Cypress Product Roadmap Public 001-89435 - 0L

Cypress Product
Roadmap
Q3 2016
Document No. 001-89435 Rev. *L
Roadmap Slide Index

Page
Topic
PSoC and MCU Portfolio
30
CapSense Controllers
41
USB Controllers
53
Wireless Solutions for The IoT
101
Modules
115
Asynchronous SRAM
120
Synchronous SRAM
123
Nonvolatile RAM
129
Timing Solutions
132
Specialty Memory
134
Flash Memory
156
Military Memory
167
Aerospace Memory
171
Energy Harvesting PMIC
178
Automotive Products

8-Bit
32-Bit ARM
Cortex-M0/M0+
32-Bit ARM
Cortex-M3
32-Bit ARM
Cortex-M4
32-Bit ARM
Cortex-M7
High Analog Integration
Ultra-Low-Power
8-/16-Bit Replacement
Mid-Range
Performance
High Performance
Next Generation
Analog and Digital Integration
Programmable System-on-Chip (PSoC) is the worlds only programmable embedded

system-on-chip integrating an MCU core, PABs1, PDBs2, programmable interconnect
and routing, and CapSense capacitive sensing
Flexible MCU (FM) is a portfolio of high-performance ARM Cortex-M-based
MCUs for industrial and consumer applications
PSoC 5LP
Cortex-M3
80 MHz, 256KB Flash
20 PAB1, 30 PDB2, 72 I/Os
PSoC 3
8051 CPU
67 MHz, 64KB Flash
Up to 19 PAB1, 30 PDB2, 72 I/Os
PSoC 1
M8C CPU
24 MHz, 32KB Flash
16 PAB1, 16 PDB2, 64 I/Os
8FX
8-bit RISC MCU
16 MHz, 32-50KB Flash
PSoC 4
Cortex-M0
48 MHz, 256KB Flash
PSoC 7
Cortex-M7
NDA Required, Contact Sales
PSoC 6
Cortex-M4 and Cortex-M0+
FM4-LP MCUs
FM4 MCUs
Cortex-M4
200 MHz, 2MB Flash, 190 I/Os
FM3 MCUs
Cortex-M3
144 MHz, 1.5MB Flash, 154 I/Os
PSoC Analog Coprocessor

CY8C4Axx
48 MHz, 32KB Flash
FM0+ MCUs
Cortex-M0+
40 MHz, 512KB Flash, 102 I/Os
Production Sampling Development Concept
A programmable analog block that is configured using PSoC software to create analog front ends, signal conditioning circuits
with opamps and filters
2 A programmable digital block that is configured using PSoC software to implement custom digital peripherals and glue logic
FM7 MCUs
Cortex-M7
Status
Availability
QQYY
QQYY
FM4 MCU Portfolio

ARM Cortex-M4
High Performance
S6E2D-Series
160 MHz, 540 CoreMark, 2.7-3.6 V,
2M/36K1, 512KB Video RAM,
120/176 Pins
NEW
S6E2G-Series
180 MHz, 608 CoreMark, 2.7-5.5 V,
1M/192K1, 144/176 Pins
Flash
MB9BFx6xM/N/R-Series
160 MHz, 540 CoreMark, 2.7-5.5 V,
1M/128K1, 32KB Work Flash2,
80/100/120 Pins
S6E2C-Series
200 MHz, 675 CoreMark, 2.7-5.5 V,
2M/256K1, 144/176/216 Pins
NEW
S6E2H-Series
160 MHz, 540 CoreMark, 2.7-5.5 V,
512K/64K1, 32KB Work Flash2,
80/100/120 Pins
MB9BFx6xK/L-Series
160 MHz, 540 CoreMark, 2.7-5.5 V,
48/64 Pins
CPU Speed

1
Flash KB/SRAM KB
Independent flash memory available to store data or additional firmware
Status
Availability
QQYY
QQYY
PSoC 5LP Portfolio
CPU Speed and Flash
ARM Cortex-M3 | CapSense | DMA | LCD | RTC | Timer/Counter/PWM

Programmable Digital
PSoC 5200
Intelligent Analog
PSoC 5400
Performance Analog
PSoC 5600
Precision Analog
PSoC 5800
Analog: 1x ADC1, 1x DAC2, 2x CMP3,

0.9% Vref
Interfaces: USB, FF4 I2C

2x Opamps, 2x SC/CT PAB5,
0.9% Vref

4x Opamps, DFB6, 4x SC/CT PAB5,
0.9% Vref
Interfaces: USB, FF4 I2C, CAN7
Analog: 2x/3x ADC1, 4x DAC2,

4x CMP3, 4x Opamps, DFB6,
4x SC/CT PAB5, 0.1% Vref
Interfaces: USB, FF4 I2C, CAN7
CY8C5288
80 MHz, 256K/64K/2K8
12b SAR ADC1
24x UDB9, 99-CSP10
CY8C5488
80 MHz, 256K/64K/2K8
12b SAR ADC1
24x UDB9, 99-CSP10
CY8C5688
80 MHz, 256K/64K/2K8
2x 12b SAR ADC1
24x UDB9, 99-CSP10
CY8C5888
80 MHz, 256K/64K/2K8
20b ADC11, 2x 12b SAR ADC1
24x UDB9, 99-CSP10
CY8C5268
67 MHz, 256K/64K/2K8
12b SAR ADC1
24x UDB9
CY8C5468
67 MHz, 256K/64K/2K8
12b SAR ADC1
24x UDB9
CY8C5668
67 MHz, 256K/64K/2K8
12b ADC11, 12b SAR/2x 12b SAR ADC1
24x UDB9
CY8C5868
67 MHz, 256K/64K/2K8
20b ADC10, 2x 12b SAR ADC1
24x UDB9
CY8C5267
67 MHz, 128K/32K/2K8
12b SAR ADC1
24x UDB9
CY8C5467
67 MHz, 128K/32K/2K8
12b SAR ADC1
24x UDB9
CY8C5667
67 MHz, 128K/32K/2K8
12b ADC11, 12b SAR/2x 12b SAR ADC1
24x UDB9
CY8C5867
67 MHz, 128K/32K/2K8
20b ADC11, 12b SAR ADC1
24x UDB9
CY8C5266
67 MHz, 64K/16K/2K9
12b SAR ADC1
20x UDB10
CY8C5466
67 MHz, 64K/16K/2K8
12b SAR ADC1
20x UDB9
CY8C5666
67 MHz, 64K/16K/2K8
20x UDB9
CY8C5866
67 MHz, 64K/16K/2K8
20x UDB9
CY8C5265
67 MHz, 32K/8K/2K8
12b SAR ADC1
20x UDB9
CY8C5465
67 MHz, 32K/8K/2K8
12b SAR ADC1
20x UDB9
Analog-to-digital converter
Digital-to-analog converter
3 Comparator
Fixed function
Switched capacitor/continuous time
programmable analog block
10
Digital filter block

Controller area network
8 Flash KB/SRAM KB/EEPROM KB
Universal digital block

Chip-scale package
11 Delta-Sigma ADC

Status
Availability
QQYY
QQYY
FM3 MCU Portfolio

ARM Cortex-M3
Midrange Performance
MB9BFx2xS/T-Series
60 MHz, 2.7-5.5 V,
1.5M/192K1, 64KB Work Flash2,
144/176 Pins
MB9BFx1xS/T-Series
144 MHz, 2.7-5.5 V,
1M/128K1, 144/176 Pins
MB9BFx1xN/R-Series
144 MHz, 2.7-5.5 V,
100/120 Pins
MB9AFx2xK/L-Series
40 MHz, 2.7-5.5 V,
512K/32K1, 80/100 Pins
MB9AFx5xM/N/R-Series
40 MHz, 1.7-3.6 V,
80/100/120 Pins
Flash
MB9AFx4xL/M/N-Series
40 MHz, 1.7-3.6 V,
64/80/100 Pins
MB9AFx3xK/L-Series
20 MHz, 1.8-5.5 V,
128K/8K1, 48/64 Pins
MB9AFx1xL/M/N-Series
40 MHz, 2.7-5.5 V,
256K/32K1, 64/80/100 Pins
MB9AFxAxL/M/N-Series
20 MHz, 1.8-5.5 V,
128K/16K1, 64/80/100 Pins
MB9AFx1xK-Series
40 MHz, 2.7-5.5 V,
48 Pins
MB9BFx2xK/L/M-Series
72 MHz, 2.7-5.5 V,
48/64/80 Pins
MB9AFx2xK/L-Series
40 MHz, 2.7-5.5 V,
64K/4K1, 48/64 Pins
MB9BF121J-Series
72 MHz, 2.7-5.5 V,
64K/8K1, 32 Pins
CPU Speed
1
Flash KB/SRAM KB
Status
Availability
QQYY
QQYY
PSoC 4 Portfolio
ARM Cortex-M0/M0+ | CapSense | Timer/Counter/PWM
PSoC MCU
PSoC 4000
Intelligent Analog
PSoC 4100
BL = BLE-Series
PSoC 4200
S = S-Series
M = M-Series
NEW
NEW
NEW
CY8C4128-BL
24-MHz M0, 256K/32K1,
CMP2, Opamp, ADC3, SCB4,
IDAC5, BLE6
CY8C4248-L
48-MHz M0, 256K/32K1,
IDAC5, UDB7, CAN8, USB
CY8C4248-BL
48-MHz M0, 256K/32K1,
IDAC5, BLE6, UDB7
NEW
NEW
CY8C4247-L
48-MHz M0, 128K/16K1,
CY8C4247-BL
48-MHz M0, 128K/16K1,
IDAC5, BLE6, UDB7
NEW
CY8C4127-M
24-MHz M0, 128K/16K1,
IDAC5
CY8C4127-BL
24-MHz M0, 128K/16K1,
IDAC5, BLE6
NEW
Flash
CY8C4126-M
24-MHz M0, 64K/8K1,
CMP2, Opamp, ADC3,
SCB4, IDAC5
NEW
CY8C4125
24-MHz M0, 32K/4K1,
2
CMP , Opamp, ADC3,
SCB4, IDAC5
NEW
CY8C4124
24-MHz M0, 16K/4K1,
2
CMP , Opamp, ADC3,
SCB4, IDAC5
NEW
CY8C4246-M
48-MHz M0, 64K/8K1,
CMP2, Opamp, ADC3,
SCB4, IDAC5, UDB7
CY8C4246-L
48-MHz M0, 64K/8K1,
Q316
CY8C4125-S
24-MHz M0+, 32K/4K1,
2
CMP , Opamp, ADC3, SCB4,
IDAC5, Smart I/O9
NEW
CY8C4024-S
24-MHz M0+, 16K/2K1,
CMP2, ADC3, SCB4,
IDAC5, Smart I/O9
CY8C4247-M
48-MHz M0, 128K/16K1,
IDAC5, UDB7, CAN8
Q316
CY8C4146-S
48-MHz M0+, 64K/8K1,
CMP2, Opamp, ADC3,
SCB4, IDAC5, Smart I/O9
NEW
CY8C4045-S
48-MHz M0+, 32K/4K1,
CMP2, ADC3, SCB4,
IDAC5, Smart I/O9
L = L-Series
CY8C4245
48-MHz M0, 32K/4K1,
2
CMP , Opamp, ADC3,
SCB4, IDAC5, UDB7
Q316
CY8C4124-S
24-MHz M0+, 16K/4K1,
CMP2, Opamp, ADC3,
SCB4, IDAC5, Smart I/O9
CY8C4244
48-MHz M0, 16K/4K1,
CMP2, Opamp, ADC3,
SCB4, IDAC5, UDB7
CY8C4014
16-MHz M0, 16K/2K1,
CMP2, I2C, IDAC5
1 Flash
KB/SRAM KB
2 Comparator
3 Analog-to-digital
converter
4 Serial
7 Universal
5 Current-output
8 Controller
communication block
DAC
6 Bluetooth Low Energy
digital block
area network
9 Embedded programmable digital logic in the I/O subsystem

Status
Availability
QQYY
QQYY
FM0+ MCU Portfolio

ARM Cortex-M0+
Ultra-Low-Power 8-Bit/16-Bit Replacement
NEW
Q416
S6E1B-Series
40 MHz, 1.7-3.6 V,
80/100/120 Pins, 65 A/MHz3
Flash
S6E1x-Series
48 MHz, 2.2-5.5 V,
Concept Only, Contact Sales
NEW
S6E1C-Series
40 MHz, 1.7-3.6 V,
128K/16K1, 26/32/48/64 Pins , 40 A/MHz3
S6E1A-Series
40 MHz, 2.7-5.5 V,
88K/6K1, 32/48 Pins, 70 A/MHz3
CPU Speed
Flash KB/SRAM KB
3 Active power consumption
2

Status
Availability
QQYY
QQYY
PSoC 3 Portfolio
8051 CPU | CapSense | DMA | LCD | RTC | Timer/Counter/PWM
PSoC 3200
Intelligent Analog
PSoC 3400
Performance Analog
PSoC 3600
Precision Analog
PSoC 3800
Analog: ADC1, 1x DAC2, 2x CMP3,

0.9% Vref
Analog: ADC1, 2x DAC2, 4x CMP3,

2x Opamps, 2x SC/CT PAB5,
0.9% Vref
Interfaces: FF4 I2C
Analog: ADC1, 2x/4x DAC2,

0x/2x/4x CMP3, 0x/2x/4x Opamps,
0x/2x/4x SC/CT PAB5, 0.1% Vref
Analog: ADC1, 2x/4x DAC2,

0x/2x/4x CMP3, 0x/2x/4x Opamps,
0x/2x/4x SC/CT PAB5, 0.1% Vref
CY8C3666
67 MHz, 64K/8K/2K6
0x/1x DFB7, 12b ADC1
20x/24x UDB8, CAN9
CY8C3866
67 MHz, 64K/8K/2K6
DFB7, 20b ADC1
20x/24x UDB8, CAN9, 72-CSP10
CY8C3665
67 MHz, 32K/4-8K/1K6
16x/20x UDB8, 72-CSP10
CY8C3865
67 MHz, 32K/4-8K/1K6
16x/20x UDB8
CPU Speed and Flash
Interfaces: FF4 I2C
CY8C3246
50 MHz, 64K/8K/2K6
12b ADC1
24x UDB8, USB, 72-CSP10
CY8C3446
50 MHz, 64K/8K/2K6
12b ADC1
24x UDB8, USB, CAN9
CY8C3245
50 MHz, 32K/4K/1K6
12b ADC1
20x UDB8, USB, 72-CSP10
CY8C3445
50 MHz, 32K/4K/1K10
12b ADC1
20x UDB8, USB
CY8C3244
50 MHz, 16K/2K/0.5K6
12b ADC1
16x UDB8
CY8C3444
50 MHz, 16K/2K/0.5K6
12b ADC1
16x UDB8
Delta-Sigma analog-to-digital converter

Digital-to-analog converter
3 Comparator
Fixed function
Switched capacitor/continuous
time programmable analog block
10
Flash KB/SRAM KB/EEPROM KB

Digital filter block
8 Universal digital block
Controller area network

Chip-scale package
Status
10
QQYY
QQYY
Availability
10
PSoC 1 Portfolio
M8C CPU | 24 MHz
PSoC MCU
Intelligent Analog
Performance Analog
CY8C29xxx
32K/2K1, 64 GPIOs2
CapSense, 16x PDB3, 4x CMP4,
1x14-bit 5 ADC, 12x SC/CT PAB6
CY8C27xxx
32K/2K1, 44 GPIOs2
CY8C24x93
32K/2K1, 36 GPIOs2
2x CMP4, 1x10-bit Incremental ADC
CY8C24x94
16K/1K1, 56 GPIOs2
2x14-bit SAR7 ADC, 6x SC/CT PAB6
CY8C28xxx
16K/1K1, 44 GPIOs2
Flash
CY8C2xx45
16K/1K1, 38 GPIOs2
1x10-bit SAR7 ADC, 6x SC/CT PAB6
CY8C21x34
8K/0.5K1 , 28 GPIOs2
CapSense, 4x PDB3 , 2x CMP4,
1x10-bit Single-Slope ADC, 4x SC/CT PAB6
CY8C23x33
8K/0.25K1, 26 GPIOs2
1x 8-bit SAR7 ADC, 4x SC/CT PAB6
CY8C21x23
4K/0.25K1, 16 GPIOs2
4x PDB3, 2x CMP4,
1x10-bit Single-Slope ADC, 4x SC/CT PAB6
2 General-purpose
Flash KB/SRAM KB
input/output pins
3 Programmable digital block
CY8C24x23
4K/0.25K1, 24 GPIOs2
7 Successive approximation register ADC

Comparator
Delta-Sigma ADC
6 Switched capacitor/continuous time programmable analog block

Status
Availability
QQYY
QQYY
11
8FX MCU Portfolio

8-Bit RISC CPU
CPU Speed and Flash
8-/16-Pin
20-Pin
24-Pin
32-Pin
48-/52-Pin
MB95690K
16 MHz, 2.8-5.5 V
56/2/41
MB95650L
16 MHz, 1.8-5.5 V,
32/1/41
MB95580H
16 MHz, 2.4-5.5 V,
16/0.5/41
64-Pin
80-Pin
MB95810K
16 MHz, 2.8-5.5 V
56/2/41
MB95710M
16 MHz, 1.8-5.5 V
56/2/41
MB95770M
16 MHz, 1.8-5.5 V
56/2/41
MB95630H
16 MHz, 2.4-5.5 V
32/1/41
MB95610H
16 MHz, 2.4-5.5 V
32/1/41
MB95560H
16 MHz, 2.4-5.5 V,
16/0.5/41
MB95570H
16 MHz, 2.4-5.5 V,
16/0.5/41

1
Flash KB/SRAM KB/work flash KB; work flash is independent flash memory available to store data or additional firmware
Status
Availability
QQYY
QQYY
12
PSoC 4000 S-Series

PSoC MCU Family
Applications
Consumer devices (wearable, mobile, personal care)
Small home appliances (coffee machine, juicer)
Block Diagram
PSoC 4 One-Chip Solution
MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Smart
I/O4
Features
32-Bit MCU Subsystem
48-MHz ARM Cortex-M0+ CPU
Up to 32KB flash, 4KB SRAM
Real-time clock capability with a WCO1
Programmable Analog Blocks
One 10-bit, 46.8-ksps single-slope ADC2
Two low-power comparators (CMP)
One CapSense block that supports low-power operation and
mutual-capacitance sensing
Two 7-bit IDACs3 configurable as a single 8-bit IDAC
Programmable Digital Blocks
Five 16-bit timer, counter, PWM (TCPWM) blocks
Two serial communication blocks (SCBs) that are configurable
as I2C, SPI or UART
Packages
25-ball WLCSP, 24-pin QFN, 32-pin QFN, 48-pin TQFP
Up to 36 GPIOs, including 16 Smart I/Os4
Collateral
Datasheet:
Flash
(16KB to 32KB)
SRAM
(2KB to 4KB)
CMP
x2
7-bit IDAC3
x2
Single-Slope
ADC2
CapSense
Blocks
WCO1
TCPWM x5
Serial Wire Debug
SCB x2
Programmable Interconnect and Routing
48 MHz
Advanced High-Performance Bus (AHB)
Cortex-M0+
GPIO x8
Smart
I/O4
GPIOx8
GPIO x8
GPIO x4
Availability
PSoC 4000S
Production:
1 Watch
3 Current
4 Embedded
crystal oscillator
A simple ADC used to measure slow-moving signals
Now
output digital-to-analog converter

programmable digital logic in the I/O subsystem
13
PSoC 4100 S-Series

Intelligent Analog Family
Applications
Block Diagram
Home appliances (washing machine, dishwasher)

Industrial applications

MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Features
Collateral
48 MHz
Flash
(16KB to 64KB)
SRAM
(4KB to 8KB)
CMP
x2
7-bit IDAC5
x2
Single-Slope
ADC3
CapSense
Blocks
WCO1
TCPWM x5
Serial Wire Debug
SCB x3
Cortex-M0+
GPIO x8
Smart
I/O6
GPIOx8
GPIO x8
GPIO x4
Sampling:
Production:
1 Watch
3A
4 Programmable
Smart
I/O6
SAR2 ADC
Availability
Datasheet: PSoC 4100S

crystal oscillator
Successive approximation register
Opamp
x2

Up to 64KB flash, 8KB SRAM
One 12-bit, 1-Msps SAR2 ADC
One 10-bit, 46.8-ksps single-slope ADC3
Two opamps configurable as PGAs4, comparators, etc.
One CapSense block that supports low-power operation with
self- and mutual-capacitance sensing
Three serial communication blocks (SCBs) that are configurable
as I2C, SPI or UART
Packages
simple ADC used to measure slow-moving signals

gain amplifier
Now
September 2016
5 Current
6

Embedded programmable digital logic in the I/O subsystem
14
PSoC 4100 BLE-Series

Intelligent Analog Family with Bluetooth Low Energy
Applications
Block Diagram
Sports and fitness monitors, wearable electronics, medical

devices, home automation solutions, game controllers, sensorbased low-power systems for the Internet of Things (IoT)
PSoC 4 BLE One-Chip Solution
Features
Collateral
Analog front end(s)

BLE System
Flash
(128KB to 256KB)
SRAM
(16KB to 32KB)
24 MHz
Serial Wire Debug
CMP
x2
I/O Subsystem
GPIO x8
SAR2
ADC
CSD
Blocks
TCPWM3 x4
SCB4 x2
GPIO x8
GPIO x8
GPIO x8
Segment LCD Drive

GPIO x4
Availability
Datasheet: PSoC 4 BLE (CY8C4XX7 BLE)

2
Opamp
x4
Cortex-M0
32-bit MCU subsystem

24-MHz ARM Cortex-M0 CPU
Up to 256KB Flash and 32KB SRAM
Programmable AFE1
Four opamps, configurable as PGAs, comparators, filters, etc.
CapSense with SmartSense Auto-tuning
Industrys No. 1 capacitive-sensing solution with one Capacitive
Sigma-Delta (CSD) controller with touchpad capability
Programmable digital logic
Four configurable TCPWM3 blocks: 16-bit timer, counter or PWM
Two configurable serial communication blocks (SCBs4):
I2C master or slave, SPI master or slave, or UART
Packages
56-pin QFN, 68-pin CSP
Bluetooth connectivity with Bluetooth 4.1 or Bluetooth 4.25
Royalty-free stack and GUI-based Component to configure profiles
2.4-GHz BLE radio with integrated balun
Programmable Analog
Blocks
MCU Subsystem
3 Timer,
4 Serial
Production:
counter, PWM block

communication block programmable as I2C/SPI/UART
Now
5 Bluetooth
4.2 is only available in the 256KB flash option device
15

Programmable Digital Family with Bluetooth Low Energy
Applications
Block Diagram
Features
Collateral
Analog front end(s)

Programmable Analog
Blocks
Opamp
x4
BLE System
Flash
(128KB to 256KB)
SRAM
(16KB to 32KB)
48 MHz
CMP
x2
I/O Subsystem
GPIO x8
SAR2
ADC
CSD
Blocks
UDB3 x4
TCPWM4 x4
SCB5 x2
GPIO x8
GPIO x8
GPIO x8
Segment LCD Drive

Serial Wire Debug
GPIO x4
Availability

2
MCU Subsystem
Cortex-M0

48-MHz Cortex-M0 with up to 256KB flash and 32KB SRAM
Programmable AFE1
Four universal digital blocks (UDBs3): custom digital peripherals
Packages

3
4

Timer/counter/PWM block
Production:
5
6
Now
Serial communication block programmable as I2C/SPI/UART

Bluetooth 4.2 is only available in the 256KB flash option device
16
PSoC 4100 M-Series

Applications
Block Diagram
User interface and host processor for home appliances

Digital and analog sensor hub
MCU and discrete analog replacement

MCU Subsystem
Programmable Analog
Blocks
GPIO x8
SAR1
ADC
Opamp
x4
Features
24-MHz ARM Cortex-M0 CPU with a DMA controller and RTC
Cypress Capacitive Sigma-Delta (CSD) controller
CapSense supported on up to 55 pins
Two comparators (CMP)
Four opamps, programmed as PGAs, CMPs, filters, etc.
Four IDACs2 (2x 8-bit, 2x 7-bit)
Eight programmable 16-bit TCPWM3 blocks
Four SCBs4: I2C master or slave, SPI master or slave, or UART
Packages: 48-pin LQFP, 64-pin TQFP (0.8-mm pitch),
64-pin TQFP (0.5-mm pitch), 68-pin QFN
GPIO x8
Flash
(64KB to 128KB)
SRAM
(8KB to 16KB)
Serial Wire Debug
CMP
x2
CSD
8-bit
IDAC2
x2
7-bit
IDAC2
x2
Blocks
TCPWM3 x8
24 MHz
Cortex-M0
GPIO x8
GPIO x8
GPIO x8
SCB4 x4
GPIO x8
Segment LCD Drive
GPIO x7
RTC
DMA
Collateral
Datasheet:
I/O Subsystem
Availability
Production:
PSoC 4 M-Series (CY8C4100)
1 Successive
approximation register
Current-output digital-to-analog converter
Now
Timer/counter/PWM block
17
PSoC 4200 M-Series

Programmable Digital Family
Applications
Block Diagram

LED control and communication for lighting systems

MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Features
Collateral
GPIO x8
48 MHz
Flash
(64KB to 128KB)
SRAM
(8KB to 16KB)
Serial Wire Debug
CAN x2
CMP
x2
CSD
8-bit
IDAC2
x2
7-bit
IDAC2
x2
Blocks
UDB3 x4
TCPWM4 x8
Cortex-M0

Two controller area network (CAN) controllers
Datasheet:
SAR1
ADC
Opamp
x4
GPIO x8
GPIO x8
GPIO x8
GPIO x8
RTC
SCB5 x4
DMA
Segment LCD Drive
GPIO x7
Availability
Production:
1 Successive

Timer/counter/PWM
Now
5 Serial
18
PSoC 4200 L-Series

Block Diagram
Applications

MCU Subsystem
Programmable Analog
Blocks
Opamp
x4
SAR2
CMP
x6
CSD
x2
8-bit
IDAC3
x2
7-bit
IDAC3
x2
I/O Subsystem
GPIO x8
GPIO x8
ADC
Features
Cortex-M0
Flash
(64KB to 256KB)
SRAM
(8KB to 32KB)
Serial Wire Debug
CAN x2
Full-Speed
USB 2.0
RTC1
DMA
Collateral
Datasheet:
1 Real-time
Blocks
UDB x8
TCPWM4 x8
48 MHz
GPIO x8
32-bit MCU Subsystem

48-MHz ARM Cortex-M0 CPU with a DMA controller and RTC1
Up to 256KB flash and 32KB SRAM
Up to 98 GPIOs supporting analog and digital interfaces
CapSense With SmartSense Auto-tuning
Two Cypress Capacitive Sigma-Delta (CSD) controllers
Two comparators (CMPs)
Four opamps, configurable as PGAs, CMPs, filters, etc.
Eight universal digital blocks (UDBs): custom digital peripherals
Eight configurable 16-bit TCPWM4 blocks
Full-Speed USB 2.0 Controller and Transceiver
Two Controller Area Network (CAN) Controllers
Packages: 48-pin TQFP,64-pin TQFP,68-pin QFN,124-pin
VFBGA
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
SCB5
x4
GPIO x8
Segment LCD Drive
GPIO x4
Availability
Production:
PSoC 4 L-Series
clock
2 Successive
3
4

Timer, counter, PWM
Now
19

Block Diagram
Applications
Industrial sensors (photoelectric sensors, displacement sensors)
Instrumentation and measurement (photometers, pH meters)
Consumer products (wearables, grooming products)


One universal analog block (UAB) configurable as a:
Programmable analog filter or
14-bit Delta-Sigma ADC or
12-bit VDAC1
Four opamps, configurable as PGAs, comparators, TIAs, etc.
One 10-bit single-slope3 ADC
38-channel analog multiplexer (AMUX)
One CapSense block configurable as a:
Capacitive-sensing controller or
IDACs4 (2x 7-bit) or
38 GPIOs
Opamp
x4
10-bit
Single-slope3
ADC
CMP
x2
Universal Analog Block

14-bit
DeltaSigma
AMUX
x38
12-bit
VDAC1
CapSense
7-bit
IDAC4
Analog
Filter
7-bit
IDAC4
Signal Processing Engine

Flash
(16KB to 32KB)
Cortex-M0+
48 MHz
SRAM
(2KB to 4KB)
DMA
TCPWM6 x8
WCO5
SCB7 x3
Signal Processing Engine

48-MHz ARM Cortex -M0+ with a DMA controller and WCO5
Eight 16-bit TCPWM6 blocks
Three SCBs7: configurable as I2C, SPI or UART
GPIO
x8
12-bit
SAR2
Features
I/O Subsystem
GPIO
x8
GPIO
x8
GPIO
x8
GPIO
x6
Packages: 28-pin SSOP, 45-pin CSP, 48-pin QFN, 48-pin TQFP
Availability
Collateral
Preliminary Datasheet:
Sampling:
Production:
Contact Sales
4 Current-output
5 Watch
Voltage-output DAC
3 A simple ADC used to measure slow-moving signals
Now
Q4 2016
DAC
crystal oscillator
6 Configurable as various timers, counters, PWMs or quadrature decoders
7 Serial
communication block
20
S6E1B-Series
FM0+ MCU Portfolio
Block Diagram
Industrial, M2M connectivity, healthcare, consumer electronics,

sensor hubs, metering and point-of-sale equipment
MCU Subsystem
Features
Cortex-M0+
40 MHz
Ultra-Low Power MCU Subsystem

Up to 40-MHz ARM Cortex-M0+ CPU
65-A/MHz active current with 1.65-V to 3.6-V operating voltage
Ultra-low-power 0.6-A real-time clock (RTC) operating current
Up to 512KB flash and 64KB SRAM with 32KB work Flash1
Near-zero wait-state flash access at up to 40 MHz
Fast 540-s startup from power-on reset and 40 s from standby
MFT
MFS x8
PPG x3
USB
(Host + Device)
GPIO x16
GPIO x15
SRAM
(32KB to 64KB)
LVD4
DSTC5
Internal Main
Oscillator
Clock Supervisor
GPIO x9
Dual Timer
GPIO x16
RTC
I2S
Watch Counter
HDMI3 x2
Smart Card x2
WDT6
CRC2
Pin Relocation
Flash
(304KB to 512KB)
GPIO x14
GPIO x12
GPIO x9
Crypto Assist
GPIO x5
Analog Subsystem
12-bit ADC
LCD Drive
Serial Wire
Debug
Packages: 80-pin LQFP, 100-pin LQFP, 120-pin LQFP,

96-pin BGA, 80-pin CSP (4.35 mm x 6.5 mm)
Datasheet:
I/O Subsystem
Base Timer x8
Analog and Digital Subsystems

Multi-function timer (MFT), 3 programmable pulse generators
(PPG), 8 base timers, dual timer, CRC2 and watch counter
8 channels of multi-function serial (MFS) interfaces configurable
as SPI, UART, I2C or LIN
USB, Inter-IC sound (I2S), 2 HDMI-CEC3 channels, 2 Smart Card
interface channels
12-bit, 1-Msps ADC with a 24-channel multiplexer input
LCD drive with support for up to 44 segments or 8 common outputs
Built-in cryptographic assist hardware coprocessor for encryption
Collateral
Digital Subsystem
Applications
GPIO x3
GPIO x3
Availability
S6E1B3-Series, S6E1B8-Series
Sampling: Now
Independent Flash memory available to store data or additional firmware

Cyclical redundancy check
3 HDMI consumer electronics control signal
Production: Q4 2016
Low-voltage detect
Descriptor system transfer controller
6 Watchdog timer
21
S6E1C-Series
FM0+ MCU Portfolio
Applications
Block Diagram
Industrial, healthcare, sensor hubs, wearable electronics and

mobile, battery-powered devices
MCU Subsystem
Digital Subsystem
I/O Subsystem
MFS x6
Features
LVD3
DSTC4
Internal Main
Oscillator
Clock Supervisor
Dual Timer
GPIO x3
GPIO x12
RTC
I2S
Watch Counter
HDMI2 x2
Smart Card
WDT5
Pin Relocation
SRAM
(12KB to 16KB)
Flash
(64KB to 128KB)
Packages: 32-pin LQFP, 48-pin LQFP, 64-pin LQFP, 32-pin QFN,

48-pin QFN, 26-pin CSP (2.35mm x 2.72mm)
Datasheet:
GPIO x12
Base Timer x8

8 base timers, dual timer, CRC1 and watch counter
USB, Inter-IC sound (I2S), 2 HDMI-CEC2 channels, 2 Smart Card
interface channels
12-bit, 1-Msps ADC with a 24-channel multiplexer input
Collateral
USB
(Host + Device)
Cortex-M0+
40 MHz
Ultra-Low-Power MCU Subsystem

Up to 40-MHz ARM Cortex-M0+ CPU
Low-power 1.2-A real-time clock (RTC) operating current
Near-zero wait-state flash access at up to 40 MHz
Fast 540-s startup from power-on reset and 40 s from standby
GPIO x8
GPIO x9
GPIO x4
CRC1
GPIO x2
Analog Subsystem
12-bit ADC
Serial Wire
Debug
GPIO x2
GPIO x2
Availability
S6E1C1-Series, S6E1C3-Series
Production: Now

HDMI consumer electronics control signal
3 Low-voltage detect

Watchdog timer
22
S6E2C-Series
FM4 MCU Portfolio
Block Diagram
Features
High-Performance MCU Subsystem
675 CoreMark, 200-MHz ARM Cortex-M4 CPU
Ultra-low-power 1.0-A real-time clock (RTC) operating current
Up to 2MB Flash and 256KB SRAM with 16KB flash accelerator
Error-correcting code (ECC) support, hardware WDT1, low-voltage
detect and clock supervisor blocks for safety-critical applications
3 multi-function timers (MFT), 9 programmable pulse generators
(PPG), 16 base timers, 4 quadrature position/revolution
counters (QPRC), a dual timer, CRC2 and watch counter
Two USB, two CAN3, CAN-FD4, IEEE 1588 Ethernet5, HighSpeed Quad-SPI (HS-QSPI), I2S6 and external bus interfaces
Three 12-bit, 2-Msps ADCs with a 32-channel multiplexer input
Two 12-bit digital-to-analog converters (DACs)
Built-in Cryptographic Assist hardware coprocessor for encryption
192-pin BGA
Collateral
Datasheet:
MCU Subsystem
Digital Subsystem
Cortex-M4
200 MHz
Flash
(1MB to 2MB)
SRAM
(128KB to 256KB)
MPU7
LVD
DMA8
DSTC9
Internal Main
Oscillator
Clock Supervisor
I/O Subsystem
MFT x3
MFS x16
GPIO x8
PPG x9
USB x2
(Host + Device)
GPIO x16
Base Timer x16
CAN3 x2
Dual Timer
CAN-FD4
QPRC x4
IEEE 1588
Ethernet5
RTC
SD Card
Watch Counter
HS-QSPI
GPIO x11
I2S6
WDT1
CRC2
GPIO x15
GPIO x16
GPIO x15
GPIO x15
GPIO x4
GPIO x8
External Bus
Interface
GPIO x16
Crypto Assist
GPIO x16
Analog Subsystem
12-bit ADC x3
GPIO x15
Pin Relocation
Motor control, factory automation, industrial, IoT

Building management systems and automation
Applications
GPIO x16
12-bit DAC x2
GPIO x3
GPIO x3
Serial Wire/
JTAG Debug
GPIO x13
Availability
S6E2CC-Series
Production: Now
Watchdog timer
3 Controller area network
Controller area network with flexible data-rate

Ethernet communications solution that supports the Precision Time Protocol (PTP) standard
6 Inter-IC sound
Memory protection unit

Direct memory access
9 Descriptor System Transfer Controller
23
S6E2G-Series
FM4 MCU Portfolio
Block Diagram
Features
Up to 1MB Flash and 192KB SRAM with 16KB flash accelerator
Two USB, CAN3, IEEE 1588 Ethernet4, I2S5, 2 Smart Card
interfaces and an external bus interfaces
Built-in Cryptographic Assist hardware coprocessor for encryption
MCU Subsystem
Digital Subsystem
Cortex-M4
180 MHz
Flash
(512KB to 1MB)
SRAM
(128KB to 192KB)
MPU6
LVD
DMA7
DSTC8
Internal Main
Oscillator
Clock Supervisor
I/O Subsystem
MFT x2
MFS x10
GPIO x8
PPG x9
USB x2
(Host + Device)
GPIO x16
Base Timer x16
CAN3
GPIO x11
GPIO x15
Dual Timer
GPIO x15
QPRC x2
IEEE 1588
Ethernet4
RTC
SD Card
Watch Counter
Smart Card x2
I2S5
WDT1
CRC2
Analog Subsystem
12-bit ADC x3
GPIO x6
Pin Relocation

Building management systems and automation
Applications
GPIO x7
GPIO x11
GPIO x4
GPIO x6
External Bus
Interface
GPIO x16
Crypto Assist
GPIO x8
GPIO x16
GPIO x3
GPIO x3
Packages: 144-pin LQFP, 176-pin LQFP
Collateral
Datasheet:
Serial Wire/
JTAG Debug
GPIO x8
Availability
S6E2G-Series
Production: Now
Watchdog timer
Ethernet communications solution that supports the Precision Time Protocol (PTP) standard
Inter-IC sound
6 Memory protection unit

24
S6E2H-Series
FM4 MCU Portfolio
Block Diagram

DSLR lens MCU and home appliance
MCU Subsystem
Digital Subsystem
MFT x3

Ultra-low power 1.3-A real-time clock (RTC) operating current
Up to 512KB Flash and 64KB SRAM with 16KB flash accelerator
Two CAN3, SD Card and External Bus Interfaces
Two 12-bit digital-to-analog converters (DACs)
121-pin BGA
Collateral
Datasheet:
SRAM
(32KB to 64KB)
MPU4
LVD
DMA5
DSTC6
Internal Main
Oscillator
Clock Supervisor
Serial Wire/
JTAG Debug
GPIO x15
GPIO x16
Base Timer x8
Flash
(256KB to 512KB)
MFS x8
PPG x9
Cortex-M4
160 MHz
Features
I/O Subsystem
CAN3 x2
GPIO x8
Dual Timer
QPRC x3
RTC
GPIO x16
SD Card
Watch Counter
WDT1
CRC2
External Bus
Interface
Pin Relocation
Applications
GPIO x14
GPIO x12
GPIO x9
GPIO x5
Analog Subsystem
12-bit ADC x3
12-bit DAC x2
GPIO x2
GPIO x3
Availability
S6E2H-Series
Production: Now
Watchdog timer
Memory protection unit

6 Descriptor System Transfer Controller
25
Low-Cost PSoC Development Kits

PSoC Prototyping Kits
Bluetooth Low Energy (BLE)

Pioneer Development Kit
PSoC 5LP Development Kit

by SparkFun1
Kit Number
CY8CKIT-049 or CY8CKIT-059
CY8CKIT-042-BLE
DEV-13229
Key Features
Ultra-low-cost prototyping
Breadboard-compatible
Serial wire debug (SWD) or
bootload for program/debug
Arduino form factor-compatible

Access to all PSoC 4 BLE I/Os
Full SWD program and debug

Access to all PSoC 5LP I/Os
Price
$4-$10
$49
$50
Learn more or buy a kit today at www.cypress.com/kits

1 SparkFun
is an online retail store that specializes in supporting the hobbyist market with kits and tools to develop small electronics products
26
Low-Cost FM Development Kits

FM0+ S6E1B-Series Pioneer Kit FM4 S6E2C-Series Pioneer Kit
FM4 S6E2H-Series Pioneer Kit
Kit Number
FM0-100L-S6E1B8
FM4-176L-S6E2CC-ETH
FM4-176L-S6E2H
Key Features



Price
$49
$49
$25

27
PSoC Packages
Package
Pins
LQFP
48
PSoC 1
PDIP
QFN
20
28
16
24
32
40
48
56
68
16
20
28
68
72
PSoC 3
PSoC 4
SOIC
PSoC 5LP
CapSense
Package
SSOP
TQFP
Pins
16
20
24
28
32
48
44
PSoC 1
48
WLCSP
64
PSoC 4
100
30
32
PSoC 3
PSoC 5LP
CapSense
Package
WLCSP
BGA
Pins
99
124
PSoC 1
PSoC 3
PSoC 4
PSoC 5LP
CapSense
28
MCU Packages
Package
SSOP
TSSOP
SDIP
QFN
Pins
16
20
24
16
20
24
32
32
8FX
FM0+
FM3
48
Pins
80
8FX
FM0+
100
120
FM3
FM4
144
176
216
QFP
TEQFP
100
120
32
48
52
64
LQFP
64
FM4
Package
LQFP
BGA
96
112
121
WLCSP
161
192
26
80
29
CapSense Controllers
30
CapSense Express
CapSense Plus
PSoC
Configurable Controllers1
Programmable Controllers2
Programmable System-on-Chip2
CY8CMBR3106S
11 Buttons, 2 Sliders
Proximity, Liquid Tolerance
SmartSense_EMCplus3
CY8CMBR3116
16 Buttons, 8 LEDs
SmartSense_EMCplus3
CY8CMBR3108
8 Buttons, 4 LEDs
SmartSense_EMCplus3
CY8CMBR3110
10 Buttons, 5 LEDs
SmartSense_EMCplus3
Performance
CY8CMBR2044
4 Buttons, 4 LEDs
SmartSense Auto-tuning
CY8CMBR3002
2 Buttons, 2 LEDs
SmartSense_EMCplus3
1 Standard
CY8C56xx/58xx
64, 128, 256KB Flash
SmartSense_EMCplus3
CY8C20xx7
16, 32KB Flash
CY8C52xx/54xx
32, 64, 128, 256KB Flash
SmartSense_EMCplus3
CY8C36xx/38xx
32, 64KB Flash
SmartSense_EMCplus3
CY8C20xx6A/S
16, 32KB Flash, 2KB SRAM
NEW
NEW
Portfolio
CY8C32xx/34xx
16, 32, 64KB Flash
SmartSense_EMCplus3
CY8CMBR2016
16 Buttons
CY8C20xx6H
8, 16KB Flash
Haptics
CY8C21x34/B
8KB Flash
CY8C41xx/42xx
16, 32KB Flash
SmartSense_EMCplus3
CY8C20x36A
8KB Flash
CY8C28xx
16KB Flash
CY8CMBR2010
10 Buttons, 10 LEDs
CY8C201xx
10 Buttons, 5 LEDs
2 Sliders
CY8C40xx
8, 16KB Flash
SmartSense_EMCplus3
CY8C20x34
8KB Flash
Integration
products that are configured for target applications with a graphical user interface
2 Microcontroller-based products that can be freely programmed to implement additional functions
3 SmartSense Electromagnetic Compatible = SmartSense Auto-tuning + high noise immunity
CY8C4246/7
64, 128KB Flash
SmartSense_EMCplus3
CY8CMBR2110
10 Buttons, 10 LEDs
CapSense
CY8CMBR3102
2 Buttons, Proximity
SmartSense_EMCplus3
NEW
CY8C4xx8-BL
256KB Flash, BLE4
SmartSense_EMCplus3
Q316
CY8C41xxS
32KB Flash, 4th Gen
SmartSense_EMCplus3
NEW
CY8C40xxS
64KB Flash, 4th Gen
SmartSense_EMCplus3
Bluetooth Low Energy

