Componente i

circuite pasive
Facultatea Electronic, Telecomunicaii i Tehnologia informaiei
Universitatea Politehnica din Bucureti

Aprecierea cunotinelor dobndite

http://www.electronica.pub.ro/index.php/facultate/regulament

Modul de notare n cadrul disciplinei CCP

LABORATOR - 60%
6 lucrri+ test final+ tem
de cas

Test final laborator

Referate de laborator
Tem de cas

30%
15%
15%

EXAMEN - 40%
oral, n sesiune

Probleme
Teorie

10%
30%

Activiti extracuriculare Programul MINERVA 20%

Obs. Cotele procentuale sunt echivalente punctelor din Regulament (maxim 100 puncte)

1. Participarea la programul MINERVA este benevol i se noteaz cu un bonus de 0.......20 puncte

2. Bonusul se acord numai n cazul obinerii a minim 70 puncte dintre care minim 30 puncte la
examen.

Laboratorul
Componente i circuite pasive

Localul LEU

B303 i B123

Capitole de curs:
1.Propieti generale ale
componentelor electronice pasive
2.Rezistoare,
3.Condensatoare,
4.Inductoare,
5.Tehnologie

Bibliografie
1. Componente electronice pasive Rezistoare, Proprieti,
Construcie, Tehnologie, Aplicatii., P. Svasta, V. Golumbeanu, C.
Ionescu, Al. Vasile, Ed. Cavallioti, Bucuresti 2011
2. Componente
i
circuite
pasive

Condensatoare,
Proprieti, Construcie, Tehnologie, Aplicatii., P. Svasta, Al.
Vasile, Ciprian Ionescu, V. Golumbeanu, Ed. Cavallioti, Bucureti 2013
3.Componente i circuite pasive Probleme, P. Svasta, Al. Vasile,
Ed. Cavallioti, Bucuresti 2010
4. INTERNET: http://www.cetti.ro
(Centrul de Electronic Tehnologic i Tehnici de Interconectare)

5. Componente electronice pasive ntrebri i rspunsuri, P.

Svasta, V. Golumbeanu, C. Ionescu, N.D. Codreanu, G. Popovici, A.
Flechiu, D. Leonescu, litografia U.P.B., 1996 (*)

INTERNET:

http://www.vishay.com/
http://www.koaspeer.com/
http://www.caddock.com/
http://www.we-online.com
http://www.avx.com/
http://www.isabellenhuette.de
http://www.murata.com
http://www.digikey.com/
http://www.tme.eu

Notiuni introductive in
ingineria modulelor si a
microsistemelor electronice

Industria electronic este un

motor al inovarii !
The global electronic industry acts as
the engine for science, technology,
advanced manufacturing, and the
overall economy of the countries that
participate in it.
Prof. Rao Tumala, Packaging Research Center, Georgia
Institute of Technology, Atlanta, Georgia, Past President of
IEEE-CPMT Society Fundamentals of Microsystems
Packaging, McGraw-Hill, 2001

Ingineria... este o mare profesiune. Este

fascinaia de a vedea cum o plsmuire a
imaginaiei se transform cu ajutorul tiinei
ntr-un plan pe hrtie, ca apoi s se
materializeze n piatr, metal sau energie. Ca
apoi s creeze locuri de munc i locuine
pentru oameni. Ca apoi s duc la creterea
standardului de via i la sporirea confortului.
Acesta este naltul privilegiu al inginerului.
Herbert Clark Hoover (1874 - 1964), Inginer,
Preedinte al SUA, 1929-1933

Scurta prezentare privind evoluia componentelor

electronice pasive
Locul i rolul componentelor pasive n actuala etap a dezvoltrii microelectronicii;
Etapa actual de dezvoltare a electronicii este caracterizat de integrarea pe scar
larg a funciilor electronice alturi de altele noi din domenii ca optoelectronica,
mecanic, microfluidic, biologie, chimie. Numrul de tranzistoare echivalente a
depit legea lui Moore, se vorbete de more than Moore i beyond Moore.
n domeniile circuitelor integrate se trece la capsule tridimensionale la utilizarea
TSV (Through Silicon Via). Evoluia n domeniul packaging-ului este caracterizat
de conceptul SIP System in Package,

Un nou domeniu este pe cale s se impun: electronica organica:

Organic Electronics - Printed Electronics

!!!!!!!!

