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Table of Contents
1 -Physical Design Flow.......................................................................................................................1
2 -DESIGN PLANNING......................................................................................................................2
3 -Floor-Planning..................................................................................................................................3
The goals of floor -Planning.............................................................................................................3
Power Planning.................................................................................................................................4
First Floor plan & PNS details:(Horizontal)....................................................................................4
Analysis............................................................................................................................................7
4 -Placement.......................................................................................................................................10
DFT Setup......................................................................................................................................11
5 -Clock Tree Synthesis......................................................................................................................18
6 -Routing...........................................................................................................................................25
7 -Design For Manufacturability (DFM)............................................................................................30
8 -Physical Verification......................................................................................................................32
Design Rule Check.........................................................................................................................33
Layout Vs Schematic......................................................................................................................34
9 -Sign off STA...................................................................................................................................35
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180nm
Library Vendor
Jazz Semiconductor
Operating Voltage
1.8 V
Clock Frequency
400Mhz
Power Budget
300mw
5%(90mw)
No. of Macros
32
43275
Functional Clocks
Sys_clk, Sys_rclk
Scan_clk
Die Area
5.9mm sq
5.04 um
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2 - DESIGN PLANNING
In the design planning context, floor-planning is the process of sizing and placing hierarchical cells
and functional block in a manner hat makes later physical design steps more effective. Floor
-planning in hierarchical flows provides a basis for estimating the timing of the top level. A timing
budget allocates the clock cycle time to each block according to the top-level timing estimation.
An effective floor-plan helps ensure timing closure in many ways,such as placing blocks to make
critical paths short,preventing routing congestion that would lead to longer paths, and eliminating
the need for over-the top routing for noise-sensitive blocks. The challenge is to create a floor-plan
with good area efficiency while leaving sufficient area for routing.
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3 - Floor-planning
The Goals of floor-planning :
1.Defining the core area (2450*2450).
2.Creating Ports (Ports. Tcl).
3.Design a floor-plan & Power network of horizontal metal layer such that the total IR Drop must be less
than 5%(VDD + VSS ) For a power Budget of 300 MW.
4.Defining the Placement and Routing Blockages.
Define core area and I/O core spacing,source the verilog file i.e.,Torpedo.v after reading all macros and
standard cells are placed outside the core area as shown in below figure.
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Placing the Macros inside the core area i.e.,the floor-planning. During the floor-planning we have
to follow the steps and techniques to come up with a good floor-plan
Kept the Macros which are communicating with same type of the Macros close together
with the help of fly lines,Colour by hierarchy and data flow diagram.
Reduce the narrow channels between the Macros and provided proper placement.
Placed the Macros with pins towards the core , Macros spacing of 0.28 (M4 Min Spacing).
POWER PLAN :
Power planning is very important stage in physical design during which we synthesize the
power network in order to provide power to all macros and standard cells with in given IR drop i.e.
5% of (VDD+VSS).Study state IR drop is caused by the resistance of the metal wires comprising
the power distribution network. By reducing the voltage difference between the local power and
ground,study state ur drop reduces both the speed and noise immunity of the local cells and
macros.
As vertical power straps are fixed (m6_power.tcl) only we have to modify the horizontal metals
i.e. metal_5 to achieve target ir drop of 90 mv and the power budget of 300mw.
Initial power plan summary w.r.t floor-plan fig 1
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Located hot spot and provided with more than one power straps by adjusting the offset and
step size of metal 5 layer is used.
So modified floor-plan is shown in below figure
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Step size
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Analysis :
During the power planning we got the floating shape and floating pin errors and are explained
below
Floating-shapes :
During power planning if metal 1 VDD overlaps with metal5 VSS then tool will not connect metal
1 to metal6 so that entire metal 1 becomes floating . Since it is not connected to any straps .If in
case we put a via that lead to short between VDD and VSS and are shown below
We took proper offset and step size as multiples of standard cell height so that metal 5 straps
beingg placed in between the metal 1 pre_routes . After that we did not got any floating shape
errors.
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Floating-pins:
During power planning some macros not got connection to power i.e , tool not connected its VDD
or VSS ring with metal 5 straps through via. Since macro is not connected to VDD or VSS so
those are called as floating pins shown below.
As shown in the figure since metal 4 of macro is overlapped with metal 3 i.e, VDD of macro if
in case tool put via that lead to short we just rearranged macros in order to get power connection.
