AIM R16 WS03 Electronic Board

Chapter 3: Structural Analysis
This tutorial demonstrates how to perform a static structural analysis using ANSYS AIM.
In this tutorial you will learn how to
Launch ANSYS AIM.
Import the geometry.
Create computational mesh.
Set up the simulation which includes setting the material properties and boundary conditions.
Calculate a solution.
Examine the results.
3.1. Prerequisites
This tutorial assumes that you have limited experience with ANSYS AIM so each step will be explicitly
described.
3.2. Problem Description

The goals are to demonstrate the ability of ANSYS AIM to import a CAD model, perform a static structural analysis, and evaluate design changes using the Workbench Parameter Manager.
You will import a CAD model of an electronic board, mesh it, define materials, and solve a structural
analysis. You will then use the Parameter Manager to evaluate how changing the applied loading and
geometry will affect the calculated stresses and displacements.
You will learn how to set up materials in details in this tutorial. You will assign materials from the default
material library and learn how to create and assign new materials.
3.3. Setup And Solution

The following sections describe the setup and solution steps for this tutorial:
3.3.1. Preparation
3.3.2. Starting AIM
3.3.3. Geometry
3.3.4. Mesh
3.3.5. Physics
3.3.6. Results
3.3.1. Preparation
1.
Create a working folder on your computer.

Release 16.0 - SAS IP, Inc. All rights reserved. - Contains proprietary and confidential information
of ANSYS, Inc. and its subsidiaries and affiliates.
Structural Analysis
2.
Copy the file AIM_ElectronicBoard.agdb to the working folder.
3.3.2. Starting AIM

In this step you will start ANSYS AIM and set up a simulation process.
1.
From the Windows Start menu, select Start > All Programs > > ANSYS 16.0 > ANSYS AIM 16.0 to start
a new ANSYS AIM session.
The ANSYS AIM application window will appear. The various Simulation Process Templates are
displayed in the Study panel at the left. The Help window is displayed on the right-hand side. It
contains links to instructional videos and the Help menu. The Workflow tab is displayed at the
bottom.
2.
You can rename the Study panel to a more descriptive name, such as, Electronic Board.
3.
Change the units to Metric (kg,mm,s,C,mA,NmV).

Home(
) > Units > Metric (kg,mm,s,C,mA,NmV)
Setup And Solution
Note
If the unit system is not in the list, click on Unit Systems....
Structural Analysis
In the Unit Systems dialog box, ensure that the unit system you are interested in is deselected in column D or the Suppressed column.
3.3.3. Geometry
1.
Select Structural from the Simulation Process Templates.
2.
In the Structural Template retain the selection of Structural only from the list under Physics.
3.
Retain Static from the list under Calculation.
4.
Retain the selection of Detect contact automatically.
5.
Click Create Simulation Process to setup the workflow for the static structural analysis.
6.
In the window that opens browse to your working folder, select the geometry file AIM_ElectronicBoard.agdb and click Open.
Setup And Solution
After the import is finished in the Simulation Process panel Geometry is marked as up to date.
As you can see the geometry is an electronic circuit board which contains different components.
In the Workflow tab you can see the tasks setup.
7.
Before proceeding you need to check the geometry. You can either click on the Geometry tab in the
Simulation Process panel, you can click on the Geometry cell in the Workflow tab, or you can use the
navigation toolbar.
a.
In the Geometry panel click on Selection Set under Output. You can see that there are 5 sets that
are imported with the Design model.
Structural Analysis
If you hover the mouse over a Selection Set, the components included in that set will be highlighted
in the graphics window. As you can see you have the following selection sets:
Electronic components
Circuits
PCB (Printed Circuit Board)
Heatsinks
Connectors
You can also see that the Geometry task shows Up-to-date status.
b.
8.
To expose the input parameters, go back to Geometry panel. Under Sources click on Geometry
Import Source. Under Geometry Preferences remove the text for Dimension key. After you erase
the Dimension key the status of Geometry panel is Out-of-date.
You can update the Geometry panel either by clicking on the blue lighting bolt next to Out_of-date
message near the top of the Geometry panel, clicking on the blue lightning bolt next to Output tab neat
the bottom of the Geometry panel, or by under RMB and selecting Update from the context menu.
Note
You can see that the parameters have now been imported.
9.
After refreshing the geometry you can see that a Dimensions property has been added to the Geometry
panel. That property contains the PCB_thickness dimension that was defined in DesignModeler. To expose
this dimension as a parameter, click on the triangular button next to the text box and select P which is
the Parametrize button. See Figure 3.1: Parameterize PCB Thickness (p. 7).
Setup And Solution

Figure 3.1: Parameterize PCB Thickness
So now you have a parameter which is the thickness of the board.

