head of Electronics and Communication
Department Mr. Amit Agrawal gave us the constant and humble guidance throughout the
project work.
We owe our deepest gratitude to Dr. Saurin Shah, Principal, SOCET who became our
constant source of inspiration throughout the work.
We would like to thank from the bottom of our heart to Mr. Raj Hakani, who lead us
in the field of Antenna Design, and gave us right direction in HFSS software and design
pattern.
Finally, we deeply acknowledge the backbone support of our family.
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ABSTRACT
Microstrip patch antenna is widely used due to its many advantages, but its
main drawback is its narrow bandwidth. Using software like HFSS 13, CADFEKO and design parameters we can design patch and ground plane
dimensions. We can also design an antenna used in ISM band which works on
the frequency of 2.4GHz. Antennas performance also depends on substrate
material so here we can have an analysis for different substrate material and
we can get better bandwidth by analysing the performance of various
substrates. We can also get better VSWR and S11 with appropriate selecting
dimensions of Superstrate. This dimension of Superstrate is selected by iteration
method. We can achieve more (60%) bandwidth with slots into Microstrip
antenna.
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LIST OF FIGURES
Figure 1 Antenna Radiation Pattern ........................................................................................... 5
Figure 2 Radiation Pattern of a Directional Antenna................................................................. 6
Figure 3 A Vertically Polarized Wave ....................................................................................... 7
Figure 4 Commonly Used Polarization Schemes ...................................................................... 7
Figure 5 Measurement of Bandwidth ........................................................................................ 8
Figure 6 Geometry of Commonly known Microstrip Patch Antenna........................................ 9
Figure 7 Operation of Microstrip patch Antenna..................................................................... 10
Figure 8 Analysis of Efficiency, Bandwidth and Substrate Height ......................................... 11
Figure 9 Probe fed microstrip patch antenna ........................................................................... 12
Figure 10 Direct contact microstrip feed line .......................................................................... 12
Figure 11 Aperture coupled Microstrip patch antenna ............................................................ 13
Figure 12 Proximity coupled patch .......................................................................................... 14
Figure 13 Microstrip line with Electric field ........................................................................... 15
Figure 14 Top view and Side view of antenna ........................................................................ 16
Figure 15 Charge distribution and current density creation on the microstrip patch............... 17
Figure 16 Flowchart for designing microstrip antenna parameter ........................................... 21
Figure 17 Snapshot of MPA Calculator ................................................................................... 22
Figure 18 Top view of Microstrip Antenna with Rectangular Plane ..................................... 24
Figure 19 Graph of S11 for rectangular plane ......................................................................... 24
Figure 20 Top view of MPA with FR-4 Material .................................................................... 25
Figure 21 Result of S11 with FR-4 Material ........................................................................... 25
Figure 22 Result of S11 with PTFE Material .......................................................................... 26
Figure 23 Result of S11 with RT/Duroid Material .................................................................. 26
Figure 24 Result of Radiation Pattern ...................................................................................... 26
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LIST OF ABBREVATIONS
Symbol Name
Abbreviations
MSA
Microstrip Antenna
HFSS
ISM
NFC
VSWR
PTFE
EmC
Electromagnetic Compatibility
TEM
Transverse-Electric-Magnetic
FEM
FEKO
FR4
Flame Retardancies 4
WLAN
HPBW
MoM
Moment Method
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TABLE OF CONTENTS
TITLE PAGE ........................................................................................................................... II
CERTIFICATE ........................................................................................................................ III
ABSTRACT .............................................................................................................................. V
LIST OF FIGURES .................................................................................................................VI
LIST OF ABBREVATIONS ................................................................................................. VII
TABLE OF CONTENTS .................................................................................................... VIII
CHAPTER 1
INTRODUCTION ............................................................................................ 1
1.1
Overview ..................................................................................................................... 1
1.2
1.3
Motivation ................................................................................................................... 1
CHAPTER 2
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4.4 Advantages of Microstrip Antenna ................................................................................ 18
4.5 Disadvantages of Microstrip Antenna ........................................................................... 18
CHAPTER 5
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Chapter 1 Introduction
CHAPTER 1
1.1
INTRODUCTION
Overview
1.2
Problem Statement
Microstrip patch antenna is used due to its many advantages like small in size, easily
installable and light in weight but a main disadvantage of microstrip antenna is its bandwidth.
To overcome the bandwidth problem, different bandwidth enhancement techniques have been
adopted. Here I am going to make a microstrip patch antenna for ISM band which is widely
used for Cordless phones, Bluetooth devices, NFC devices and wireless computer networks.
