NEW

3D Laser Scanning Microscope

VK-X100/X200 Series

A Microscope, SEM and

Roughness Gauge in a Single Unit
Perform profile and roughness measurements with a click of a button

Providing Non-contact Profile and Roughness

Measurements on Nearly Any Material

NEW

3D Laser Scanning Microscope

VK-X100/X200

OPTICAL MICROSCOPE

SEM

ROUGHNESS GAUGE

It is impossible to focus on a target

with an uneven surface at high
magnication.

Observation can only be performed

in black and white, sample size is
limited and pre-processing is time
consuming.

Projections and depressions cannot

be measured without damaging the
target area.

All of these limitations are overcome

with a laser scanning microscope

NEW

Two New Functions

Wide-view

WIDE-Scan

For overall observation and measurement of a target

High-speed and high-precision image stitching with WIDE-Scan eliminates field-of-view
limitations at high magnification.

FULLY-AUTOMATED
MEASUREMENTS
with one push of
a button

Measurement

AI-Scan

Ensure uniform measurements from user to user

Per form fully-automated measurements with a single-click of the mouse.

COMMON PROBLEMS WITH CONVENTIONAL EQUIPMENT

Disadvantages
OPTICAL MICROSCOPE
1 Poor resolution, low contrast

Disc pits (6000x)

2 Shallow depth-of-eld

3 No support for traceability

Blade edge (1000x)

SEM
1 Monochrome image only

2 Time-consuming preparation
and observation

3 Restricted sample size

PREPARATION
Sample processing
Deposition
To stage

Approx. 20 min
OBSERVATION
Start-up Vacuuming
Observation

Approx. 25 min

Observation may not be possible due to the size

of the sample because it cannot t in the sample
chamber.

Ink toner (1000x)

ROUGHNESS GAUGE
1 Sample scratched due to
contact with probe

2 Difcult to measure target areas

3 Resolution is limited by stylus

tip diameter
Contact-type surface
roughness gauge

R: 2 m
0.08 Mil

Enlarged (1000x)
Hitting the desired
area of a target
with a stylus can
be problematic for
targets like screw
thread crests.
Aluminum surface
(200x)

Horizontal indentations on screen.

It is not possible to measure surfaces that are

smaller than the tip of the roughness gauges
stylus.

Problems Solved with a Laser Microscope

HIGH-RESOLUTION, LARGE DEPTH-OF-FIELD OBSERVATION
1 High resolution, 24000x
magnication

2 Fully-focused image

3 Traceability compatible
Z

X-Y

Independent administrative agency/

National Institute of Advanced Industrial
Science and Technology (AIST)

National Institute of
Standards and Technology
(NIST)

JCSS Accredited
Laboratories
Height difference gauge

Coordinate measurement
instrument

Calibration block

Calibration chart

3D Laser Scanning Microscope (VK Series)

Disc pits (6000x)

Measurement results obtained using the VK Series are

highly reliable and comply with national traceability
standards.

Blade edge (1000x)

RAPID 3D COLOR IMAGING

1 High-denition color image

2 No sample preparation

3 Measure samples of any size

and nearly any material

PREPARATION
Place your sample directly
on the stage

0 min
OBSERVATION
Start-up Observation

Approx. 3 min

Detachable head unit allows for a variety of sample sizes

to be measured, can be integrated with other devices and
supports remote operation.

Ink toner (1000)

NON-DESTRUCTIVE PROFILE AND ROUGHNESS MEASUREMENTS

1 Non-contact design can be used
on soft targets

2 Easily locate area of interest

3 Small beam-spot laser

LED pad (1000x)

Laser microscope
2D image

3D image

R: 0.4 m
0.02 Mil

Laser beam diameter is signicantly smaller than a

roughness gauge stylus, enabling more accurate
measurement of irregular shapes.

VK-X100/X200 Features.01

OBSERVATION
Observation of unparalleled clarity

The Next Step in the Evolution of Optical Observation

High-resolution laser monochrome
image

Full-focus image
Optical observation

Easily achieves full-focus

observation

NEW

High resolution, high

magni cation observation

Digital microscope observation

Capture high-resolution images with true color

Super high-resolution observation

Built-in camera with 3CCD imaging mode

21.6 megapixel image

Full-focus observation
Capture fully-focused images, even on threedimensional objects or at high magnication.

What is the pixel shift method?

Records a total of 9 images by shifting the CCD both
vertically and horizontally by 1/3 of a pixel. Furthermore,
it obtains RGB data for each pixel, thus allowing for clear
observation with superior color reproduction.

High-speed auto focus

Instantly obtain a focused image of a sample with a single click, even at
high magnication. Additional focus adjustments are unnecessary.

