Cree v. E. Mishan & Sons - Complaint

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 1 of 24
UNITED STATES DISTRICT COURT

FOR THE DISTRICT OF MASSACHUSETTS
CREE, INC.,
Plaintiff,
v.
Civil Action No. 16-CV-12275
E. MISHAN & SONS, INC.,
JURY TRIAL DEMANDED
Defendant.
COMPLAINT
Plaintiff Cree, Inc. (Cree) files this complaint against defendant E. Mishan & Sons, Inc.
(Emson), based upon actual knowledge as to itself and its own actions, and upon information
and belief as to all other persons and events, as follows:
PARTIES
1.
Plaintiff Cree is a corporation organized and existing under the laws of the State
of North Carolina with a principal place of business at 4600 Silicon Drive, Durham, North
Carolina, 27703.
2.
Upon information and belief, Emson is a New York corporation with its principal
place of business at 230 5th Ave, Suite 800, New York, NY 10001.
JURISDICTION AND VENUE
3.
This action for patent infringement arises under the patent laws of the United
States, Title 35 of the United States Code. This Court has original jurisdiction over the subject
matter of this action pursuant to 28 U.S.C. 1338(a) and 1331.
4.
On information and belief, Emson regularly transacts and/or solicits business
within this Judicial District and has purposefully availed itself of the privilege of conducting
business in the Commonwealth of Massachusetts.
5.
On information and belief, Emson regularly sells and offers for sale products
within this Judicial District over the Internet (see, e.g., http://www.emsoninc.com/ and
http://www.emsoninc.com/tac-light/) and through retailers that operate brick and mortar stores
within this Judicial District.
6.
On information and belief, Emson has committed acts of infringement in this
Judicial District by, inter alia, selling and offering for sale the infringing products within this
Judicial District.
7.
Accordingly, this Court has personal jurisdiction over Emson.
8.
Upon information and belief, venue is proper under 28 U.S.C. 1391(b), (c) and
28 U.S.C. 1400(b) because Emson is subject to personal jurisdiction in this Judicial District.
BACKGROUND
9.
Since its founding in 1987, Cree has become a market-leading innovator engaged
in the design, manufacture, and sale of light emitting diodes ( LED ), lighting products using
LEDs, and semiconductor solutions for wireless and power applications.
10.
LEDs provide environmentally friendly and energy-efficient alternatives to
traditional light sources such as incandescent light bulbs.

11.
Cree s LED products include LED fixtures and lamps, LED chips, high brightness
LEDs, and lighting-class power LEDs, and are used in applications such as general illumination,
backlighting, flashlights and electronic signs and signals.
12.
According to Emson s website, Emson is an importer of promotional products,
television supported, and general merchandise. This enables the company to maximize full
profit potential for each product marketed. Categories include: electrical and non-electrical
appliances, beauty and personal care, pet care, fitness, auto and outdoor products. Emson s
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customer base includes major department stores, drug chains, supermarkets, discounters, mail
order, catalog showroom, warehouse clubs, premium, demonstration and international sales.
http://www.emsoninc.com/our-crew/.
13.
According to Emson s website, building brands such as Bell+Howell has
allowed Emson to increase product categories and expand its marketing ability to all accounts
across the nation. Examples of such categories are flashlights, including TACLIGHT.
14.
This action arises out of Emson s infringement of six Cree patents.
15.
On October 5, 2010, U.S. Patent No. 7,808,013 (the 013 patent), entitled
Integrated Heat Spreaders For Light Emitting Devices (LEDs) and Related Assemblies, was
duly and legally issued to inventors Nicholas W. Medendorp, Jr. and Peter Andrews. Cree is the
owner of all right, title, and interest in and to the 013 patent by assignment. The 013 patent is
valid and subsisting. A copy of the 013 patent is attached as Exhibit A.
16.
The 013 patent generally relates to a light emitting device assembly that may
include an electrically insulating substrate and a thermally conductive layer on a surface of the
insulating substrate. A light emitting device may be on the thermally conductive layer so that the
thermally conductive layer is between the light emitting device and the electrically insulating
substrate. A plurality of thermally conductive vias are thermally and electrically coupled to the
thermally conductive layer.
17.
On December 28, 2010, U.S. Patent No. 7,858,998 (the 998 patent), entitled
Semiconductor Light Emitting Devices Including Flexible Silicone Film Having a Lens
Therein, was duly and legally issued to the inventor Gerald H. Negley. Cree is the owner of all
right, title, and interest in and to the 998 patent by assignment. The 998 patent is valid and
subsisting. A copy of the 998 patent is attached as Exhibit B.
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18.
The 998 patent generally relates to a light emitting device assembly that may
include a solid alumina block and a light emitting diode on a face of the solid alumina block. A
flexible unitary film comprising silicone extends conformally on the face of the solid alumina
block and includes a lens.
19.
On May 1, 2012, U.S. Patent No. 8,167,463 (the 463 patent), entitled Power
Surface Mount Light Emitting Die Package, was duly and legally issued to the inventor Ban P.
Loh. Cree is the owner of all right, title, and interest in and to the 463 patent by assignment.
The 463 patent is valid and subsisting. A copy of the 463 patent is attached as Exhibit C.
20.
The 463 patent generally relates to a light emitting die package that may include
a substrate, a thermal pad disposed in a middle portion of the bottom surface of the substrate, and
a plurality of traces disposed on opposing sides of and isolated from the thermal pad.
21.
On January 7, 2014, U.S. Patent No. 8,622,582 (the 582 patent), entitled
Power Surface Mount Light Emitting Die Package, was duly and legally issued to the inventor
Ban P. Loh. Cree is the owner of all right, title, and interest in and to the 582 patent by
assignment. The 582 patent is valid and subsisting. A copy of the 582 patent is attached as
Exhibit D.
22.
The 582 patent generally relates to a light emitting die package that may include
an electrically insulating substrate, a plurality of traces disposed on the top surface of the
substrate, a light emitting diode mounted on the top surface of the substrate and proximate a
center of the substrate, and a thermal contact pad disposed on the bottom surface of the substrate.
23.
On June 30, 2015, U.S. Patent No. 9,070,850 (the 850 patent), entitled Light
Emitting Diode Package And Method For Fabricating Same, was duly and legally issued to
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inventors Bernd Keller, Nicholas W. Medendorp, Jr., and Thomas Cheng-Hsin Yuan. Cree is the
owner of all right, title, and interest in and to the 850 patent by assignment. The 850 patent is
valid and subsisting. A copy of the 850 patent is attached as Exhibit E.
24.
The 850 patent generally relates to an LED package that includes a submount
having a top and bottom surface with a plurality of top electrically and thermally conductive
elements on its top surface. An LED is included on one of the top elements such that an
electrical signal applied to the top elements causes the LED to emit light. A bottom thermally
conductive element is on the bottom surface not in electrical contact with the top electrically and
thermally conductive elements, a lens is over the LED, and a protective layer extends from a
bottom of the lens.
25.
On May 11, 2010, U.S. Patent No. D615,504 (the 504 patent), entitled
Emitter Package, was duly and legally issued to inventors Bernd Keller, Nicholas W.
Medendorp, Jr., and Thomas Cheng-Hsin Yuan. Cree is the owner of all right, title, and interest
in and to the 504 patent by assignment. The 504 patent is valid and subsisting. A copy of the
504 patent is attached as Exhibit F.
26.
The 504 patent is a design patent for the ornamental design of a light emitter
package.
DEFENDANTS EXEMPLARY INFRINGING PRODUCT
27.
On information and belief, Emson markets, offers for sale and sells infringing
flashlight or lighting products, including at least an infringing tactical flashlight product under
the name TACLIGHT throughout the United States and within this Judicial District.
28.
According to TACLIGHTs product packaging (see Exh. G), TACLIGHT is a
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Bell+Howell TACLIGHT flashlight distributed by Emson. The product packaging also

alleges, inter alia, that the accused product is 22-times brighter than a regular flashlight, that
when in use, the flashlight can be seen from five nautical miles, and that the product may be used
in five different modes: high, medium, low, strobe and SOS. The product packaging also alleges
that the product has been Seen on TV. On information and belief, the as Seen on TV label
refers to a commercial that shows the TACLIGHT product in use and effectively teaches an enduser how to use the accused product. See, e.g., https://www.youtube.com/watch?v=uNcWl2Z3pQ (As Seen On TV video).
29.
On information and belief, Emson offers infringing flashlight or lighting products,
including its infringing TACLIGHT tactical flashlight product for sale on its websites
(http://www.emsoninc.com/tac-light/ and https://www.tryTACLIGHT.com/) throughout the
United States and within this Judicial District. Attached as Exhibit H is a printout showing two
Emson websites offering the TACLIGHT product for sale.
30.
The importation, sale, and offer for sale of Emsons flashlight or lighting
products, including TACLIGHT tactical flashlight infringes at least one or more claims of the
013, 998, 463, 582, 850, and 504 patents (the Asserted Patents). See Exh. I. For
example, Emsons TACLIGHT tactical flashlight includes a light emitting diode (LED)
component meeting the limitations of at least one claim of each of the Asserted Patents. Id.
31.
Since at least as early as August 25, 2016, or as of the filing date of this action,
Emson has known of the Asserted Patents and knew that its sale of the TACLIGHT tactical
flashlight product infringed the Asserted Patents. See Exh. J.
COUNT 1 PATENT INFRINGEMENT OF U.S. PAT. NO. 7,808,013
32.
Cree repeats and realleges the allegations set forth in paragraphs 1-31 above, as
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though fully set forth herein.