Status
Availability
QQYY
QQYY
31
PSoC 4000 S-Series

PSoC MCU Family
Applications
Consumer devices (wearable, mobile, personal care)
Small home appliances (coffee machine, juicer)
Block Diagram
MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Smart
I/O4
Features
Up to 32KB Flash, 4KB SRAM
One 10-bit, 46.8-ksps Single-Slope ADC2
One CapSense block that supports low-power operation and
mutual-capacitance sensing
Two serial communication blocks (SCBs) that are configurable
as I2C, SPI or UART
Packages
Collateral
Datasheet:
Flash
(16KB to 32KB)
SRAM
(2KB to 4KB)
CMP
x2
7-bit IDAC3
x2
Single-Slope
ADC2
CapSense
Blocks
WCO1
TCPWM x5
Serial Wire Debug
SCB x2
48 MHz
Cortex-M0+
GPIO x8
Smart
I/O4
GPIOx8
GPIO x8
GPIO x4
Availability
PSoC 4000S
Production:
1 Watch
3 Current
4 Embedded
crystal oscillator
A simple ADC used to measure slow-moving signals
Now

programmable digital logic in the I/O subsystem
32
PSoC 4100 S-Series

Applications
Block Diagram
Home appliances (washing machine, dishwasher)

Industrial applications

MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Features
Collateral
48 MHz
Flash
(16KB to 64KB)
SRAM
(4KB to 8KB)
CMP
x2
7-bit IDAC5
x2
Single-Slope
ADC3
CapSense
Blocks
WCO1
TCPWM x5
Serial Wire Debug
SCB x3
Cortex-M0+
GPIO x8
Smart
I/O6
GPIOx8
GPIO x8
GPIO x4
Sampling:
Production:
1 Watch
3A
4 Programmable
Smart
I/O6
SAR2 ADC
Availability
Datasheet: PSoC 4100S

crystal oscillator
Opamp
x2

Up to 64KB Flash, 8KB SRAM
One 10-bit, 46.8-ksps Single-Slope ADC3
Two opamps configurable as PGAs4, comparators, etc.
One CapSense block that supports low-power operation with
self- and mutual-capacitance sensing
Three serial communication blocks (SCBs) that are configurable
as I2C, SPI or UART
Packages
simple ADC used to measure slow-moving signals

gain amplifier
Now
September 2016
5 Current
6

Embedded programmable digital logic in the I/O subsystem
33

Intelligent Analog Family with Bluetooth Low Energy
Applications
Block Diagram

Features
Collateral
Analog front end(s)

BLE System
Flash
(128KB to 256KB)
SRAM
(16KB to 32KB)
24 MHz
Serial Wire Debug
CMP
x2
I/O Subsystem
GPIO x8
SAR2
ADC
CSD
Blocks
TCPWM3 x4
SCB4 x2
GPIO x8
GPIO x8
GPIO x8
Segment LCD Drive

GPIO x4
Availability

2
Opamp
x4
Cortex-M0

Programmable AFE1
Packages
Programmable Analog
Blocks
MCU Subsystem
3 Timer,
4 Serial
Production:
counter, PWM block

Now
5 Bluetooth
4.2 is only available in the 256KB flash option device
34

Programmable Digital Family with Bluetooth Low Energy
Applications
Block Diagram
Features
Collateral
Analog front end(s)

Programmable Analog
Blocks
Opamp
x4
BLE System
Flash
(128KB to 256KB)
SRAM
(16KB to 32KB)
48 MHz
CMP
x2
I/O Subsystem
GPIO x8
SAR2
ADC
CSD
Blocks
UDB3 x4
TCPWM4 x4
SCB5 x2
GPIO x8
GPIO x8
GPIO x8
Segment LCD Drive

Serial Wire Debug
GPIO x4
Availability

2
MCU Subsystem
Cortex-M0

48-MHz Cortex-M0 with up to 256KB flash and 32KB SRAM
Programmable AFE1
Packages

3
4

Timer/counter/PWM
Production:
5
6
Now

Bluetooth 4.2 is only available in the 256KB flash option device
35
PSoC 4100 M-Series

Applications
Block Diagram


MCU Subsystem
Programmable Analog
Blocks
GPIO x8
SAR1
ADC
Opamp
x4
Features
GPIO x8
Flash
(64KB to 128KB)
SRAM
(8KB to 16KB)
Serial Wire Debug
CMP
x2
CSD
8-bit
IDAC2
x2
7-bit
IDAC2
x2
Blocks
TCPWM3 x8
24 MHz
Cortex-M0
GPIO x8
GPIO x8
GPIO x8
SCB4 x4
GPIO x8
Segment LCD Drive
GPIO x7
RTC
DMA
Collateral
Datasheet:
I/O Subsystem
Availability
Production:
1 Successive
Now
Timer/counter/PWM
36
PSoC 4200 M-Series

Applications
Block Diagram


MCU Subsystem
Programmable Analog
Blocks
I/O Subsystem
GPIO x8
Features
Collateral
GPIO x8
48 MHz
Flash
(64KB to 128KB)
SRAM
(8KB to 16KB)
Serial Wire Debug
CAN x2
CMP
x2
CSD
8-bit
IDAC2
x2
7-bit
IDAC2
x2
Blocks
UDB3 x4
TCPWM4 x8
Cortex-M0

Two controller area network (CAN) controllers
Datasheet:
SAR1
ADC
Opamp
x4
GPIO x8
GPIO x8
GPIO x8
GPIO x8
RTC
SCB5 x4
DMA
Segment LCD Drive
GPIO x7
Availability
Production:
1 Successive

Timer/counter/PWM
Now
5 Serial
37
PSoC 4200 L-Series

Block Diagram
Applications

MCU Subsystem
Programmable Analog
Blocks
Opamp
x4
SAR2
CMP
x6
CSD
x2
8-bit
IDAC3
x2
7-bit
IDAC3
x2
I/O Subsystem
GPIO x8
GPIO x8
ADC
Features
Cortex-M0
Flash
(64KB to 256KB)
SRAM
(8KB to 32KB)
Serial Wire Debug
CAN x2
Full-Speed
USB 2.0
RTC1
DMA
Collateral
Datasheet:
1 Real-time
Blocks
UDB x8
TCPWM4 x8
48 MHz
GPIO x8

48-MHz ARM Cortex-M0 CPU with a DMA controller and RTC1
Up to 98 GPIOs supporting analog and digital interfaces
CapSense With SmartSense Auto-tuning
Two Cypress Capacitive Sigma-Delta (CSD) controllers
Two comparators (CMPs)
Four opamps, configurable as PGAs, CMPs, filters, etc.
Eight universal digital blocks (UDBs): custom digital peripherals
Eight configurable 16-bit TCPWM4 blocks
Full-Speed USB 2.0 Controller and Transceiver
Two Controller Area Network (CAN) Controllers
Packages: 48-pin TQFP,64-pin TQFP,68-pin QFN,124-pin
VFBGA
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
GPIO x8
SCB5
x4
GPIO x8
Segment LCD Drive
GPIO x4
Availability
Production:
PSoC 4 L-Series
clock
2 Successive
3
4

Timer/counter/PWM
Now
38
Low-Cost PSoC Development Kits

PSoC Prototyping Kits
Bluetooth Low Energy (BLE)

Pioneer Development Kit
PSoC 5LP Development Kit

by SparkFun1
Kit Number
CY8CKIT-049 or CY8CKIT-059
CY8CKIT-042-BLE
DEV-13229
Key Features
Ultra-low-cost prototyping
Breadboard-compatible
Serial wire debug (SWD) or
bootload for program/debug

Access to all PSoC 4 BLE I/Os

Access to all PSoC 5LP I/Os
Price
$4-$10
$49
$50

1 SparkFun
is an online retail store that specializes in supporting the hobbyist market with kits and tools to develop small electronics products
39
PSoC Packages
Package
Pins
LQFP
48
PSoC 1
PDIP
QFN
20
28
16
24
32
40
48
56
68
16
20
28
68
72
PSoC 3
PSoC 4
SOIC
PSoC 5LP
CapSense
Package
SSOP
TQFP
Pins
16
20
24
28
32
48
44
PSoC 1
48
WLCSP
64
PSoC 4
100
30
32
PSoC 3
PSoC 5LP
CapSense
Package
WLCSP
BGA
Pins
99
124
PSoC 1
PSoC 3
PSoC 4
PSoC 5LP
CapSense
40
USB Controllers
41
USB 3.1
USB Portfolio
Device
Hub
Bridge
CYUSB301x
FX3
CYUSB33xx
HX3
32-Bit Bus to USB 3.1 Gen 1

ARM9, 512KB RAM
USB 3.1 Gen 1, Shared Link1

BC 1.22, Ghost Charge3
FX3PD
NEW
USB 3.1 Gen 2 Type-C

Peripheral Controller with PD
Contact Sales
CYUSB333x
HX3C
Storage
Type-C
CYUSB306x
CX3
CYUSB303x
FX3S
CYPD1xxx
CCG1
CSI-24 to USB 3.1 Gen 1

4 CSI-24 Lanes, 1 Gbps/Lane
16-Bit Bus to USB 3.1 Gen 1

RAID5, Dual SDXC6/eMMC7
USB Type-C Port Controller

1 PD Port, 5 Profiles, 100 W
CYUSB361x
GX3
CYUSB302x
SD3
CYPD2xxx
CCG2
USB 3.1 Gen 1 to GigE

Energy Efficient Ethernet
USB 3.1 Gen 1 SD Reader

SDXC6/eMMC7, RAID5
USB Type-C Cable Controller

1 PD Port, Termination, ESD
Q316
4 Ports: 1 Type-C, 3 Type-A

USB PD, Billboard, BC1.22
HX3PD
USB 1.1
USB 2.0

Hub with PD
Contact Sales
Host
NEW
DX3
DSI8
USB 3.1 Gen 1 to

Contact Sales
TX
Q316
CYPD3xxx
CCG3

20-V, Crypto, Billboard
CY7C6801x/53
FX2LP
CY7C656x4
HX2VL
CYWB016xBB
Bay
CYWB0x2xABS
Arroyo, Astoria
NEW
16-Bit Bus to USB 2.0

8051, 16KB RAM
4 Ports
4 Transaction Translators
HS USB OTG
Dual SDXC6/eMMC7

8051, Dual SD/eMMC7

2 PD Ports,128KB Flash, Mux
CY7C68003
TX2UL
CY7C656x1
HX2LP
CY7C6803x
NX2LP
4 Ports, Industrial Grade

1 Transaction Translator
NAND Flash to USB 2.0

8051, 15KB RAM
ULPI9
PHY
13, 19.2, 24, 26 MHz
CY7C683xx
AT2LP

ARM9 512KB RAM
Parallel ATA to USB 2.0

8051
CY7C6521x
USB-Serial
M8C MCU, 20 GPIOs

SPI, 8KB Flash
UART/SPI/I2C to USB
2 Channels, CapSense
CY7C64215
enCoRe III
CY7C65213
USB-to-UART (Gen 2)
M8C MCU, 50 GPIOs, ADC

I2C/SPI, 16KB Flash
SL811HS
FS USB Host/Device
256Byte RAM
4 Ports, FS USB OTG

32 GPIOs
CY7C643xx
enCoRe V
CY7C65210/7
USB Billboard
CY7C67200
EZ-OTG

I2C/SPI, 32KB Flash
ARM Cortex M0
1 or 2 UART/SPI/I2C channels
2 Ports, FS USB OTG

25 GPIOs
USB 2.0 and

SuperSpeed traffic on the same port
2 Battery Charging specification v1.2
3 Enables
USB charging without

host connection
4 Camera Serial Interface v2.0
5 Redundant
array of
independent disks
6 SD extended capacity
USB Type-C AFE

Contact Sales
Type-C products
apply to any
USB speed
CY7C67300
EZ-Host
3 Mbps, 8 GPIOs
1 Simultaneous
Q316
CCG5
CYUSB201x
FX2G2
CY7C638xx
enCoRe II
CYPD4xxx
CCG4/CCG4M
Concept
7 Embedded
Multimedia Card
Serial Interface
9 UTMI low-pin interface
8 Display
Development
Sampling
Production
QQYY
QQYY
Status
Availability
42
CCG1
USB Type-C and PD Port Controller

Block Diagram
Notebooks, tablets, monitors, docking stations, power adapters,

Type-C EMCAs1 and dongles
CCG1: USB Type-C Port Controller with PD

MCU Subsystem
Programmable Analog
Blocks
Features
IDAC

48-MHz ARM Cortex-M0 CPU with 32KB flash and 4KB SRAM
Integrated Analog Blocks
12-bit, 1-Msps ADC for VBUS voltage and current monitoring
Dynamic overcurrent and overvoltage protection
Integrated Digital Blocks
Two configurable 16-bit TCPWM2 blocks
One SCB3: I2C master or slave, SPI master or slave, or UART
Up to eight GPIOs
Type-C Support
Integrated Type-C transceiver, supporting two Type-C ports
Controls routing of all protocols to an external MUX
PD Support
Supports provider4 and consumer5 roles and all power profiles
Low-Power Operation
1.71-5.5 V operation
Sleep: 1.3 mA, Deep Sleep: 1.3 A
Packages
40-pin QFN (36 mm x 36 mm), 35-ball CSP (6.8 mm x 6.8 mm),
16-pin SOIC (60 mm x 60 mm)
Collateral
Electronically Marked Cable Assembly

Timer/Counter/Pulse-Width Modulation
ADC
CORTEX-M0
48 MHZ
Flash
(32KB)
SRAM
(4KB)
Type-C
Port 1
Comparators
Blocks
TCPWM
SCB
(I2C, SPI, UART)
Profiles and
Configurations
Baseband MAC
Type-C
Port 2
GPIO
Port
Serial Wire Debug
Baseband PHY
Availability
Datasheet:
CCG1 Datasheet
Reference Design Kit: CCG1 RDK
1
I/O Subsystem
Applications
Serial communication block

Type-C port that sources power over VBUS
Production:
5A
Now
Type-C port that sinks power from VBUS
4A
43
CCG2

Applications
Block Diagram
USB Type-C Electronically Marked Cabled Assembly (EMCA) and

powered accessories
CCG2: USB Type-C Port Controller With PD

MCU Subsystem
I/O Subsystem
Features
CC7
Flash
(32KB)
SRAM
(4KB)
VCONN2
SCB1
(I2C, SPI, UART)
Profiles and
Configurations
Baseband MAC
Baseband PHY
Programmable I/O Matrix
48 MHz
VDDIO
GPIO5
Port
Integrated RP, RD, RA
Serial Wire Debug
Production:
CCG2 Datasheet
CCG2 RDK
1 Serial
communication block configurable as UART, SPI or I 2C

Termination resistor read as a Down Facing Port (DFP)
4 Termination
CORTEX-M0
VCONN1
SCB1
SPI, UART)
Availability
Collateral
Datasheet:
Reference Design Kit:
(I2C,

48-MHz ARM Cortex -M0 CPU with 32KB flash and 4KB SRAM
Integrated timer/counter/pulse-width modulators (TCPWMs)
Two SCBs1 configurable to I2C, SPI or UART modes
Type-C Support
Integrated transceiver, supporting one Type-C port
Integrated DFP (RP2), UFP (RD3), EMCA (RA4) termination resistors
Power Delivery (PD) Support
Standard power profiles
Low-Power Operation
Two independent VCONN rails with integrated isolation
Independent supply voltage pin for GPIO5
2.7-5.5-V operation
Sleep: 2.0 mA; Deep Sleep: 2.5 A
System-Level ESD on CC6 and VDD Pins
8-kV contact, 15-kV Air Gap IEC61000-4-2 level 4C
Packages
20-ball CSP (3.3 mm x 3.3 mm) with 0.4-mm ball pitch,
14-pin DFN (2.5 mm x 3.5 mm)with 0.6-mm pin pitch,
24-pin QFN (4 mm x 4 mm) with 0.55-mm pin pitch
TCPWM6
Now
Termination resistor read as a Up Facing Port (UFP)

resistor read as an EMCA
5 General-purpose
6
input/output
Configuration Channel
44
CCG3

Block Diagram
Applications
Accessories and power adapters
CCG3: USB Type-C Cable Controller
Collateral
Datasheet:
Cortex-M0
48 MHz
Flash
(64KB)
Flash
(64KB)
4x TCPWM9
4x SCB4
(I2C, SPI, UART)
Crypto Engine
I/O Subsystem
Programmable
I/O Matrix
Type-C Support
Alternate modes1, Crypto Engine2 for USB authentication3
Power Delivery (PD) Support for Standard Power Profiles
Integrated Digital Blocks for VBUS Power and MUX Interface
Four TCPWMs, 24x GPIOs
Four SCBs4 for configurable master/slave I2C, SPI or UART
USB Billboard Controller5 with Billboard Device Class6 support
Integrated Analog Blocks for OVP/OCP7
20-V OVP/OCP; 4:2 cross-bar switch
32-bit ARM Cortex-M0 CPU with MCU Subsystem
2x64KB Flash for fail-safe updates over CC, I2C or USB interfaces
Low-Power Operation
2x VBUS Gate Drivers8, for consumer and provider power paths
2x high-voltage (5-20 V, 25 V maximum) VBUS voltage inputs
Sleep: 2.0 mA; Deep Sleep: 2.5 A with wake-on-I2C or wake-on-CC
System-Level ESD on CC/VCONN, VBUS, and SBU Pins
8-kV contact, 15-kV Air Gap IEC61000-4-2 Level 4C
Packages
42-ball (8.5 mm2) CSP and 40-pin (36 mm2) QFN
MCU Subsystem
Features
CC
24x GPIO
Ports
USB PD Subsystem
Baseband MAC
Baseband PHY
20-V Regulator
2x VCONN FETs
Overcurrent
Protection
2x 20V VBUS FET

Gate Drivers8
System Resources
Overvoltage
Protection
Integrated Resistors
(RP, RD, RA)10
Full-Speed USB
Billboard Controller
4:2 Analog
Cross-Bar Switch
8-bit SAR ADC
SRAM
(8KB)
Availability
Samples:
CCG3 Datasheet
Mode of operation in which the data lines are repurposed to transmit non-USB data
The encryption hardware and software required to implement USB Authentication
3 A USB-IF specification that defines the authentication protocol for Type-C accessories
4 Serial communication block configurable as UART, SPI or I 2C
5 A USB Device controller that informs the USB Host of the supported Alternate Modes
Now
Production:
Q3 2016
A specification that defines the method for a USB Device to communicate the supported Alternate Modes
Overvoltage protection, overcurrent protection
8 Circuits to control the gates of external power Field-Effect Transistors (FETs) on V
BUS (5-20 V)
9 Timer/counter/pulse-width modulator block
10 Termination resistors: R read as a DFP, R as a UFP, R as an EMCA
P
D
P
45
CCG4/4M

Applications
Block Diagram
Notebooks, tablets, monitors, docking stations, power adapters
CCG4/4M: Two-Port Type-C Controller with Power Delivery
Features
ARM
Cortex-M0
48 MHz
Flash
(128KB)
SRAM
(8KB)
16
4x SCB1
32
32
Type-C
Baseband
Transceiver
Type-C
Baseband
Transceiver
CC
CC
2x VCONN
FETs
4x
TCPWM
24
GPIOs
2x VCONN
FETs
4x 8-bit
SAR ADC
Integrated USB Type-C Transceivers Support Two Type-C Ports

Integrated 2x 1-W VCONN FETs and 2x FET control signals, per
port programmable RP1 and removable RP, and RD2 terminations
Supports dead battery mode operation
Integrated SuperSpeed USB/DisplayPort (DP) Mux (CCG4M)
Increased Flash Enables Fail-Safe Bootup
Integrates 128KB flash to store dual FW images for Fail-Safe Boot
Integrated Digital Blocks for Inter-Chip Communications
Four SCBs3 master or slave configurable to I2C, SPI or UART
SCBs interconnect CCG4 with embedded controller,
two alternate muxes and Thunderbolt4 controller (optional)
Integrated Blocks for OVP5 and OCP6
Four 8-bit SAR ADCs configurable for OVP and OCP
Low-Power Operation
2.7-V to 5.5-V operation and independent supply voltage for general
purpose input/output (GPIO) Sleep: 2.0 mA; Deep Sleep: 2.5 A
with wake-on-I2C or wake-on-configuration channel (CC)
System-Level ESD on CC Pins
32-bit ARM Cortex -M0 CPU with MCU Subsystem
128KB Flash, upgradable over CC lines or I2C interface
Packages
40-pin QFN, 96-ball BGA (CCG4M)
To
EC7
24
SS_
USB
+
DP
USB/DP
Mux
(CCG4M)
2
12
Type-C
Port 1
Type-C
Port 2
SS_USB
+ DP
AUX
SBU
Availability
Samples: Now
Production: Q3 2016
Collateral
Datasheet: CCG4 Datasheet
1 Termination
4 An
resistor read as a DFP

Termination resistor read as a UFP
Serial communication block configurable as UART, SPI or I2C

interface jointly defined by intel and Apple that connects peripherals to a computer
5
6
Overvoltage protection
Overcurrent protection
Embedded controller in a PC
46
HX3C
USB 3.0 Type-C PD Hub1

Block Diagram
Applications
USB Type-C charging hubs1, adapters and accessories
Docking stations for notebook PCs and tablets
Televisions and monitors
PC motherboards and servers
Set-top boxes, home gateways and routers
EEPROM
USB Type-C (US Port)

2
HX3C Hub
SS6 PHY
MCU
Features
USB 2.0 PHY CC5
16
32
Directs data traffic between a USB Host and multiple USB Devices
A USB Device controller that is used to implement the USB Billboard Device Class
Informs the USB Host of the supported Alternate Modes as well as any failures
USB 2.0 Hub1 Controller
SS6 Hub1 Controller
16
32
Buffers
4x TT7
Repeater
16
32
Routing Logic
USB
Billboard
Controller2
Routing Logic
16
32
USB 3.1 Gen 1 PHY

SS6 PHY
USB Type-A (DS Port)
USB 3.1 Gen 1 PHY
USB 2.0 PHY SS6 PHY
Collateral
PD
Controller
32
USB 3.1 Gen 1-compliant Hub1 controller

Upstream (US): Type-C
Downstream (DS): 1 Type-C and 2 Type-A ports
Integrated Type-C transceivers, supporting two ports
Integrated DFP (RP) and UFP (RD) termination resistors
Integrated USB Billboard Controller2
Charging Support: USB PD, BC v1.23, Apple Charging
Standard4
PD policy engine configures power profiles dynamically
Ghost Charge: Charging DS without US connection
Firmware upgradable over USB
System-Level ESD on CC5 Pins: 8 kV contact, 15 kV airconfigurable USB SS6 and USB 2.0 PHY (drives 11 trace)
121-ball BGA (10 mm x 100 mm, 0.8 mm ball-pitch)
Datasheet:
CYUSB3333/CYUSB3343
Product Overview: EZ-USB HX3C: USB 3.0 Type-C Hub
with Power Delivery
USB 3.1 Gen 1 PHY
USB Type-A (DS Port)
USB 3.1 Gen 1 PHY
USB 2.0 PHY SS6 PHY
USB 2.0 PHY CC5
PD
Controller
USB Type-C (DS Port)
Availability
Samples:
Production:
3A
Now
Q3 2016
specification published by the USB Implementers Forum

(USB-IF) for charging portable USB Devices
4 An Apple-specified battery charging standard for the iPhone,
iPod and iPad
Configuration Channel
USB SuperSpeed
6
47
GX3
USB 3.1 Gen 1 to GigE1 Bridge

Block Diagram
USB dongles, docking stations and port replicators

Network printers and security cameras
Ultrabooks and home gateways
Game consoles and portable media players
DVRs, IP set-top boxes and IP TVs
Other embedded systems
GX3 Bridge
Data SRAM
Program
ROM
DMA
Engine
RISC SOC
GigE MAC
Controller
USB
Controller
One-chip USB 3.1 Gen 1 to 10/100/1000M GigE bridge

Integrates USB 3.1 Gen 1 PHY and GigE PHY
Integrates USB 3.1 Gen 1 Controller and GigE MAC2
Needs only a 25-MHz crystal to drive both USB & GigE1 PHY
IEEE 802.3az3 support for low-power idle state
Supports dynamic cable length and power adjustment
Offers multiple power management wake-on-LAN4 features
Supports optional EEPROM to store USB descriptors
Integrates on-chip POR5 circuitry
68-QFN (8 x 8 x 0.85 mm)
GigE1 PHY
Features
I2C
GPIO
Clock
USB 3.1 Gen 1 PHY
Applications
USB 3.1
Gen 1
Host
Reset
Collateral
Datasheet:
GX3 Datasheet
Reference Design Kit: GX3 RDK
Software Drivers:
GX3 Drivers
Availability
Production:
Now
1 Gigabit
Ethernet
Media access controller that provides the address to an Ethernet node
3 A new-energy efficient Ethernet standard
4 An Ethernet standard that allows a computer to be turned on by a network message
5 Power-on-reset
2
48
HX3
USB 3.1 Gen 1 Hub

Applications
Block Diagram
Docking stations for notebook PCs and tablets,

PC motherboards, servers, digital TV, monitors, retail hub
boxes, printers, scanners, set-top boxes, home
gateways, routers and game consoles
Upstream Port
EEPROM
2
4
HX3 Hub
SS3 PHY
USB 2.0 PHY
MCU
USB 3.1 Gen 1 PHY
I2C
32
Features
16
32
USB 3.1 Gen 1-compliant four-port Hub Controller

USB-IF certified (Test ID: 330000047)
WHQL certified for Windows 7, Window 8, Windows 8.1
Shared Link supports simultaneous USB 2.0 and
USB SuperSpeed (SS) devices on the same port
Ghost Charge enables USB charging while the hub is
disconnected from a USB Host
Charging Standard support:
USB-IF Battery Charging v1.2
Apple Charging Standard
Charging an OTG Host in an ACA-Dock
Programming of external EEPROM via USB
Configurable USB SS and USB 2.0 PHY that drives 11 trace
68-QFN (8 x 8 x 1.0 mm), 88-QFN (10 x 10 x 1.0 mm),
100-BGA (6 x 6 x 1.0 mm)
SuperSpeed Hub
Controller
USB 2.0 Hub Controller

16
32
Buffers
4x TT1
Repeater
16
32
Routing Logic
Routing Logic
32
16
USB 3.1 Gen 1 PHY
USB 3.1 Gen 1 PHY

SS3
PHY
USB 2.0 PHY
USB 3.1 Gen 1 PHY

SS3
PHY
SS3 PHY
USB 2.0 PHY
USB 3.1 Gen 1 PHY

SS3 PHY
USB 2.0 PHY
USB 2.0 PHY
2
4
Downstream Port 1
Downstream Port 2
Downstream Port 3
Downstream Port 4
Collateral
Datasheet:
Application Note:
Kits:
Configuration Utility:
1
HX3 Datasheet
HX3 Hardware Design Guide
CY4609, CY4603, CY4613
Blaster Plus2
Transaction translator
Availability
Production:
Now
A Cypress GUI-based PC application for setting HX3 configuration parameters
SuperSpeed
49
FX3
USB 3.1 Gen 1 Peripheral Controller

Block Diagram
Industrial
Medical and machine vision cameras
3-D and 1080p full HD and 4K Ultra HD (UHD) cameras
Document and fingerprint scanners
Videoconferencing and data acquisition systems
Video capture cards and HDMI converters
Protocol and logic analyzers
USB test tools and software-designed radios (SDRs)
5
FX3 Controller
JTAG
512KB
RAM
Image
Sensor,
FPGA or
ASIC
Features
USB 3.1 Gen 1-compliant peripheral controller
USB-IF certified (TID:340800007)
Fully accessible 32-bit, 200-MHz ARM926EJ core
512KB of embedded SRAM for code space and buffers
Up to 32-bit, 100-MHz, flexible GPIF II interface
Other peripheral interfaces such as I2C, I2S, UART, SPI and
12 GPIOs
Unused I/O pins can be used as GPIOs
Up to 32 USB endpoints
Flexible clock options:
19.2-MHz crystal
19.2-MHz, 26-MHz, 38.4-MHz and 52-MHz clock input
121-ball BGA (10 x 10 mm), 131-ball WLCSP (4.7 x 5.1 mm)
32
32
32
USB 3.1 Gen 1
ARM9
GPIF-II
Applications
32
32
32
UART
I2C
I2S
SPI
USB 3.1
Gen1
Host
GPIO
12
Availability
Production:
Now
Collateral
Datasheet:
Development Kit:
Software Development Kit:
CYUSB301X/CYUSB201X
FX3 SuperSpeed Explorer Kit
EZ-USB FX3 SDK
50
FX3S
USB 3.1 Gen 1 RAID1-on-Chip

Applications
Block Diagram
Servers
Routers
Mobile storage
USB flash drives
POS terminals
Automatic teller machines (ATM)
SDIO expanders and data logging devices
16
GPIF II
ASIC,
FPGA,
SoC
USB 3.1 Gen 1-compliant Peripheral Controller

USB-IF certified (TID:340800007)
Fully accessible 32-bit, 200-MHz ARM926EJ core
512KB of embedded SRAM for code space and buffers
Up to 16-bit, 100-MHz, flexible GPIF II interface
Peripheral interfaces such as I2C, UART, SPI and GPIOs
Supports two SDXC2, eMMC3 4.4, or SDIO 3.0 interfaces
Support RAID0 or RAID1 configurations
Flexible clock options:
19.2-MHz crystal
19.2-MHz, 26-MHz, 38.4-MHz and 52-MHz clock input
121-ball BGA (10 x 10 mm)
131-ball WLCSP (4.7 x 5.1 mm)
32
32
32
32
SDXC2/eMMC3S
DIO
4
SD Card,
eMMC3 NAND,
SDIO Device
USB 3.1
Gen 1
Host
SDXC2/eMMC3S
DIO
4
SD Card,
eMMC3 NAND,
SDIO Device
Availability
Collateral
1 Redundant
512KB
RAM
(RAID1
Firmware)
ARM9
Features
Datasheet:
Kit:
Software:
App Notes:
JTAG
USB 3.1 Gen 1
FX3S
RAID1-on-Chip
EZ-USB FX3S
FX3S RAID1-on-Chip Boot Disk Kit
FX3 Software Development Kit (SDK)
FX3S Hardware Design Guidelines (AN70707)
USB RAID 1 Disk Design Using FX3S (AN89661)
array of independent disks
2 SD
extended capacity
3 Embedded
Production:
Now
Multimedia Card
51
CX3
MIPI1 CSI-2 to USB 3.1 Gen 1 Bridge

Block Diagram
Features
USB 3.1 Gen 1-compliant video-class controller
Four-lane MIPI1 Camera Serial Interface v2.0 (CSI-2) input
Camera Control Interface (CCI) for image sensor configuration
Supports industry-standard video data formats:
RAW8/10/12/142, YUV422/4443, RGB888/666/5654
Supports uncompressed streaming video:
4K UHD at 15 fps, 1080p at 30 fps, 720p at 60 fps
On-chip ARM9 with 512KB RAM for data processing
Supports I2C, I2S, SPI, UART and 12 GPIOs
121-BGA (10 x 10 x 1.7 mm)
Collateral
Datasheet:
Software Development Kit:
5
CX3 Bridge
JTAG
512KB
RAM
ARM9
Image
Sensor or
Image
Signal
Processor
32
32
32
32
UART
I2C
SPI
USB 3.1 Gen 1
Industrial
Medical and machine vision cameras
1080p full HD and 4K Ultra HD (UHD) cameras
Document scanners
Fingerprint scanners
Game consoles
Videoconferencing systems
Notebook PCs
Tablets and image acquisition systems
MIPI1 CSI-2
Applications
USB 3.1
Gen 1
Host
GPIO
12
Availability
Production:
Now
CYUSB306X
CX3 Reference Design
EZ-USB SDK
Mobile Industry Processor Interface

format for raw video data
3 Video format for luminance and chrominance components
4 Video format for red, green and blue pixel components
2 Video
52
Wireless Solutions for the IoT
53
Bluetooth
Wi-Fi
Wi-Fi + Bluetooth Combo
Automotive
NEW
NEW
IEEE 802.11a/b/g/n/ac WLAN1 + Bluetooth

Up to 867 Mbps Wi-Fi, 1-3 Mbps Bluetooth
Dual Band (2.4/5 GHz), 2x2 MIMO2
IEEE 802.11a/b/g/n/ac WLAN + Bluetooth

Up to 867 Mbps
Dual Band (2.4/5 GHz), 2x2 MIMO, RSDB3
NEW
Integration and Performance
NEW
IEEE 802.11a/b/g/n WLAN + MCU

Up to 150 Mbps
ARM Cortex-R4/-M3 MCU
IEEE 802.11a/b/g/n WLAN + Bluetooth

Up to 300 Mbps Wi-Fi, 1-3 Mbps Bluetooth
Dual Band (2.4/5 GHz), 2x2 MIMO
NEW
NEW
IEEE 802.11a/b/g/n WLAN

Up to 300 Mbps
2x2 MIMO
Wireless Portfolio
Bluetooth (BR4 + EDR5 + BLE6) + MCU

1-3 Mbps,
Class 1/2/37, ARM Cortex-M4/-M3 MCU
NEW
Bluetooth (BR + EDR)

1-3 Mbps
Class 1/2/3
PSoC 4 BLE
1 Mbps, CapSense
ARM Cortex-M0 MCU, AFE8, Opamp, TIA9
PRoC BLE
1 Mbps, CapSense
ARM Cortex-M0 MCU
NEW
Bluetooth Low Energy (BLE) + MCU

1-2 Mbps,
ARM Cortex-M3 MCU
2 Multiple-input
5 Enhanced
Wireless Local Area Network

multiple-output
3 Read simultaneous dual band
Basic Rate
Data Rate
Concept
Class 1 (100 m)/2 (10 m)/3 (1 m)

Analog front end
9 Transimpedance amplifier
8
Development
Sampling
Production
QQYY
QQYY
Status
Availability
54
Wireless Solutions for The Internet of Things (IoT)

Roadmap
BLE PORTFOLIO
55
Bluetooth Low Energy (BLE) Portfolio

WICED
PSoC Creator
PRoC BLE (MCU + Touch1)
BLE + MCU
PSoC 4 BLE (MCU + Touch + Mixed-Signal)
NEW
Q416
BCM20719
CM42, SPI, UART, I2C3,
IR TX/RX4, ADC, 6 PWM,
KB Scanner5, Mouse QD6,
Crypto7, 4 TRIAC Control,
40 GPIO, 1MB Flash,
512KB RAM, BT8 4.2,
2 Mbps support, WICED SDK9
Q316
CYBL1117x
CM0, DMA10, 2 SCB11, I2S
4 TCPWM12, 4 PWM, ADC,
36 GPIO, 256KB Flash,
32KB RAM, BT 4.2,
PSoC Creator
NEW
BCM20738
CM3, SPI, UART, I2C,
IR TX/RX, ADC, 4 PWM,
KB Scanner, Mouse QD,
40 GPIO, 60 KB RAM,
BT 4.0, ADK
Q316
Q316
Q316
CYBL1147x/57x
CM0, DMA, 2 SCB, I2S
2-Finger1, 4 TCPWM, 4 PWM,
ADC, 36 GPIO, 256KB Flash,
32KB RAM, BT 4.2,
PSoC Creator
CY8C41x8-BL5xx
CM0, DMA, 2 SCB, 4 Opamp,
2 CMP13, ADC, 4 TCPWM,
32KB RAM, BT 4.2,
PSoC Creator
CY8C42x8-BL5xx
CM0, DMA, 2 SCB, 4 Opamp,
2 CMP, 4 UDB14, ADC,
4 TCPWM, 36 GPIO,
256KB Flash, 32KB RAM,
BT 4.2, PSoC Creator
CYBL1057x
CM0, 2 SCB, I2S
2-Finger, 4 TCPWM,
4 PWM, ADC, 36 GPIO,
CY8C41x8-BL4xx
CM0, 2 SCB, ADC, 4 Opamp,
2 CMP, 4 TCPWM, 36 GPIO,
CY8C42x8-BL4xx
2 CMP, 4 UDB, 4 TCPWM,
32KB RAM, BT 4.1,
PSoC Creator
CYBL1046x/57x
CM0, 2 SCB, I2S, 2-Finger,
4 TCPWM, 4 PWM, ADC,
32KB RAM, BT 4.2,
PSoC Creator
CY8C41x7-BL4xx
2 CMP, 4 TCPWM, 36 GPIO,
CY8C42x7-BL4xx
2 CMP, 4 UDB, 4 TCPWM,
16KB RAM, BT 4.1,
PSoC Creator
NEW
BCM20737
LE Audio, NFC15, Crypto,
14 GPIO, 60KB RAM,
BT 4.1, WICED SDK
NEW
NEW
BCM20732
14 GPIO, 60KB RAM, BT 4.0,
WICED SDK
BCM20736
IR TX/RX, ADC, A4WP16,
4 PWM, 40 GPIO, 60KB RAM,
BT4.1, WICED SDK
CYBL1016x
CM0, 2 SCB, I2S, 4 TCPWM,
4 PWM, ADC, 36 GPIO,
Integration and Flexibility

1
Touch-sensing technology with up to 2-finger

gestures
2 ARM Cortex-M0/M0+/M3/M4
3 Broadcom serial communications block
4 Infrared transmit and receive
5 Keyboard scanner
6 Mouse quadrature decoder
13
14
Cryptographic accelerator block for security

Bluetooth Specification
9 Software development kit
10 Direct memory access
11 Serial communication block
(SPI/I2C/UART)
12 Timer/Counter/PWM
Comparator
15 Out-of-Band pairing with NFC
16 Alliance for Wireless Power BLE
Profile
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
56
BCM20737
Bluetooth Low Energy Connectivity MCU with Security and Wireless Charging
Block Diagram
Wearables, medical, home automation, toys
MCU Subsystem
Industrys Most-Widely-Deployed BLE Stack

Bluetooth Low Energy (BLE) Features
Bluetooth 4.1 compliant
Simultaneous multiple Master and Slave (1M, 3S)
Alliance for Wireless Charging (A4WP) support
Proprietary low-energy audio (LE Audio) support
Out-of-band (OOB) pairing using near-field communication (NFC)
Secure over-the-air (OTA) firmware upgrade
Security Engine
RSA, X.509, SHA, AES128
Packages
32-pin QFN (5 x 5 mm), 80-ball WLCSP (2.2 x 2.2 mm)
FCC and CE-certified 6.5 x 6.5 x 1.2-mm modules with antenna
WICED SMART SDK 2.1 (and later)
Collateral
16-bit
DelSig
ADC1
Cortex-M3
24 MHz
SRAM
(60KB)
ROM (320KB)
Communication
Interfaces
BLE Stack
Security Engine
Profiles
A4WP
I/O Subsystem
GPIO x14
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
Master
NFC
LE Audio
SPI
BLE System
(Bluetooth 4.1)
JTAG Debug
BCM20737
WICED SMART SDK
WICED SMART SDK 2.x and
BCM92073x_LE_TAG4
Availability
Production:
1 Effective
Analog Peripheral
System Bus
Features
Datasheet:
Software:
Quick Start Guide:
BLE Connectivity MCU
I/O Ring Bus
Applications
Now
number of bits is 10 at 187 ksps
57
BCM20736
Bluetooth Low Energy Connectivity MCU with Wireless Charging
Features
Support for all standard Bluetooth 4.1 low energy profiles including
Alliance for Wireless Charging (A4WP)
Pre-standard BLE mesh
Over-the-air (OTA) firmware upgrade
Packages
32-pin QFN (5 x 5 mm)

MCU Subsystem
Analog Peripheral
16-bit
DelSig
ADC1
Cortex-M3
24 MHz
SRAM
(60KB)
ROM (320KB)
Communication
Interfaces
BLE Stack
Profiles
A4WP
I/O Subsystem
I/O Ring Bus
Beacons, tags, toys, industrial/home automation
Block Diagram
System Bus
Applications
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
Master
SPI
WICED SMART SDK 2.1 (and later)
Collateral
Datasheet:
BCM20736
Software:
WICED SMART SDK
Quick Start Guide: WICED SMART SDK 2.x and
BCM92073x_LE_TAG4
BLE System
(Bluetooth 4.1)
JTAG Debug
Availability
Production:
1 Effective
Now
58
BCM20738
Bluetooth Low Energy Connectivity MCU
Human interface device (HID), remote control, game controller,

remote sensor
Block Diagram
MCU Subsystem
Analog Peripheral
Features

LE HID (HoGP1)
HID-Specific Peripherals
8x20 keyboard scanner
3-axis quadrature decoder for mice/joysticks
40 GPIOs
Packages
80-ball BGA (7 x 7 mm)
HID Application Development Kit (ADK)
24 MHz
SRAM
(60KB)
ROM (320KB)
Communication
Interfaces
BLE Stack
Profiles
System Bus
16-bit
DelSig
ADC2
Cortex-M3
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
Master
SPI
BLE System
(Bluetooth 4.0)
I/O Subsystem
I/O Ring Bus
Applications
Keyboard
Scanner
Quad Decoder
JTAG Debug
Collateral
Datasheet:
Software:
BCM20738
HID ADK (Contact Sales)
Availability
Production:
1
2
Now
HID-over-GATT profile
Effective number of bits is 10 at 187 ksps
59
BCM20732
Bluetooth Low Energy Connectivity MCU
Proximity and asset tracking, beacons, tags, remote sensor,

cable replacement
Block Diagram
MCU Subsystem
Analog Peripheral
Features

Entry-level, single connection BLE
24 MHz
SRAM
(60KB)
ROM (320KB)
BLE Stack
Packages
Profiles
BLE System
(Bluetooth 4.0)
Digital Peripherals
UART x2
PWM x4
Master
SPI
Collateral
GPIO x14
IR RX/TX
I2C/SPI
WICED SMART SDK 1.x
Datasheet:
BCM20732 (Contact Sales)
Software:
WICED SMART SDK
Quick Start Guide: WICED SMART SDK 1.x and
BCM920732_BLE_KIT
Communication
Interfaces
System Bus
16-bit
DelSig
ADC1
Cortex-M3
I/O Subsystem
I/O Ring Bus
Applications
Keyboard
Scanner
Quad Decoder
JTAG Debug
Availability
Production:
1 Effective
Now
60
BCM20719
Ultra Low Power Bluetooth Smart Ready Connectivity Secure MCU
Applications
Medical, home automation, wearables, POS
Block Diagram
MCU Subsystem
Analog Peripheral
I/O Subsystem

Bluetooth 4.2-compliance with LE privacy 1.2, LE data length
extension, LE secure connections
Industrys lowest-power radio
Proprietary low energy audio (LE Audio) support
2-Mbps proprietary BLE support
ARM Cortex-M4 CPU with Floating-Point Unit, Digital-Signal
Processing Logic and 1MB Flash
MIPI-Compliant Display Driver
Security Engine
Public key accelerator (PKA), SHA, AES, RSA, Elliptic Curve
Diffie Hellman (ECDH)
Packages
16-bit
DelSig
ADC1
Cortex-M4
96 MHz
SRAM
(512KB)
Flash
(1MB)
ROM
(2MB)
BR/BLE Stack
Profiles
BR/BLE/2-Mbps
Subsystem
(Bluetooth 4.2)
JTAG Debug
32-kHz/128-kHz
On-Chip OSC
Industrys Most-Widely-Deployed Bluetooth Stack
I/O Ring Bus
Features
TRIAC Control
x4
Communication
Interfaces
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x6
I2C/SPI Master
Keyboard
Scanner
SPI/Dual SPI/
Quad SPI/MIPI
Quad Decoder
Security Engine
PKA
SHA
AES
WICED SMART Ready SDK
Collateral
Datasheet:
Software:
1 Effective
Availability
WICED SMART Ready SDK (Contact Sales)
Sampling:
Production:
Q416
Q117
61
PSoC 4 BLE (CY8C4xxx-BL)