IC pattern (1000x)

Blade edge (1000x)

Industrys Best

16-bit laser color image

Sandpaper (400x)
Color SEM-like
observation

Industrys Best

3D
observation

16-bit laser color image

Achieve fully-focused observation with unparalleled resolution

By scanning the entire surface with a
short-wavelength laser, full-focus
observation is achieved from 200x to
24000x* at resolutions that can not be
attained with an optical microscope.
* When using the VK-X200 Series

Optical image

Laser image

Disc pits (6000x)

Monochrome laser image

16-bit laser color image

Ink toner (1000x)

SEM-like resolution with real color

By scanning a laser in XYZ directions
over a target, users can capture fullyfocused color images with accurate
height information associated with each
pixel.

VK-X100/X200 Features.02

RECORDING
Intuitive and easy-to-use interface

Now Anyone can Perform High-Quality Measurements

Developed with years
of experience and
technical knowledge.
Easy Mode and
AI-Scan allow anyone
to perform expert
measurements.

Worlds First

The 3 functions of AI-Scan

1. AAG function

Start measurement with a single click

Automatically selects the two best settings for the laser light-receiving element to allow for accurate measurements to be
made on angled surfaces and targets with varying levels of contrast.
* AAG=Advanced Auto Gain

Conventional method

AAG function

Diamond tool (400x)

Glare

CONVENTIONAL ALGORITHM
(1) Sensitivity adjustment

Exists

1-2. Optimal adjustment at each height

Changes the sensitivity of the light-receiving

element to prevent saturation when scanning a
sample.

Field of View

AAG ORIGINAL
(2) Sensitivity readjustment*
Absent

Automatically adjusts to raise the sensitivity to a

level just below the level that will produce
saturation.
* If settings are performed without this adjustment,
reections on angled surfaces and dark surfaces
will be weaker and cause errors.

Conventional systems only adjust the

laser sensitivity at a certain height,
making it impossible to account for
changes in the surface of the target
throughout the entire measurement
range.

AAG FUNCTION
Field of View

Measurement range

1-1. Automatic adjustment of the laser sensitivity

FULLY-AUTOMATED
MEASUREMENTS
with one push of
a button

By simply clicking the Start measurement button,

the AI-Scan function will automatically scan an object
using the optimal settings.

2. Auto setting of the upper and lower limits

The lens scans automatically

Automatically recognizes and sets the upper and lower limits of

the measurement range, and then collects measurement data by
scanning the target throughout that range.

The upper and lower limits on the screen are

recognized and automatically set as the
measurement range
Upper limit

Lower limit

3.

Double scan function

When using single scan

Adjusts the measurement and capture settings and automatically re-scans the target to obtain information
that wasnt detected during the rst scan.

After double scan

Solder (200)

VK-X100/X200 Features.03

MEASUREMENT
Measure any surface shape

Robust measurement software provides flexibility

for analysis
Perform prole, height, area and volume measurements
Prole and 3D measurement

Height, width, angle

and cross-section measurement
The VK-Analyzer software can measure the height, width,
cross-section, angle or radius-of-curvature of any userspecied line or curved cross-section prole.

Height, width, angle and cross-section

measurement (1000)

Radius-of-curvature of a micro lens

(1000x)

Surface area and volume measurement

Measures volume, surface area and surface area to area ratio
of objects in any specied location on the screen.

Optical film (1000x)

Surface area measurement of a solar

battery (1000x)

3D image and prole comparison

Prole and 3D measurement

Compare proles on two different images

3D comparison view
Aligns two three-dimensional images to allow for comparative
evaluation.

Comparative measurement
Overlay and compare prole measurements on two different
targets. Differences in height are automatically displayed in
the prole graph.
Sample A

Sample A

LED pad unit - 3D comparison (1000x)

10

Sample B

Differential measurement of sample A and B

Sample B

Evaluate and characterize surface topography

Quantify line and surface roughness

Line roughness measurement

Calculate roughness on a 2D or 3D image for a given line.

Surface roughness measurement

Quantitatively determine differences in surface conditions by
measuring the surface roughness of a target.

Film - surface roughness comparison (3000x)

Sample A: Ra 1.5 m

1. Surface-roughness of red filter

Sample B: Ra 3.2 m

2. Surface-roughness of blue filter

Electronic device pattern (1000x)

Automatically record and measure multiple samples at once

Automatically measures targets that have a repeating
pattern

Automatic width and height measurement

Performs consecutive measurements of multiple areas

Automatic measurement of multiple areas on

multiple samples

Automatically measures the width and height of targets that

have a repeating pattern. Since measurement is automatic, no
user errors are generated, allowing for rapid, accurate
measurement.

Using the motorized stage (optional), multiple areas of a single

sample or specic areas of multiple samples are automatically
measured.

Resist pattern (6000x)

Color lter (1000x)

Optical lm (1000x)

11

Laser Scanning Microscope History

Evolution to an easy-to-use, high-precision

instrument
The shift from a laser microscope to a laser scanning microscope
Light receiving element

Improved operability

VK-X100 Series

NEW
FULLY-AUTOMATED
MEASUREMENTS

16-bit

with one push of

a button

Achieves the measurement of shapes that are at or

below a micron. Enables a range of observation,
from optical microscope to SEM observation, in a
single unit.