33.
This cause of action arises under Section 35 of the patent Laws of the United
States, 35 U.S.C. 271.

34.
The 013 patent is valid and enforceable.
35.
Upon information and belief, Emson has committed acts of infringement of the
013 patent, and continues to commit such acts of infringement, by importing, selling and
offering for sale flashlight or lighting products, including the TACLIGHT flashlight that directly
infringes one or more claims of the 013 patent.
36.
Upon information and belief, the light emitting device assembly incorporated in
the TACLIGHT flashlight infringes at least claim 1 of the 013 patent. See Exh. I-1. Emson
sells and offers for sale the infringing TACLIGHT flashlight in the United States.
37.
Representative claim 1 of the 013 patent recites:

A light emitting device (LED) assembly comprising:
an electrically insulating substrate;
a continuous thermally conductive layer adjacent a surface of the electrically

insulating substrate;
a light emitting device adjacent the continuous thermally conductive layer so that
the continuous thermally conductive layer is between an entirety of the light emitting
device and the electrically insulating substrate, wherein the continuous thermally
conductive layer extends beyond an edge of the light emitting device in at least one
direction a distance greater than half of a width of the light emitting device; and
a plurality of thermally conductive vias through the electrically insulating
substrate, wherein the plurality of thermally conductive vias are thermally and electrically
coupled to the continuous thermally conductive layer and wherein portions of the
electrically insulating substrate adjacent the light emitting device are free of the plurality
of thermally conductive vias.
38.
As shown in Exhibit I-1, the TACLIGHT flashlight incorporates a light emitting
device assembly that includes each recited element of claim 1 of the 013 patent. The light
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emitting device assembly includes an electrically insulating substrate and a continuous thermally
conductive layer adjacent to a surface of the insulating substrate. The assembly includes a light
emitting device adjacent the continuous thermally conductive layer so that the thermally
conductive layer lies in its entirety between the light emitting device and the electrically
insulating substrate. Further, the light emitting device includes the recited plurality of thermally
conductive vias.
39.
Emson received notice of the 013 patent at least as early as August 25, 2016 (see
Exh. J), as well as by the filing and service of the Complaint in this action. On information and
belief, at all times relevant hereto, Emson has had actual knowledge of the 013 patent, but
nonetheless has infringed and continues to infringe the 013 patent in a willful and deliberate
disregard of Plaintiffs respective rights therein and with the intent to infringe those rights.
40.
By the acts alleged above, Emson has made, used, offered to sell, sold and/or
imported into the United States, and on information and belief, still is making, using, offering to
sell, selling, and/or importing into the United States, products that directly infringe, literally or
under the doctrine of equivalents, at least one claim of the 013 patent, without Crees
authorization or consent.
41.
On information and belief, Emson had actual notice of the 013 patent at least as
early as August 25, 2016 (see Exh. J) when Cree sent Emson a letter informing Emson of its
infringement. The notice letter identified the Asserted Patents, the accused product and the
infringing LED structure included in the accused TACLIGHT tactical flashlights. The notice
letter provided images of a counterfeit LED structure that is incorporated in the accused
TACLIGHT flashlights. Based on that letter, as early as August 25, 2016, Emson knew or
should have known that the accused products infringed at least one or more claims of the 013
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patent.
42.
On information and belief, Emson indirectly infringes the 013 patent either by
knowingly, actively, and with specific intent inducing others to directly infringe, or with willful
blindness to the fact that their product packaging and television commercials would induce
others to directly infringe. As of at least August 25, 2016, Emson knew or should have known
that their actions would induce actual infringement by others, including but not limited to, its
customers.
43.
On information and belief, Emsons infringement has been intentional and willful,
making this an exceptional case. Emson has known of the 013 patent since the filing of this
action and at least as early as August 25, 2016 (see Exh. J), but nonetheless has infringed and
continues to infringe the patent in a willful and deliberate disregard of Crees respective rights
therein and with the intent to infringe those rights.
44.
As a direct and proximate cause of Emsons infringement, as alleged above, Cree
has suffered damages. Emson is liable to Cree for the amount of any such damages.
45.
Emson will, on information and belief, continue to infringe upon Crees rights
under 271 of the Patent Act, unless and until it is enjoined by this Court. Cree has been and is
likely to continue to be irreparably injured unless Emson is enjoined. Cree has no adequate
remedy at law.
46.

47.
-9-
48.
49.
50.
Upon information and belief, the light emitting device in the TACLIGHT
flashlight infringes at least claim 1 of the 998 patent. See Exh. I-2. Emson sells and offers for
sale the infringing TACLIGHT flashlight in the United States.
51.

A semiconductor light emitting device comprising:
a solid alumina block;
a light emitting diode on a face of the solid alumina block; and
a flexible unitary film comprising silicone that extends conformally on the face of
the solid alumina block outside the light emitting diode and that also extends on the light
emitting diode, the flexible unitary film comprising silicone including therein a lens
comprising silicone adjacent the light emitting diode, such that the light emitting diode
emits light through the lens.
52.
device that includes each recited element of claim 1 of the 998 patent, including a
semiconductor light emitting device with a solid alumina block, a light emitting diode on a face
of the solid alumina block, and a flexible unitary film comprising silicone.
53.
- 10 -
54.
55.
patent.
56.
customers.
57.
- 11 -
58.
59.
remedy at law.
60.

61.

62.
63.
64.
Upon information and belief, the light emitting die package in the TACLIGHT
65.
- 12 -
A light emitting die package, comprising:

a substrate comprising a top surface, a bottom surface and a plurality of sides;
a thermal pad disposed in a middle portion of the bottom surface of the substrate; and
a plurality of traces disposed on opposing sides of and isolated from the thermal pad on
the bottom surface of the substrate.
66.
die package that includes each recited element of claim 1 of the 463 patent, including a substrate
with a top and bottom surfaces and a plurality of sides, a thermal pad disposed in a middle
portion of the bottom surface of the substrate, and a plurality of traces disposed on opposing
sides of and isolated from the thermal pad on the bottom surface of the substrate.
67.
68.
69.
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patent.
70.
customers.
71.
72.
73.
remedy at law.
- 14 -

74.

75.

76.
77.
78.
Upon information and belief, the light emitting die package in the TACLIGHT
79.

an electrically insulating substrate comprising a substantially planar top surface and a
substantially planar bottom surface;
a plurality of traces disposed on the top surface of the substrate;
a light emitting diode (LED) mounted on the top surface of the substrate and proximate a
center of the substrate, and the LED being connected to one or more traces of the plurality of
traces; and
a thermal contact pad disposed on the bottom surface of the substrate.
80.
As shown in Exhibit I-4, the TACLIGHT flashlight incorporates each recited
element of claim 1, including a light emitting die package with an electrically insulating
- 15 -
substrate, a plurality of traces on the top surface of the substrate, an LED mounted on the top
surface of the substrate proximate to the center of the substrate and connected to one or more
traces, and a thermal contact pad disposed on the bottom surface of the substrate.
81.
82.
83.
patent.
84.
- 16 -
customers.
85.
86.
87.
remedy at law.
88.

89.

90.
91.
- 17 -
92.
Upon information and belief, the LED package in the TACLIGHT flashlight
infringes at least claim 1 of the 850 patent. See Exh. I-5. Emson sells and offers for sale the
infringing TACLIGHT flashlight in the United States.
93.
An LED package, comprising:

a submount comprising a top surface and a bottom surface;
a plurality of top electrically and thermally conductive elements on said top surface of
said submount;
an LED on one of said top electrically and thermally conductive elements, an electrical
signal applied to said top electrically and thermally conductive elements causing said LED to
emit light, said top electrically and thermally conductive elements spreading heat from said LED
across the majority of said submount top surface;
a bottom thermally conductive element on said bottom surface not in electrical contact
with said top electrically and thermally conductive elements and conducting heat from said
submount;
a lens over said LED; and
a protective layer in direct contact with and extending from a bottom of said lens;
wherein at least a portion of said lens is above a top surface of said protective layer.
94.
As shown in Exhibit I-5, the TACLIGHT flashlight incorporates each element of
claim 1, including an LED package that has a submount with a top surface and a bottom surface,
a plurality of top electrically and thermally conductive elements on top surface that when an
electrical signal is applied causes the LED to emit light. The top electrically and thermally
conductive elements spread heat from the LED across the majority of the submount top surface.
- 18 -
The LED package also includes a recited bottom thermally conductive element for conducting
heat from the submount.
95.
96.
97.
patent.
98.
- 19 -
customers.
99.
100.
101.
remedy at law.
COUNT 6 PATENT INFRINGEMENT OF U.S. PAT. NO. D615,504
102.

103.
States, 35 U.S.C. 271 and 289.

104.
105.
- 20 -

106.
Upon information and belief, the light emitter package in the TACLIGHT
flashlight infringes the claim of the 504 patent. See Exh. I-6. Emson sells and offers for sale
the infringing TACLIGHT flashlight in the United States.
107.
The claim of the 504 patent recites:
The ornamental design for an emitter package, as shown and described.

108.
As shown in Exhibit I-6, the TACLIGHT flashlight incorporates an ornamental
design for an emitter package according to claim 1.

109.
110.
111.
- 21 -
should have known that the accused products infringed the 504 patent.
112.
113.
114.
remedy at law.
PRAYER FOR RELIEF

115.
Wherefore, Cree demands judgment against Emson, its affiliates, officers, agents,
servants, employees and all persons in active concert or participation with Emson, as follows:
116.
Entry of permanent injunctive relief prohibiting Emson from further acts of
infringement of the Asserted Patents. Such relief should prohibit at least the importing,
distributing, promoting, selling or offering for sale the TACLIGHT tactical flashlight product, or
any other flashlight or lighting product whose operation falls within the scope of the Asserted
Patents;
- 22 -
117.
An award to Cree of such damages as it shall prove at trial against Emson,
adequate to compensate Cree for Emsons infringement of the Asserted Patents, to include but
not limited to Emsons profits under 35 U.S.C. 289, and/or, Crees lost profits, but in no event,
an award of less than a reasonable royalty pursuant to 35 U.S.C. 284, together with
prejudgment interest;
118.
A declaration that Emson has infringed and is infringing the Asserted Patents;
119.
A declaration that the Asserted Patents are valid;
120.
A declaration that Emsons infringement is willful, and an award of enhanced
damages pursuant to 35 U.S.C. 284;