Antenna is simulated in HFSS 13.
1.3
Motivation
Despite the many advantages of patch antennas, One of the main limitations with patch
antennas is their inherently narrowband performance due to its resonant nature. With
bandwidths as low as a few percent, broadband applications using conventional patch designs
are limited. Other characteristics of patch antennas include low efficiencies, limited power
capacity, spurious feed radiation, poor polarization purity, and manufacturing tolerance
problems. For over two decades, research scientists have developed several methods to
increase the bandwidth of a patch antenna. Many of these techniques involve adjusting the
Department of Electronics & Communication Engineering
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Chapter 1 Introduction
placement and/or type of element used to feed (or excite) the antenna. The first, simplest and
most direct, approach is to increase the thickness of the substrate, while using a low dielectric
substrate. Using thick dielectric substrate material on the other hand has the ability to produce
undesired surface wave which likely reduces the antenna efficiency, gain, bandwidth,
increases the side-lobes and antenna loss in general. In recent years the fastest-growing uses
of ISM bands have been for short-range, low power communications systems and Microstrip
patch antenna is best suitable for low power application.
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CHAPTER 2
LITERATURE SURVEY
In this section some related works on Microstrip Patch antenna has been explained.
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embedding parallel slots onto the patch (E-shaped) while the use of inverted patch improves
the gain of the antenna. The composite effects of integrating these techniques offer a low
profile, broadband, high gain, and compact antenna element suitable for array applications.
The proposed microstrip patch antenna achieves a fractional bandwidth of 21.79% (1.84 to
2.29 GHz) at 10 dB return loss. The maximum achievable gain of the antenna is 9.5 dBi with
gain variation of 0.9dB.
2.5. Design and Modeling of Microstrip Patch Antenna Used for S-Band
Communication
Author: Kashmira Vaghela, Ved Vyas Dwivedi, Balvant Makwana[4]
Published Year: Proceedings of an International Conference on Optoelectronics, ICT2009
Conclusion: From this paper I have got idea about design parameters of microstrip patch
antenna. Also I got idea about two substrates microstrip antenna. Here they have design
antenna for s-band (3GHZ).
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CHAPTER 3
ANTENNA FUNDAMENTALS
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P
P
=
area
4 r 2
HPBW: The half power beam width (HPBW) can be defined as the angle subtended
by the half power points of the main lobe.
Main Lobe: This is the radiation lobe containing the direction of maximum radiation.
[8]
3.1.2 Directivity
The directivity of an antenna has been defined as the ratio of the radiation intensity in a
given direction from the antenna to the radiation intensity averaged over all directions. The
directivity is fairly insensitive to the substrate thickness. In a Microstrip patch antenna
directivity is higher for lower permittivity because of the larger patch.
3.1.3 Gain
The gain is a basic property which is used as a figure of merit. It is defined as the ratio of
maximum radiation intensity in given direction to maximum radiation intensity from a
reference antenna produced in the same direction with the same power.
Gain G
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[8]
[8]
3.1.6 Voltage Standing Wave Ratio (VSWR)
In order for the antenna to operate efficiently, maximum transfer of power must take place
between the transmitter and the antenna. If the condition for matching is not satisfied, then
Department of Electronics & Communication Engineering
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some of the power may be reflected back and this leads to the creation of standing waves,
which can be characterized by a parameter called as the Voltage Standing Wave Ratio.
VSWR
1
1
Vr Zin Z s
Vi Zin Z s
3.1.7 Bandwidth
The bandwidth of an antenna is defined as the range of usable frequencies within which the
performance of the antenna, with respect to some characteristic, conforms to a specified
standard. The bandwidth of a broadband antenna can be defined as the ratio of the upper to
lower frequencies of acceptable operation. The bandwidth of a narrowband antenna can be
defined as the percentage of the frequency difference over the center frequency. These
definitions can be written in terms of equations as follows:
BWbroadband
fH
fL
f fL
BWnarrowband (%) H
100
fC
[7]
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CHAPTER 4
MICROSTRIP ANTENNA
Microstrip antennas are one of the most widely used types of antenna. A microstrip antenna
consists of a radiating metallic patch or an array of patches situated on one side of a thin,
non-conducting, substrate panel with a metallic ground plane situated on the other side of the
panel. The metallic patch is normally made up of thin copper foil or is copper-foil-plated with
a corrosion resistive metal, such as gold, tin, or nickel. Each patch can be designed with a
variety of shapes, with the most popular shapes being rectangular or circular. The dielectric
substrate is used primarily to provide proper spacing and mechanical support between the
patch and its ground plane. It is also often used with high dielectric-constant material to load
the patch and reduce its size. The substrate material should be low in insertion loss with a loss
tangent of less than 0.005, in particular for large array application.
