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Systems
High Output-Current Capability
Sink or Source . . . 20 mA Typ
Micropower Operation . . . 170 A Typ
Output Regulation
45 V Typ at IO = 0 to 10 mA
+15 V Typ at IO = 0 to + 10 mA
Input Regulation = 1.5 V/V Typ
Low-Impedance Output . . . 0.0075 Typ
Macromodel Included
D
D
description
OUTPUT REGULATION
100
VI = 5 V
VV)
O Output Voltage Change V
80
60
TA = 40C
40
TA = 0C
TA = 55C
20
0
TA = 125C
TA = 25C
TA = 25C
20
40
TA = 125C
60
TA = 55C
80
100
10
4 2
0
2
4
6
IO Output Current mA
10
The TLE2425 improves input regulation as well as output regulation and, in addition, reduces output impedance
and power dissipation in a majority of virtual-ground-generation circuits. Both input regulation and load
regulation exceed 12 bits of accuracy on a single 5-V system. Signal-conditioning front ends of data acquisition
systems that push 12 bits and beyond can use the TLE2425 to eliminate a major source of system error.
AVAILABLE OPTIONS
TA
SMALL OUTLINE
(D)
PLASTIC
TO-226AA
(LP)
0C to 70C
TLE2425CD
TLE2425CD
40C to 85C
TLE2425ID
TLE2425ID
55C to 125C
TLE2425MD
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!"# $%
$ ! ! & '
$$ ()% $ !* $ #) #$
* ## !%
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D, OR JG PACKAGE
(TOP VIEW)
OUT
COMMON
IN
NC
LP PACKAGE
(TOP VIEW)
NC
NC
NC
NC
IN
COMMON
OUT
NC No internal connection
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 mA
Duration of short-circuit current at (or below) 25C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: C-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C
I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to 85C
M-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C to 125C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D package . . . . . . . . . . . . . . . . . . . . . 260C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG or LP package . . . . . . . . . . . . . . 300C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
PACKAGE
TA 25
25C
C
POWER RATING
DERATING FACTOR
ABOVE TA = 25C
TA = 70
70C
C
POWER RATING
TA = 85
85C
C
POWER RATING
TA = 125
125C
C
POWER RATING
725 mV
5.8 mW/C
464 mW
377 mW
145 mW
JG
1050 mV
8.4 mW/C
672 mW
546 mW
210 mW
LP
775 mV
6.2 mW/C
496 mW
403 mW
155 mW
I-SUFFIX
M-SUFFIX
MIN
MAX
MIN
MAX
MIN
Input voltage, VI
40
40
40
70
40
85
55
125
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MAX
UNIT
MIN
TYP
MAX
25C
2.48
2.5
2.52
Full range
2.47
IO = 0
TLE2425C
TA
TEST CONDITIONS
25C
20
25C
170
Full range
VI = 4.5 V to 5.5 V
Full range
VI = 4 V to 40 V
Full range
1.5
VI(PP) = 1 V
f = 120 Hz,
1.5
25
25C
80
Full range
250
IO = 0 to 20 mA
25C
450
150
450
25C
160
15
160
Full range
250
25C
235
Noncumulative
25C
f = 10 Hz to 10 kHz
25C
25C
VO to 0.1%,
IO = 10 mA
CL = 0
VO to 0.01%,
IO = 10 mA
CL = 0
VI = 4.5 to 5.5 V,
VI = 4.5 to 5.5 V,
VO to 0.1%
VO to 0.01%
25C
VI = 0 to 5 V,
VI = 0 to 5 V,
VO to 0.1%
VO to 0.01%
25C
CL = 100 pF
250
250
65
7.5
30
55
30
50
100
V
V
V/V
V/V
160
V
235
15
25C
VO = 5 V
VO = 0
45
A
A
dB
IO = 0 to 10 mA
Output impedance
Short-circuit output current (sink current)
20
160
IO = 0 to 20 mA
t = 1000 h,
20
25C
IO = 0 to 10 mA
250
25
25C
V
ppm/C
250
25C
Ripple rejection
2.53
UNIT