121.
A declaration that this is an exceptional case and an award of attorneys fees
pursuant to 35 U.S.C. 285;

122.
An award to Cree of the costs incurred by Cree in this action; and
123.
Such other and further relief as this Court shall deem proper and just.
Dated: November 11, 2016
Respectfully submitted,
CREE, INC.,
By its counsel,
/s/ Christopher M. Morrison
Christopher M. Morrison (BBO# 651335)
JONES DAY
100 High Street, 21st Floor
Boston, MA 02110-1781
Tel:
(617) 960-3939
Fax:
(617) 449-6999
Email: cmorrison@jonesday.com
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Blaney Harper (to be admitted pro hac vice)

Garfield B. Simms (BBO# 638996)
JONES DAY
51 Louisiana Ave., N.W.
Washington, DC 20001-2113
Tel: (202) 879-3939
Fax: (202) 626-1700
Email: bharper@jonesday.com
Email: gbsimms@jonesday.com
Attorneys for Plaintiff Cree, Inc.
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Case 1:16-cv-12275 Document 1-1 Filed 11/11/16 Page 1 of 2
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E. Mishan & Sons, Inc.
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(b)
(c)
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UNITED STATES DISTRICT COURT
DISTRICT OF MASSACHUSETTS
1. Title of case (name of first party on each side only) Cree, Inc. v. E. Mishan & Sons, Inc.
2. Category in which the case belongs based upon the numbered nature of suit code listed on the civil cover sheet. (See local
rule 40.1(a)(1)).
I.
410, 441, 470, 535, 830*, 891, 893, 895, R.23, REGARDLESS OF NATURE OF SUIT.
II.
110, 130, 140, 160, 190, 196, 230, 240, 290,320,362, 370, 371, 380, 430, 440, 442, 443, 445, 446, 448, 710, 720,
740, 790, 820*, 840*, 850, 870, 871.
III.
120, 150, 151, 152, 153, 195, 210, 220, 245, 310, 315, 330, 340, 345, 350, 355, 360, 365, 367, 368, 375, 385,
400,422, 423, 450, 460, 462, 463, 465, 480, 490, 510, 530, 540, 550, 555, 625, 690, 751, 791, 861-865, 890, 896,
950.
*Also complete AO 120 or AO 121. for patent, trademark or copyright cases.
3. Title and number, if any, of related cases. (See local rule 40.1(g)). If more than one prior related case has been filed in this
district please indicate the title and number of the first filed case in this court.
4. Has a prior action between the same parties and based on the same claim ever been filed in this court?
YES
NO
5. Does the complaint in this case question the constitutionality of an act of congress affecting the public interest?
2403)
YES
NO
YES
NO
(See 28 USC
If so, is the U.S.A. or an officer, agent or employee of the U.S. a party?
6. Is this case required to be heard and determined by a district court of three judges pursuant to title 28 USC 2284?
YES
NO
7. Do all of the parties in this action, excluding governmental agencies of the United States and the Commonwealth of
Massachusetts (governmental agencies), residing in Massachusetts reside in the same division? - (See Local Rule 40.1(d)).
YES
A.
NO
If yes, in which division do all of the non-governmental parties reside?

Eastern Division
B.
Central Division
Western Division
If no, in which division do the majority of the plaintiffs or the only parties, excluding governmental agencies,
residing in Massachusetts reside?
Eastern Division
Central Division
Western Division
8. If filing a Notice of Removal - are there any motions pending in the state court requiring the attention of this Court? (If yes,
submit a separate sheet identifying the motions)
YES
NO
(PLEASE TYPE OR PRINT)

ATTORNEY'S NAME Christopher M. Morrison
ADDRESS JONES DAY, 100 High Street, 21st Floor, Boston, MA 02110-1781
TELEPHONE NO. (617) 960-3939
(CategoryForm-201.wpd )
EXHIBIT A
Illlll llllllll Ill lllll lllll lllll lllll lllll 111111111111111111111111111111111

US007808013B2
c12)
(54)
(75)
United States Patent
(10)
Mendendorp, Jr. et al.
(45)
INTEGRATED HEAT SPREADERS FOR

LIGHT EMITTING DEVICES (LEDS) AND
RELATED ASSEMBLIES
Inventors: Nicholas W. Mendendorp, Jr., Raleigh,
NC (US); Peter Andrews, Durham, NC
(US)
(73)
Assignee: Cree, Inc., Durham, NC (US)
( *)
Notice:
Appl. No.: 11/590,480
(22)
Filed:
6/1996 Edmond et al.
5,604,135 A
5,631,190 A
5/1997 Negley
5,739,554 A
10/1998 Bhatt et al. ................. 428/209

6/1999 Negley
(Continued)
FOREIGN PATENT DOCUMENTS
DE
101 09 349
912002
(Continued)
Prior Publication Data

US 2008/0099770 Al
(52)
(58)
Oct. 5, 2010
Oct. 31, 2006
(65)
(51)
US 7,808,013 B2
5,523,589 A
5,817,405 A
5,912,477 A
Subject to any disclaimer, the term ofthis

patent is extended or adjusted under 35
U.S.C. 154(b) by 66 days.
(21)
Patent No.:
Date of Patent:
Int. Cl.
HOJL 33100
(2010.01)
HOJL 231495
(2006.01)
U.S. Cl. ......................................... 257/99; 257/675
Field of Classification Search ........... 257/78-103,
257/675, E33.072
See application file for complete search history.
(56)
OTHER PUBLICATIONS
May 1, 2008
U.S. Appl. No. 111197,096, filed Aug. 4, 2005 entitled "Packages for
Semiconductor Light Emitting Devices Utilizing Dispensed
Encapsulants and Methods of Packaging the Same".
(Continued)
Primary Examiner-Cuong Q Nguyen
(74) Attorney, Agent, or Firm-Myers Bigel Sibley &
Sajovec, P.A.
References Cited
U.S. PATENT DOCUMENTS
3,805,347
3,875,456
4,822,536
4,918,497
4,966,862
5,027,168
5,043,716
5,119,174
5,177,593
5,210,051
5,338,944
5,393,993
5,416,342
A
A
A
A
A
A
A
A
A
A
A
A
A
4/1974
4/1975
4/1989
4/1990
10/1990
6/1991
8/1991
6/1992
1/1993
5/1993
8/1994
2/1995
5/1995
Collins et al.
Kano et al.
Voinis et al.
Edmond
Edmond
Edmond
Latz et al.
Chen
Abe ............................ 257/98
Carter, Jr.
Edmond et al.
Edmond et al.
Edmond et al.
(57)
ABSTRACT
A light emitting device (LED) assembly may include an

electrically insulating substrate and a thermally conductive
layer on a surface of the insulating substrate. A light emitting
device may be on the thermally conductive layer so that the
thermally conductive layer is between the light emitting
device and the electrically insulating substrate. Moreover, the
thermally conductive layer may extend beyond an edge of the
light emitting device in at least one direction a distance
greater than half of a width of the light emitting device.
59 Claims, 5 Drawing Sheets

US 7,808,013 B2
Page 2
5,942,770
5,959,316
6,117,705
6,120,600
6,187,606
6,201,262
6,282,094
6,335,548
6,610,563
6,635,363
6,642,652
6,730,933
6,744,077
6,746,295
6,747,406
6,917,057
7,084,435
200110030326
2002/0057056
2002/0079837
2002/0123164
200210163001
2003/0006418
2003/0141510
2003/0211804
2004/0041222
2004/0056260
2004/0079957
A *
A
A *
A
Bl
Bl
Bl *
Bl *
Bl
Bl
B2
Bl
B2
B2
Bl
B2
B2 *
Al
Al
Al
Al
Al
Al
Al
Al
Al
Al
Al*
8/1999 Ishinaga et al. ............... 257 /89

9/1999 Lowery
912000 Glenn et al. ................ 438/106
912000 Edmond et al.
8/2001 Lo et al ...................... 361/704
112002 Roberts et al. ................ 257/98
8/2003 Wait! et al.
10/2003 Duclos et al.
1112003 Collins, III et al.
512004 Shimizu et al.
6/2004 Trottier et al.
6/2004 Song
6/2004 Bortscheller et al.
7/2005 Stokes et al.
8/2006 Sugimoto et al. ............. 257/99
10/2001 Reeh et al.
512002 Okazaki
612002 Okazaki
912002 Slater, Jr. et al.
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7/2003 Brunner et al.
1112003 Sorg
3/2004 Loh
3/2004 Slater, Jr. et al.
412004 Andrews et al. ............ 257/100
200410188696
2005/0122031
2005/0218421
2005/0221518
2005/0274957
2007/0235739
2008/0043444
Al *
Al*
Al
Al
Al
Al *
Al
912004 Hsing Chen et al ........... 257/99
6/2005
10/2005
10/2005
12/2005
10/2007
2/2008
Itai et al. .................... 313/498

Andrews et al.
Andrews et al.
Wang eta!.
Sun et al. ...................... 257/79
Hasegawa et al.