Aplicaii
|
|
|
|
|

Medicin
Comer
Logistic
Securitate
Textile

n domeniul componentelor pasive

evoluia este orientat spre:
Reducerea dimensiunilor,
Creterea frecvenelor de lucru,
Mrirea capacitii de dispare a puterii i a gamei de temperatur (cerine
speciale pentru industria auto),
mbuntirea stabilitii (cu temperatura i ali factori de mediu); creterea
fiabilitii,
Diversificarea produselor pentru a oferi componenta specific fiecrei
aplicaii,
Reducerea preului,
Utilizarea componentelor pasive integrate,
Dezvoltarea de noi componente LEC (Light Emmiting Capacitor),
Supercondensatoare.
!!!!!!! Componente pasive in electronica organic !!!!!

Evoluii n domeniul electronicii (sursa: J. C. Eloy, EMPC 2009, Rimini)

Electronics packaging has become

recognized as a critical technology for
the continued growth of the nations
electronics industry. 1
Prof. James E. Morris Head of Department of Electrical
Engineering, Portland State University, Oregon, USA
______________
1 A Multidisciplinary Sophomore Course in Electronics
Packaging, Proceedings ECTC, May 1998

Electronic Packaging
The engineering discipline that
combines the engineering and
manufacturing technologies
required to convert an electrical
circuit into a manufactured
assembly. These include at least
electrical, mechanical and
material design and many
functions such as engineering,
manufacturing and quality
control.
Editura: McGraw-Hill, Inc. New York & all, 1993, ISBN 0-07-026688-3

Electronic Package
The electromechanical
assembly resulting from
electronic packaging
design and manufacture.
The level of an electronic
package may range from
the integrated circuit
package assembly to a
printed wiring board
assembly to a subsystem
or system package
assembly.

Modulul electronic =

ansamblul electromecanic rezultat al activitilor de

proiectare i fabricaie specifice packagingului electronic de la

nivelul:

Componentei electronice respectiv al

circuitului integrat
la
placa cu circuite imprimate (PCB)
asamblat
la
Subansamble sau produse electronice .

Industrie electronic n
Romnia

Nivelul 2 - o ans pentru Romnia

A-E Electronics,
Electronics Bacau
Antrice,
Antrice Bucuresti
Armtech, Curtea de Arges
Benchmark Electronics Romania,
Romania Ghimbav
BKD,
BKD Petrosani
Celestica,
Celestica Oradea
Connectronics Romania,
Romania Oradea
Continental, Sibiu, Timisoara, Iasi, Brasov
Dasteco,
Dasteco Iasi
Delphi Automotive,
Automotive Moldova Noua, Sannicolau Mare, Ineu
Electromagnetica,
Electromagnetica Bucuresti
Elettra Communications,
Communications Ploiesti
EMS Electra,
Electra Iasi
Flextronics,
Flextronics Timisoara
GDM Electronics Romania,
Romania Curtea de Arges
Hanil Electronics (Samsung), Biharia
Hella Electronics Romania,
Romania Arad, Timisoara
Honeywell Life Safety,
Safety Lugoj

Nivelul 2 - o ans pentru Romnia

Intrarom,
Intrarom Bucuresti
IAE, Timisoara
Kromberg & Schubert, Sibiu, Medias, Timisoara
Kuhnke Automation,
Automation Sibiu
Leoni Wiring Systems,
Systems Arad
Marquardt, Sibiu
Mibatron,
Mibatron Bucuresti
Microsif, Bucuresti
Plexus,
Plexus Oradea
Steinel, Curtea de Arges
Sumida Romania,
Romania Jimbolia
Systronics,
Systronics Arad
Topex,
Topex Bucuresti
Trion Electronics,
Electronics Curtea de Arges
Yazaki Component Technology,
Technology Arad, Ploiesti, Timisoara,

Celulele fotovoltaice ale satelitului GOLIAT

Building block technology of the information age

Technology package trend

1970

2011

Source: F. Pasolini, EMPC 2009,

Semilogaritmic Moores plots of the Roadmap data

Porti / Chip

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The
twenty-first
century
will
be
characterized by revolutionary changes in
communication, computing, and consumer
electronics.
Today's product, from cellular phones to
personal digital assistants to multimedia and
networks computers, represent the top of the
iceberg of a set of products that will
dramatically change the way the World does
business and communicates.
Prof. Rao Tumala, Packaging Research Center, Georgia Institute of
Technology, Atlanta, Georgia, Past President of IEEE-CPMT Society
Universitatea Politehnica din Bucureti

