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Technical Data
HSDL-1100
Features
Fully Compliant to IrDA 1.1
4 Mbps
Compatible with ASK, HPSIR, and TV Remote
Backward Compatible to
Slower Speeds
Excellent Nose to Nose
Operation
Excellent Noise Immunity
No Programming to Switch
Speeds
Available in Several
Mounting Options
Designed to Compensate for
Light Loss Due to Cosmetic
Windows
Fully Supported by All
Interface Chips
Application Circuit
Description
The HSDL-1100 infrared
transceiver provides the interface
between logic and IR signals for
through-air, serial, half-duplex IR
data links and is designed to
satisfy the IrDA Physical Layer
Specification.
The HSDL-1100 contains a high
speed, high efficiency, TS AlGaAs
870 nm LED, a silicon PIN
photodiode, and a bipolar, silicon
integrated circuit. The IC contains
an LED driver and a receiver
providing two output signals,
RXD-A for signal rates from 2.4 to
CX7
R2
10
HSDL-1100
CX2
LEDA
IE
TX
TXD
R1
EI
PIN
BIAS
RXD-A
8
R3
VCC
VCC
VREF
GND
ADAPTIVE
THRESHOLD
& SQUELCH
CX5
CX6
RXD-B
CX1
1
CX1
GND
6
CX4
3
CX3
9
CX4
CX3
Ordering Information
Specify Part Number followed by Option Number
HSDL-1100
#0x7
017 front mount orientation, 10 piece increment
007 front mount orientation, 200 piece increment
HSDL-1100
#0x8
018 top mount orientation, 10 piece increment
008 top mount orientation, 200 piece increment
HSDL-1100
#S07
front mount orientation, integrated shield, 200 piece increment
Package Dimensions
Option #0x7
13.21 0.10
(0.520 0.004)
6.35
(0.250)
3.43
(0.135)
0.43 (0.02) MAX.
0.47 0.10
(0.019 0.004)
8.75 0.20
(0.345 0.008)
6.86 0.10
(0.270 0.004)
-B-
R 2.87
(0.113)
3.50 0.20
(0.138 0.008)
(7x) 1.27 0.10 BSC
(0.050 0.004)
-C-
2.61 0.20
(0.103 0.008)
1.00 0.10
(2x)
(0.039 0.004)
6.22 0.10
(0.245 0.004)
R 2.77
(0.109)
(8x) 0.51
(0.020)
4.41 0.20
(0.173 0.008)
-A-
2.71 0.20
(0.106 0.008)
1.71 0.20
(0.067 0.008)
5.94 0.10
(0.234 0.004)
15.89 0.25
(0.626 0.010)
4.10 0.20
(0.161 0.008)
COPLANARITY OF LEADS
TO BE O.1 mm (0.076 mm TOOL)
Option #0x8
13.21 0.10
(0.520 0.004)
6.35
(0.250)
3.43
(0.135)
0.43 (0.02) MAX.
(4x) 0.67
(0.026)
0.47 0.10
(0.019 0.004)
THE B DATUM IS FORMED
BY THE TWO HIGHEST POINTS
OF THE COMBINED SURFACE
FORMED BY THIS SURFACE
AND THE CORRESPONDING
SURFACE OF THE SAME LEAD
ON THE OPPOSITE SIDE OF
THE PACKAGE.
6.86 0.10
(0.270 0.004)
-B-
1.46
(0.057)
1.46
(0.057)
3.86 0.15
(0.152 0.006)
R 2.87 R 2.77
(0.113) (0.109)
(2x)
1.18 0.10
BSC
(0.047 0.004)
(8x) 0.51
(0.020)
-C-
8.85 0.25
(0.348 0.010)
(12x) 1.15 0.15
(0.045 0.006)
6.22 0.10
(0.245 0.004)
-A-
5.94 0.10
(0.234 0.004)
LEAD COPLANARITY
0.1 mm
16.61 0.25
(0.654 0.010)
(12x) 1.70 0.10
(0.067 0.004)
Option #S07
13.21 0.10
3.43
6.35
0.47 0.10
6.86 0.10
-B-
2.
87
2.
77
11.90 0.15
(12x) 4.42 0.15
6.84 0.15
1.00
THE B DATUM IS FORMED
BY THE HIGHEST POINT ON
THE SURFACE AND THE
HIGHEST POINT ON THE
CORRESPONDING SURFACE
OF THE LEAD ON THE OTHER
SIDE OF THE PACKAGE.
5.0 3.5
3.50 0.20
(8x) 0.51
-C-
0.63 0.12
2.71 0.20
2.61 0.20
(2x) 1.00 0.10
15.89 0.25
4.41 0.20
4.10 0.20
6.22 0.10
5.94 0.10
-A-
1.71 0.20
COPLANARITY OF LEADS
TO BE 0.1 mm (0.076 mm TOOL)
DIMENSIONS IN MILLIMETERS.
