Rendering date: 2016-08-01 20:00:43

http://conductivity-app.org

CuETP
UNS:C11000
EN:CW004A

Manufactures list:
Aurubis (http://www.aurubis.com/en/) - Cu-ETP, Cu-ETP1
Cupori Oy (http://www.cupori.com) - Cupori 110 Premium
Daechang Co., Ltd. (http://www.brasone.com/) - ETP
Diehl Metall Stiftung & CO.KG (http://www.diehlmetall.de) - KD58
Freeport McMoRan Copper & Gold (http://www.fcx.com/) - C110 - ETP Copper
KGHM Polska Mied S.A. (http://www.kghm.pl/) - Cu-ETP-8-CL
KM Europa Metal AG (http://www.kme.com/) - KME100
La Farga (http://www.lfl.es) - Cu-ETP, Cu-ETP1
Luvata (http://www.luvata.com/) - CuETP
Montanwerke Brixlegg AG (http://www.montanwerke-brixlegg.com) - MB-ETP, MB-ETP1
Mueller Industries (www.muellerindustries.com/) - ASTM B152 Alloy C11000
Nexans (http://www.nexans.us/) - ETP copper, Cu-a1
Palabora (http://www.palabora.com/) - Cu-ETP 1
Pan Pacific Copper (http://www.ppcu.co.jp/eng/) - Tough Pitch Copper (ETP)
Pegler Yorkshire Group LTD. (http://www.pegleryorkshire.co.uk) - ETP
Revere Copper Products, Inc. (http://reverecopper.com/) - C11000
Sociedad Contractual Minera el Abra (http://www.fcx.com/) - C110
Sociedad Minera Cerro Verde S.A.A. (http://www.fcx.com/) - C110
Sofia Med S.A. (http://www.sofiamed.bg) - Cu-ETP
Tenke Fungurume (http://www.fcx.com/) - C110
Wieland-Werke AG (http://www.wieland.de/) - Wieland-K32/E-Cu58
CuETP is the most common copper. It is universal for electrical applications. CuETP has a
minimum conductivity rating of 100% IACS and is required to be 99.9% pure. It has
0.02% to 0.04% oxygen content (typical). Most ETP sold today will meet or exceed the
101% IACS specification. As with OF copper, silver (Ag) content is counted as copper
(Cu) for purity purposes. C11000C (Electrolytic Tough Pitch Copper) is an electrolytic
refined copper widely used for electrical and electronic applications. CuETP has the
properties required in all applications with a hydrogen-free atmosphere. In the presence
of H2 and heat all oxygen-bearing coppers suffer from so-called hydrogen embrittlement.
This is a chemical reduction of copper oxide by diffusing hydrogen leading to formation of
H2O within the microstructure, resulting in embrittlement of the grain boundaries. The
phosphorus of our copper content is very low, so that electrical conductivity is
comparable to the best performing materials. C1100 is an oxygen containing copper
which has a very high electrical and thermal conductivity. It has excellent forming
properties. Due to its oxygen content soldering and welding properties are limited. The
alloy is registered US EPA antimicrobial. Due to its high copper content of about 99% CuETP provides the full antimicrobial properties of copper to inhibit the growth of bacteria,
1

viruses and fungi which are in contact for a short period of time on copper containing
surfaces. Traditionally used ETP grade copper for electric applications, characterized by
its content of hard copper oxides (Cu2O) with sizes of 510 m, which, for very small
wire diameters, significantly decrease their ductility. Electrolytic Tough Pitch Copper is
not suitable for case hardening. This material can be bent, soldered, drilled, riveted, and
formed to almost any configuration. ETP Copper is available in round bar, squares, flat
rectangular (bus bar), and certain profile shapes.
Literature [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 342, 340, 415, 268,
347, 343, 345, 344, 143, 341, 346]

Basic properties
Basic properties

Density [g/cm ]

Specific heat capacity

[J/(kg*K)]
Temperature coefficient of
electrical resistance (0...100C)
[10-3/K]
Electrical conductivity [T=20C,
(% IACS)]

Thermal conductivity
[W/(m*K)]

Value

8,89-8,94
8,32
7,93

Comments
Solid state,
temperature:
20C
Solid state,
temperature:
1083C
Liquid state,
temperature:
1083C

385-386
3,7
97
100-101,5

388

H14 temper
O60 temper
For high
conductivity
copper, a
values of 387
is an adjusted
value
corresponding
to an electrical
conductivity of
101% IACS

Thermal expansion coefficient

17,7
20...300C [10-6/K]
[Ref: 316, 409, 413, 254, 342, 340, 415, 268, 347, 343, 346,
417, 418, 419, 420, 421, 422, 423]
Electrical conductivity is strongly influenced by chemical composition. A high level of cold
deformation and small grain size decrease the electrical conductivity moderately.
Minimum conductivity level can be specified [Ref: 316, 409, 410, 254, 340, 268, 344,
143]

Variation of density with amount of cold reduction by rolling for CuETP (C11000) and
similar coppers (CuETP1). A - vacuum annealed 12 h at 880 C and cold drawn; B vacuum annealed 12 h at 970 C and flat rolled; C - vacuum annealed 12 h at 995 C
and cold drawn; D - hot rolled, vacuum annealed 4 h at 600 C and drawn [Ref: 254]

Electrical conductivity of CuETP, CuETP1 according to KME [Ref: 417]