[8]
Generally, substrate materials can be separated into three categories in accordance with their
dielectric constant:
1. Having a relative dielectric constant r in the range of 1.0 to 2.0. This type of material can
be air, polystyrene foam, or dielectric honeycomb.
2. Having r in the range of 2.0 to 4.0 with material consisting mostly of fiberglass reinforced
Teflon.
3. With r between 4 and 10. The material can consist of ceramic, quartz, or alumina.
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The primary source of this radiation is the electric fringing fields between the edges of the
conductor element and the ground-plane behind it. By analyzing this we discovered that the
Q (quality factor) of the dielectric cavity formed by two short circuit walls and four open
circuit walls depends on several parameters. The parameters are dielectric constant (r),
height (h) of the Substrate, patch dimensions and the frequency. Results showed that at high
frequency, radiation loss is the main source of energy dissipation as shown in figure.
[8]
The metallic patch essentially creates a resonant cavity, where the patch is the top of the
cavity, the ground plane is the bottom of the cavity, and the edges of the patch form the sides
of the cavity. The edges of the patch act approximately as an open-circuit boundary
condition. Hence, the patch acts approximately as a cavity with perfect electric conductor on
the top and bottom surfaces, and a perfect magnetic conductor on the sides. This point of
view is very useful in analyzing the patch antenna, as well as in understanding its behaviour.
Inside the patch cavity the electric field is essentially z directed and independent of the zcoordinate. Hence, the patch cavity modes are described by a double index (m, n). For the
(m, n) cavity mode of the rectangular patch, the electric field has the form.
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anywhere from 1 to 10.Materials with dielectric constants higher than 10 should be used with
care. They can significantly reduce the radiation efficiency by having small antenna volumes.
The most popular type of material is Teflon-based with a relative dielectric constant between
2 and 3. This Teflon-based material, also named PTFE (poly tetra fluoro ethylene), has a
structure form very similar to the fiberglass material used for digital circuit boards, but it has
a much lower loss tangent or insertion loss.
[6]
The selection of the appropriate material for a microstrip antenna should be based on the
desired patch size, bandwidth, insertion loss, thermal stability, cost, etc. For commercial
application, cost is one of the most important criteria in determining the substrate type. For
example, a single patch or an array of a few elements may be fabricated on a low-cost
fiberglass material at the L-band frequency, while a 20-element array at 30 GHz may have to
use higher-cost, but lower loss, Teflon-based material. For a large number of array elements
at lower microwave frequencies (below 15 GHz), a dielectric honeycomb or foam panel may
be used as substrate to minimize insertion loss, antenna mass, and material cost with
increased bandwidth performance.
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rectangular patch, where the center conductor of a coaxial feed line penetrates the substrate to
make direct contact with the patch. For linear polarization, the patch is usually fed along the
centreline, y = W /2. The feed point location at x =Xf controls the resonant input resistance.
The input resistance is highest when the patch is fed at the edge, and smallest when the patch
is fed at the center (x = L /2). It has narrow bandwidth and it is more difficult to model,
especially for thick substrates (h > 0.02).
[8]
Another common feeding technique, preferred for planar fabrication, is the direct-contact
microstrip feed line, shown in Figure. An inset notch is used to control the resonant input
resistance at the contact point. The input impedance seen by the microstrip line is
approximately the same as that seen by a probe at the contact point, provided the notch does
not disturb the modal field significantly.
The microstrip-line feed is easy to fabricate, simple to match by controlling the inset position
and rather simple to model. However as the substrate thickness increases, surface waves and
spurious feed radiation increase, which for practical designs limit the bandwidth (typically 2
5%).
[8]
Both the microstrip feed line and the probes possess inherent asymmetries which generate
higher order modes which produce cross-polarized radiation. To overcome some of these
Department of Electronics & Communication Engineering
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[8]
For the sake of maximum coupling the slot is usually placed at the center and it is
perpendicular to the feed line, as a result the patch and the slot may share common center.