0.9 0.2
4.66 0.10
24.00 0.10
(0.945 0.004)
4.00 0.10
(0.157 0.004)
2.00 0.10
(0.079 0.004)
1.50 0.10
(0.059 0.004)
1.75 0.10
(0.069 0.004)
14.20 0.10
(0.559 0.004)
32.00 0.30
(1.260 0.012)
2.18
(0.086)
1.19 R
(0.046)
2.41
(0.095)
2.21
(0.087)
0.419 0.013
(0.0165 0.0005)
2.66
(0.105)
7.46
(0.294)
15 MAX.
1.25
(0.049)
2.75
(0.108)
3.86
(0.152)
13.39
(0.527)
9.27
11.66 0.10 (0.365)
(0.459 0.004)
5 MAX.
1.5 MAX.
16.99 0.10
(0.669 0.004)
15.38 0.10
(0.606 0.004)
AO
DIMENSIONS ARE IN MILLIMETERS (INCHES).
KO
BO
1.55 0.10
(0.061 0.002)
16.00 0.10
(0.630 0.004)
4.00 0.10
(0.157 0.004)
2.00 0.10
(0.079 0.004)
1.75 0.10
(0.069 0.004)
14.20 0.10
(0.559 0.004)
32.00 0.30
(1.26 0.012)
1.14 R
(0.045)
2.00 + 0.25
(0.079 + 0.010)
2.74
(0.108)
6.53
(0.257)
1.70
(0.067)
0.368 0.013
(0.0145 0.0005)
5.03
(0.198)
3.58
(0.141)
7 MAX.
9.02 0.10
(0.355 0.004)
4 MAX.
7.04 0.10
(0.277 0.004)
17.15 0.10
(0.675 0.004)
1.75 0.10
2.00 0.10
4.00 0.10
1.50 0.10
14.20 0.10
32.00 0.30
0.76 x 45
1.19 R
2.18
13.50
-0.419 0.013
2.41
2.75
3.18
2.67
1.25
4.80
8.23
9.80
15 MAX.
5 MAX.
12.34 0.10
1.5 MAX.
16.97 0.10
15.56 0.10
AO
KO
BO
Recommended Value
Notes
R1
R2
R3
CX1
CX2
CX3
CX4
CX5
CX6
CX7
Notes:
1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit on
page 1.
2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-1100 to obtain optimum noise immunity.
3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on VCC.
Truth Table
Inputs
TXD
VIH
VIL
VIH
VIL
EI
X
EIH[4]
EIH[5]
EIL
Outputs
RXD-A
NV
Low[6]
NV
High
IE (LED)
High
Low
Low
Low
RXD-B
NV
NV
Low[6]
High
X = Dont care
NV = Not Valid
Notes:
4. In-Band EI 115.2 Kb/s.
5. In-Band EI 576 Kb/s.
6. Logic Low is a pulsed response. The condition is maintained for a duration dependent
on pattern and strength of the incident intensity.
Pinout
Pin
Description
Symbol
PIN 1
1
2
3
4
5
6
RXD-B
GND
7
8
9
TX
RXD-A
CX3
LED Anode
LEDA
10
PIN 10
CX1
GND
CX4
VCC
HP 1100
YYWW
PIN 10
-20
85
Operating Temperature
Average LED Current
TA
ILED (DC1)
70
100
C
mA
ILED (DC2)
165
mA
ILED (RP)
660
mA
ILED (PK)
1.0
VLEDA
VCC
-0.5
0
7.0
7.0
V
V
ITXD (DC)
VRXD-A
VRXD-B
-12
-0.5
-0.5
12
VCC + 0.5
VCC + 0.5
mA
V
V
Storage Temperature
PIN 1
Conditions
90 s Pulse Width,
25% Duty Cycle
90 s Pulse Width,
25% Duty Cycle
2 s Pulse Width,
10% Duty Cycle
TEMPERATURE C (T)
250
200
185 C
3.5 .5 MINS.
(SOLDER JOINT)
150
T > 120 C FOR t
GREATER THAN 2.5 MINS.
(SOLDER JOINT)
100
50
10
12
14
TIME (t)
Symbol
Min.
Max.
Units
Operating Temperature
TA
70
Supply Voltage
Logic High Transmitter
Input Voltage (TXD)
VCC
VIH
4.75
4.25
5.25
5.25
V
V
VIL
0.0
0.3
EIIH
0.0036
0.0090
500
500
0.3
EIIL
ILEDA
400
2.4
0.576
Conditions
Case to Ambient Thermal
Resistance 50C/W
660
mA
1.0
ms
116
4
Kb/s
Mb/s
Notes
9
7
7
9
Notes:
7. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 nm p 900 nm, and the pulse
characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
8. With RI, CX2 Input network and where tr (VI ) and tf (VI ) 5 ns. See Application Circuit (Table 1) for component values. The driver
gate for this input should be able to source and sink 6 mA (DC) and 50 mA (pk). TXD refers to the node on the driver gate side of
R1, CX2 on application circuit.