EP
EP
EP
JP
JP
JP
JP
JP
JP
JP
JP
JP
WO
WO
1 187 226
1 246 266
1760784
08032120
09027643
10-65220
10-190065
11026647
11-298050
2005317 596
2006128512
2006245032
WO 01115242
WO 2004/068594
A
A
A
A
3/2002
10/2002
3/2007
2/1996
111997
3/1998
7/1998
111999
10/1999
1112005
512006
912006
3/2001
8/2004
OTHER PUBLICATIONS
International Preliminary Report on Patentability for International
Application No. PCT/US2007/022576, mailed Oct. 14, 2008 (12
pages).
* cited by examiner
U.S. Patent
Oct. 5, 2010
US 7,808,013 B2
Sheet 1of5
103a
FIGURE lA
110b
""""'~~~~~~~,.,,.,.,.,.,..,~-105b
100b
103b
FIGURE lB
FIGURE lC
113
U.S. Patent
Oct. 5, 2010
Sheet 2 of 5
US 7,808,013 B2
U.S. Patent
Oct. 5, 2010
Sheet 3 of 5
US 7,808,013 B2
105f
122f
lOOf
FIGURE 2
302
111
lOOg
~~~~r-~~~1~13~gr~~~~~-103g
llOg'
FIGURE 3
U.S. Patent
Oct. 5, 2010
Sheet 4 of 5
US 7,808,013 B2
lOOh
105h
110h
FIGURE 4A
100i
lOli
110i
FIGURE 4B
U.S. Patent
US 7,808,013 B2
Sheet 5 of 5
Oct. 5, 2010
lOOk
101k
122k
~4k
402k
lllk
llOk
122k
112k
FIGURE 4C
FIGURE 5
sos

US 7,808,013 B2
1
INTEGRATED HEAT SPREADERS FOR

LIGHT EMITTING DEVICES (LEDS) AND
RELATED ASSEMBLIES
encapsulant into spaces or out of the cavity such that, when

cooled, it may not move back into the cavity. This could cause
delamination, voids, higher triaxial stresses and/or the like,
which may result in less robust light emitting devices.
Accordingly, there continues to exist a need in the art for more
effective methods for heat spreading and lowering thermal
resistances of LED systems.
FIELD OF THE INVENTION

This invention relates to semiconductor devices, and more
particularly to semiconductor light emitting devices and
related methods and packages.
SUMMARY
10
BACKGROUND
Light emitting diodes and laser diodes are well known solid
state electronic light emitting devices capable of generating
light upon application of a sufficient voltage. Light emitting
diodes and laser diodes may be generally referred to as light
emitting devices ("LEDs"). Light emitting devices generally
include a p-njunction formed in an epitaxial layer grown on
a substrate such as sapphire, silicon, silicon carbide, gallium
arsenide and the like. The wavelength distribution of the light
generated by the LED generally depends on the material from
which the p-n junction is fabricated and the structure of the
thin epitaxial layers that make up the active region of the
device.
Typically, an LED chip includes a substrate, an n-type
epitaxial region formed on the substrate and a p-type epitaxial
region formed on the n-type epitaxial region (or vice-versa).
To facilitate application of a voltage to the device, an anode
ohmic contact is formed on a p-type region of the device
(typically, an exposed p-type epitaxial layer) and a cathode
ohmic contact is formed on an n-type region of the device
(such as the substrate or an exposed n-type epitaxial layer).
To use an LED chip in a circuit, it is known to enclose an
LED chip in a package to provide environmental and/or
mechanical protection, color selection, focusing and the like.
An LED package also includes electrical leads, contacts or
traces for electrically connecting the LED package to an
external circuit. In a typical LED package, an LED chip is
mounted on a reflective cup by means of a solder bond or
conductive epoxy. One or more wirebonds connect the ohmic
contacts of the LED chip to leads which maybe attached to or
integral with the reflective cup. The reflective cup may be
filled with an encapsulant material containing a wavelength
conversion material such as a phosphor. Light emitted by the
LED at a first wavelength may be absorbed by the phosphor,
which may responsively emit light at a second wavelength.
The entire assembly is then encapsulated in a clear protective
resin, which may be molded in the shape of a lens to collimate
the light emitted from the LED chip. Some LED packages
have one or more LED chips mounted onto a carrier such as a
printed circuit board (PCB) carrier.
During operation of the LED or LEDs, large amounts of
heat may be generated. Much of the heat may be dissipated by
the substrate and the reflector cup, each of which may act as
a heatsink for the package. However, the temperature of the
package may still increase significantly during operation.
Substrates typically have low thermal conductivity. Additionally, while the reflective cup directs light upward, some light
may be absorbed by the reflector cup or there may be reasons
not to use a separate metal piece as a metal reflector.
Encapsulant materials, such as silicone gels, typically have
high coefficients of thermal expansion. As a result, when the
package heats up, the encapsulant material may expand. As
the lens is mounted within a channel defined by the sidewalls
of the reflector cup, the lens may travel up and down within
the sidewalls as the encapsulant material expands and contracts. Expansion of the encapsulant material may extrude the
15
20
25
30
35
40
45
50
55
60
65
According to some embodiments of the present invention,

a light emitting device (LED) assembly may include an electrically insulating substrate and a thermally conductive layer
on a surface of the insulating substrate. A light emitting
device may be on the thermally conductive layer so that the
thermally conductive layer is between the light emitting
device and the electrically insulating substrate. Moreover, the
thermally conductive layer may extend beyond an edge of the
light emitting device in at least one direction a distance
In addition, a plurality of thermally conductive vias may be
thermally coupled to the thermally conductive layer, and portions of the substrate adjacent the light emitting device may
be free of the thermally conductive vias. Moreover, the thermally conductive vias may extend from the thermally conductive layer through the electrically insulating substrate.
The thermally conductive layer may include a metal layer
such as a copper layer.
The thermally conductive layer may be electrically conductive, and the light emitting device assembly may also
include a first electrical coupling between a first terminal of
the light emitting device and the thermally conductive layer.
An electrode may be on the electrically insulating substrate
with the electrode and the thermally conductive layer being
electrically isolated, and a second electrical coupling may be
provided between a second terminal of the light emitting
device and the electrode.
The thermally conductive layer may be electrically conductive, and the light emitting device assembly may further
include first and second electrodes, each of which is electrically isolated from the thermally conductive layer. A first
electrical coupling may be provided between a first terminal
of the light emitting device and the first electrode, and a
second electrical coupling may be provided between a second
terminal of the light emitting device and the second electrode.
The thermally conductive layer may be electrically conductive, and the thermally conductive layer may be a substantially circular thermally conductive layer. Moreover, a first
portion of the substantially circular thermally conductive
layer may be electrically isolated from a second portion of the
substantially circular thermally conductive layer. In addition
or in an alternative, the substantially circular thermally conductive layer may include a plurality of notches around a
perimeter thereof. Moreover, each of the notches may extend
radially from the perimeter of the thermally conductive layer
toward the light emitting device. In addition, a conductive
trace on the electrically insulating substrate may extend from
the substantially circular thermally conductive layer.
According to additional embodiments of the present inventi on, a light emitting device assembly may include an electrically insulating substrate having opposing first and second
surfaces. A first thermally conductive layer may be provided
on the first surface of the electrically insulating substrate, and
a second thermally conductive layer may be provided on the
second surface of the electrically insulating substrate. In addition, a light emitting device may be provided on the first
thermally conductive layer so that the first thermally conduc-

US 7,808,013 B2
3
tive layer is between the light emitting device and the electrically insulating substrate. Moreover, a plurality of thermally
conductive vias may be thermally coupled between the first
and second thermally conductive layers, and portions of the
substrate between the light emitting device and the second
thermally conductive layer may be free of the thermally conductive vias.
The thermally conductive vias may extend from the first
thermally conductive layer through the electrically insulating
substrate to the second thermally conductive layer. In addition, the first thermally conductive layer may extend beyond
edges of the light emitting device a distance greater than half
of a width of the light emitting device. Each of the first and
second thermally conductive layer may include respective
first and second metal layers, such as respective copper layers, and the first thermally conductive layer may be electrically isolated from first and second terminals of the LED.
The first and second thermally conductive layers may be
electrically conductive, and the light emitting device assembly may further include a first electrical coupling between a
first terminal of the light emitting device and the first thermally conductive layer. An electrode may be provided on the
electrically insulating substrate with the terminal and the first
and second thermally conductive layers being electrically
isolated. A second electrical coupling may be provided
between a second terminal of the light emitting device and the
electrode.
The first and second thermally conductive layers may be
electrically conductive, and the light emitting device assembly may further include first and second electrodes, each of
which is electrically isolated from the first and second thermally conductive layers. A first electrical coupling may be
provided between a first terminal of the light emitting device
and the first electrode, and a second electrical coupling may
be provided between a second terminal of the light emitting
device and the second electrode.
The first thermally conductive layer may be electrically
conductive, and the first thermally conductive layer may be a
substantially circular thermally conductive layer. A first portion of the substantially circular thermally conductive layer
may be electrically isolated from a second portion of the
substantially circular thermally conductive layer. Moreover,
the substantially circular thermally conductive layer may
include a plurality of notches around a perimeter thereof. In
addition, a conductive trace on the electrically insulating
substrate may extend from the substantially circular thermally conductive layer.
According to still other embodiments of the present invention, a light emitting device (LED) assembly may include an
electrically insulating substrate and a substantially circular
thermally conductive layer on a surface of the insulating
substrate. A light emitting device may be provided on the
substantially circular thermally conductive layer so that the
substantially circular thermally conductive layer is between
the light emitting device and the electrically insulating substrate.
A first portion of the substantially circular thermally conductive layer may be electrically isolated from a second portion of the substantially circular thermally conductive layer.
The substantially circular thermally conductive layer may
include a plurality of notches around a perimeter thereof.
Moreover, each of the notches may extend radially from the
perimeter of the substantially circular thermally conductive
layer toward the light emitting device.
In addition, a conductive trace on the electrically insulating
substrate may extend from the substantially circular thermally conductive layer. The substantially circular thermally