One-click AI-Scan

VK-8700 Series

14-bit

PHOTOMULTIPLIER

A red semiconductor laser that greatly improves

versatility with a variety of observation and
measurement options.

Flow chart format

VK-9500 Series

A short wavelength violet laser that achieves

high measurement precision with a 14-bit
light receiving element
Equipped with a violet laser as well as a 14-bit
photomultiplier to achieve high measurement precision with
18000x observation.

VK-8500 Series

PHOTODIODE

Enables the measurement of surface

shapes from lines to planes
Performs area scanning with a red semiconductor
laser and achieves 3D shape analysis as well as
color confocal images.

From lines to planes

8-bit
VK-7500 Series

CCD

The fusion of a laser displacement

meter and a microscope

12

Achieves both microscope observation and prole

measurement by using a laser to perform line
scanning.

10 nm

5 nm

0.01 m

0.005 m

A built-in 16-bit light receiving element, along with

AI-Scan mode, enables simple, high-accuracy
measurements with high-resolution image capture.
m

NEW
NE

VK-X200 Series

The worlds most advanced laser scanning

microscope with 24000x magnication and
mic
0.5nm resolution.
0.5

Greatly improved
accuracy

VK-9700 Series

Further
er increases the versatility of observation
observat and
measurement functions and can be operated by
non-experienced users.

By improving the lightreceiving element,

response capabilities have
improved dramatically.

Measurement function

Recording function

Observation function

Extremely versatile with 1 nm resolution and the ability to observe

transparent objects.

TYPE
Light-receiving
element
Magnication
Optical zoom
Laser scanning
method
HDR function
Linear scale module
resolution
Measurement method
setting
Detection algorithm
AI-Scan function
Image stitching
function
Navigation function
Traceability
compatible
Repeatability ()
Top surface lm
thickness of a
transparent object
Film thickness
measurement

VF-7500

VK-8500

VK-9500

Line CCD, 8-bit

Photodiode, 8-bit

Photomultiplier, 14-bit

VK-8700

Photomultiplier, 14-bit

VK-9700

VK-X100

Photomultiplier, 16-bit

VK-X200

250x to 2500x
None

200x to 8000x
1x, 2x, 4x

200x to 18000x
1x to 6x

200x to 12000x
200x to 18000x
1x to 6x

100x to 16000x
200x to 24000x
1x to 8x

Line (488 pixels 1 pixel)

Area (1024 768 pixels)

Area (1024 768 pixels)

Area (2048 1536 pixels)

Area (2048 1536 pixels)

None

None
10nm
(0.01m)

None
10nm
(0.01m)

HDR function (16-bit)

5nm
0.5nm
(0.005m)
(0.0005m)
Manual settings/
Built-in Easy mode
Peak algorithm, RPD algorithm
Yes
Yes (Built-in WIDE algorithm)

Manual

Manual

Manual

Peak algorithm
None

Peak algorithm
None

Peak algorithm
None

OTC function (14-bit)

10nm
1nm
(0.01m)
(0.001m)
Manual or Beginner Mode
(AAG function)
Peak algorithm, RPD algorithm
None

None

None

Yes (AIA system)

Yes (FAST algorithm)

None

None

None

None

Yes

None

Yes

Yes

Yes

Yes

0.03 m

0.03 m

0.02 m

None

0.03 m

0.014 m

0.02 m

0.012 m

None

None

None

Yes

Yes

Yes (line lm thickness

measurement)

Yes (line lm thickness

measurement)

Yes (line lm thickness

measurement)

Yes (line and area lm thickness

measurement)

Yes (line and area lm thickness

measurement

1 nm

0.5 nm

0.001 m

0.0005 m

Resolution of
the linear scale module
13

Part.

New features of laser scanning microscopes

Higher Precision
16 times the dynamic range of conventional laser scanning microscopes
Industrys Best

16-bit photomultiplier

When it comes to obtaining accurate data, the element responsible for detecting the reected laser light is the most important component
of a laser scanning microscope. Boasting the worlds greatest dynamic range, the 16-bit photomultiplier of the VK-X Series is able to
accurately detect both faint and strong reected light, even on highly-angular surfaces.

Conventional

256x
more than a CCD

16x

VK-X100/200

more than
conventional models

CCD

Conventional

8-bit
(256 levels)

12-bit
(4096 levels)

16-bit
(65536 levels)

* Dynamic Range Comparison

Automatically adjust the sensitivity of the 16-bit photomultiplier to its

optimal settings
Worlds First

AAG function*

* AAG = Advanced Auto Gain

16-bit & AAG

This function automatically adjusts the sensitivity of the laser receiving element
throughout the entire measurement range to account for variations in material, shape
and reectance.
Glare

(1) Sensitivity adjustment

Exists

Changes the sensitivity of the light-receiving

element to prevent saturation when scanning a
sample.