9. See the thermal derating curves on pages 8 and 9 for maximum operating conditions in order to maintain T junction <125C.
All HSDL-1100 IR transceivers are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the
current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe.
See Hewlett-Packard Application Note 1094 for more information.
Symbol
Min.
Typ. Max.
Unit
Conditions
Notes
Logic Low
VOL
(RXD-A)
0.5
11
Logic Low
VOL
(RXD-B)
0.5
11
Logic High
VOH
(RXD-A)
VCC-0.6
Logic High
VOH
(RXD-B)
VCC-1.2
21/2
30
degrees
Voltage
Viewing Angle
Effective Detector Area
Transmitter
Radiant
Intensity
Logic High
cm2
0.2
EI
100
177
10
EI
80
177
10
875
nm
Spectral Line
Half Width
1/2
35
nm
Viewing Angle
21/2
30
60
degrees
Peak
Wavelength
Transmitter
Logic Low
I IL(TXD)
-2.0
2.0
10
Data Input
Current
Logic High
IIH(TXD)
5.4
6.6
mA
10
LED Anode
Supply
Current
Receiver Peak
Sensitivity
Wavelength
On State
Voltage
VON (LEDA)
2.78
10
Off State
Leakage
I LK (LEDA)
250
10
Idle
ICC1
5.1
mA
VCC = 5.25 V,
VI (TXD) = VIL, EI = 0
Active
Receiver
ICC2
18
mA
VCC = 5.25 V,
VI (TXD) = VIL,
EI 500 mW/cm 2
880
nm
Notes:
10. With R1, CX2 input network. See Application Circuit (Table 1) for component values. TXD refers to driver gate of R1, CX2 on
application circuit.
11. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident
intensity.
10
Switching Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions
represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in
their operating range. All typicals are at 25C and 5 V unless otherwise noted.
Parameter
Transmitter Radiant
Intensity Pulse Width
Symbol
tpw (IE)
Transmitter Radiant
Intensity Rise and Fall Times
RXD-A Pulse Width
RXD-B Pulse Width
tr(IE),
tf(IE)
tpw
(RXD-A)
tpw
(RXD-B)
Min.
1.5
Typ.
1.6
Max.
1.8
Unit
s
115
125
135
ns
40
ns
1.0
7.5
Conditions
tpw (TXD) = 1.6 s at
115.2 K pulses/second
tpw (TXD) = 125 ns at
2.0 M pulses/second
tpw (TXD) = 125 ns at
2.0 M pulses/second
1/2 15
75
185
ns
1/2 15
14
1.0
1.3
15
0.50
1.0
ms
0.7
tL
(RXD-B)
tL
(RXD-A)
Notes
12
12
13
13, 14
Notes:
12. Pulse widths measured at 1.4 volts.
13. For In-Band signals 115.2 Kb/s where 3.6 W/cm2 EIL 500 mW/cm2 .
14. For In-Band signals, 125 ns PW, 4 Mb/s, 4 PPM where 9.0 W/cm2 EI 500 mW/cm2.
15. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse
may exceed 2 s in width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the
HSDL-1100 has been shown to correctly receive all data bits for 9 W/cm2 <EI <500 mW/cm 2 incoming signal strength. ASK or
DASK should use the RXD-B channel only.
100
REFERENCE
80
THERMAL RESISTANCE
BOARD TO AMBIENT
60
50 C/W
100 C/W
40
GUARANTEED
200 C/W
20
250 C/W
300 C/W
0
REFERENCE
-20
150 C/W
0.2
0.4
0.6
0.8
HSDL-1100#0x7 Leadform
Max. Ambient vs. LED Drive Current
These 2 graphs show maximum allowable LED drive current as a function of ambient temperature and the
designer's PCB-to-ambient thermal resistance.
100
REFERENCE
80
THERMAL RESISTANCE
BOARD TO AMBIENT
60
50 C/W
100 C/W
40
GUARANTEED
150 C/W
200 C/W
20
250 C/W
300 C/W
0
REFERENCE
-20
0.2
0.4
0.6
0.8
HSDL-1100#0x8 Leadform
Max. Ambient vs. LED Drive Current
*Note: Performance is guaranteed in the operating temperature range of 0C - 70C. The information provided outside of this range is for
reference only.
11
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
20
40
60
80
100
120
www.hp.com/go/ir
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright 1998 Hewlett-Packard Co.
Obsoletes 5967-6063E
5968-1408E (7/98)