10. Save the project Electronic_Board.
3.3.4. Mesh
1.
Now you need to Mesh the geometry. You can do this by either:
Clicking on the Mesh cell in the Workflow tab.
Structural Analysis
Or in the Geometry panel under Connected Tasks, click on Mesh.
2.
The Mesh panel indicates an Out-of-date status. You can see that Structural, thermal or electric cond.
is selected for Engineering intent which will set the meshing preferences accordingly. By default, the
slider bar for Mesh resolution is set to below medium. You can generate the mesh by clicking on either
the blue lightning bolt near the top of the Mesh panel, the blue lightning bolt near the bottom of the
Mesh panel, the Update option under the Workflow tab, or by RMB inside the graphics window and selecting Generate Mesh from the context menu.
Setup And Solution

Figure 3.2: Tet Mesh
Note
As you can see in Figure 3.2: Tet Mesh (p. 9), the default mesh settings produce a
coarse mesh.
3.
You can check Statistics under Output and see that the Number of nodes is approximately 85000 and
the Number of elements is approximately 30000. Hold down the Shift key and right mouse button and
zoom in on the portion shown in Figure 3.3: Skewed elements in mesh (p. 10).
Structural Analysis
Figure 3.3: Skewed elements in mesh
The assembly is subjected to out-of-plane inertial loading, which produces in-plane bending stresses in
the board. As you can see in Figure 3.3: Skewed elements in mesh (p. 10), the default settings produced
a mesh with one tet element through the thickness of the board. This type of mesh is not ideal for
resolving bending stress. So you will modify the default settings to improve the mesh quality.
4.
10
To improve the mesh in the board you will change the elements to hex elements. In the Mesh panel click
on Objects.
a.
Click on Add next to Mesh Controls and select Element Shape from the list.
b.
In the Element Shape panel, select NS_PCB Selection Set from the Location drop-down list.
c.
Select Hexahedrons from the Shape drop-down list.
d.
To document the step rename Element Shape to Element Shape = Hex.
Setup And Solution

e.
Go back to the Mesh panel under Objects, click on Add next to Size Controls and select Body Sizing
from the list.
f.
In the Body Sizing panel, select NS_PCB from the Location drop-down list.
g.
Enter 1 mm for Element size.
h.
To document the step rename Element size to Board Size = 1 mm.
5.
Go back to Mesh in the navigation bar. You can see that it is Out-of-date now since the sizing is changed.
6.
Generate the mesh by clicking on the Generate Mesh button (with a lightning bolt) in the panel (top and
next to Output), or Workflow tab or you can right-click and select Generate Mesh from the context
menu.
Note
This mesh will take a little bit longer to generate.
7.
You can see in Figure 3.4: Improved Hex Mesh (p. 12) and Figure 3.5: Close up view of Hex Mesh (p. 12),
that the mesh quality is improved, particularly the board mesh.
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Structural Analysis
Figure 3.4: Improved Hex Mesh
Figure 3.5: Close up view of Hex Mesh
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Setup And Solution

You can check Statistics under Output and see that the Number of nodes is approximately 250000 and
the Number of elements is approximately 57000.
3.3.5. Physics
Navigate to Physics. You can do this by either:
Clicking on the Physics cell in the Workflow tab,
In the Mesh panel under Connected Tasks click on Physics, or
Right-click in the graphics window and select Add next task > Physics Solution
In the Physics panel you will be defining material properties.

1.
Click on Material Assignments under Objects. You can see that the whole geometry is selected. Delete
this.
Note
You will learn how to assign materials from the existing database and how to create,
define, and assign new materials. For the heat sinks and the circuits, you will assign
materials from the existing database. For the electronic components, board, and connectors, you will create new materials.
Following table shows the material setting at a quick glance.
Table 3.1: Material Properties
Component
Material from the database Material Properties
NS_heatsinks
Aluminium Alloy
Default
NS_circuits
Copper Alloy
Default
NS_elec_components NA
Density: 2.3e-06 kg mm^-3

Youngs modulus: 2.3e+05 MPa
Poissons ratio: 0.2
NS_PCB
NA

Youngs modulus: 2.4e+04 MPa
Poissons ratio: 0.13
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Structural Analysis
NS_connectors
NA