conductive layer may extend beyond edges of the light emitting device a distance greater than half of a width of the light
emitting device. The substantially circular thermally conductive layer may include a metal layer.
The light emitting device assembly may further include a
second thermally conductive layer on a second surface of the
electrically insulating substrate so that the electrically insulating substrate is between the substantially circular thermally conductive layer and the second thermally conductive
layer. A plurality of thermally conductive vias may be thermally coupled between the substantially circular thermally
conductive layer and the second thermally conductive layer,
and portions of the substrate between the light emitting device
and the second thermally conductive layer may be free of the
thermally conductive vias. Moreover, first and second terminals of the light emitting device may be electrically isolated
from the substantially circular thermally conductive layer.
10
15
BRIEF DESCRIPTION OF THE DRAWINGS

20
25
30
FIGS. lA-E are cross-sectional views illustrating light

emitting device packages with a thermally conductive layer
according to some embodiments of the present invention.
FIGS. 2-3 are cross sectional views oflight emitting device
packages including lenses according to additional embodiments of the present invention.
FIGS. 4A-C are plan views illustrating thermally conductive layers of light emitting devices according to some
embodiments of the invention.
FIG. 5 is a perspective view illustrating multi-chip light
emitting device packages according to still other embodiments of the present invention.
DETAILED DESCRIPTION
35
40
45
50
55
60
65
The present invention will now be described more fully

with reference to the accompanying drawings, in which
embodiments of the invention are shown. This invention may,
however, be embodied in many different forms and should not
be construed as limited to the embodiments set forth herein.
Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the
scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be
exaggerated for clarity. Like numbers refer to like elements
throughout.
It will be understood that when an element such as a layer,
region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening
elements may also be present. It will be understood that if part
of an element, such as a surface, is referred to as "inner," it is
farther from the outside of the device than other parts of the
element. Furthermore, relative terms such as "beneath" or
"overlies" may be used herein to describe a relationship of
one layer or region to another layer or region relative to a
substrate or base layer as illustrated in the figures. It will be
understood that these terms are intended to encompass different orientations of the device in addition to the orientation
depicted in the figures. Finally, the term "directly" means that
there are no intervening elements. As used herein, the term
"and/or" includes any and all combinations of one or more of
the associated listed items.
It will be understood that, although the terms first, second,
etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one

US 7,808,013 B2
element, component, region, layer or section from another

region, layer or section. Thus, a first element, component,
region, layer or section discussed below could be termed a
second element, component, region, layer or section without
departing from the teachings of the present invention.
Embodiments of the invention are described herein with
reference to cross-sectional, perspective, and/or plan view
illustrations that are schematic illustrations of idealized
embodiments of the invention. As such, variations from the
shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected.
Thus, embodiments of the invention should not be construed
as limited to the particular shapes of regions illustrated herein
but are to include deviations in shapes that result, for example,
from manufacturing. For example, a region illustrated or
described as a rectangle will, typically, have rounded or
curved features due to normal manufacturing tolerances.
Thus, the regions illustrated in the figures are schematic in
nature and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit
the scope of the invention.
Unless otherwise defined, all terms (including technical
and scientific terms) used herein have the same meaning as
commonly understood by one of ordinary skill in the art to
which this invention belongs. It will be further understood
that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is
consistent with their meaning in the context of the relevant art
and this specification and will not be interpreted in an idealized or overly formal sense unless expressly so defined
herein.
Various embodiments of the present invention used to
package a semiconductor light emitting device will be
described herein. As used herein, the term semiconductor
light emitting device (LED) may include a light emitting
diode, laser diode and/or other semiconductor device which
includes one or more semiconductor layers, which may
include silicon, silicon carbide, gallium nitride and/or other
semiconductor materials. A light emitting device may or may
not include a substrate such as a sapphire, silicon, silicon
carbide and/or another microelectronic substrates. A light
emitting device may include one or more contact layers which
may include metal and/or other conductive layers. In some
embodiments, ultraviolet, blue and/or green light emitting
diodes may be provided. Red and/or amber LEDs may also be
provided. The design and fabrication of semiconductor light
emitting devices are well known to those having skill in the art
and need not be described in detail herein.
For example, semiconductor light emitting devices (LEDs)
discussed herein may be gallium nitride-based LEDs or lasers
fabricated on a silicon carbide substrate such as those devices
manufactured and sold by Cree, Inc. of Durham, N.C. The
present invention may be suitable for use with LEDs and/or
lasers as described in U.S. Pat. Nos. 6,201,262; 6,187,606;
6,120,600; 5,912,477; 5,739,554; 5,631,190; 5,604,135;
5,523,589; 5,416,342; 5,393,993; 5,338,944; 5,210,051;
5,027,168; 5,027,168; 4,966,862 and/or 4,918,497, the disclosures of which are incorporated herein by reference as if
set forth fully herein. Other suitable LEDs and/or lasers are
described in published U.S. Patent Publication No. US 2003/
0006418 Al entitled Group III Nitride Based Light Emitting
Diode Structures With a Quantum Well and Superlattice,
Group III Nitride Based Quantum Well Structures and Group
III Nitride Based Superlattice Structures, published Jan. 9,
2003, as well as published U.S. Patent Publication No. US
2002/0123164 Al entitled Light Emitting Diodes Including
Modifications for Light Extraction and Manufacturing Meth-
ods Therefor, the disclosures of which are hereby incorporated herein in their entirety by reference. Furthermore, phosphor coated LEDs, such as those described in U.S. Patent
Publication No. 2004/0056260Al, entitled Phosphor-Coated
Light Emitting Diodes Including Tapered Sidewalls and Fabrication Methods Therefor, the disclosure of which is incorporated by reference herein as if set forth fully, may also be
suitable for use in embodiments of the present invention. The
LEDs and/or lasers may be configured to operate such that
light emission occurs through the substrate. In such embodiments, the substrate may be patterned so as to enhance light
output of the devices as is described, for example, in the
above-cited U.S. Patent Publication No. US 2002/0123164
Al.
Referring to the embodiments of FIGS. lA-E, 2, 3, 4A-C,
and 5, each of substrates lOOa-k (also referred to as submounts) may have respective upper surfaces lOSa-k and
lower surfaces 103a-k as shown. Each of the substrates
lOOa-k may include a printed circuit board (PCB) substrate,
an aluminum block substrate, an alumina substrate, an aluminum nitride substrate, a sapphire substrate, and/or a silicon
substrate, and/or any other suitable substrate material, such as
a T-Clad thermal clad insulated substrate material, available
from The Bergquist Company of Chanhassen, Minn. A PCB
substrate may include standard FR-4 PCB, a metal-core PCB,
flex tape, and/or any other type of printed circuit board.
As illustrated in FIGS. lA-E, 2, 3, 4A-C, and5, a patterned
metal feature( s) may be formed on upper surfaces 1 OSa-k of
the respective substrates 1 OOa-k. The patterned metal feature
(s) may include a thermally conductive layer(s) ll2a-k,
meniscus control feature(s) 303 and/or 304 (as shown in FIG.
3), a wirebond pad(s) 305 (as shown in FIG. 3), and/or electrodes llOa-k and/or llla-k. The conductive features on top
surfaces lOSa-k of substrate lOOa-k may be formed, for
example, using a plating process. A plating process may be
used to plate a thin or thick metallic film on a substrate. In a
typical plating process, a titanium adhesion layer and a copper seed layer may be sequentially sputtered onto the substrate. Then, approximately 75 microns of copper may be
plated onto the copper seed layer. Alternatively, the adhesion
layer and seed layer may be sputtered using, for example, a
metal mask to form a desired pattern. A plating process may
also be used to form conductive metal vias through a substrate. In an alternative, a deposited metal film may be patterned using standard lithographic processes to provide metal
features on the substrate having desired patterns.
In some embodiments of the invention illustrated in FIG. 3,
first and second meniscus control features 303 and 304 may
be formed of a material different from the thermally conductive layer 112g and/or the wirebond pads 305. For example,
the meniscus control features 303 and 304 may comprise a
polymer such as a solder mask material including, for
example, polyimide. A polymer such as polyimide, for
example, may provide a suitable material for use as a meniscus control feature because polyimide may provide a relatively a low surface energy, which may provide improved
meniscus control properties.
Lateral dimensions (parallel to the substrate) and thicknesses of the thermally conductive layers ll2a-k may vary
based on the heat spreading properties of the materials used.
Heat spreading may be increased when a diameter or width
(parallel to the surface of the substrate) of the thermally
conductive layer 112a-kextends from an edge or edges of the
LED source ll4a-ka distance that is at least halfofthe width
of the LED source ll4a-k, and according to some embodiments of the present invention, a distance that is at least the
width of the LED source ll4a-k. Moreover, the thermally
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conductive layer ll2a-k may extend beyond edges of the

LED ll4a-k a distance greater than twice a thickness of the
thermally conductive layer. According to some embodiments
of the present invention, the thermally conductive layer
ll2a-k may include a layer of a metal (such as copper, aluminum, gold, tin, tin-silver, and/or copper-tin), a layer of a
ceramic (such as aluminum-nitride), and/or a layer ofa semiconductor material (such as silicon carbide). With a layer of
copper provided as a thermally conductive layer ll2a-k, the
copper thermally conductive layer(s) may be configured so
that a ratio ofa diameterorwidth (parallel to the surface of the
substrate) of the copper thermally conductive layer(s) ll2a-k
with respect to a thickness (perpendicular to the surface of the
substrate) may be in the range of at least about 25 to about
140. With a layer of aluminum provided as a thermally conductive layer ll2a-k, the aluminum thermally conductive
layer(s) may be configured so that a ratio of a diameter or
width (parallel to the surface of the substrate) of the aluminum thermally conductive layer(s) ll2a-k with respect to a
thickness (perpendicular to the surface of the substrate) may
be in the range of at least about 7 to about 50.
One or more of the electrodes llOa-kand/or llla-kmay be