The influence of impurities on the electrical conductivity of CuETP [Ref: 24, 56, 26, 27]

Applications
Main applications
Typical uses: produced in all forms except pipe and used for building fronts, downspouts,
flashing, gutters, roofing, screening, spouting, gaskets, radiators, busbars, electrical
wire, stranded conductors, contacts, radio parts, switches, terminals, ball floats, butts,
cotter pins, nails, rivets, soldering copper, tacks, chemical process equipment, kettles,
pans, printing rolls, rotating bands, roadbed expansion plates, vats. Automotive industry:
radiators, gaskets. Builders hardware: cotter pins, butts, ball floats, tacks, soldering
copper, rivets. Consumer: christmas ornaments. Electrical industry: transformer coils,
switches, terminals, contacts, radio parts, busbars, terminal connectors, conductors,
stranded conductors, cable strip. Fasteners. Industrial: printed circuit boards, stamped
parts, pressure vessels, chemical process, equipment, chlorine cells, chimney cap
screens, heat exchangers, printing rolls, anodes, rotating bands, pans, vats, heat sinks.
Architecture: downspouts, flashing, roofing, gutters, building fronts, skylight frames,
kitchen countertops.
Preferred applications: transformer, fuse, relay box, punshed screen, cable strip, current
carrying capacity. Literature: [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254,
342, 340, 415, 268, 347, 343, 345, 344, 143, 341, 346]

Kinds of semi-finished products/final products

Forms Available: sheet, strip, plate for locomotive fireboxes, rod for locomotive staybolts,
flat products, rod, bar and shapes, wire, conductors, tubular products, miscellaneous

Product
Plate for locomotive
fireboxes
Rod
Rod for locomotive
staybolts
Sheet and strip
Wire

CuETP (C11000)
Specification

Literature

ASME SB11

[Ref: 428]

SAE J463
MIL-C-12166

[Ref: 429]
[Ref: 430]

ASME SB12

[Ref: 431]

AMS 4500
AMS 4701
MIL-W-3318
MIL-W-6712

[Ref:
[Ref:
[Ref:
[Ref:

432]
433]
434]
435]

ASTM and federal specifications for CuETP (C11000)

Product and condition

- General requirements
for copper and copper
alloy plate, sheet, strip
and rolled bar
- Sheet, strip, plate and
rolled bar
- Sheet, lead coated

Specification number
ASTM
Federal
Flat products:
B248 [Ref: 436]

B152 [Ref: 373]

QQ-C-576 [Ref: 389]

B101 [Ref: 437]

- Sheet and strip for

building construction
- Strip and flat wire
- Foil, strip and sheet for
printed circuits

B370 [Ref: 388]

B272 [Ref: 375]

QQ-C-502 [Ref: 381]

B451 [Ref: 438]

Rod, bar and shapes:

- General requirements
for copper and copper
alloy rod, bar and shapes

B249 [Ref: 334]

- Rod, bar and shapes

B133 [Ref: 372]

- Rod, hot rolled

- Rod, bar and shapes for
forging
- Busbars, rods and
shapes

B49 [Ref: 348]

QQ-C-502 [Ref: 381],

QQ-C-576 [Ref: 389]
-

B124 [Ref: 380]

QQ-C-502 [Ref: 381]

B187 [Ref: 374]

QQ-B-825 [Ref: 440]

Wire
- General requirements
for copper and copper
alloy wire
- Hard drawn
- Tinned
- Medium-hard drawn
- Tinned

B250 [Ref: 441]

B1 [Ref: 385]
B246 [Ref: 400]
B2 [Ref: 386]
B246 [Ref: 400]
B3 [Ref: 387]
- Soft
B189 [Ref: 399]
- Lead alloy coated
B355 [Ref: 403]
- Nickiel coated
B48 [Ref: 371], B272
- Rectangular and square
[Ref: 375]
- Tinned
B33 [Ref: 396]
- Silver coated
B298 [Ref: 402]
B47 [Ref: 442], B116
- Trolley
[Ref: 398]
Conductors
- Bunch stranded
B174 [Ref: 444]
B8 [Ref: 445], B226 [Ref:
- Concentric-lay stranded
446], B496 [Ref: 447]
- Conductors for electronic
B286 [Ref: 401], B470
equipment
[Ref: 397]
B172 [Ref: 448], B173
- Rope-lay stranded
[Ref: 449]
- Composite conductors
(copper plus copper-clad
B229 [Ref: 450]
steel)
Tubular products
- Bus pipe and tube
B188 [Ref: 379]
- Pipe
- Welded copper tube
B477 [Ref: 452]
Miscellaneous
- Standard classification of
B224 [Ref: 453]
copper
- Electrolytic Cu wirebars,
cakes, slabs, billets,
B5 [Ref: 454]
ingots and ingot bars
- Anodes
- Die forgings
B283 [Ref: 456]

QQ-W-343 [Ref: 404]

QQ-W-343 [Ref: 404]
QQ-W-343 [Ref: 404]
-

QQ-B-825 [Ref: 440]

WW-P-377 [Ref: 451]

QQ-A-673 [Ref: 455]

-

EN specification for CuETP (C11000)