The length of the slot should be kept somehow larger than the width of the slot. The
diagrammatic setup for aperture coupling is shown in figure. This scheme has the advantage
of isolating the feeding network from the radiating patch element. It also overcomes the
limitation on substrate thickness imposed by the feed inductance of a coaxial probe, so that
thicker substrates and hence higher bandwidths can be obtained but it suffers from high back
radiation.
Proximity coupling is a type of EMC feed, this has many advantages over edge fed and
coaxial fed antenna. Proximity-coupled microstrip antenna is also known as non-contacting
feeds. Some advantages are:
No drilling required.
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[8]
Matching can be achieved by controlling the length of the feed line and the width-to-line ratio
of the patch. The major disadvantage of this feed scheme is that it is difficult to fabricate
because of the two dielectric layers which need proper alignment. Also, there is an increase in
the overall thickness of the antenna.
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[8]
Hence, as seen from Figure, most of the electric field lines reside in the substrate and parts of
some lines in air. As a result, this transmission line cannot support pure transverse-electricmagnetic (TEM) mode of transmission, since the phase velocities would be different in the
air and the substrate. Instead, the dominant mode of propagation would be the quasi-TEM
mode. Hence, an effective dielectric constant (reff) must be obtained in order to account for
the fringing and the wave propagation in the line. The value of reff is slightly less than r
because the fringing fields around the periphery of the patch are not confined in the dielectric
substrate but are also spread in the air as shown in Figure above. The expression for
reff is
reff
( 1) ( r 1)
h
r
1 12
2
2
W
1
2
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[2]
It is seen from above Figure that the normal components of the electric field at the two edges
along the width are in opposite directions and thus out of phase since the patch is /2 long
and hence they cancel each other in the broadside direction. The tangential components
which are in phase, means that the resulting fields combine to give maximum radiated field
normal to the surface of the structure. Hence the edges along the width can be represented as
two radiating slots, which are /2 apart and excited in phase and radiating in the half space
above the ground plane. The fringing fields along the width can be modelled as radiating slots
and electrically the patch of the microstrip antenna looks greater than its physical dimensions.
The dimensions of the patch along its length have now been extended on each end by a
distance L. The designing parameters of microstrip patch antenna is described in next
chapter.
4.4.2 Cavity Model
Although the transmission line model discussed in the previous section is easy to use, it has
some inherent disadvantages. Specifically, it is useful for patches of rectangular design and it
ignores field variations along the radiating edges. These disadvantages can be overcome by
using the cavity model. A brief overview of this model is given below. In this model, the
interior region of the dielectric substrate is modelled as a cavity bounded by electric walls on
the top and bottom. The basis for this assumption is the following observations for thin
substrates (h << ).Since the substrate is thin, the fields in the interior region do not vary
much in the z direction, i.e. normal to the patch.
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The electric field is z directed only, and the magnetic field has only the transverse
components Hx and Hy in the region bounded by the patch metallization and the ground
plane. This observation provides for the electric walls at the top and the bottom.
Figure 15 Charge distribution and current density creation on the microstrip patch
[4]
Consider Figure 15, when the microstrip patch is provided power, a charge distribution is
seen on the upper and lower surfaces of the patch and at the bottom of the ground plane.
When the microstrip patch is provided power, a charge distribution is seen on the upper and
lower surfaces of the patch and at the bottom of the ground plane. This charge distribution is
controlled by two mechanisms-an attractive mechanism and a repulsive mechanism as
discussed by Richards. The attractive mechanism is between the opposite charges on the
bottom side of the patch and the ground plane, which helps in keeping the charge
concentration intact at the bottom of the patch. The repulsive mechanism is between the like
charges on the bottom surface of the patch, which causes pushing of some charges from the
bottom, to the top of the patch. As a result of this charge movement, currents flow at the top
and bottom surface of the patch. The cavity model assumes that the height to width ratio (i.e.
height of substrate and width of the patch) is very small and as a result of this the attractive
mechanism dominates and causes most of the charge concentration and the current to be
below the patch surface. Much less current would flow on the top surface of the patch and as
the height to width ratio further decreases, the current on the top surface of the patch would
be almost equal to zero, which would not allow the creation of any tangential magnetic field
components to the patch edges. Hence, the four sidewalls could be modelled as perfectly
magnetic conducting surfaces. This implies that the magnetic fields and the electric field
distribution beneath the patch would not be disturbed. However, in practice, a finite width to
height ratio would be there and this would not make the tangential magnetic fields to be
completely zero, but they being very small, the side walls could be approximated to be
Department of Electronics & Communication Engineering
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perfectly magnetic conducting. Since the walls of the cavity, as well as the material within it
are lossless, the cavity would not radiate and its input impedance would be purely reactive.