formed on an upper surface 105a-kofthe respective substrate
lOOa-k. In addition, one or more lower electrodes llOc'-g'
and/or lllc'-g' may be formed on a lower surface 103c-g of
the respective substrate lOOc-g as shown in FIGS. lC-E, 2,
and 3. One or more conductive vias 122c-g may connect one
or more of the lower electrodes llOc'-g' and/or lllc'-g' to
various features on an upper surface 105c-g of the respective
substrate lOOc-g. For example, one of the conductive vias
122c-g and/or 122c'-g' may electrically connect electrodes
11 Oc-g and/or lllc-g with respective lower electrodes 11 Oc'g' and/or lllc'/g'. Accordingly, respective conductive features formed on upper surfaces 105c-g of substrates lOOc-g
may be formed of a same material. For example, the conductive features may include copper deposited using a plating
process.
In some other embodiments of the present invention, some
conductive features may include additional metals. For
example, the thermally conductive layer(s) ll2a-k may be
plated and/or coated with additional metals and/or other
materials to make the thermally conductive layer(s) ll2a-k
more suitable for mounting a respective LED chip ll4a-k
thereon. For example, the thermally conductive layer(s)
ll2a-k may be plated with additional layers such as, for
example, additional adhesive, bonding, reflector, die attach
pad and/or barrier layers (not shown). These layers can be in
addition to the thermally conductive layer, and these additional layers may also be thermally conductive. In an alternative, a direct die attach may be performed using flux instead of
Au/Sn solder paste to reduce a thermal resistance between an
LED ll4a-k and the respective thermally conductive layer
ll2a-k and/or to reduce voiding. Direct die attach may enable
use of a discrete zener device for ESD protection in another
area of the LED system. The LED(s) ll4a-k and respective
thermally conductive layer(s) ll2a-k may be configured to
provide coupling with vertical, planar, and/or flip-chip LEDs.
As illustrated in FIGS. lA-E, a thermally conductive layer
ll2a-e may be formed on an upper (primary) surface 105a-e
ofrespective substrate lOOa-e. As shown in FIGS. lC-lE, a
second thermally conductive layer 113c-e may also be
formed on a lower (secondary) surface 103c-e of the respective substrate 103C-E. As shown in FIGS. lD-E, thermally
conductive vias 201d-e may be thermally coupled between
first thermally conductive layer(s) ll2d-e and second thermally conductive layer(s) 113d-e. The thermally conductive
vias 201d-e may extend through the substrate lOOd-e to
improve thermal coupling between the first thermally conductive layer(s) ll2d-e and the second thermally conductive
layer(s) 113d-e.A profile of each via through the substrate (as
viewed from above or below the substrate) may take any
shape such as a circle, a square, a polygon, etc. Each thermally conductive via 201d-e may extend from any portion of
the respective thermally conductive layer 112. According to
some embodiments of the present invention, the thermally
conductive vias 201d-e may be provided between the LED
ll4d-e and the second thermally conductive layer 113d-e to
increase thermal conduction. According to some other
embodiments of the present invention, the thermally conductive vias 201d-e may be spaced apart from (or laterally offset
from) the respective LED 114d-e to improve a mechanical
coupling between the LED 114d-e and the thermally conductive layer ll2d-e. For example, a portion of the thermally
conductive layer ll2d-e that is free of thermally conductive
vias 201d-e may provide a more planar surface to improve
mechanical coupling with the LED 114d-e.
Because the thermally conductive layers ll2a-e and/or
113c-e may be formed using thin film technologies according
to some embodiments of the present invention, first and second thermally conductive layers ll2a-e and/or 113c-e may be
electrically isolated from the electrodes llOa-e and/or llla-e
as illustrated in FIGS. lA, lC, and/or lD. This electrical
isolation may be provided, for example, so that a material(s)
for the thermally conductive layer(s) and for the electrodes
may be different.As shown in FIGS. lA-E, wirebonds 128a-e
may be used to provide electrical coupling between the LEDs
ll4a-e and the respective electrodes llla-e. As shown in
FIGS. lA and lC-D, wirebonds 128a' and 128c'-d' may provide electrical coupling between LED's 114a and 114c-d and
respective electrodes llOa and llOc-d. As shown in FIG. lB,
the thermally conductive layer 112b and the electrode llOb
may be provided as a continuous/patterned layer of an electrically and thermally conductive material. For example, a
patterned layer layer of a thermally conductive material may
provide the thermally conductive layer 112b, the electrode
llOb, and a conductive trace therebetween. As shown in
FIGS. 4A-B, thermally conductive layer(s) ll2h-i may be
electrically coupled to respective electrode( s) lllh-i through
conductive trace(s) 402h-i. Second thermally conductive
layer 113e may be electrically coupled to an electrode llOe'
as shown in FIG. lE. The first thermally conductive layer
112e may be electrically coupled to an electrode 11 Oe' on the
lower surface 103e of the substrate lOOe through electrically
and thermally conductive vias 201e as shown in FIG. lE.
While not shown in FIGS. lA-E, structures of FIGS. lA-E
may be used together with lenses and/or reflection devices as
illustrated, for example, in FIGS. 2 and 3. Moreover, the
structure of FIG. 2 may be used with the lens of FIG. 3 and/or
the structure of FIG. 3 may be used with the lens of FIG. 2.
Moreover, structures including thermally conductive layers,
thermally/electrically conductive vias, LEDs, electrodes,
and/or substrates according to embodiments of the present
invention (as discussed, for example, with respect to FIGS.
lA-E, 2, 3, 4A-B, and 5) may be used with additional elements of LED packaging as discussed, for example, in U.S.
patent application Ser. Nos. 11/044,126 and 11/336,369, the
disclosures of which are incorporated herein by reference as
if set forth fully herein.
More particularly, the LED package of FIG. lA may
include a thermally conductive layer 112a between the LED
ll4a and the substrate lOOa, and the thermally conductive
layer 112a may extend beyond edges of the LED 114a a
distance greater than half a width of the LED 114a, and
according to some embodiments of the present invention, a
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distance that is greater than a width of the LED 114a. Moreover, the LED may be a horizontal LED such that both electrodes (i.e., the cathode and anode) thereof are on the surface
of the LED 114a opposite the substrate lOOa. Wirebonds
l28a and 128a' may provide electrical coupling between the
LED 114a and the electrodes llla and llOa. The lower
surface 103a of the substrate lOOa opposite the LED 114a
may thus be free of electrical connection. During operation,
heat from the LED may be spread through the thermally
conductive layer 112a and into the substrate lOOa. The thermally conductive layer 112a may include an electrically and
thermally conductive material such as copper. Moreover, the
backside 103a of the substrate lOOa may be thermally
coupled to a heat sink and/or to a thermally conductive portion of another substrate (such as a printed circuit board) so
that heat is conducted away from the substrate lOOa.
The LED package of FIG. lB may include a thermally
conductive layer 112b between the LED 114b and the substrate lOOb, and the thermally conductive layer 112b may
extend beyond edges of the LED 114b a distance greater than
halfa width of the LED 114b, and according to some embodiments of the present invention, a distance that is greater than
a width of the LED 114b. Moreover, the LED may be a
vertical LED such that the electrodes (i.e., the cathode and
anode) thereof are on opposite surfaces of the LED 114b.
Wirebond 128b may provide electrical coupling between a
first electrode of the LED 114b and the electrodes lllb. A
second electrode of the LED 114b may be coupled directly to
the thermally conductive layer 112b. As further shown in FIG.
lB, the thermally conductive layer 112b and the electrode
llOb and a trace therebetween may be formed from a same
layer of an electrically and thermally conductive material so
that a second wirebond is not required. As with the structure
of FIG. lA, the lower surface 103b of the substrate lOOb
opposite the LED 114b may thus be free of electrical connection. During operation, heat from the LED 114b may be
spread through the thermally conductive layer 112b and into
the substrate 1 OOb. The thermally conductive layer 112a may
include an electrically and thermally conductive material
such as copper. Moreover, the backside 103b of the substrate
lOOb may be thermally coupled to a heat sink and/or to a
thermally conductive portion of another substrate (such as a
printed circuit board) so that heat is conducted away from the
substrate lOOb. Ifthe LED 114b is a horizontal LED, a second
wirebond may be provided between the second electrode on a
surface of the LED 114b opposite the thermally conductive
layer 112b and the thermally conductive layer 112b.
The LED package of FIG. lC may include a thermally
conductive layer 112c between the LED 114c and the substrate lOOc, and the thermally conductive layer 112c may
extend beyond edges of the LED 114a a distance greater than
half a width of the LED 114c, and according to some embodiments of the present invention, a distance that is greater than
a width of the LED 114c. Moreover, the LED may be a
anode) thereof are on opposite surfaces of the LED 114c.
Wirebond 128c may provide electrical coupling between a
first electrode of the LED 114c and the electrode lllc. The
layer 112c may also be electrically conductive, and a second
electrode of the LED 114c may be coupled directly to the
thermally and electrically conductive layer 112c, and wirebond 128c' may provide electrical coupling between the thermally conductive layer 112c and the electrode llOc. In an
alternative, a conductive trace may be provided between the
thermally conductive layer 112c and the electrode llOc as
discussed above with respect to FIG. lB so that a second
wirebond is not required.
In FIG. lC, a second thermally conductive layer 113c may

be provided on a backside 103c of the substrate lOOc to
enhance coupling of heat from the substrate lOOc to a heat
sink and/or to a thermally conductive portion of another circuit board (such as a printed circuit board). During operation,
heat from the LED 114c may be spread through the thermally
conductive layer 112c and into the substrate lOOc and the
second thermally conductive layer 113c. The thermally conductive layers 112c and 113c may each include a thermally
conductive material such as copper. Moreover, the backside
103c of the substrate lOOc may be thermally coupled to aheat
sink and/or to a thermally conductive portion of another substrate (such as a printed circuit board) so that heat is conducted away from the substrate lOOc. If the LED 114c is a
horizontal LED, the second wirebond 128c' may be provided
between the second electrode on a surface of the LED 114c
opposite the thermally conductive layer 112c and the electrode llOc.
As further shown in FIG. lC, secondary electrodes lllc'
and llOc' may be provided on the backside 103c of the substrate lOOc, and the secondary electrodes lllc' and llOc' may
be electrically coupled to the electrodes lllc and 11 Ocon the
frontside 105c of the substrate lOOc through electrically conductive vias 122c and 122c'. The substrate lOOc can thus be
mounted on a printed circuit board with the secondary electrodes lllc' and llOc' providing electrical coupling to the
printed circuit board. In an alternative, conductive vias 122c
and 122c' and secondary electrodes lllc' and llOc' may be
omitted if electrical coupling to another substrate is provided
directly to the electrodes lllc and llOc.