Number
EN 13601
EN 13600
EN 13602
EN 1652
EN 1976
EN 1977
EN 13599
EN 13605
EN 12165
EN 12420
EN 13148

Title - products
Copper and copper alloys. Copper
rod, bar and wire for general
electrical purposes
Copper and copper alloys. Seamless
copper tubes for electrical purposes
Copper and copper alloys. Drawn,
round copper wire for the
manufacture of electrical conductors
Copper and copper alloys. Plate,
sheet, strip and circles for general
purposes
Copper and copper alloys. Cast
unwrought copper products
Copper and copper alloys. Copper
drawing stock (wire rod)
Copper and copper alloys. Copper
plate, sheet and strip for electrical
purposes
Copper and copper alloys. Copper
profiles and profiled wire for electrical
purposes
Copper and copper alloys. Wrought
and unwrought forging stock
Copper and copper alloys. Forgings
Copper and copper alloys. Hot-dip
tinned strip

Chemical composition
Chemical composition
Ag [wt.%]
As [wt.%]
Bi [wt.%]
Cd [wt.%]
Co [wt.%]
Cr [wt.%]
Cu [wt.%]
Fe [wt.%]
Mn [wt.%]
Ni [wt.%]
O2 [wt.%]
P [wt.%]
Pb [wt.%]
S [wt.%]
Sb [wt.%]
Se [wt.%]
Sn [wt.%]
Te [wt.%]
Zn [wt.%]
[Ref: 567]

Value
0,0009
6E-05
1E-05
1E-06
3E-06
9E-06
99,97884
0,00016
4E-06
0,00017
0,019
0,0002
7E-05
0,00028
6E-05
1E-05
3E-05
2E-05
0,00018

Comments

Calculated

* Chemical composition measured for wire rod (diameter 8.00 mm) obtained from
Contirod technology
Composition limits: 99.90 Cu min (silver counted as copper). Silver has little effect on
mechanical and electrical properties but does raise the recrystallization temperature and
tends to produce a fine-grain copper. Iron as present in commercial copper, has no effect
on mechanical properties, but even traces of iron can cause C11000 to be slightly
ferromagnetic. Sulfur causes spewing and unsoundness, and is kept below 0.003% in
ordinary refinery practice. Selenium and tellurium are usually considered undesirable
impurities but may be added to improve machinability. Bismuth creates brittleness in
amounts greater than 0.001%. Lead should not be present in amounts greater than
0.005% if the copper is to be hot rolled. Cadmium is rarely present; its effect is to
toughen copper without much loss in conductivity. Arsenic decreases the conductivity of
copper noticeably, although it is often added intentionally to copper not used in electrical
service because it increases the toughness and heat resistance of the metal. Antimony is
sometimes added to the copper when a high recrystallization temperature is desired
[Ref: 316, 409, 412, 254, 415, 343, 344]

Chemical composition of CuETP according to EN 1976, EN 1977

Chemical composition, wt%
Other named elements
Cu1)
Bi
9

Pb

max
max
(As + Bi + Cd + Co + Cr + Fe + Mn + Ni +
O + P + Pb + S + Sb + Se + Si + Sn + Te
99,90
0,0005
+ Zn) maximum 0,03%
1)
Including Ag with maximum 0,015%
2)
Maximum permissible oxygen 0,060%
Literature: [Ref: 335, 336]

10

min
0,00402)

0,005

Chemical composition of CuETP1 according to EN 1976, EN 1977

Ag

As

Bi

Cd

Co

Cr

Fe

0,00
25

0,00
05

0,00
02

-1)

-3)

-1)

0,00
10

1)

2)

3)

Chemical composition, wt%

Mn Ni
O
P
Pb
max.
-1)

-3)

0,04
00

-1)

1)

2)

0,00
05

Sb

Se

Si

Sn

Te

Zn

0,00
15

0,0004

0,00
02 2)

-3)

-3)

0,00
02

-3)

1)

(As + Cd + Cr + Mn + P + Sb) maximum 0,0015%

(Bi + Se + Te) maximum 0,0003%, including (Se + Te) maximum 0,00030%
3)
(Co + Fe + Ni + Si + Sn + Zn) maximum 0,0020%
Literature: [Ref: 335, 336]

11

Cu
-

Mechanical properties
Mechanical properties
UTS [MPa]
YS [MPa]
Elongation [%]
Hardness

Value
220-395
69-365
4-55
10-62
40-95
25-64

Youngs modulus [GPa]

115
115-130

Kirchhoffs modulus [GPa]

44
44-49

Comments

HRB
HRF
HR30T
O60 temper
Cold-worked
(H) temper
O60 temper
Cold-worked
(H) temper

Poisson ratio
0,33
[Ref: 316, 409, 254, 342, 340, 415, 268, 343, 344, 143, 346,
417, 418, 419, 420, 421, 422, 423, 66, 267, 355, 91, 354, 406]

Variation of tensile properties with amount of cold reduction by rolling for Cu-ETP
(C11000) and similar coppers (Cu-ETP1) [Ref: 254]
12

Variation of hardness with amount of cold reduction by rolling for Cu-ETP (C11000) and
similar coppers (Cu-ETP1) [Ref: 254]

Mechanical properties of CuETP, CuETP1 according to KME [Ref: 417]

Temper

UTS, MPa

YS, MPa

R220 (a)
R240
R290
R360

220 - 260
240 - 300
290 - 360
360

< 140
180
250
320
(a) Annealed

Elongation A
50, %
33
8
4
2

Hardness HV
40 - 65
65 - 95
90 - 110
110

Mechanical properties of CuETP wire rod (diameter 8.0mm) used in electrical application
[Ref: 316, 254, 343, 344, 143, 346, 417, 418, 419, 420, 421, 422, 423, 66, 267, 355,
91, 354, 357, 358]
Material

