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CHAPTER 5
PHASE SHIFTED CARRIER BASED PULSE WIDTH
MODULATION
5.1
INTRODUCTION
In this chapter performance analysis of phase shifted carrier based
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5.2
SUBHARMONIC PWM
In SHPWM technique the reference voltage is continuously
compared with each of the shifted carrier signals. Figure 5.1 shows the
sinusoidal phase shifted pulse width modulation. Each cell is modulated
independently using sinusoidal unipolar pulse width modulation and bipolar
pulse width modulation respectively, which provides an even power
distribution among the cells. A carrier phase shift of 180/m for cascaded
inverter is introduced across the cells to generate the stepped multilevel
output waveform with lower distortion.
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( K 1)
n
(5.1)
N=
L 1
2
(5.2)
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Voi =
1
Voi (t)dt
Tcr
(5.3)
Voi =
Ton
.Vdc
Tcr
(5.4)
Voi = V
(5.5)
Where, Voi is the output voltage of cell i, and Ton is the time
interval, determined by the comparison between the reference and the carrier
signals.
The phase shifted carrier SHPWM generator is shown in Figure 5.2.
The three phase sinusoidal modulating signals are generated by using phase
shift oscillator. This signal is compared with (n-1) phase shifted carrier waves
and PWM pulses are generated. These PWM pulses are applied to three phase
five level inverter.
The PSC SHPWM signal generation is shown in Figure 5.3.
It is noted that when the sinusoidal reference signal is greater
than all carrier waves, +Vdc is obtained.
When the sinusoidal reference signal is greater than carrier
wave except upper most carrier wave, +Vdc/2 is obtained.
When the sinusoidal reference signal is greater than lower most
carrier and less than all carrier, Vdc/2 is obtained.
When the sinusoidal reference signal is lesser than all carrier
waves, Vdc is obtained.
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108
Results
The simulation and hardware parameters for PSC SHPWM are as
follows:
Three-phase load R = 100 Ohms & L = 20 mH
Voltage level of each source Vdc = 100V
Fundamental frequency = 50Hz
Switching frequency = 5 kHz
The simulation and hardware output voltage for PSC SHPWM is
shown in Figures 5.4 and 5.5.
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5.3
minimum of the three reference voltages (Va, Vb, Vc) and subtracts the value
from each of the individual reference voltages to obtain the modulation
waveforms, which is shown in Figure 5.8.
max(Va , Vb , Vc ) + min(Va , Vb , Vc )
Voff =
(5.6)
Va SFO = Va Vcarrier
(5.7)
Vb SFO = Vb Vcarrier
(5.8)
Vc SFO = Vc Vcarrier
(5.9)
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Results
The simulation and hardware output voltage for PSC SFOPWM is
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SFO methods are analyzed and THD as well as output voltage values are
compared as shown in Table 5.1, Figures 5.15 and 5.16.
The THD value and output voltage values are small in SH PWM
technique whereas the values are high in SFO PWM technique. It is observed
finally that with minimised THD, SH PWM method gives better results and
the SFO PWM technique is the most suitable in achieving the increased
output voltage.
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Table 5.1
Output voltage and THD for CSF, VSF and PSC PWM
techniques
Figure 5.15 % of THD value for CSF, VSF and PSC PWM techniques
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Figure 5.16 Output voltage for CSF, VSF and PSC PWM techniques
It is observed that the SH-PWM and SFO-PWM in PSC PWM
gives better result compared to the other methods. Here, the SH-PWM
strategy reduces the THD and SFO-PWM strategy enhances the output
voltage. The output voltage Vac is maintained between 180V to 200V. In CSF
SH-PWM, the THD value is 6.70% whereas in VSF PWM, it is 10.10% and
in PSC-PWM, it is about 3.84%. In CSF SFO-PWM the output voltage is
200V, THD value is 21.40% whereas it is about 22.45% in VSF PWM and in
PSC-PWM, output voltage is 220.2V and THD value is 20.65%.
5.5
HARDWARE DESCRIPTION
The Figure 5.17 shows the hardware setup for three phase cascaded
multilevel inverter. The hardware setup consists of six single phase inverter
sets using FSBB20CH60 Smart Power Module (SPM), six 100V DC power
supplies and Digital storage oscilloscope. The inverter topology is based on
the series connection of single phase inverters with separate DC sources. The
details of FSBB20CH60 SPM Data sheet is given in Appendix 1.
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Design entry
2)
Design synthesis
3)
Design implementation
4)
Design verification
5)
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The source code is written in the VHDL. After writing the code
syntax check has been performed on the code to verify whether code was
properly written using correct syntax [73-76].
The next step is HDL RTL simulation called behavioral simulation.
This step verifies whether the design entered is functionally correct or not.
For this simulation the VHDL test bench is written for PWM generator
architecture and simulation can be seen in Xilinx ISE simulator. If that is
functionally correct we have to move next step i.e., Synthesis.
The VHDL code of PWM generator is then synthesized using
Xilinx XST which is a part of Xilinx ISE software. The synthesis process has
been used for optimizing the design architecture selected. The resulting netlist
is saved to an NGC file. Then the synthesis report is generated which gives
information about how many logic blocks are used.
After the synthesis, the implementation is carried out. The
implementation part consists of three phases.
Translate: Merge multiple design files into a single net list.
Map: Group logical symbols from the net list (gates) into
physical components (Slices and IOBs).
Place and route: Place components onto the chip, connect the
components, and extract timing data into reports.
Before translating the design, User Constrained File (UCF) is
written to assign the pin configuration of the FPGA to the PWM generator
I/Os. Once this is over, the translate merges together this UCF file and netlist
generated. Mapping is done to fit the design into the available resources of
target device i.e. FPGA. The last step of implementation is placing and
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routing which places the logic blocks of the design into FPGA and route them
together. This operation produces NCD output file.
XILINX/SPARTAN-3
FPGA processor
is
shown
in
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Xilinx device programming uses IMPACT to create a BIT file for debugging
and downloads it into the target device. Once the program is dumped to
FPGA kit, it acts as a PWM based FPGA controller and generates gate drive
switching pulses. These pulses are connected to optoisolator circuit for
preventing the ground sharing between the FPGA-processor and H-bridge
power module. The output of optoisolator is connected through driver to each
switching devices for controlling the PWM three phase cascaded multilevel
inverter.
Figure 5.20 shows the Spartan-3 processor, which includes the
following components and features:
1.
2.
2Mbit
Xilinx
XCF02S
Platform
Flash,
in-system
3.
4.
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5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
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15.
16.
17.
18.
19.
20.
21.
22.
JTAG port.
23.
24.
25.
AC
power
adapter
input
27.
28.
29.
for
included
international
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SN74LVCC32345
is
designed
for
asynchronous
communication between data buses. The device transmits data from the A bus
to the B or from the B bus to the A bus, depending on the logic level at the
direction control input. The output-enable (OE) input can be used to disable
the device. The buses are effectively isolated. The 6 number translators are
used in FPGA board to convert 3.3V to 5V.
The output LEDs are used to verify the conditions or to debug the
code. The I/O lines from FPGA-1 are used to interface external peripherals.
To interface external peripheral devices, 26 I/O lines from FPGA-1 is
terminated in 26 pin header.
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lock-out and
short circuit protection. The high speed built-in HVIC provides optocouplerless single-supply IGBT gate driving capability that further reduce the overall
size of the inverter system design. Each phase current of inverter can be
monitored separately due to the divided negative dc terminals.
5.6
SUMMARY
The two proposed techniques namely SH and SFO are simulated