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Department of Mechanical Engineering, Shiv Nadar University, Gautam Buddha Nagar, India
Department of Mechanical Engineering, IIT Patna, Patna, India
Department of Mechanical and Industrial Engineering, IIT Roorkee, Roorkee, India
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ABSTRACT
Article history:
Received 28 April 2016
Received in revised form 26 July 2016
Accepted 2 August 2016
Available online xxx
This paper presents the three-dimensional interfacial crack growth simulations using coupled finite element and element
free Galerkin (FE-EFG) approach under mechanical and thermo-elastic loading. Extrinsic partition of unity (PU) enrichment technique has been employed to model a crack in the domain. Crack face and crack front have been modelled by
Heaviside and asymptotic branch enrichment functions respectively whereas a material interface has been modelled by a
signed distance function. Modified domain based interaction integral approach has been employed to evaluate the individual stress intensity factors. Standard Paris law of fatigue crack growth has been employed for the life prediction of interfacial cracked geometries. Several interfacial fatigue crack growth problems have been solved by the coupled EF-EFG
approach.
Keywords:
Three-dimensional interfacial crack
growth
Coupled FE-EFG approach
Stress intensity factors
Thermo-elastic loading
1. Introduction
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ARTICLE INFO
fatigue testing of polymer bi-material interfaces under thermo-mechanical load. Pippan and Riemelmoser [60] investigated the plastic
deformation of a crack perpendicular to the material interface under
cyclic mechanical loading. Milan and Bowen [40] predicted the fatigue crack growth of a crack perpendicular to bi-material interface,
and concluded that the elastic-plastic mismatch significantly affects
the fatigue crack growth resistance. Chen et al. [20] modelled the interface failure in hip-implants by finite element approach to predict the
fatigue crack growth using elasto-plastic fracture mechanics. Sukumar et al. [72] developed partition of unity (PU) enrichment technique to model interfacial crack problems. They concluded that the
twelve enrichment functions can accurately capture the oscillatory singular stress at the interfacial crack tip. Rakin et al. [67] investigated
the effect of thermal residual stress in bi-layered structures. Drai et
al. [22] performed the finite element analysis to understand the behaviour of interface cracks in ceramic-metal assemblies under the effect of thermal residual stress. Khandelwal and Kishen [33] computed
the SIFs for an interface crack under thermal loading. Boutabout et
al. [16] studied the effect of thermal and mechanical loading on the
behaviour of sub-interface crack in the ceramic material. They used
finite element formulation to simulate the mixed-mode crack propagation near the interface. Ouinas et al. [49] implemented the finite
element method to understand the interaction effect of micro-cracks
on the major interfacial crack. Mrz and Daliski [42] proposed a
new criterion to determine the angle of crack propagation in bi-material structure under mixed-mode loading. They assumed that the
crack is tough enough to cross the interface during its growth. This
criterion accurately predicts the crack growth in the layered structures. Hu and Yao [30] proposed a new singular finite element to
accurately model the interfacial crack tip. This element does not require any post processing to calculate SIFs. Moslemian et al. [41]
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Dissimilar or layered materials such as ceramic-metal and composite-metal have been widely used in engineering applications for the
purpose of strengthening or lightening of the components. Many modern applications such as thermal barrier coatings of gas turbine engines and space shuttle thermal protection systems can be modelled
as layered materials. The structural performance of the layered materials depends on the mechanical properties and the fracture behaviour of the interface. Unlike the behaviour of homogeneous materials,
abrupt change in properties at the interface is the major source of failure in the layered materials [29]. The presence of flaws such as cracks
or pores can complicate the modelling of the layered materials [69].
These flaws must be taken into account to accurately know the behaviour of the layered materials.
To analyse the behaviour of the materials in the presence of cracks/
flaws, various novel computational techniques have been developed
in past two decades. These include meshfree/particle methods
[62,63,66,79,80,1,45],
extended
finite
element
method
[19,39,78,3537], extended isogeometric analysis [17,12,13,18] and
others [5,6,4,7,2,32,3].
Over the years, a significant amount of work has been reported on
interfacial cracks in two-dimensional domain. Ritchie [69] discussed
the crack growth criterion based on elastic mismatch and critical energy release rate for interfacial cracks. Olsson and Giannakopoulos
[47] developed a closed form solution for interfacial crack geometry
subjected to thermal loading. Gurumurthy et al. [27] performed the
Corresponding author.