Centrul de Electronic Tehnologic i Tehnici de Interconectare

Electronics in automotive

Vehicle environmental zone

 Despre module si micro

module electronice

Structure of a Second level EP

Electro-mechanical
parts,
Electronic
components

Mechanical
parts,

Subsystem

Motherboard
Electronic module

Detail of an electronic module content:

standard components

dedicated components (PCB)

electronic technologies

Components
Standardized components
developed and manufactured by specialized
producers.
(examples: IC, Discrete active and passive
components etc)

Dedicated components
developed by company itself according to the
application requirements.
(examples: PCB, integrated passives etc

Education and Training

Criterii de proiectare a cablajelor imprimate

Ge

Economice
om
et r
ice

Mecanice

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e
c
tri

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i
g
o
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o
hn

Termice

Te
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bil
itat
e
40 / 37

TIE Project http://www.tie.ro

Interconnection Techniques in Electronics-TIE is a major project
established to promote eSkills of students in electrical & electronics
engineering education. The topics are focused on CAD

activities for electronic design of modules and micromodules. TIE was developed to cover the presence of all universities
involved in electrical & electronics engineering education in
Romania. Because English is the TIE official language, the event is
open towards all European universities. The Budapest University for
Technology and Economics from Hungary has a constant
participation in the last years. TIE is highly appreciated by the IEEE
CPMT Society and is strongly supported by its IEEE CPMT Hu&Ro
Joint Chapter. TIE, in fact, aims to raise awareness the growing
demand of highly skilled ICT practitioners and users in industry in a
domain with high added value products, like electronics industry is.

In this perspective, one of TIEs committees, the

Industrial

Advisory Committee (IAC),

composed only by
professionals coming from well known companies (Continental
Automotive, Siemens, Microchip, etc), works closely with the
Technical Program Committee for preparing the topics, the
subjects, and the evaluation sheets of the competitors. At the end of
the event, IAC establishes the level over which the participants are
considered to have an accepted knowledge to be considered PCB
designers, able to participate in industrial design teams and
companies. The TIE project offers to students an extra-

curricular environment for gaining design skills in

CAE-CAD-CAM for electronics. The acquired knowledge
and competence represent one of the main elements destined to
promote the mandatory electronic industrial requirements in
engineering education and training. Through this, the event
provides by academia a concrete answer to the European Europe
2020 strategy.

Posterul
evenimentul
ui
TIE 2012
www.tie.ro

Poster TIE

Componente electronice pasive

Componente
pasive
scurt
scurt prezentare
prezentare

Electronica 2008
Messe
Messe Mnchen
Mnchen -- Germania
Germania

=9mm

TOP SIDE
BOTTOM SIDE

Activiti extracurriculare
destinate cercetrii n domeniul
ingineriei electronice cu accent
pe problematica CCP

Programul Minerva

http://www.cetti.ro/minerva/

http://www.cetti.ro/minerva

 Programul Minerva reprezinta o activitate extra curriculara ce isi

propune sprijinirea studentilor anului I ai facultatii ETTI interesati
sa fie implicarea in proiecte de ce reprezinta o initiere intr-o activitate
de cercetare orientata asupra problematicii componentelor
electronice pasive. Programul este promovat cu ajutorul Chapterului
studentesc al Societatii CPMT din cadrul IEEE ce a fost constituit in
Universitatea Politehnica din Bucuresti in 2001.
Se urmareste prin intermediul proiectelor programului, la cei ce
participa si isi finalizeaza tema de proiect, dezvoltarea de abilitati
privind cautarea si structurarea informatiei precum si capacitatea de
a expune, intr-un mod cat mai profesional, rezultatele muncii depuse.
Se doreste sa se dezvolte participantilor la program capacitatea
studentilor de a lucra in echipe, pe care ei si le formeaza, de a conduce
activitatea echipei etc.
*

!!!!!!!!!!!!!!!!!!!!!

SBCs Site

IEEE CPMT HUNGARY & ROMANIA Joint Chapter

HUNGARY & ROMANIA

Joint Chapter
www.cpmt.org

ECTC 2003 SBCs Awarding- Diploma

http://www.cetti.ro/sbc/

Politehnica University of Bucharest CPMT Society Student Branch Chapter

Diplom
Se acord echipei:
Tiberiu Condensator, Clara Amper, Ionu Electron, Mihai Tranzistor,
Dan Diod,
pentru rezultate deosebite cu proiectul Parametrii Transformatoarelor.
Transformatoare planare n cadrul programului Minerva n anul universitar
2006/2007 .
IEEE Romania Chair,
Prof. dr. ing. Nicolae pu

CPMT Student Branch Chapter

Adviser,
Prof. dr. ing. Paul Svasta

CPMT Student Branch Chapter Chair

Project Manager
Stud. Alexandru Romanescu