BLOCKAGE CREATION :
During power planning in some region metal 1 rail is discontinued so during placement tool may
place standard cell over there since those cells will not get power connection in order to prevent
standard cell placement over there create placement blockage as shown below .
FLOOR PLAN SUMMARY
Floor-plan
No. of Errors from
verify_PG_nets
Run1
2 Floating shapes and pins
Run2
No errors
92.4
43275
43275
Placement utilization
67%
67%
3.5
3.3
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4 -PLACEMENT
Design Status before Placement
synthesis is compiled second pass netlist is generated. Data setup is completed. Floor -plan
cell is ready .All the errors related to floating shapes and floating pins should be fixed.
Zero Interconnect Timing Sanity Check
Before starting Placement make sure that Zero interconnect delay is made false .To make ZIC
Delay false set .Set_zero_interconnect_delay_mode false.
Placement setup and checks
IC Compiler Placement Flow
Inputs to Placement
TLU + (Min,max)
Floor -plan
Blockages
Routing Layers
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Outputs of Placement
Logs
Floor -Plan
Netlist
Design Constraints
DFT Setup
If your design flow includes DESIGN FOR TEST, the netlist will contain Scan_chains, group of
scan_registers that they are serially connected through SI/SO pins, and inserted during synthesis.
Scan_chain paths are active only during Test_mode , not during Functional_mode. Registers
are typically connected in alphanumeric order during synthesis -irrelevant for DFT, but not optimal
for routing.
Scan chain information is given to IC compiler using scandef file and for place_opt if we given
-optimize_dft the IC compiler will reorder the scan chain based on the functional optimization to
reduce the routing congestion.
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PLACEMENT CEL
To extend flexibility, SCANDEF also supports reordering with partitions across multiple buckets
a PARTITION is a group of SCANDEF chains that may exchange flip-flops during reordering.
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PLACEMENT SUMMARY
Placement
Run1
Run2
WNS(setup :hold)
-1.73:0.00
-1.75:00
TNS(setup :hold)
-19623:0.000
-19256:0.00
526286 sites
526272
47928
47906
Placement ?Utilization
76.78%
76.50%
Is placement congestion ok
OK
OK
NO
NO
Note: Run2 WNS and TNS are less compared to Run1 because after first pass placement we
used critical range to optimize sub_critical paths.
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CONGESTION
Congestion occurs when the number of wires going through a region exceeds the capacity of
that region. This condition is detected by global routing. A congestion map can help you visualize
the quality of placement with respect to the avoidance of routing congestion .The congestion map
shows the borders between global congestion cells highlighted with different colours that respect
different levels of overflow. The overflow values shown in congestion map are determined by
combing the overflow and underflow of all selected layers . For Example , in below figure the light
blue colour highlighted on the edge of the global routing cell shows 10/9.This means there are 9
wire tracks available, but 10 tracks are needed.
CONGESTION MAP
Timing Analysis :
During first run we got 22k violations with most violations in REGIN paths due to over
constraining of input to reg paths.
We have analysed some paths which are false paths and reported them to synthesis
Engineer.
We have observed some paths in which macro delays is more than clock period and
reported them to project manager.
During initial design setup we have segregated all timing path to REGIN,REGOUT and
CLOCK groups for better optimization of sub_critical paths.
We gave critical range just greater than WNS to optimize all sub-critical paths and gave
another run observed that TNS reduced.
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Clock Tree Synthesis is a process of distributing clock Signals to the clock sink pins of each
flop in the Design according to the information given by the Logic synthesis. Up to this step the
clock Signals are considered as ideal that is zero skew, latency, uncertainty and Transition times. In
this step the CTS will synthesize the clock tree by using clock inverters or clock buffers and will
balances the skew and it tries to minimise the skew targets, latency and transition times given by the
specifications.
The difference between HFN synthesis during placement and CTS is that the HFN
will balance the load this is not good at balancing skew. And hence clock networks are considered
ideal during placement stage in PD flow.
CTS FLOW
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CTS Specifications
Meet the buffering constraints
Maximum transition delay
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SYS_CLK
SCAN_CLK
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SYS_RCLK
UART_CLK
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6 - ROUTING
Routing creates the physical connection to all the clock and signal pins through the metal
interconnects. The routing should perform according to the priority as listed
Route clock nets ( Enable non default routing i.e. Double spacing )
Global routing
Track Assignment
Detailed routing
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Global Routing:
GR assigns nets to specific metal layers and global routing cells (G cells). GR tries to avoid
congested Gcells while minimizing route at congestion areas. Congestion exist if no of tracks
available is less than the required.