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curate tracking of crack front is not easy, and involves lot of complexities. Hence, this research work presents a simple and efficient coupled
FE-EFG approach to model interfacial crack growth under cyclic fatigue loading. In the coupled approach, a small discontinuous region
near the crack is modelled by EFG while the rest of the continuum region is modelled by FE. The EFG method is quite suitable for modelling a discontinuous region whereas FEM is preferred over EFG for
the modelling of homogeneous continuum region since FEM is computationally much more efficient than EFG. Discontinuities due to the
presence of crack and interface are captured through extrinsic partition
of unity (PU) enrichment. In PU enrichment, the standard field variable approximation (i.e. displacement) is enriched through PU. Heaviside step function [26] is used to model a crack, and a signed distance
enrichment function [71] is used for the modelling of the interface.
Stress field singularity at the crack front has been modelled by asymptotic crack front enrichment functions [26]. The SIFs of bi-material interface cracks are numerically evaluated using domain form of interaction integral approach. Level set functions [79] are used for tracking the growing cracks. Crack growth is modelled by successive linear
extensions of crack surface. A curve crack front (for arbitrary shape
crack) is modelled by dividing it into the finite number of spline curve
segments [52,54,57], and the enclosed area of these spline segments
represents a crack surface. In this approach, the crack is not considered a part of the mesh and its presence is ensured by level set and
enrichment functions. Thus, any regular or arbitrary crack front can be
easily modelled by this approach. The main objectives of the present
work are as follows,
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Coupled FE-EFG approach has been extended to simulate three-dimensional interfacial fatigue crack growth problems.
A small region near the interface and crack has been modelled by
extrinsic enriched EFG whereas the rest of domain is modelled by
FE.
The issue of Kronecker delta property in EFG is eliminated by FE,
and essential boundary conditions at the domain boundary are directly imposed at FE nodes.
Remeshing issue near the crack surface is resolved by EFG.
Extrinsic PU enrichment technique is employed to model interface
and crack.
Interfacial crack growth has been modelled including all issues like
logarithmic singularity, material discontinuity and crack kinking
criterion.
Only four enrichment functions are used to model a crack front
which results in huge saving of computational time without compromising on the accuracy of the solution.
An arbitrary shape crack front is modelled by spline segments to
improve the efficiency of the solution.
(3b)
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(1a)
(1b)
(3c)
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(2)
(4b)
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(4a)
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(3a)
(5)
Two types of thermal boundary conditions namely thermal shock and
adiabatic have been considered. In case of thermal shock, uniform
temperature gradient is applied to whole the geometry. Thermal shock
induces discontinuity in displacement field across the crack surface
and jump in strain field across the material interface. Thus, Eq. (5)
has been used to approximate displacement field in interfacial thermal
shock problems whereas for the adiabatic interfacial crack problems,
displacement and temperature fields become discontinuous across the
crack surface and strain field possesses discontinuity along the material interface. Heat flux and stress fields are singular at the crack
front [70,23,77]. Heaviside step function is used to capture temperature jump. The near-tip enrichment is obtained by considering the
leading term of the asymptotic expansion of the temperature field. The
temperature and heat flux asymptotic fields for an adiabatic crack can
be written as,
(6b)
(10)
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(6a)
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(6c)
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(7)
(8)
where
is the signed distance function, and
the level set function, which is defined as,
is
(9)
,
and
are the FE and EFG approximations and
is the ramp function defined as the sum of the FE shape functions associated with interface element nodes on the EFG boundary.
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where
is FE shape function,
is standard EFG shape function and
is coupled FE-EFG shape function.
This coupled approach uses two different approximations within
the domain. In FE and EFG transition region, an effective mathematical treatment is required to maintain consistency and continuity of
the primary variable. Thus, a ramp function is used in the transition
region to maintain the consistency. The displacement (primary variable) approximation in the EFG domain needs to be defined in such
a way that crack growth always lies in the EFG region. In case of
3-D crack growth modelling, computational time is a critical issue. Although, EFG shows better convergence but its use in the entire domain
requires huge CPU time. Therefore, it is advantageous to use EFG
(meshfree) in the selected region near the crack and FEM in rest of the
domain. This ensures accurate modelling of the 3-D crack growth in
the optimum time.