AAG ORIGINAL
(2) Sensitivity readjustment*
Absent

Automatically adjusts to raise the sensitivity to a

level just below the level that will produce
saturation.
* If settings are performed without this adjustment,
reections on angled surfaces and dark surfaces
will be weaker and cause errors.

Diamond tool (400x)

Achieves even higher precision

Industrys Best

0.5 nm linear scale module

Detect position
information in the z-axis
with an ultra highprecision 0.5 nm linear
scale module that is 20x more accurate than conventional
systems. This newly developed linear scale module can
achieve high-resolution measurement and boasts a
reliability that can be traced back to national standards.
Resolution

14

Linear scale module

[Conventional]
0.01m
[VK-X200]
0.0005m
Achieves an ultra high precision that is 20x
greater than conventional models.

Higher Speeds
Achieves measurement speeds that are at least 2x faster than conventional systems
NEW

Equipped with an ultra high-speed scan mode

with a top-speed of 120 Hz

Measurement speeds have been improved to 2x that of conventional systems while also improving the measurement accuracy. For
applications that require even higher speeds, a newly developed 120 Hz ultra high-speed scan mode can be equipped.

[Measurement mode: High-precision]

[Measurement mode: Ultra high-speed]

Conventional

Conventional

2x
faster than conventional
models

VK-X

10

8x
faster than conventional
models

VK-X

Measurement speed (sec)

Measurement speed (sec)

* Reference data from measuring a 10 m step with a 50x objective lens

Perform high-precision measurements in a shorter amount of time

RPD* algorithm

* RPD=Real Peak Detection

The VK-Xs original algorithm detects the true peak position using the Z-I curve after measurement. It enables high resolution with a
signicant reduction in measurement time.
Z-I curve after measurement

0.053 m (0.002 Mil) standard step sample measurement

result (Comparison with conventional method)

Position in Z-axis direction

(Z position)

Conventional method

Detected peak
Cannot detect the real peak.
Conventional method

RPD method

Intensity of received reflected

light (Intensity)
The RPD algorithm enables high-precision
measurement results while reducing the time
it takes to scan a target.

Detected peak
Can detect the real peak.

RPD method

15

New features of laser scanning microscopes

Part.

Resolve narrow eld-of-view issues

with image stitching

Issue.1

A narrow eld-of-view prevents a user from understanding the target as a whole

and restricts the measurement range.

Conventional measurement method

High-magnification makes it difficult to understand what and where you are looking at.

The statue of Lincoln

on a U.S. penny
(200x)

WIDE-Scan

High-speed,
high-precision

Solution

16

Use WIDE-Scan mode to easily understand the overall

structure of a target.
A high magnication image allows users to perform measurements with high-precision. However, as the magnication
is increased, the eld-of-view reduces, making it difcult to understand where you are looking or what you are looking
at. WIDE-Scan allows users to quickly and easily generate a wider eld-of-view image by stitching together multiple
images.

Issue.2

Measuring only a single area often leads to incorrect data when applied to the
entire target.
Conventional measurement method
Each location being measured exhibits variations in the result.

20.5 m height
18.5 m height
22.5 m height

Average height 20.5 m

WIDE-Scan

High-speed,
high-precision

Solution

Multiple areas can be measured and

averaged with WIDE-Scan.
If only measuring a limited number of areas, the numerical values may vary depending on the locations being
measured. WIDE-Scan obtains a wide-eld, high-resolution 3D image and allows users to average data collected
from a much larger sample area.

17

New features of laser scanning microscopes

Part.

Easily perform high-speed image stitching and

wide-eld measurements with WIDE-Scan

High-speed,
high-precision

Solution

WIDE-Scan
Optional

By combining AI-Scan and WIDE-Scan, images can be

NEW

seamlessly stitched together at speeds over 6x faster than

Image stitching application

VK-H1XJE

conventional systems.

High-precision stitching
with the WIDE algorithm

Conventional
image stitching
Measurement,
processingVK-X100/X200
and stitchingimage stitching
speed are dramatically improved with
AI-Scan and WIDE algorithm.

Quickly stitches together images without the

appearance of seams or incorrect measurement
information. Automatically corrects all XYZ data by
evaluating the light intensity and height data of
overlapping areas.

PCB (200x)

6x the measurement speed

of conventional models
Measurement, processing and stitching speed are

Conventional

6x

faster than
conventional models

VK-X

dramatically improved with AI-Scan and WIDE -Scan

algorithms.
10

60

Measurement speed (min)

* Reference data from measuring an approx. 4 mm square

Image assembly - manual operation

Its possible to stitch together several images without the need of a motorized stage.
Just drag and drop multiple images into the software, and the VK-X will automatically
complete the merge.