Programmable System-on-Chip with Bluetooth Low Energy
Block Diagram
Features
ARM Cortex-M0 with DMA, 256KB flash and 32KB SRAM
Programmable Analog Front End
One 12-bit, 1-Msps SAR ADC
One Cypress Capacitive Sigma-Delta (CSD) controller with
touchpad capability
Programmable Digital Logic
Four universal digital blocks (UDBs): custom digital peripherals
Two configurable serial communication blocks (SCBs)2
Packages
56-pin QFN, 68/76-ball CSP and thin CSP3
Bluetooth Smart Connectivity with Bluetooth 4.2
Collateral
modulator
Serial communication block configurable as I2C/SPI/UART
MCU Subsystem
Programmable Analog
Blocks
Cortex-M0
48 MHz
BLE System
(Bluetooth 4.2)
Flash
(256KB)
SRAM
(32KB)
DMA
Opamp
x4
SAR
ADC
CMP
x2
CSD
Blocks
UDB x4
TCPWM x4
SCB x2
I/O Subsystem
GPIO x8
GPIO x8
GPIO x8
GPIO x8
Segment LCD Drive

Serial Wire Debug
GPIO x4
Availability
Datasheet:
CY8C4xxx-BL
Software:
PSoC Creator IDE
Application Note: Getting Started With PSoC 4 BLE
1 Timer/Counter/Pulse-Width
Sports and fitness monitors, wearable electronics, medical devices,

home automation solutions, game controllers, sensor-based
low-power systems for IoT
Applications
Sampling:
Production:
128KB
Now
Now
256KB
Now
Now
256KB with BLE 4.2

Now
Q316
A thinner CSP package, 0.38 mm thick as compared to 0.55 mm for a regular CSP package
62
PRoC BLE (CYBL1x1x/4x/5xx)

Programmable Radio-on-Chip with Bluetooth Low Energy
Block Diagram
Features
ARM Cortex-M0 with DMA, 256KB flash and 32KB SRAM
with SmartSense Auto-tuning
One Cypress Capacitive Sigma-Delta (CSD) controller with
touchpad capability
CapSense
Analog and Digital Peripherals

One 12-bit, 1-Msps SAR ADC
Two configurable serial communication blocks (SCBs)2
Dedicated I2S Tx/Rx interface
Up to four additional PWMs
Packages
56-pin QFN, 68/76-ball CSP and thin CSP3
PRoC BLE One-Chip Solution

MCU Subsystem
Analog Peripheral
I/O Subsystem
GPIO x8
SAR
ADC
CORTEX-M0
48 MHz
BLE System
(Bluetooth 4.2)
Flash
(256KB)
SRAM
(32KB)
DMA
CSD
Digital Peripherals
I2S
TCPWM x4
SCB x2
BLE connectivity, wireless touch mice, wireless keyboards

with trackpads, wireless trackpads, wireless remote control
with trackpads, wireless toys
Applications
GPIO x4
Availability
Datasheet:
CYBL1x1x/4x/5xx
Software:
PSoC Creator IDE
Application Note: Getting Started With PRoC BLE
Counter, Pulse-Width Modulator
Serial communication block configurable as I2C/SPI/UART
GPIO x8
Segment LCD Drive
Collateral
GPIO x8
Serial Wire Debug
Bluetooth Smart Connectivity With Bluetooth 4.2

2.4-GHz BLE radio with integrated Balun
1 Timer,
GPIO x8
Sampling:
Production:
3
128KB
Now
Now
256KB
Now
Now
256KB with BLE 4.2

Now
Q316
A thinner CSP package, 0.38 mm thick as compared to 0.55 mm for a regular CSP package
63

Roadmap
Bluetooth classic + BLE PORTFOLIO
64
Bluetooth Classic + BLE Portfolio

BR1 +BLE
BR + EDR2
BR + EDR + BLE3
NEW
Q416
BCM20735
48-MHz CM44, 2 SPI (Quad/Dual),
UART, I2C, IR TX/RX5, ADC,
6 PWM, KB Scanner6, Mouse QD7,
GCI8, 4 TRIAC Control,
40 GPIO, 384KB RAM,
BT9 4.2 + BLE + 2 Mbps, C1/C2/C310,
WICED SMART READY
Q416
NEW
BCM207x9
ULP11, 48-MHz CM4, 2 SPI (Quad/Dual),
UART, I2C, IR TX/RX, ADC,
6 PWM, KB Scanner, Mouse QD,
GCI, Crypto12, 4 TRIAC Control,
40 GPIO, 1MB Flash, 512KB RAM,
BT 4.2 + BLE + 2 Mbps, C2/C3,
WICED SMART READY
CPU Performance
NEW
NEW
BCM20707
96-MHz CM3, 2 SPI, UART, I2C,
GCI, 4 PWM, I2S/PCM,
24 GPIO, 352KB RAM,
BT 4.1 + EDR + BLE, C1/C2
WICED SMART READY
NEW
NEW
NEW
BCM20706
96-MHz CM3 Embedded BT SoC,
2 SPI, UART, I2C, IR TX/RX,
ADC, 4 PWM, GCI, I2S/PCM, 4 TRIAC
Control, 24 GPIO, 352KB RAM,
WICED SMART READY
BCM20704
96-MHz CM3, UART, I2C,
USB 2.0, I2S/PCM, GCI
8 GPIO, 352KB RAM,
HCI-Over-UART/USB 2.0
BCM20730
24-MHz CM3, 2 SPI, UART, I2C,
IR TX/RX, ADC, 4 PWM, KB Scanner,
Mouse QD, 4 TRIAC Control, 3D Glass,
40 GPIO, 60KB RAM,
BT 3.0, C2/C3, ADK
BCM20734
96-MHz CM3, 2 SPI, UART, I2C, GCI,
IR TX/RX, ADC, 4 PWM, KB Scanner,
Mouse QD, I2S/PCM, 4 TRIAC Control,
3D Glass13, 40 GPIO, 352KB RAM,
BT 4.1 + EDR + BLE, C1/C2, ADK14
NEW
BCM20733
24 MHz-ARM7TDMI-S15, 2 SPI,
UART, I2C, ADC, IR TX/RX, 4 PWM,
KB Scanner, Mouse QD, I2S/PCM,
4 TRIAC Control, 3D Glass,
CDAA16, 58 GPIO, 80KB RAM,
BT 3.0 + EDR, C1/C2/C3, ADK
Integration
1
13
2 Enhanced
14
Basic Rate
data rate
4 ARM Cortex-M3/M4
5 Infrared transmit and receive
6 Keyboard scanner
Mouse quadrature decoder

Global coexistence interface
9 Bluetooth Specification 3.0/4/1/4.2
10 Class 1 (100 m)/2 (10 m)/3 (1 m)
11 Ultra-low power
12 Cryptographic accelerator block for security
3D Glass shutter control

Application Development Kit
15 ARM 7 Family CPU
16 Class-D Audio Amplifier
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
65
BCM20733
Bluetooth Connectivity MCU
Features
Bluetooth Features
Basic rate Bluetooth 3.0 stack
Ideal for HID/trackpad applications
Two, independent, half-duplex PCM/I2S interfaces
Integrated 200-mW, filter-less, class-D audio amplifier (CDAA)
Dedicated GPIO for sinking up to 100 mA current
8x20 keyboard scanner, 3-axis quadrature decoder
40 GPIO
Packages
81-ball FBGA (8 x 8 mm)
Collateral
Datasheet: BCM20733 (Contact Sales)
Software: HID ADK (Contact Sales)

MCU Subsystem
16-bit
DelSig
ADC1
CDAA
Cortex-M3
24 MHz
TRIAC Control
x4
SRAM
(60KB)
ROM (320KB)
Communication
Interfaces
Bluetooth Stack
Profiles
I/O Subsystem
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
Master
SPI
Keyboard
Scanner
Bluetooth System
(Bluetooth 3.0)
Quad Decoder
JTAG Debug
3D Glass
Availability
Production:
Analog Peripheral
I/O Ring Bus
Human-interface devices (HID), joysticks, remote controls
Block Diagram
System Bus
Applications
Now
66
BCM20730
Applications
Human-interface-devices (HID) and 3D-glasses
Block Diagram
MCU Subsystem
Analog Peripheral
I/O Subsystem
Bluetooth Features
Bluetooth 3.0 stack with basic rate
Optimized low-power sniff mode
Small form factor solution
Application Specific Peripherals
Two independent half-duplex PCM/I2S interfaces
8x20 keyboard scanner, 3-axis quadrature decoder
3D-glass shutter-control
40 GPIO
Packages
40-pin QFN (6 x 6 mm),
64-pin BGA (7 x 7 mm)
16-bit
DelSig
ADC1
ARM7TDMI-S
24 MHz
TRIAC Control
x4
SRAM
(80KB)
ROM (384KB)
Communication
Interfaces
Bluetooth Stack
Profiles
System Bus
Digital Peripherals
UART x2
PWM x4
Master
SPI
JTAG Debug
GPIO x40
IR RX/TX
I2C/SPI
Bluetooth System
(Bluetooth 3.0)
I/O Ring Bus
Features
I2S/PCM
Keyboard
Scanner
Quad Decoder
3D Glass
Collateral
Datasheet: BCM20730
Availability
Production:
1 Effective
Now
67
BCM20707
Block Diagram
HCI-based Bluetooth and dongles

MCU Subsystem
Analog Peripheral
Features
Bluetooth Features
Bluetooth 4.1 + high-speed stack with BR1/EDR2/BLE3
Class 1 (100 meters), Class 2 (10 meters) support
Global coexistence interface (GCI)
Wideband speech (16K) support
Up to 16 LE connections
Host controller interface (HCI) over UART
Application Specific Peripherals

Two independent half-duplex PCM/I2S interfaces
96 MHz
Bluetooth Stack
Profiles
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
GCI
Collateral
Communication
Interfaces
ROM (848KB)
Package
49-pin FBGA (4.5 x 4.0 mm)
WICED SMART READY SDK
TRIAC Control
x4
SRAM
(352KB)
System Bus
16-bit
DelSig
ADC4
Cortex-M3
I/O Subsystem
I/O Ring Bus
Applications
Master
SPI
Bluetooth System
(Bluetooth 4.1)
I2S/PCM
JTAG Debug
Datasheet: BCM20707
Software: WICED SMART READY SDK (Contact Sales)
Availability
Production:
1 Basic
Rate
Enhanced Data Rate
Now

68
BCM20704
Applications
HCI-based Bluetooth and dongles
Block Diagram
MCU Subsystem
I/O Subsystem
Bluetooth Features
Bluetooth 4.1 + high-speed stack with BR1/EDR2/BLE3
Host controller interface (HCI) over UART and USB
Cortex-M3
96 MHz
SRAM
(352KB)
Bluetooth Stack
Package
49-pin FCBGA (4.5 x 4.0 mm)
Profiles
GPIO x8
Communication
Interfaces
ROM (848KB)
System Bus
I/O Ring Bus
Features
UART x2
I2C/SPI Master
Collateral
Datasheet: BCM20704
GCI
I2S/PCM
Bluetooth System
(Bluetooth 4.1)
USB 2.0
JTAG Debug
Availability
Production:
Now
Basic Rate
Enhanced Data Rate
2
69
BCM20706
Applications
Block Diagram
Speaker/Headset, Bluetooth gateway, automation gateway

MCU Subsystem
Analog Peripheral
I/O Subsystem
16-bit
DelSig
ADC4
Cortex-M3
96 MHz
Package
49-pin FBGA (4.5 x 4.0 mm)
Communication
Interfaces
ROM (848KB)
Bluetooth Stack
Profiles

GCI
GPIO x24
Digital Peripherals
IR RX/TX
UART x2
PWM x4
I2C/SPI
Master
SPI
Collateral
Datasheet: BCM20706
TRIAC Control
x4
SRAM
(352KB)
System Bus
Bluetooth Features
Hostless, complete system-on-chip with Bluetooth 4.1 stack with
BR1/EDR2/BLE3
A2DP, AVRCP, SPP, GATT support
I/O Ring Bus
Features
Bluetooth System
(Bluetooth 4.1)
I2S/PCM
JTAG Debug
Availability
Production:
1 Basic
Rate
Enhanced Data Rate
Now

70
BCM20734
Applications
Block Diagram
Remotes, game controllers, joysticks, POS input devices

MCU Subsystem
Analog Peripheral
I/O Subsystem
Bluetooth Features
Bluetooth 4.1 stack with BR1/EDR2/BLE3
BLE HID profile, Bluetooth device ID profile 1.3
8x20 keyboard scanner
3-axis quadrature decoder for mice/joystick
I2S/PCM/PDM for audio use case
40 GPIO
96 MHz
Communication
Interfaces
ROM (848KB)
Bluetooth Stack
Profiles
JTAG Debug
Digital Peripherals
UART x2
PWM x4
Master
SPI
Bluetooth System
(Bluetooth 4.1)
GPIO x40
IR RX/TX
I2C/SPI
GCI
Collateral
TRIAC Control
x4
SRAM
(352KB)
Package
90-pin FBGA (8.5 x 8.5 mm)
16-bit
DelSig
ADC4
Cortex-M3
System Bus
I/O Ring Bus
Features
I2S/PCM/PDM
Keyboard
Scanner
Quad Decoder
3D Glass
Datasheet: BCM20734
Availability
Production:
1 Basic
Rate
Enhanced Data Rate
Now

71
BCM20735
Bluetooth Smart and Basic Rate Connectivity MCU
Features
Bluetooth Features
Bluetooth 4.2 stack with basic rate and Bluetooth Low Energy (BLE)
All new Bluetooth 4.2 features: LE privacy 1.2, LE data length
Industrys lowest-power radio
Integrated power amplifier (up to 10 dBm)
ARM Cortex-M4 CPU With Floating-Point Unit (FPU) and
Digital-Signal Processing (DSP) Logic

MCU Subsystem
96 MHz
SRAM
(512KB)
Packages
Collateral
Datasheet: BCM20735
1
TRIAC Control
x4
Communication
Interfaces
ROM
(2MB)
BR/BLE Stack
Profiles
BR/BLE/2-Mbps
Subsystem
(Bluetooth 4.2)
JTAG Debug
32-kHz/128-kHz
On-Chip OSC
I/O Subsystem
16-bit
DelSig
ADC1
Cortex-M4

Security Engine
PKA, SHA, AES
Analog Peripheral
I/O Ring Bus
Remote controls, BR-gateways
Block Diagram
AHB Bus
Applications
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x6
I2C/SPI Master
Keyboard
Scanner
SPI/Dual SPI/
Quad SPI/MIPI
Quad Decoder
Security Engine
PKA
SHA
AES
Availability
Sampling:
Production:
Now
Q416
72
BCM207x9
Ultra Low Power Multi-Protocol Connectivity MCU
Applications
Block Diagram
Medical, home automation, wearables, POS input devices
Multi-Protocol Connectivity MCU

MCU Subsystem
Analog Peripheral
16-bit
DelSig
ADC5
Cortex-M4
SRAM
(512KB)
Cortex-M4
CPU With Floating-Point Unit (FPU),

Digital-Signal Processing (DSP) Logic and 1MB Flash
TRIAC Control
x4
Flash
(1MB)
Communication
Interfaces
ROM
(2MB)
BR/BLE/ZigBee/Th
read Stack
802.15.4 ZigBee and Thread Support

ARM
96 MHz
AHB Bus
Bluetooth Features
Industrys lowest power Bluetooth radio
Bluetooth 4.2 stack with BR1/EDR2/BLE3
All new, Bluetooth 4.2 features: LE privacy 1.2, LE data length
LE audio
Profiles
802.15.4/BR/BLE/
2-Mbps Subsystem
(Bluetooth 4.2)

Security Engine
PKA, SHA, AES, RSA, ECDH4
JTAG Debug
Packages
I/O Subsystem
I/O Ring Bus
Features
32-kHz/128-kHz
On-Chip OSC
GPIO x40
Digital Peripherals
IR RX/TX
UART x2
PWM x6
I2C/SPI Master
Keyboard
Scanner
SPI/Dual SPI/
Quad SPI/MIPI
Quad Decoder
Security Engine
PKA
SHA
AES
Availability
Collateral
Datasheet: BCM207x9 (Contact Sales)
1 Basic
Rate
Enhanced Data Rate

Elliptic-Curve Diffie Hellman
Sampling:
Production:
5
BCM20719
Q416
Q117
BCM20729
Q117
BCM20739
Q117
73

Roadmap
Wi-Fi PORTFOLIO
74
Wi-Fi Portfolio
IEEE 802.11a/b/g/n WLAN1
NEW
Q316
BCM43909
Up to 150 Mbps, 802.11a/b/g/n, SISO7, 320-MHz CR48,
GCI SECI9, Security, CCX, DDR3/3L I/F10,
Ethernet (RMII/MII), 6 PWM, SDIO 3.0 (H/D),
USB 2.0 + HSIC (H/D), S/PDIF, 3 UART, Quad SPI, 2 SPI,
2 I2S, 2 I2C, 17 GPIO, Integrated PA for both bands
WICED
NEW
BCM43907
Up to 150 Mbps, 802.11a/b/g/n, SISO, 320-MHz CR4,
GCI SECI, Security, CCX, 6 PWMs, Ethernet (RMII/MII),
SDIO 3.0 (H/D), USB 2.0 + HSIC (H/D),
S/PDIF, 3 UART, Quad SPI, 2 SPI, 2 I2S, 2 I2C
17 GPIO, Integrated PA for both bands
WICED
BCM43243
Up to 300 Mbps, 802.11a/b/g/n,
2x2 MIMO, Security, CCX
USB2.0
13 GPIO, Integrated PA for both bands
Linux Driver
NEW
Single Band
(2.4 GHz)
NEW
BCM43236B
Up to 300 Mbps, 802.11a/b/g/n,
2x2 MIMO2, SECI3, Security4, CCX5,
USB 2.0 + HSIC, SPI,
8 GPIO, Integrated PA6 for both bands
Linux Driver
NEW
NEW
Data Rate
Dual Band
(2.4/5 GHz)
NEW
IEEE 802.11a/b/g/n WLAN + MCU
BCM43143
Up to 150 Mbps, 802.11b/g/n, SISO
GCI SECI, Security,
SDIO 2.0, USB 2.0, I2C/SPI
19 GPIO, Integrated PA
Linux Driver
NEW
BCM43364
GCI SECI, Security, CCX
SDIO 2.0, SPI,
Linux Driver, WICED
NEW
BCM43362
SECI, Security,
SDIO 2.0, SPI,
Linux Driver, WICED
5 Cisco
6 Power
10

Multiple-input multiple-output
3 Serial enhanced coexistence interface
4 WPA, WAPI STA, WPA2, AES, TKIP security features
Compatible Extensions
amplifier
7 Single-input single-output
8 ARM Cortex-M3/R4
BCM43903
Up to 72 Mbps, 802.11b/g/n, SISO,
160-MHz CR4, GCI SECI, Security, CCX,
6 PWMs, 3 UART, Quad SPI, 2 SPI, 2 I2C
WICED
BCM4390
Up to 72 Mbps, 802.11b/g/n, SISO,
48-MHz CM3, GCI, Security, CCX,
6 PWMs, 4 UART, I2S, 2 SPI, I2C
WICED

Double data rate type
three/-L memory interface
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
75
BCM43362
Single-Chip IEEE 802.11n MAC/Baseband/Radio + SDIO Connectivity Solution
Applications
Consumer and commercial internet-of-things (IoT),
sensors and control
Block Diagram
Single-Chip Wi-Fi Connectivity Solution
I/O Subsystem
Wi-Fi Subsystem
Features
I/O Ring Bus
MAC
Industrys Most-Widely-Deployed Wi-Fi IP
Security Engine1
WPA and WPA2
AES in hardware
Packages
69-ball WLBGA (4.52 x 2.92 mm)
WICED Wi-Fi SDK, Linux Driver
Collateral
Datasheet:
Software:
PHY
Radio
Communication
Interfaces
Security Engine
ARM
Cortex-M3
UART
SPI
SRAM
(240KB)
ROM
(448KB)
SDIO
SECI
JTAG Debug
BCM43362
WICED Wi-Fi SDK
Linux Driver
Availability
Production:
System Bus
Wi-Fi Features
802.11b/g/n compliant
72-Mbps data rate
Single band (2.4 GHz)
SDIO 2.0 and SPI support
3-/4-wire serial enhanced coexistence interface (SECI)
GPIO x5
Now
WPA, WAPI STA, WPA2, AES, TKIP security features
76
BCM43364
Single-Chip IEEE 802.11n MAC/Baseband/Radio
Applications
Block Diagram
Low-cost WLAN connectivity for consumer/commercial IoT
Security Engine2
WPA and WPA2
AES in hardware
Cisco Compatible Extensions
PHY
Communication
Interfaces
Security Engine
ARM
Cortex-M3
UART
SPI
SRAM
(512KB)
Packages
ROM
(640KB)
SDIO
GCI SECI
JTAG Debug
Collateral
BCM43364
WICED Wi-Fi SDK
Linux Driver
Availability
Production:
GPIO x5
Radio
System Bus
Wi-Fi Features
96-Mbps data rate
2-/3-/4-wire global coexistence interface (GCI) SECI1
I/O Ring Bus
MAC
Datasheet:
Software:
I/O Subsystem
Wi-Fi Subsystem
Features
Serial enhanced coexistence interface
2 WPA,
Now
WAPI STA, WPA2, AES, TKIP security features
77
BCM43143
Single-Chip IEEE 802.11n MAC/Baseband/Radio + SDIO/USB Connectivity Solution
Applications
Block Diagram
Consumer electronics, printers
Security Engine2
WPA and WPA2
AES in hardware
PHY
GPIO x19
Radio
Communication
Interfaces
Security Engine
ARM Cortex-M3
System Bus
Wi-Fi Features
150-Mbps data rate
SDIO 2.0 and USB 2.0 support
I/O Ring Bus
MAC
UART
USB2.0
SRAM
(256KB)
Packages
SDIO
ROM
(448KB)
Linux Driver
Collateral
Datasheet:
Software:
I/O Subsystem
Wi-Fi Subsystem
Features
JTAG Debug
GCI SECI
I2C/SPI
BCM43143
Linux Driver
Availability
Production:
2 WPA,
Now
78
BCM43243
Single-Chip IEEE 802.11n MAC/Baseband/Radio + USB Connectivity
Applications
Consumer electronics, wireless media applications
Block Diagram
I/O Subsystem
Wi-Fi Subsystem
Features
I/O Ring Bus
MAC

PHY
2x2 Dual-Band
Radio
Security Engine
Engine1
Security
WPA and WPA2
AES in hardware
Packages
FCFBGA (10 x 10 mm)
Linux Driver
Communication
Interfaces
USB 2.0
SRAM
(512KB)
ROM
(640KB)
JTAG Debug
Collateral
Datasheet:
Software:
ARM Cortex-M3
GPIO x13
System Bus
Wi-Fi Features
802.11a/b/g/n compliant
300-Mbps data rate
Dual band (2.4/5 GHz)
2x2 Multiple-input multiple-output (MIMO)
USB 2.0 support
BCM43243
Linux Driver
Availability
Production:
Now
79
BCM43236/BCM43236B
Single-Chip IEEE 802.11n MAC/Baseband/Radio + USB Connectivity
Applications
USB 2.0 dongles, HSIC media modules
Block Diagram
I/O Subsystem
Wi-Fi Subsystem
Wi-Fi Features
300-Mbps data rate
USB 2.0 support
5-wire legacy serial enhanced coexistence interface (SECI)
Security Engine1
WPA and WPA2
AES in hardware
Packages
88-pin QFN (10 x 10 mm)
MAC
I/O Ring Bus
PHY
2x2 Dual-Band
Radio
Security Engine
ARM Cortex-M3
GPIO x8
Communication
Interfaces
System Bus
Features
USB 2.0/HSIC
SRAM
(512KB)
ROM
(640KB)
Linux Driver
JTAG Debug
5-Wire Legacy
SECI
SPI
Collateral
Datasheet:
Software:
BCM43236/BCM43236B
Linux Driver
Availability
Production:
Now
80
BCM4390
IEEE 802.11n System-on-Chip with Embedded Application Processor
Applications
Block Diagram
Consumer, home automation, health, smart energy

Wi-Fi Subsystem
Features
MAC
GPIO x24
PHY
Security Engine2
WPA and WPA2
AES in hardware
AXI
SRAM
(1MB)
Radio
Digital
Peripherals
ROM
(610KB)
Security Engine
AXI
32-bit ARM Cortex-M3 Application MCU Subsystem
I/O Subsystem
Cortex-M3
48 MHz
Wi-Fi Features
72-Mbps data rate
ARM
JTAG Debug
PWM x6
Cortex-M3
Communication Interfaces
SRAM
(256KB)
Packages
286-ball WLCSP (4.87 x 5.413 mm)
ROM
(448KB)
WICED Wi-Fi SDK
UART x4
GCISECI
SPI x2
I2C x2
JTAG Debug
Collateral
Datasheet:
Software:
Application MCU Subsystem
BCM4390
WICED Wi-Fi SDK
Availability
Production:
2 WPA,
Now
81
BCM43907
Applications
Block Diagram
Appliances, HID, embedded audio, health/medical

Wi-Fi Subsystem
Features
MAC
GPIO x17

PHY
SRAM
(1MB)
2.4/5-GHz
Dual-Band Radio
Ethernet (RMII/MII)
Digital
Peripherals
ROM
(610KB)
Security Engine
AXI
32-bit ARM Cortex-R4 Application MCU Subsystem
Cortex-R4
320 MHz
AXI
Wi-Fi Features
150-Mbps data rate
I/O Subsystem
JTAG Debug
PWM x6
ARM Cortex-R4
(160 MHz)
Security Engine2
WPA and WPA2
AES in hardware
SRAM
(2MB)
Packages
316-ball WLCSP (4.58 x 5.53 mm)
WICED Wi-Fi SDK
UART x3
GCI SECI
Ethernet
(RMII/MII)
ROM
(640KB)
SPI x2
I2C x2
USB 2.0
HSIC
JTAG Debug
Quad SPI
SDIO 3.0
Collateral
Datasheet:
Software:
Availability
BCM43907
WICED Wi-Fi SDK
Production:
2 WPA,
Now
82
BCM43909
Applications
Block Diagram
Appliances, HID devices, embedded audio, health/medical

Wi-Fi Subsystem
Features
MAC
GPIO x17

PHY
SRAM
(1MB)
2.4/5-GHz
Dual-Band Radio
Ethernet (RMII/MII), DDR3/3L interface
Digital
Peripherals
ROM
(610KB)
Security Engine
AXI
Cortex-R4
320 MHz
AXI
Wi-Fi Features
150-Mbps data rate
I/O Subsystem
JTAG Debug
PWM x6
ARM Cortex-R4
(160 MHz)
Security Engine2
WPA and WPA2
AES in hardware
SRAM
(2MB)
Packages
338-ball FCFBGA (10 x 10 mm)
WICED Wi-Fi SDK
UART x3
GCI SECI
Ethernet
(RMII/MII)
ROM
(640KB)
SPI x2
I2C x2
USB 2.0
HSIC
JTAG Debug
Quad SPI
SDIO 3.0
DDR3/3L
I/F
Collateral
Datasheet:
Software:
BCM43909
WICED Wi-Fi SDK
Availability
Production:
2 WPA,
Now
83
BCM43903
Applications
Block Diagram
Consumer/home appliances, HID

Wi-Fi Subsystem
I/O Subsystem
Features
MAC
Wi-Fi Features
72-Mbps data rate
Security Engine2
WPA and WPA2
AES in hardware
PHY
SRAM
(1MB)
Single-Band Radio
Digital
Peripherals
ROM
(610KB)
Security Engine1
JTAG Debug
PWM x6
ARM Cortex-R4
(160 MHz)
SRAM
(1MB)
Packages
151-ball WLBGA (4.91 x 5.85 mm)
WICED Wi-Fi SDK
Collateral
Datasheet:
Software:
Cortex-R4
320 MHz
AXI
GPIO x17
AXI
UART x3
GCI SECI
ROM
(640KB)
SPI x2
I2C x2
JTAG Debug
Quad SPI
SDIO 3.0
BCM43903
WICED Wi-Fi SDK
Availability
Production:
2 WPA,
Now
84

Roadmap
Wi-Fi + Bluetooth Combo PORTFOLIO
85
Wi-Fi + Bluetooth Combo Portfolio

IEEE 802.11a/b/g/n WLAN1 +
Bluetooth (BR2 + EDR3 + BLE4)
Q117
Single-Band
(2.4 GHz)
Dual-Band
(2.4/5 GHz)
NEW
BCM43012
Up to 96 Mbps, ULP5, 802.11a/b/g/n,
BT6 5.0, SDIO 3.0, Security7, UART,
SPI, 2 PCM/I2S, 16 GPIOs
WICED
NEW
NEW
NEW
BCM4334
Up to 150 Mbps, 802.11a/b/g/n, BT 4.0,
SECI8, Security, SDIO 2.0, SPI,
HSIC, HCI-over-UART, 2 PCM/I2S,
FM RX, I2S for FM, 16 GPIOs,
Linux Driver
BCM43340
Up to 150 Mbps, 802.11a/b/g/n, BT 4.0,
SECI, Security, SDIO 2.0, SPI,
HSIC, HCI-over-UART, 2 PCM/I2S,
I2S/Stereo Audio for FM, 8 GPIOs,
Integrated PA,
Linux Driver, WICED
NEW
NEW
NEW
BCM43438/BCM4343W
Up to 96 Mbps, 802.11b/g/n, BT4.1,
A4WP, GCI SECI, Security, SDIO2.0,
SPI, HCI-over-UART, 2 PCM/I2S,
FM RX, PCM/Stereo Audio for FM,
5 GPIOs, Integrated PA,
Linux Driver, WICED
IEEE 802.11a/b/g/n/ac WLAN +

Bluetooth (BR + EDR + BLE)
BCM43455
Up to 433.3 Mbps, 802.11a/b/g/n/ac,
BT 4.1, A4WP9, GCI10 SECI,
Security, PCIe3.0, SDIO 2.0/3.0,
SPI, HCI-over-UART, PCM/I2S,
FM RX, 15 GPIOs, Integrated PA11,
Linux Driver
NEW
BCM43242
Up to 300 Mbps, 2x2 MIMO,
802.11a/b/g/n w/USB 2.0, Security,
BT 4.1 w/USB/UART, PCM/I2S,
Linux Driver
BCM4339
Up to 433.3 Mbps, 802.11a/b/g/n/ac,
BT4.1, A4WP, GCI SECI,
Security, SDIO2.0/3.0,
SPI, HCI-over-UART, PCM/I2S,
FM RX, 16 GPIOs, Integrated PA,
Linux Driver
NEW
BCM4356
Up to 867 Mbps, 2x2 MIMO12,
802.11a/b/g/n/ac w/PCIe, Security,
BT 4.1 w/UART, PCM/I2S,
Linux Driver
NEW
BCM4354
Up to 867 Mbps, 2x2 MIMO,
802.11a/b/g/n/ac w/SDIO, Security,
BT4.1 w/UART, PCM/I2S,
Linux Driver
BCM4334W
Up to 150 Mbps, 802.11b/g/n, BT4.0,
SECI, Security, SDIO2.0,
SPI, HSIC, HCI-over-UART,
2 PCM/I2S, 8 GPIOs,
Linux Driver
Data Rate
6 Bluetooth
10

Basic Rate
3 Enhanced Data Rate
Ultra-low power
Specification
7 WPA, WAPI STA, WPA2, AES, TKIP
8 Serial enhanced coexistence interface
11
12
Alliance for Wireless Power BLE Profile

Status
Power amplifier
Availability
Multiple-in multiple-out
Concept
Development
Sampling
Production
QQYY
QQYY
86
BCM43438/BCM4343W
Single chip IEEE 802.11n with Integrated Bluetooth 4.1 and FM Receiver
Applications
Block Diagram
Single-Chip Wi-Fi and Bluetooth Connectivity Solution
Wi-Fi Subsystem
Features
Interfaces
MAC And PHY
Wi-Fi Features
96-Mbps data rate
Bluetooth Features
Class 1 (100 m) and Class 2 (10 m) operation
Host controller interface (HCI)-over-UART
FM Features
FM receiver
UART
Single-Band Radio
SPI
Security Engine2
ARM Cortex M3
AXI
Industrys Most-Widely-Deployed Wi-Fi IP and Bluetooth Stack
I/O Subsystem
APB
Portable consumer/commercial IoT and wearables
GPIO x5
PCM/I2S x2
SRAM (512KB)
FM Subsystem
SDIO 2.0
ROM (640KB)
FM RX
JTAG/SWD
GCI2
SECI3
PCM/I2S
Stereo Audio
Bluetooth Subsystem
Bluetooth 4.1
Link Layer And PHY
Packages
153-ball WLCSP (4.87 x 2.87 mm)
SRAM (160KB)
AHB
ARM Cortex M3
ROM (576KB)
JTAG/SWD
WICED Wi-Fi SDK, Linux driver
Collateral
Datasheets:
Software:
1
Availability
BCM43438, BCM4343W
WICED Wi-Fi SDK
Linux Driver
Production:
2 WPA,
BCM43438
Now
BCM4343W
Now
87
BCM4334W
Single chip IEEE 802.11n with Integrated Bluetooth 4.0
Applications
Block Diagram
Portable consumer/commercial IoT, wearables

Wi-Fi Subsystem
Interfaces
MAC And PHY
UART
Single-Band Radio
SPI
Wi-Fi Features
150-Mbps data rate,
SDIO 2.0, SPI and HSIC support
ARM Cortex M3
PCM/I2S x2
SDIO 2.0
ROM (640KB)
JTAG/SWD
Legacy
SECI2
Bluetooth Subsystem
HSIC
Bluetooth 4.0
Link Layer And PHY
Packages
109-ball WLBGA (4.08 x 4.48mm)
208-ball WLCSP (4.08 x 4.48 mm)
Audio Subsystem
MP3
Encoder/Dec
oder
AAC
Decoder
SRAM (173KB)
AHB
ARM Cortex M3
Linux Driver
ROM (680KB)
JTAG/SWD
Collateral
BCM4334W
Linux Driver
Availability
Production:
GPIO x8
SRAM (512KB)
Bluetooth Features
Datasheet:
Software:
AXI
Security Engine1
APB
Features
I/O Subsystem
Now
88
BCM43340
Single chip IEEE 802.11n with Integrated Bluetooth 4.0 and FM Receiver
Applications
Block Diagram
Portable consumer/commercial IoT applications

Wi-Fi Subsystem
Interfaces
MAC And PHY
I/O Subsystem
UART
Dual-Band Radio
Wi-Fi Features
150-Mbps data rate
SDIO 2.0, SPI, HSIC support
SPI
ARM Cortex M3
AXI
Security Engine1
APB
Features
GPIO x8
PCM/I2S
SRAM (512KB)
FM Subsystem
SDIO 2.0
ROM (640KB)
Bluetooth Features
FM RX
JTAG/SWD
Legacy
SECI2
PCM/I2S
Stereo Audio
Bluetooth Subsystem
FM Features
FM receiver
USB/HSIC
Bluetooth 4.0
Link Layer And PHY
SRAM (195KB)
AHB
ARM Cortex M3
Package
141-ball WLBGA (5.67 x 4.47 mm)
ROM (652KB)
JTAG/SWD
Collateral
Datasheet:
Software:

WICED Wi-Fi SDK
Linux Driver
Availability
Production:
Now
89
BCM43242
Single-Chip IEEE 802.11n with Integrated Bluetooth 4.0 + HS
Applications
Block Diagram
Remote controls and sensors

Wi-Fi Subsystem
Interfaces
MAC And PHY
UART
2x2 Dual-Band Radio
Wi-Fi Features
300-Mbps data rate
SPI
AXI
Security Engine1
ARM Cortex M3
I/O Subsystem
APB
Features
GPIO x16
PCM/I2S
SRAM (544KB)
5-Wire SECI2
ROM (640KB)
Bluetooth Features
Bluetooth 4.0 + High Speed compliant
JTAG/SWD
USB
Bluetooth Subsystem
Bluetooth 4.0
Link Layer And PHY
Package
FCFBGA (10 x 10 mm)
SRAM (166KB)
AHB
ARM Cortex M3
Linux Driver
ROM (660KB)
JTAG/SWD
Collateral
Datasheet:
Software:
Availability
BCM43242
WICED Wi-Fi SDK
Linux Driver
Production:
Now
90
BCM4334
Single chip IEEE 802.11n with Integrated Bluetooth 4.0 + HS and FM Receiver
Applications
Block Diagram
Portable consumer/commercial IoT applications

Wi-Fi Subsystem
MAC And PHY
Wi-Fi Features
150-Mbps data rate
SDIO 2.0, SPI, HSIC support
Security Engine1
ARM Cortex M3
GPIO x16
PCM/I2S
FM Subsystem
SDIO 2.0
ROM (640KB)
FM RX
JTAG/SWD
5-Wire
SECI2
PCM/I2S
Bluetooth Subsystem
USB/HSIC
Bluetooth 4.0
Link Layer And PHY
FM Features
FM receiver
SRAM (173KB)
AHB
ARM Cortex M3
Packages
109-ball (4.08 x 4.48 mm)
208-ball WLCSP (4.08 x 4.48 mm)
ROM (680KB)
Linux Driver
JTAG/SWD
Collateral
SPI
SRAM (512KB)
Bluetooth Features
Bluetooth 4.0 + High Speed compliant
Datasheet:
Software:
UART
AXI
Dual-Band Radio
I/O Subsystem
APB
Features
Interfaces
Availability
BCM4334
Linux Driver
Production:
Now
91
BCM4339
Single chip IEEE 802.11ac with Integrated Bluetooth 4.1 and FM Receiver
Block Diagram
High-performance, space-constrained consumer IoT applications

Wi-Fi Subsystem
Features
MAC And PHY

Dual-Band Radio
Wi-Fi Features
802.11b/g/n/ac compliant
433.3-Mbps data rate
Security Engine2
Bluetooth Features
SPI
GPIO x16
PCM/I2S
SRAM (768KB)
FM Subsystem
SDIO 2.0/3.0
ROM (640KB)
FM RX
JTAG/SWD
GCI2
SECI
PCM/I2S
Bluetooth Subsystem
Bluetooth 4.1
Link Layer And PHY
FM Receiver
Packages
160-ball FCFBGA (8 x 8 mm)
145-ball WLBGA (4.87 x 5.41 mm)
286-ball WLCSP (4.87 x 5.41 mm)
SRAM (192KB)
AHB
ARM Cortex M3
ROM (608KB)
Linux Driver
JTAG/SWD
Collateral
ARM Cortex R4
I/O Subsystem
UART
AXI
Industrys Most-Widely deployed Wi-Fi IP and Bluetooth stack
Datasheet:
Software:
Interfaces
APB
Applications
Availability
BCM4339
Linux Driver
Production:
2 WPA,
Now
92
BCM4356
Single-Chip IEEE 802.11ac with Integrated Bluetooth 4.1 and FM Receiver, A4WP
Block Diagram
Consumer electronics and wireless chargingenabled applications

Interfaces
Wi-Fi Subsystem
Features
MAC And PHY
Wi-Fi Features
Bluetooth Features
Alliance for Wireless Power (A4WP) Bluetooth Low Energy profile
UART
2x2 Dual-Band Radio

SPI
Security Engine2
ARM Cortex R4
AXI
I/O Subsystem
APB
Applications
GPIO x16
PCM/I2S
SRAM (768KB)
FM Subsystem
SDIO 2.0/3.0
ROM (640KB)
FM RX
JTAG/SWD
PCIe 3.0
PCM/I2S
Bluetooth Subsystem
GCI2 SECI3
Bluetooth 4.1
Link Layer And PHY
SRAM (200KB)
Packages
192-ball WLBGA (4.87 x 7.67 mm)
395-ball WLCSP (4.87 x 7.67mm)
AHB
ARM Cortex M3
FM Receiver
ROM (668KB)
JTAG/SWD
Linux Driver
Collateral
Datasheet:
Software:
1
Availability
BCM4356
Linux Driver
Production:
2 WPA,
Now
93
BCM43455
Single chip IEEE 802.11ac with Integrated Bluetooth 4.1 and FM Receiver
Block Diagram
High-performance, space-constrained consumer/commercial IoT

Interfaces
Wi-Fi Subsystem
Features
MAC And PHY
Wi-Fi Features
Bluetooth Features
FM Receiver
UART
Dual-Band Radio
SPI
Security Engine2
ARM Cortex R4
AXI
GPIO x15
PCM/I2S
SRAM (800KB)
FM Subsystem
SDIO 2.0/3.0
ROM (704KB)
FM RX
JTAG/SWD
PCIe 3.0
PCM/I2S
Bluetooth Subsystem
GCI2 SECI
Bluetooth 4.1
Link Layer And PHY
Package
140-ball WLBGA (4.47x5.27 mm)
I/O Subsystem
APB
Applications
SRAM (270KB)
Linux Driver
AHB
ARM Cortex M3
ROM (845KB)
Collateral
Datasheet:
Software:
JTAG/SWD
BCM43455
Linux Driver
Availability
Production:
2 WPA,
Now
94
BCM4354
Single-Chip IEEE 802.11ac with Integrated Bluetooth 4.1 and FM Receiver
Block Diagram
High-performance, space-constrained consumer/commercial IoT

Interfaces
Wi-Fi Subsystem
Features
MAC And PHY
Wi-Fi Features
Bluetooth Features
FM Receiver
ARM Cortex R4
GPIO x16
PCM/I2S
SRAM (768KB)
FM Subsystem
SDIO 2.0/3.0
ROM (640KB)
FM RX
JTAG/SWD
PCIe 3.0
PCM/I2S
Bluetooth Subsystem
GCI2 SECI
Bluetooth 4.1
Link Layer And PHY
AHB
SRAM (200KB)
ROM (668KB)
Linux Driver
JTAG/SWD
Collateral
SPI
Security Engine2
ARM Cortex M3
Packages
192-ball WLBGA (4.87 x 7.67 mm)
395-ball WLCSP (4.87 x 7.67mm)
Datasheet:
Software:
UART
2x2 Dual-Band Radio
AXI
I/O Subsystem
APB
Applications
Availability
BCM4354
Linux Driver
Production:
2 WPA,
Now
95
BCM43012
Single-Chip IEEE 802.11n with Integrated Bluetooth 5.0 Ready
Applications
Block Diagram
Smart-home hub for IoT applications

Interfaces
Wi-Fi Subsystem
MAC And PHY
Dual-Band Radio
Ultra-Low-Power
Security Engine1
Wi-Fi Features
96-Mbps data rate
On-chip, low-noise amplifier for both bands
ARM Cortex M3
UART
SPI
AXI
I/O Subsystem
APB
Features
GPIO x16
PCM/I2S x2
SRAM (640KB)
SDIO 2.0/3.0
ROM (1280KB)
Bluetooth Features
Bluetooth 4.2 compliant, Bluetooth 5.0 ready
JTAG/SWD
GCI2 SECI3
Bluetooth Subsystem
Bluetooth 4.2/5.0
Link Layer And PHY
Packages
252-ball WLCSP (3.76 x 4.27 mm)
107-ball RWLBGA (3.96 x 4.47 mm)
SRAM (388KB)
AHB
ARM Cortex M4
ROM (1152KB)
Linux Driver
JTAG/SWD
Collateral
Datasheet:
Software:

Linux Driver
Availability
Sampling:
3 Serial
Q117
enhanced coexistence interface
96