Youngs modulus: 900 MPa
Poissons ratio: 0.34
2.
3.
Click on Add next to Material Assignments. Select New Using and enter aluminium alloy. Select
Aluminium Alloy (Material Samples) from the list.
a.
Select NS_heatsinks for Location in the panel.
b.
You can rename the material from Aluminium Alloy Assignment to something more descriptive,
such as, Heat Sinks.
Go back to Material Assignments, click Add > New Using>copper. Select Copper Alloy (Material
Samples) from the list.
a.
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Select NS_circuits for Location in the panel.
Setup And Solution
b.
4.
Change the material name from Copper Alloy Assignment to Circuits.
Now you will assign a material for the electronic components on the circuit board. Click on Add next to
Material Assignments and select Material Assignment from the list.
a.
Select NS_elec_components for Location in the panel.
b.
Select Create New from the Material drop-down list.
15
Structural Analysis
c.
In the material assignment panel, click on the most recent material created (e.g., Material 4 in the
Material 4 Assignment 3 panel).
d.
In the material panel click on Add Material Data and select Density from the drop-down list.
e.
f.
Enter 2.3e-06 kg mm^-3 for Density.
Click on Add Material Data and select Isotropic Elasticity from the drop-down list.
i.
Enter 2e+05 MPa for Youngs modulus.
ii.
Enter 0.2 for Poissons ratio.
Change the material name to Electronic Components.
Note
You can assign other materials by referring to Table 3.1: Material Properties (p. 13).
16
Setup And Solution

5.
Now assign a material for the circuit board. Click on Add next to Material Assignments and select Material Assignment from the list.
a.
Select NS_PCB for Location in the panel.
b.
Change the name to Electronic Board.
c.
d.
In the material assignment panel, click on the most recent material created.
e.
f.
i.
Enter 2.4e+04 MPa for Youngs modulus.

17
Structural Analysis
ii.
6.
To add the next material click on Add next to Material Assignments and select Material Assignment
from the list.
a.
Select NS_connectors for Location in the panel.
b.
c.
In the material assignment panel, click on the most recent material created.
d.
e.
18
i.
Enter 900 MPa for Youngs modulus.
ii.

Setup And Solution

f.
Change the name to Connectors.
All of the materials are now defined.
Now you will add boundary conditions. The edge shown in Figure 3.4: Improved Hex Mesh (p. 12)
is connected to the electronic device. It must be restrained.
7.
To add boundary condition click on Add next to Boundary Conditions and select Support from the list.
a.
Select the 4 faces on the edge as shown and then click Add next to Location in the Support panel.
19
Structural Analysis
b.
8.
20
Change the name to Fixed Support.
Add another boundary condition. Click on Add next to Boundary Conditions and select Inertia Load
from the list.
Setup And Solution
9.
a.
The whole model is selected for Location. Retain this selection.
b.
Enter 9810 for Z under Specify to apply a load of 1 G acceleration in the Z direction.
c.
Parameterize the load by clicking on the Parameterize button next to Z.
d.
Change the name to 1 G Loading.
Check under Interface Conditions and you can see that they are 55 connections or contact pairs automatically defined.
10. Retain the default options under Physics Options and also under Solver Options.
Now you are ready to solve.
11. The Physics task is now ready to be updated. You can update it by either clicking blue lightning bolt next
to the Out-of-date message near the top of the Physics panel, the blue lightning bolt next to the Output
tab near the bottom of the Physics panel, by selecting Update under the Workflow tab, or by RMB
within the graphics window and selecting Solve Physics from the context menu.
You can see the status in the progress bar. In the Workflow tab you can also review the progress
using the Transcript tab.
21
Structural Analysis
12. When solving is finished the Physics panel shows the Up-to-date status.
3.3.6. Results
Click on Results in the Workflow tab. You can see that there are two results automatically defined
Displacement Magnitude and Equivalent Stress. You can review those results and/or request additional results.
1.
Click Displacement Magnitude and click Evaluate at the bottom of the panel, click on the lightning bolt
sign next to Out-of-date at the top of the panel, or right-click in the graphics window and select Evaluate
Results. See Figure 3.6: Displacement Magnitude Contours (p. 22).
Figure 3.6: Displacement Magnitude Contours
2.
Click the right mouse button in the window and click on Animate.
You can now animate the displacement of the electronic board. As expected it is bending down
on the outer edge (edge opposite the supported edge) of the board.
3.
22
Now check the Equivalent Stress.
Setup And Solution

Figure 3.7: Equivalent Stress Magnitude
You can see that the maximum equivalent stress occurs in the board near the restrained end (Figure 3.7: Equivalent Stress Magnitude (p. 23)). If you zoom in on the high stress area, you can see
the expected bending stress distribution (Figure 3.8: Zoomed View of Equivalent Stress Magnitude (p. 24)).
23
Structural Analysis
Figure 3.8: Zoomed View of Equivalent Stress Magnitude
4.
Now you will parameterize both the results. Click on the Parameterize button next to Calculated maximum, in the Equivalent Stress panel as well as the Displacement Magnitude panel.
5.
Now return to the Workbench Project Schematic by clicking on the Project tab. You can see that the
Parameter Set is now in a close loop. Double click on the Parameter Set to access Parameter Manager.
a.
24
In the Outline of Parameters panel, you can now see that two Input Parameters (board thickness
and applied inertia load), and two Output Parameters (maximum equivalent stress and total displacement), are defined.
Setup And Solution
In Outline of Parameters you can rename the parameters.