CuETP

Production technology
Chemical
composition
Cu + Ag

[%wt]

Contirod, Southwire,
Continuus Properzi

99,95 - 99,97

99,98

13

Content by
weight of
elements
Oxygen
UTS
Elongation A250
Ductility

[ppm]

150

25

[ppm]
[MPa]
[%]
[mm]

150 - 400
220 - 240
40 - 45
0,2

160 - 200
220
45 - 50
0,05

Mechanical properties of CuETP, CuETP1 wire rod [Ref: 567]

Production
technology
Contirod

YS
[MPa]
140,0

UTS
[MPa]
220,7

Elongation A250
[%]
42,3

Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) from Contirod
technology [Ref: 567]

14

Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) by Fujiwara [Ref: 357]

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process [Ref: 567]

15

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process [Ref: 567]

16

UTS/YS ratio vs strain of Cu-OFE wires (diameter 0,5-8.0 mm) after drawing process
[Ref: 567]

17

Elongation A250 vs strain of Cu-ETP wires (diameter 0,5-8.0 mm) after drawing process
[Ref: 567]

18

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process -logarithmic system [Ref: 567]

19

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process -logarithmic system [Ref: 567]

20

Typical mechanical properties of CuETP, CuETP1 [Ref: 316, 409, 254, 340, 268, 344, 91, 354]
Hardness
Temper

UTS,
MPa

YS (a),
MPa

OS050
OS025
H00
H01
H02
H04
H08
H10
H20

220
235
250
260
290
345
380
395
235

69
76
195
205
250
310
345
365
69

OS050
H00
H01
H04
M20

220
250
260
345
220

Elongation in A50, %

69
195
205
310
60

H04

310

275

H80
(40%)

380

345

HRF

Flat products, 1 mm thick

45
40
45
45
60
60
70
70
84
84
90
90
94
94
95
95
45
45
Flat products, 6 mm thick
50
40
40
60
35
70
12
90
50
40
Flat products, 25 mm thick
20
85
Rod, 6 mm in diameter
10

94

220

Rod, 25 mm in diameter
69
55
40

330

305

220

69
55
40
Rod, 50 mm in diameter

H80
(16%)

310

275

OS050

240

Wire, 2 mm in diameter
35(d)
-

OS050
H80
(35%)
M20

16

20

21

87

85

Shear
strength,
MPa

Fatigue
strength (b),
MPa

HRB

HR30T

10
25
40
50
60
62
-

25
36
50
57
63
64
-

150
160
170
170
180
195
200
200
160

76
90
90
97
-

10
25
50
-

150
170
170
195
150

45

180

60

200

150

47

185

115(c)

150

45

180

165

H04
H08

280
455

OS050
OS025
H55
(15%)
H80
(40%)

220
235

1.5(e)
1.5(e)
Tube, 25 mm outside diameter, 1.65 mm wall thickness
69
45
40
76
45
45
-

200
230

150
160

275

220

25

77

35

45

180

380

345

95

60

63

200

Shapes, 13 mm in diameter
OS050
220
69
50
40
150
H80
275
220
30
35
180
(15%)
M20
220
69
50
40
150
M30
220
69
50
40
150
(a) At 0.5% extension under load. (b) At 108 cycles. (c) At 3 108 cycles in a rotating beam test. (d) Elongation in 254 mm. (e)
Elongation in 1500 mm.

22

Mechanical properties of CuETP, CuETP1 (flat, round, square, hexagonal) according to EN13601 by Aurubis [Ref: 418]
Dimensions, mm
Metallurgical
State D
D
H035 (a)

Round, square,
hexagonal
up
From
To
to
2
80
2
80

Hardness

Thickness

0.5
0.5

Up
to
-

From

Width
To

From

40
40

1
1

Up
to
-

HB

Elongation
HV

Max.

Min.

UTS
MPa

YS,
MPa

Max.

A100
[%]

A
[%]

To

Min.

200
200

Cold drawn product without any specific mechanical properties

35
65
35
65
-

R200 (a)

80

1,0

40

200

200

Max.120

25

35

H065

80

0,5

40

200

65

90

70

95

R250

10

1,0

10

200

250

12

R250

10

30

250

15

R230

30

80

10

40

10

200

230

18

H085
H075

2
-

40

40
80

0,5
-

20

20
40

1
-

20

120
160

85
75

110
100

90
80

115
105

R300

20

1,0

10

120

300

R280

20

40

10

20

10

120

280

10

R260

40

80

20

40

20

160

260

12

H100

10

0,5

120

100

110

R350

10

1,0

120

350

Min.
200
Min.
180
Min.
160
Min.
260
Min.
240
Min.
220
Min.
320

(a) Annealed

23

Mechanical properties of CuETP, CuETP1 according to EN13606 by Aurubis [Ref: 418]

Metallurgical State
D
H035 (a)
R200 (a)
H065
R240
H080
R280

Dimensions, mm
Thickness
Width
Max.
Max.
50
180
50
180
50
180
10
150
10
150
5
100
5
100

Hardness
HB
Min.
35
65
80
-

HV
Max.

Min.