18

Step.1

Step.2

Easy stitching

Free measurement

If an arbitrary range is set, the motorized stage will be

Even for stitched images, its possible to perform any

used to automatically perform continuous

measurement by clicking on the image.

measurement and stitching within that range.

Built-in navigation
system
Use the wide-eld image that was stitched
together as a reference when navigating
around a target at higher magnication.

19

New features of laser scanning microscopes

Part.

A new function captures subtle features that were

previously impossible to image
NEW

16-bit gradation dramatically enhances image contrast and eliminates glare

WO RLDS FI RST

High Dynamic Range (HDR) Function

This function optimizes the appearance (texture and contrast) of targets with unclear or low-contrast surfaces.
It enables higher contrast, and an unprecedentedly clear observation that fully captures the details of the target
object.

Conventional 8-bit gradation

Normal image

8-bit

(256 levels of gray)

HDR

16-bit

After HDR processing

Conventional method

16-bit

Printing (400x)

(65536 levels)

HDR function

Gradations
obtained by
capturing
multiple images

Gradations obtained
by capturing a single
image
Low-contrast gradations are
shown in detail

Light guide plate(1000x)

Difficulties
The range of obtainable brightness is narrow, resulting in the
glaring of areas beyond the range.
Subtle contrast cannot be rendered because of coarse resolutions.

Conventional
256x levels

Solutions
The range of obtainable brightness is wide, diminishing the
perceived glare.
Subtle contrast can be rendered because of detailed gradation.

Differential observation and prole measurement without the need to remove and insert prisms or lters

C-laser DIC display function

[Function for observing minute surface features]
This function combines the laser image and height information. This enables effective observation of target objects previously difcult to
observe when using contrast information, such as mirrored samples and samples with little variation in surface texture. It lets you observe
nano-level indentations and projections, which were difcult to observe with conventional laser microscopes.

Laser, full-focus image

20

Rear face of a wafer

(1000x)

C-laser DIC 2D image

C-laser DIC 3D image

Capture the top surface of a transparent object

Transparent Top Surface Observation function

Transparent Top mode acquires information on the outermost surface of a transparent object, while being
unaffected by light that reects from other layers within the target.
Resist (1000x)

Conventional model

VK-X100/X200

Capture data from the top, bottom and intermediate layers of a transparent object

Area Film Thickness Measurement function

Analyze multiple layers at all points in the
observation eld. You can display 3D
images and cross-section proles of a
selected single layer or multiple layers, and
measure shapes or lm thicknesses of
user-specied locations.

Laser light
Front surface film

Transparent film
surface

Ink jet nozzle (1000x)

Position in the Z axis

[Z position]
Front face

Film thickness
Rear face
Rear surface film

Received reflected light

intensity [Intensity]

In the case of transparent

targets, transmitted light
goes through the peak
(focal point) on the front
face and detects the peak
(focal point) on the rear
face. The difference in
both peak positions can
be measured (lm
thickness).

Substrate
surface

Transparent
film thickness

Transparent
film surface
Substrate
surface

21

Principle structure

Color CCD camera

Half mirror

Uses two light sources to

acquire information

Short wavelength
laser light source

The laser scanning microscope employs two light

sources: a laser source and a white light source. These
two types of light sources enable the acquisition of
laser intensity, color, and height that are required to
construct fully-focused color images, fully-focused
laser images and height information.
[Detects re ected-light intensity and height with a
short-wavelength laser]
The light that is emitted from the laser light source of
the laser scanning microscope is focused on the target
via the XY scanning optical system and the objective
lens. The focused beam spot then performs a surface
scan of the target within the observation eld through
the XY scanning optical system. The target within the
observation eld is split into 1024 x 768 pixels,
scanned, and then reected light for each pixel is
detected with the light receiving element. The objective
lens is then driven in the Z-direction and surface
scanning is repeated. This acquires the reected-light
intensity of every z-axis position for each pixel. After
this, the height information and reected-light intensity
is detected, with the z-axis position of the highest
reected-light intensity as the focal point. This makes it
possible to acquire full-focus light intensity images and
height images (information) in which the entire target is
in focus.

Condensing lens

X-Y scanning
optical system

Half
mirror

Pinhole
White light source for
illumination

Half
mirror

Light receiving element

(photomultiplier)

Objective
lens

Observed
target object

[CCD camera obtains color information]

The data collected from the laser is then coupled with
the reected light from the white light source to
produce an image with height and color information.
This gives a user an image that rivals the resolution of
an SEM, yet also provides real color observation.

Diagram of the measurement principle

Short wavelength laser light

Three types of images built from laser scan

1024 X 768 pixels

1 Scan with the laser

2 Move the objective

lens in the Z-axis
direction and scan
with the laser again.

3 Repeat for the

entire measurement
range.

4 Measurement
complete.

22

Measurement range

in the X and Y directions.