Change Geometry Import Source 1 PCB_thickness parameter name to PCB_thickness.
Change Equivalent Stress Calculated maximum parameter name to Max Equivalent
Stress.
Change Displacement Magnitude Calculated maximum parameter name to Max Displacement.
b.
In the Table of Design Points you can see all these in a row. Right click on row DP 0 (Current) and
select Duplicate Design Point from the context menu.
c.
Set P2 Inertia Load 1 Z to 98100.
Note
By doing this you will increase the inertia load from 1G to to 10 G. The analysis is
linear, so the results should also change by a factor of 10.
d.
Right-click on DP 1 and select Update Selected Design Points from the context menu.
25
Structural Analysis
Note
As expected, both the stress and displacement have increased by a factor of 10.
e.
Now you can evaluate how the change in the thickness of he board affects the stress and displacement.
Right-click on row DP 1 and select Duplicate Design Point twice from the context menu.
Retain the load as 10 G.
f.
Now change the thickness of the board to1.5 for DP 2 and 2.5 for DP 3.
g.
Select DP 2 and DP 3 and then right-click select Update Selected Design Points from the context
menu.
Note
As expected, changing the board thickness has a non-linear effect on stress and
displacement.
3.4. Summary
With ANSYS AIM interface you can perform a static structural analysis. You learned how to:
1. Set-up a structural analysis in AIM using a template,
26
Summary
2. Import CAD geometry with parameters,
3. Create and modify a mesh,
4. Assign materials from existing libraries,
5. Create and assign new materials,
6. Apply boundary conditions,
7. Solve the analysis,
8. Post-process results, and
9. Assess design changes using design points in the Workbench Parameter Manager.
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Chapter 3: Structural Analysis

3.2. Problem Description

3.3. Setup And Solution

Create a working folder on your computer.

Copy the file AIM_ElectronicBoard.agdb to the working folder.

3.3.2. Starting AIM

Change the units to Metric (kg,mm,s,C,mA,NmV).

) > Units > Metric (kg,mm,s,C,mA,NmV)

Setup And Solution

Select Structural from the Simulation Process Templates.

Retain Static from the list under Calculation.

Retain the selection of Detect contact automatically.

Setup And Solution

Setup And Solution

So now you have a parameter which is the thickness of the board.

Or in the Geometry panel under Connected Tasks, click on Mesh.

Setup And Solution

Select Hexahedrons from the Shape drop-down list.

To document the step rename Element Shape to Element Shape = Hex.

Setup And Solution

Enter 1 mm for Element size.

To document the step rename Element size to Board Size = 1 mm.

Figure 3.5: Close up view of Hex Mesh

Setup And Solution

In the Physics panel you will be defining material properties.

Material from the database Material Properties

Density: 2.3e-06 kg mm^-3

Density: 1.85e-06 kg mm^-3

Density: 9.2e-07 kg mm^-3

Select NS_heatsinks for Location in the panel.

Select NS_circuits for Location in the panel.

Setup And Solution

Change the material name from Copper Alloy Assignment to Circuits.

Select NS_elec_components for Location in the panel.

Select Create New from the Material drop-down list.

Enter 2.3e-06 kg mm^-3 for Density.

Enter 2e+05 MPa for Youngs modulus.

Enter 0.2 for Poissons ratio.

Change the material name to Electronic Components.

Setup And Solution

Select NS_PCB for Location in the panel.

Change the name to Electronic Board.

Select Create New from the Material drop-down list.

Enter 1.85e-06 kg mm^-3 for Density.

Enter 2.4e+04 MPa for Youngs modulus.

Select NS_connectors for Location in the panel.

Select Create New from the Material drop-down list.

Enter 0.13 for Poissons ratio.

Enter 9.2e-07 kg mm^-3 for Density.

Enter 900 MPa for Youngs modulus.

Enter 0.34 for Poissons ratio.

Setup And Solution

Change the name to Connectors.

All of the materials are now defined.

Change the name to Fixed Support.

Setup And Solution

The whole model is selected for Location. Retain this selection.

Parameterize the load by clicking on the Parameterize button next to Z.

Change the name to 1 G Loading.

Now check the Equivalent Stress.

Setup And Solution

Setup And Solution

In Outline of Parameters you can rename the parameters.