Documente Academic
Documente Profesional
Documente Cultură
Folder
Sample &
Buy
Technical
Documents
Support &
Community
Tools &
Software
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
3 Description
2 Applications
PACKAGE
LM117HV
LM317HV
TO-39 (3)
8.255 mm 8.255 mm
TO-3 (2)
19.507 mm 19.507 mm
LM317HV
TO-220 (3)
14.986 mm 10.16 mm
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
4
7.1
7.2
7.3
7.4
7.5
7.6
4
5
5
5
6
7
22
22
22
22
22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2013) to Revision D
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Page
LM117HV, LM317HV
www.ti.com
TEMPERATURE
DESCRIPTION
PRODUCT FOLDER
LM317-N
0 C to 125 C
Click here
LM317A
40 C to 125 C
Click here
LM317HV
0 C to 125 C
Click here
LM317L-N
40 C to 125 C
Click here
LM117
55 C to 150 C
Click here
LM117HV
55 C to 150 C
Click here
LM117HVQML
55 C to 125 C
Click here
LM117HVQML-SP
55 C to 125 C
Click here
LM117JAN
55 C to 125 C
Click here
LM117QML
55 C to 125 C
Click here
LM117QML-SP
55 C to 125 C
Click here
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
NDE Package
3-Pin TO-220
Front View
Pin Functions
PIN
NAME
TO-39 NO.
TO-3 NO.
TO-220
NO.
I/O
ADJ
Adjust Pin
VOUT
3, CASE
CASE
2, TAB
VIN
DESCRIPTION
7 Specifications
7.1 Absolute Maximum Ratings
See
(1)
.
MIN
Power dissipation
Inputoutput voltage differential
65
UNIT
Internally limited
0.3
(1)
MAX
60
300
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
LM117HV, LM317HV
www.ti.com
Electrostatic discharge
VALUE
UNIT
2000
Manufacturing with less than 500-V HBM is possible with the necessary precautions.
MIN
MAX
UNIT
LM117HV
55
150
LM317HV
125
LM317HV
NDT
(TO-39)
NDS
(TO-3)
NDE
(TO-220)
3 PINS
2 PINS
3 PINS
140 (2)
35 (2)
23.0
C/W
UNIT
RJA
RJC(top)
12
2.3
15.9
C/W
RJB
4.6
C/W
JT
2.5
C/W
JB
4.6
C/W
RJC(bot)
0.9
C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
No Heat Sink
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
TEST CONDITIONS
LM117HV
LM317HV
TYP
MAX
MAX
TJ = 25C
0.01
0.02
0.01
0.04
%/V
0.02
0.05
0.02
0.07
%/V
TJ = 25C
0.1%
0.3%
0.1%
0.5%
0.3%
1%
0.3%
1.5%
0.03
0.07
0.04
0.07
%/W
50
100
50
100
0.2
0.2
1.25
1.3
1.25
1.3
3.5
12
mA
3 V VIN VOUT
60 V
IL = 10 mA (2)
Load Regulation
10 mA IOUT
IMAX
Thermal Regulation
TJ = 25C, 20 ms Pulse
MIN
10 mA IL IMAX
3 V (VIN VOUT) 60 V
Reference Voltage
3 V (VIN VOUT) 60 V
10 mA IOUT IMAX, P PMAX
Temperature Stability
TMIN TJ TMAX
1%
(VIN VOUT) = 60 V
3.5
1.5
2.2
3.5
1.5
2.2
3.7
0.5
0.8
1.8
0.5
0.8
1.9
(VIN VOUT)
15 V
Current Limit
(VIN VOUT)
60 V
RMS Output Noise, % of
VOUT
Ripple Rejection Ratio
Long-Term Stability
(1)
(2)
TO-3, TO-220
Packages
TO-39 Package
1.2
TO-3, TO-220
Packages
TO-39 Package
TJ = 25C, 10 Hz f 10 kHz
VOUT = 10V, f = 120 Hz
CADJ = 10 F
TJ = 125C
UNIT
TYP
Line Regulation
MIN
66
1.2
1%
0.3
0.3
0.03
0.03
0.003%
0.003%
65
65
80
66
0.3%
1%
dB
80
0.3%
dB
1%
Unless otherwise specified, these specifications apply: 55C TJ +150C for the LM117HV, and 0C TJ +125C for the
LM317HV; VIN VOUT = 5 V and IOUT = 0.1 A for the TO-39 package and IOUT = 0.5 A for the TO-3 and TO-220 packages. Although
power dissipation is internally limited, these specifications are applicable for power dissipations of 2 W for the TO-39 and 20 W for the
TO-3 and TO-220. IMAX is 1.5 A for the TO-3 and TO-220 and 0.5 A for the TO-39 package.
