2012 IEEE 10th International Conference on the Properties and Applications ofDielectric Materials

July 24-28,2012,Bangalore,India

Performance of insulation systems for low voltage APFC panels during temperature rise test
at elevated ambient temperatures
V.Vaidhyanathan, T.Bhavani Shanker, G. Govinda Rao, H. N.Nagamani
Central Power Research Institute Bangalore-S60 012,India.
hnn@cpri.in, vaidhya@cpri.in

Abstract:

Application

Correction

panels

of

Factor

important tests to assess the thermal performance of the

in electrical distribution

constituent components of APFC panels like, capacitor

Automatic

(APFC)

Power

network is gaining importance due to the advantages of

banks,

APFC panels over fixed capacitor banks, like, ability to

thyristors and MCCBs along with insulation systems

reactors,

switching

devices

like

contactors,

maintain the target power factor with varying load and

employed.

hence

performance of the materials may get influenced by the

improve

efficiency

of

the

system

consequently reduce distribution losses.

and

The desired

performance of the APFC panels can be efficiently

ambient

The

rise

in

temperature

(Ta)

temperature

which

and

hence

generally

the

varies

geographically up to SOC. In order to study this issue,

achieved with appropriate design, material, construction

temperature rise test has been carried out for APFC

and application. Temperature rise test is one of the

panels

important tests to assess the thermal performance of

components connected in circuit. Different

constituent

20C to 60C has been simulated by conducting the test

components

of

APFC

panels.

Rise

in

temperature and hence performance of materials and

with

capacitor

banks

and

all

other

allied

Ta

from

inside a climatic chamber.

components is influenced by the ambient temperature

which may be as high as SOC. The paper deals with the
performance

of

APFC

panels

at

elevated

EXPERIMENTAL

ambient

temperatures. Temperature rise measured at capacitor

Present study has been conducted employing two types

banks,

of APFC panels with different types

reactors,

employed

in

information

switching components and MCCBs

APFC

would

panels

help

in

are

discussed.

arriving

at

limits

The
for

mechanism

namely

contactor

of switching

switching

(CS)

and

thyristor switching (TS). Rating of the panels was 200

temperature rise for components employed in 3 phase

kvar, 440 V, 3-phase and Ll connected. In order to

low voltage APFC panels.

simulate different

Ta,

temperature rise test has been

carried out inside an environmental test chamber having

Key Words: Power factor, APFC panels, Capacitor

internal physical dimensions of 2.0m (w) x 2.2m (d) x

2.5m (h). Test panel was placed inside the test chamber

bank, Reactor, temperature rise

in the most unfavourable condition which the panel is

likely to encounter in field. The experiments have been

INTRODUCTION

carried out with air velocity inside the test chamber as

Most of the electrical loads are inductive in nature

1. 8 mlsec.

resulting in severely lagging power factor. The most

given in table 1 for monitoring the temperature.

Temperature sensors were positioned as

practical and economical solution to improve the power

factor (PF) is to provide reactive compensation by

Before undertaking thermal evaluation, the automatic

installing power capacitors of suitable rating at strategic

power factor correction function of the APFC panel was

locations.

verified.

PF correction is more important in electrical

Switching of capacitor banks to correct the

distribution systems. For accomplishing the same, low

power

factor

voltage (LV) capacitors are being extensively used both

simulating

the

target

inductive

to

loads

value

as fixed capacitor banks and in Automatic Power Factor

conditions for both CS panel and TS panel.

at

was

verified

different

by

ambient

Correction (APFC) panels. Application of APFC panels

is

becoming

more

attractive

due

to

their

techno

APFC panels were energised to suitable voltage in order

commercial advantages like (1) Ability to maintain PF

to pass the required current.

at the required high value (close to unity) and hence

panels, energization of APFC panels is more complex

to

the

presence

of

Unlike other types of

avoid penalties imposed by electricity supply companies

due

due to low PF, (2) Avoid over compensation during low

capacitance of the order of 3 x l100IlF for a 200 kvar,

capacitor

banks

having

load conditions and (3) Improved efficiency of the

440 V, 3phase and Ll connected.

system due to reduction in losses. These desired features

compensation was provided for loading the panel to the

of the APFC panels can be efficiently achieved with

rated current of 262 Amps.

appropriate

is shown in figure 1.

design,

material,

construction

and

Suitable reactive

A view of test arrangement

application.
The temperature profiles of various components were
Performance of LV APFC panels needs to be evaluated

periodically

in

various

temperatures of 20C, 40C and 60C. The test current

industry needs. Temperature rise test is one of the

was passed for a time sufficient for the temperature at

accordance

with

relevant

protocols

978-1-4673-2851-7/12/$31.00 2012 IEEE

for

recorded

for

simulated

ambient

various

components

to

reach

stable

value

with

variation not exceeding 1 Klhr.