Moreover, electrically conductive vias and secondary electrodes as discussed above with respect to FIG. lC may be
applied to the structures of FIGS. lA and/or lB according to
some embodiments of the present invention. For example,
secondary electrodes on the backside 103a of substrate 1 OOa
ofFIG. lAmay be electrically coupled to electrodes llla and
llOa using respective conductive vias through the substrate
lOOa. Similarly, secondary electrodes on the backside 103b
of substrate lOOb of FIG. lB may be electrically coupled to
electrodes lllb and llOb using respective conductive vias
through the substrate lOOb.
The LED package of FIG. lD may include a thermally
conductive layer 112d between the LED 114d and the substrate lOOd, and the thermally conductive layer 112d may
extend beyond edges of the LED 114d a distance greaterthan
halfa width of the LED 114d, and according to some embodiments of the present invention, a distance that is greater than
a width of the LED 114d. Moreover, the LED may be a
horizontal LED such that the electrodes (i.e., the cathode and
anode) thereof are on a surface of the LED 114d opposite the
substrate 1 OOd. Wirebonds 128d and 128d' may provide electrical coupling between electrodes of the LED 114d and the
electrodes llld and llOd.
In FIG. lD, a second thermally conductive layer 113d may
be provided on a backside 103d of the substrate lOOd to
enhance coupling of heat from the substrate 1OOd to a heat
sink and/or to a thermally conductive portion of another circuit board (such as a printed circuit board). In addition, thermally conductive vias 201d may improve thermal coupling
between the first thermally conductive layer 112d and the
second thermally conductive layer 113d. During operation,
heat from the LED 114d may be spread through the thermally
conductive layer 112d and through the thermally conductive
vias 201d to the second thermally conductive layer 113d. The
thermally conductive layers 112d and 113d and the thermally
conductive vias 201d may each include a thermally conductive material such as copper. Moreover, the backside 103d of
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the substrate lOOd may be thermally coupled to a heat sink

and/or to a thermally conductive portion of another substrate
(such as a printed circuit board) so that heat is conducted
away from the substrate lOOd.
Ifthe LED 114d is a vertical LED, a second electrode of the
LED 114d may be coupled directly to the thermally conductive layer 112d, and wirebond 128d' may provide electrically
coupling between the thermally conductive layer 112d and
the electrode llOd. In an alternative, a conductive trace may
be provided between the thermally conductive layer 112d and
the electrode 11 Od as discussed above with respect to FIG. lB
so that a second wirebond is not required.
As further shown in FIG. lD, secondary electrodes llld'
and llOd' may be provided on the backside 103d of the
substrate lOOd, and the secondary electrodes llld' and llOd'
may be electrically coupled to the electrodes llld and llOd
on the frontside 105d of the substrate 1 OOd through electrically conductive vias 122d and 122d'. The substrate 1 OOd can
thus be mounted on a printed circuit board with the secondary
electrodes llld' and llOd' providing electrical coupling to
the printed circuit board. In an alternative, conductive vias
122d and 122d' and secondary electrodes llld' and llOd'
may be omitted if electrical coupling to another substrate is
provided directly to the electrodes llld and llOd.
The LED package of FIG. lE may include a thermally
conductive layer 112e between the LED 114e and the substrate lOOe, and the thermally conductive layer 112e may
extend beyond edges of the LED 114e a distance greater than
half a width of the LED 114e, and according to some embodiments of the present invention, a distance that is greater than
a width of the LED 114e. Moreover, the LED may be a
anode) thereof are on opposite surfaces of the LED 114e.
Wirebond 128e may provide electrical coupling between a
first electrode of the LED 114e and the electrodes llle. A
second electrode of the LED 114e may be electrically and
mechanically coupled to the thermally conductive layer 112e.
In FIG. lE, a second thermally conductive layer 113e may
be provided on a backside 103e of the substrate lOOed to
enhance coupling of heat from the substrate 1 OOe to a heat
sink and/or to a thermally conductive portion of another circuit board (such as a printed circuit board). In addition, thermally conductive vias 201e may improve thermal coupling
between the first thermally conductive layer 112e and the
second thermally conductive layer 113e. During operation,
heat from the LED 114e may be spread through the thermally
conductive layer 112e and through the thermally conductive
vias 201e to the second thermally conductive layer 113e. The
thermally conductive layers 112e and 113e and the thermally
conductive vias 201e may each include a thermally conductive material such as copper. Moreover, the backside 103e of
the substrate lOOe may be thermally coupled to a heat sink
and/or to a thermally conductive portion of another substrate
(such as a printed circuit board) so that heat is conducted
away from the substrate lOOe. If the LED 114e is a horizontal
LED, a second electrode of the LED 114e may be coupled to
the thermally conductive layer 112e using a second wirebond.
As further shown in FIG. lE, secondary electrodes llle'
and llOe' may be provided on the backside 103e of the substrate lOOe. The secondary electrode llle' may be electrically coupled to the electrode llle on the frontside 105e of
the substrate lOOe through electrically conductive via 122e.
The secondary electrode llOe' may be electrically coupled to
the second thermally conductive layer 113e through a trace on
the backside 103e of the substrate lOOe. Accordingly, electrical coupling between the LED 114e and the electrode llOe'
may be provided through the first thermally conductive layer
112e, through the thermally conductive traces 201e, and

through the second thermally conductive layer 113e. According to some embodiments of the present invention, the secondary electrode llOe' and the second thermally conductive
layer 113e may be provided as portions of a same layer of an
electrically and thermally conductive layer and/or electrical
coupling to another substrate may be provided directly to the
second thermally conductive layer 113e. The substrate lOOe
can thus be mounted on a printed circuit board with the
secondary electrodes llle' and llOe' providing electrical
coupling to the printed circuit board.
Referring to FIG. 2, according to some embodiments of the
present invention, a metal and/or reflective cup (or ring) 212
may be provided around the LED 114{, and a pre-formed lens
210 may be secured within the reflective cup or ring 212 using
an adhesive material 211. An electrically insulating material
213 may be provided between the ring 212 and the substrate
100/and/orother layers (such as electrodes 110/and/or 111.f)
on the substrate 100/ The first and second thermally conductive layers 112/ and 113/may be thermally coupled using
thermally conductive vias 201f that extend through the substrate 100/to the second thermally conductive layer 113/ As
further illustrated in FIG. 2, the integrated heat spreading
system including the thermally conductive layers 112/ and
113/and the thermally conductive vias 201f may be electrically isolated from electrodes of the LED 114f and/or from
electrodes 110/, 110/, 111/, and/or 111/. Electrodes of the
LED 114fmay be electrically coupled to the electrodes HOA
and/or lllA by wirebonds 128/and 128/ Lenses and reflective cups may be fabricated as discussed, for example, in U.S.
patent application Ser. No. 11/044,126 entitled "Methods For
Packaging A Light Emitting Device And Packaged Light
Emitting Devices" and filed Jan. 27, 2005, the disclosure of
which is hereby incorporated herein in its entirety by reference.
As shown in FIG. 3, a light emitting device assembly may
include one or more encapsulated regions according to some
embodiments of the present invention. More particularly, a
first meniscus control feature 303 on the substrate lOOg may
encircle the thermally conductive layer 112g to define a
region confining an encapsulant material 301 on upper surface 105g of the substrate 1 OOg within the periphery of the
first meniscus control feature 303. A second meniscus control
feature 304 may surround the region 301 and, together with
the first meniscus control feature 303, may define an annular
(or ring-shaped) region confining a lens material 302 on the
upper surface 105g of the substrate 1 OOg surrounding the first
encapsulant region 301. The encapsulant material 301 may be
dispensed as a liquid confined by the first meniscus control
feature 303 and then cured. The lens material 302 may then be
dispensed as a liquid confined by the second meniscus control
feature 304 and then cured. The encapsulant material 301
and/or the lens material 302 may be an epoxy material(s ).
As illustrated in FIG. 3, the lens material 302 may enclose
and encompass the encapsulant material 301. While the lens
material 302 may be annular as discussed above, the lens
material 302 may be provided according to other shapes
depending on shapes of the first meniscus control feature 3 03
and the second meniscus control feature 304 and depending
on volumes of the encapsulant and/or lens materials dispensed. For example, the lens material may have an oval
periphery. It will be understood that for a feature to "encircle"
or "surround" a region, the feature need not be continuously
formed around the region. Although the figures illustrate continuous meniscus control features, it may be possible for a
meniscus control feature to include gaps or voids therein
which do not affect the meniscus control function of the
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feature. Moreover, the feature need not form a circle, but

could be provided in other two dimensional shapes such as
ellipses, polygons, etc.
As further shown in FIG. 3, the wirebond pads 3 05 and 3 05'
may be formed on the upper surface 105g of substrate 1OOg
within the lens region surrounded by the second meniscus
control feature 304. One of the conductive vias 122g may
electrically couple a wire bond pad 305 and/or 305' with a
respective lower electrode lllg' and/or llOg'. Another of the
electrically conductive vias 122g may electrically couple a
lower electrode lllg' and/or 11 Og' with a respective electrode
lllg and/or llOg on an upper surface 105g of the substrate
lOOg. In another alternative (not shown), an electrically and
thermally conductive via 201g may electrically couple the
thermally conductive layer 112g with a lower electrode lllg'
and/or 11 Og' so that a lower surface of a vertical LED may be
electrically coupled to one of the lower electrodes lllg' and/
or llOg' thereby eliminating one of the wirebonds 128g and/
or 128g'. Moreover, the structure including LED 114g; vias
122g, 122g', and 201g; thermally conductive layers 112g and
113g; wirebond pads 305 and 305'; and electrodes lllg,
lllg', llOg, and llOg' may be provided without encapsulant
material 301 and lens material 302 so that the LED 114g is
exposed as shown in FIGS. lA-E. In an alternative, the structure of FIG. 3 may be provided with the reflector and lens
structure of FIG. 2 instead of the encapsulant material and
lens material.
Lenses may be fabricated as discussed, for example, in
U.S. patent application Ser. No. 11/197,096 entitled "Packages for Semiconductor Light Emitting Devices Utilizing
Dispensed Encapsulants And Methods Of Packaging The
Same" and filed Aug. 4, 2005, and in U.S. patent application
Ser. No. 11/336,369 entitled "Packages For Semiconductor
Light Emitting Devices Utilizing Dispensed Reflectors And
Methods Of Forming Same" and filed Jan. 20, 2006. The
disclosures of both of the above referenced applications are
hereby incorporated herein in their entirety by reference.
the thermally conductive layer(s) 112a-g may be circular in a