ppm
22.5
m
mA
V
110
115
25C
CL = 100 pF
180
ss
180
12
30
125
210
ss
ss
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TEST CONDITIONS
Output voltage
Temperature coefficient of output voltage
Bias current
IO = 0
TLE2425I
TA
MIN
TYP
MAX
25C
2.48
2.5
2.52
Full range
2.47
25C
20
25C
170
Full range
VI = 4.5 V to 5.5 V
Full range
VI = 4 V to 40 V
Full range
VI(PP) = 1 V
f = 120 Hz,
1.5
75
25C
80
Full range
250
IO = 0 to 20 mA
25C
450
150
450
25C
160
15
160
Full range
250
25C
235
Noncumulative
25C
f = 10 Hz to 10 kHz
25C
25C
VO to 0.1%,
IO = 10 mA
CL = 0
VO to 0.01%,
IO = 10 mA
CL = 0
VI = 4.5 to 5.5 V,
VI = 4.5 to 5.5 V,
VO to 0.1%
VO to 0.01%
25C
VI = 0 to 5 V,
VI = 0 to 5 V,
VO to 0.1%
VO to 0.01%
25C
CL = 100 pF
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250
7.5
30
55
30
50
100
V/V
V/V
235
ppm
22.5
m
mA
V
110
115
25C
CL = 100 pF
250
65
V
V
160
15
25C
VO = 5 V
VO = 0
45
A
A
dB
IO = 0 to 10 mA
Output impedance
Short-circuit output current (sink current)
20
160
IO = 0 to 20 mA
t = 1000 h,
20
25C
IO = 0 to 8 mA
250
75
25C
1.5
V
ppm/C
250
25C
Ripple rejection
2.53
UNIT
180
ss
180
12
30
125
210
ss
ss
MIN
TYP
MAX
25C
2.48
2.5
2.52
Full range
2.47
IO = 0
TLE2425M
TA
TEST CONDITIONS
25C
20
25C
170
Full range
VI = 4.5 V to 5.5 V
Full range
VI = 4.5 V to 40 V
Full range
1.5
VI(PP) = 1 V
f = 120 Hz,
1.5
25C
80
Full range
250
IO = 0 to 20 mA
25C
450
150
450
25C
160
15
160
Full range
250
25C
235
Noncumulative
25C
f = 10 Hz to 10 kHz
25C
25C
VO to 0.1%,
IO = 10 mA
CL = 0
VO to 0.01%,
IO = 10 mA
CL = 0
VI = 4.5 to 5.5 V,
VI = 4.5 to 5.5 V,
VO to 0.1%
VO to 0.01%
25C
VI = 0 to 5 V,
VI = 0 to 5 V,
VO to 0.1%
VO to 0.01%
25C
CL = 100 pF
250
250
65
7.5
30
55
30
50
100
V
V
V/V
V/V
160
V
235
15
25C
VO = 5 V
VO = 0
45
A
A
dB
IO = 0 to 10 mA
Output impedance
Short-circuit output current (sink current)
20
100
160
IO = 0 to 20 mA
t = 1000 h,
20
25C
IO = 0 to 3 mA
250
100
25C
V
ppm/C
250
25C
Ripple rejection
2.53
UNIT
ppm
22.5
m
mA
V
110
115
25C
CL = 100 pF
180
ss
180
12
30
125
210
ss
s
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TYPICAL CHARACTERISTICS
Table Of Graphs
FIGURE
Output voltage
Output voltage hysteresis
Input bias current
Distribution
vs Free-air temperature
vs Free-air temperature
vs Input voltage
vs Free-air temperature
Ripple rejection
vs Frequency
7
8
Output impedance
vs Frequency
vs Free-air temperature
10
vs Frequency
11
vs Frequency
12
vs Time
13
vs Time
14
vs Time
15
Output current
vs Load capacitance
16
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TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
DISTRIBUTION OF
OUTPUT VOLTAGE
24
VI = 5 V
TA = 25C
2.53
VI = 5 V
IO = 0
2.52
VV)
O Output Voltage V
Percentage of Units %
20
16
12
2.51
2.5
2.49
2.48
0
2.48
2.5
2.49
2.51
2.47
75
2.52
50
VO Output Voltage V
25
Figure 1
50
75
100
125
35
40
250
VI = 5 V
Normalized to First 25C VO
IO = 0
TA = 25C
IIB
I IB Input Bias Current A
25
Figure 2
TA Free-Air Temperature C
Start Point
0
End Point
2
4
200
150
100
50
8
10
75
0
50
25
25
50
75
100
125
10
TA Free-Air Temperature C
Figure 3
25
15
20
30
VI Input Voltage V
Figure 4
Data at high and low temperatures are applicable within rated operating free-air temperature ranges of the various devices.