65
35
95
70
115
85
(a) Annealed

24

UTS MPa
Max.
Min.
Same as drawn
70
200
100
240
120
280

YS,
MPa
Max. 120
Min. 160
Min. 240

Elongation
A
A100 [%]
[%]
25
-

35
15
8

Exploitation properties
Heat resistance
Mechanical and electrical properties vs temperatures

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hour
annealing process (At temperatures from 100 C to 400 C the UTS of Cu-ETP wire rod is
stable, whilein the temperature range of 500 C to 900 decreases) [Ref: 567]

25

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hour
annealing process [Ref: 567]

26

Variation of tensile properties and grain size of electrolytic tough pitch copper (Cu-ETP)
and similar coppers (Cu-ETP1) [Ref: 254]

27

Short-time elevated-temperature tensile properties of Cu-ETP (C11000) and similar

coppers (Cu-ETP1) [Ref: 254]

Low-temperature tensile properties of Cu-ETP (C11000) and similar coppers (Cu-ETP1)

[Ref: 254]

28

Tension stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire
rod after annealing process [Ref: 567]

29

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire
rod after annealing process [Ref: 567]

Elongation vs strain of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod after
annealing process [Ref: 567]
30

Softening resistance of Cu-ETP [Ref: 417]

Thermal expansion and enthalpy of Cu-ETP. (a) Total thermal expansion from -190 C.
(b) Enthalpy (heat content) above 0 C [Ref: 254]
Thermal conductivity of Cu-ETP in different temperature [Ref: 254, 340, 415, 344, 267,
91, 406]
Temperature
K
4.2
20
77
194

C
-268.8
-253
-196
-79
31

Thermal conductivity
W/mK
300
530
550
400

273
373
573
973

0
100
300
700

390
380
370
300

Softening resistance of cold drawn Cu-ETP wires [Ref: 567]

32

Softening resistance of cold drawn Cu-OFE wires[Ref: 567]

Long-therm heat resistance, e.g. Arrhenius curve

33

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24

hours annealing process [Ref: 567]

34

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24 hours
annealing process [Ref: 567]

35

Percentage reduction of area vs temperature of Cu-ETP wire rod (diameter 8.0mm) after
24 hours annealing process [Ref: 567]

Half- softening temperature

Half-softening temperature of Cu-ETP wire [Ref: 567]

Diameter of wire

Strain

[mm]
7,0
5,5
4,5
2,5
0,5

[-]
0,28
0,76
1,16
2,38
5,59

Half-softening
temperature
[C]
265
210
210
175
125

Corrosion resistance
Hydrogen embrittlement resistance
CuETP (C11000) is subjected to embrittlement when heated to 370 C or above in a
reducing atmosphere, as in annealing, brazing or welding. If hydrogen or carbon
monoxide is present in the reducing atmosphere embrittlement can be rapid. Literature:
[Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 340, 268, 343, 143, 346, 335,
336, 417, 418, 419, 420, 421, 422, 423, 267, 354, 424, 425, 426, 427, 92]
36

Other kind of corrosion elements

Type of
corrosion
Atmospheric
Marine
environment
Stress crack

Hydrogen
embrittlement

Electrolytic

Suitability

Literature

[Ref: 254, 340, 415, 344,

417, 419, 420, 421, 422,
423, 267, 406]
[Ref: 254, 268, 344, 418,
Good
423]
Good
[Ref: 254, 340, 415, 344]
CuETP (C11000) is subjected to
[Ref: 316, 409, 410, 411,
embrittlement when heated to 370 C or
412, 413, 414, 325, 411,
above in a reducing atmosphere, as in
254, 340, 268, 343, 143,
annealing, brazing or welding. If hydrogen 346, 335, 336, 417, 418,
or carbon monoxide is present in the
419, 420, 421, 422, 423,
reducing atmosphere embrittlement can be 267, 354, 242, 425, 426,
rapid
427, 92]
[Ref: 254, 340, 268, 347,
Good
423, 406]
Good

37

Other

C11000 has excellent corrosion resistance

to weathering and very good resistance to
many chemicals. It is often used
specifically for corrosion resistance. It is
suitable for use with most waters, and can
be used underground because it resists soil
corrosion. It resists non-oxidising mineral
and organic acids, caustic solutions and
saline solutions. Depending on
concentration and specific conditions of
exposure, copper generally resists: acids
mineral acids such as hydrochloric and
sulphuric acids; organic acids such as
acetic acid (including acetates and
vinegar), carbolic, citric, formic, oxalic,
tartaric and fatty acids; acidic solutions
containing sulphur, such as the sulphurous
acid and sulphite solutions used in pulp
mills. Alkalies fused sodium and potassium
hydroxide; concentrated and dilute caustic
solutions. Salt solutions aluminium
[Ref: 254, 342, 268, 347,
chloride, aluminium sulphate, calcium
344, 346, 417, 421, 66,
chloride, copper sulphate, sodium
267, 354]
carbonate, sodium nitrate, sodium
sulphate, zinc sulphate. Waters all potable
waters, many industrial and mine waters,
seawater and brackish water. The
corrosion resistance of C11000 is not
adequate for: ammonia, amines and
ammonium salts; oxidizing acids such as
chromic and nitric acids and their salts;
ferric chloride; persulphates and
perchlorates; mercury and mercury salts.
Copper may also corrode in aerated non
oxidising acids such as sulphuric and acetic
acids, although it is practically immune
from these acids if air is completely
excluded. Copper is not suitable for use
with acetylene, which can react to form an
acetylide which is explosive. C11000 is
considered to be immune to stress
corrosion cracking in ammonia and the
similar media which cause season cracking
in brass and other copper alloys.