The global router divides a design into global routing cells. By default the width of a global
routing cell is same as the height of a standard cell and is aligned with the standard cell rows.
FIG: G CELL
The initial routing phase ( phase 0 ), in which the tool routes the unconnected nets and
calculate the overflow for each global routing cells with overflows
the routing phases, in which the tool tries to reduce congestion by ripping up and rerouteing
nets around global routing cells with overflows.
The size of GRC is equal to the height of the average standard cell.
Track assignment:
This process assigns each net to specific track and lays down the actual metal traces. It
attempts to make long, straight traces. And reduces no of vias. It does not follow DRC rules.
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Detailed routing:
Input channels and approximate routing from the global routing phase Determine the exact
route and layers for each net
Objective:
valid routing, minimize area (congestion), meet timing constraints minimum via, power.
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SIGNAL ROUTE
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Antenna violation:
The antenna will be violated when long running metal can collect the charge during CMP
( chemical mechanical polishing ) and can destroy the gate of MOS transistor (or) if the antenna
ratio is violated which is given by the fab. The antenna ratio is defined as
Antenna ratio= Am /Ag
where
Antenna fixing
Antenna can be fixed in two ways
1. Metal jog ( metal jumping )
2. Inserting reverse biased diode near gate of MOS
1.Metal jog:
The figures below shows antenna violation and fixing it by metal jog
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Via doubling:
Replacing one via with multiple vias can improve yield & timing ( series R reduction ). the
tool inserts multiple vias without re-routing. insert_redundant_vias is used to create multiple vias .
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Metal slotting:
Metal slotting can avoid the metal lift and metal erosion during the fabrication process. Slotting wide
wires reduces the metal density and it minimizes stresses build-up, reducing lift-off
tendency .
Primarily used on Power and Ground traces Can apply to any other net if wide enough Slotting
parameters can be set per layer
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8 - PHYSICAL VERIFICATION
Design Rule Check
Design rules are series of parameters provided by semiconductor manufactures that enables the
designer to verify the correctness of a mask set. Design rules are specific to a manufacturing
process. A design rule set specifies certain geometric and connectivity restrictions to ensure
sufficient margins to account variability during manufacturing process so that most of the design
parts work correctly.
In PD we can check only subset of rules there in DRC rule deck, these subset of rules are
related tp metal layers and vias. The rules are present in technology file. The rules include
minimum spacing, minimum area, minimum width etc. Some of the errors we have encountered in
our block are given below.
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Layout vs Schematic
A successful design rule check ensures the layout confirms to the rules required for
faultless fabrication. However it does not guarantee is it really represent the circuit you desire to
fabricate. This is where an LVS check is used.
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These differences can cause timing violations during final sign-off. Prime Time supports the use of
timing models to represent chip sub-modules. A timing model contains information about the timing
characteristics, but not the logical functionality of a sub-module.
Prime Time can generate a timing model from a sub-module netlist , and then use that model in
place of the original netlist for timing analysis at higher levels of hierarchy. This technique makes
whole chip analysis run much faster.
To perform stage delay calculation accurately and efficiently, Prime Time uses models to represent
the driver, RC Network and capacity load on the net. An ideal model would produce exactly the
same delays and slews as a SPICE simulation at the output of the driver and at the input of each
receiver.
To perform Static Timing Analysis, PrimeTime must accurately calculate the delay and slew
(transition time ) at each stage of each timing path. A stage consists of a driving cell, the annotated
RC network at the output of the cell and the capacitive load of the network load pins. The goal is to
compute the response at the driver output and at the network load pins, given the input slew or
waveform at the driver input using the least amount of runtime necessary to get accurate results.
To perform stage delay calculation accurately and efficiently, PrimeTime uses models to represent
the driver, RC network and Capacitive load on the net. An ideal model would produce exactly the
same delays and slews as a SPICE simulation at the output of the driver and at the input of each
receiver.
The driver model is intended to reproduce the response of the driving cell's underlying transistor
circuitry when connected to an arbitrary RC network given for a specific input slew. The reduced
order network model is a simplified representation of the full annotated network that has really the
same response characteristics as the original network. PrimeTime uses the Arnoldi reduction
method to create this model.
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