For evaluating temperature rise, temperature profiles

recorded at

Ta

of 20C and 60C for CS panel at various

components are shown in figures 3 and 4 respectively.

Table 1. Temperature sensor locations inside CS and

Similarly temperature profiles of TS panel recorded at

TS APFC panels

Ta

Sensor

Sensor Location in CS

of 20C and 40C are shown in figures 5 and 6.

Sensor Location in

Temperature rise test at 60C could not be carried out

for TS panel as thermal protection relay operated at

No.

APFC panel

TS APFC panel

Main MCCB

Main MCCB

Y-phase input terminal

Y-phase input

50C.

----------------

terminal
2
3

Main Copper Busbar Y

Main Copper Busbar

Phase

Y Phase

Stage 2 MCCB

Main MCCB case

Y-phase input terminal

. .'(i!='iP.. , ?,:;S!'lIJ.:

Stage 3 MCCB Surface

Controller

Stage 4 MCCB out

Stage 1, 12.5 kvar,

going Y phase terminal

Capacitor case

Stage 5 MCCB

Stage 1, Harmonic

Y- phase input terminal

filter reactor surface

Y- phase

Stage 2 Contactor

Stage 2 Harmonic

Y-phase out going

filter reactors.

terminal

Y-phase terminal

Stage 3 Contactor

Air temperature at

Y-phase out going

the centre of the

terminal

panel

Stage 4

Stage 3 Thyristor case

10

Stage 5 Contactor

Stage 3,

Y-phase out going

filter reactor top

terminal

surface , Y- phase

Y-phase input terminal

11
12

VZ(CHl>
II\'

Figure 2. Switching of capacitor banks for PF correction in

TS APFC panel.

80
70
U60
50
.E 40

30
20
10

Stage 1, 50 kvar, MPP

Stage 4, 50 kvar,
MPP Capacitor case

Stage 2 50 kvar, MPP

Stage 5, 50 kvar ,

Capacitor case

MPP Capacitor case

....... 1
_5
-9

I-

Harmonic

Capacitor case

; 135 .01'11,1:
-:-144.-31'11J:

_2 ....... 3_4
....... 6
_7 -8
....... 10 _11 ....... 12

I-- --

o
o

4
3
Time (hr)

Figure 3. Temperature profiles at Ta of 20C for CS panel

80
70
p- 60
50
'lU 40
30
20
10
0
:::J

...

I-

-9

_2
....... 3 _4
....... 6
-8
_7
....... 10 _11 ....... 12

2 Time3(h)r 4
.

Figure 4. Temperature profiles at Ta of 60C for CS panel

Figure 1.

Experimental setup for study on a 200 kvar,

440 V thyristor switched APFC panel.

RESULTS
correct PF to the set target of 0. 95 has been verified at

Ta

for both CS and TS APFC panels.

Both the panels have functioned satisfactorily to correct

the PF.

....... 1
_5
-9

_2 ....... 3 _4
....... 6
_7 -8
....... 10 _11 ....... 12

:::J

Switching of different stages of capacitor banks to

different simulated

80
70
60
50
'lU40
30
20
10

Figure 2 shows the line current monitored

during sequential switching of five stages of capacitor

bank in TS panel while correcting PF to the set target of
0.95 at ambient temperature of 40C.

I-

o
o

2 Timg(hr) 4

Figure 5. Temperature profiles at Ta of 20C for TS panel

80
70
P60
50
'lU 40
30
20
10
0

and vermin proof, different air filters are used for

various level of ingress protection from dust like IP54,
IP42, IP34, IP31 etc. These restrict the air flow and
hence

may

lead to

higher

temperatures at

various

components, consequently affecting the performance.