www.copper.org

Rheological resistance
Stress relaxation

38

Relaxation at stress level 0.5 Yield Strength [Ref: 419]

Stress relaxation curves for Cu-ETP (C11000) and similar coppers (Cu-ETP1). Data are
H80 temper wire, 2 mm in diameter, and represent the time-temperature combination
necessary to produce a 5% reduction in tensile strength [Ref: 254]

Creep

39

Creep properties of CuETP, CuETP1 (C11000)

Testing
temperature

Stress

MPa

Temper

Total
Duration of
extension(a) Intercept
test
h

Minimum
creep rate
% per
1000 h

Strip, 2.5mm thick

55
2500
2.6
2.0
0.15
130
100
2600
10.0
7.6
1.2
OS030
140
170
29.8(b)
39
55
2000
3.3
2.3
0.65
175
100
350
15(b)
8.0
6.3
55
8250
0.20
0.15
0.01
130
100
8600
0.67
0.26
0.042
H01
140
1750
2.4(b)
0.32
0.45
55
6850
1.14
0.14
0.088
175
100
1100
2.0
0.22
0.66
55
7200
0.24
0.13
0.01
130
100
8600
1.02
0.25
0.054
H02
140
4680
3.4(b)
0.36
0.27
175
55
1050
3.3(b)
0.6
55
8250
1.58
0.08
0.035
H06
130
100
8700
7.31
0.16
0.055
140
4030
11(b)
0.24
0.17
Rod, 3.2 mm diameter
2.5
6000
0.08
0.016
0.011
4.1
6000
0.19
0.010
0.030
OS025
260
7.2
6500
0.64
0.113
0.080
13.8
6500
2.88
0.87
0.306
7.2
6500
0.06
0.045
0.011
14.5
6500
0.20
0.112
0.012
H08
205
28
6500
1.08
0.41
0.097
50
6500
5.42
2.47
0.44
(a) Total extension is initial extension (not given in table) plus intercept plus the product of
minimum creep rate and duration.
(b) Rupture test
Literature: [Ref: 254]

Wear resistance
Friction resistance
Values given below apply to any of the unalloyed copperd in contact with the indicated
materials without lubrication of any kind between the contacting surfaces:

Opposing material
Carbon steel
Cast iron
Glass

Coefficient of friction
Static
Sliding
0.53
0.36
1.05
0.29
0.68
0.53
Literature: [Ref: 254]
40

Fatigue resistance
Fatigue cracking

Fatigue strength at 108 cycles in

a reversed bending test , MPa
Flat products, 1 mm thick
OS025
76
H02
90
H04
90
H08
97
Rod, 25 mm in diameter
115 (At 3 108 cycles in a rotating
H80 (35%)
beam test)
Literature: [Ref: 254]
Temper

Values shown in table are typical for all tough pitch, oxygen-free, phosphorus-deoxidized
and arsenical coppers. Copper does not exhibit an endurance limit under fatigue loading
and, on the average, will fracture in fatigue at the stated number od cycles when
subjected to an alternating stress equal to the corresponding fatigue strenght (see Fig.)
[Ref: 254]

Rotating-beam fatigue strength of Cu-ETP (C11000) wire, 2 mm in diameter, H80 temper

[Ref: 254]
The fatigue strength is defined as the maximum bending stress amplitude which a
material withstands for 107 load cycles under symmetrical alternate load without
breaking. It is dependent on the temper tested and is about 1/3 of the tensile strength
[Ref: 419].
41

Impact strength
Typical impact strength of Cu-ETP (Cu-ETP1)
Product and condition
Impact strength, J
Charpy V-notch
Hot rolled, annealed
96
Charpy keyhole-notch
As-cast
11
As-hot rolled
43
Rod- Annealed
52
- Commercial temper
35
Izod
Rod- Annealed and drawn 30%
54
- Drawn 30%
45
Plate- As-hot rolled
52
- Annealed
53(a)
39(b)
26(a)
12(b)
(a) Parallel to rolling direction. (b) Transverse to rolling direction
Literature: [Ref: 254]
Cold rolled 50%

42

Fabrication properties
Fabrication properties
Soldering
Brazing
Hot dip tinning
Electrolytic tinning
Electrolytic silvering
Electrolytic nickel coating
Laser welding

Value
Comments
Excellent
Good
Excellent
Excellent
Excellent
Excellent
Less suitable
Not
Oxyacetylene Welding
Recommended
Not
Gas Shielded Arc Welding
Recommended
Not
Coated Metal Arc Welding
Recommended
Resistance welding
Less suitable
Not
Spot Weld
Recommended
Not
Seam Weld
Recommended
Butt Weld
Good
Capacity for Being Hot Formed
Excellent
Forgeability Rating
65
Machinability Rating
20
Less suitable
[Ref: 254, 340, 415, 268, 343, 344, 417, 418, 419, 422, 423,
267, 91, 354, 406, 427]

43

Technological properties
Technological properties

Value

Melting temperature [C]

1083

Casting temperature [C]

1140-1200

Annealling temperature [C]

475-750

Stress relievieng temperature

[C]

150-200

Hot working temperature [C]

