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Freescale Semiconductor
MPX5050
Rev 11, 03/2010
MPX5050
MPXV5050
MPVZ5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 V Output
Features
Case
Device Name
No.
Unibody Package (MPX5050 Series)
None
MPX5050D
867
MPX5050DP
867C
MPX5050GP
867B
MPX5050GP1
867B
Small Outline Package (MPXV5050 Series)
# of Ports
Single
Dual
Gauge
Pressure Type
Differential
Absolute
Device
Marking
MPX5050D
MPX5050DP
MPX5050GP
MPX5050GP
MPXV5050GP
1369
MPXV5050DP
1351
MPXV5050GC6U
482A
MPXV5050GC6T1
482A
MPXV5050GP
MPXV5050DP
MPXV5050G
MPXV5050G
MPVZ5050GW7U
MZ5050GW
1560
Pressure
UNIBODY PACKAGES
MPX5050D
CASE 867-08
MPX5050GP
CASE 867B-04
MPX5050DP
CASE 857C-05
MPVZ5050GW7U
CASE 1560-03
MPXV5100GC6U
CASE 482A-01
MPXV5050DP
CASE 1351-01
MPXV5050GP
CASE 1369-01
MPX5050
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
50
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
7.0
10
mAdc
(0 to 85C)
Voff
0.088
0.2
0.313
Vdc
(0 to 85C)
VFSO
4.587
4.7
4.813
Vdc
(0 to 85C)
VFSS
4.5
Vdc
Accuracy(6)
(0 to 85C)
2.5
%VFSS
V/P
90
mV/kPa
Response Time(7)
tR
1.0
ms
Io+
0.1
mAdc
Warm-Up Time(8)
20
ms
Offset Stability(9)
0.5
%VFSS
Sensitivity
MPX5050
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Pmax
200
kPa
Storage Temperature
Tstg
-40 to +125
Operating Temperature
TA
-40 to +125
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
MPX5050
4
Sensors
Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
5.0
4.5 Transfer Function:
Vout = VS*(0.018*P+0.04) ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85C
TYPICAL
Output (V)
3.0
2.5
MAX
2.0
MIN
1.5
1.0
0.5
0
10
15
20
25
30
35
40
45
50
55
Fluorosilicone
Gel Die Coat
P1
Epoxy
Plastic
Case
Differential/Gauge Element
Die
Bond
Die
Wire Bond
Lead Frame
P2
Vout
OUTPUT
Vs
IPS
1.0 F
0.01 F
GND
470 pF
MPX5050
Sensors
Freescale Semiconductor
Pressure
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
4.0
Temp
3.0
Temperature
Error
Factor
40
0 to 85
+125
2.0
Multiplier
3
1
3
1.0
0.0
40
20
20
40
60
Temperature in C
80
100
120
140
NOTE: The Temperature Multiplier is a linear response from 0 to 40C and from 85 to 125C.
2.0
1.0
Pressure (in kPa)
0.0
0
1.0
10
20
30
40
50
60
2.0
3.0
Pressure
Error (Max)
0 to 50 (kPa)
1.25 (kPa)
MPX5050DP
867C
MPX5050GP
867B
MPXV5050GP
1369
MPXV5050DP
1351
MPXV5050GC6U/T1
482A
MPX5050
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
A
D 8 PL
4
0.25 (0.010)
T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
N B
G
8
1
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0
7
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0
7
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
T
SEATING
PLANE
PIN 1 IDENTIFIER
CASE 482A-01
ISSUE A
UNIBODY PACKAGE
C
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
S
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
T A
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.84
0.027
0.033
0.68
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30 NOM
30 NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX5050
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5050
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5050
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
P
0.25 (0.010)
T Q
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
PORT #2
VACUUM
(P2)
B
PIN 1
C
SEATING
PLANE
T
J
S
SEATING
PLANE
D 6 PL
G
F
0.13 (0.005)
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
MPX5050
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5050
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5050
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5050
Sensors
Freescale Semiconductor
13
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5050
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
Sensors
Freescale Semiconductor
15
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
PAGE 2 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
16
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1560-03
ISSUE D
SMALL OUTLINE PACKAGE
MPX5050
Sensors
Freescale Semiconductor
17
MPX5050
Rev. 11
03/2010