Micro-Electro-Mechanical

Systems

-The Future Technology, but Todays choice

Presented by Vinayak Hegde

Guide: Mrs. Priti M

AIM OF MY PRESENTATION
To familiarize what the MEMS TECHNOLOGY is all about
To explain about Microfabrication Process.
Applications of the MEMS in various fields.

September 13, 2016

Outline of My Presentation
Introduction
Historical Background
(MEMS Evolution)

Preparation Process of MEMS

(Fabrication Process)

Applications of MEMS
(Fields where MEMS Used)

Interrelationship between MEMS and Nano

(Future Scope of MEMS)

Conclusion
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Introduction
What is MEMS Technology?
MEMS technology is based on a number of tools and

methodologies, which are used to form small structures with

dimensions in the micrometer scale
MEMS fabrication approach that conveys the advantages of

miniaturization, multiple components, and microelectronics to the

design and construction of integrated Electromechanical systems

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Introduction

Conti

What are MEMS?

Micro - Small size, microfabricated structures

Electro - Electrical signal /control ( In / Out )
Mechanical - Mechanical functionality (Out/ In )
Systems - Structures, Devices, Systems controls

What is the size of MEMS?

They range in size from the sub micron level to the

millimeter level, and there can be any number, from a few

to millions, in a particular system.
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MEMS Scaling

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Building Blocks In MEMS

How MEMS are prepared?
There are three basic building blocks in MEMS technology.
1. Deposition: The ability to deposit thin films of
material on a substrate.
2. Lithography: To apply a patterned mask on top of
the films by photolithograpic imaging.
3. Etching:
To etch the films selectively to the mask.

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MEMS Deposition Technology

MEMS deposition technology can be classified in two groups:
1.

Depositions that happen because of a chemical reaction:

2.

Chemical Vapor Deposition (CVD)

Electrodeposition
Epitaxy
Thermal oxidation

Depositions that happen because of a physical reaction:

Physical Vapor Deposition (PVD)

Casting

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MEMS Lithography Technology

MEMS lithography technology can be classified in two groups:
1. Pattern Transfer
2. Lithographic Module
a.
b.
c.
d.
e.

Dehydration bake and HMDS prime

Resist spin/spray and Soft bake
Alignment, Exposure
Post exposure bake and Hard bake
Descum

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MEMS Etching Technology

There are two classes of etching process:
1.

Wet etching: The material is dissolved when immersed in a

chemical solution.

2.

Dry etching: The material is sputtered or dissolved using

reactive ions or a vapor phase etchant.

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Microfabrication Process

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Photolithography
Clean wafer : to remove particles on the surface as well as any traces of organic, ionic,
and metallic impurities
Dehydration bake: to drive off the absorbed water on the surface
Coating
Coat wafer with adhesion promoting film
Coat with photoresist
Soft bake : to drive off excess solvent and to promote adhesion
Exposure
Post exposure bake: to suppress standing wave-effect
Develop, Clean, Dry
Hard bake: to harden the PR and improve adhesion to the substrate

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Photolithography

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Additive Processes
Oxidation
Thermal Oxidation of Silicon is done in a furnace in wet or dry conditions

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Additive Processes
Doping
Dopants : N type (Phosphorous, Arsenic), P type (Boron)
Doping Methods
1. Diffusion
Dopants are diffused thermally into the
substrate in furnace at 950 1280 0C.
It is governed by Ficks Laws of Diffusion.

2. Ion Implantation
Dopant ions bombarded into targeting
substrate by high energy.
Ion implantation are able to place any ion at
any depth in sample.
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Additive Processes
Physical Vapor Deposition (PVD)
1. Evaporation
Deposition is achieved by evaporation or
sublimation of heated metal onto substrate.
2. Sputtering
Sputtering is achieved by accelerated inert
ion by DC drive in plasma through potential
gradient to bombard metallic target.
Then the targeting material is sputtered away
and deposited onto substrate placed on
anode.