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TYPICAL CHARACTERISTICS
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
172
VI = 5 V
IO = 0
170
IO = 0
TA = 25C
VV)
O Output Voltage Change V
IIB
I IB Input Bias Current A
168
166
164
162
160
158
156
154
60
40
20
152
150
75 50
20
25
0
25
50
75
100
TA Free-Air Temperature C
125
Figure 5
90
VI = 5 V
80
VV)
O Output Voltage Change V
80
70
60
50
40
30
VI = 5 V
VI(PP) = 1 V
IO = 0
TA = 25C
20
10
10
100
60
TA = 40C
TA = 0C
40
TA = 55C
20
0
20
40
10 k
100 k
1M
TA = 125C
60
80
1k
TA = 125C
TA = 25C
TA = 25C
100
10 8
f Frequency Hz
Figure 7
TA = 55C
6
4 2
0
2
4
6
IO Output Current mA
Figure 8
Data at high and low temperatures are applicable within rated operating free-air temperature ranges of the various devices.
40
Figure 6
RIPPLE REJECTION
vs
FREQUENCY
Ripple Rejection dB
30
10
20
VI Input Voltage V
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10
TYPICAL CHARACTERISTICS
OUTPUT IMPEDANCE
vs
FREQUENCY
100
IO = 0
IOS
I OS Short-Circuit Output Current mA
VI = 5 V
TA = 25C
z o Output Impedance
10
IO = 10 mA
0.1
IO = 10 mA
0.01
10
100
1k
10 k
100 k
1M
IOS
Output Source, VO = 0
52
50
48
46
44
42
40
0.001
IOS
Output Sink, VO = 5 V
54
VI = 5 V
75 50
f Frequency Hz
75 100
0
25
50
25
TA Free-Air Temperature C
Figure 9
Figure 10
WIDE-BAND NOISE VOLTAGE
vs
FREQUENCY
1400
80
1200
70
Wide-Band Noise Voltage V
V rms
1000
800
600
400
200
VI = 5 V
TA = 25C
0
1
10
125
100
1k
f Frequency Hz
10 k
100 k
VI = 5 V
TA = 25C
1 Hz to Frequency Indicated
60
1 Pole Low Pass
50
40
30
20
2 Pole Low Pass
10
0
10
100
1k
10 k
100 k
f Frequency Hz
Figure 11
Figure 12
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TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE RESPONSE
TO INPUT VOLTAGE STEP
vs
TIME
VI = 5 V
CL = 100 pF
TA = 25C
3
0.1 %
2
1
1.5 V
0.01 %
VO Response
0.01 %
1
2
10 mA
IO Step
0.1 %
0
10 mA
150
300
450
600
750
t Time s
900
IO = 0
CL = 100 pF
TA = 25C
1050
0.1 %
2
1
0
0.01 %
VO Response
1
VI = 5.5 V
2
0.1 %
3
VI = 4.5 V
VI Step
500
0
1.5 V
0
50
Figure 13
VI = 4.5 V
100
t Time s
200
150
Figure 14
STABILITY RANGE
OUTPUT CURRENT
vs
LOAD CAPACITANCE
20
IO = 0
CL = 100 pF
TA = 25C
0.1 %
15
Unstable
10
I O Output Current mA
VV)
O Output Voltage V
VI = 5 V
TA = 25C
0
5
5
0
5
Stable
10
15
10
t Time s
20
130
20
10 6 10 5 10 4 10 3 10 2 10 1 10 0
CL Load Capacitance F
Figure 15
10
Figure 16
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10 1
10 2
macromodel information
* TLE2425 OPERATIONAL AMPLIFIER MACROMODEL SUBCIRCUIT
* CREATED USING PARTS RELEASE 4.03 ON 08/21/90 AT 13:51
* REV (N/A)
SUPPLY VOLTAGE: 5 V
* CONNECTIONS: INPUT
*
| COMMON
*
| | OUTPUT
*
| | |
.SUBCKT TLE2425 3 4 5
*
OPAMP
C1
C2
C3
CPSR
DCM+
DCM
DC
DE
DLN
DLP
DP
ECMR
EGND
EPSR
ENSE
FB
10E6
GA
GCM
GPSR
GRC1
GRC2
GRE1
GRE2
HLIM
HCMR
IRP
IEE
IIO
I1
Q1
Q2
R2
RCM
REE
RN1
RN2
SECTION
11 12 21.66E 12
6 7 30.00E 12
87 0 10.64E 9
85 86 15.9E 9
81 82 DX
83 81 DX
5 53 DX
54 5 DX
92 90 DX
90 91 DX
4 3 DX
84 99 (2,99) 1
99 0 POLY(2)
(3,0) (4,0) 0 .5 .5
85 0 POLY(1)
(3,4) 16.22E6 3.24E6
89 2 POLY(1)
(88,0) 120E6 1
7 99 POLY(6)
