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Lecture 8:
Photolithography
Microfabrication process
Starting substrate
(e.g., silicon wafer)
Mask
Mask set
#1
Pattern definition
(Lithography)
Etching
(e.g., wet or dry etching)
Doping
(e.g., diffusion or ion implantation)
Photolithography
Process steps:
Coat substrate
Substrate preparation
Photoresist application
Soft-baking
Expose photoresist
Develop photoresist
Hard-bake
Cleanroom
Due to the small dimensions of
microstructures, it is important to keep
the fabrication area as clean as possible.
This is typically specified as the total
number of particles of a certain
maximum size (e.g., 0.5m) in a given
volume (e.g., one cubic foot).
Cleaning
It is often necessary to clean the wafers in
between different fabrication steps.
RCA clean: NH4OH:H2O2:H2O followed by
HCl:H2O2:H2O
Piranha clean: H2SO4:H2O2:H2O
Photoresist
Positive resist becomes more soluble to the
developer after it is exposed to UV light.
Exposure to UV light makes negative resist less
soluble in the developer.
The resist is applied to the wafer by putting a
few drops at the centre of the wafer and then
spinning it at 1000s of rpm.
The final resist thickness is empirically found
from:
=
Resist Polarity
Optical lithography
Exposure
= 546 nm
= 436 nm
= 405 nm
= 365 nm
: (10 100 2 )
:
:
Region name
Wavelength (nm)
Near UV
330-450
UV
260-330
Deep UV
200-260
Extreme UV
10-14
Contact printing
Mask is pressed onto the wafer
Advantages:
simple setup;
good resolution ( 0.5 m).
Disadvantages:
resolution is not uniform;
defects on mask and wafer.
10
Proximity Printing
Small spacing between mask
and wafer (10-50m)
Advantages:
simple setup;
increased mask lifetime
Disadvantage:
Reduced resolution ( 2m)
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Projection Printing
Mask is projected onto wafer (Reducing projection
for increased resolution such as 5:1 or 10:1)
Pros: high resolution (0.1-0.5 m); long mask lifetime
Cons: complex optical system; many exposures are
needed; limited depth of focus (1m)
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Resolution
The smallest width that can be successfully transferred to the resist layer is the
resolution of the printing process.
=
+
2
2
where tresist is the resist thickness and s is the separation between the mask and the wafer.
NA is the numerical aperture (= lens radius/focal length, typically between 0.16 to 0.93) and k1 is an
experimentally determined number ( between 0.3 and 1.1).
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