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DATA SHEET
book, halfpage
M3D186
1997 Mar 27
Philips Semiconductors
Product specification
FEATURES
PINNING
PIN
DESCRIPTION
emitter
base
collector
handbook, halfpage1
2
3
2
1
MAM281
Fig.1
PARAMETER
collector-base voltage
CONDITIONS
80
BC557
50
30
65
collector-emitter voltage
open base
BC557
45
BC558
30
200
mA
500
mW
125
475
125
800
100
ICM
Ptot
Tamb 25 C
hFE
DC current gain
IC = 2 mA; VCE = 5 V
BC556
BC557; BC558
1997 Mar 27
UNIT
BC556
BC556
fT
MAX.
open emitter
BC558
VCEO
MIN.
transition frequency
MHz
Philips Semiconductors
Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCBO
PARAMETER
collector-base voltage
CONDITIONS
MAX.
UNIT
open emitter
BC556
80
BC557
50
30
BC556
65
BC557
45
30
BC558
VCEO
MIN.
collector-emitter voltage
open base
BC558
VEBO
emitter-base voltage
open collector
IC
100
mA
ICM
200
mA
IBM
200
mA
Ptot
500
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Tamb
65
+150
Tamb 25 C
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
note 1
Note
1. Transistor mounted on an FR4 printed-circuit board.
1997 Mar 27
VALUE
UNIT
250
K/W
Philips Semiconductors
Product specification
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
IE = 0; VCB = 30 V
15
nA
ICBO
IE = 0; VCB = 30 V; Tj = 150 C
IEBO
IC = 0; VEB = 5 V
100
nA
hFE
DC current gain
IC = 2 mA; VCE = 5 V;
see Figs 2, 3 and 4
125
475
BC557; BC558
125
800
125
250
220
475
BC557C; BC558C
420
800
BC556
VCEsat
60
300
mV
VBEsat
IC = 100 mA; IB = 5 mA
180
650
mV
750
mV
930
mV
600
650
750
mV
VBE
base-emitter voltage
820
mV
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
pF
Ce
emitter capacitance
10
pF
fT
transition frequency
MHz
noise figure
IC = 200 A; VCE = 5 V; RS = 2 k;
f = 1 kHz; B = 200 Hz
10
dB
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
1997 Mar 27
Philips Semiconductors
Product specification
MBH726
300
hFE
200
VCE = 5 V
100
0
101
102
10
IC (mA)
103
MBH727
400
hFE
VCE = 5 V
300
200
100
0
102
101
10
1997 Mar 27
102
IC (mA)
103
Philips Semiconductors
Product specification
MBH728
600
hFE
500
VCE = 5 V
400
300
200
100
0
102
101
10
BC557C; BC558C.
1997 Mar 27
102
IC (mA)
103
Philips Semiconductors
Product specification
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
E
d
L
b
1
e1
3
b1
L1
2.5
5 mm
scale
b1
e1
L1(1)
mm
5.2
5.0
0.48
0.40
0.66
0.56
0.45
0.40
4.8
4.4
1.7
1.4
4.2
3.6
2.54
1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
1997 Mar 27
REFERENCES
IEC
JEDEC
EIAJ
TO-92
SC-43
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Mar 27
Philips Semiconductors
Product specification
1997 Mar 27
Philips Semiconductors
Product specification
1997 Mar 27
10
Philips Semiconductors
Product specification
1997 Mar 27
11
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
117047/00/02/pp12