Roadmap
Automotive wireless PORTFOLIO
97
Automotive Wireless Portfolio

Bluetooth (BR1 + EDR2)
IEEE 802.11a/b/g/n/ac WLAN3 + Bluetooth
Performance/Integration
NEW
NEW
Q416
BCM89359
Up to 867 Mbps, 802.11a/b/g/n/ac,
2x2 MIMO10 w/RSDB11, BT 4.2 BR + EDR + BLE,
GCI SECI, SDIO 3.0, PCIe, UART, USB, I2C,
SPI, HCI-over-UART, PCM/I2S, Security12,
20 GPIO, C1/C2,
Linux Driver
BCM89071
24-MHz ARM7TDMI-S4, SPI, UART, I2C,
I2S/PCM, GCI5 SECI6,
HCI7-over-UART/SPI,
8 GPIO, 112KB RAM,
BT8 4.1 BR + EDR, C1/C2/C39
NEW
NEW
BCM88335/BCM43353
Up to 433.3 Mbps, 802.11a/b/g/n/ac, SISO13,
BT4.1 BR + EDR + BLE, GCI SECI,
SDIO2.0/3.0,
SPI, HCI-over-UART, PCM/I2S, Security,
9 GPIO, C1/C2,
Linux Driver
BCM20713
24-MHz ARM7TDMI-S, SPI, UART, I2C,
I2S/PCM, GCI SECI, HCI-over-UART/SPI,
8 GPIO, 16KB RAM,
BT 4.0 BR + EDR, C1/C2/C3
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
11
12
Basic Rate
Enhanced Data Rate
3 Wireless Local Area Network
4 ARM 7 Family CPU
5 Global coexistence interface

Host controller interface
8 Bluetooth Specification
9 Class 1 (100 m)/2 (10 m)/3 (1 m)
10 Multiple-input multiple-output
Real Simultaneous Dual Band

WPA, WAPI STA, WPA2, AES, TKIP, Cisco
Compatible Extensions security features
13 Single-input single-output
98

Roadmap
Proprietary Wireless PORTFOLIO
99
Proprietary Wireless Portfolio

Programmable Radio-on-Chip (PRoC)
GFSK4
2.4-GHz RF
Transceiver
CYRF8935
WUSB2-NL
1 Mbps,
TX 18 mA, RX 18 mA
CYRF89135
PRoC-Embedded
WUSB-NL, M8C3,
35 GPIO, 32KB Flash
GFSK + DSSS5
TrueTouch
CYRF89535
PRoC-TT
WUSB-NL, M8C,
2-Finger,
35 GPIO, 32KB Flash
CYRF89435
PRoC-CS
WUSB-NL, M8C,
35 GPIO, 32KB Flash
CYRF89235
PRoC-USB
WUSB-NL, M8C, USB,
13 GPIO, 32KB Flash
CYRF6936
WUSB-LP
1 Mbps,
TX 26 mA, RX 21 mA
CapSense
MCU
CYRF69xx3
PRoC-LP
WUSB-LP, M8C, USB,
14 GPIO, 8KB Flash
Integration
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
1 Touch-sensing
technology with 2-finger gestures
2 WirelessUSB
3 Cypress
4 Gaussian
5 Direct
frequency shift keying

sequence spread spectrum
proprietary 8-bit MCU
100
Modules
101
EZ-BLETM Module Portfolio

Programmable Radio-on-Chip (EZ-BLETM PRoCTM)
256KB Flash
128KB Flash
256KB Flash
CYBLE-014008-00
EZ-BLE PSoC Module BLE 4.1
4 Opamps, 1 CMP6, 4 UDBs7
CM0, 2 SCB,,25 GPIOs
11 x 11 x 1.80 mm SMT
CYBLE-214009-00 Q316
4 Opamps,1 CMP, 4 UDBs
11 x 11 x 1.80 mm SMT
CYBLE-022001-00
EZ-BLEPRoC Module BLE5 4.1
CM03, 2 SCB4
16 GPIOs
10 x 10 x 1.80 mm SMT8
CYBLE-222005-00
EZ-BLE PRoC Module BLE 4.1
CM0, 2 SCB
16 GPIOs
10 x 10 x 1.80 mm SMT
CYBLE-222014-01 Q316
CM0, 2 SCB
16 GPIOs
10 x 10 x 1.80 mm SMT
CYBLE-012011-00
CM0, 2 SCB
23 GPIOs
14 x 19 x 2.00 mm SMT
CYBLE-212019-00 Q316
CM0, 2 SCB
23 GPIOs
14 x 19 x 2.00 mm SMT
CYBLE-212020-01 Q316
CM0, 2 SCB
23 GPIOs
14 x 19 x 2.00 mm SMT
CYBLE-214015-01 Q316
4 Opamps,1 CMP, 4 UDBs
11 x 11 x 1.80 mm SMT
CYBLE-012012-10
CM0, 2 SCB
23 GPIOs, NS10, NC11
14 x 19 x 2.00 mm SMT
CYBLE-212023-10 Q316
CM0, 2 SCB
23 GPIOs, NS10, NC11
14 x 19 x 2.00 mm SMT
CYBLE-202007-01 Q316
EZ-BLE PRoC Module BT 4.2
External Antenna via u.FL
CM0, 2 SCB, PA9, 19 GPIOs
15 x 23 x 2.0 mm SMT
CYBLE-224110-00 Q316
EZ-BLEPSoC XT/XR12 Module
BLE 4.1, 4 Opamps,1 CMP,PA9
4 UDBs,CM0,2 SCB, 25 GPIOs
9.5 x 15.4 x 1.80 mm SMT
Long Range2
Standard Range1
128KB Flash
Programmable System-on-Chip (EZ-BLE PSoC)
CYBLE-212006-01 Q316
PCB Antenna
15 x 23 x 2.0 mm SMT
NEW
CYBLE-202013-11 Q316
External Antenna via RF Pin
15 x 23 x 2.0 mm SMT
CYBLE-224116-01 Q316
EZ-BLEPSoC XT/XR12 BLE 4.2
4 Opamps,1 CMP,4 UDBs,PA9
CM0,2 SCB, 25 GPIOs
9.5 x 15.4 x 1.80 mm SMT
Integration
1 Range
up to 30 meter Line-of-Sight
2 Range up to 400 meter Line-of-Sight
3 ARM Cortex -M0
4 Serial communication block
5 BLE
Specification Version
6 Comparator
7 Universal Digital Block
8 Surface mount technology
9
10
11
12
Power Amplifier
NS = No Shield
NC = No Certifications
XT/XR = Extended Temperature/Extended Range
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
102
Cypress Trackpad Portfolio
Gen5 Windows PTP1 Module

5-Finger Detection/Communication
PS2/I2C
60-Vpp2 Charger Armor3
Chrome Trackpad Modules
Modules for Embedded Systems
Gen5 Chrome Module

I2C
Gen6 Embedded Module

5-Finger Gesture4
I2C
Max Size5: 120 x 75 mm
Gen6 Chrome Module

I2C
Gen4 + KB6 + RF7 Module

5-Finger Gesture4 and KB6 Scan
I2C
Software
Self
Capacitance
Mutual
Capacitance
Windows Trackpad Modules

2-Finger Gesture4
I2C
Windows Driver
5-Finger Gesture4
Windows 7/8/8.1/10 Compatible
User Configuration GUI9
1 Microsoft
6 Keyboard
2 Noise
7 Radio
Precision Touchpad
voltage peak to peak
3 System noise detection and reduction
4 Gesture processing
5 Maximum active sensing area
Chrome Driver
MT-B Compliant, Linux
frequency (2.4-GHz wireless)

8 Bluetooth Low Energy, also known as Bluetooth Smart
9 Graphical user interface
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
103
EZ-BLE CYBLE-x220xx-0x Modules

Bluetooth Low Energy Module using PRoC BLE with 128KB and 256KB Flash
Block Diagram
Applications
Bluetooth Low Energy (BLE) connectivity, medical, industrial,
PC accessories, toys and smartphone accessories
Power/
Ground
EZ-BLE PRoC Module
32.768-kHz Crystal
Features
14
Qualification and Certification

Bluetooth SIG QDID1, FCC2, CE3, KC4, MIC5 and IC6
Small Footprint:
10 mm x 10 mm x 1.8 mm, 21/22-pad SMT with 16 GPIO
Bluetooth Smart Connectivity with BLE 4.1 and 4.2
2.4-GHz BLE radio and baseband
-91-dBm Rx sensitivity, +3-dBm Tx output power
Power Modes
1.3-A deep-sleep, 150-nA hibernate, 60-nA stop
Highly Integrated Solution
Two crystals, chip antenna, passives, shield
128KB and 256KB flash sizes
CYBLE-x220xx-EVAL Evaluation Board Interface
Easy interface to CY8CKIT-042-BLE Pioneer Kit
Enables testing of CapSense, buttons, GPIOs, OTA7
PRoC BLE
24-MHz Crystal
XRES
SWD8/
GPIO
SPI/
I2C/
UART/
CapSense/
ADC/
PWM/GPIO
Chip
Antenna
VREF10
Collateral
CYBLE-022001-00 Datasheet
CYBLE-222014-01 (BT 4.2) Datasheet

PRoC BLE Datasheet
Availability
Sampling:
Production:
Getting Started Application Note

128KB
Now
Now
256KB
Now
Now
BLE 4.2
Now
Q316
PSoC Creator
PSoC Programmer
CySmart11 Windows Host Emulation Tool
CySmart iOS and Android Apps
1 Bluetooth
5 Korea
2 Bluetooth
10
Low Energy, also known as Bluetooth Smart

Special Interest Group Qualification Design ID
3 Federal Communications Commission
4 Conformit Europenne (Europe)
Certification
Ministry of Internal Affairs and Communications (Japan)
7 Industry Canada
8 Over-the-Air
Serial wire debug communication protocol

VREF only available on 256KB module
11 A GUI-based software tool that installs on your PC to test and debug
BLE functionality; also available in iOS and Android mobile applications
104
EZ-BLE CYBLE-x140xx-0x Modules

Bluetooth Low Energy (BLE) Module using PSoC 4 BLE with up to 256KB Flash
Applications
Block Diagram
Sports and fitness monitors, medical devices, wearable

electronics, home automation solutions and game controllers
5
Power/
Ground
EZ-BLE PSoC Module
SWD9/
GPIO
23
Analog
and Digital
GPIOs
32.768-kHz Crystal
Features
Bluetooth SIG QDID1, FCC2, CE3, KC4, MIC5 and IC6
Small Footprint: 11 mm x 11 mm x 1.8 mm, 32-SMT, 25 GPIOs
Bluetooth Smart Connectivity with Bluetooth 4.1 and 4.2
Two crystals, trace antenna, passives, shield
128KB and 256KB flash sizes, with over-the-air firmware
upgrades
Four Universal Digital Blocks (UDBs): custom digital peripherals
Two configurable serial communication blocks for I2C/SPI/UART
Power Modes:1.3-A Deep Sleep,150-nA Hibernate,60-nA Stop
CYBLE-x140xx-EVAL Kit for fast evaluation and development
PSoC 4 BLE
24-MHz Crystal
XRES
Trace
Antenna
VREF
Collateral
PSoC 4 BLE Datasheet
PSoC Creator
Availability
Sampling
Production:
PSoC Programmer
128KB
Now
Now
256KB
Now
Q316
BLE 4.2
Q316
Q416
1 Bluetooth
2 Federal
10

Communications Commission
4 Korea Certification

Industry Canada
7 Successive approximation register
8 Timer/Counter/Pulse-Width Modulator

A GUI-based software tool that installs on your PC to test and debug
105
EZ-BLE CYBLE-x120xx-xx Modules

Cost Optimized Bluetooth Low Energy (BLE) EZ-BLE PRoC Modules
Applications
Block Diagram
BLE connectivity, medical, industrial, PC accessories,

toys and smartphone accessories
Power/
Ground
EZ-BLE PRoC Module
SWD9/
GPIO
21
SPI/
I2C/
UART/
CapSense/
ADC/
PWM/GPIO
32.768-kHz Crystal
Features
Bluetooth SIG QDID1 (CYBLE-012011-00/
CYBLE-212019-00), FCC2, CE3, KC4, MIC5 and IC6
Small Footprint
14.5 mm x 19.2 mm x 2.0 mm, 31-pad SMT with 23 GPIO
-91-dBm Rx sensitivity, +3-dBm Tx output power
Power Modes
1.3-A Deep-Sleep, 150-nA Hibernate, 60-nA Stop
Two crystals, trace antenna, passives, shield7
CYBLE-x120xx-EVAL Adapter Board Interface
PRoC BLE
24-MHz Crystal
XRES
Trace
Antenna
VREF
Collateral
CYBLE-01200x-x0 Datasheet
PRoC BLE Datasheet
Availability
Sampling:
Production:
PSoC Creator
4.1/128KB 256KB
Now
Now
Now
Q316
BLE 4.2
Q316
Q316
PSoC Programmer

1 Bluetooth
2 Federal
10

Communications Commission
4 Korea Certification

Industry Canada
7 CYBLE-0120012-10 does not include metal shield
8 Over-the-Air

106
EZ-BLE XT/XR1 Module CYBLE-22411x-0x

Long Range Bluetooth Low Energy Module Supporting Extended Temperatures
Applications
Block Diagram
Bluetooth Low Energy (BLE) connectivity, lighting, industrial

and medical
Power/
Ground
EZ-BLE PSoC XT/XR1 Module
SWD9/
GPIO
23
SPI/
I2C/
UART/
CapSense/
ADC/
PWM/GPIO
32.768-kHz Crystal
Features
Bluetooth SIG QDID2, FCC3, CE4, MIC5, KC6 and IC7
Small Footprint
9.5 mm x 15.4 mm x 1.8 mm, 32-pad SMT with 25 GPIOs
Extended Industrial Temperature Range
Operating Temperature range from -40C to +105C
Long Range
+9.5-dBm Tx output power
- 95 dBm Rx sensitivity
400 meters line-of-sight range
2 crystals, trace antenna, power amplifier, passives, shield
CYBLE-22411x-EVAL Adapter Board Interface
PSoC 4 BLE
24-MHz Crystal
XRES
Chip
Antenna
VREF
Power
Amplifier
Collateral
PSoC Creator
PSoC Programmer
Availability
Sampling:
Production:

4.1
Now
Q316
4.2
Q316
Q416
6 Korea
10
Extended temperature/extended range

Bluetooth Special Interest Group Qualification Design ID

Certification
7 Industry Canada
8 Over-the-Air

107
EZ-BLE XR1 Module CYBLE-2x20xx-x1

Long Range Bluetooth Low Energy Module Supporting External Antenna
Applications
Block Diagram
Bluetooth Low Energy (BLE) connectivity, lighting, industrial

and medical
Power/
Ground
EZ-BLE PRoC XR1 Module
SWD9/
GPIO
17
SPI/
I2C/
UART/
CapSense/
ADC/
PWM/GPIO
32.768-kHz Crystal
Features
Bluetooth SIG QDID2, FCC3, CE4, MIC5, KC6 and IC7
Small Footprint
15.0 mm x 23.0 mm x 2.0 mm, 30-pad SMT with 19 GPIOs
Bluetooth Smart Connectivity with Bluetooth 4.2
Extended Industrial Temperature Range
Operating Temperature range from -40C to +85C
Long Range
+7.5-dBm Tx output power
- 93 dBm Rx sensitivity
400 meters line-of-sight range
2 crystals, trace antenna (option), power amplifier, passives
CYBLE-2x20xx-EVAL Adapter Board Interface
PRoC 4 BLE
24-MHz Crystal
XRES
Power
Amplifier
VREF
PCB
Antenna
Antenna
Collateral
Datasheet - Contact Sales
PSoC Creator
PSoC Programmer
Availability
Sampling:
Production:

Q316
Q416
6 Korea
10
Extended range
Bluetooth Special Interest Group Qualification Design ID

Certification
7 Industry Canada
8 Over-the-Air

108
Gen5 Chrome Module

Applications
Block Diagram
Host Processor
Chromebook PCs
2 I2C Clock/Data
INT4
Features
Gen5 Chrome Module
Mechanical Construction
Maximum active sensing area of 125 mm x 70 mm
Minimum of 1.3 mm total module thickness
Clickpad1 and standard2 configurations
Overlay assembly and lamination available
Advanced Processing
60-Vpp3 charger noise immunity (1-500 kHz, 9-mm finger)
32-bit ARM Cortex-M0 core for more processing power
I2C communication interface
Report rates up to 150 Hz
Five-finger detection and communication
Low-power, look-for-touch active mode
Google-qualified multi-touch Cypress driver
Compatible with Google Multi-touch Protocol B (MT-B)
Product Support
On-site support for customer product introduction available
Incoming/outgoing test equipment available to customers
CY8CTMA545
I2C
AHB-Lite5
Flash
AHB-Lite5
ARM Cortex-M0
SRAM
116
116
AHB-Lite5
116
Channel
Engine
10-V Tx
Pump
Touch
Sequencer
Rx Channels
Programmable Analog Multiplexer
36
Collateral
Datasheet:
116
AHB-Lite5
Trackpad Sensor I/O: XY00-XY35
Trackpad
Sensor
Contact Sales
1 Trackpad
with integrated mechanical button

with support for external mechanical button inputs
3 Noise voltage peak to peak
4 Interrupt
5 Advanced High-Performance Bus Lite
2 Trackpad
Availability
Production:
Now
109
Gen6 Chrome Module

Applications
Block Diagram
Host Processor
Chromebook PCs
2 I2C Clock/Data
INT4
Features
Gen6 Chrome Module
Advanced Processing
I2C communication interface
Google-qualified multi-touch Cypress driver
Compatible with Google Multi-touch Protocol B (MT-B)
Product Support
CY8CTMA445A
I2C
AHB-Lite5
Flash
AHB-Lite5
ARM Cortex-M0
AHB-Lite5
5-V Tx Pump
SRAM
116
116
116
Touch
Sequencer
Rx Channels
36
Collateral
Datasheet:
116
AHB-Lite5

Trackpad
Sensor
Contact Sales
1 Trackpad

4 Interrupt
2 Trackpad
Availability
Production:
Now
110
Gen5 Windows PTP1 Module

Applications
Block Diagram
Host Processor
Windows PCs
INT5
I2C/PTP1 Only
Features
Advanced Processing
Dual bus interface PS2 and I2C/PTP1
Report rates of up to 150 Hz
Enhanced palm rejection
Windows driver support for 7/8/8.1/10
Product Support
PS2 and I2C Clock/Data
Gen5 Windows
PTP1 Module
CY8CTMA545
PS2/I2C
AHB-Lite6
116
AHB-Lite6
Flash
AHB-Lite6
ARM Cortex-M0
SRAM
116
116
AHB-Lite6
116
Channel
Engine
10-V Tx
Pump
Touch
Sequencer
Rx Channels
36

Trackpad
Sensor
Collateral
Datasheet:
Contact Sales
1 Microsoft
Precision Touchpad
3 Trackpad with support for external mechanical button inputs
5 Interrupt
2 Trackpad
Availability
Production:
Now
111
Gen6 Embedded Trackpad Module

Applications
Block Diagram
Host Processor
Keyboards, mice, remote controls and wearables
Advanced Processing
I2C, UART, or SPI communication interface
Embedded Gesture Detection and Communication
Product Support
CY8CTMA445A
I2C
AHB-Lite5
Flash
AHB-Lite5
ARM Cortex-M0
AHB-Lite5
5-V Tx Pump

4 Interrupt
116
Touch
Sequencer
Rx Channels

Trackpad
Sensor
Contact Sales
2 Trackpad
SRAM
116
116
36
1 Trackpad
116
AHB-Lite5
Collateral
Datasheet:
2 I2C Clock/Data
INT4
Features
Availability
Production:
Now
112
Gen2 Embedded Trackpad Module

Applications
Block Diagram
Host Processor
Keyboards, mice, remote controls and wearables
2 I2C or SPI Clock/Data
INT4
Features
Advanced Processing
Low-power active mode as low as 1 mA
Low-power idle and sleep modes (<30 A)
I2C or SPI communication interface
Two-finger detection and communication
Embedded Gesture Detection and Communication
Product Support
CY8CTMG2xx
Flash
I2C/SPI
CPU
SRAM
Analog Front End
Collateral
28
Datasheet:
Contact Sales

Trackpad
Sensor
Availability
1 Trackpad

4 Interrupt
2 Trackpad
Production:
Now
113

Wireless Trackpad + Keyboard Solution
Applications
External keyboard and trackpad, standalone trackpad,
remote control and trackpad, tablet keyboard dock and
trackpad
Block Diagram
Antenna
SPI
Features
WUSB-NX
Advanced Processing
Software-free solution allowing fast time-to-market
Embedded gesture detection
Six configurable power modes
2.4-GHz wireless communication
Cypress PSoC4A supporting keyboard scan
Optional LED control
Product Support
Simplification of OEM/ODM supply chains
PSoC4
30
Keyboard GPIO:
XY00-XY29
Keyboard
Matrix
I2C
2
INT5
Mechanical
Buttons
Gen4
Trackpad
Controller
65
GPIO
Trackpad Sensor I/O:

XY00-XY64
LEDs
GPIO
Trackpad
Sensor
Availability
Production:
Now
Collateral
Datasheet:
Contact Sales
1 Keyboard
2 Radio
frequency (2.4-GHz wireless)

4 Trackpad with support for external mechanical button inputs
5 Interrupt
3 Trackpad
114
Asynchronous SRAMs
115
Asynchronous SRAM Portfolio
High Density | Wide Voltage Range | Automotive A1, E2 | On-Chip ECC3

Low-Power SRAM (MoBL4)
Fast SRAM
32Mb-128Mb
Non-ECC
ECC
CY7C107x
32Mb; 3.3 V
12 ns; x8, x16
Ind
64Kb-1Mb
2Mb-16Mb
CY7C106x
16Mb; 1.8, 3.3 V
10 ns; x8, x16, x32
Ind
ECC
CY6218x
64Mb; 1.8, 3.0 V
55 ns; x16
Ind
NDA Required
Contact Sales
CY7C106x
16Mb; 1.8-5.0 V
10 ns; x8, x16, x32
Ind, Auto E
CY6216x
16Mb;1.8, 3.0, 5.0 V
45 ns; x8, x16
Ind, Auto A
CY6216x
16Mb; 1.8-5.0 V
45 ns; x8, x16, x32
Ind, Auto E
CY7C1012
12Mb; 3.3 V
10 ns; x24
Ind
CY7C105x
8Mb; 3.3, 5.0 V
10 ns; x8, x16
Ind, Auto E
CY6215x
8Mb; 1.8, 3.0, 2.5-5V
45 ns; x8, x16
Ind, Auto A, E
CY6216x
8Mb; 3.3, 5.0 V
45 ns; x8, x16, x32
Ind, Auto E
CY7C104x
4Mb; 3.3, 5.0 V
10 ns; x4, x8, x16
Ind, Auto A, E
CY7C1034
6Mb; 3.3 V
10 ns; x24
Ind
CY7C104x
4Mb; 1.8-5.0 V
10 ns; x8, x16
Ind, Auto E
CY6214x
4Mb; 1.8, 3.0, 2.5-5V
45 ns; x8, x16
Ind, Auto A, E
CY6214x
4Mb; 1.8-5.0 V
45 ns; x8, x16
Ind, Auto E
CY7C1010/11
2Mb; 3.3 V
10 ns; x8, x16
Ind, Auto A, E
CY7C1024
3Mb; 3.3 V
10 ns; x24
Ind
CY6213x
2Mb; 1.8, 2.5-5.0 V
45 ns; x8, x16
Ind, Auto A, E
CY7C1020
512Kb; 2.6, 3.3, 5.0 V
10 ns; x16
Ind, Auto E
CY7C1019/21/100x
1Mb; 2.6, 3.3, 5.0 V
10 ns; x4, x8, x16
Ind, Auto A, E
CY6212x
1Mb; 2.5-5.0 V
45 ns; x8, x16
Ind, Auto A, E
CY7C185
64Kb; 5.0 V
15 ns; x8
Ind
CY7C19x/1399
256Kb; 3.3, 5.0 V
10 ns; x4, x8
Ind, Auto A
CY6264/62256
64-256Kb; 1.8, 3.0, 5V
55 ns, 70 ns; x8
Ind, Auto A, E
A Fast SRAM with a deep-sleep mode in addition to a

conventional standby mode. For example, the
12-ns 16Mb offering has a deep-sleep current of
1.37 A/Mb and a standby current of 1.87 mA/Mb
ECC
Serial SRAM (with ECC)

Quad-SPI
HyperBus6
NDA Required
Contact Sales
NDA Required
Contact Sales
CY6217x
32Mb; 1.8-5.0 V
55 ns; x16
Ind
CY7C105x
8Mb; 3.3 V
10 ns; x8, x16
Ind
AEC-Q100 -40C to +85C

AEC-Q100 -40C to +125C
3 Error correcting code
4 More Battery Life
2
Non-ECC
PowerSnooze5
CY7S106x
16Mb; 1.8-5.0 V
10 ns; x8, x16, x32
Ind, Auto E
CY7S104x
4Mb; 1.8-5.0 V
10 ns; x8, x16
Ind, Auto E
A high-bandwidth,12-signal interface that

transfers information over 8 I/O signals at
Status
Double Data Rate (DDR), delivering up to
Availability
400 MBps
Concept
Development
Sampling
Production
QQYY
QQYY
Roadmap 116
Fast SRAM Family with ECC1

Applications
Family Table
Switches and routers

IP phones
Test equipment
Automotive
Computation servers
Military and aerospace systems
Features
Access time: 10 ns
Bus-width configurations: x8, x16 and x32
Wide operating voltage range: 1.65-5.5 V
Industrial and automotive temperature grades
Industry-standard, RoHS-compliant packages
ECC to detect/correct single-bit errors
Bit-interleaving to avoid multi-bit errors
Error indication (ERR) pin to indicate single-bit errors
Density
MPN
Access Time
4Mb
8Mb
16Mb
CY7C104x
CY7C105X
CY7C106x
10 ns
10 ns
10 ns
Operating Current
(Maximum at 85C)
45 mA
110 mA
110 mA
Block Diagram
Fast SRAM with ECC
SRAM Array
ECC
Encoder
Input
Buffer
18-23
Address
Address
Decoder
Collateral
8, 16, 32
Data
ERR
I/O Mux
SRAM Array
Sense
Amps
ECC
Decoder
Datasheet: Async SRAM with ECC datasheets

Control Logic
CE
OE
WE
BHE2
BLE3
Availability
1
Error-correcting code
Byte high enable
3 Byte low enable
2
Sampling:
Production:
Now
Now
Product Overview 117
MoBL1 SRAM Family With ECC2

Applications
Family Table
Programmable logic controllers

Handheld devices
Multifunction printers
Automotive
Implantable medical devices
Computation servers
Features
Access time: 45 ns
Standby current: 8.7 A for 4Mb
ECC to detect/correct single-bit errors
Error indication (ERR) pin to indicate single-bit errors
Density
MPN
4Mb
8Mb
16Mb
CY6214x
CY6215x
CY6216x
Standby Current
(Maximum at 85C)
8.7 A
16.0 A
16.0 A
Standby Current
(Typical at 25C)
3.5 A
5.5 A
5.5 A
Block Diagram
MoBL SRAM with ECC
SRAM Array
ECC
Encoder
Input
Buffer
18-23
Address
Address
Decoder
I/O Mux
SRAM Array
Collateral
8, 16, 32
Data
ERR
Sense
Amps
ECC
Decoder
Control Logic
CE
OE
WE
BHE3
BLE4
Availability
1
More Battery Life

3 Byte high enable
4 Byte low enable
2
Sampling:
Production:
Now
Now
Fast SRAM Family with PowerSnooze1

Applications
Family Table

Handheld devices
Automotive
Computation servers
Features
Access time: 10 ns
PowerSnooze: Additional power-saving (deep-sleep) mode
Deep-sleep current: 15 A for 4Mb (see Family Table)
Error-Correcting Code (ECC) to detect/correct single-bit errors
Density
MPN
Access Time
4Mb
16Mb
CY7S104x
CY7S106x
10 ns
10 ns
Deep Sleep Current

(Maximum at 85C)
15 A
22 A
Block Diagram
Fast SRAM with PowerSnooze
ECC
Encoder
20
Address
Address
Decoder
Collateral
DS2
8, 16, 32
Data
ERR
I/O Mux
SRAM Array
Power
Management
Block
(Enables
PowerSnooze)
Input
Buffer
Sense
Amps
ECC
Decoder
Control Logic
CE
OE
WE BHE3 BLE4
Availability
1
A Fast SRAM with a deep-sleep mode in addition to a conventional standby mode.

For example, the 12-ns 16Mb offering has a deep-sleep current of 1.37 A/Mb and a
standby current of 1.87 mA/Mb
2 Deep-sleep
3 Byte high enable
4 Byte low enable
Sampling:
Production:
Now
Now
Synchronous SRAMs
120
Synchronous SRAM Portfolio
High Random Transaction Rate (RTR)1 | Low Latency | High Bandwidth

Standard Sync
and NoBL
Standard Sync and

NoBL with ECC2
QDR -II/
DDR-II
QDR-II+/
DDR-II+
QDR-II+X/
DDR-II+X
QDR-IV
Max RTR1: 250 MT/s

Max BW: 18 Gbps
Latency: 1 Cycle
Pipeline and
Flow-through Modes
Max RTR1: 250 MT/s

Max BW: 18 Gbps
Latency: 1 Cycle
Pipeline and
Flow-through Modes
Max RTR1: 666 MT/s

Max BW: 47.9 Gbps
Latency: 1.5 Cycles
CIO3 and SIO4
Max RTR1: 666 MT/s

Max BW: 79.2 Gbps
Latency: 2 or
2.5 Cycles
CIO3and SIO4, ODT5
Max RTR1: 900 MT/s

Max BW: 91.1 Gbps
Latency: 2.5 Cycles
SIO4, ODT5
Max RTR1: 2.1 GT/s

Max BW: 153.5 Gbps
Latency: 5 or 8 Cycles
Dual-Port Bidirectional
ODT5
CY7C161/2xKV18
144Mb; 250-333 MHz
1.8 V; x9, x18, x36
Burst 2, 4
CY7Cx4/5/6/7xKV18
144Mb; 300-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C151/2xKV18
72Mb; 250-333 MHz
1.8 V; x9, x18, x36
Burst 2, 4
CY7Cx54/5/6/7KV18
72Mb; 250-550 MHz
1.8 V; x18, x36
RH6; Burst 2, 4
CY7C156/7xXV18
72Mb; 366-633 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C141/2xKV18
36Mb; 250-333 MHz
1.8 V; x8, x9, x18, x36
Burst 2, 4
CY7Cx24/5/6/7xKV18
36Mb; 400-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C126/7x
36Mb; 366-633 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C131/2/9xKV18
18Mb; 250-333 MHz
1.8 V; x8, x18, x36
Burst 2, 4
CY7Cx14/5/6/7xKV18
18Mb; 400-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C147/8xB
72Mb; 133-250 MHz
2.5, 3.3 V; x18, x36
Density
NEW
CY7C144/6xK
36Mb; 133-250 MHz
2.5, 3.3 V; x36, x72
CY7C144/6xK
36Mb; 133-250 MHz
2.5, 3.3 V; x18, x36
NEW
CY7C137/8xD/K
18Mb; 100-250 MHz
3.3 V; x18, x32, x36
CY7C137/8xK
18Mb; 100-250 MHz
2.5, 3.3 V; x18, x36
CY7C135/6xC
9Mb; 100-250 MHz
3.3 V; x18, x32, x36
Auto E7
NEW
CY7C41xKV13
144Mb; 667-1066 MHz
1.3 V; x18, x36
Burst 2
NEW
CY7C40xKV13
72Mb; 667-1066 MHz
1.3 V; x18, x36
Burst 2
CY7C1911xKV18
18Mb; 250-333 MHz
1.8 V; x9
Burst 2, 4
CY7C134/2xG
2,4Mb; 100-250 MHz
3.3 V; x18, x32, x36
Random Transaction Rate

1 Rate
of truly random accesses to

memory, expressed in transactions
per second (MT/s, GT/s)
2 Error-correcting
3 Common
I/O
4 Separate I/O
code
5 On-die
termination; parts are CY7C2x

hardened, military grade
7 AEC-Q100 -40C to +125C
6 Radiation

Status
Availability
QQYY
QQYY
2121
QDR-IV Product Overview

Family Table
Switches and routers

High-performance computing
Test and measurement
Density
MPN
Max Freq
RTR
QDR-IV HP
72Mb
144Mb
CY7C40x1KV13
CY7C41x1KV13
667 MHz
1,334 MT/s
QDR-IV XP
72Mb
144Mb
CY7C40x2KV13
CY7C41x2KV13
1,066 MHz
2,132 MT/s
Block Diagram
Available in two options: QDR-IV HP (RTR 1,334 MT/s) and

QDR-IV XP (RTR 2,132 MT/s)
Two independent, bidirectional DDR1 data ports
Error-correcting code (ECC) to reduce soft error rate to less
than 0.01 Failure-in-Time (FIT) per megabit
Bus inversion to reduce simultaneous switching I/O noise
On-die termination (ODT) to reduce board complexity
De-skew training to improve signal-capture timing
I/O levels: 1.2-1.25 V (HSTL/SSTL), 1.1-1.2 V (POD2)
Package: 361-pin FCBGA3
Bus widths: x18, x36
Address/
Control
Clock
QDR-IV
Data Valid
x2
x18, x36
Data Port A
Address Interface
x2
x2
SRAM Array
Impedance Matching
1 Double
x21,x22
x2
ODT
Datasheet:
Address Parity
Parity Error
ECC
Data Clocks x2
Bus Inversion
Collateral
Bus
Address
Inversion
Port
x2
Data Port A
(HSTL/SSTL or POD)
Features
Option
Data Port B
(HSTL/SSTL or POD)
Applications
Control
Logic
Control
x4
x2
Data Clocks
Data Valid
x18, x36
Data Port B
x2
Bus Inversion
Test
Engine
JTAG Interface
Availability
QDR-IV datasheets
Data Rate: two data transfers per clock cycle
Sampling:
Production:
2 Pseudo
Now
Now
open drain: Signaling interface that uses strong pull-down and weak pull-up drive strength
3 Flip-chip
ball grid array

3122
Nonvolatile RAM
123
nvSRAM Portfolio
High Density | High Speed
6 nvSRAM
SPILPC
nvSRAM
I2C nvSRAM
CY14B116R/S
16Mb; 3.0 V
25, 45 ns; x32; Ind1
RTC2
CY14B116K/L
16Mb; 3.0 V
25, 45 ns; x8; Ind1
RTC2
CY14V116F/G
16Mb; 3.0, 1.8 V I/O
30 ns; ONFI3 1.0
x8, x16; Ind1
Higher Densities
nvSRAM
NDA Required
Contact Sales
CY14B104NA
4Mb; 3.0 V
25, 45 ns; x16
Auto E4; RTC2
CY14B108K/L
8Mb; 3.0 V
25, 45 ns; x8; Ind1
RTC2
CY14B108M/N
8Mb; 3.0 V
25, 45 ns; x16; Ind1
RTC2
CY14B116M/N
16Mb; 3.0 V
25, 45 ns; x16; Ind1
RTC2
CY14B104K/LA
4Mb; 3.0 V
25, 45 ns; x8; Ind1
RTC2
CY14V104LA
4Mb; 3.0, 1.8 V I/O
25, 45 ns; x8; Ind1
CY14B104M/NA
4Mb; 3.0 V
25, 45 ns; x16; Ind1
RTC2
CY14V104NA
4Mb; 3.0, 1.8 V I/O
25, 45 ns; x16; Ind1
CY14V101PS
1Mb; 3.0, 1.8 V I/O
108 MHz QSPI7; Ind1
Ext. Ind8; RTC2
CY14V101QS
1Mb; 3.0, 1.8 V I/O
108 MHz QSPI7; Ind1
Ext. Ind8
CY14B101I
1Mb; 3.0 V
3.4 MHz I2C; Ind1
RTC2
CY14B101KA/LA
1Mb; 3.0 V
25, 45 ns; x8; Ind1
RTC2
CY14V101LA
1Mb; 3.0, 1.8 V I/O
25, 45 ns; x8; Ind1
CY14B101MA/NA
1Mb; 3.0 V
25, 45 ns; x16; Ind1
RTC2
CY14V101NA
1Mb; 3.0, 1.8 V I/O
25, 45 ns; x16; Ind1
CY14B101PA
1Mb; 3.0 V
40 MHz SPI; Ind1
RTC2
CY14B512P
512Kb; 3.0 V
40 MHz SPI; Ind1
RTC2
CY14B512I
512Kb; 3.0 V
3.4 MHz I2C; Ind1
RTC2
CY14B256KA/LA
256Kb; 3.0 V
25, 45 ns; x8; Ind1
RTC2
CY14V/U256LA
256Kb; 3.0, 1.8V I/O
35 ns; x8; Ind1
CY14E256LA
256Kb; 5.0 V
25, 45 ns; x8; Ind1
STK14C88-5
256Kb; 5.0 V
35, 45 ns; x8; Mil5
CY14B256PA
256Kb; 3.0 V
40 MHz SPI; Ind1
RTC2
CY14B256I
256Kb; 3.0 V
3.4 MHz I2C; Ind1
RTC2
STK11C68-5
64Kb; 5.0 V
35, 55 ns; x8; Mil5
STK12C68-5
64Kb; 5.0 V
35, 55 ns; x8; Mil5
CY14B064PA
64Kb; 3.0 V
40 MHz SPI; Ind1
RTC2
CY14B064I
64Kb; 3.0 V
3.4 MHz I2C; Ind1
RTC2
64Kb - 256Kb
512Kb - 16Mb
Parallel Parallel
nvSRAM
nvSRAM
grade 40C to +85C

clock
3 Open NAND flash interface
40C to +125C
Military grade 55C to +125C
6 Low-pin-count
1 Industrial
4 AEC-Q100
2 Real-time
Higher Densities
nvSRAM
NDA Required
Contact Sales
Quad serial peripheral interface

Extended Industrial grade 40C to +105C

Status
Availability
QQYY
QQYY
124
F-RAM Portfolio
Low Power | High Endurance
Processor
Companion
4Kb - 256Kb
512Kb - 8Mb
LPC1 F-RAM
FM25H20/V20A
2Mb; H20: 2.7-3.6 V
V20A: 2.0-3.6 V
40 MHz SPI; Ind2
CY15B102Q
2Mb; 2.0-3.6 V
25 MHz SPI; Auto E3
Wireless
Memory
Higher Densities
F-RAM
NDA Required
Contact Sales
CY15B104Q
4Mb; 2.0-3.6 V
40 MHz SPI; Ind2
FM22L16/LD16
4Mb; 2.7-3.6 V
55 ns; x8; Ind2
FM25V10/VN10
FM24V10/VN10
1Mb; 2.0-3.6 V
1Mb; 2.0-3.6 V
40 MHz SPI; Ind2, Auto A3 3.4 MHz I2C; Ind2 , Auto A3
FM25V05
512Kb; 2.0-3.6 V
40 MHz SPI; Ind2, Auto A3
FM24V05
512Kb; 2.0-3.6 V
3.4 MHz I2C; Ind2 , Auto A3
FM25V02A/W256
256Kb; V02A: 2.0-3.6 V
W256: 2.7-5.5 V
FM24V02A/W256
FM33256
256Kb; V02A: 2.0-3.6 V 256Kb; 3.3V; 16 MHz SPI
W256: 2.7-5.5 V
Ind2; RTC5; Power Fail
3.4 MHz I2C; Ind2, Auto A3
Watchdog; Counter
FM25V01A
128Kb; 2.0-3.6 V
FM24V01A
128Kb; 2.0-3.6 V
3.4 MHz I2C; Ind2, Auto A3
FM31256/31(L)278
256Kb; 3.3, 5.0V; 1 MHz
I2C; Ind2; RTC5; Power
Fail; Watchdog; Counter
FM25640/CL64
64Kb; 3.3, 5.0 V
20 MHz SPI; Ind2, Auto E4
FM24C64/CL64
64Kb; 3.3, 5.0 V
1 MHz I2C; Ind2, Auto E4
FM3164/31(L)276
64Kb; 3.3, 5.0 V; 1 MHz
I2C; Ind2; RTC5; Power
Fail; Watchdog; Counter
FM25C160/L16
16Kb; 3.3, 5.0 V
FM24C16/CL16
16Kb; 3.3, 5.0 V
1 MHz I2C; Ind2 , Auto A3
FM25040/L04
4Kb; 3.3, 5.0 V
FM24C04/CL04
4Kb; 3.3, 5.0 V
1 MHz I2C; Ind2 , Auto A3
40C to +125C
clock
4 AEC-Q100
5 Real-time
Low-pin-count
Industrial grade 40C to +85C
3 AEC-Q100 40C to +85C
Parallel F-RAM
Wireless Memory
NDA Required
Contact Sales
FM28V102A
1Mb; 2.0-3.6 V
60 ns; x16; Ind2
FM28V202A
2Mb; 2.0-3.6 V
60 ns; x16; Ind2
CY15B101N
1Mb; 2.0-3.6 V
60 ns; x16; Auto A3
CY15B102N
2Mb; 2.0-3.6 V
60 ns; x16; Auto A3
FM28V020
256Kb; 2.0-3.6 V
70 ns; x8; Ind2
FM18W08
256Kb; 2.7-5.5 V
70 ns; x8; Ind2
FM1808B
256Kb; 5.0 V
70 ns; x8; Ind2
FM16W08
64Kb; 2.7-5.5 V
70 ns; x8; Ind2

Status
Availability
QQYY
QQYY
125
nvSRAM Packages
Family
32-pin
SOIC
44-pin
TSOP
II
48-ball
FBGA
48-pin
SSOP
4Mb
8Mb
16Mb
28-pin
SOIC
28-pin
CDIP
28-pad
LCC
64Kb
256Kb
Density
8-pin
SOIC
8-pin
DFN
16-pin
SOIC
1Mb
Parallel
64Kb
256Kb
512Kb
1Mb
64Kb
LPC
512Kb
Wafer
1Mb
165ball
FBGA
256Kb
I2C
48-pin 54-pin 60-ball

TSOP I TSOPII FBGA
126
F-RAM Packages
Family
LPC
I2C
8-pin
SOIC
8-pin
DFN
4Kb
16Kb
64Kb
128Kb
256Kb
512Kb
1Mb
Density
14-pin
SOIC
28-pin
SOIC
28-pin
TSOP I
32-pin
TSOP I
44-pin
TSOP II
48-ball
FBGA
Wafer
2Mb
4Mb
4Kb
16Kb
64Kb
128Kb
256Kb
512Kb
1Mb
64Kb
Processor
Companion 256Kb
Parallel
8-pin
EIAJ
64Kb
256Kb
2Mb
4Mb
1Mb
127
1Mb Quad SPI nvSRAM

Applications
Block Diagram
Computing and networking

Industrial automation
RAID storage
VCAP2
1Mb Quad SPI

nvSRAM
Store
Control
Features
QSPI I/Os
Quad SPI interface: 108 MHz

Unlimited write endurance
One million store cycles on power fail
Data retention of 20 years at 85C
Operating voltages: 3.0 V, 1.8-V I/O
Low standby (280-A) and sleep (10-A) currents
Industrial temperature range: -40C to +85C
Extended Industrial temperature range: -40C to +105C
Integrated, high-accuracy real-time clock (RTC)
Package: 16-SOIC
Control
Logic
Store/Recall
Control
SRAM Array
I/O
Control
Recall
Software
Command
Detect
XIN1
XOUT1
RTC
VRTC
HSB3
Availability
Collateral
Final Datasheet: CY14V101QS
Sampling:
Production:
1
2
Power
Control
SONOS Array
Now
Now
Crystal connections
External capacitor connection
3 Hardware
store busy
128
Timing Solutions
129
Timing Solutions Portfolio

Programmable | High-Performance | EMI Reduction | Automotive
Clock Generators
EMI Reduction
Standard
Performance
High
Performance
NEW
CY274x
Max. Frequency: 700 MHz
12 Outputs; PCIe 3.0; 4 PLL
0.7-ps RMS Jitter1; Ind2; Auto A3
NEW
2-PLL Clock Generator