:::l

The filters are to be judiciously selected.

...

Similarly,

volume of APFC panel enclosure is also an influencing

I-

_2
6
....... 10

-9

Figure 6.

....... 3
_7
....... 11

3
4
Time (hr)

Temperature profiles at

Ta

factor.

_4
-8
_12

Both

CS

and

satisfactorily

TS

APFC

during

panels

temperature

abnormality was observed.

have
rise

performed

test

as

no

Temperature rise test on TS

APFC panel could not be carried out at 60C as thermal

protection relay operated at 50C which could be the
of 40C for TS

APFC panel

design criteria for the required application. The highest

temperatures

attained

at

important

components

are

summarized in table 3 for both the panels, for the

DISCUSSION

conditions given in table 2.

Ambient temperature may play a significant role on the

thermal

performance

of

APFC

panels.

Rise

in

temperature and hence the performance of the materials

may be influenced by

Ta

panels

were

Ta

major components of APFC panels

which could be as high as 50C

depending on the geographical location. In order to

simulate elevated

Table 2. Details of cooling, ventilation, volume and

Parameter

and the operating condition, APFC

placed

and

energised

inside

an

environmental test chamber of suitable dimensions.

Cooling

Also, capacitor banks and all other allied components of

APFC

panels

were

connected

temperature rise test at different

Ta

while

conducting

from 20C to 60C.

The feature of PF correction to the set target has also

been verified at different simulated
TS APFC panels.

Ta

for both CS and

Ventilation
Internal

Time taken for temperature stabilization (within 1K1hr)

example, MPP capacitor case, stabilization time is 3 hr

for

Ta

as 20 C and 5 hr for

Ta

Temperature attained by different components during

temperature rise test depends on several external factors

Panel
components

Construction

3.

components

harmonics. Present study does not cover harmonics.

<:
U

Cooling, ventilation, air velocity, internal volume of the

enclosure and the components of CS APFC panel and
TS APFC panel considered for the study are listed in
1. 8 mlsec which

can

be

classified as high air velocity, may represent outdoor

installation sites particularly wind energy farms where
APFC panels find huge application.
in

the

panel

effectiveness of air circulation.

determines

the

Louvered vents with

IP42 filters at

bottom

bottom all around

3

2.36 m

Capacitors - 9

Capacitors - 16

MCCB

MCCB

-8

- 1

Reactor - 6

Controller -1

Thyristor - 6

Copper bus bar 2

400 mm

Controller - 1
Copper bus bar 2

Modular

Non modular

Temperature
during

(max.)

temperature

measured
rise

test

at

panel

for

the

<!)
c

it g

Max. temperature

(OC) measured in

APFC panel at

TS APFC panel at

8.

E
0
o.u

Max. temperature

(OC) measured in CS
different To

different T"

60C

40C

20C

40C

20C

68.5

47.2

28.8

47.3

27.3

MCCB

66.5

46.7

27.5

43.3

25.1

Bus bar

63.5

44.1

25.1

42.3

23.4

Thyristor

---

---

---

46.9

27.9

Reactor

---

---

---

45.5

27.8

71.4

49.7

30.9

---

---

Capacitor
case

Contactor

Several options are

available like natural air with vents and without vents,

forced air with vents, etc.

Five vents with

IP54 filters at

conditions given in table 2.

like air velocity, air ventilation, volume of the enclosure,

provided

fan at top of panel

300 mm

positioning of components, power quality, particularly,

Ventilation

127W, 2550 rpm,

fan at top of panel

Contactors - 7

Table

Air velocity of

with 230V,10,

91W, 2400 rpm,

as 60 C in CS APFC

panels.

table 2.

Forced Air Cooling

with 230V, 10,

1.32 m

volume

at various panel components during temperature rise test

appears to be dependant on ambient temperature. For

TS APFC panel

Both the panels have functioned

satisfactorily to correct the PF (refer fig. 2 for TS panel)

CS APFC panel
Forced Air Cooling

Since panels are to be dust

As seen from table 3 the rise in temperature is more in

CS APFC panel as compared to TS APFC panel.

Temperatures attained by the components of CS APFC

panel at different

Ta

are shown in figure 7.