750-875

44

Comments

Literature
[Ref: 316, 254
, 342, 340,
415, 268, 344,
143, 341, 417,
418, 419, 420,
421, 422, 423,
267, 355, 91,
354, 406]
[Ref: 316, 254
, 342, 340,
415, 268, 343,
344, 346, 417,
418, 419, 420,
421, 422, 423,
66, 267, 355,
91, 354, 406]
[Ref: 254, 340
, 268, 344,
421, 422, 423,
66, 267, 91,
357]
[Ref: 254, 340
, 268, 417,
418, 419, 423,
267, 91, 354,
406]
[Ref: 254, 342
, 340, 268,
344, 66, 267,
91, 406]

Time - temperature relationships for annealing Cu-ETP and similar coppers (Cu-ETP1)
[Ref: 254]

45

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26. Effect of internal oxidation on the residual resistivity of dilute Cu alloys, Sekula S. T., Bull. Am. Phys. Soc., 6 (1961) 173
27. Effect of certain fifth - period elements on some properties of high - purity
copper - Smart J. S., Smith A. A., Trans. AIME, Vol 152,1943, p 103
56. Copper Bars and Copper Sections CERTEC - Buntmetall
66. The Metallurgy of Copper Wire - Dr. Horace Pops
91. Key to Metals - Data Base - www.keytometals.com
92. Comparative study of electrical and mechanical properties of fire-refined
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242. Structure and strength of the age hardened CuNiSi alloy - D.M. Zhao, Q.M.
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8186
254. Copper and copper alloys - J.Davis, ASM International, 2001
267. MatWeb - Data Base - www.matweb.com
268. Copper Development Association Inc. - www.copper.org
316. The influence of parameters of the casting process on shaping of material
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325. Problem of hydrogen embrittlement of copper used for conductors in
fireproof cables - T. Knych, B. Smyrak, M. Walkowicz, Electrical Review, 2011
334. ASTM B249/B249 M 11 Standard specification for general requirements
for wrought copper and copper alloy rod, bar, shapes and forgings - 2011
335. EN 1976:1998 Copper and copper alloys. Cast unwrought copper products 336. EN 1977:1998 Copper and copper alloys. Copper drawing stock (wire rod) 340. Electrical and Magnetic Properties of Metals - Materials Data Series, ASM
Ready Reference, The Materials Information Society 2000
341. Metallurgy of Copper - J. Newton, C. L. Wilson, John Wiley And Sons Inc. 1942
342. Casting - D. M. Stefanescu, ASM Handbook, The Materials Information Society
1988
46

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2009
344. Copper: its trade, manufacture, use, and environmental status - J. Gnter,
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346. Copper Alloys: Preparation, Properties & Applications - Materials Science and
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347. Structures, Physico, chemical Properties and Biological Activities of Copper
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348. ASTM B49-98, Standard specification for copper rod drawing stock for
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354. Base Metals - Metal Bulletin Research - Data Base
355. Wrought and Cast Copper Alloys - Properties Data Base - www.copper.org
357. Properties and applications of high-purity copper - S. Fujiwara, I. Nishino, S.
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for Properties, The Minerals, Metals & Materials Society, November 7-10, 1993
358. Continuous copper rod production from 100 percent scrap - O. Guixa Arderiu,
G. Properzi, 1996
371. ASTM B48 - 00(2011) Standard Specification for Soft Rectangular and
Square Bare Copper Wire for Electrical Conductors 372. ASTM B133-93A Specification for Copper Rod, Bar, and Shapes - (Withdrawn
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373. ASTM B152 / B152M - 13 Standard Specification for Copper Sheet, Strip,
Plate, and Rolled Bar 374. ASTM B187 / B187M - 11 Standard Specification for Copper, Bus Bar, Rod,
and Shapes and General Purpose Rod, Bar, and Shapes 375. ASTM B272 - 12 Standard Specification for Copper Flat Products with
Finished (Rolled or Drawn) Edges (Flat Wire and Strip) 379. ASTM B188 - 10 Standard Specification for Seamless Copper Bus Pipe and
Tube 380. ASTM B124 / B124M - 12 Standard Specification for Copper and Copper
Alloy Forging Rod, Bar, and Shapes 381. QQ-C-502C (Notice-1), Federal Specification: Copper Rods And Shapes; And
Flat Products With Finished Edges (Flat Wire, Strips And Bars) - (03-Apr-1991)
[S/S By ASTM-B133 and ASTM-B272]
385. ASTM B1 - 12 Standard Specification for Hard-Drawn Copper Wire 386. ASTM B2 - 12e1 Standard Specification for Medium-Hard-Drawn Copper
47