0.7-ps RMS Jitter1
Contact Sales
Clock Buffers
Non-EMI Reduction
NEW
NEW
Q316
CY294x/ CY5107
Max. Frequency: 2.1 GHz
1 Output; 40/100 GbE; 1 PLL
0.15-ps RMS Jitter1; Ind2
PLL ICs
Zero/Non-Zero Delay Buffer
MB15F63UL
Max. Input Frequency: 2 GHz
Sigma-Delta and Integer PLL;
-88.5 dBc/Hz CNR8; Ind2;
CY2DLx/DMx/DPx/CPx
2-10 Outputs; LVDS, LVPECL, CML
4-PLL Clock Generator

0.15-ps RMS Jitter1
Contact Sales
CY2Xx (FleXO)
1 Output; Frequency Margining
CY254x/CY251x
3-9 Outputs; 1-4 PLL; I2C
100-ps CCJ4; Ind2
CY2239x/CY229x/CY2238x
400-ps CCJ4; Ind2; Auto E5
MB15E07SL/05SL/03SL
Max. Input Frequency: 2.5GHz
1 PLL; < 4mA PSC7 ; Ind2;
CY230x/EP0x
5-9 Outputs; LVCMOS
22-ps CCJ4; Ind2; Auto A3
CY22800/801/2429x
2-4 Outputs; 1 PLL; PCIe 1.1
CY22050/150
3-6 Outputs; 1 PLL
250-ps CCJ4; Ind2
MB15E07SR/06SR/05SR
Max. Input Frequency: 3GHz
1 PLL; -86 dBc/Hz CNR8 ; Ind2
CY230xNZ
4-18 Outputs; LVCMOS
250-ps CCJ4; Ind2
MB88151Ax/2Ax/3Ax/4Ax
1 Output; 1 PLL;
< 200-ps CCJ4; Ind2;
MB15F78UL/73UL/72UL
Max. Input Frequency: 2.6 GHz
2 PLL; < 2.8 mA PSC7; Ind2;
CY23S02/05/08/09/FP12
2-12 Outputs; Spread Aware
200-ps CCJ4; Ind2
MB88155x
1 Output; 1 PLL;
MB15F07SL
2 PLL; < 5 mA PSC7; Ind2;
CY7B99x (RoboClock)
8-18 Outputs; Configurable Skew
50-ps CCJ4; Ind2
2 Industrial
Integrated phase noise across 12-kHz to 20-MHz offset

grade: -40C to +85C
3 AEC-Q100: -40C to +85C
4 Cycle-to-cycle jitter
AEC-Q100: -40C to +125C

Automatic clock switching on failure of a clock source
7 Power supply current
8 Carrier-to-noise ratio

Status
Availability
QQYY
QQYY
130
CY294x: High-Performance 1-PLL

Programmable Oscillator
Applications
Block Diagram
Routers
Switches
Base stations
Storage area networks
Network backplanes
Wireless infrastructure
Military/Aerospace
Video
High-Performance Programmable Oscillator
Crystal
Oscillator
PLL
Features
High frequency: 2,100-MHz differential, 250-MHz single-ended
LVPECL1, LVDS2, HCSL3 and CML4 outputs
RMS phase jitter5 ~110 fs (typical) at all output frequencies
Frequency select to choose from four preprogrammed
configurations
Voltage-controlled frequency synthesis (VCFS) with tunable
pull range of 50 ppm to 275 ppm
Pin select and I2C programming
VDD support: 1.8 V, 2.5 V and 3.3 V
Operating temperature range from -40C to +85C
Available in a 5 mm x 7 mm, 5 mm x 3.2 mm LCC package
SCLK6
SDAT6
VIN7
FS18
FS08
Preliminary Datasheet: Contact Sales
OUT1P
OUT1N
Memory
and
Control
Logic
Sampling:
Production:
Now
Q3 2016
8 Frequency
Output
Bank
Availability
Collateral
Low-voltage positive emitter coupled logic

Low-voltage differential signaling
3 High-speed current steering logic
Divider
Current mode logic

The uncertainty of the clock rising and falling edge timing
6 I2C input
Voltage input pin for VCFS

select inputs
131
Specialty Memory
132
Specialty Memory Portfolio

Intelligent Memory | High Density | High Throughput
Dual-Port SRAM
Asynchronous
FIFO
Synchronous
Asynchronous
Synchronous
2 Mb-72 Mb
CYFB0072V4
72Mb; 1.8, 3.3 V
133 MHz
x36; Ind1
CYD02/9/18/36SxxV18
22Mb,
Mb, 99Mb,
Mb, 18
Mb,36Mb;
36 Mb;1.8
1.8VV
18Mb,
167 MHz, 200 MHz
x18, x36, x72; Ind1
CYFX18V/36V/72V
18Mb, 36Mb, 72Mb; 1.8, 3.3 V
100 MHz, 133 MHz
x9 to x36 Prog3; Ind1
2 Kb-64 Kb
128 Kb-1 Mb
CY7C083x/5x
2Mb, 4Mb, 9Mb, 18Mb; 3.3 V
100 MHz, 133 MHz, 167 MHz
x18, x36, x72; Ind1
CY7C02x/3x/5x
512Kb, 1Mb; 3.3, 5.0 V
12 ns, 15 ns, 20 ns, 25 ns
x8, x16, x18, x36; Ind1
CY7C09279/289/389/579
512Kb, 1Mb; 3.3 V
7, 9, 12 ns; 83 MHz, 100 MHz
x8, x16, x18, x36; Ind1
CY7C4275/81/85/91
512Kb, 1Mb; 3.3 V
67 MHz, 100 MHz
x9, x18; Ind1
CY7C006/025/026
128Kb, 256Kb; 3.3, 5.0 V
15 ns, 20 ns, 25 ns, 55 ns
x8, x16, x18; Ind1
CY7C09269/369
256Kb; 3.3 V
9 ns, 12 ns
x16, x18; Ind1
CY7C4255/61/65/71
128Kb, 256Kb; 3.3, 5.0 V
67 MHz, 100 MHz
x9, x18; Ind1
CY7C024/144
64Kb; 3.3, 5.0 V
15 ns, 20 ns, 25 ns, 55 ns
x8, x16, x18; Ind1
CY7C09159/349
64Kb; 3.3 V
9 ns, 12 ns
x9, x18; Comm2
CY7C421
4Kb; 5.0 V
15 ns, 20 ns
x9; Ind1
CY7C13x
8Kb, 16Kb, 32Kb; 5.0 V
15 ns, 25 ns, 55 ns
x8; Ind1
Industrial grade: -40C to +85C

Commercial grade: 0C to +70C
3 Programmable bus width
2
CY7C4201/11
2Kb, 4Kb; 3.3 V
67 MHz
x9; Ind1
4
CYFB denotes Video Frame Buffer products

Status
Availability
QQYY
QQYY
133
Flash Memory
134
NOR Flash Memory Family Decoder

S 29 G L 128 S
Technology:
J = 110 nm Floating Gate

K = 90 nm Floating Gate
L = 65 nm Floating Gate
N = 110 nm MirrorBit
P = 90 nm MirrorBit
R, S = 65 nm MirrorBit
T = 45 nm MirrorBit
Density:
008 = 8Mb
016 = 16Mb
032 = 32Mb
064 = 64Mb
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
02G = 2Gb
0BG = 32Gb
04G = 4Gb
0CG = 64Gb
08G = 8Gb
0AG = 16Gb
Voltage:
D = 2.5V
L = 3.0V
S = 1.8V
Family:
A = Standard ADP (Address-Data Parallel)

C = Burst Mode ADP (Address-Data Parallel)
F = Serial
G = Page Mode
J = Simultaneous Read/Write ADP (Address-Data Parallel)
K = HyperBus
N = Burst Mode Simultaneous Read/Write ADM (Address-Data Multiplexed)
P = Page Mode Simultaneous Read/Write ADP (Address-Data Parallel)
V = Burst Mode Simultaneous Read/Write ADM (Address-Data Multiplexed)
W = Burst Mode Simultaneous Read/Write ADP (Address-Data Parallel)
X = Burst Mode Simultaneous Read/Write AADM (Address-Address-Data
Multiplexed)
Series:
25 = SPI
29 = NOR
Prefix:
26 = HyperFlash
70 = Stacked Die
1 = 63 nm DRAM
27 = HyperRAM
79 = Dual Quad SPI
Product Selector Guide 135
Parallel NOR Flash Memory Portfolio

S29AS-J
110 nm, 1.8 V
S29AL-J
110 nm, 3.0 V
S29JL-J1
110 nm, 3.0 V
S29PL-J1, 2
110 nm, 3.0 V
S29GL-N2
110 nm, 3.0 V
All parts supported by

Longevity Program
unless noted
128Mb
60 ns / 20 ns
* I, A
32Mb
64-128Mb
256Mb
Density
Initial / Page Access
* Temp Range
16Mb
70 ns / -* I, A
16Mb
55 ns / -* I, A, N, M
8Mb
70 ns / -* I, A
8Mb
55 ns / -* I, A, N, M
* I = Industrial: -40C to +85C

A = Industrial, AEC-Q100: -40C to +85C
V = Industrial-plus: -40C to +105C
B = Industrial-plus, AEC-Q100: -40C to +105C
64Mb
55 ns / -* I, A
64Mb
55 ns / 20 ns
* I, A
64Mb
90 ns / 25 ns
* I, A
32Mb
60 ns / -* I, A
32Mb
55 ns / 20 ns
* I, A
32Mb
90 ns / 25 ns
* I, A
N = Extended: -40C to +125C

M = Extended, AEC-Q100: -40C to +125C
1 Supports Simultaneous Read/Write Operation
2 Supports Page Mode
3 S70 series (stacked die)
S29GL-P2
90 nm, 3.0 V
S29GL-S2
65 nm, 3.0 V
S29GL-T2
45 nm, 3.0 V
2Gb3 Q317
110 ns / 25 ns
*I
2Gb3
110 ns / 20 ns
* I, A, V, B
Q316
2Gb3
110 ns / 20 ns
* I, A, V, B, N, M
Q317
1Gb
110 ns / 25 ns
*I
1Gb
100 ns / 15 ns
* I, A, V, B
1Gb
100 ns / 15 ns
* I, A, V, B, N, M
512Mb Q317
100 ns / 25 ns
*I
512Mb
100 ns / 15 ns
* I, A, V, B
512Mb
100 ns / 15 ns
* I, A, V, B, N, M
256Mb
90 ns / 25 ns
*I
256Mb
90 ns / 15 ns
* I, A, V, B
128Mb
90 ns / 25 ns
*I
128Mb
90 ns / 15 ns
* I, A, V, B
64Mb
70 ns / 15 ns
* I, A, B, N
Concept Development Sampling

Status
Availability
EOL (Last-Time-Ship)
QQYY
Production
QQYY
QQYY
136
S29WS-P1
90 nm, 1.8 V
S29NS-P2
90 nm, 1.8 V
S29VS-R2
65 nm, 1.8 V
S29XS-R3
65 nm, 1.8 V
Density
Initial Access / SDR Clock
* Temp Range

Longevity Program
unless noted
512Mb
80 ns / 104 MHz
*W
512Mb
80 ns / 83 MHz
*W
256Mb
80 ns / 104 MHz
*W
256Mb
80 ns / 108 MHz
* W, I
256Mb
80 ns / 108 MHz
* W, I
128Mb
80 ns / 104 MHz
*W
128Mb
80 ns / 108 MHz
* W, I
128Mb
80 ns / 108 MHz
* W, I
64Mb
80 ns / 108 MHz
* W, I
64Mb
80 ns / 108 MHz
* W, I
32Mb
64-128Mb
256Mb
Burst NOR Flash Memory Portfolio
* W = Wireless: -25C to +85C

I = Industrial: -40C to +85C
H = Hot: -40C to +145C

T = Hot, AEC-Q100: -40C to +145C
1 ADP (Address Data Parallel) Burst
2 ADM (Address Data Multiplex) Burst
3 AADM (Address high, Address low, Data Multiplex) Burst
S29CD-J1
110 nm, 2.5 V
S29CL-J1
110 nm, 3.0 V
32Mb
54 ns / 75 MHz
* I, A, N, M, H, T
32Mb
54 ns / 75 MHz
* I, A, N, M, H, T
16Mb
54 ns / 66 MHz
* I, A, N, M, H, T
16Mb
54 ns / 66 MHz
* I, A, N, M, H, T

Status
Availability
QQYY
Production
QQYY
QQYY
137
SPI NOR Flash Memory Portfolio

S25FL1-K
90 nm, 3.0 V
4KB2
S25FL-L
65 nm, 3.0 V
4KB2
S25FL-P
90 nm, 3.0 V
>4KB2
Density
SDR Clock / DDR Clock
* Temp Range
Longevity Program
unless noted
64-128Mb
256Mb
S25FL2-K1
90 nm, 3.0 V
4KB2
64Mb
108 MHz / -* I, A, V, B, N4, M4
S79FL-S3
65 nm, 3.0 V
>4KB2
S25FS-S
65 nm, 1.8 V
>4KB2
1Gb5
133 MHz / 80 MHz
* I, A, V, B
1Gb
133 MHz / 80 MHz
* I, A, V, B
1Gb5
133 MHz / 80 MHz
* I, A, V, B
512Mb
133 MHz / 80 MHz
* I, A, V, B
512Mb
133 MHz / 80 MHz
* I, A, V, B
512Mb
133 MHz / 80 MHz
* I, A, V, B
256Mb
133 MHz / 80 MHz
* I, A, V, B
256Mb
133 MHz / 80 MHz
* I, A, V, B
256Mb Q416
133 MHz / 66 MHz
* I, A, V, B, N, M
256Mb5
104 MHz / -* I, A
256Mb
133 MHz / 80 MHz
* I, A, V, B, N, M
128Mb
133 MHz / 66 MHz
* I, A, V, B, N, M
128Mb6
104 MHz / -* I, A, V, B
128Mb8
133 MHz / 80 MHz
* I, A, V, B, N, M
128Mb7
104 MHz / -* I, A, V, B
128Mb9
108 MHz / -* I, A, V, B
64Mb
108 MHz / 54 MHz
* I, A, V, B, N, M
32Mb
108 MHz / -* I, A, V, B, N4, M4
32Mb
S25FL-S
65 nm, 3.0 V
>4KB2
64Mb
104 MHz / -* I, A, V, B
128Mb
133 MHz / 80 MHz
* I, A, V, B
64Mb
133 MHz / 80 MHz
* I, A, V, B, N, M
32Mb
104 MHz / -* I, A, V, B
16Mb
108 MHz / -* I, A, V, B, N4, M4
Q117
8Mb
76 MHz / -*I

S25FL2-K Dual SPI

Logical sector size
3 S79 series, Dual Quad SPI (stacked die)
4 Contact Sales
6 S25FL129P Quad SPI
S25FL128P Dual SPI

S25FL128S 133-MHz SDR / 80-MHz DDR
9 S25FL127S 108-MHz SDR
Status
Availability

QQYY
Production
QQYY
QQYY
138
HyperFlash and HyperRAM Portfolio

HyperFlash
S26KS-S1
65 nm, 1.8 V
HyperFlash
S26KL-S1
65 nm, 3.0 V
HyperRAM
S27KS-12
63 nm, 1.8 V
HyperRAM
S27KL-12
63 nm, 3.0 V
256Mb3
Contact Sales
Density
Initial Access / DDR Clock
* Temp Range
64-128Mb
256Mb

Longevity Program
unless noted
1Gb3
96 ns / 166 MHz
* I, A, V, B, N, M
1Gb3
96 ns / 100 MHz
* I, A, V, B, N, M
512Mb
96 ns / 166 MHz
* I, A, V, B, N4, M4
512Mb
96 ns / 100 MHz
* I, A, V, B, N4, M4
256Mb
96 ns / 166 MHz
* I, A, V, B, N4, M4
256Mb
96 ns / 100 MHz
* I, A, V, B, N4, M4
256Mb3
Contact Sales
128Mb
96 ns / 166 MHz
* I, A, V, B, N4, M4
128Mb
96 ns / 100 MHz
* I, A, V, B, N4, M4
128Mb3
Contact Sales
* C = Commercial: -0C to +70C

Q416
Q316
64Mb
36 ns / 166 MHz
* I, A, V, B

1 S26 = HyperFlash
2 S27 = HyperRAM
4 Contact sales
Q416
128Mb3
Contact Sales
Q316
64Mb
36 ns / 100 MHz
* I, A, V, B

Status
Availability
QQYY
Production
QQYY
QQYY
139
NAND and e.MMC Family Decoder

NAND
S 34 M L 08G 2
Technology: 1 = 4x nm
2 = 32 nm
3 = 16 nm
Density:
01G = 1Gb
02G = 2Gb
04G = 4Gb
08G = 8Gb
16G = 16Gb
Voltage:
L = 3.0V
S = 1.8V
Family:
M = NAND (Address-Data Multiplexed)

S = SecureNAND (Address-Data Multiplexed)
Series:
34 = NAND
Prefix:
e.MMC
S 40 41 016 1 B1
Controller: B1 = e.MMC 4.51
Revision:
1 = NAND MLC1 19 nm
Density:
008 = 8GB
016 = 16GB
Controller Architecture:
1 Multi-level
B2 = e.MMC 5.1
2 = NAND MLC1 15 nm
032 = 32GB
064 = 64GB
41 = e.MMC
Series:
40 = Managed Memory
Prefix:
cell
Product Selector Guide
140
SLC NAND Portfolio

S34ML-11
4x nm, 3.0 V
SLC, ONFI 1.04
S34MS-11
4x nm, 1.8 V
SLC, ONFI 1.04
S34ML-22
32 nm, 3.0 V
SLC, ONFI 1.04
S34MS-22
32 nm, 1.8 V
SLC, ONFI 1.04
16Gb; x8
40 MBps
* I, A5, V5, B5
S34SL-22, 3
32 nm, 3.0 V
SLC, ONFI 1.04
S34ML-31
16 nm, 3.0 V
SLC, ONFI 1.04
S34MS-31
16 nm, 1.8 V
SLC, ONFI 1.04
16Gb; x8
40 MBps
* I, A5, V5, B5
16Gb; x8
40 MBps
* I, A, V, B
16Gb; x8
40 MBps
* I, A, V, B
8Gb; x8
40 MBps
* I, A, V, B
8Gb; x8
40 MBps
* I, A, V, B
8Gb; x8
40 MBps
* I, A, V, B
8Gb; x8
40 MBps
* I, A, V, B
1Gb-4Gb
8Gb-16Gb
Density; Bus Width

Interface Bandwidth
* Temp Range
Longevity Program
unless noted
8Gb; x8 Q218
40 MBps
* I, A, V5, B
4Gb; x8/16
40 MBps
* I, A, V , B
Q218
4Gb; x8
40 MBps
* I, A5, V, B
Q218
4Gb; x8/16
40 MBps
* I, A, V, B
4Gb; x8/16
40 MBps
* I, A, V, B
4Gb; x8
40 MBps
* I, V
4Gb; x8
40 MBps
* I, A, V, B
4Gb; x8
40 MBps
* I, A, V, B
2Gb; x8/16
40 MBps
* I, A, V, B
Q218
2Gb; x8/16
40 MBps
* I, A5, V, B
Q218
2Gb; x8/16
40 MBps
* I, A5, V5, B5
2Gb; x8/16
40 MBps
* I, A5, V5, B5
2Gb; x8
40 MBps
* I, V5
2Gb; x8
40 MBps
* I, A, V, B
2Gb; x8
40 MBps
* I, A, V, B
1Gb; x8
40 MBps
* I, A, V, B
Q218
1Gb; x8/16
40 MBps
* I, A5, V, B
Q218
1Gb; x8/16
40 MBps
* I, A, V, B
1Gb; x8/16
40 MBps
* I, A, V, B
1Gb; x8
40 MBps
* I, V
1Gb; x8
40 MBps
* I, A, V, B
1Gb; x8
40 MBps
* I, A, V, B
Status
Availability

1 1-bit
Error-Correcting Code (ECC)

Error-Correcting Code (ECC)
3 SecureNAND: Cypresss SLC NAND Flash Memory with
full-capacity Volatile and Nonvolatile Block Protection
4 Open NAND Flash Interface
5 Contact Sales
2 4-bit
QQYY
Production
QQYY
QQYY
141
e.MMC Portfolio
S4041-1B1
19 nm, 3.0-V
MLC, e.MMC1 4.51
S4041-2B2
15 nm, 3.0-V
MLC, e.MMC1 5.1
32GB-64GB
Density; Bus Width

Interface Bandwidth
* Temp Range
64GB; x8
400 MBps
* I, A
8GB-16GB
32GB; x8
400 MBps
* I, A
16GB; x8
200 MBps
* W, I
Q117
16GB; x8
400 MBps
* I, A
8GB; x8
200 MBps
* W, I
Q117
8GB; x8
400 MBps
* I, A

*W = Embedded: -25C to +85C
e.MMC = Embedded Multi Media Card
Status
Availability
QQYY
Production
QQYY
QQYY
142
Flash and RAM MCP Decoder

S 71 N S 512 R D
RAM Density:
A = 16Mb
B = 32Mb
C = 64Mb
D = 128Mb
E = 256Mb
Flash Technology: N = 110 nm MirrorBit
P = 90 nm MirrorBit
R, S = 65 nm MirrorBit
Flash Density:
032 = 32Mb
064 = 64Mb
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
Voltage:
L = 3.0V
Family:
Series:
G = Page Mode
K = HyperFlash
N = Burst Mode Simultaneous Read/Write ADM (Address-Data Multiplexed)
V = Burst Mode Simultaneous Read/Write ADM (Address-Data Multiplexed)
W = Burst Mode Simultaneous Read/Write ADP (Address-Data Parallel)
X = Burst Mode Simultaneous Read/Write AADM (Address-Address-Data Multiplexed)
71, 98 = NOR Flash + pSRAM
72 = NOR Flash + DRAM
Prefix:
Memory Type:
2 = NAND SLC, x16 NAND, x16 LPDDR1, 200 MHz DDR, 1.8 V
RAM Density:
9 = 512Mb
Flash Density:
A = 1Gb
Voltage:
L = 3.0V
Family:
M = NAND
Series:
76 = NAND Flash + DRAM
Prefix:
S = 1.8V
S 76 M S A 9 2
S = 1.8V
143
Flash and RAM MCP Memory Portfolio

S71WS-P1
90 nm, 1.8 V
Flash Density
RAM Density
* Temp Range
S71NS-P2
90 nm, 1.8 V
S71VS-R2
65 nm, 1.8 V
S72VS-R3
65 nm, 1.8 V
S72XS-R3
65 nm, 1.8 V
S98GL-N4
110 nm, 3.0 V
S76MS5
3x nm, 1.8 V
S71KS-S6
65nm, 1.8V
S71KL-S6
65nm, 3.0V

Longevity Program
unless noted
256Mb
1Gb
512Mb
*I
512Mb
64Mb9
* I, A, V, B
512Mb Q316
64Mb9
* I, A, V, B
256Mb
64Mb
*W
256Mb
64Mb9
* I, A, V, B
256Mb
64Mb9
* I, A, V, B
128Mb
64Mb
*W
128Mb
64Mb9
* I, A, V, B
128Mb
64Mb9
* I, A, V, B
512Mb
128Mb
*W
256Mb
256Mb7
*I
256Mb
128Mb
*W
64-128Mb
256Mb
64Mb
*W
256Mb
256Mb
*W
256Mb
256Mb8
* W, I
128Mb
32Mb
*W
64Mb
32Mb
*W
* W = Wireless: -25C to +85C

2 ADM (Address Data Multiplex) Burst
3 AADM
64Mb
32Mb
*I
(Address high, Address low, Data Multiplex) Burst

Page Mode
4 Parallel,
5 NAND
6 HyperFlash
7 DRAM
Version 2
Version 1
9 HyperRAM
8 DRAM
Status
Availability
QQYY
Production
QQYY
QQYY
144
Parallel NOR Flash Memory Packages

Family Density Device
48-ball
FBGA
48-ball
FBGA
56-ball
BGA
64-ball
BGA
64-ball
Fortified BGA
(0.8-mm pitch) (0.5-mm pitch) (0.8-mm pitch) (0.8-mm pitch) (1.0-mm pitch)
AS-J
AL-J
JL-J
PL-J
GL-N
GL-P
GL-S
GL-T
S29AS008J
16Mb
S29AS016J
8Mb
S29AL008J
16Mb
S29AL016J
32Mb
S29JL032J
64Mb
S29JL064J
32Mb
S29PL032J
64Mb
S29PL064J
128Mb
S29PL127J
32Mb
S29GL032N
64Mb
S29GL064N
128Mb
S29GL128P
256Mb
S29GL256P
512Mb
1Gb
8Mb
48-pin
TSOP
56-pin
TSOP
KGD
S29GL512P
S29GL01GP
2Gb
S70GL02GP
64Mb
S29GL064S
128Mb
S29GL128S
256Mb
S29GL256S
512Mb
S29GL512S
1Gb
S29GL01GS
2Gb
S70GL02GS
512Mb
S29GL512T
1Gb
S29GL01GT
2Gb
S70GL02GT
145
Burst NOR Flash Memory Packages

Family
WS-P
NS-P
VS-R
XS-R
44-ball
FBGA
(0.5-mm pitch)
64-ball
BGA
(0.5-mm pitch)
84-ball Fortified
BGA
(0.8-mm pitch)
80-ball
FBGA
(1.0-mm pitch)
80-pin
PQFP
KGD
S29CD016J
32Mb
S29CD032J
16Mb
S29CL016J
32Mb
S29CL032J
Density
Device
128Mb
S29WS128P
256Mb
S29WS256P
512Mb
S29WS512P
512Mb
S29NS512P
64Mb
S29VS064R
128Mb
S29VS128R
256Mb
S29VS256R
64Mb
S29XS064R
128Mb
S29XS128R
256Mb
S29XS256R
16Mb
CD-J
CL-J
146
SPI NOR Flash Memory Packages

Family
Density
Device
FL2-K
8Mb
16Mb
32Mb
64Mb
64Mb
128Mb
256Mb
32Mb
64Mb
128Mb
128Mb
256Mb
128Mb
128Mb
256Mb
512Mb
1Gb
256Mb
512Mb
1Gb
64Mb
128Mb
256Mb
512Mb
1Gb
S25FL208K
S25FL116K
S25FL132K
S25FL164K
S25FL064L
S25FL128L
S25FL256L
S25FL032P
S25FL064P
S25FL128P
S25FL129P
S70FL256P
S25FL127S
S25FL128S
S25FL256S
S25FL512S
S70FL01GS
S79FL256S
S79FL512S
S79FL01GS
S25FS064S
S25FS128S
S25FS256S
S25FS512S
S70FS01GS
FL1-K
FL-L
FL-P
FL-S
FL-S
Dual
Quad
FS-S
SOIC-8
150 mil
SOIC-8
208 mil
UD
UD
SOIC-16
300 mil
UD
UD
CF
USON
4 x 3 mm
WSON
4 x 4 mm
WSON
6 x 5 mm
CF
CF
UD
UD
WSON
8 x 6 mm
VSOP8
208 mil
UD
LGA (CF)
LGA (CF)
CF
BGA24
8 x 6 mm
5 x 5 ball
BGA24
8 x 6 mm
4 x 6 ball
UD
UD
UD
UD
KGD
CF = Contact Factory
UD = Under Development
147
HyperFlash and HyperRAM Packages

Family
KS-S
KL-S
KS-1
KL-1
BGA24
8 x 6 mm
5 x 5 ball
KGD
S26KS128S
CF
256Mb
S26KS256S
CF
512Mb
S26KS512S
CF
1Gb
S70KS01GS
128Mb
S26KL128S
CF
256Mb
S26KL256S
CF
512Mb
S26KL512S
CF
1Gb
S70KL01GS
64Mb
S26KS0641
128Mb
S70KS1281
256Mb
S70KS2561
64Mb
S26KL0641
128Mb
S70KL1281
256Mb
S70KL2561
Density
Device
128Mb
CF
CF
CF = Contact Factory
148
SLC NAND Packages

Family
ML-1
ML-2
ML-3
MS-1
MS-2
MS-3
Density
Device
1Gb
2Gb
4Gb
8Gb
1Gb
2Gb
4Gb
8Gb
16Gb
1Gb
2Gb
4Gb
8Gb
16Gb
1Gb
2Gb
4Gb
1Gb
2Gb
4Gb
8Gb
16Gb
1Gb
2Gb
4Gb
8Gb
16Gb
S34ML01G1
S34ML02G1
S34ML04G1
S34ML08G1
S34ML01G2
S34ML02G2
S34ML04G2
S34ML08G2
S34ML16G2
S34ML01G3
S34ML02G3
S34ML04G3
S34ML08G3
S34ML16G3
S34MS01G1
S34MS02G1
S34MS04G1
S34MS01G2
S34MS02G2
S34MS04G2
S34MS08G2
S34MS16G2
S34MS01G3
S34MS02G3
S34MS04G3
S34MS08G3
S34MS16G3
63-ball
BGA
(0.8-mm pitch)
67-ball
BGA
(0.8-mm pitch)
48-pin
TSOP
149
e.MMC and SecureNAND Packages

Family
41-1B1
41-2B2
SL-2
153-ball
FBGA
(0.5-mm pitch)
100-ball
LBGA
(1.0-mm pitch)
S40410081B1
16GB
S40410161B1
8GB
S40410082B2
16GB
S40410162B2
32GB
S40410322B2
64GB
S40410642B2
1Gb
S34SL01G2
2Gb
S34SL02G2
4Gb
S34SL04G2
Density
Device
8GB
63-ball
BGA
(0.8-mm pitch)
150
Flash and RAM MCP Memory Packages

56-ball
Very Thin FBGA
(0.5-mm pitch)
56-ball
FBGA
(0.8-mm pitch)
84-ball
FBGA
(0.8-mm pitch)
130-ball
BGA
(0.65-mm pitch)
133-ball
FBGA
(0.5-mm pitch)
Family
Flash
Density
RAM
Density
S71WS-P
256Mb
64Mb
S71NS-P
512Mb
128Mb
256Mb
128Mb
256Mb
64Mb
128Mb
64Mb
128Mb
32Mb
64Mb
32Mb
S72VS-R
256Mb
256Mb
S72XS-R
256Mb
256Mb
S98GL-N
64Mb
32Mb
1Gb
512Mb
128Mb
64Mb
256Mb
64Mb
512Mb
64Mb
128Mb
64Mb
256Mb
64Mb
512Mb
64Mb
S71VS-R
S76MS
S71KS-S
S71KL-S
151
APPENDIX
152
Cypress 3.0-V 64Mb (S25FL064L)

Quad SPI NOR Flash Memory
Applications
Block Diagram
Set-top boxes
Printers
White goods
Smart meters
Automotive instrument clusters and infotainment systems
64Mb Quad SPI NOR Flash Memory

CS#8
SRAM
SCK8
Features
IO08
Operating voltage range: 2.7 V to 3.6 V

100,000 Program1/Sector Erase2 endurance cycles3
20-year data retention at +55C
SDR4 clock rate: 108-MHz QIO5
DDR6 clock rate: 54-MHz QIO5
Program1 time (256B): 0.70 ms (typical)
Sector Erase2 time (64KB): 400 ms (typical)
Industrial temp range (AEC-Q100 optional): -40C to +85C
Industrial-plus temp range (AEC-Q100 optional): -40C to
+105C
Extended temp range (AEC-Q100 optional): -40C to +125C
Packages: 8-SOIC 208 mil, 8-WSON7 4 mm x 4 mm or 5 mm x
6 mm, 24-ball BGA 6 mm x 8 mm
X/Y
Decoder
Array
Right
IO18
I/O
IO28
IO38
Control
Logic
RD10
Data Path
RESET#9
Collateral
Datasheet:
App Notes:
Array
Left
Availability
S25FL064L
Cypress FL-L SPI NOR Flash Memory
The operation required to change a value 1 to a value 0 in NOR Flash memory

The operation required prior to a NOR Flash Memory Program, in which all the bits
in a Sector are set to value 1
3 The number of times a NOR Flash Memory Sector can be Programmed/Erased before it
wears out
4 Single-data-rate: A mode of data transfer in which data is transferred once per clock cycle
Sampling:
Production:
Quad input/output (QIO): An interface that transfers addresses or data on four I/Os simultaneously
Double-data-rate: A mode of data transfer in which data is transferred twice per clock cycle
7 Very, Very Thin, Small-Outline, No-Lead semiconductor package
8 Signals used for standard Quad (x4) SPI interface.
9 RESET# is an optional signal available on 16-SOIC and BGA packages.
10 Read data buffer
TBD
TBD

Applications
Block Diagram
Video game consoles

Advanced driver assistance systems (ADAS)
White goods
Set-top boxes

CS#8
SRAM
SCK8
Features
IO08

20-year data retention at +55C
+105C
Extended temp range (AEC-Q100 optional): -40C to +125C
Packages: 16-SOIC 300 mil, 8-WSON7 5 mm x 6 mm,
24-ball BGA 6 mm x 8 mm
X/Y
Decoder
Array
Right
IO18
I/O
IO28
IO38
Control
Logic
RD10
Data Path
RESET#9
Collateral
Datasheet:
App Notes:
Array
Left
Availability
S25FL128L
The operation required to change a value 1 to a value 0 in NOR Flash memory

The operation required prior to a NOR Flash Memory Program, in which all the bits
wears out
Sampling:
Production:
8 Signals used for standard Quad (x4) SPI interface. Refer to the S25FL128L datasheet for signal
definitions in the x1 and x2 mode.
9 RESET# is an optional signal available on 16-SOIC and BGA packages.
10 Read data buffer
TBD
TBD

Applications
Block Diagram
Video game consoles

Advanced driver assistance systems (ADAS)
Networking devices
Set-top boxes

CS#8
SRAM
SCK8
Features
IO08

20-year data retention at +55C (typical)
+105C
Extended temp range (AEC-Q100 optional.): -40C to +125C
Packages: 16-SOIC 300 mil, 8-WSON7 6 mm x 8 mm,
24-ball BGA 6 mm x 8 mm
X/Y
Decoder
Array
Right
IO18
I/O
IO28
IO38
Control
Logic
RD10
Data Path
RESET#9
Collateral
Datasheet:
App Notes:
Array
Left
Availability
S25FL256L
operation required to change a value 1 to a value 0 in NOR Flash memory

operation required prior to a NOR Flash Memory Program, in which all the bits
wears out
Sampling:
Production:
1 The
2 The
Now
Now
8 Signals used for standard Quad (x4) SPI interface; refer to the S25FL256L datasheet for signal
definitions in the x1 and x2 mode
9 RESET# is an optional signal available on 16-SOIC and BGA packages
10 Read data buffer
Military Memory
156
Military Memory Portfolio

Military Temperature | Single Event Latch-up Immune
Fast Async SRAM
Sync SRAM
NoBL2, ECC
CY7S106x
16Mb, 1.8-5.0 V,
10 ns, x8/x16/x32,
Auto E, M
CY7C144/6xK
36Mb, 133-250 MHz,
2.5 V/3.3 V, x18/x36,
M
CY7S105x
8Mb, 1.8-5.0 V,
10 ns, x8/x16/x32,
Auto E, M
CY7C137/8xK Q316
18Mb, 100-250 MHz,
2.5 V/3.3 V, x18/x36,
M
CY7S104x
4Mb, 1.8-5.0 V,
12 ns, x8/x16,
Auto E, M
CY7C136xK Q316
9Mb, 100-250 MHz,
2.5 V/3.3 V, x18/x36,
M
64Kb-256Kb
1Mb-36Mb
64Mb-1Gb
ECC1
NOR Flash
Serial/Parallel I/O
Serial/Parallel I/O, ECC
Serial/Parallel I/O, ECC
CY7C41xKV13
144Mb; 667-1066 MHz,
1.3 V, x18/x36,
Burst 2, M4
S29GL-S
1Gb; 100 ns/15 ns,
3.0 V, x16,
Auto E5, M
CYRS26xKV18
144Mb, 1.8 V, 450 MHz,
x18/x36, Burst 2/4, M
S25FL-S
512Mb; 3.0 V,
133-MHz/80 MHz,
Auto E, M
CYPT154xAV18
72Mb, 1.8 V, 250 MHz,
x18/x36; Burst 2/4, M
S25FS-S
512Mb; 1.8 V,
133-MHz QSPI,
Auto E, M
CY14B116x
16Mb; 1.8-3.0 V,
25 ns/45 ns, x8/x16/x32,
M, RTC6
CY14B104x
4Mb, 1.8-3.0 V,
25 ns/45 ns, x8/x16,
Auto E, M
CY14B101x
1Mb, 1.8-3.0 V,
25 ns/45 ns, x8/x16, SPI
Auto E, M, RTC
CY15B102N
2Mb, 2.0-3.6 V,
60 ns, x16, Auto E, M
CY15B102Q
2Mb, 2.0-3.6 V,
40-MHz SPI, Auto E, M
FM25V10
1Mb; 2.0-3.6 V,
40-MHz SPI, Auto E, M
STK12C68-5
64Kb; 5.0 V,
35 ns/55 ns, x8; QML-Q
5 AEC-Q100
6 Real-time
F-RAM
STK14C88-5
256Kb; 5.0 V,
35 ns/45 ns, x8; QML-Q7
No Bus Latency
3 Quad Data Rate
4 Military Temperature: 55C to +125C
QDR3II+/IV
Nonvolatile SRAM
-40C to +125C
clock
7 Qualified Manufacturers List Level Q, per MIL-PRF-38535
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
157
256Kb Military nvSRAM

Applications
Block Diagram
Military communication
Military real-time controls
Avionics real-time controls
High-reliability data logging
VCAP1
256kb Parallel nvSRAM
Features
Fast access time (35 ns, 45 ns, or 55 ns)
Available in parallel interface for 64Kb and 256Kb densities
Unlimited read/write endurance
100 years data retention at +85C
Qualified Manufacturers List Level Q (QML-Q certified)
per MIL-PRF-38535
Military temperature grade: -55C to +125C
Packages: Ceramic 32-pin DIP, ceramic 32-pin LCC, 28-pin SOIC
and 32-pin SOIC
SONOS Array
STORE
Control
Control
Logic
Data
Store/Recall
Control
SRAM Array
x8
Power
Control
HSB2
RECALL
I/O Control
Address
Decoder
Software
Command
Detect
x14
Collateral
Address
Datasheets: STK12C68
STK14C88
Availability
Sampling: Now
Production: Now
1
2

Hardware STORE busy
158
SRAM
Applications
Block Diagram
Military communication
Military real-time control
Avionics real-time control
Address
Port
x21, x22
QDR-II+
Data Clocks
Maximum frequency of operation/throughput: 250 MHz/36 Gbps

Burst sizes: 2 or 4
Bus-width configurations: x18 or x36
Two independent unidirectional data ports for read and write
enable concurrent transactions
Maximum throughput with double data rate (DDR) data ports
Output impedance matching input (ZQ): Matches the device
outputs to system data bus impedance
Bit-interleaving to eliminate multi-bit errors
I/O signaling standards: 1.5-1.8 V (HSTL)
Controllers available for Altera/Xilinx/Microsemi FPGAs
Package: 165-pin CCGA2
Collateral
Datasheets: CYPT1542AV18/CYPT1544AV18
CYPT1543AV18/CYPT1545AV18
1
2
CQ
CQ
Write Data Port

x18, x36
Write Data Port

(HSTL)
Features
Address Interface
SRAM Array
ZQ
Output Impedance Matching
Control
Logic
7
Control
Read Data Port

(HSTL)
72Mb
QDR -II+
Echo Clocks
QVLD Data Valid

Read Data Port
x18, x36
Boundary
Scan
JTAG Interface
Availability
Sampling: Now
Production: Now
Quad Data Rate: Four data transfers per clock cycle

Ceramic column grid array package
159
SRAM
High-performance computing
Features
Available in two options: QDR-IV HP (RTR 1,334 MT/s)
and QDR-IV XP (RTR 2,132 MT/s)
Two independent, bidirectional DDR2 data ports
Embedded error-correcting code (ECC) to reduce soft error rate
to <0.01 failure-in-time (FIT) per megabit
Bus inversion to reduce simultaneous switching I/O noise
On-die termination (ODT) to reduce board complexity
De-skew training to improve signal-capture timing
I/O levels: 1.2-1.25 V (HSTL/SSTL), 1.1-1.2 V (POD3)
Package: 361-ball FCBGA4
Bus widths: x18 or x36
Family Table
Option
Density
MPN
Max. Frequency
RTR
QDR-IV HP
72Mb
144Mb
CY7C40x1KV13
CY7C41x1KV13
667 MHz
1,334 MT/s
QDR-IV XP
72Mb
144Mb
CY7C40x2KV13
CY7C41x2KV13
1,066 MHz
2,132 MT/s
Block Diagram
Address
Address/Control Bus
Clock
Inversion Port
Address Parity
Parity Error
x21,x22
QDR-IV
Address Interface
2
2
Data Clocks
2
Data Valid
x18, x36
Data Port A
Collateral
Bus Inversion
ECC
Data Port B
(HSTL/SSTL or POD)
Applications
Data Port A
(HSTL/SSTL or POD)
QDR -IV
SRAM Array
Data Clocks
2
2
Data Valid
x18, x36
Data Port B
2
Bus Inversion
Datasheet: CY7C4021KV13/CY7C4041KV13
ODT
Impedance Matching
Quad Data Rate: Four data transfers per clock cycle

Double Data Rate: Two data transfers per clock cycle
3 Pseudo Open Drain: Signaling interface that uses strong pull-down and weak
pull-up drive strength
4 Flip-chip ball grid array
Control
Logic
Control
Test
Engine
JTAG Interface
Availability
Sampling: Now
Production: Contact Sales
160
Sync SRAM With On-Chip ECC
Available in flow-through and pipeline modes1

Single-cycle (SCD)2 and double-cycle (DCD)2 deselect options
Bus-width configurations: x18 or x36
Two voltage options: 2.5 V and 3.3 V
Error-correcting code (ECC) to detect and correct
single-bit errors
Packages: 165-ball BGA and 100-pin TQFP
Industry-standard, RoHS3-compliant packages
MPN
Standard Sync with

On-Chip ECC Pipeline
9Mb
18Mb
36Mb
CY7C1360/2K
CY7C1370/2K
CY7C1440/2K
250 MT/s
<0.01
Standard Sync with

On-Chip ECC Flow-Through
9Mb
18Mb
36Mb
CY7C1361/3K
CY7C1371/3K
CY7C1441/3K
133 MT/s
<0.01
Block Diagram
Datasheets: CY7C135XKV33/CY7C136XKV33
CY7C137XKV33/CY7C138XKV33
CY7C144XKV33/CY7C146XKV33
1 Modes
of synchronous SRAM operation that optimize either read latency (Flow-Through)

or operating frequency (Pipeline)
2 Modes of operation in Pipeline mode where the output driver is tri-stated after either a
single cycle (SCD) or dual cycle (DCD) of issuing the deselect command
3 Restriction of Hazardous Substances: A European Union directive intended to eliminate
the use of environmentally hazardous material in electronic components
4 Failures-in-Time (FIT) per Megabit of Data (FIT/Mb): The projected failure rate of a device
where one FIT/Mb equals one failure per billion device hours per megabit of data
Input
Register
2
Control
Byte Write
Chip Enable
Clock
Collateral
RTR
FIT/Mb4
Density
Output
Enable
x18, x36
Data Port
Control
Logic
ECC
Encoder
SRAM
Array
Address
Interface
Features
Option
Test
Engine
Avionics engine controls

Radar and signal processing
Test equipment
Family Table
Data Port and Control

(2.5/3.3V)
Applications
Output
Register
(Pipeline)
x19-x21
Address
Bus
JTAG
Interface
ECC
Decoder
Availability
Sampling: Now
Production: Now (36Mb), Q3 2016 (18Mb/9Mb)
161
Fast SRAM With PowerSnooze

Applications
Family Table
Avionics engine controls

Military helicopter controls
Military/commercial aircraft flight controls
Density
MPN
4Mb
8Mb
16Mb
CY7S104x
CY7S105x
CY7S106x
Access Time
(85C/125C)
10/12 ns
10/12 ns
10/12 ns
Deep Sleep Current

(Max at 85C)
15 A
22 A
22 A
Features
Access time: 10 ns or 12 ns (see Family Table)
PowerSnooze: Additional power-savings (deep-sleep) mode
Deep-sleep current: 22 A for 16Mb (see Family Table)
Multiple bus-width configurations: x8, x16 and x32
Wide I/O operating voltage range: 1.8-5.0 V
Industry-standard, RoHS2-compliant and leaded BGA packages
Error-correcting code (ECC) to detect/correct single-bit errors
Block Diagram
Fast SRAM with PowerSnooze
ECC
Encoder
Input
Buffer
Data
Address
20
x8, x16, x32
Address
Decoder
SRAM Array
ERR
Power
Management
Block
(Enables
PowerSnooze)
Collateral
Datasheets: CY7S1049G/CY7C1049G
CY7S1059H/CY7C1059H
CY7S1069G/CY7C1069G
I/O Mux
DS3
Sense
Amps
ECC
Decoder
Control Logic
CE
OE WE BHE4 BLE4
Availability
1
A Fast SRAM with a deep-sleep mode in addition to a conventional standby mode.