Color + laser intensity information

Laser intensity information

Height information

Color + Laser image

Laser intensity image

Height-Color Map

Fully-focused color image that

SEMs and optical microscopes
cannot provide.

Gray-scale, high contrast image

similar to what SEMs provide.
Shows changes in reected laser
intensity.

Different heights are marked by

changes in color.

High accuracy measurement with the pinhole confocal optical system

Conventional pseudo-confocal optical systems that use a CCD
as the light receiving element are limited in their ability to
provide either high-accuracy measurements or high-denition
images. Since these systems do not employ a pinhole
mechanism, unfocused light is able to be collected by the
CCD. However, with a pinhole confocal system, light is only
received when it is at its focal point, creating very sharp
images with high-resolution measurement data.
Lens

CCD

Lens

Conventional optical systems receive reected light from areas

outside of the peak focal point. With a confocal system, only
light from the focal point is collected, producing a sharper
image.
Peak detection (focal point) comparison between a pinhole confocal
system and conventional system.

PMT

Mirror

Lens

Position in the Z axis

[Z position]

Mirror

Difference between a pinhole confocal system

and conventional systems

Lens

Laser light

Laser light

Target

Target

Pinhole

Z-I curve of conventional optical system

Light intensity peaks at focal points are spread out in
conventional optical systems
Ambient light from points other than the peak focal point

Focal
position

Z-I curve of the pinhole confocal optical system

Received reflected light intensity [Intensity]
Optical film (1000x)

Conventional system

VK-X100/X200 system

Image from a conventional

optical microscope
Defocused light and flare cannot be
removed.

1 Device 4 Benefits

Confocal image the VK-X100/X200

Only displays the area thats in focus,
while eliminating defocused information.

Disadvantages of Interferometers

1. Unable to detect steep angles

2. The targets that can be viewed are limited

When using interferometers to measure objects with steep angles, due

to the concentration of interference patters in those areas, accurate
information is unable to be gathered.

With light interference, if the surface does not reflect well, measurement
is difficult to perform, so support for a variety of targets is not provided.
Measurement also cannot be performed if there is an extreme difference
between the reflected light from the reference surface and the reflected
light from the measurement surface (Works well with mirrored-surfaces,
but is difficult to measure samples with extreme projections and
depressions and samples without much of a reflective surface).

VK-X100/X200

The confocal range nding system, which uses laser

reection intensity for detection, can measure shapes that
have high angular characteristics with low noise.

VK-X100/X200

Because it uses a photomultiplier element (PMT) with a wide

sensitivity range, targets that include areas of both high and
low reectivity can be accurately measured.

3. Slope correction is required

4. The lateral resolution is the same as an optical microscope

Before measurement, slope correction of the sample with a goniometer

stage is required. Because interference patterns become crowded when
the sample is at an angle, proper measurement cannot be performed.

Since interferometers operate on white light, the lateral resolution of these

systems will be the same as a conventional optical microscope approximately 0.43 m 0.02 Mil.

VK-X100/X200

Because interference patterns are not used, direct

measurement is possible even if the sample is at an angle.
Slope correction can also be applied after image capture.

VK-X100/X200

Using short-wave lasers and pinhole optics, a lateral

resolution of 0.13 m 0.01 Mil can be obtained.

23

SOFTWARE OPTIONS

2D & 3D Measurement Tools

NEW

ISO 25178

Surface texture measurement

module VK-H1XR
This software module complies with
ISO 25178 and allows users to complete
measurements of several surface
parameters. Parameters that can be
measured include height, spatial, hybrid,
functional, and functional volume
measurements.

Analysis expansion module VK-H1XP

Indentation/projection measurement

Sphere/surface angle measurement

Divide areas above (projections) or

below (indentations) a specified height
threshold value into separate zones,
and take measurements for each area.

Automatically extracts the radii of

circular objects in a specified area.
Since the measurements are calculated
automatically, this function reduces
variations in measurements between
users.

PROJECTION MEASUREMENT

SPHERE MEASUREMENT

Microlens (1000x)

Bump (2000x)

Particle analysis
module VK-H1XG
Automatically counts and measures
circular objects within the microscope field.
Preprocessing such as automatic
separation of adjacent particles, counting,
diameter, etc can be performed.

Position compensation function

When a standard sample has been registered and a different image is opened in a
template, the VK-Analyzer automatically adjusts the image position so that the image
opens at the same position as the registered sample. This function is effective when
measuring large sample populations.
AUTOMATIC POSITION COMPENSATION

Tilted

HEIGHT DIFFERENCE ANALYSIS FUNCTION

Automatically corrected

Analyzes the difference between two images as

a solid 3D image. Enables surface-based image
analysis that can capture minute changes.