A linear

Table 4. Temperature rise in TS and CS APFC panels at

elevated ambient temperatures

with

Ta.

ambient temperatures from

This is true for all the

20C to 60C*

components.

80 "T"""-----,

U
e.....
60

Capacitor case

8.8 K

MCCB terminal

7.5 K

Copper Bus bar

5.1K

Thyristor case

7.9 K

Contactor terminal

Thermal

QI

.. 20
x

40
20
60
Ambient temperature (0C)

Ambient

temperature

versus

80

1.

components acting as heat source, like, filter reactor and

heat sink for thyristors as compared to CS APFC panel.

the cooling and ventilation system provided in TS panel

3.

panels are depicted in table 4.

This is applicable for the

conditions listed in table 2. Metallised Poly-propylene

film (MPP) capacitors are used in both APFC panels.
temperature

of

MPP

capacitors

has

been

monitored during tests like thermal stability test for 48

hours (minimum) as per IEC 60831-1 [1] and ageing for
1500 hours as per IEC 60831-2 [2], where ambient air
temperature will be generally in the range of 50C to
60C.

Laboratory test results [3] on more than 200

performance

when

temperature

capacitor case has not exceeded 10K.

rise

at

As shown in

table 4, a maximum rise of 8. 8K has been measured at

capacitor case.
As

APFC

panels

during
ambient

was observed to

be

APFC panel with modular switching stages has

a

lower

rise

in

temperature

for

the

Based on laboratory tests performed on different

types of APFC panels, temperature rise at various
components have been estimated. This could be a
reference for setting limits.

ACKNOWLEDGMENT
Authors

acknowledge

CPRI,

Bangalore,

India

for

according permission to publish the paper. Authors also

acknowledge the financial support from Bureau of
Indian

Standards

(BIS),

New

Delhi

and

technical

support from the participating organizations for the

study.

Authors thank Mr. S. Neelakantan, Mrs. Viji

Venugopal, SRF and Mr. K. Sashi of Power Capacitor

laboratory of CPRI for extending support.

REFERENCES

[II

International

Standard

IEC

60831-1,

Shunt

power

capacitors of the self healing type for ac systems having a

MPP capacitors of unit rating up to 100 kvar indicate

satisfactory

elevated

with non modular construction.

4.

these

temperature rise observed for both types of APFC

satisfactorily
at

constituent components as compared to the panel

conditions, TS panel has performed better than CS panel.

Based on the data listed in table 3, the maximum

test

Automatic switching operation of both thyristor and

shown

appears to be more efficient in dissipating the heat,

Under

performed
rise

satisfactory during the above test.

two horizontal stacks whereas it is in vertical modular

stack formation in TS panel, aiding better cooling. Also

have

contactor switched APFC

The arrangement of capacitors in CS APFC panel is in

rise.

and

temperatures considered for the study.

2.

As listed in table 2, TS APFC panel has more number of

temperature

switched

Contactor switched and thyristor switched APFC

temperature

temperature

attained (max) by the components in CS APFC panel.

limiting

contactor

findings of the study are

panels

7.

of

elevated ambient temperatures. Some of the important

...... Busbar

performance

thyristor switched APFC panels has been studied at

....... contactor

ru

Case

. .

CONCLUSIONS

thereby

11.4 K

"Applicable for the conditIOns listed In table 2

Qj
40
Co

Figure

7 .8 K

Reactor surface

:::J
..
ru

measured at different

Component

However components in CS panel have shown

a steeper rise than TS panel.

Temperature rise (max)

Panel

increase in component temperature has been observed

[2 ]

rated voltage up to and including 1000 V

International

Standard

IEC

60831-2,

Shunt

power

capacitors of the self-healing type for ac systems having a

rated voltage up to and including 1000 V Part:2 Ageing
test, Self-healing test and destruction test

have

performed

satisfactorily,

[3] H.

N.

Nagamani

et.al,

"Experience

of

CPRI

in

temperature rise results furnished in table 4 can be taken

performance evaluation of power capacitors of unit rating

h
up to 1000 kvar", 7l International Seminar on Capacitors

as reference for setting the limits for temperature rise.

(CAPACIT 2010), pp. IV 1-13, Jan 2010, Mumbai, India