Hence, in order to account for radiation and a loss mechanism, one must introduce a radiation
resistance RR and a loss resistance RL. A lossy cavity would now represent an antenna and the
loss is taken into account by the effective loss tangent eff.
Light weight, low profile planar configurations, which can be made conformal.
The antennas may be easily mounted on missiles, rockets and satellites without major
alterations.
Linear, circular (left hand or right hand) polarizations are possible with simple
modification of patch geometry and changes in feed position.
Feed lines and matching networks are fabricated simultaneously with antenna
structure.
Narrow bandwidth.
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There are ways to minimize the effect of some of these limitations. For example, bandwidth
can be increased to more than 60% by using special techniques; lower gain and lower power
handling limitations can be overcome thorough an array configuration. Surface wave
associated limitations such as poor efficiency, increased mutual coupling, reduced gain and
radiation pattern degradation can be overcome by the use of photonic band gap structures.
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CHAPTER 5
The main factors involved in the design of a single patch antenna are:
Patch dimensions.
For the selection of substrate, the major electrical properties to consider are relative dielectric
constant and loss tangent. The selection of substrate material plays a very important role in
patch antenna design. A higher loss tangent reduces antenna efficiency and increases feed
losses. A higher dielectric constant results in smaller patch but generally reduces bandwidth
resulting in tighter fabrication tolerance. The substrate thickness should be chosen as large as
possible to maximize bandwidth and efficiency, but not so large to risk surface wave.
Step 1: Width Calculation (W): The width of a micro strip patch is given by,
W
2 fa
c
( r 1)
2
(5.1)
reff
( 1) ( r 1)
h
r
1 12
2
2
W
1
2
(5.2)
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[3]
Step 3: Calculation of the Effective Length (Leff): The effective length is given by,
Leff
c
2 f o reff
(5.3)
W
0.264)
h
W
0.258)( 0.8)
h
(5.4)
Step 5: Calculation Of Actual Length Of Patch (L): The actual length is obtained by
rewriting equation as:
L Leff 2L
(5.5)
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it will carry out all the necessary mathematical calculations, Please note that the values are in
millimetre.
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Ansoft
NameCorporation
X
XY Plot 1
m2
0.00
2.4500
-29.1383
m3
2.3900
-10.2684
m4
2.5200
-10.1882
FR_2.45
Curve Info
dB(St(coaxpin_T1,coaxpin_T1))
Setup1 : Sw eep1
dB(St(coaxpin_T1,coaxpin_T1))
-5.00
m4
m3
-10.00
-15.00
-20.00
BW:0.14 GHZ
5.7 %
-25.00
m2
-30.00
2.00
2.20
2.40
2.60
2.80
3.00
Freq [GHz]
Patch Dimension for PTFE material MPA: r = 2.5, height=1.7 mm, Patch dimensions = 33
mm, W=37 mm, ground Plane dimensions= L=44.2 mm, W=48.2 mm. We got S11= -30db at
2.48 GHZ.
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Ansoft
NameCorporation
X
XY Plot 1
m1
0.00
2.4800
m2
2.7400
-9.7985
m3
2.3900
-10.2900
PTFE_old
-29.5922
Curve Info
dB(St(coaxpin_T1,coaxpin_T1))
Setup1 : Sw eep1
dB(St(coaxpin_T1,coaxpin_T1))
-5.00
m2
m3
-10.00
-15.00
-20.00
-25.00
m1
-30.00
2.00
2.20
2.40
2.60
2.80
3.00
Freq [GHz]
Patch Dimension for RT/duroid material MPA: r = 2.2, height: 1.7 mm, Patch dimensions=
31.4 mm, W=39.15 mm, ground Plane dimensions: L=43.02 mm, W=49.72 mm. We got
S11=-31.4402db at 2.45 GHZ.
Department of Electronics & Communication Engineering
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References
REFERENCES
[1]
[2]
Mohammad
Tariqul
Islam,Mohammed
Nazmus
Shakib,Norbahiah
Misran
[4]
[5]
Band-Gap(EBG)
Substrate
on
Two
Patches
Microstrip
Design and Modeling of Microstrip Patch Antenna Used For S band Communication,
Ved Vyas Dwivedi & Balvant Makwana , Proceedings of an International Conference
on Optoelectronics, ICT(ICOICT 2009)
[7]
[8]
[9]
[10]
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