Metal surface
(1000x)

Wire bonding (1000x)

24

Industrys First

VK LASER SCANNING MICROSCOPE OPTIONS

Adjustable-height stand
for the VK Series

Stand for
the VK Series

The unique structure of the VK-X allows for the measuring head to be
separated from the base, making targets that were previously too tall to
measure easily possible. (Max 128 mm 5.04") (OP-82693)

A highly-rigid, adjustable-height stand attaches to the back of the

VK microscope, allowing the measuring head to be adjusted to any
height. Inserting a spacer between the measuring head and the
base improves the stability and enables high accuracy
measurement.

Turning the
knob adjusts
the height as
desired.

128 mm
5.04"

The spacer
improves the
stability.

Objective lenses

300 mm 11.81" wafer stage

Wide magnication range

Support larger wafer sizes (OP-51498)

A large selection of lenses are available, including high N.A., APO,

long focal distance, and low magnication lenses.

An entire 300 mm 11.81" wafer can be examined and analyzed.

Easy-to-mount design.

Motorized stage

Separate measuring head

Automatic image assembly (VK-S100K/VK-S105/VK-S110)

Non-destructive examination of large-sized targets

The motorized stage is essential to automatic image assembly and

programmable operation. Easy-to-mount design.

Non-destructive examination and analysis of any point on largesized targets by mounting the head on a 3rd-party stage.

* Optional 100 mm x 100 mm 3.94" x 3.94" motorized stage also available.

25

DIMENSIONS
Unit: mm inch

Measurement unit
VK-X210

3.93"
100

4.25"
108

3.05"
77.5
7.3 0.29"

270.5 10.65"
159
6.26"

Controller
VK-X200K

415.4
16.4"

171.3
6.74"

150 5.91"
155 6.10"
249.9
9.84"

Measuring head

14.9"
378.5
270.5 10.65"

13.3
0.52"

295.4 11.63"
398.4 15.33"

53.2
2.09"

405
15.94"

22 0.87"

4 x M6
1.38"
6.52"
Depth 10 0.39" 35
165.5
130 5.12"
20.5 0.81"
0.49"
12.5
190
7.48"
168
172
6.61"
6.07"
0.51"
13

4.69"
119.2
160 6.30"
164
6.46"

285 11.22"
357 14.06"

6
0.24"

0.28" 7

4.25"
108
2 x M6 Heli-Coil, 1.5D
(Depth 8 0.31")

70.2 2.76"

(40) 1.57"

6.52"
165.5
0.81" 20.5

77.5 3.05" 0.26"

2 x 6.6 through hole
80
3.15"

Measurement unit
VK-X105/110

3.74"
95
7
0.28"

3.80"
96.5

63.5 2.50"

10.63"
270
159 6.26"

Controller
VK-X100K

416.4
16.39"

0.52"
13.3

171.3
6.74"
5.91"
150
155 6.10"
249.9
9.84"

295.4 11.63"
397.1 15.63"

52.2
2.06"

405
15.94"

22 0.87"

Measuring head
366.5 14.43"
166.5 6.56"
66.5
2.62"

23.5 0.93"

4 x M6
Depth 10
0.39"

182
7.17"
190
0.28" 80 7.48"
7 3.15"
3.80"
96.5

(40) (1.57")

2 x M6 Heli-Coil 1.5D
(Depth 8 0.31")

145 5.71"

0.26"
2 x 6.6 through hole

26

20.5 0.81"
63.5 2.50"

80
3.15"

4.41"
112

4.69"
119.2
160 6.30"
164
6.46"

183
17.20"
0.24"
6

56.5 2.22"

285 11.22"
357 14.06"

6
0.24"

SPECIFICATIONS
Measurement unit
Controller
Magnification on a 15 monitor
Objective lens magnification
Model

Observation/
measuring range 1.

Horizontal (H): m Mil

Vertical (V): m Mil

Working distance: mm inch

Numerical Aperture (N.A.)
Optical zoom
Total magnification
Optical system for observation/measurement
Measuring range
Height
Display resolution
measurement
Repeatability
Display resolution
Width measurement
Repeatability 3
Pixel count
For monochrome image
Frame memory
For color image
For height measurement
Surface scan
Frame rate*8
Line scan
Auto function
Wavelength
Laser beam light
source for
Output
measurement
Laser Class
Laser light-receiving element
Light source for
Lamp
optical observation
Imaging element
Color camera for
Recording resolution
optical observation
Auto adjustment
Data processing unit
Power-supply voltage
Power supply
Current consumption
Weight

Measurement unit
Controller

200x
10
1350
53.15
1012
39.84
16.5
0.65"
0.3

VK-X210
VK-X200K
400x
1000x
20
50
675
270
26.57
10.63
506
202
19.92
7.95
3.1
0.35
0.12"
0.01"
0.46
0.95

