Technical Data Sheet for STLA-2835DB TOP LED

Technical Data Sheet
Part Number: STLA-2835DB
0.2W
TOP LED
Working Current @ IF = 60mA
SPECIFICATION
Customer
Type
Customer No.
ERP
ERP No.
APPROVED SIGNATURES
Research & Development Center

APPROVE
CHECK
DRAW
(Version NO.): A
(Release Date): 2012-10-18
This page is only for confirming the part No., for specific data sheet please download from our website at
www.sennikko.jp
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TOP LED
Part No. Description

S
Product Series
L: Lighting
B: Backlight
F: Flashlight
S: Special
Size
Angle
Identification Code
X1 X2 X3 X4 - X5 X6 X7 - X8 X9
Product Info.
Emitting Color
D=Daylight White, N=Nature White,
W=Warm White,
R=Red,G=Green, B=Blue, A=Amber
Power
Product Type
TTOP LED
PPOWER LED
CCERAMIC LED
SSIDE VIEW LED
MMolding
A
COB
COB
COB
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Features
Package Size: 3.5(L) 2.8(W) 0.65 (T) mm
Silicone Packed
Suitable for different working environment
Super long lifetime: 30000HRs
Anti UV
White colors are available in (5000K- 7500K)
Wide viewing angle (21/2=120)
Device Selection Guide

ITEM
Resin
Bonding Wire
Lens Color
Dice
MATERIALS
Silicone
1mil Au
Water Clear
InGaN
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE DEVICES
Applications
Indoor lighting: Fluorescent lamp, tube
Commercial illumination and displays: Advertising

words, light box
Decorative lighting: light strip
Automotive interior auxiliary lighting
Other illumination and displays
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Package Outline Dimensions
Recommended solder pad for MTLA-2835 series

STLA-2835
Note: 1. UNIT: MM [INCH].

2. The tolerances unless mentioned is 0.2 mm.
0.2 mm
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Absolute Maximum Ratings
(Ta=25)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
Forward Current
IF
90
mA
Operating Temperature
Topr
-40 +80
Storage Temperature
Tstg
-40 +80
Soldering Temperature
Tsol
260(for 10 seconds)
Junction Temperature
Tj
115
Power Dissipation
Pd
300
mW
Peak Forward Current
(Duty 1/10 @ 1KHz)
IFP
200
mA
Electro-Optical Characteristics
Parameter
Viewing Angle
Reverse Current
Ta=25
Condition
Symbol
Min.
Typ.
Max.
Unit
21/2
-----
120
------
deg
If=60mA
IR
-----
-----
50
VR=5V
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Bin Code of Luminous Flux

Luminous Flux
Code
Luminous Flux
Range
lm
Color Rendering
Index
Luminous Flux
Code
Luminous Flux Color Rendering

Range
Index
lm
LLM028
24-27
70
LLM024
21-24
80
Note: Tolerance of Luminous Flux is 10%.
Daylight White Bin Code of CIE1931
10%
CIE
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Color coordinates
DB1
DB2
DB3
DC1
DC2
DC3
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
0.3101
0.3029
0.3063
0.3114
0.3025
0.3199
0.3167
0.3146
0.3129
0.3231
0.3091
0.3315
0.3034
0.2913
0.2996
0.2997
0.2958
0.3082
0.3101
0.3029
0.3063
0.3114
0.3025
0.3199
0.3072
0.2828
0.3034
0.2913
0.2996
0.2997
0.3139
0.2945
0.3101
0.3029
0.3063
0.3114
0.3139
0.2945
0.3101
0.3029
0.3063
0.3114
0.3205
0.3061
0.3167
0.3146
0.3129
0.3231
DD1
DD2
DD3
DE1
DE2
DE3
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
0.3234
0.3263
0.3196
0.3347
0.3158
0.3432
0.3301
0.3379
0.3263
0.3464
0.3225
0.3549
0.3167
0.3146
0.3129
0.3231
0.3091
0.3315
0.3234
0.3263
0.3196
0.3347
0.3158
0.3432
0.3205
0.3061
0.3167
0.3146
0.3129
0.3231
0.3272
0.3178
0.3234
0.3263
0.3196
0.3347
0.3272
0.3178
0.3234
0.3263
0.3196
0.3347
0.3339
0.3295
0.3301
0.3379
0.3263
0.3464
DF1
DF2
DF3
DG1
DG2
DG3
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
CIE-x
CIE-y
0.3367
0.3496
0.3329
0.3581
0.3291
0.3665
0.3434
0.3613
0.3396
0.3697
0.3358
0.3782
0.3301
0.3379
0.3263
0.3464
0.3225
0.3549
0.3367
0.3496
0.3329
0.3581
0.3291
0.3665
0.3339
0.3295
0.3301
0.3379
0.3263
0.3464
0.3405
0.3411
0.3367
0.3496
0.3329
0.3581
0.3405
0.3411
0.3367
0.3496
0.3329
0.3581
0.3472
0.3528
0.3434
0.3613
0.3396
0.3697
Note: Tolerance of Color coordinates is 0.01.
xy
0.01
Bin Range of Forward Voltage

Group
Min VF(V)
Max VF(V)
Group
Min VF(V)
Max VF(V)
VF2007
2.8
3.0
VF2010
3.4
3.6
VF2008
3.0
3.2
VF2011
3.6
3.8
VF2009
3.2
3.4
Note:Tolerance of Forward Voltage is 0.1V.
0.1V
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Relative Spectral Power Distributi
Electrical Characteristics
ewing Angle
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Guideline for Soldering

Handing of an SMD LED should be done only when the package has been cooled down to below 40 or
less. This is to prevent SMD LED failures due to thermal-mechanical stress during handing.
1. Hand Soldering
A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the
temperature of the soldering iron under 300 while soldering. Each terminal of the LED is to go for less than
3 second and for one time only.
Be careful because the damage of the product is often started at the time of the hand soldering.
2. Reflow Soldering
Recommended reflow soldering conditionLead-free solder
Note: 1. We recommend the reflow temperature 245(+/-5).The maximum soldering temperature should
be limited to 260
2. Reflow soldering should not be done more than two times.