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where
(16)
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(11)
(15)
(12)
After substituting the displacement approximation in Eq. (11), the approximation in transition element is given by
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(13)
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(14)
(17)
where is bi-material constant,
and
are equivalent Youngs
modulus and shear modulus respectively. Special auxiliary field equations for an interfacial crack problems are presented in Appendix A.
(18)
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crack may kink [29] into anyone of the bulk materials depending upon
the loading, boundary condition and material properties. Crack kinking behaviour has been studied for two dissimilar bulk materials without considering the effect of interface material. The kinking criterion
[29] to select a particular bulk material is given as,
(24)
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where
is the energy release rate of a crack at kinked position,
is the energy release rate for crack advance along its interface,
is the critical energy release rate of the bulk material in which
the crack kinks in, and
is referred as the interface toughness.
This kinking criterion has been modified in terms of SIFs. Depending
on crack growth direction ( ), the following expression can be written,
In above equation,
are obtained using Eq. (22). Interface is assumed stronger than both the bulk materials. Therefore, a crack kinks
in any one of the base material based on the modified criterion. Two
ratios Z1 and Z2 are defined as,
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(19)
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where
and
are the values of equivalent SIFs corresponding to maximum (
or
) and minimum (
or
) applied loads. The equivalent SIFs for maximum and minimum applied
load can be calculated by following expression,
(23)
(26)
RE
(20)
(25)
(27)
Numerical value
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3
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of
= 22.52 C and minimum shock load of
= 0 C. All DOFs
associated with the top and bottom faces are constrained which induces the thermo-elastic stress in the cracked geometry. The fatigue
life obtained by Paris law under thermal shock load is presented in Fig.
12 for the interfacial edge and interfacial centre cracks. The fatigue
life of the interfacial edge and centre crack are found as 9308 cycles
and 22,956 cycles respectively.
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Fig. 7. Domain with interfacial edge and centre cracks under mechanical load.
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Fig. 8. Crack growth contour for an interfacial edge crack under cyclic mechanical load (a) domain with crack (b) magnified view of crack growth.
Fig. 9. Crack growth contour for an interfacial centre crack under cyclic mechanical load (a) domain with crack (b) magnified view of crack growth.
edge crack and centre crack problems are simulated by coupled approach under adiabatic thermal load. A body with an interfacial edge
crack of length,
and centre crack of length,
have been taken for the simulations as shown in Fig. 13. A constant
cyclic heat flux has been applied across the crack surface. The top
and bottom faces of interfacial (edge and centre) crack domain are
specified as
and
respectively for maximum cyclic thermal load whereas these specified temperatures become zero for minimum thermal load. In addition to this, the crack
is kept thermally insulated (adiabatic) which creates discontinuity in
the temperature field. Fig. 14 shows a comparison of fatigue life for
interfacial edge and interfacial centre cracks under cyclic adiabatic
thermal load. The fatigue life is found to be 3962 cycles for an inter
facial edge crack whereas the fatigue life is found as 10,391 cycles for
an interfacial centre crack.
3.2.3. Arbitrary shape interfacial crack growth
In this section, arbitrary spline shape crack lying at the interface of
the domain has been simulated by coupled FE-EFG approach. Crack
front has been created by taking 26 arbitrary points at the interface,
which are joined together by splines to form a closed arbitrary shape
crack. The surface enclosed by the arbitrary splines is divided into triangles using Delaunay triangulation scheme. A constant cyclic traction of
and
is applied at the top face
of the domain, whereas the bottom face is constrained in z-direction
as shown in Fig. 15. For SIFs computation, J-domain has been cre
Table 2
Fatigue failure life for interfacial cracks under cyclic mechanical load.
Interfacial crack
Edge crack
Centre crack
XFEM
Coupled FE-EFG
3934
14,039
3877
13,938
3829
13,477
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Fig. 10. A comparison of fatigue life for interfacial edge and centre cracks under mechanical load.