For example, the 12-ns 16Mb offering has a deep-sleep current of 1.37 A/Mb and a
standby current of 1.87 mA/Mb
2 Restriction of Hazardous Substances: A European Union directive intended to eliminate
the use of environmentally hazardous material in electronic components
3 Deep sleep power mode
4 Byte high enable (BHE)/Byte low enable (BLE)
Sampling:
Now
162
16Mb Parallel nvSRAM

Block Diagram
Applications
Industrial automation
Gaming machines
Industrial data logging
Networking and storage
Telecom equipment
VCAP4
16Mb Parallel nvSRAM

STORE
Control
Features
Control
Logic
Data
XIN1
XOUT2
INT3
Store/Recall
Control
SRAM Array
HSB5
RECALL
I/O Control
RTC
Power
Control
Address
Decoder
Software
Command
Detect
x21
Address
Availability
Collateral
Datasheet: CY14X116L/CY14X116N/CY14X116S
x32
Fast access time (25 ns)

Available in parallel and Open NAND Flash Interface (ONFI)
version 1.0 interfaces
Unlimited read/write endurance
Optional real-time clock (RTC) functionality
Packages: 44-pin TSOP-II, 48-pin TSOP-I, 54- pin TSOP-II,
165-ball FBGA
Crystal connection input

Crystal connection output
3 Interrupt output/calibration/square wave
SONOS Array
Sampling: Now

Hardware STORE busy
163
2Mb SPI Serial F-RAM

Applications
Industrial controls and automation
Medical wearables
Test and measurement equipment
Smart meters
Aerospace and defense applications
Missiles and launchers
Block Diagram
2Mb SPI Serial F-RAM
Control
Features
40-MHz SPI interface
100-trillion read/write cycle endurance
Operating voltage range: 2.0-3.6 V
Low (20-A) sleep current at +125C
Packages: 8-pin TDFN and 8-pin SOIC
Control
Logic
Instruction
Register
F-RAM
Array
Address
Register
Serial
Input
Data I/O
Register
Serial
Output
Status
Register
Collateral
Datasheet: CY15B102Q
Availability
Sampling: Now
164
1Gb Parallel NOR Flash Memory

Applications
Block Diagram
Military systems boot memory

Avionics boot memory
1Gb Parallel Page Mode NOR Flash Memory

D0 D15 16
Features
100 program1/sector erase2 endurance cycles3 at +125C
>10 years data retention at +125C
Initial access time: 100 ns
Page access time: 15 ns
Program time (512B): 0.34 ms (typical)
Sector erase time (128KB): 275 ms (typical)
Packages: 56-pin TSOP (14 x 20 mm), 64-ball fortified4 BGA (9
x 9 and 13 x 11 mm)
Embedded
Voltage
Control
A0 A25 26
X Decoder
Array
RESET
CE
OE
I/O
Y Decoder
Control
Logic
26
WE
WP5
RY/BY6
Data Path
16
Collateral
Datasheet: S29GL01GS
Availability
Sampling: Now
The operation required to change a NOR Flash memory cell state from 1 to 0
The operation in which all the bytes in a sector of NOR Flash memory are erased
simultaneously prior to programming
3 The number of times a NOR Flash memory sector can be programmed or erased before
it wears out
1
Fortified BGA supports a 1-mm ball pitch

Write protect input
6 Ready/busy output
165

Applications
Block Diagram
Military systems boot memory

Avionics boot memory

CS7
SRAM
Features
SCK7
Operating voltage range: 2.7-3.6 V

100 program1/sector erase2 endurance cycles3 at +125C
>10 years data retention at +125C
DDR6 clock rate: 80-MHz QIO
Program time (512B): 0.340 ms (typical)
Sector erase time (256KB): 520 ms (typical)
Packages: 16-pin SOIC 300 mil and 24-ball BGA (6x8 mm)
I/O07
Array
Left
X/Y
Decoder
Array
Right
I/O17
I/O
I/O27
Control
Logic
I/O37
RD9
Data Path
RESET8
Collateral
Datasheet: S25FL512S
Availability
Sampling: Now
The operation required to change a NOR Flash memory cell state from 1 to 0
The operation in which all the bytes in a sector of NOR flash memory are erased
simultaneously prior to programming
3 The number of times a NOR Flash memory sector can be programmed/erased before
it wears out
4 Single Data Rate: A mode of data transfer in which data is transferred once per clock
cycle
1
2
Quad Input/Output (QIO): An interface that transfers addresses or data on four I/Os
simultaneously
6 Double Data Rate: A mode of data transfer in which data is transferred twice per clock cycle
7 Signals used for standard Quad (x4) SPI interface. Refer to the S25FL512S datasheet for signal
definitions in the x1 and x2 mode.
8 RESET# is an optional signal available on 16-pin-SOIC and BGA packages.
9 Read data buffer
5
166
Aerospace Memory
167
Aerospace Memory Portfolio

Radiation Hardened | Latch-up Immune | QML-V1 Certified
Fast Async SRAM
128Mb-144Mb
Non-ECC2
ECC2
Sync SRAM
Nonvolatile SRAM
QDR-II+/IV
Parallel I/O
Serial I/O
16Mb-72Mb
CYRS109x
128Mb; 1.8-5.0 V
12 ns; x8, x16, x32
CYRS264x
144Mb; 1.8 V; 450 MHz
x18, x36; Burst 2,4
CYRS108x
64Mb Serial; 1.8-5.0 V
SPI, QSPI, 106MHz
CYRS154x
72Mb; 1.8 V; 250 MHz
x18, x36; Burst 2,4
CYRS108x
64Mb; 1.8-5.0 V
12 ns; x8, x16, x32
Q416
Q417
CYRS104x
4Mb; 3.3 V
12 ns; x8
Q216
CYRS14x164
64Mb; 1.8-5.0 V
35 ns; x16, x32
Q217
CYRS14x116
16Mb; 1.8-5.0 V
35 ns; x16, x32
Q218
Q217
CYRS104x
4Mb; 1.8-5.0 V
12 ns; x8, x16, x32
Q117
CYRS15x102
2Mb; 2.0-3.6 V
40 MHz; SPI
Concept
1
2
Parallel I/O
CYRS4141x
144Mb; 1.2 V; 667 MHz
x18, x36; Burst 2
CYRS106x
16Mb; 1.8-5.0 V
10 ns; x8, x16, x32
2Mb-4Mb
FRAM
Qualified Manufacturers List Level V, per military specification MIL-PRF-38535

Q417
Q117
Development
CYRS15x102
2Mb; 2.0-3.6 V
60 ns; x16
Q417
Sampling
Production
QQYY
QQYY
Status
Availability
168
72Mb QDR-II+ SRAM with RadStop1

Block Diagram
Applications
Payload processing
Reconfigurable computing platforms
Address
Port
x21,x22
Features
QDR-II+
CQ
CQ
Write Data Port

x18, x36
Read Data Port

(HSTL)
Data Clocks
Address Interface
Write Data Port

(HSTL)
Max frequency of operation/throughput: 250 MHz/36 Gbps

Burst sizes: 2, 4
Bus-width configurations: x18, x36
Two independent unidirectional data ports for read and write
enable concurrent transactions
Maximum throughput with double data rate (DDR) data ports
Output impedance matching input (ZQ): Matches the device
outputs to system data bus impedance
I/O signaling standards: 1.5-1.8 V (HSTL)
Controller available for Xilinx and Microsemi FPGAs
Total ionizing dose: 300 Krad
Heavy-ION SEL2: 120 LET3 MeV-cm sq/mg
Heavy-ION SEU4: 1.34E-07 (Geosynchronous) Error/Bit-day
QML-V5 qualified (DLAM6 part number: 5962F11201/02VXA)
SRAM Array
ZQ
Output Impedance Matching
Control
Logic
7
Control
Availability
Cypress Datasheets : 72-Mbit SRAMs w/ RadStop

DLAM Datasheets:
72-Mbit SRAMs w/ RadStop
Request FPGA controller IP via email: radstop@cypress.com
Non-space-qualified prototypes (CYPT154x):

QML-V5 space-qualified devices (CYRS154x):
4
proprietary design and process technology that increases radiation-resistance

Single-event latch-up
3 Linear energy transfer
QVLD
Data Valid
Read Data Port
x18, x36
Boundary
Scan
Collateral
1 Cypresss
Echo Clocks
JTAG Interface
Now
Now
Single-event upset
6 Defense Logistics Agency Land and Maritime, Columbus, OH
169
4Mb Fast SRAM with RadStop1

Block Diagram
Applications
Payload processing
Sensors and switches
Features
Fast SRAM
Access time: 10 ns (85C), 12 ns (125C)

Bus-width configuration: x8
Operating voltage: 3.3 V
Package: 36-pin ceramic flat pack (CFP)
Total ionizing dose: 300 Krad
Heavy-ION SEL2: 120 LET3 MeV-cm sq/mg
Heavy-ION SEU4: 5.0E-08 (Geosynchronous) Error/Bit-day
QML-V5 qualified (DLAM6 part number: 5962F11235VXA)
Address Port
x18
Address
Decoder
SRAM
Array
Sense
Amps
OE
x8
WE
Collateral
Availability
Cypress Datasheet: 4-Mbit SRAM w/ RadStop

DLAM Datasheet:
4-Mbit SRAM w/ RadStop
Non-space-qualified prototypes (CYPT1049):

QML-V5 space-qualified devices (CYRS1049):
1 Proprietary
Data Port
Control Logic
CE
Cypress design and process technology that increases radiation-resistance

Single-event latch-up
3 Linear energy transfer
I/O
MUX
Now
Now
Single-event upset
6 Defense Logistics Agency Land and Maritime, Columbus, OH
170
Energy Harvesting PMIC
171
Series Solar Cell by

Panasonic (AM-1801)
Wearable
Residential
Building
Industrial
Activity Monitor
WSNs2 for HVAC3, Level

of Light Emitted,
Temperature, Humidity,
Motion
WSNs2 for HVAC3, Level

of Light Emitted,
Temperature, Humidity,
Motion, BLE4 Beacon5
WSNs2 for Infrastructure, Agriculture,

Transportation, Factory Automation, Animal
Monitoring
Indoor/Outdoor
Single Solar Cell by

Ningbo Hebe Solar (HSC125155)
NEW
Light
Piezoelectric Device by
Thrive (K7520BS3)
S6AE101A
Linear, Power Gating6,
Multiplexer7,
10-pin QFN
Series
Solar Cell
Indoor
NEW
NEW
S6AE102A
Multiplexer7, LDO8,
Comparator, 20-pin QFN
S6AE103A
Multiplexer7, LDO8, Timer,
Comparator, 24-pin QFN
MB39C811
Buck DC/DC, Dual-Bridge
Rectifier, Power Good,
40-pin QFN
MB39C811
40-pin QFN
MB39C811
40-pin QFN
S6AE101A
Multiplexer7,
10-pin QFN
NEW
Energy Harvesting PMIC1 Portfolio
Electromagnetic Device by
Perpetuum (PMG-FSH)
Light
Single
Solar Cell
MB39C811
40-pin QFN
Vibration
TEG by Micropelt
(TGP-651)
Piezoelectric,
Electromagnetic
MB39C831
Boost DC/DC, MPPT9,
Li-ion Protection,
40-pin QFN
Thermoelectric
Generator (TEG)
Management IC
2 Wireless Sensor Nodes
3 Heating, ventilation, air conditioning
5 A wireless device that transmits data (e.g., signal strength and ID)
over a periodic radio signal from a known location
MB39C831
Boost DC/DC, MPPT9,
Li-ion Protection,
40-pin QFN
MB39C811
40-pin QFN
Heat
1 Power
Outdoor
6 Output
Market Segment
power control circuit that controls power provided

to the system load
7 Power source switch circuit for primary battery or Energy
Harvesting Device
8 Low drop out regulator
9 Maximum Power Point Tracking
Concept
Development
Sampling
Production
QQYY
QQYY
Status
Availability
Roadmap
172
Energy Harvesting PMIC1 (S6AE101A)

Applications
Block Diagram
Series solar cell energy harvesting2 and wireless sensor nodes3

Primary
Battery
(Optional)
Features
Ultra-low power: Enables 1 cm2 minimum solar cell size for
startup operation4
Input voltage range:
Series solar cell: 2.0-5.5 V
Primary battery: 2.0-5.5 V
Output voltage range: 1.1-5.2 V
Quiescent current5: 250 nA
Startup power: 1.2 W
Power gating6 switch circuit
Storage control circuit
Multiplexer7 circuit (battery vs. solar cell)
Overvoltage protection
Packages: 10-pin SON (3.0 x 3.0 mm)
S6AE101A
System
Load
Power Gating6
Switch
+
Multiplexer7
Storage
Control
Series
Solar Cell
Overvoltage
Protection
Vref8
Control Block
Collateral
Datasheet:
S6AE101A Datasheet
Development Kits: Solar-Powered IoT Device Kit
S6AE10xA Evaluation Board
Software:
Easy DesignSim Software
Availability
Sampling:
Production:
1 Power
2 The
Management IC
process of capturing and converting tiny amounts of energy
(e.g., from light, vibration or heat) into electricity
3 A sensor-based device that monitors conditions such as temperature, humidity and
pressure and wirelessly transmits that data to a control unit, such as a PC or a mobile
device
Now
Now
Estimate based on solar cell power = 2 W/cm2 at 100 lx

Current consumed at no load condition
6 Output power control circuit that controls power provided to the system load
7 Power source switch circuit for primary battery and Energy Harvesting Device
8 Voltage reference circuit for internal block
Product Overview
173

Applications
Block Diagram
Primary Battery
(Optional)
Features
S6AE102A
Power Gating6
Switch

startup operation4
Low quiescent current5 low drop out regulator (LDO): 400 nA
Dual channel power gating6 switch circuit with IRQ7 control
Signal output circuit of power gating switch control
Hybrid storage control circuit9 and overvoltage protection
Packages: 20-pin QFN (4.0 x 4.0 mm)
Multiplexer8
Hybrid Storage
Control9
Series
Solar
Cell
Overvoltage
Protection
VIN_LDO
LDO
Control Block
ENA_LDO
STBY_LDO
IRQ7 for Power

Gating
Switch Control
INT
Vref10
Datasheet:
S6AE102A Datasheet
Development Kits: S6AE10xA Evaluation Board
Software:
Availability
Sampling:
Production:
1 Power
2 The
System
Load2
SW_CONT
VOUT_LDO
Collateral
Management IC
pressure and wirelessly transmits that data to a control unit, such as a PC or a mobile device
4 Estimate based on solar cell power = 2 W/cm 2 at 100 lx
Power Gating6
Switch
System
Load1
Now
Now

Output power control circuit that controls power provided to the system load
7 Interrupt request control function for power management
8 Power source switch circuit for primary battery or series solar cell
9 Uses a small and large capacitor to automatically store excess power for backup
Product Overview
174

Applications
Block Diagram
Primary Battery
(Optional)
Features
startup operation4
Low quiescent current5 low drop out regulator (LDO): 400 nA
Low consumption current CR timer6: 30 nA
General-purpose low consumption current comparator: 20 nA
Dual channel power gating7 switch circuit with CR timer6 and
IRQ6 control
Signal output circuit of power gating switch control
Hybrid storage control circuit9 and overvoltage protection
Packages: 24-pin QFN (4.0 x 4.0 mm)
S6AE103A
Gating7
Power
Switch
+
Multiplexer8
Power Gating7
Switch
Hybrid Storage
Control9
Series
Solar Cell
VIN_LDO
System
Load1
System
Load2
Overvoltage
Protection
SW_CONT/
COMPOUT
LDO
ENA_COMP
ENA_LDO
STBY_LDO
VOUT_LDO
Control Block
Vref10
COMPP
Comparator
COMPM
CR Timer6 & IRQ6

for Power Gating
Switch Control
INT
Collateral
Datasheet:
S6AE103A Datasheet
Development Kits: S6AE10xA Evaluation Board
Software:
Availability
Sampling:
Production:
1 Power
2 The
Management IC
3 A sensor-based device that monitors conditions such as temperature, humidity and pressure
and wirelessly transmits that data to a control unit, such as a PC or a mobile device
4 Estimate based on solar cell power = 2 W/cm 2 at 100 lx
Now
Now

Time (or IRQ: Interrupt request) control function for power management
7 Output power control circuit that controls power provided to the system load
8 Power source switch circuit for primary battery or series solar cell
9 Uses a small and large capacitor to automatically store excess power for backup
Product Overview
175
Energy Harvesting PMIC1 (MB39C811)

Applications
Block Diagram
Series solar cell energy harvesting2, Piezoelectric3 energy

harvesting and wireless sensor nodes (WSN)4
MB39C811
Features
Ultralow-power buck DC/DC converter dual-bridge rectifiers
Quiescent current5: 1.5 A
Input voltage range: 2.6 V-23 V
Output voltage: 1.5 V, 1.8 V, 2.5 V, 3.3 V, 3.6 V, 4.1 V,
4.5 V and 5.0 V
Output current: 100 mAmax
Overcurrent protection
Low-loss full-wave bridge rectifier: VF6 = 0.28 V (IF = 10 A),
IR7 = 20 nAmax (Vreverse = 18 V)
Shunt for input protection: VIN 21 V, up to 100-mA pulldown
Input and output power good monitoring
Package: 40-pin QFN (6.0 x 6.0 mm)
VIN
Series
Solar cell
Shunt
Bridge
Rectifier
Piezoelectric
VOUT
Bridge
Rectifier
VB Reg8
S2
S1
S0
VOUT
Setting
Buck DC/DC
Converter
BGR9
ERR
CMP10
Collateral
Datasheet:
MB39C811 Datasheet
Development Kits: Energy Harvesting Starter Kit
MB39C811 Evaluation Board
Software:
Availability
Sampling:
Production:
1 Power
2 The
Management IC
3 Power generation device using vibration
pressure and wirelessly transmits that data to a control unit, such as a PC or a mobile device
Power Good
VIN
Power
Good
VOUT
Power
Good
Now
Now

Bridge rectifier reverse breakdown voltage
7 Bridge rectifier reverse bias leak current
8 Regulator for internal block
9 Band Gap Reference
10 Error Comparator
Product Overview
176
Energy Harvesting PMIC1 (MB39C831)

Applications
Single solar cell energy harvesting2, thermoelectric generator3
energy harvesting and wireless sensor nodes4
Block Diagram
VIN
MB39C831
Features
Ultralow-voltage startup boost DC/DC converter
Input voltage range: 0.3 V-4.75 V
Startup voltage: 0.35 V
Output voltage: 3.0 V, 3.3 V, 3.6 V, 4.1 V, 4.5 V, 5.0 V
(Constant voltage mode only)
Quiescent current5: 32 A
Output current: 8 mA (VDD = 0.6 V, VOUT = 3.3 V) and
80 mA (VDD = 3.0 V, VOUT = 3.3 V)
Input peak current limit: 200 mA
Built-in Maximum Power Point Tracking (MPPT)6 function
Built-in Li-ion charge function
Input and output power good monitoring
Package: 40-pin QFN (6.0 x 6.0 mm)
VDD Voltage
Detector
(UVLO7)
Startup
VCC Voltage
Detector
VOUT Voltage
Detector
MPPT6
Enable
Enable
S2
S1
S0
VOUT-VDD
Voltage
Inversion
Detector
BGR8
VOUT
Boost DC/DC
Converter
Energy
Storage
Device
MPPT6
Controller
Collateral
Datasheet:
MB39C831 Datasheet
Development Kits: MB39C831 Evaluation Board
Software:
VIN & VOUT

Power Good
Availability
Sampling:
Production:
1 Power
5 Current
2 The
6 Maximum
Management IC
3 Power Generation Device using heat
4 A sensor-based device that monitors conditions such as temperature, humidity and pressure
and wirelessly transmits that data to a control unit, such as a PC or a mobile device
Now
Now
consumed at no load condition

Power Point Tracking maximizes the Energy Harvest by adjusting
current drawn from a solar panel
7 Undervoltage lockout
8 Band Gap Reference
Product Overview
177
Automotive Products
178
Table of Contents
Page
Topic
180
Automotive TrueTouch
187
Automotive CapSense
193
Automotive PSoC
201
Automotive Traveo Instrument Cluster MCU Family
206
Automotive Traveo Body Control MCU Family
210
Automotive Traveo MPN Selector Guides
215
Automotive Asynchronous SRAM
219
Automotive Synchronous RAM
221
Automotive Nonvolatile RAM
226
Automotive Flash Memory
237
Automotive USB
243
Automotive Timing Solutions
247
Automotive Power Management IC
252
Automotive LED Driver
179
Automotive TrueTouch Roadmap
180
Automotive Portfolio: TrueTouch

Gen4
Gen6
Gen7
10 Finger, AutoArmor1, DualSense2, H2O3, Glove Touch4

In-Cell7 or SLIM8, Gestures, AMS5
Thick Glove6 or Thick/Curved Overlay
Next Generation
CYAT8168X-88
88 I/O, 100-Hz RR10
Grades: A12 and S13
CYAT8X68X-88
88 I/O, 100-Hz RR10
Grades: A12 and S13
CYAT8X7XX
CY8CTMA1036
65 I/O, 80-Hz RR10
Gestures, Thin Glove14
Grades: A12 and S13
CYAT8168X-77/71
77/71 I/O, 120-Hz RR10
Grades: A12 and S13
CYAT8X68X-77/71
77/71 I/O, 120-Hz RR10
Grades: A12 and S13
CY8CTMA768
56 I/O, 80-Hz RR10
Grades: A12 and S13
CYAT8168X-61
61 I/O, 120-Hz RR10
Grades: A12 and S13
CYAT8X68X-61
61 I/O, 120-Hz RR10
Grades: A12 and S13
CYTMA461
48/43 I/O15, 80-Hz RR10
AMS5, Thick Overlay, Thick Glove6
Grades: A12 and S13
CYAT8165X-48
48 I/O, 100-Hz RR10
Grades: A12 and S13
CYAT8X65X-48
48 I/O, 100-Hz RR10
Grades: A12 and S13
CY8CTMA460
48/43 I/O15, 100-Hz RR10
Grades: A12 and S13
CYAT816XX-36
36 I/O, 120-Hz RR10
Grades: A12 and S13
CYAT8X6XX-36
36 I/O, 100-Hz RR10
Grades: A12 and S13
3-8
7-12
Active Touch Area
> 12
Gestures, AMS5
Thick Glove6 or Thick Overlay
1 Enables
compliance with chip-level emission,

immunity and system-level specifications
2 Self-Capacitance + Mutual-Capacitance
3 Waterproofing and wet-finger tracking
4 A feature that allows the detection of gloved fingers
on a touch sensor
5 Automatic Mode Switching
6 1-mm to 5-mm glove thickness (ski gloves)
CYAT8X7XX
Q316
A type of sensor stack-up in which the RX sensor is

inside the LCD module under the color-filter glass
8 Single-Layer Independent Multi-Touch
9 AutoArmor + Test report on touch functionality during
immunity conditions
10 Refresh rate
11 A type of sensor stack-up in which the RX sensor is inside the
LCD module as part of the TFT layer
12
AEC-Q100: -40C to +85C

AEC-Q100: -40C to +105C
14 Less than 1-mm glove thickness (normal leather gloves)
15 Number of available I/Os depends on package selection
Concept Development Sampling Production
Industrial
Automotive
QQYY
QQYY
Availability
13
181
Automotive Portfolio:
TrueTouch Software1
PSoC Designer
TrueTouch Host
Emulator2
TrueTouch Driver for

Android3
Manufacturing Test
Kit4
5.4 SP1
3.3.10
3.5
1.8.5
CY8CTMA616
Production
Production
CY8CTMA884
Production
TTDA 2.5.1
Production
CY8CTMA460
Production
CY8CTMA768
Production
CY8CTMA1036
Production
CY8CTMA461
Production
Production
CYAT8168X-61
Production
Production
CYAT8168X-71
Production
Software
MPN
Current Version
Gen 1
Gen 3
Gen 4
Gen 6
CY8CTMA120
Production
CY8CTMG120
Production
Production
Production
TTDA 2.5
Production
Production
Production
Production
Contact Sales
CYAT8168X-77
Production
Production
CYAT8168X-88
Production
Production
Contact sales for the latest TrueTouch software, drivers and tools
1 PSoC
Designer, TTHE and MTK releases are backward compatible. The latest version is recommended for new designs.
Host Emulator (TTHE) is a front-end tool used to configure, tune, debug and demonstrate TrueTouch devices
3 TrueTouch Driver for Android (TTDA) is the driver for Android that translates touch information into Linux/Android events
4 TrueTouch Manufacturing Test Kit (MTK) enables customers and ITO partners to test touch panels that use Cypress TrueTouch controllers through the manufacturing flow
2 TrueTouch
182
CY8CTMA460/768/1036
Automotive TrueTouch Gen4 Family
Applications
Block Diagram
Host Processor
Touchscreens
Trackpads
1 - I2 C
2 - Serial Peripheral Interface (SPI)
INT8
Features
Advanced User Interface
Waterproofing1: Works with water droplets, condensation, sweat
and wet-finger tracking
Tracking with up to 1-mm-thick gloves
Proprietary Analog Front End2 with AutoArmorTM 3
True 10-V TX-Boost with multiphase TX4
DualSense: Self5- and mutual6-capacitance analog front end
(U.S. patents 8,358,142; 8,319,505; and 8,067,948)
System Solutions
Supports thin ITO7 stackups and metal mesh sensors
AutoArmor enables compliance with chip-level emission
(IEC 61967), immunity (IEC 62132) and system-level
(CISPR 25) specifications
Android driver support
Manufacturing test kits for production testing
Packages
100-pin TQFP, 56-pin QFN (TMA460 only)
Collateral
Datasheet:
CY8CTMA1036/768/460
Evaluation Kit: CY3290-TMA1036A
CY8CTMA
460/768/1036
32
32
Flash
ARM Cortex
CPU
32
SRAM
32
10-V TX
Pump
Touch
Sequencer
RX
Channels
65
Touchscreen Sensor I/O: XY00-XY64
Touchscreen Sensor
Availability
Sampling:
Production:
56-pin QFN: Now

100-pin TQFP: Now; 56-pin QFN: Q3 2016
1 The
5 The
2 Analog
6 The
ability of a Touchscreen Sensor to work properly in the presence of water droplets, condensation or sweat
circuit in the touchscreen controller used to measure Self- and Mutual-Capacitance
3 Cypress proprietary technology used to reduce emissions and improve EMI immunity to meet automotive EMC
requirements
4 A scanning method used to drive multiple TX lines simultaneously
I2C/SPI
capacitance of a row or column line in a Touchscreen Sensor

capacitance between a row and a column in a Touchscreen Sensor
7 Indium tin oxide
8 Interrupt
183
CY8CTMA461

Applications
Block Diagram
Host Processor
Touchscreens
Trackpads
1 - I2 C
INT8
Features
CY8CTMA461
I2C/SPI

Tracking with up to 5-mm-thick gloves or thick overlay
Proprietary Analog Front End2 with AutoArmorTM 3
True 10-V TX-Boost with multiphase TX4
DualSense: Self5- and mutual6-capacitance analog front end
(U.S. patents 8,358,142; 8,319,505; and 8,067,948)
System Solutions
Supports thin ITO7 stackups and metal mesh sensors
AutoArmor enables compliance with chip-level emission
Android driver support
Packages
100-pin TQFP, 56-pin QFN
Collateral
Datasheets and Design Guides:
Contact Sales or automotive@cypress.com
32
32
Flash
32
SRAM
32
10-V Tx
Pump
Touch
Sequencer
Rx
Channels
48
Touchscreen Sensor
Availability
Sampling:
Production:
56-pin QFN: Now

100-pin TQFP: Now; 56-pin QFN: Q3 2016
1 The
5 The
2 Analog
6 The
requirements
ARM Cortex
CPU

7 Indium tin oxide
8 Interrupt
184
CYAT8168X

Applications
Block Diagram
Host Processor
Large touchscreen human machine interface (HMI) systems
1 - I2C
INT7
Features
CYAT8168X
I2C/SPI

Tracking with up to 5-mm thick gloves or thick overlay
Proprietary Analog Front End2 with AutoArmor3
True 5-V TX-Boost with Multi-Phase TX4
54 Receive Channels to support 100 Hz refresh rates
DualSense: Self5- and Mutual6-Capacitance analog front end
(U.S. Patents 8,773,146; 8,358,142; 8,319,505; and 8,067,948)
AutoArmor enables compliance with chip-level emissions
System Solutions
Package
128-pin TQFP, 100-pin TQFP
32
32
Flash
ARM Cortex
CPU
32
SRAM
32
Channel
Engine
Touch
Sequencer
5-V TX
Pump
RX
Channels

88
Touchscreen Sensor
Collateral
Datasheets and Design Guides:
Contact Sales or automotive@cypress.com
Availability
Production:
Now
1 The
5 The
2 Analog
6 The
requirements

7 Interrupt
185
Automotive TrueTouch Packages

Package
QFN
Pins
Body Size
56
100
128
8 x 8 mm
14 x 14 mm
14 x 20 mm
0.5 mm
0.5 mm
0.5 mm
Family
Pitch
Gen 1
CY8CTMA120
, 1
CY8CTMG120
Gen 3
Gen 4
CY8CTMA616
CY8CTMA884
CY8CTMA460
CY8CTMA768
CY8CTMA1036
CY8CTMA461
Gen 6
TQFP
CYAT8168X-61
CYAT8168X-71
CYAT8168X-77
CYAT8168X-88
Wettable flanks package to allow automated optical inspection (AOI)
186
Automotive CapSense Roadmap
187
Entry
Value
Performance
Automotive Portfolio: CapSense

CapSense Express
CapSense Plus
PSoC
Configurable1
Programmable2
Programmable System-on-Chip
CY8CMBR3106S
SmartSense_EMCplus3
Proximity
Grades: A4 and S5
CY8CMBR3116
16 Buttons, 8 LEDs
SmartSense_EMCplus3
Proximity, Water Tolerance
Grades: A4 and S5
CY8C20xx7/S
16, 32KB Flash; 2KB SRAM
Glove, Stylus Support
CY8CMBR3108
8 Buttons, 4 LEDs
SmartSense_EMCplus3
CY8CMBR3110 Q416
10 Buttons, 5 LEDs
SmartSense_EMCplus3
Grades: A4 and S5
CY8CMBR3102
2 Buttons, Proximity
SmartSense_EMCplus3
CY8CMBR2110
10 Buttons, 10 LEDs
CY8CMBR310XLP
1-4 Buttons, Low Power
Contact Sales
CY8CMBR2016
16 Buttons
CY8CMBR2044
4 Buttons, 4 LEDs
CY8CMBR2010
10 Buttons, 10 LEDs
CY8C24x94
16KB Flash, 1KB SRAM
Grade: A4
CY8CMBR3002
2 Buttons, 2 LEDs
SmartSense_EMCplus3
CY8C201xx
10 Buttons, 5 LEDs
2 Sliders
CY8C20234
8KB Flash, 512Byte SRAM
Grade: A4
CY8C20236A
8KB Flash, 1KB SRAM
Grade: A4
CY8C21x34
Grades: A4 and E6
CY8C20xx6H
8,16KB Flash; 1,2KB SRAM
Haptics
CY8C4246/7-M Q416
64, 128KB Flash
Grades: A4 and S5
CY8C4246/7-L
128, 256KB Flash
Contact Sales
CY8C41xx-S
16-64KB Flash
Grades: A4 and S5
CY8C36xx/38xx
32, 64KB Flash
Grades: A4 and E6
CY8C41xx/42xx
16, 32KB Flash
Grades: A4 and S5
CY8C32xx/34xx
16-64KB Flash
Grades: A4 and E6
CY8C21x12
Grades: A4 and E6
CY8C40xx-S
16, 32KB Flash
Grades: A4 and S5
CY8C2xx45
Grades: A4 and E6
CY8C40xx
Grades: A4 and S5
Integration
1 Standard
products are configured for target applications with a graphical user interface
2 Microcontroller-based products can be freely programmed to implement additional functions
3 SmartSense Electromagnetic Compatible = SmartSense Auto-tuning + high noise immunity
4 AEC-Q100:
-40C to +85C
5 AEC-Q100: -40C to +105C
6 AEC-Q100: -40C to +125C

Industrial
Automotive
Availability
QQYY
QQYY
188
CapSense Software1
Software
Current Version
PSoC Creator2
PSoC Designer
3.3 CP3
PSoC 1
PSoC Programmer4
EZ-Click
5.4 SP1
3.24.4
2.0 SP1
Production
Production
PSoC 3
Production
Production
PSoC 4
Production
Production
CapSense Plus
CapSense Express
Production
Production
Download the latest PSoC software version here
1 All
software and tool releases are backward compatible. The latest versions are recommended for new designs
Creator is an Integrated Design Environment (IDE) that allows concurrent hardware and firmware design of PSoC 3 and PSoC 4 systems
3 PSoC Designer is an IDE that enables firmware design using a library of precharacterized peripherals for PSoC 1 systems
4 PSoC Programmer can be used with PSoC Designer and PSoC Creator to program and debug any design onto a PSoC device
5 EZ-Click is a Windows GUI-based tool that enables development of CapSense MBR solutions. It allows you to set up sensor configuration, apply global system properties, monitor real-time
sensor output, and run production-line system diagnostics
2 PSoC
189
Automotive PSoC 4100-Series

Block Diagram

Digital and analog one-chip sensor hub
User interface for heating, ventilation, air conditioning

MCU Subsystem
Programmable Analog
Blocks
Opamp
x1

One opamp, configurable as PGA1, CMP, filter, etc.
One 12-bit, 806-Ksps SAR2 ADC
One Cypress Capacitive Sigma-Delta (CSD) controller
Capacitive sensing supported on up to 24 pins
Four configurable 16-bit timer, counter or pulse-width modulator
(TCPWM) blocks
Two configurable serial communication blocks (SCBs): I2C master
or slave, SPI master or slave, UART or LIN slave
Packages
28-pin SSOP
Collateral
Datasheet:
24 MHz
Flash
(16KB to 32KB)
SRAM
(4KB)
CMP
x2
GPIO x6
SAR2
ADC
CSD
Blocks
TCPWM x4
SCB x2
Segment LCD Drive
GPIO x4
GPIO x6
GPIO x4
Serial Wire Debug

GPIO x4
Availability
Automotive PSoC 4100 Datasheet
1 Programmable
2 Successive
Cortex-M0
Features
I/O Subsystem
Applications
gain amplifier
3 Industrial:
Sampling:
Production:
Now
Now
-40C to +85C
190


Block Diagram
MCU Subsystem
Programmable Analog
Blocks
Opamp
x1

Packages
28-pin SSOP
Collateral
Datasheet:
Cortex-M0
48 MHz
Flash
(16KB to 32KB)
SRAM
(4KB)
Serial Wire Debug
Features
CMP
x2
I/O Subsystem
GPIO x6
SAR2
ADC
CSD
Blocks
UDB x4
TCPWM3 x4
SCB x2
Segment LCD Drive
Applications
GPIO x4
GPIO x6
GPIO x4
GPIO x4
Availability
Sampling:
Production:
Now
Now
1 Programmable
gain amplifier
3 Timer, counter, pulse-width modulator
2 Successive
191
Automotive CapSense Packages

Package
LQFP
Pins
Body Size
Family
Pitch
PSoC 1
2XX45
QFN
SOIC
24
40
56
16
20
28
48
64
7 x 7 mm
4 x 4 mm
6 x 6 mm
8 x 8 mm
150 Mil
210 Mil
5 x 10 mm
300 Mil
10 x 10 mm
0.5 mm
0.5 mm
0.75 mm
0.5 mm
1.27 mm
0.65 mm
0.65 mm
0.635 mm
0.5 mm
21X34
24X23
29X66
4000
41/42XX
TQFP
48
24894
PSoC 4
SSOP
192
Automotive PSoC Roadmap
193
Automotive PSoC and MCU Portfolio

8-Bit
32-Bit ARM
Cortex-M0/M0+
32-Bit ARM
Cortex-M3
32-Bit ARM
Cortex-M4
32-Bit ARM
Cortex-M7
High Analog Integration
Ultra-Low-Power
8-/16-Bit Replacement
Mid-Range
Performance
High Performance
Next Generation
Analog and Digital Integration
Programmable System-on-Chip (PSoC) is the worlds only programmable embedded

system-on-chip integrating an MCU core, PABs1, PDBs2, programmable interconnect
and routing, and CapSense capacitive sensing
Flexible MCU (FM) is a portfolio of high-performance ARM Cortex-M-based
MCUs for industrial and consumer applications
PSoC 5LP
Cortex-M3
80 MHz, 256KB Flash
20 PAB1, 30 PDB2, 72 I/Os
PSoC 4
Cortex-M0
48 MHz, 128KB Flash
PSoC 3
8051 CPU
67 MHz, 64KB Flash
PSoC 1
M8C CPU
24 MHz, 32KB Flash
16 PAB1, 16 PDB2, 56 I/Os
PSoC 7
Cortex-M7
PSoC 6
FM7 MCUs
Cortex-M7
FM4 MCUs
Cortex-M4
200 MHz, 2MB Flash, 190 I/Os
FM3 MCUs
Cortex-M3
144 MHz, 1.5MB Flash, 154 I/Os

CY8C4Axx
48 MHz, 32KB Flash
FM0+ MCUs
Cortex-M0+
40 MHz, 512KB Flash, 102 I/Os

1
A programmable analog block that is configured using PSoC software to create analog front ends, signal conditioning circuits
with opamps and filters
2 A programmable digital block that is configured using PSoC software to implement custom digital peripherals and glue logic
Industrial
Automotive
Availability
QQYY
QQYY
194
Automotive Portfolio: PSoC 1

M8C Core | 24 MHz
PSoC MCU
Intelligent Analog
Performance Analog
Analog: 2x CMP1
Analog: 1x/2x CMP1,

4xSC/CT PAB2
Interfaces: I2C, SPI, UART
Analog: 2x/4x CMP1,

6xSC/CT PAB2, PGA3
Analog: 4x CMP1,
12x/16x SC/CT PAB2, PGA3
Interfaces: I2C, SPI
CY8C29x66
32K/2K4, 44 GPIOs5
1x14-bit ADC6
Grades: A7 and E8
CY8C27x43
32K/2K4, 44 GPIOs5
CapSense, 1x14-bit ADC6
CY8C24894
16K/1K4, 56 GPIOs5
CapSense, 2x14-bit SAR ADC6
Grade: A7
CY8C28xxx
16K/1K4, 44 GPIOs5
Performance
CY8C2xx45
16K/1K4, 38 GPIOs5
CapSense, 1x10-bit SAR ADC6
Grades: A7 and E8
CY8C21x34
8K/0.5K4, 28 GPIOs5
Grades: A7 and E8
CY8C24x23
4K/0.25K4, 24 GPIOs5
Grades: A7 and E8
CY8C23x33
8K/0.25K4, 26 GPIOs5
CapSense, 1x 8-bit SAR ADC6
CY8C24x93
32K/2K4, 36 GPIOs5
1x10-bit ADC6
CY8C21x23
4K/0.25K4, 16 GPIOs5
1x10-bit ADC6
Integration
1 Comparator
2 Switched
capacitor/continuous time programmable analog block

3 Programmable gain amplifier
4 Flash KB/SRAM KB
5 General-purpose input/output pins
6 Analog-to-digital
converter: Includes incremental, successive

approximation register (SAR) or Delta-Sigma () ADCs
7 AEC-Q100: -40C to +85C
8 AEC-Q100: -40C to +125C

Industrial
Automotive
Availability
QQYY
QQYY
195
Automotive Portfolio: PSoC 4

ARM Cortex-M0/M0+ | CapSense | Timer/Counter/PWM
PSoC MCU
PSoC 4000
Intelligent Analog
PSoC 4100
BL = BLE-Series
PSoC 4200
S = S-Series
M = M-Series
CY8C4248-L
48-MHz M0, 256K/32K1
CMP2, Opamp, ADC3
SCB4, IDAC5, UDB7, CAN8
USB
CY8C4248-BL
48-MHz M0, 256K/32K1
CMP2, Opamp, ADC3
SCB4, IDAC5, BLE6, UDB7
CY8C4247-M Q416
48-MHz M0, 128K/16K1
CMP2, Opamp, ADC3
Grades: A10 and S11
CY8C4247-L
48-MHz M0, 128K/16K1
CMP2, Opamp, ADC3
SCB4, IDAC5, UDB7, CAN8,
USB
CY8C4247-BL
48-MHz M0, 128K/16K1
CMP2, Opamp, ADC3
SCB4, IDAC5, BLE6, UDB7
CY8C4246-M Q416
48-MHz M0, 64K/8K1
CMP2, Opamp, ADC3
SCB4, IDAC5, UDB7
Grades: A10 and S11
CY8C4246-L
48-MHz M0, 64K/8K1
CMP2, Opamp, ADC3
USB
Flash
CY8C4128-BL
24-MHz M0, 256K/32K1
CMP2, Opamp, ADC3
SCB4, IDAC5, BLE6
Q316
CY8C4045-S
48-MHz M0+, 32K/4K1
NDA Contact Sales
Q316
CY8C4024-S
24-MHz M0+, 16K/2K1
NDA Contact Sales
CY8C4127-M Q416
24-MHz M0, 128K/16K1
CMP2, Opamp, ADC3
SCB4, IDAC5
Grades: A10 and S11
CY8C4127-BL
24-MHz M0, 128K/16K1
CMP2, Opamp, ADC3
SCB4, IDAC5, BLE6
CY8C4126-M Q416
24-MHz M0, 64K/8K1
CMP2, Opamp, ADC3
SCB4, IDAC5
Grades: A10 and S11
CY8C4146-S
48-MHz M0+, 64K/8K1
NDA Contact Sales
CY8C4125
24-MHz M0, 32K/4K1
CMP2, Opamp, ADC3
SCB4, IDAC5
Grades: A10 and S11
CY8C4125-S
24-MHz M0+, 32K/4K1
NDA Contact Sales
CY8C4124
24-MHz M0, 16K/4K1
CMP2, Opamp, ADC3
SCB4, IDAC5
Grades: A10 and S11
CY8C4124-S
24-MHz M0+, 16K/2K1
NDA Contact Sales
CY8C4244
48-MHz M0, 16K/4K1
CMP2, Opamp, ADC3
SCB4, IDAC5, UDB7
Grades: A10 and S11
7 Universal
10
Q316
Q316
Q316
L = L-Series
CY8C4245
48-MHz M0, 32K/4K1
CMP2, Opamp, ADC3
SCB4, IDAC5, UDB7
Grades: A10 and S11
CY8C4014
16-MHz M0, 16K/2K1
CMP2, I2C, IDAC5
Grades: A10 and S11
1 Flash
KB/SRAM KB
2 Comparator
3 Analog-to-digital converter
4 Serial
communication block
5 Current-output DAC
digital block
9 Programmable I/Os
AEC-Q100: -40C to +85C