3. When soldering, do not put stress on the LEDs during heating.
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Test items and results of reliability
Test Item
Test conditions
Test Duration
Sample NO.
Solderability
T=26055Sec
22
Temperature Cycle
-40(30min) ~25
(5min) ~100(30min)
100cycles
50
Ta=1003
1000 hrs
50
Ta=-403
1000 hrs
50
Temperature Humidity Storage
Ta=603,
RH=90%3%
1000 hrs
50
Life Test 1
1
Ta=253,
If=60mA
1000 hrs
22
Life Test 2
2
Ta=253,
If=90mA
1000 hrs
22
Ta=603,
RH=90%3%,
If=60mA
240 hrs
22
High Temperature Storage
Low Temperature Storage
High Temperature Life Test
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Tape and Reel
Note:
1. The number of loaded products in the reel is 4000ea.
2. All dimensions are in millimeters (tolerance: 0.2).
4000pcs
mm,
0.2
3. Scale: None.
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Part Number: STLA-2835DB -
0.2W
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Dry Packaging and Packaging
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Test Circuit
NOTE: All temperatures refer to the topside of the package, measured on the package body surface.
Handling Precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change
(Burn out will happen).
(
2. Cleaning
2.1 When necessary, cleaning should occur only with isopropyl alcohol (IPA) at room temperature (25C)
for a duration of no more than one minute. Dry at room temperature for 15 minutes before use.
(25C)
(IPA)
15
2.2 The influence of ultrasonic cleaning on the SMD LED depends on factors such as ultrasonic power and
the way the SMD LEDs are mounted. Ultrasonic cleaning should be pre-qualified to ensure this will not
cause damage to the SMD LEDs.
SMD LED
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3. Storage
3.1
Dont open moisture proof bag before the products are ready to use.
3.2
Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less.
30( )
3.3
90%( )
After opening the package: The LED's floor life are 24 hours under 30 or less and 70% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
( )
4. Baking
It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions are as
followings:
24
4.1
65 3 x (24hrs) and 5%RH, taped reel type
4.2
100 3 x (4hrs), bulk type
4.3
130 3 x (2hrs), bulk type
5. Operating
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its
characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical
force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED.
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5.1
Handle the component along the side surfaces by using forceps or appropriate tools.
5.2
Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
5.3
Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone
lens or damage the internal circuitry.
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5.4 The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air
leaks. The inner diameter of the nozzle should be as large as possible.
5.5 A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface
during pickup.
5.6 The dimensions of the component must be accurately programmed in the pick-and-place machine to
insure precise pickup and avoid damage during production.
5.7
Users should be cautioned not to stare at the light of this LED product. The bright light can damage
the eye.
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Chemicals Tested as Harmful

In testing, SN has found the
following chemicals to be harmful to the LEDs. SN recommends
not using these chemicals anywhere in an LED system. The fumes from even small amounts of these
chemicals may damage the LEDs.
Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
Methyl acetate or ethyl acetate (i.e., nail polish remover)
Cyanoacrylates (i.e., Superglue)
Glycol ethers (including Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
Formaldehyde or butadiene
bleach
Cleaner spray
activator
thread locker
Sulfurbromideiodine chloride
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ESD Protection During Production

Electric static discharge can result when static-sensitive products come in contact with the operator or
other conductors.
The following procedures may decrease the possibility of ESD damage:
1. Minimize friction between the product and surroundings to avoid static buildup.
2.All production machinery and test instruments must be electrically grounded.
3.Operators must wear anti-static bracelets.
4.Wear anti-static suit when entering work areas with conductive machinery.
5.Set up ESD protection areas using grounded metal plating for component handling.
ESD
6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of
150V or less.
IC
150V
7.Maintain a humidity level of 50% or higher in production areas.

50%
8.Use anti-static packaging for transport and storage.
9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper
functionality.
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Thermal Management
1. Thermal design of the end product is of paramount importance.Please consider the heat generation of the
LED when making he system design. The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board ,as well as
other components. It is necessary to avoid intense heat generation and operate within the maximum ratings
given in this specification.
2. The equation
indicates correlation between Tj and Ta ,and the equation
indicates correlation
between Tj and Ts
Tj = Ta + Rthj-a *W
Tj = Ts + Rthj-s *W
Tj = dice junction temperature: C
Tj =
Ta = ambient temperature:C
Ta =
Ts = solder point temperature:C
Ts=
Rthj-a = heat resistance from dice junction temperature to ambient temperature : C / W
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : C / W
W = inputting power (IFx VF) : W
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Humidity Indicator Card

After the moisture barrier bag is opened, make sure that Humidity Indicator Card does not become red at
30%RH. Otherwise, Devices require baking again under below conditions.
65 3 x (24hrs) and 5%RH, taped reel type
65 3 x (24hrs) and 5%RH,
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Technical Data Sheet

Part Number: STLA-2835DB

Working Current @ IF = 60mA

Research & Development Center