VK-X110
VK-X105
VK-X100K
VK-X100K
3000x
200x
400x
1000x
2000x
100x
200x
400x
150
10
20
50
100
5x
10x
20x
90
1350
675
270
135
2700
1350
675
3.54
53.15
26.57
10.63
5.31
106.30
53.15
26.57
67
1012
506
202
101
2025
1012
506
2.64
39.84
19.92
7.95
3.98
79.72
39.84
19.92
0.2
16.5
3.1
0.54
0.3
22.5
16.5
3.1
0.008"
0.65"
0.12"
0.02"
0.01"
0.89"
0.65"
0.12"
0.95
0.3
0.46
0.8
0.95
0.13
0.3
0.46
1x to 8x
200x to 24000x
200x to 16000x
100x to 8000x
Pinhole confocal optical system
7 mm 0.28"
7 mm 0.28"
7 mm 0.28"
0.0005 m 0.00002 Mil
0.005 m 0.0002 Mil
0.005 m 0.0002 Mil
2.
2.
0.02 m 0.0008 Mil
0.02 m 0.0008 Mil 2.
0.012 m 0.0005 Mil
0.001 m 0.00004 Mil
0.01 m 0.0004 Mil
0.01 m 0.0004 Mil
0.03 m 0.001 Mil 4.
0.05 m 0.002 Mil 5.
0.02 m 0.0008 Mil 3.
2048 x 1536, 1024 x 768, 1024 x 64
16-bit
8-bit for RGB each
24-bit
21-bit
21-bit
4 Hz to 120 Hz
7900 Hz
AAG (Auto gain), Auto focus, Auto upper/lower limit setting, Double Scan brightness settings
Violet laser, 408 nm
Red semiconductor laser, 658 nm
0.95 mW
Class 2 Laser Product (IEC 60825-1, FDA (CDRH) Part1040.10 6.)
PMT (Photoelectron Multiplier Tube)

1000x
50x
270
10.63
202
7.95
0.54
0.02"
0.8

100 W halogen lamp

1/3" Color CCD image sensor
Super high resolution (30722304)
Gain, Shutter speed
Dedicated PC, supplied by KEYENCE with the VK-X (OS: Windows 7 Professional Edition) 7.
100 to 240 VAC, 50/60 Hz
450 VA max.
Approx. 26 kg
Approx. 25 kg
Approx. 25 kg
(Measuring head detached: approx. 10 kg) (Measuring head detached: approx. 8.5 kg) (Measuring head detached: approx. 8.5 kg)
Approx. 11 kg

1. The observation/measuring range is the minimum visual field range.

2. When a standard height difference of 2 m 0.08 Mil is measured with the 50x objective lens.
3. When the KEYENCE reference chart line width of 1 m 0.04 Mil is measured with the 150x objective lens in line peak mode (image averaging: 8 times).
4. When the KEYENCE reference chart line width of 1 m 0.04 Mil is measured with the 100x objective lens in line peak mode (image averaging: 8 times).
5. When the KEYENCE reference chart line width of 1 m 0.04 Mil is measured with the 50x objective lens (optical zoom 2x) in line peak mode (image averaging: 8 times).
6. The laser classification for FDA (CDRH) is implemented based on IEC60825-1 in accordance with the requirements of Laser Notice No.50.
7. Windows 7 is a registered trademark of Microsoft, U.S.A.
8. At top speed when using a combination of measurement mode/measurement quality/lens magnification. When line scan has a measurement pitch that is within 0.1 m.

SYSTEM CONFIGURATION
Measurement unit

VK-X105

Controller

VK-X110
VK-X100K

Control PC

Monitor (Optional)

VK-X210
Motorized XY stage for image stitching
VK-S105/S100K (50 mm 1.97")
VK-S110/S100K (100 mm 3.94")
Stage for 300 mm 11.81" wafer
OP-51498 (Optional)
VK Series stand
OP-82693 (Optional)
* Please contact KEYENCE for large-sized sample stage.

VK-X200K

Viewer software
VK-H1XVE
Analysis software
VK-H1XAE
Analysis expansion module
VK-H1XP (Optional)

Image stitching software

VK-H1XJE (Optional)
Particle analysis module
VK-H1XG (Optional)
ISO 25178 Surface texture
measurement module
VK-H1XR (Optional)

27

New principle that has realized overwhelming observation

Digital Microscope
NEW VHX-2000
Exceeding the resolution capabilities of an optical microscope
Realizes vivid 3D observation with large depth-of-eld
Simple operation using 3-axis (XYZ) motorized control
High-speed image stitching function
Advanced automatic measurement functions
Quick Depth Composition function & 3D composition

All-in-one High-speed Imaging Solution

High-speed Microscope
NEW VW-9000
Record at up to 230,000 frames per second
Fully-integrated system with built-in light source and LCD
Setup and record in minutes
Error Monitoring Function automatically detects changes in motion
Quantify and analyze moving objects
Provides on-site, magnied observation with microscope functionality

The information in this publication is based on KEYENCEs internal research/evaluation at the time of release and is subject to change without notice.
Copyright (c) 2011 KEYENCE CORPORATION. All rights reserved.
VKX-KA-C-E 1033-4 611542 Printed in Japan
*