Regulation is measured at constant junction temperature. Changes in output voltage due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
LM117HV, LM317HV
www.ti.com
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
LM117HV, LM317HV
www.ti.com
8 Detailed Description
8.1 Overview
In operation, the LM317HV develops a nominal 1.25-V reference voltage, VREF, between the output and
adjustment terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is
constant, a constant current I1 then flows through the output set resistor R2, giving an output voltage calculated
by Equation 1:
R2
VOUT = VREF 1 +
+ I ADJ (R2 )
R1
(1)
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
10
LM117HV, LM317HV
www.ti.com
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
D1 protects against C1
D2 protects against C2
Figure 15. Regulator With Protection Diodes
11
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
R2
VOUT = 1.25 V 1 +
+ I ADJ (R2 )
R1
LM117HV, LM317HV
www.ti.com
13
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
Solid tantalum
*Discharges C1 if output is shorted to ground
14
LM117HV, LM317HV
www.ti.com
Solid tantalum
*Minimum load current = 30 mA
Optionalimproves ripple rejection
15
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
LM117HV, LM317HV
www.ti.com
Solid tantalum
*CoreArnold A-254168-2 60 turns
NOTE: *All
Minimum load10 mA
outputs
within
100
mV
17
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
R2
RS sets output impedance of charger ZOUT = RS 1 +
R1
18
LM117HV, LM317HV
www.ti.com
19
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
20
LM117HV, LM317HV
www.ti.com
11 Layout
11.1 Layout Guidelines
Some layout guidelines should be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current should be wide to reduce the amount of parasitic trace inductance and the
feedback loop from V2 to ADJ should be kept as short as possible. To improve PSRR, a bypass capacitor can be
placed at the ADJ pin and should be located as close as possible to the IC. In cases when VIN shorts to ground,
an external diode should be placed from VOUT to VIN to divert the surge current from the output capacitor and
protect the IC. Similarly, in cases when a large bypass capacitor is placed at the ADJ pin and VOUT shorts to
ground, an external diode should be placed from ADJ to VOUT to provide a path for the bypass capacitor to
discharge. These diodes should be placed close to the corresponding IC pins to increase their effectiveness.
21
LM117HV, LM317HV
SNVS773D APRIL 2000 REVISED SEPTEMBER 2015
www.ti.com
PRODUCT FOLDER
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LM117HV
Click here
Click here
Click here
Click here
Click here
LM317HV
Click here
Click here
Click here
Click here
Click here
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
22
www.ti.com
19-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
LM117HVH
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
( LM117HVHP+ ~
LM117HVHP+)
LM117HVH/NOPB
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
( LM117HVHP+ ~
LM117HVHP+)
LM317HVH
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM317HVHP+ ~
LM317HVHP+)
LM317HVH/NOPB
ACTIVE
TO
NDT
500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
( LM317HVHP+ ~
LM317HVHP+)
LM317HVK STEEL
ACTIVE
TO-3
NDS
50
TBD
Call TI
Call TI
0 to 125
LM317HVK
STEELP+
LM317HVK STEEL/NOPB
ACTIVE
TO-3
NDS
50
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
0 to 125
LM317HVK
STEELP+
LM317HVT/NOPB
ACTIVE
TO-220
NDE
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 125
LM317
HVT P+
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
www.ti.com
19-Jul-2016
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDS0002A
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2016, Texas Instruments Incorporated