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This work presents three-dimensional interfacial crack growth simulations using coupled FE-EFG approach under mechanical and
thermo-elastic loading. Extrinsic partition of unity enrichment is used
to capture the geometric discontinuities present in the domain. Heaviside and crack tip enrichment functions are used to model a crack
whereas a signed distance function is used to capture the discontinuity due to the presence of bi-material interface. A benchmark problem
has been solved to check accuracy of the coupled approach. In addition to this, interfacial edge, centre and arbitrary shape cracks are simulated under cyclic loading to predict the fatigue life of the interfacial cracked structures. On the basis of the present work, the following
conclusions are drawn,
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ated using 25 arbitrary points along the crack front as shown in Fig.
16. The SIFs are presented in Fig. 17 at the first step of crack growth.
Crack growth direction is evaluated from the values of SIFs. Due
to irregular shape of the crack front, the mode-I and mode-II SIFs
vary along the crack front, whereas mode-III SIF is found constant
(nearly zero) along the crack front. Both thermal shock and adiabatic
loads are imposed on the cracked geometry to predict the fatigue life
and crack growth contours. A maximum load of
and
minimum load of
has been applied over the domain in
4. Conclusions
Fig. 11. Domain with interfacial edge and centre cracks under cyclic thermal shock load.
11
Acknowledgement
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Appendix A
Fig. 12. A comparison of fatigue life for interfacial edge and centre cracks under cyclic
thermal shock load.
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Coupled FE-EFG approach is found quite capable to solve 3-D interfacial crack growth problems under mechanical and thermo-elastic loading.
Arbitrary shape crack is efficiently simulated by the coupled
FE-EFG approach.
Only four crack front enrichment functions are sufficient to model
an interface crack in place of twelve crack front enrichment functions.
Fatigue life of an interfacial edge crack body is found small as compared to the interfacial centre crack body under same loading and
boundary conditions.
Crack gradually moves towards the weak material in case of interfacial crack growth simulations.
Thermal shock loading exhibits more fatigue life as compared to
equivalent mechanical load.
Fig. 13. Domain with interfacial edge and centre cracks under adiabatic loading conditions.
(A1)
(A2)
(A3)
(A4)
(A5)
12
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(A8)
(A9)
(A10)
(A11)
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Fig. 14. A comparison of fatigue life for interfacial edge and centre cracks under adiabatic loading conditions.
(A12)
(A6)
Derivatives of displacement field may be defined as,
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(A7)
Fig. 15. Cuboid with an interfacial arbitrary shape crack under cyclic mechanical load.
(A13)
(A14)
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Fig. 18. Domain with an interfacial arbitrary shape crack under thermal shock load.
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Fig. 17. SIFs variation along J-domain position at initial load step.
(A15)
(A16)
(A17)
Fig. 19. Domain with an interfacial arbitrary shape crack under adiabatic thermal load.
(A18)
(A19)
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Fig. 20. Interfacial arbitrary shape crack growth under cyclic mechanical load.
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(A22)
(A23)
(A24)
(A25)
Fig. 21. Fatigue life of an interfacial arbitrary shape crack under mechanical load.
(A20)
(A21)
(A26)
where R and are polar co-ordinates of evaluation point from crack
front/tip in local co-ordinate system, is shear modulus, is Poisson
ratio and is Kolsov constant will be defined as,
(A27)
A.2. BI-Material
Auxiliary field equations for SIFs evaluation in bi-material interfacial cracked domain [72,48] may be defined in the following ways,
15
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(A30)
(A31)
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Fig. 22. Interfacial arbitrary shape crack growth under cyclic thermal shock load.
(A32)
(A29)
Fig. 23. Fatigue life of an interfacial arbitrary shape crack under thermal shock load.
(A33)
(A28)
(A34)
(A35)
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Fig. 24. Interfacial arbitrary shape crack growth under adiabatic thermal load.
(A40)
(A41)
(A42)
(A43)
(A44)
(A45)
Fig. 25. Fatigue life of an interfacial arbitrary shape crack under adiabatic thermal load.
(A46)
(A36)
(A47)
(A37)
(A48)
(A38)
(A39)
(A49)
Auxiliary derivative of displacement fields are defined as,
17
(A62)
(A50)
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(A63)
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(A51)
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(A52)
(A64)
(A65)
(A53)
(A66)
(A54)
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(A55)
(A67)
(A68)
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(A61)
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