VB VC VE VLP VLN VPSR
O
74E6
6 0 11 12 320.4E6
0 6 10 99 1.013E9
85 86 (85,86)
100E6
4 11 (4,11) 3.204E4
4 12 (4,12) 3.204E4
13 10 (13,10)
1.038E3
14 10 (14,10)
1.038E3
90 0 VLIM
1K
80 1 POLY(2)
VCM+
VCM
0 1E2 1E2
3 4 146E6
3 10 DC 24.05E6
2 0 .2E9
88 0 1E21
11 89 13 QX
12 80 14 QX
6 9 100.0E3
84 81 1K
10 99 8.316E6
87 0 2.55E8
87 88 11.67E3
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10E6
11
12
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11-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
5962-9555601Q2A
OBSOLETE
LCCC
FK
20
TBD
Call TI
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-55 to 125
5962-9555601QPA
OBSOLETE
CDIP
JG
TBD
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-55 to 125
TLE2425CD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425C
TLE2425CDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425C
TLE2425CDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425C
TLE2425CDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425C
TLE2425CLP
ACTIVE
TO-92
LP
1000
Pb-Free
(RoHS)
CU SN
2425C
TLE2425CLPR
OBSOLETE
TO-92
LP
TBD
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TLE2425CPS
ACTIVE
SO
PS
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Q2425
TLE2425CPSR
ACTIVE
SO
PS
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Q2425
TLE2425ID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425I
TLE2425IDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425I
TLE2425IDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425I
TLE2425IDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2425I
TLE2425ILP
ACTIVE
TO-92
LP
1000
Pb-Free
(RoHS)
CU SN
2425I
TLE2425ILPE3
ACTIVE
TO-92
LP
1000
Pb-Free
(RoHS)
CU SN
2425I
TLE2425MD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
2425M
TLE2425MDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
2425M
TLE2425MDR
OBSOLETE
SOIC
TBD
Call TI
Call TI
-55 to 125
Addendum-Page 1
Samples
www.ti.com
11-Mar-2015
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
Device Marking
(4/5)
TLE2425MDRG4
ACTIVE
SOIC
TLE2425MFKB
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
TLE2425MJG
OBSOLETE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
TLE2425MJGB
OBSOLETE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
TLE2425MLP
OBSOLETE
TO-92
LP
TBD
Call TI
Call TI
-55 to 125
2425M
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
Samples
www.ti.com
11-Mar-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
13-Feb-2016
Device
TLE2425CDR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLE2425CPSR
SO
PS
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
TLE2425IDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
13-Feb-2016
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLE2425CDR
SOIC
2500
367.0
367.0
38.0
TLE2425CPSR
SO
PS
2000
367.0
367.0
38.0
TLE2425IDR
SOIC
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
0.280 (7,11)
0.245 (6,22)
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.023 (0,58)
0.015 (0,38)
015
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
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