11 AEC-Q100: -40C to +105C
Industrial
Automotive
Availability
QQYY
QQYY
196
PSoC Software1
Software
Current Version
PSoC Creator2
PSoC Designer
3.3 CP3
PSoC 1
PSoC 4
Production
PSoC Programmer4
EZ-Click
5.4 SP1
3.24.4
2.0 SP1
Production
Production
Production
Download the latest PSoC software version here
1 All
software and tool releases are backward compatible. The latest versions are recommended for new designs
Creator is an Integrated Design Environment (IDE) that allows concurrent hardware and firmware design of PSoC 3 and PSoC 4 systems
3 PSoC Designer is an IDE that enables firmware design using a library of precharacterized peripherals for PSoC 1 systems
4 PSoC Programmer can be used with PSoC Designer and PSoC Creator to program and debug any design onto a PSoC device
5 EZ-Click is a Windows GUI-based tool that enables development of CapSense MBR solutions. It allows you to set up sensor configuration, apply global system properties, monitor real-time
sensor output, and run production-line system diagnostics
2 PSoC
197

Block Diagram


MCU Subsystem
Programmable Analog
Blocks
Opamp
x1

One 12-bit, 806-Ksps SAR2 ADC
Four configurable 16-bit timer, counter or pulse-width modulator
(TCPWM) blocks
Packages
28-pin SSOP
Collateral
Datasheet:
24 MHz
Flash
(16KB to 32KB)
SRAM
(4KB)
CMP
x2
GPIO x6
SAR2
ADC
CSD
Blocks
TCPWM x4
SCB x2
Segment LCD Drive
GPIO x4
GPIO x6
GPIO x4
Serial Wire Debug

GPIO x4
Availability
1 Programmable
2 Successive
Cortex-M0
Features
I/O Subsystem
Applications
gain amplifier
3 Industrial:
Sampling:
Production:
Now
Now
-40C to +85C
198


Block Diagram
MCU Subsystem
Programmable Analog
Blocks
Opamp
x1

Packages
28-pin SSOP
Collateral
Datasheet:
Cortex-M0
48 MHz
Flash
(16KB to 32KB)
SRAM
(4KB)
Serial Wire Debug
Features
CMP
x2
I/O Subsystem
GPIO x6
SAR2
ADC
CSD
Blocks
UDB x4
TCPWM3 x4
SCB x2
Segment LCD Drive
Applications
GPIO x4
GPIO x6
GPIO x4
GPIO x4
Availability
Sampling:
Production:
Now
Now
1 Programmable
gain amplifier
3 Timer, counter, pulse-width modulator
2 Successive
199
Automotive PSoC Packages

Package
LQFP
Pins
Body Size
Family
Pitch
PSoC 1
2XX45
QFN
SOIC
24
40
56
16
20
28
48
64
7 x 7 mm
4 x 4 mm
6 x 6 mm
8 x 8 mm
150 Mil
210 Mil
5 x 10 mm
300 Mil
10 x 10 mm
0.5 mm
0.5 mm
0.75 mm
0.5 mm
1.27 mm
0.65 mm
0.65 mm
0.635 mm
0.5 mm
21X34
24X23
29X66
4000
41/42XX
TQFP
48
24894
PSoC 4
SSOP
200
Automotive Instrument Traveo Cluster MCUs
201
Feature Overview
Traveo Instrument Cluster MCU Family
QPRC1
I/O Timer2
Source Clock
Timer
External NMI/
External IRQ5
IRQ
DMA6
Standard I/O
Relocation
Watchdog
CSV7
Oscillators
PLLs
SSCG PLL8
Power Mgmt.
Temp. Sensor9
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU13
TPU14
Reload Timer
Boot ROM
RTC3
OCD (JTAG)
Trace10
Cortex R5F
FPU, Safety, Security
Sound
LVD11
CRC12
eSHE
Wave Gen x5
Mixer
SMC + ZPD4
TCON15
3D Engine
Base Timer
VRAM
12-bit ADC
Command
Sequence
Video In
Dithering
Gamma16
Vector
Drawing
2D Engine
Signature
Unit
Video Out/
LCD Bus
HyperBus
3-Pin MLB17
4-bit x2
DDR HSSPI18
APIX AIC19
Multifunctional
Serial
CAN FD
Ethernet AVB20
PCM/PWM21
Audio-DAC
I2S22
4COM x 32SEG
LCDC
EBI23
15
16
Quad position and revolution counter

Input/output timer
3 Real-time clock
4 Stepper motor control + zero point detection
5 Nonmaskable interrupt/interrupt request
7 Clock supervisor
Spread-spectrum clock generator/phase-locked loop

Power management, temperature sensor
10 On-chip debug (Joint Test Action Group)
11 Low-voltage detection
12 Cyclic redundancy check
13 Peripheral protection units
14 Timing protection unit
Timing controller
Dithering and gamma correction
17 Media local bus
18 Double data rate high-speed serial peripheral
interface
19 Automotive pixel link/automatic interconnect
20 Audio/video bridging
21
Pulse-code modulation/pulse-width
modulation
22 Inter-IC sound bus
23 External bus interface
202
S6J3120 Series
Traveo Instrument Cluster MCU Family: Virgo
Applications
Block Diagram1
Instrument clusters
2-ch QPRC
Features
32-bit MCU Core Systems
112-MHz ARM Cortex-R5, up to 1MB Flash and
80KB RAM with backup RAM
Supply Voltage
5.0 V
Interfaces
3-ch CAN FD, DDR HSSPI, 10-ch multifunctional serial
Cluster Features
4COM x 32SEG LCDC and 3-ch sound generator
Package
144-pin TEQFP
4-ch Source
Clock Timer
External NMI/
16 External IRQ
IRQ
16-ch DMA
Standard I/O
Relocation
Watchdog
CSV
Oscillators
PLLs
SSCG PLL
Power
Management
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU
TPU
12-ch I/O Timer

10-ch Reload
Timer
Boot ROM
RTC
Cortex R5
Safety, Security
OCD (JTAG)
Trace
Sound
LVD
CRC
4-ch SMC ZPD
Datasheet:
S6J3120 Series
Hardware Manual: S6J3120 Series
1
TCON
3D Engine
30-ch Base
Timer
VRAM
50-ch 12-bit
ADC
Command
Sequencer
Video In
Dithering
Gamma
2D Engine
Vector
Drawing
Signature Unit
Video Out
HyperBus
3-Pin MLB
1-ch 4-bit x2
DDR HSSPI
APIX AIC
10-ch Multifunctional
Serial
3-ch CAN FD
Ethernet AVB
PCM/PWM
Audio-DAC
I2S
EBI
Collateral
eSHE
Wave Gen
Mixer
4COM x 32SEG
LCDC
Availability
Sampling: Now
Production: Q3 2016
Blue boxes highlighted in the block diagram indicate features available on the device shown. Gray boxes indicate omitted features.
203
S6J3200 Series
Traveo Instrument Cluster MCU Family: Amethyst (1MB)/Amber (2MB)
Applications
Block Diagram7
Instrument clusters, head-up displays (HUDs), HVACs

2-ch QPRC
Features
Up to 240-MHz ARM Cortex-R5F, 2MB Flash,
256KB RAM with backup RAM and 2MB VRAM
Supply Voltages
1.2 V, 3.3 V or 5.0 V
Interfaces
4-ch CAN FD, 2-ch DDR HSSPI, 3-ch HyperBus1,
12-ch multifunctional serial, MLB2, Ethernet AVB3
Cluster Features
3D OpenGL ES1.1 on-the-fly (optional), 2D engine,
2-ch (maximum)/1-ch (maximum) video-out/-in,
audio-DAC, PCM/PWM4 and I2S5
Packages
208-pin TEQFP, 216-pin TEQFP and 256-pin TEQFP6
Collateral
External NMI/
32 External IRQ
IRQ
16-ch DMA
Standard I/O
Relocation
Watchdog
CSV
Oscillators
PLLs
SSCG PLL
Power
Management
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU
TPU
24-ch I/O Timer

10-ch
Reload Timer
Boot ROM
RTC
OCD (JTAG)
Trace
Cortex
R5F
Sound
LVD
CRC
eSHE
Wave Gen x5
Mixer
6-ch
SMC ZPD
TCON
3D Engine
24-ch
Base Timer
VRAM
50-ch
12-bit ADC
Command
Sequencer
Dithering
Gamma
2D Engine
Vector
Drawing
Signature
Unit
1-ch Video In
2-ch
RGB/LVDS
Video Out
3-ch (maximum)
HyperBus
1-ch 3-Pin MLB
2-ch 4-bit x2
DDR HSSPI
APIX AIC
Serial
4-ch CAN FD
1-ch Ethernet AVB
1-ch PCM/PWM
Audio-DAC
2-ch I2S
4COM x 32SEG
LCDC
EBI
Datasheet:
S6J3200 Series
Cypresss high-bandwidth, 12-signal interface that transfers data over 8 I/O
signals at double data rate (DDR), delivering 333 MBps
2 Media local bus
4 Pulse-code modulation/pulse-width modulation
6 Contact Sales for 256-pin TEQFP availability
7 Blue boxes highlighted in the block diagram indicate features available on the
device shown. Gray boxes indicate omitted features.
4-ch Source
ClocK Timer
Availability
Amethyst
Amber
Sampling:
Production:
Sampling:
Production:
Now
Q3 2016
Now
Q3 2016
204
S6J3300 Series
Traveo Instrument Cluster MCU Family: Juno (4MB)/Artemis (2MB)
Applications
Block Diagram8
Instrument clusters, vehicle controllers

2-ch QPRC
Features
4-ch Source
Clock Timer
External NMI/
24 External IRQ
IRQ
16-ch DMA
Standard I/O
Relocation
Watchdog
CSV
Oscillators
PLLs
SSCG PLL
Power
Management
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU
TPU
12-ch I/O Timer

240-MHz ARM Cortex-R5F, up to 4MB Flash and
Supply Voltages
1.15V, 3.3V or 5.0V
Interfaces
6-ch CAN FD, DDR HSSPI, HyperBus1, MLB2,
12-ch multifunctional serial, EBI3, APIX AIC4 and
Ethernet AVB4
Cluster Features
Simple video out and LCD-bus interface audio-DAC,
PCM/PWM6 and I2S7
Packages
144-pin TEQFP, 176-pin TEQFP, 208-pin TEQFP
6-ch Reload
Timer
Boot ROM
RTC
OCD (JTAG)
Trace
Sound
LVD
CRC
eSHE
Wave Gen x5
Mixer
6-ch SMC ZPD
TCON
3D Engine
32-ch Base
Timer
VRAM
32+16-ch
12-bit ADC
Command
Sequencer
1-ch Video In
Dithering
Gamma
2D Engine
Vector
Drawing
Signature
Unit
LCD Bus
Video-Out
1-ch HyperBus
1-ch 3-Pin MLB
1-ch 4-bit x2
DDR HSSPI
APIX AIC
Serial
6-ch CAN FD
1-ch Ethernet AVB
1-ch PCM/PWM
Audio-DAC
2-ch I2S
Collateral
Datasheet:
S6J331x Series
2 Media local bus
4 Automotive pixel link/automatic interconnect
6 Pulse-code modulation/pulse-width modulation
8 Blue boxes highlighted in the block diagram indicate features available on the
device shown. Gray boxes indicate omitted features.
Cortex R5F
4COM x 32SEG
LCDC
EBI2
Availability
Juno
Artemis
Sampling:
Production:
Sampling:
Production:
Now
Q1 2017
July 2016
Q1 2017
205
Automotive Traveo Body

Control MCUs
206
Feature Overview
Traveo Body Control MCU Family
QPRC1
I/O Timer2
Source Clock
Timer
External NMI/
External IRQ4
Partial
Wakeup
DMA5
Standard I/O
Relocation
Watchdog
CSV6
Oscillators
PLLs
SSCG PLL7
Power
Management
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU11
TPU12
Reload Timer
Boot ROM
RTC3
OCD (JTAG)
Trace8
LVD9
Cortex R5F
CRC10
eSHE
4-bit x2 DDR
HSSPI13
HyperBus
Base Timer
CAN FD
Ethernet AVB14
12-bit ADC
EBI15
FlexRay
11
12
Quad position and revolution counter

Input/output timer
3 Real time clock
4 Nonmaskable interrupt/Interrupt request
Clock supervisor
Spread-spectrum clock generator/phase-locked loop
8 On-ship debug (Joint Test Action Group)
9 Low-voltage detection
10 Cyclic redundancy check
13
14
15
Multifunctional
Serial
Peripheral protection units

Timing protection unit
Double data rate high-speed serial peripheral interface
Audio/video bridging
External bus interface
207
S6J3110 Series
Traveo Body Control MCU Family: Leo (4MB)/Aries (1MB)
Applications
Block Diagram2
Body control modules (BCM), HVACs, gateways, lighting,

infotainment
Features
32-bit MCU Core System
144-MHz/96-MHz ARM Cortex-R5, up to 4MB Flash
and 384KB RAM with backup RAM
Supply Voltage
5.0 V
Interfaces
Up to 2-ch CAN FD and 22-ch multifunctional serial
AD Converter
Up to 64 ch
Timers
Up to 12-ch I/O timer1 and 30-ch base timer
Packages
144-pin TEQFP and 176-pin TEQFP
Collateral
Datasheets:
S6J3118 to S6J311A Series (Aries)

S6J311B to S6J311E Series (Leo)
Hardware Manuals: Contact Sales
1
2
3-ch Source
Clock Timer
External NMI/
16 External IRQ
Partial
Wakeup
DMA
Standard I/O
Relocation
12-ch I/O Timer
Watchdog
CSV
Oscillators
PLLs
SSCG PLL
Power
Management
Flash
Reload Timer
GPIO
D-Cache
Work-Flash
RTC
OCD (JTAG)
Trace
I-Cache
RAM
PPU
TPU
QPRC
LVD
Cortex R5
Safety, Security
CRC
eSHE
HyperBus
DDR HSSPI
30-ch Base
Timer
2-ch 192-msg
CAN FD
Ethernet AVB
32-ch x2
12-bit ADC
EBI
FlexRay
Serial
Availability
Leo
Aries
Sampling:
Production:
Sampling:
Production:
Now
August 2016
Now
Q3 2016
Input/output timer
Blue boxes highlighted in block diagram indicate features available on the device shown. Gray boxes indicate omitted features
208
S6J3350 Series
Traveo Body Control MCU Family: Neptune
Applications
Block Diagram5
Body control modules (BCM), gateways

2-ch QPRC
4-ch Source
Clock Timer
External NMI/
24 External IRQ
Partial
Wakeup
DMA
Standard I/O
Relocation
Watchdog
CSV
Oscillators
PLLs
SSCG PLL
Power
Management
Flash
D-Cache
Work-Flash
I-Cache
RAM
PPU
TPU
Features
240-MHz ARM Cortex-R5F, up to 4MB Flash and
Supply Voltages
1.15 V, 3.3 V, or 5.0 V
Interfaces
Up to 8-ch CAN FD, up to 12-ch multifunctional serial,
Ethernet AVB1, HyperBus2, 2-ch DDR HSSPI, EBI3
AD Converter
Up to 64 ch (2 units)
Timers
Up to 12-ch I/O timer4 and 64-ch base timer
Packages
144-pin TEQFP, 176-pin TEQFP and 208-pin TEQFP
12-ch I/O Timer
6-ch Reload
Timer
GPIO
1-ch RTC
OCD (JTAG)
Trace
LVD
Cortex R5F
CRC
eSHE
1-ch
HyperBus
1-ch 4-bit x2
DDR HSSPI
64-ch Base
Timer
8-ch 192-msg
CAN FD
1-ch
Ethernet AVB
32-ch x2
12-bit ADC
EBI
FlexRay
12-ch
Multifunctional Serial
Collateral
Datasheet:
S6J3350 Series
1
Audio/video bridging
4 Input/output timer
5 Blue boxes highlighted in block diagram indicate features available on the
device shown. Gray boxes indicate omitted features
Availability
Sampling:
Production:
Now
Q1 2017
209
Automotive Traveo MPN Selector Guides
210

S6J3110 Series (Leo/Aries), S6J3120 Series (Virgo)
Part Number
S6J311
S6J311
S6J312
Flash
1.5/2/3/4MB
512/768KB, 1MB
512/768KB, 1MB
RAM
128/192/256/320KB
48/64/80KB
48/64/80KB
SHE1
On/Off
On/Off
On/Off
Chip Erase
Controllable
Controllable
Controllable
Package
TEQFP-144/176
TEQFP-144
TEQFP-144
S6J310 Part Numbering Decoder

S6J 3 1 X X X X X X XX X XXX
Reserved
Packing:
0 = Tray
Packages: E2 = TEFP 0.5-mm Pitch
Reliability:
S = GS Grade, E = ES Grade
Revision:
Option:
A = SHE On + Chip Erase (Controllable)2

B = SHE Off + Chip Erase (Controllable)
Pins:
H = 144, J = 176
Flash Size: 8 = 512KB, 9 = 768KB, A = 1MB

C = 2MB, D = 3MB, E = 4MB
Function:
1 = Body, 2 = Cluster
Product ID: 1 = S6J310 Series

Core:
3 = R5
ID:
S6J = Cypress Automotive MCU
1 Secure
2
hardware extension
Chip erase can be constantly disabled via the chip erase enable register
211

S6J335 Series (Neptune)
Part Number
S6J335
Flash
1.5/2/3/4MB
RAM
192/256/384/512KB
ETH1
Yes
SHE2
On/Off
Chip Erase
Enabled/Controllable
VCC / DVCC
5/5 V, 3/5 V, 3/3 V
Package
TEQFP-144/176/208

S6J 3 3 5 X X X X X XX X XXX
Reserved
Packing:
0 = Tray
Packages:
C2 = TEQFP 0.4-mm Pitch, E2 = TEQFP 0.5-mm Pitch
Reliability:
Revision:
Option:
S = SHE On + Chip Erase (Enabled)

T = SHE On + Chip Erase (Controllable)3
U = SHE Off + Chip Erase (Enabled)
V = SHE Off + Chip Erase (Controllable)
S/U/T/V = VCC/DVCC: 5/5 V, A/C/E/G = VCC/DVCC: 3/5 V
B/D/F/H = VCC/DVCC: 3/3 V
Pins:
H = 144, J = 176, K = 208
Flash Size: B = 1.5MB, C = 2MB, D = 3MB, E = 4MB

Function:
5 = ETH
1 Ethernet
2
audio/video bridging
Secure hardware extension
Core:
3 = R5
ID:
Chip erase can be constantly disabled via the chip erase

enable register
212

S6J331 Series (Juno/Artemis)
Part Number
S6J331
S6J332
S6J333
S6J334
Flash
1.5/2/3/4MB
1.5/2/3/4MB
1.5/2/3/4MB
1.5/2/3/4MB
RAM
512KB
512KB
512KB
512KB
2D
Yes
Yes
Yes
Yes
ETH1
Yes
Yes
Yes
No
MLB2
Yes
Yes
Yes
No
SS3
Yes
Yes
No
No
APIX4
Yes
No
No
No
SHE5
On/Off
On/Off
On/Off
On/Off
Chip Erase
VCC / DVCC
5/5 V, 3/5 V, 3/3 V
5/5 V, 3/5 V, 3/3 V
5/5 V, 3/5 V, 3/3 V
5/5 V, 3/5 V, 3/3 V
Package
TEQFP-144/176/208
TEQFP-144/176/208
TEQFP-144/176/208
TEQFP-144/176/208

Reserved
Packing:
0 = Tray
Packages:
Reliability:
Revision:
Option:
S/A/B = SHE On + Chip Erase (Enabled)

T/E/F = SHE On + Chip Erase (Controllable)6
U/C/D = SHE Off + Chip Erase (Enabled)
V/G/H = SHE Off + Chip Erase (Controllable)
S/U/T/V = VCC/DVCC: 5/5 V, A/C/E/G = VCC/DVCC: 3/5 V
B/D/F/H = VCC/DVCC: 3/3 V
Pins:
H = 144, J = 176, K = 208
Flash Size: B = 1.5MB, C = 2MB, D = 3MB, E = 4MB

Function:
1 = 2D + ETH + MLB + SS + APIX + MK_CEER

2 = 2D + ETH + MLB + SS, 3 = 2D + ETH +MLB, 4 = 2D
1 Ethernet
audio/video bridging
2 Media local bus
3 Sound system
4 Automotive
pixel link
5 Secure hardware extension
Core:
3 = R5
ID:
6 Chip
erase can be constantly

disabled via the chip erase
enable register
213

S6J320 Series (Amber/Amethyst)
Part Number
S6J323
S6J324
S6J325
S6J326
S6J327
S6J328
S6J32A
S6J32B
S6J32C
S6J32D
Flash
2MB
2MB
2MB
2MB
2MB
2MB
1MB
1MB
1MB
1MB
RAM
256KB
256KB
256KB
256KB
256KB
256KB
128KB
128KB
128KB
128KB
VRAM
2MB
2MB
2MB
2MB
2MB
2MB
1MB
1MB
1MB
1MB
2D
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
3D
No
No
Yes
Yes
No
Yes
No
No
Yes
Yes
SS1
No
Yes
No
Yes
Yes
Yes
No
Yes
No
Yes
LVDS2
No
No
No
Yes
No
Yes
No
No
No
No
2HB3
No
No
No
No
Yes
Yes
No
No
No
No
SHE4
On/Off
On/Off
On/Off
On/Off
On/Off
On/Off
On/Off
On/Off
On/Off
On/Off
Package
TEQFP-208/216/2565
TEQFP-208/216/2565
TEQFP-208/216/2565
TEQFP-208/216/2565
TEQFP-208/216/2565
TEQFP-208/216/2565
TEQFP-208/216
TEQFP-208/216
TEQFP-208/216
TEQFP-208/216

Reserved
Packing:
0 = Tray
Packages:
Reliability:
Revision:
Option:
S = SHE On, U = SHE Off
Pins:
K = 208, L = 216, M = 256
Flash Size: A = 1MB, C = 2MB

Function:
3 = 2D, 4 = 2D + SS, 5 = 2D + 3D, 6 = 2D + 3D + SS + LVDS,

7 = 2D + SS + 2HB, 8 = 2D + 3D + SS + LVDS + 2HB, A = 2D,
B = 2D + SS, B = 2D + SS, C = 2D, D = 2D + 3D + SS
1 Sound
4 Secure
system
Low-voltage differential
signaling interface
Second HyperBus interface

hardware extension
Core:
3 = R5
ID:
Contact Sales for 256-pin

TEQFP availability
214
Automotive Asynchronous SRAM
215
Asynchronous SRAM
Low-Power SRAM (MoBL1)
Fast SRAM
ECC3
32Mb-128Mb
Non-ECC
CY7C107x
32Mb; 3.3 V
12 ns; x8, x16
2Mb-16Mb
Serial SRAM (with ECC3)
Non-ECC
ECC3
ECC3
Quad-SPI4
HyperBus5
CY6218x
64Mb; 1.8, 3.0 V
55 ns; x16
Other densities
NDA Contact Sales
Other densities
NDA Contact Sales
Other densities
NDA Contact Sales
Other densities
NDA Contact Sales
CY6217x
32Mb; 1.8-5.0 V
55 ns; x16
CY7C106x
16Mb; 1.8, 3.3 V
10 ns; x8, x16, x32
64Kb-1Mb
PowerSnooze2
CY7C106x
16Mb; 1.8-5.0 V
10 ns; x8, x16, x32
Grades: E6
CY6216x
16Mb;1.8, 3.0, 5.0 V
45 ns; x8, x16
Grades: A7
CY6216x
16Mb; 1.8-5.0 V
45 ns; x8, x16, x32
Grades: A6 and E5
CY7C105x
8Mb; 3.3 V
10 ns; x8, x16
CY7C1012
12Mb; 3.3 V
10 ns; x24
CY7C105x
8Mb; 1.8-5.0 V
10 ns; x8, x16, x32
Grade: E5
CY6215x
8Mb; 1.8, 3.0, 2.5-5V
45 ns; x8, x16
Grades: A7 and E6
CY6215x
8Mb; 1.8-5.0 V
45 ns; x8, x16, x32
Grade: A6 and E5
CY7C104x
4Mb; 3.3, 5.0 V
10 ns; x4, x8, x16
Grades: A7 and E6
CY7C1034
6Mb; 3.3 V
10 ns; x24
CY7C104x
4Mb; 1.8-5.0 V
10 ns; x8, x16
Grades: E6
CY6214x
4Mb; 1.8, 3.0, 2.5-5V
45 ns; x8, x16
Grades: A7 and E6
CY6214x
4Mb; 1.8-5.0 V
45 ns; x8, x16
Grades: A7 and E6
CY7C1010/11
2Mb; 3.3 V
10 ns; x8, x16
Grades: A7 and E6
CY7C1024
3Mb; 3.3 V
10 ns; x24
CY6213x
2Mb; 1.8, 2.5-5.0 V
45 ns; x8, x16
Grades: A7 and E6
CY7L02Mx
2Mb; 1.8, 3.3 V
40 MHz, 133 MHz
Grades: E6
CY7C1020
512Kb; 2.6, 3.3, 5.0 V
10 ns; x16
Grades: E6
CY7C1019/21
1Mb; 2.6, 3.3, 5.0 V
10 ns; x4, x8, x16
Grades: A7 and E6
CY6212x
1Mb; 2.5-5.0 V
45 ns; x8, x16
Grades: A7 and E6
CY7L01Mx
1Mb; 1.8, 3.3 V
40 MHz, 133 MHz
Grades: E6
CY7C185
64Kb; 5.0 V
15 ns; x8
CY7C199
256Kb; 3.3, 5.0 V
10 ns; x4, x8
Grades: A7 and E6
CY6264/62256
64-256Kb; 1.8, 3.0, 5V
55 ns, 70 ns; x8
Grades: A7 and E6
CY7L064/256x
64, 256Kb; 1.8, 3.3 V
40 MHz, 133 MHz
Grades: E6
More Battery Life

SRAM with low-power sleep mode
3 Error-correcting code
1
2 Fast
6 AEC-Q100: -40C to +125C

Serial peripheral interface
7 AEC-Q100: -40C to +85C
A high-bandwidth,12-signal interface that transfers
information over 8 I/O signals at Double Data Rate (DDR),
delivering up to 400 MBps

Industrial
Automotive
Availability
QQYY
QQYY
216
Fast SRAM with ECC

Applications
Family Table
Infotainment systems
Driver assistance
Driver information
Powertrain
Telematics
Density
MPN
Access Time
2Mb
4Mb
8Mb
16Mb
CY7C101x
CY7C104x
CY7C105x
CY7C106x
10 ns
10 ns
10 ns
10 ns
Supply Current
(Max. at 85C)
45 mA
45 mA
110 mA
110 mA
Block Diagram
Features
Access time: 10 ns
Multiple bus-width configurations: x8, x16, x32
Available in automotive temperature (A1 and E2) grades
Packages: 48-pin VFBGA, 48-pin TSOP1
Fast SRAM with ECC

SRAM Array
18-23
Address
ECC
Encoder
Input
Buffer
8, 16, 32
Data
I/O Mux
Address
Decoder
Sense
Amps
SRAM Array
ECC
Decoder
Collateral
Datasheets:
16Mb CY7C106x
8Mb CY7C105x
4Mb CY7C104x
2Mb CY7C101x
Control Logic
CE
-40C to +85C
2 AEC-Q100:
WE
BHE3
BLE4
Availability
Sampling:
Production:
1 AEC-Q100:
OE
-40C to +125C
3 Byte
high enable
Now
Now
4 Byte
low enable
217
MoBL
SRAM with ECC
Applications
Family Table
Telematics
Density
MPN
4Mb
8Mb
16Mb
32Mb
64Mb
CY6214x
CY6215x
CY6216x
CY6217x
CY6218x
Standby Current
(Max. at 85C)
8 A
9 A
16 A
58 A
58 A
Standby Current
(Typ. at 25C)
2.5 A
3.0 A
4.6 A
9.0 A
9.0 A
Block Diagram
Features
Access time: 45 ns for 16Mb
Standby current: 16 A for 16Mb
Multiple bus-width configurations: x8, x16 and x32
Available in automotive temperature (A2 and E3) grades
Packages: 48-pin VFBGA, 48-pin TSOP1
MoBL1 SRAM with ECC

SRAM Array
18-23
Address
Address
Decoder
ECC
Encoder
Input
Buffer
8, 16, 32
Data
I/O Mux
SRAM Array
Sense
Amps
ECC
Decoder
Collateral
Datasheets:
Control Logic
16Mb CY6216x
4Mb CY6214x
CE
OE
WE
BHE4
BLE5
Availability
Sampling:
Production:
1 More
Battery Life
2 AEC-Q100:
-40C to +85C
3 AEC-Q100:
-40C to +125C
4 Byte
high enable
Now (4Mb, 16Mb), Q3 2016 (8Mb)

Now (4Mb, 16Mb), Q3 2016 (8Mb)
5 Byte
low enable
218
Automotive Synchronous SRAM
219
Automotive Portfolio: Synchronous SRAM

High Random Transaction Rate (RTR)1 | Low Latency | High Bandwidth
Standard Sync
and NoBL
Standard Sync and

NoBL with ECC2
QDR -II/
DDR-II
QDR-II+/
DDR-II+
QDR-II+X/
DDR-II+X
QDR-IV
Max RTR1: 250 MT/s

Max BW: 18 Gbps
Latency: 1 Cycle
Pipeline and
Flow-through Modes
Max RTR1: 250 MT/s

Max BW: 18 Gbps
Latency: 1 Cycle
Pipeline and
Flow-through Modes
Max RTR1: 666 MT/s

Max BW: 47.9 Gbps
Latency: 1.5 Cycles
CIO3 and SIO4
Max RTR1: 666 MT/s

Max BW: 79.2 Gbps
Latency: 2 or
2.5 Cycles
CIO3and SIO4, ODT5
Max RTR1: 900 MT/s

Max BW: 91.1 Gbps
Latency: 2.5 Cycles
SIO4, ODT5
Max RTR1: 2.1 GT/s

Max BW: 153.5 Gbps
Latency: 5 or 8 Cycles
Dual-Port Bidirectional
ODT5
CY7C161/2xKV18
144Mb; 250-333 MHz
1.8 V; x9, x18, x36
Burst 2, 4
CY7Cx4/5/6/7xKV18
144Mb; 300-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C151/2xKV18
72Mb; 250-333 MHz
1.8 V; x9, x18, x36
Burst 2, 4
CY7Cx54/5/6/7KV18
72Mb; 250-550 MHz
1.8 V; x18, x36
RH6; Burst 2, 4
CY7C156/7xXV18
72Mb; 366-633 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C126/7x
36Mb; 366-633 MHz
1.8 V; x18, x36
Burst 2, 4
Density
CY7C147/8xB
72Mb; 133-250 MHz
2.5, 3.3 V; x18, x36
CY7C144/6xA
36Mb; 133-250 MHz
2.5, 3.3 V; x36, x72
CY7C144/6xK
36Mb; 133-250 MHz
2.5, 3.3 V; x18, x36
CY7C141/2xKV18
36Mb; 250-333 MHz
1.8 V; x8, x9, x18, x36
Burst 2, 4
CY7Cx24/5/6/7xKV18
36Mb; 400-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C137/8xD
18Mb; 100-250 MHz
3.3 V; x18, x32, x36
CY7C137/8xK
18Mb; 100-250 MHz
2.5, 3.3 V; x18, x36
CY7C131/2/9xKV18
18Mb; 250-333 MHz
1.8 V; x8, x18, x36
Burst 2, 4
CY7Cx14/5/6/7xKV18
18Mb; 400-550 MHz
1.8 V; x18, x36
Burst 2, 4
CY7C136xC
9Mb; 100 MHz
3.3 V; x18, x36
Grade: E7
CY7C41xKV13
144Mb; 667-1066 MHz
1.3 V; x18, x36
Burst 2
CY7C40xKV13
72Mb; 667-1066 MHz
1.3 V; x18, x36
Burst 2
CY7C1911xKV18
18Mb; 250-333 MHz
1.8 V; x9
Burst 2, 4
CY7C134xxG
4Mb; 100 MHz
3.3 V; x36
Grade: E7
Random Transaction Rate

1 Rate
of truly random accesses to

memory, expressed in transactions
per second (MT/s, GT/s)
2 Error-correcting
3 Common
4 Separate
I/O
I/O
code
5 On-die
termination; parts are CY7C2x

6 Radiation hardened, military grade
7 AEC-Q100: -40C to +125C

Industrial
Automotive
Availability
QQYY
QQYY
220
Automotive Nonvolatile RAM
221
Automotive Portfolio: nvSRAM

High Density | High Speed
1 nvSRAM
SPI
nvSRAM
LPC
nvSRAM
ParallelParallel
nvSRAM
CY14B116R/S
16Mb; 3.0 V
25, 45 ns; x32; RTC2
Ind3
CY14B116K/L
16Mb; 3.0 V
25, 45 ns; x8; RTC2
Ind3
CY14V116F/G
16Mb; 3.0, 1.8 V I/O
30 ns; ONFI4 1.0
x8, x16; Ind3
Higher Densities
nvSRAM
NDA Contact Sales
CY14B104NA
4Mb; 3.0 V
25, 45 ns; x16; RTC2
Grade: E5
CY14B108K/L
8Mb; 3.0 V
25, 45 ns; x8; RTC2
Ind3
CY14B108M/N
8Mb; 3.0 V
25, 45 ns; x16; RTC2
Ind3
CY14B116M/N
16Mb; 3.0 V
25, 45 ns; x16; RTC2
Ind3
CY14B104K/LA
4Mb; 3.0 V
25, 45 ns; x8; RTC2
Ind3
CY14V104LA
4Mb; 3.0, 1.8 V I/O
25, 45 ns; x8
Ind3
CY14B104M/NA
4Mb; 3.0 V
25, 45 ns; x16; RTC2
Ind3
CY14V104NA
4Mb; 3.0, 1.8 V I/O
25, 45 ns; x16
Ind3
CY14V101PS
1Mb; 3.0, 1.8 V,
108 MHz QSPI7; RTC2
Ind3, Ext. Ind8
CY14V101QS
1Mb; 3.0, 1.8 V,
108 MHz QSPI7
Ind3, Ext. Ind8
CY14B101I
1Mb; 3.0 V
3.4 MHz I2C; RTC2
Ind3
CY14B101KA/LA
1Mb; 3.0 V
25, 45 ns; x8; RTC2
Ind3
CY14V101LA
1Mb; 3.0, 1.8 V I/O
25, 45 ns; x8
Ind3
CY14B101MA/NA
1Mb; 3.0 V
25, 45 ns; x16; RTC2
Ind3
CY14V101NA
1Mb; 3.0, 1.8 V I/O
25, 45 ns; x16
Ind3
CY14B101PA
1Mb; 3.0 V
40 MHz SPI; RTC2
Ind3
CY14B512P
512Kb; 3.0 V
40 MHz SPI; RTC2
Ind3
CY14B512I
512Kb; 3.0 V
3.4 MHz I2C; RTC2
Ind3
CY14B256KA/LA
256Kb; 3.0 V
25, 45 ns; x8; RTC2
Ind3
CY14V/U256LA
256Kb; 3.0, 1.8V I/O
35 ns; x8
Ind3
CY14E256LA
256Kb; 5.0 V
25, 45 ns; x8
Ind3
STK14C88-5
256Kb; 5.0 V
35, 45 ns; x8
Mil6
CY14B256P
256Kb; 3.0 V
40 MHz SPI; RTC2
Ind3
CY14B256I
256Kb; 3.0 V
3.4 MHz I2C; RTC2
Ind3
STK11C68-5
64Kb; 5.0 V
35, 55 ns; x8
Mil6
STK12C68-5
64Kb; 5.0 V
35, 55 ns; x8
Mil6
CY14B064P
64Kb; 3.0 V
40 MHz SPI; RTC2
Ind3
CY14B064I
64Kb; 3.0 V
3.4 MHz I2C; RTC2
Ind3
64Kb-256Kb
512Kb-16Mb
NEW
Higher Densities
nvSRAM
NDA Contact Sales

1 Low-pin-count
2 Real-time
3 Industrial
clock
grade: -40C to +85C
4 Open
NAND flash interface

5 AEC-Q100: -40C to +125C
6 Military grade: -55C to +125C
Quad serial peripheral interface

8 Extended Industrial grade: -40C to +105C
Industrial
Automotive
Availability
QQYY
QQYY
222
Automotive nvSRAM Package

Package
Balls
Body Size
BGA
48
6 x 10 mm
Family
Pitch
0.75 mm
Parallel
4Mb
223
Automotive Portfolio: F-RAM

Low Power | High Endurance
Processor
Companion
4Kb-256Kb
512Kb-4Mb
LPC1 F-RAM
Wireless
Memory
Parallel F-RAM
FM25H20/V20A
2Mb; H20: 2.7-3.6 V
V20A: 2.0-3.6 V
40 MHz SPI; Ind2
CY15B104Q
4Mb; 2.0-3.6 V
40 MHz SPI; Ind2
Higher Densities
F-RAM
NDA Contact Sales
FM22L16/LD16
4Mb; 2.7-3.6 V
55 ns; x8; Ind2
CY15B102Q
2Mb; 2.0-3.6 V
25 MHz SPI
Grade: E3
FM25V10/VN10
1Mb; 2.0-3.6 V
40 MHz SPI;
Grade: Ind2, A4
FM24V10/VN10
1Mb; 2.0-3.6 V
3.4 MHz I2C;
Grade: Ind2, A4
FM28V102A
1Mb; 2.0-3.6 V
60 ns; x16; Ind2
FM28V202A
2Mb; 2.0-3.6 V
60 ns; x16; Ind2
FM25V05
512Kb; 2.0-3.6 V
40 MHz SPI;
Grade: Ind2, A4
FM24V05
512Kb; 2.0-3.6 V
3.4 MHz I2C;
Grade: Ind2, A4
CY15B101N
1Mb; 2.0-3.6 V
60 ns; x16
Grade: A4
CY15B102N
2Mb; 2.0-3.6 V
60 ns; x16
Grade: A4
FM25V02/W256
256Kb; V02: 2.0-3.6 V
W256: 2.7-5.5 V
40 MHz SPI; Ind2, A4
FM24V02/W256
256Kb; V02: 2.0-3.6 V
W256: 2.7-5.5 V
3.4 MHz I2C; Ind2, A4
FM33256
256Kb; 3.3V; 16 MHz SPI
RTC5; Power Fail
Watchdog; Counter; Ind2
FM28V020
256Kb; 2.0-3.6 V
70 ns; x8; Ind2
FM18W08
256Kb; 2.7-5.5 V
70 ns; x8; Ind2
FM25V01A
128Kb; 2.0-3.6 V
40 MHz SPI;
Grade: Ind2, A4
FM24V01A
128Kb; 2.0-3.6 V
3.4 MHz I2C;
Grade: Ind2, A4
FM31256/31(L)278
256Kb; 3.3, 5.0V; 1 MHz
I2C; RTC5; Power Fail
FM1808B
256Kb; 5.0 V
70 ns; x8; Ind2
FM16W08
64Kb; 2.7-5.5 V
70 ns; x8; Ind2
FM25640/CL64
64Kb; 3.3, 5.0 V
20 MHz SPI;
Grade: Ind2, E3
FM24C64/CL64
64Kb; 3.3, 5.0 V
1 MHz I2C;
Grade: Ind2, E3
FM3164/31(L)276
64Kb; 3.3, 5.0 V; 1 MHz
I2C; RTC5; Power Fail
FM25C160/L16
16Kb; 3.3, 5.0 V
20 MHz SPI;
Grade: Ind2, E3
FM24C16/CL16
16Kb; 3.3, 5.0 V
1 MHz I2C;
Grade: Ind2, A4
FM25040/L04
4Kb; 3.3, 5.0 V
20 MHz SPI;
Grade: Ind2, E3
FM24C04/CL04
4Kb; 3.3, 5.0 V
1 MHz I2C;
Grade: Ind2, A4
Wireless Memory
NDA Contact Sales

1
Low-pin-count
2 Industrial grade -40C to +85C
3 AEC-Q100: -40C to +125C
4 AEC-Q100:
-40C to +85C
5 Real-time clock
Industrial
Automotive
Availability
QQYY
QQYY
224
Automotive F-RAM Packages

Package
SOIC
DFN
EIAJ
TSOP I
TSOP II
32
44
Family
Pins
LPC
4Kb
16Kb
64Kb
128Kb
256Kb
512Kb
1Mb
2Mb
4Kb
16Kb
64Kb
128Kb
256Kb
512Kb
1Mb
1Mb
2Mb
I2C
Parallel
225
Automotive Flash Memory
226
Automotive Portfolio: Parallel NOR

S29AS-J
110 nm, 1.8 V
S29AL-J
110 nm, 3.0 V
S29JL-J1
110 nm, 3.0 V
S29PL-J1,2
110 nm, 3.0 V
S29GL-N2
110 nm, 3.0 V
Density (Name)
256Mb

Longevity Program
unless noted
32Mb
64-128Mb
Parallel NOR
(NDA)
16Mb
70 ns / -Grade: A3
16Mb
55 ns / -Grades: A3 and M4
8Mb
70 ns / -Grade: A3
8Mb
55 ns / -Grades: A3 and M4
128Mb
60 ns / 20 ns
Grade: A3
2Gb5
110 ns / 20 ns
Grades: A3 and B6
Q416
2Gb5
110 ns / 20 ns
Contact Sales
1Gb
100 ns / 15 ns
Grades: A3 and B6
1Gb
100 ns / 15 ns
Grades: A3, B6 and M4
512Mb
100 ns / 15 ns
Grades: A3 and B6
512Mb
100 ns / 15 ns
128Mb
90 ns / 15 ns
Grades: A3 and B6
64Mb
55 ns / -Grade: A3
64Mb
55 ns / 20 ns
Grade: A3
64Mb
90 ns / 25 ns
Grade: A3
32Mb
60 ns / -Grade: A3
32Mb
55 ns / 20 ns
Grade: A3
32Mb
90 ns / 25 ns
Grade: A3
64Mb
70 ns / 15 ns
S29GL-T2
45 nm, 3.0 V
256Mb
90 ns / 15 ns
Grades: A3 and B6
1 Supports
simultaneous read/write operation

Supports Page mode
3 AEC-Q100: -40C to +85C
4 AEC-Q100: -40C to +125C
6 AEC-Q100: -40C to +105C
S29GL-S2
65 nm, 3.0 V
Industrial
Automotive
Availability
EOL(Last-Time-Ship)
QQYY
QQYY
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227
NOR Flash Memory Family Decoder

S 29 G L 128 S
Technology:
J = 110 nm Floating Gate

K = 90 nm Floating Gate
L = 65 nm Floating Gate
N = 110 nm MirrorBit
P = 90 nm MirrorBit
S = 65 nm MirrorBit
T = 45 nm MirrorBit
Density:
001 = 1Mb
002 = 2Mb
004 = 4Mb
008 = 8Mb
016 = 16Mb
032 = 32Mb
064 = 64Mb
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
02G = 2Gb
Voltage:
D = 2.5V
L = 3.0V
S = 1.8V
Family:
A = Standard ADP (Address-Data Parallel)