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Additive Processes
Physical Vapor Deposition (PVD)

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Additive Processes
Chemical Vapor Deposition (CVD)
Materials deposited: Polysilicon, silicon nitride, silicon oxide, silicon carbide etc.
How does CVD Work?
Gaseous reactants are introduced into chamber at elevated temperatures.
Reactant reacts and deposits onto substrate

Types of CVD
LPCVD (Low Pressure CVD),
PECVD (Plasma Enhanced CVD)

Salient Features
CVD results depend on pressure, gas, and temperature
Can be diffusion or reaction limited
Varies from film composition, deposition rate and electrical and mechanical properties
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Subtractive Processes
Dry Etching

Dry Chemical Etching

HF Etching
HF is a powerful etchant and hence, highly dangerous.
XeF2 Etching
2XeF2+Si2Xe+SiF4
Isotropic etching (typically 1-3m/min)
Does not attack aluminum, silicon dioxide, and silicon nitride
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Subtractive Processes
Dry Etching
Plasma Etching

Reaction Mechanism
Produce reactive species in gas-phase
Adsorption, and diffuse over the surface

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Reactive species diffuse to the solid

Reaction Desorption
Diffusion

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Subtractive Processes
Dry Etching
Deep Reactive Ion Etching (DRIE)
A very high-aspect-ratio silicon etch method

DRIE Etched Pillars

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Subtractive Processes
Wet Etching
Isotropic Wet Etching
Isotropic etchants etch in all directions at
nearly the same rate.
Commonly use chemical for Silicon is
HNA (HF/HNO3/Acetic Acid) This results in
a finite amount of undercutting

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Subtractive Processes
Wet Etching
Anisotropic Wet Etching
Anisotropic etchants etch much faster in one
direction than in another.
Etchants are generally Alkali Hydroxides
(KOH, NaOH, CeOH
Reaction :
Silicon (s) + Water + Hydroxide Ions Silicates + Hydrogen

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Metal Patterning

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Surface Micromachining

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MEMS Packaging

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Example:

An insulin pump fabricated by classic MEMS technology

1. Pumping membrane

2. Pumping chamber

3. Inlet

4. Outlet

5. Large mesa

6. Upper glass plate

7. Bottom glass plate

8. patterned thin layer (for improved fluidics)

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MEMS Applications
Micro-engines

Micro Reactors,

Vibrating Wheel

Inertial Sensors Virtual Reality Systems

Accelerometers Airbag Accelerometer
Pressure Sensors Air Pressure Sensors
Optical MEMS
Pill Camera
Fluidic MEMS
-Cartridges for Printers
Bio MEMS
-Blood Pressure Sensors
MEMS Memory Units -Flash Memory
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iPod Touch: Techno

Sensitiveness
The two key elements of

a
MEMS are:
MEMS sensor, the silicon

mechanical
element
which senses the motion;
Interface chip, the IC
which
converts
the
motion measured by the
sensor into an analog or
digital signal.
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Bio MEMS Application

An implantable blood
pressure sensor
developed by
CardioMEMS

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MEMS Memory [Nanochip]

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MEMS driven Storage Devices

TB to PB device capacities
Massively parallel data transfer

rates
Very fast file access times
Improved reliability
Smaller size and weight
Device costs less than today's
devices
Excellent fit for applications to
enterprise
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Future of Magnetic Storage

HAMR-Heat Assisted Magnetic Recording or TAR -Thermally

Assisted Recording
SOMA-Self Organized Magnetic Assemblies; a form of directed
patterned media.
Super high coercivity storage layers (such as FePt) with
stable grain sizes averaging < 2nm.
Super servos for (coarse/fine) tracking and flying height control.

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Advantages and Disadvantages

Minimize energy and materials

use in manufacturing
Cost/performance advantages
Improved reproducibility
Improved accuracy and
reliability
Increased selectivity and
sensitivity

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Farm establishment requires

huge investments
Micro-components are Costly
compare to macro-components
Design includes very much
complex procedures
Prior knowledge is needed to
integrate MEMS devices

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Conclusion
The medical, wireless technology, biotechnology, computer,
automotive and aerospace industries are only a few that will
benefit greatly from MEMS.
This enabling technology promises to create entirely new
categories of products
MEMS will be the indispensable factor for advancing
technology in the 21st century
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References for MEMS

IEEE Explore http://ieeexplore.ieee.org/Xplore/DynWel.jsp
PDF Files http://www.scribd.com/mems/
Introduction to Microengineering
http://www.dbanks.demon.co.uk/ueng/
MEMS Clearinghouse
http://www.memsnet.org/
MEMS Exchange
http://www.mems-exchange.org/
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