Wire 387. ASTM B3 - 12 Standard Specification for Soft or Annealed Copper Wire 388. ASTM B370 - 12 Standard Specification for Copper Sheet and Strip for
Building Construction 389. QQ-C-576B, Federal Specification, Copper Flat Products With Slit, Slit And
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396. ASTM B33 - 10 Standard Specification for Tin-Coated Soft or Annealed
Copper Wire for Electrical Purposes 397. ASTM B470 - 02(2012) Standard Specification for Bonded Copper
Conductors for Use in Hookup Wires for Electronic Equipment 398. ASTM B116 - 95(2012) Standard Specification for Figure-9 Deep-Grooved
and Figure-8 Copper Trolley Wire for Industrial Haulage 399. ASTM B189 - 05(2010) Standard Specification for Lead-Coated and LeadAlloy-Coated Soft Copper Wire for Electrical Purposes 400. ASTM B246 - 05(2010) Standard Specification for Tinned Hard-Drawn and
Medium-Hard-Drawn Copper Wire for Electrical Purposes 401. ASTM B286 - 07(2012) Standard Specification for Copper Conductors for
Use in Hookup Wire for Electronic Equipment 402. ASTM B298 - 12 Standard Specification for Silver-Coated Soft or Annealed
Copper Wire 403. ASTM B355 - 11 Standard Specification for Nickel-Coated Soft or Annealed
Copper Wire 404. QQ-W-343F, Federal Specification: Wire, Electrical, Copper (Uninsulated) (19 Nov 1990)
406. Data Sheet - Kanthal
409. The characterization of the oxygen-free copper wire rod produced with the
Upcast technology - T. Knych, A. Mamala, B. Smyrak, Rudy i Metale Nieelazne, 2007
410. Parameterization of materials characteristic of oxygen free cooper used in
electronics and electrotechnics - T. Knych, B. Smyrak, M. Walkowicz, S. Pabian,
Hutnik Wiadomoci Hutnicze, 2009
411. Research on the influence of the structural state of Cu-ETP wire rod on the
annealing susceptibility of wires - T. Knych, A. Mamala, B. Smyrak, M. Walkowicz,
International Technical Conference Monterrey, Mexico 2010
412. Investigation of the recrystallization temperature of wires made of copper
from ETP and OFC - T. Knych, B. Smyrak, M. Walkowicz, P. Osuch, Rudy i Metale
Nieelazne, 2010
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electronic uses - T. Knych, B. Smyrak, M. Walkowicz, Erzmetall World of Metallurgy:
Internationale Fachzeitschrift fr Metallurgie, 2011
48

414. Dynamic recrystallization of continuous cast copper wire rod and the rapid
tensile test - T. Knych, A. Mamala, B. Smyrak, M. Walkowicz, Wire Journal
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415. Pure Metals Properties: A Scientific-Technical Handbook - A. Buch, ASM
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417. Data Sheet - Cu-ETP C11000, Data Sheet KME 100 - KME
418. Data Sheet - Cu-ETP - Aurubis
419. Data Sheet - C11000 Wieland-K322, Rolled Products - Wieland
420. Data Sheet - Electrolytic Tough Pitch Copper C11000 - NBMMETALS
421. Copper Alloys C11000, Metal Suppliers: Material Property Data 422. Data Sheet - Copper - C11000 - ETP - Little Falls Alloys
423. Data Sheet - Copper No. C11000 - Anchor Bronze & Metals Inc.
424. Effects of trace amounts of impurities on the recrystallization behavior of
high-purity tough-pitch copper - Coutsouradis D., Diderrich E., Smets J., Crocq G.,
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430. ARMY MIL-C-12166: Copper Rod For Crusher Cylinders - 1997
431. ASME SB12: Specification for Copper Rods for Locomotive Staybolts 432. AMS 4500: Copper Sheet, Strip And Plate, Soft Annealed 433. AMS 4701: Copper Brazing Alloy AMS 4701 434. MIL-W-3318A: Wire, Copper; and Wire, Steel, Copperclad 435. MIL-W-6712C: Military Specification, Wire, Metallizing - (3 Oct 1984)
436. ASTM B248 - 12 Standard Specification for General Requirements for
Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar 437. ASTM B 10107 Specification for Lead-coated Copper Sheet and Strip for
Building Construction 438. ASTM B451-93 Specification for Copper Foil, Strip, and Sheet for Printed
49

Circuits and Carrier Tapes - (Withdrawn 1998)

440. QQ B 825 Bus Bar, Copper, Aluminum Or Aluminum Alloy 441. ASTM B250 / B250M - 12 Standard Specification for General Requirements
for Wrought Copper Alloy Wire 442. ASTM B47 - 95a(2012) Standard Specification for Copper Trolley Wire 444. ASTM B174 - 10 Standard Specification for Bunch-Stranded Copper
Conductors for Electrical Conductors 445. ASTM B8 - 11 Standard Specification for Concentric-Lay-Stranded Copper
Conductors, Hard, Medium-Hard, or Soft 446. ASTM B226 - 11 Standard Specification for Cored, Annular, Concentric-LayStranded Copper Conductors 447. ASTM B496 - 04(2010)e1 Standard Specification for Compact Round
Concentric-Lay-Stranded Copper Conductors 448. ASTM B172 - 10 Standard Specification for Rope-Lay-Stranded Copper
Conductors Having Bunch-Stranded Members, for Electrical Conductors 449. ASTM B173 - 10 Standard Specification for Rope-Lay-Stranded Copper
Conductors Having Concentric-Stranded Members, for Electrical Conductors 450. ASTM B229 - 12 Standard Specification for Concentric-Lay-Stranded Copper
and Copper-Clad Steel Composite Conductors 451. WW P 377 Revision D Amendment 1 Pipe, Copper, Seamless, Standard
Sizes - Revision D Amendment 1 452. ASTM B477 - 97(2012) Standard Specification for Gold-Silver-Nickel
Electrical Contact Alloy 453. ASTM B224 - 10 Standard Classification of Coppers 454. ASTM B5 - 11 Standard Specification for High Conductivity Tough-Pitch
Copper Refinery Shapes 455. QQA673 Anode, Plating 456. ASTM B283 / B283M - 12 Standard Specification for Copper and CopperAlloy Die Forgings (Hot-Pressed) 567. AGH-UST - own research - contact person: tknych@agh.edu.pl

50