C = Burst Mode ADP (Address-Data Parallel)
F = Serial
G = Page Mode
J = Simultaneous Read/Write ADP (Address-Data Parallel)
K = HyperBus
P = Page Mode Simultaneous Read/Write ADP (Address-Data Parallel)
Series:
25 = SPI
29 = NOR
Prefix:
26 = HyperFlash
70 = Stacked Die
1 = 63 nm DRAM
04G = 4Gb
0CG = 64Gb
08G = 8Gb
0AG = 16Gb
0BG = 32Gb
27 = HyperRAM
79 = Dual Quad SPI
228
64-128Mb
256Mb
Automotive Portfolio: HyperFlash,

HyperRAM, & Burst Parallel NOR
HyperFlash
S26KS-S1
65 nm 1.8 V
HyperFlash
S26KL-S1
65 nm 3.0 V
HyperRAM
S27KS-12
63 nm 1.8 V
HyperRAM
S27KL-12
63 nm 3.0 V
Density
Temp Range

Longevity Program
unless noted
1Gb3
96 ns / 166 MHz
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1Gb3
96 ns / 100 MHz
Contact Sales
512Mb
96 ns / 166 MHz
512Mb
96 ns / 100 MHz
256Mb
96 ns / 166 MHz
256Mb
96 ns / 100 MHz
256Mb3
36 ns / 166 MHz
Contact Sales
256Mb3
36 ns / 100 MHz
Contact Sales
128Mb
96 ns / 166 MHz
128Mb
96 ns / 100 MHz
128Mb3
36 ns / 166 MHz
Contact Sales
128Mb3
36 ns / 100 MHz
Contact Sales
32Mb
64Mb
36 ns / 166 MHz
Grades A5 and B6
Q416
64Mb
36 ns / 100 MHz
Grades A5 and B6
S29CD-J3
110 nm, 2.5 V
S29CL-J3
110 nm, 3.0 V
32Mb
54 ns / 75 MHz
Grades: A5, M7 and T8
32Mb
54 ns / 75 MHz
16Mb
54 ns / 66 MHz
16Mb
54 ns / 66 MHz
Q416
Concept Development
1 S26
= HyperFlash
2 S27 = HyperRAM
5 AEC-Q100:
-40C to +85C
6 AEC-Q100: -40C to +105C
7 AEC-Q100: -40C to +125C
8 AEC-Q100: -40C to +145C
Industrial
Automotive
Availability
Sampling
Production
QQYY
QQYY
QQYY
229
Automotive Portfolio: SPI NOR

S25FL1-K
90 nm, 3.0V
4KB1
S25FL-L
65 nm, 3.0 V
4KB1
S25FL-P
90 nm, 3.0 V
>4KB1
S25FL-S
65 nm, 3.0 V
>4KB1
Density (Name)
SDR / DDR Clock
Temp Range
256Mb

Longevity Program
unless noted
64-128Mb
Q316
256Mb
133 MHz / 66 MHz
64Mb
108 MHz / -Grades: A4 and B5
32Mb
S79FL-S2
65 nm, 3.0 V
>4KB1
S25FS-S
65 nm, 1.8 V
>4KB1
1Gb3
133 MHz / 80 MHz
Grades: A4 and B5
Q316
1Gb
133 MHz / 80 MHz
Grades: A4 and B5
Q316
1Gb3
133 MHz / 80 MHz
512Mb
133 MHz / 80 MHz
Grades: A4 , B5 and M6
Q316
512Mb
133 MHz / 80 MHz
Grades: A4 and B5
Q316
512Mb
133 MHz / 80 MHz
256Mb
133 MHz / 80 MHz
Grades: A4 , B5 and M6
Q316
256Mb
133 MHz / 80 MHz
Grades: A4 and B5
128Mb7
128Mb8
133 MHz / 80 MHz
128Mb
133 MHz / 66 MHz
128Mb9
128Mb10
108 MHz
Grades: A4 and B5
64Mb
108 MHz / -Grades: A4, B5 and M6
64Mb
32Mb
Roadmap
256Mb
133 MHz / 80 MHz
Grades: A4 and B5
128Mb
133 MHz / 80 MHz
Grades: A4 and B5
Q316
64Mb
133 MHz / 100 MHz
32Mb
16Mb
Logical sector size

S79 series, Dual Quad SPI (stacked die)
4 AEC-Q100: -40C to +85C
5 AEC-Q100: -40C to +105C
6 AEC-Q100: -40C to +125C
2
S25FL129P
S25FL128S
9 S25FL128P
10 S25FL127S
8
Quad SPI
133-MHz SDR / 80-MHz DDR
Dual SPI
108-MHz SDR
Concept Development
Industrial
Automotive
Availability
EOL(Last-Time-Ship)
Sampling
Production
QQYY
QQYY
QQYY
230
NAND and e.MMC Family Decoders

NAND
S 34 M L 08G 2
Technology: 1 = 4x nm
2 = 32 nm
Density:
01G = 1Gb
02G = 2Gb
04G = 4Gb
08G = 8Gb
Voltage:
L = 3.0 V
S = 1.8 V
Family:
M = NAND (Address-Data Multiplexed)
Series:
34 = NAND
Prefix:
Controller:
B1 = e.MMC 4.51
B2 = e.MMC 5.1
Revision:
1 = NAND MLC1 1x nm
2 = NAND MLC1 1y nm
Density:
004 = 4GB
008 = 8GB
064 = 064GB
128 = 128GB
0AG = 16Gb
0BG = 32Gb
e.MMC
S 40 41 016 1 B1
Controller Architecture:
1 Multi-level
016 = 16GB
032 = 32GB
41 = e.MMC
Series:
40 = Managed Memory
Prefix:
cell
231
Automotive Portfolio: SLC NAND &

e.MMC
S34ML-11
4x nm, 3.0 V
SLC, ONFI 1.04
S34MS-11
4x nm, 1.8 V
SLC, ONFI 1.04
S34ML-22
32 nm, 3.0 V
SLC, ONFI 1.04
S34MS-22
32 nm, 1.8 V
SLC, ONFI 1.04
S4041-1B1
1x nm, 3.0 V
MLC, e.MMC 4.515
S34SL-22, 3
32 nm, 3.0 V
SLC, ONFI 1.04
S4041-2B2
1y nm, 3.0 V
MLC, e.MMC 5.15
16Gb; x8
40 MBps
8Gb; x8 Q417
40 MBps
Grades: A6 and B7
1G-4Gb
32GB-64GB

Longevity Program
unless noted
4Gb; x8/16 Q418

40 MBps
Grades: A6 and B7
4Gb; x8
40 MBps
Grade: B7
2Gb; x8/16 Q418

40 MBps
Grades: A6 and B7
2Gb; x8
40 MBps
Grade: B7
1Gb; x8 Q418
40 MBps
Grades: A6 and B7
1Gb; x8
40 MBps
Grade: B7
Q418
Q418
Q418
8Gb; x8
40 MBps
Grades: A6 and B7
8Gb; x8
40 MBps
4Gb; x8
40 MBps
Grades: A6 and B7
4Gb; x8/16
40 MBps
4Gb; x8
40 MBps
2Gb; x8/16
40 MBps
Grades: A6 and B7
2Gb; x8/16
40 MBps
2Gb; x8
40 MBps
1Gb; x8/16
40 MBps
Grades: A6 and B7
1Gb; x8/16
40 MBps
Grade: A
1Gb; x8
40 MBps
64GB; x8
400 MBps
Grade: A6
32GB; x8
400 MBps
Grade: A6
Q117
16GB; x8
400 MBps
Grade: A6
Q117
8GB; x8
400 MBps
Grade: A6
16GB; x8
200 MBps
8GB-16GB
8Gb-16Gb
Density; Bus Width

Interface Bandwidth
8GB; x8
200 MBps
1-bit ECC
4-bit ECC
3 Secure NAND
4 ONFI = Open NAND Flash Interface
5 e.MMC = Embedded Multi Media Card
6 AEC-Q100: -40C to +85C
7 AEC-Q100: -40C to +105C
2

Industrial
Automotive
Availability
EOL(Last-Time-Ship)
QQYY
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232
Parallel NOR Flash Memory Packages

Package
Balls/Pins
FBGA
BGA
TSOP
Fortified BGA
48
48
56
64
64
0.8 mm
0.5 mm
0.8 mm
0.8 mm
1.0 mm
48
56
Family
Density
Pitch
AS-J
8Mb
S29AS008J
16Mb
S29AS016J
8Mb
S29AL008J
16Mb
S29AL016J
32Mb
S29JL032J
64Mb
S29JL064J
32Mb
S29PL032J
64Mb
S29PL064J
128Mb
S29PL127J
32Mb
S29GL032N
64Mb
S29GL064N
64Mb
S29GL064S
128Mb
S29GL128S
256Mb
S29GL256S
512Mb
S29GL512S
1Gb
S29GL01GS
2Gb
S70GL02GS
512Mb
S29GL512T
1Gb
S29GL01GT
2Gb
S70GL02GT
AL-J
JL-J
PL-J
GL-N
GL-S
GL-T
233
HyperFlash, HyperRAM, & Burst

Parallel NOR Packages
Package
BGA
FBGA
PQFP
80
80
Family
Density
Balls/Pins
25
KS-S
128Mb
256Mb
512Mb
1Gb
128Mb
256Mb
512Mb
1Gb
64Mb
128Mb
256Mb
64Mb
128Mb
256Mb
16Mb
32Mb
16Mb
32Mb
S26KS128S
S26KS256S
S26KS512S
S70KS01GS
S26KL128S
S26KL256S
S26KL512S
S70KL01GS
S26KS0641
S26KS1281
S70KS2561
S26KL0641
S26KL1281
S70KL2561
S29CD016J
S29CD032J
S29CL016J
S29CL032J
KL-S
KS-1
KL-1
CD-J
CL-J
1 Known
KGD1
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Good Die
234
SPI NOR Flash Memory Packages

Package
Balls/Pins
Family
Density Body Size
FL1-K
16Mb
32Mb
64Mb
64Mb
S25FL116K
S25FL132K
S25FL164K
S25FL064L
128Mb
256Mb
S25FL128L
S25FL256L
32Mb
64Mb
S25FL032P
S25FL064P
128Mb
128Mb
128Mb
128Mb
256Mb
512Mb
1Gb
256Mb
S25FL128P
S25FL129P
S25FL127S
S25FL128S
S25FL256S
S25FL512S
S70FL01GS
S79FL256S
512Mb
S79FL512S
1Gb
64Mb
128Mb
S79FL01GS
S25FS064S
S25FS128S
256Mb
512Mb
1Gb
S25FS256S
S25FS512S
S70FS01GS
FL-L
FL-P
FL-S
FL-S
Dual
Quad
FS-S
SOIC
USON
16
150 Mil
208 Mil
300 Mil
UD
UD
4 x 3 mm
WSON
4 x 4 mm
Contact Sales Contact Sales

UD
UD
UD
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25
24
8 x 6 mm
8 x 6 mm
UD
UD
UD
UD
Contact Sales
6 x 5 mm 8 x 6 mm
UD
UD
UD
UD
Contact Sales
UD
LGA (UD)
Contact
Sales
KGD1
BGA
Contact Sales
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Contact Sales
UD
1 Known
2 UD
Good Die
= Under Development
235
SLC NAND and e.MMC Packages

Package
BGA
BGA
LBGA
TSOP
153
100
48
Family
Density
Balls/Pins
63
ML-1
1Gb
2Gb
4Gb
8Gb
1Gb
2Gb
4Gb
8Gb
16Gb
1Gb
2Gb
4Gb
1Gb
2Gb
4Gb
8Gb
8GB
16GB
8GB
16GB
32GB
64GB
S34ML01G1
S34ML02G1
S34ML04G1
S34ML08G1
S34ML01G2
S34ML02G2
S34ML04G2
S34ML08G2
S34ML16G2
S34MS01G1
S34MS02G1
S34MS04G1
S34MS01G2
S34MS02G2
S34MS04G2
S34MS08G2
S40410081B1
S40410161B1
S40410082B2
S40410162B2
S40410322B2
S40410642B2
ML-2
MS-1
MS-2
41-1B1
41-2B2
236
Automotive USB
237
Automotive Portfolio: USB

Device
USB 1.1
USB 2.0
USB 3.0
FX3: CYUSB301x
ARM9, 512KB RAM
FX3PD
Peripheral Controller with PD
NDA Contact Sales
Hub
HX3: CYUSB33xx
4 Ports, Shared Link1
BC 1.22, Ghost Charge3
Grade A4
HX3C
Hub with PD
NDA Contact Sales
HX3PD
Hub with PD
NDA Contact Sales
FX2LP: CY7C6801x/53
8051, 16KB RAM
HX2VL: CY7C656x4
4 Ports
4 Transaction Translators
TX2UL: CY7C68003
ULPI10 PHY
13, 19.2, 24, 26 MHz
HX2LP: CY7C656x1
4 Ports
Bridge
Host
Storage
Type-C
CX3: CYUSB306x
CSI-25 to USB 3.0
4 CSI-25 Lanes, 1 Gbps/Lane
FX3S: CYUSB303x
RAID6, Dual SDXC7/eMMC8
Grade A4
DX3
USB 3.0 to DSI9 TX
NDA Contact Sales
SD3: CYUSB302x
SDXC7/eMMC8 to USB 3.0
RAID6
CCG1: CYPD1xxx
2 PD Ports, 5 Profiles, 100 W
Grade A4
CCG2: CYPD2xxx
USB Type-C Cable Controller
1 PD Port, Termination, ESD
Grade A4
CCG3: CYPD3xxx
Grade A4
GX3: CYUSB361x
USB 3.0 to Gigabit Ethernet
Bay: CYWB016xBB
HS USB OTG
Dual SDXC7/eMMC8
GX2
USB 2.0 to 10/100 Ethernet
Contact Sales
CYUSB201x
FX2G2
ARM9 512KB RAM
USB-Serial: CY7C6521x
UART/SPI/I2C to USB
2 Channels, CapSense
SL811HS
FS USB Host/Device
256Byte RAM
enCoRe III: CY7C64215

I2C/SPI, 16KB Flash
USB-to-UART (Gen 2):

CY7C65213
3 Mbps, 8 GPIOs
EZ-Host: CY7C67300
4 Ports, FS USB OTG
32 GPIOs
Grade: A4
enCoRe V: CY7C643xx
I2C/SPI, 32KB Flash
USB-to-UART (Gen 1):

CY7C64225
230 Kbps
EZ-OTG: CY7C67200
2 Ports, FS USB OTG
25 GPIOs
USB 2.0 and USB 3.0

traffic on the same port
2 Battery Charging specification v1.2
3 Enables USB charging without host connection
CCG4
NDA Contact Sales
NX2LP: CY7C6803x
NAND Flash to USB 2.0
8051, 15KB RAM
CCG5
USB Type-C AFE
NDA Contact Sales
AT2LP: CY7C683xx
Parallel ATA to USB 2.0
8051
enCoRe II: CY7C638xx

M8C MCU, 20 GPIOs
SPI, 8KB Flash
1 Simultaneous
Arroyo, Astoria:
CYWB022xABS
8051, Dual SD/eMMC7
AEC-Q100: 40C to +85C

Serial Interface v2.0
6 Redundant array of independent disks
7 SD extended capacity
4
5 Camera
Embedded MultiMedia Card

Display Serial Interface
10 UTMI low-pin interface
Type-C product
applies to any
USB speed

Industrial
Automotive
Availability
QQYY
QQYY
238
Automotive HX3: USB 3.1 Gen 1 Hub

Applications
Block Diagram
Upstream Port
Automotive infotainment
EEPROM
2
4
HX3 Hub
SS3 PHY
USB 2.0 PHY
MCU
USB 3.1 Gen 1 PHY
I2C
32
16
32
Features
USB 3.1 Gen 1-compliant four-port Hub Controller
USB-IF certified (Test ID: 330000047)
WHQL certified for Windows 7, Window 8, Windows 8.1
Shared Link: Supports simultaneous USB 2.0 and
USB SuperSpeed (SS) Devices on the same port
Ghost Charge: Enables USB charging while the Hub is
disconnected from a USB Host
Charging Standard support:
USB-IF Battery Charging v1.2
Apple Charging Standard
Charging an OTG Host in an ACA-Dock
Programming of external EEPROM via USB
Configurable USB SS & USB 2.0 PHY. Drives 11 trace
100-BGA (6 x 6 x 1.0 mm)
SuperSpeed Hub
Controller
Buffers
Transaction translator
4x TT1
Repeater
16
32
Routing Logic
Routing Logic
32
16
USB 3.1 Gen 1 PHY

SS3 PHY
USB 3.1 Gen 1 PHY
USB 2.0 PHY SS3 PHY
USB 3.1 Gen 1 PHY
USB 2.0 PHY SS3 PHY
Downstream Port 2
USB 3.1 Gen 1 PHY
USB 2.0 PHY SS3 PHY
Downstream Port 3
USB 2.0 PHY
Downstream Port 4
Availability
Datasheet:
Application Note:
Kits:
Configuration Utility:
1
16
32
Downstream Port 1
Collateral
USB 2.0 Hub Controller
HX3 Datasheet
HX3 Hardware Design Guide
CY4609, CY4603, CY4613
Blaster Plus2
2
Sampling:
Production:
Q4 2016
Q4 2016
A Cypress GUI-based PC application for setting HX3 configuration parameters
SuperSpeed
239
Automotive CCG2:
Applications
Block Diagram
USB Type-C EMCA, powered accessories, UFP, DFP, DRP
CCG2: USB Type-C Port Controller With PD

MCU Subsystem
Features
CC7
Collateral
Flash
(32KB)
SRAM
(4KB)
VCONN1
SCB1
SPI, UART)
VCONN2
SCB1
(I2C, SPI, UART)
48 MHz
CORTEX-M0
(I2C,
Profiles and
Configurations
Baseband MAC
Baseband PHY
VDDIO
GPIO5
Port
Integrated RP2, RD3,

RA4
Serial Wire Debug
Availability
CCG2 Datasheet
CCG2 RDK
communication block configurable as UART, SPI or I2C

Termination resistor read as a DFP
Production: Industrial (Now)
1 Serial
4 Termination
I/O Subsystem
TCPWM6

48-MHz ARM Cortex -M0 CPU with 32KB flash and 4KB SRAM
Integrated timers, counters and pulse-width modulators
Two SCBs1 configurable to I2C, SPI or UART modes
Type-C Support
Integrated DFP (RP2), UFP (RD3), EMCA (RA4) termination resistors
Power Delivery (PD) Support
Standard power profiles
Low-Power Operation
Two independent VCONN rails with integrated isolation
Independent supply voltage pin for GPIO5
2.7-V to 5.5-V operation
Sleep: 2.0 mA; Deep Sleep: 2.5 A
System-Level ESD on CC6 and VDD Pins
Package
24-pin 4mm x 4mm QFN with 0.55-mm pin pitch
Datasheet:
Termination resistor read as a UFP

resistor read as an EMCA
5 General-purpose
6
input/output
Timer, counter, pulse-width modulation block
7 Configuration
Channel
240
Automotive CCG3: USB Type-C and PD Port

Controller
Applications
Block Diagram
Accessories and power adapters
CCG3: USB Type-C Cable Controller
Collateral
Datasheet:
Cortex-M0
48 MHz
Flash
(64KB)
Flash
(64KB)
4x TCPWM9
4x SCB4
(I2C, SPI, UART)
Crypto Engine
I/O Subsystem
Programmable
I/O Matrix
Type-C Support
Alternate Modes1, Crypto Engine2 for USB Authentication3
Power Delivery (PD) Support for Standard Power Profiles
Integrated Digital Blocks for VBUS Power and MUX Interface
Four timers, counters and pulse-width modulators, 24x GPIOs
Four SCBs4 for configurable master/slave I2C, SPI or UART
USB Billboard Controller5 with Billboard Device Class6 support
Integrated Analog Blocks for OVP, OCP7
20-V OVP7 and OCP8; 4:2 cross-bar switch
32-bit ARM Cortex-M0 CPU with MCU Subsystem
2x64KB flash for fail-safe updates over CC, I2C or USB interfaces
Low-Power Operation
2x VBUS Gate Drivers8, for consumer and provider power paths
2x high-voltage (5-20 V, 25 V Max) VBUS voltage inputs
Sleep: 2.0 mA; deep sleep: 2.5 A with wake-on-I2C or wake-on-CC
System-Level ESD on CC/VCONN, VBUS, and SBU Pins
Package
40-pin QFN
MCU Subsystem
Features
CC
24x GPIO
Ports
USB PD Subsystem
Baseband MAC
Baseband PHY
20-V Regulator
2x VCONN FETs
Overcurrent
Protection
2x 20V VBUS FET

Gate Drivers8
System Resources
Overvoltage
Protection
Integrated Resistors
(RP, RD, RA)10
Full-Speed USB
Billboard Controller
4:2 Analog
Cross-Bar Switch
8-bit SAR ADC
SRAM
(8KB)
Availability
CCG3 Datasheet
Production: Industrial (Now)
Mode of operation in which the data lines are repurposed to transmit non-USB data
The encryption hardware and software required to implement USB Authentication
3 A USB-IF specification that defines the authentication protocol for Type-C accessories
4 Serial communication block configurable as UART, SPI or I 2C
5 A USB Device controller that informs the USB Host of the supported Alternate Modes
A specification that defines the method for a USB Device to communicate the supported Alternate Modes
Overvoltage protection, overcurrent protection
8 Circuits to control the gates of external power Field-Effect Transistors (FETs) on V
BUS (5-20 V)
9 Timer/counter/pulse-width modulator block
10 Termination resistors: R read as a DFP, R as a UFP, R as an EMCA
P
D
P
241
Automotive USB Packages

Package
Pins
Body Size
Functionality
Family
Pitch
Hub
HX3
CYUSB33XX
Host
EZ-Host
CY7C67300
Storage
FX3S
CYUSB303X
Type-C
CCG2
CYPD2XX
Type-C
CCG3
CYPD3XX
TQFP
BGA
QFN
100
100
121
24
40
14 x 14 mm
6 x 6 mm
10 x 10 mm
4 x 4 mm
6 x 6 mm
0.5 mm
0.5 mm
0.8 mm
0.5 mm
0.5 mm
242
Automotive Timing Solutions
243
Automotive Portfolio: Timing Solutions

Clock Generators
EMI Reduction
Q416
CY274x
7 Outputs; PCIe 3.0; 4 PLL
Standard
Performance
High
Performance
NEW
CY276x
4-8 Outputs; PCIe 3.0, 10GbE; 2 PLL
Clock Buffers
Non-EMI Reduction
PLL ICs
Zero/Non-Zero Delay Buffer
CY294x/ CY5107
1 Output; 40/100 GbE; 1 PLL
MB15F63UL
Max. Input Frequency: 2 GHz
Sigma-Delta and Integer PLL;
-88.5 dBc/Hz CNR4; Ind2;
CY2DLx/DMx/DPx/CPx
2-10 Outputs; LVDS, LVPECL, CML
CY314X/CY344X
12 Outputs; 1-4 PLL; Hitless Switching5
CY2Xx (FleXO)
1 Output; Frequency Margining
CY254x/CY251x
100-ps CCJ4; Ind2
CY2239x/CY229x/CY2238x
400-ps CCJ6; Ind2; Auto E7
MB15E07SL/05SL/03SL
Max. Input Frequency: 2.5GHz
1 PLL; < 4mA PSC8 ; Ind2;
CY230x/EP0x
5-9 Outputs; LVCMOS
CY22800/801/2429x
2-4 Outputs; 1 PLL; PCIe 1.1
250-ps CCJ6; Ind2, Auto A3
CY22050/150
3-6 Outputs; 1 PLL
250-ps CCJ6; Ind2
MB15E07SR/06SR/05SR
Max. Input Frequency: 3GHz
1 PLL; -86 dBc/Hz CNR4 ; Ind2
CY230xNZ
4-18 Outputs; LVCMOS
250-ps CCJ6; Ind2
MB88151Ax/2Ax/3Ax/4Ax
1 Output; 1 PLL;
MB15F78UL/73UL/72UL
2 PLL; < 2.8 mA PSC8; Ind2;
CY23S02/05/08/09/FP12
2-12 Outputs; Spread Aware
200-ps CCJ6; Ind2
MB88155x
1 Output; 1 PLL;
MB15F07SL
2 PLL; < 5 mA PSC8; Ind2;
CY7B99x (RoboClock)
8-18 Outputs; Configurable Skew
50-ps CCJ6; Ind2
2 Industrial
6 Cycle-to-cycle
Integrated phase noise across 12-kHz to 20-MHz offset

grade: -40C to +85C
3 AEC-Q100: -40C to +85C
4 Carrier-to-noise ratio
Automatic clock switching on failure of a clock source

jitter
7 AEC-Q100: -40C to +125C
8 Power supply current

Industrial
Automotive
Availability
QQYY
QQYY
244
High Performance 4-PLL Clock Generator

(CY274x)
Applications
Block Diagram
High-Performance 4-PLL Clock Generator
PLL 1 Block
Divider
Out1
Divider
PLL
Out2
Divider
Divider
Features
Out3P
XIN1
High frequency: 700-MHz differential, 250-MHz single-ended

Pin select and I2C programming
Seven outputs:
Three configurable as differential or single-ended
Four single-ended
Reference clock support for PCIe 3.0, SATA 2.0 and 10 GbE
RMS phase jitter <0.7 ps
Additional features:
Configurable as zero or non-zero delay buffer
Glitch-free frequency switching
Frequency select
Early/late clocks
PLL cascading
Voltage-controlled frequency synthesis
XOUT2
IN1P3
Input
Block
Out4P
PLL 2 Block
Out4N
IN1N3
Out5P
SCLK4
SDAT4
VIN5
FS16
Memory
and
Control
Logic
PLL 3 Block
Out5N
Output
Bank 2
Out6P
FS06
Out6N
PLL 4 Block
Out7
Collateral
Output
Bank 1
Availability
Contact Sales
Contact Sales
1
4 Serial
5 Voltage
Crystal input
Crystal output
3 Reference clock inputs
port
input pin for VCFS
6 Frequency select inputs
245
Automotive Timing Solutions Packages

SOIC
TSSOP
QFN
16
48
Body Size
150 Mil
4.4 x 5.0 mm
7 x 7 mm
Functionality
Pitch
0.05 in
0.65 mm
0.5 mm
Clock Buffer
CY2305
Clock Generators
CY22393
CY24293
Package
Pins
CY274X
246
Automotive PMIC
247
Automotive PMIC1 Family Portfolio

ADAS2
High-End
Instrument Cluster
Mid-Range
NEW
NEW
CYxxx1
Boost+Buck Cnv3
12 V Vbat4, 4 A Output
20-pin TSSOP
NEW
Low-End
Body Control Module
S6BP203A
1xBuck-boost Cnv3, PG6
12 V Vbat4, 3.3 V/2.4 A Output
16-pin TSSOP
CYxxx2
Multi-SMPS5
12 V Vbat4
High Output Current
NEW
Q316
S6BP502A
3xSMPS5
SSCG7, PG6
12 V Vbat4, 2.0 A Output
32-pin Side-Wettable8 QFN
NEW
S6BP201A
12 V Vbat4, 5 V/1 A Output
16-pin TSSOP
CYxxx3
Multi-SMPS5 and LDO
3.0-5.5 V input
NEW
NEW
S6BP401A
4xSMPS5, 2xLDO
WDT9, PG6
5 V Input, 3.0 A Output
40-pin QFN
S6BP203A
12 V Vbat4, 3.3 V/2.4 A Output
16-pin TSSOP
S6BP202A
12 V Vbat4, 5 V/2.4 A Output
16-pin TSSOP
Q316
S6BP502A
3xSMPS5
SSCG7, PG6
NEW
NEW
S6BP201A
16-pin TSSOP
Q316
S6BP501A
3xSMPS5
SSCG7, PG6
NEW
S6BP202A
16-pin TSSOP
NEW
CYxxx1
Boost+Buck Cnv3
12 V Vbat4, 4 A Output
20-pin TSSOP
S6BP202A
16-pin TSSOP
NEW
Q316
S6BP501A
3xSMPS5
SSCG7, PG6
NEW
NEW
S6BP401A
4xSMPS5, 2xLDO
WDT9, PG6
5 V Input, 3.0 A Output
40-pin QFN
S6BP201A
16-pin TSSOP
NEW
S6BP201A
16-pin TSSOP
Market Segment
1 Power
Management IC: An IC that converts extremely fluctuating automobile power to safe,

stable power for ECUs
2 Advanced Driver Assistance Systems
3 Converter: A general-purpose regulator IC that integrates power MOSFETs
4 Battery voltage
5 Switch-Mode Power Supply: A general-purpose regulator IC that uses a switching circuit to
up-convert and/or down-convert a voltage source to a different voltage for powering other ICs
Power Good: An output signal that PMICs provide to signify that the supplied power by PMICs is
proper and ready
7 Spread Spectrum Clock Generator
8 A package whose flanks are processed to improve soldering adherence and to simplify the
optical inspection, which follows soldering
9 Watchdog timer
Industrial
Automotive
Availability
QQYY
QQYY
248
One-Channel Automotive PMIC1

Automotive PMIC1 Family | S6BP20x
Applications
Family Table
General-purpose automotive: Instrument cluster, body control,

ADAS2
Output Voltage
5.0-5.2 V
Features
1-Channel PMIC: Synchronous buck-boost converter
Wide Input Voltage Range: 2.5-42 V
Low Quiescent Current: 20 A
Programmable Switching Frequency: 0.2-2.1 MHz
Synchronization with external clock from 200 kHz to 400 kHz
Autonomous PFM/PWM3 switching
BOM Integration: Built-in switching transistors
System Safety Function Support:
Undervoltage protection (UVP), overvoltage protection (OVP)
Undervoltage locked-out (UVLO), thermal shutdown (TSD)
Overcurrent protection (OCP)
Voltage supervisor with independent PG4 pins
Operating Temperature Range: -40C to +125C
Package: 16-pin Thermally Enhanced TSSOP
Qualification: AEC-Q1005 Grade-1
1.0 A
S6BP202A
3.3 V
2.4 A
S6BP203A
UVP/OVP Threshold
6
4.5%
4.5%, 8.0%
8.0%
Block Diagram
Battery
2.5-42 V
Enable
5.0 V
S6BP20xA
5.0-V LDO,
Enable
Buck-Boost
DC/DC
Converter
2.1 MHz
PFM/PWM3 Switch
External Clock for
Synchronization
5.0 V or 3.3 V
Oscillator,
External
Sync
Frequency
Setting
S6BP201A S6BP202A S6BP203A

S6BP201A S6BP202A S6BP203A
Management IC: An IC that converts extremely fluctuating automobile power to safe,

stable power for ECUs
2 Advanced Driver Assistance Systems
3 PFM: Pulse-Frequency modulation, PWM: Pulse-Width modulation
4 Power Good: An output signal that PMICs provide to signify that the supplied power by
PMICs is proper and ready
S6BP201A
2.4 A
Protection
Function
1 Power
MPN
5.0-5.2 V
Collateral
Datasheet:
Evaluation Kit:
Software:
Max. Output Current
Power Good4
Function
Power Good4
GND
Availability
Samples: Now
Production: Now
5A
quality standard defined by the Automotive Electronics Council used to verify the reliability of
ICs and qualify them for automotive applications
6 S6BP201A and S6BP202A have factory-selectable options of output voltage, power-on-reset
time, UVP/OVP threshold, and SYNC Function
249
Three-Channel Instrument Cluster Automotive

PMIC1
Automotive PMIC1 Family | S6BP50x
Applications
Family Table
Low-end to mid-range hybrid automotive cluster system
Buck Converter
Output Specification
Features
3-Channels:
Buck controller, boost converter, buck converter
Wide Range Input: 2.5-42 V
Low Quiescent Current: 15 A
High Switching Frequency:
Boost converter and buck converter: 2.1 MHz
Built-in SSCG2
Synchronization with external clock from 1.8 to 2.4 MHz
Undervoltage protection (UVP), overvoltage protection (OVP)
Undervoltage lock-out (UVLO), thermal shutdown (TSD)
Overcurrent protection (OCP)
Temperature supervisor with thermal warning feature
Package: 32-pin Thermally Enhanced Side-Wettable4 QFN
MPN
Buck Controller
Boost Converter
1.15 V6, 1.4 A
S6BP501A
3.3 V6, 1.6 A
5.0 V6, 1.3 A
1.2 V6, 2.0 A
S6BP502A
3.3 V6, 1.9 A
5.0 V6, 1.3 A
Block Diagram
2.5-42 V
S6BP50x
Battery
Power
Sources
Enable SSCG2
External Clock for

Synchronization
Enable
GND
An IC that converts extremely fluctuating automobile power to safe, stable power for ECUs
Spread Spectrum Clock Generator
3 Power Good: An output signal that PMICs provide to signify that the supplied power by PMICs
is proper and ready
4 A package whose flanks are processed to improve soldering adherence and to simplify the
optical inspection, which follows soldering
2
5.0 V6
Boost
Converter
2.1 MHz
Collateral
Preliminary Datasheet: S6BP501A S6BP502A
Evaluation Kit:
User Guide
Buck
Controller
0.42 MHz
3.3 V6
SSCG2,
External
Sync
Enable,
LDO
Protection
Function
Bypass Switch
Buck
Converter
2.1 MHz
Power Good3
and Thermal
Warning
1.2 V6 or 1.15 V6
Thermal
Warning
Power
Good3
Availability
Samples: Now
Production: August 2016
A quality standard defined by the Automotive Electronics Council used to verify the reliability of
ICs and qualify them for automotive applications
6 Output voltages are finely adjustable with external resistive dividers
250
Six-Channel ADAS Automotive PMIC1

Automotive PMIC1 Family | S6BP401A
Applications
Block Diagram
2.5-42 V
Automotive Advanced Driver Assistance Systems (ADAS)

Security camera systems
S6BP202A
Automotive PMIC1
Battery
5.0 V
Features
6-Channel PMIC: 4-channel buck converters, 2-channel LDOs
Input Voltage Range: 4.5-5.5 V
High Switching Frequency: 2.1 MHz
Synchronization with external clock from 1.8 to 2.4 MHz
BOM Integration:
Built-in switching transistors and LDO output transistors
Built-in voltage setting resistors and compensation circuitry
Built-in discharge resistors
Built-in windowed watchdog timer (WDT)
Independent enable pins
Overcurrent protection (OCP), overvoltage protection (OVP)
Undervoltage locked-out (UVLO), thermal shutdown (TSD)
Package: 40-pin Thermally Enhanced QFN
S6BP401A
Enable for 6
6-Channel
1.8 V
External Clock for

Synchronization
Trigger
Input
Reset
Output
(Combined with
Power Good2
for LDO1)
GND
1.8V LDO,
Enable
Oscillator,
External
Sync
Windowed
Watchdog
Timer
Power Sources
Buck Converter
2.1 MHz (DC/DC 1)
1.200-1.575 V4
2.0 A
(MCU Core)
Buck Converter
2.1 MHz (DC/DC 2)
1.000-1.275 V4
3.0 A
(ISP Core)
Buck Converter
2.1 MHz (DC/DC 3)
1.200-2.575 V4
2.0 A
(DDR)
Buck Converter
2.1 MHz (DC/DC 4)
3.300-3.400 V4
1.0 A
(Flash Memory)
3.300-3.400 V4
0.2 A
(MCU I/O)
LDO 1
1.200-2.875 V4
0.5 A
(Camera Module)
LDO 2
Protection
Function
Power Good2
Power Good2
for 5-Channel
(Except LDO1)
Collateral
Datasheet:
S6BP401A
Evaluation Kit: User Guide
Availability
Samples: Now
Production: Now
1 An
IC that converts extremely fluctuating automobile power to safe, stable power for ECUs 3 A quality standard defined by the Automotive Electronics Council used to verify the
Good: An output signal that PMICs provide to signify that the supplied power by
reliability of ICs and qualify them for automotive applications
4 S6BP401A has factory-selectable options of output voltage for each channel
PMICs is proper and ready
2 Power
251
Automotive LED Driver
252
Automotive LED Driver Portfolio

Fog Light
Clearance Light
Daytime Running
Light
Turn Light
Head Light
Matrix Control1
Q416
CYxxx1
Asynchronous Boost2
1 ch3, 1.0 A4, 2.1 MHz5,
SSCG6,
60 V7, 24-Pin HTSSOP
CYxxx1
Asynchronous Boost2
1 ch3, 1.0 A4, 2.1 MHz5,
SSCG6,
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
CYxxx2_HG
Switch2,
8 ch3, 0.5 A4,1 kHz5,
CYxxx2_SG
Switch2,
4 ch3, 1.0 A4,1 kHz5,
CYxxx2_HG
Switch2,
8 ch3, 0.5 A4,1 kHz5,
Mid-Range
Simple Lighting
Q416
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
Q416
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
Q416
Q416
S6BL112A
Synchronous Buck2
1 ch3, 2.0 A4, 2.1 MHz5,
Q416
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
Q416
S6BL112A
Synchronous Buck2
1 ch3, 2.0 A4, 2.1 MHz5,
Q416
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
Q416
S6BL111A
Asynchronous Buck2,
1 ch3, 1.0 A4, 2.1 MHz5,
Market Segment
A new front lighting technology that controls individual LEDs

Main topology
3 Output channel
4 Maximum output current
Maximum switching frequency

Spread spectrum clock generator
7 Maximum Input and output voltage

Industrial
Automotive
Availability
QQYY
QQYY
253
One-Channel Automotive LED Driver

S6BL111A
Applications
Family Table
Daytime running lights, clearance lights, fog lights, turn lights

and headlights
Maximum Output Current
MPN
FET ON Resistor
Method
1.0 A
S6BL111A
Hi-Side: 480 m
Asynchronous Buck
2.0 A
S6BL112A
Hi-Side: 200 m
Lo-Side: 150 m
Synchronous Buck
Features
Asynchronous rectification buck LED driver
High efficiency: >90 %
Wide input voltage range: 4.5-42 V
Maximum output current: 1 A
High accuracy output current: 2.0 %
Adjustable switching frequency: 0.205-2.1 MHz
Minimum on time1: 35 ns
System safety functions for system protection
Dimming function: Analog2, PWM3
Slew rate control4 for noise reduction
Package: 16-pin thermally enhanced TSSOP (4.4 mm x 5.0 mm)
Block Diagram
VBAT
VIN
MASK6
S6BL111A
BGR5
4.2-V LDO
MASK6
Oscillator
VCC
RT
PVIN
UVLO7
UVLO7
DIM
SRCNT
BST
Collateral
Automotive LED Driver Evaluation Kit:
S6BL111A
Contact Sales
1A
LED
Current
Control
4A
PWM
Control
LX
PGND
CSP
Protection
Function
Production: Q4 2016
spec of switching on time of power MOSFET used in the LED driver

method to control the brightness of an LED using varying DC current
3 A method to control the brightness of an LED using a pulse width
modulated signal generated by a microcontroller
2A
VCC
DIAG
Availability
Sampling: Now
ADJ
function that reduces switching noise by controlling

the rise time (Tr) and fall time (Tf) of the internal switching
power MOSFET
5 Band gap reference
CSN
LED
6 Prevents
a false LED open detection when a drop in

the input voltage causes the output voltage to fall
below the forward voltage of the LED devices
254
One-Channel Automotive LED Driver

S6BL112A
Applications
Family Table
Headlights, daytime running lights, clearance lights, fog lights and

turn lights
Maximum Output Current
MPN
FET ON Resistor
Method
1.0 A
S6BL111A
Hi-Side: 480 m
Asynchronous Buck
S6BL112A
Hi-Side: 200 m
Lo-Side: 150 m
Synchronous Buck
2.0 A
Features
Synchronous rectification buck LED driver
High efficiency: >90 %
Wide input voltage range: 4.5-42 V
Maximum output current: 2 A
High accuracy output current: 2.0 %
Adjustable switching frequency: 0.205-2.1 MHz
Minimum on time1: 35 ns
System safety functions for system protection
Dimming function: Analog2, PWM3
Slew rate control4 for noise reduction
Package: 16-pin thermally enhanced TSSOP (4.4 mm x 5.0 mm)
Block Diagram
Contact Sales
Contact Sales
Availability
DIAG
Production: Q4 2016
A spec of switching on time of power MOSFET used in the LED driver

A method to control the brightness of an LED using varying DC current
3 A method to control the brightness of an LED using a pulse width
modulated signal generated by a microcontroller
2
UCD
BGR6
4.2-V LDO
MASK6
Oscillator
VCC
VCC
RT
PVIN
LED
Current
Control
ADJ
VCC
Automotive LED Driver Evaluation Kit:
S6BL112A
MASK6
Collateral
Sampling: Q2 2016
VIN
VBAT
DIM
SRCNT
BST
UVLO7
Under
Current
Detection
Protection
Function
A function that reduces switching noise by controlling

the rise time (Tr) and fall time (Tf) of the internal switching
power MOSFET
5 Band gap reference
PWM
Control
LX
PGND
CSP
CSN
LED
Prevents a false LED open detection when a drop in

the input voltage causes the output voltage to fall below
the forward voltage of the LED devices
255

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Document No. 001-89435 Rev. *L

Roadmap Slide Index

PSoC and MCU Portfolio

Wireless Solutions for The IoT

Energy Harvesting PMIC

Document No. 001-89435 Rev. *L

PSoC and MCU Portfolio

Document No. 001-89435 Rev. *L

PSoC and MCU Portfolio

High Analog Integration

Analog and Digital Integration

Programmable System-on-Chip (PSoC) is the worlds only programmable embedded

PSoC Analog Coprocessor

Production Sampling Development Concept

Document No. 001-89435 Rev. *L

FM4 MCU Portfolio

Production Sampling Development Concept

Document No. 001-89435 Rev. *L

Independent flash memory available to store data or additional firmware

PSoC 5LP Portfolio

CPU Speed and Flash

ARM Cortex-M3 | CapSense | DMA | LCD | RTC | Timer/Counter/PWM

Analog: 1x ADC1, 1x DAC2, 2x CMP3,

Analog: 1x ADC1, 2x DAC2, 4x CMP3,

Analog: 2x ADC1, 4x DAC2, 4x CMP3,

Analog: 2x/3x ADC1, 4x DAC2,

Document No. 001-89435 Rev. *L

Digital filter block

Universal digital block

Production Sampling Development Concept

FM3 MCU Portfolio

Document No. 001-89435 Rev. *L

Independent flash memory available to store data or additional firmware

Document No. 001-89435 Rev. *L

Production Sampling Development Concept

FM0+ MCU Portfolio

Document No. 001-89435 Rev. *L

Production Sampling Development Concept

Analog: ADC1, 1x DAC2, 2x CMP3,

Analog: ADC1, 2x DAC2, 4x CMP3,

Analog: ADC1, 2x/4x DAC2,

Analog: ADC1, 2x/4x DAC2,

CPU Speed and Flash

Interfaces: FF4 I2C

Delta-Sigma analog-to-digital converter

Document No. 001-89435 Rev. *L

Flash KB/SRAM KB/EEPROM KB

Controller area network

Document No. 001-89435 Rev. *L

7 Successive approximation register ADC

Production Sampling Development Concept

8FX MCU Portfolio

CPU Speed and Flash

Production Sampling Development Concept

Document No. 001-89435 Rev. *L

PSoC 4000 S-Series

Serial Wire Debug

Programmable Interconnect and Routing

Advanced High-Performance Bus (AHB)

Document No. 001-89435 Rev. *L

output digital-to-analog converter

PSoC 4100 S-Series