plan view or may have other shapes such as an oval, a polygon, etc. By way of example, the thermally conductive layer
(s) 112a-g may be substantially circular as shown in FIGS.
4A-C. A substantially circular shape, for example, may efficiently spread heat while reducing Uilllecessary expansion
(due to heating) that may result from an increased distance
from an LED source 114a-g to corners of a square or rectangular thermally conductive layer.
As shown in the plan view FIG. 4A, an LED 114h may be
provided on a substantially circular thermally conductive
layer 112h. More particularly, the thermally conductive layer
ll2h may have a gap 401h therein electrically isolating a
portion 112h' of the thermally conductive layer 112h. A trace
402h may provide electrical coupling between the thermally
conductive layer 112h and electrode lllh, and a trace 403h
may provide electrical coupling between the portion 112h'
and electrode 11 Oh. With a horizontal LED 114h (having both
electrodes on an upper surface thereof), a first wirebond may
provide electrical coupling between the main portion of the
thermally conductive layer 112h and the LED 114h, and a
second wirebond may provide electrical coupling between
the portion 112h' and the LED 114h. The portion 112h' may
provide a relatively large area for a wirebond connection
without significantly reducing a heat spreading capacity of
the thermally conductive layer 112h. With a vertical LED
114H (having electrodes on opposite surfaces thereof), a first
surface of the LED 114h may be electrically and mechanically bonded (for example, using solder) to the main portion
of the thermally conductive layer 112h, and a wirebond may

provide electrical coupling of a second surface (opposite the
thermally conductive layer) to the portion 112h' of the thermally conductive layer.
According to still other embodiments of the present invention, the thermally conductive layer 112h may be electrically
isolated from the electrodes lllh and llOh (so that one or
both of traces 402h and/or 403h may be eliminated). Without
traces 402h and/or 403h, wirebonds may provide electrical
coupling between the LED 114h and electrodes lllh and/or
llOh. Moreover, a second thermally conductive layer (not
shown) may be provided on a surface of the substrate lOOh
opposite the thermally conducive layer 112h as shown, for
example, in FIGS. lC, lD, and lE, and/or thermally conductive vias through the substrate llOh may provide thermal
coupling between the thermally conductive layers on opposite sides of the substrate lOOh as shown, for example, in
FIGS. 1D and lE.
As shown in FIG. 4B, notches 404i may be provided in the
substantially circular thermally conductive layer 112i to
reduce stress/strain due to thermal expansion. Heat generated
by the LED 114i may thus be dissipated across the relatively
large thermally conductive layer 112i while reducing thermal
stress/strain across the thermally conductive layer. As shown
in FIG. 4B, the notches 404i may be spaced around peripheral
portions of the thermally conductive layer 112i. Moreover,
the notches 112i may extend radially toward the LED 112i to
reduce impedance of heat flow from the LED 114i toward
edges of the thermally conductive layer 112i. The electrodes
llli and llOi, the traces 402i and 403i, the conductive vias
122;, and the substrate 1oo; may be provided and/or function
as discussed above with respect to corresponding elements of
FIG. 4A.
As further shown in FIGS. 4A and 4B, the electrically
isolating gap 40lh-i of FIGS. 4A-B may be formed using a
solder mask when plating the thermally conductive layer, or
the gap may be formed by subsequently patterning the thermally conductive layer (for example, using photolithographic
mask and etch operations). This gap 401h or 401i may electrically isolate cathode and anode portions of the substantially
circular thermally conductive layer while providing significant heat spreading. Electrically conductive traces 402h-i
and/or 403h-i may electrically couple the portions ll2h-i
and/or ll2h'-i' of the thermally conductive layer to the electrodes llOh-i and/or llOh-i.
According to further embodiments of the present invention, a substantially circular thermally conductive layer 112k
may be electrically isolated from one or both of the electrodes
lllk and/or llOk as shown in FIG. 4C. Moreover, the gap of
FIGS. 4A and 4B may be omitted from the thermally conductive layer 112k, and notches 404kmay be substantially evenly
spaced around peripheral portions of the thermally conductive layer 112k. With three notches as shown in FIG. 4C, for
example, the notches 404k may be spaced by approximately
120 degrees around the substantially circular thermally conductive layer 112k. With four notches, the notches may be
spaced by approximately 90 degrees around the substantially
circular thermally conductive layer.
Moreover, the notches 112kmay extend radially toward the
LED 112k to reduce impedance of heat flow from the LED
ll4k toward edges of the thermally conductive layer 112k.
The electrodes lllk and llOk, the trace 402k, the conductive
vias 122k, and the substrate lOOk may be provided and/or
function as discussed above with respect to corresponding
elements of FIGS. 4A-B. By way of example, the LED may
be a vertical LED with a first surface electrically and
mechanically bonded (for example, soldered) to the thermally
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conductive layer, and a wirebond may provide electrical coupling between a second surface of the LED 114K and the
electrode llOk. In an alternative, the LED 114k may be a
horizontal LED with a first wirebond providing electrical
coupling between a first portion of the LED 114k and the
thermally conductive layer 112k and with a second wirebond
providing electrical coupling between a second portion of the
LED and the electrode llOk.
Any of the thermally conductive layers 112h, 112i, and/or
112kofFIGS. 4A-C may be electrically coupled to a second
thermally conductive layer on an opposite side of the substrate lOOh, lOOi, and/or lOOk, for example, using thermally
conductive vias. According to some embodiments of the
present invention, any such thermally conductive vias may be
offset relative to the LED 114h, 114i, and/or 114kto provide
a more planar surface to which the LED may be bonded.
According to other embodiments of the present invention, the
one or more thermally conductive vias may be provided
directly between the LED and the second thermally conductive layer on the opposite side of the substrate. Moreover, any
of the patterns of thermally conductive layers 112h, 112i,
and/or 112kdiscussedabovewithrespectto FIGS. 4A-C may
be used for the thermally conductive layers discussed herein
with respect to FIGS. lA-E, 2, 3, and/or 5. Moreover, each of
the substantially circular thermally conductive layers 112h,
112i, and/or 112kmay extend beyond edges of the respective
LED 114h, 114i, and/or 114k a distance that is greater than
half of a width of the LED, and according to some embodiments of the present invention, a distance that is greater than
a width of the LED.
Further embodiments of the present invention may include
a plurality of LEDs on a same substrate, such as a three-chipin series layout illustrated in FIG. 5. In FIG. 5, three LEDs
114j, 114/, and 114}" may be electrically coupled in series.
For purposes of illustration, each LED 114}, 114}', 114}" may
be provided in a configuration similar to that discussed above
with respect to FIG. lA. Electrodes lllj and/or 110} may be
electrically coupled to respective conductive traces 501}, and
additional conductive traces may be provided between LEDs
114j, 114/, and/or114j".As shown in FIG. 5, each LED 114j,
114j', and/or 114}" may be electrically coupled to traces using
respective wirebond pairs 128}, 128/, and/or 128}". As shown
in FIG. 5, the thermally conductive layers 112}, 112/, and/or
112}" may be electrically isolated from the electrodes 110}
and/or lllj and/or from traces 501}.
While a pairof wirebonds is provided for each LED in FIG.
5, a number of wirebonds and/or traces may be reduced by
providing wirebond connections directly between LEDs and/
or directly to the electrodes lllj and/or 110}. As further
shown in FIG. 5, horizontal LEDs may be used with both
electrical couplings to each LED on a surface of the LED
opposite the substrate 100}. With vertical LEDs, first electrical couplings may be from LEDs 114}, 114/, and/or 114}" to
the respective thermally conductive layer 112}, 112/, and/or
112}", and second electrical couplings may be provided using
wirebonds to surfaces of the LEDs 114}, 114}', and/or 114}"
opposite the substrate 100}.
Second thermally conductive layers may be provided on a
backside of the substrate 1 OOJ opposite the thermally conductive layers 112}, 112/, and/or 112}" as discussed above with
respect to FIGS. lC-E, 2, and 3. For example, a separate
second thermally conductive layer may be provided for each
of the first thermally conductive layers 112}, 112/, and/or
112}". If no electrical connections are provided to a backside
of the substrate 100}, a continuous second thermally conductive layer 505 may be provided across the backside 103} of the
substrate 100}. Moreover, thermally conductive vias may be
provided through the substrate 100} between one or more of

the thermally conductive layers 112}, 112/, and/or 112}" and
any such second thermally conductive layer on the backside
103} of the substrate 100}.
In addition, the series of LED chips 114}, 114/, 114}" may
also be coupled to an ESD (electrostatic discharge) protection
chip 502 (such as a zener diode). Integrated heat spreading,
according to embodiments of the present invention, may provide conditions more favorable for the use of thin film and
direct bond technologies, allowing multiple LED chips on a
single small form factor LED package. According to some
embodiments of the present invention, heat generated by such
a multi-chip assembly may be transferred away from the
LEDs more effectively.
Each of the thermally conductive layers 112}, 112/, and/or
112}" may be substantially circular and/or may include
notches therein as discussed above with respect to FIGS.
4A-C. Moreover, a reflective cup, a preformed lens, meniscus
control features, and/or liquid dispensed/cured lenses may be
provided forthe LED's 114}, 114j', and/or 114}" as discussed
above with respect to FIGS. 2 and/or 3.
A thermally conductive layer (e.g., thermally conductive
layers ll2a-k discussed above) according to some embodiments of the present invention may thus provide a heat
spreader that is integral with respect to the substrate (e.g.,
substrates lOOa-k discussed above) on which it is formed.
Thermal transport of heat from an LED (e.g., LEDs ll4a-k)
into the substrate and/or a heat sink can be improved, so that
the LED can be operated at higher power, for example, up to
5 Watts. Thermally conductive layers according to some
embodiments of the present invention may be formed using
thin film processing of highly conductive metals and photolithographic patterning. Thermally conductive layers according to some embodiments of the present invention may enable
direct flux die attach and/or attachment of a discrete zener
diode for ESD protection.
More particularly, the thermally conductive layers ll2a-k
discussed above with respect to FIGS. lA-E, 2, 3, 4A-C, and
5 may be formed, for example, by plating, sputtering, and/or
evaporating one or more layers of a metal( s) such as nickel,
copper, gold, and/or silver. Thermally conductive vias (e.g.,
conductive vias 201d-g) may be provided using a highly
thermally conductive material such as copper in a hole
through the substrate to aid thermal transport of heat through
the substrate. Moreover, the thermally conductive layers
ll2a-kmay enable a direct die attach of the LED ll4a-k, for
example, using flux instead of a gold/tin solder paste. A
thickness of a bond between the LED and the thermally
conductive layer may thus be reduced to improve a thermal
interface and to reduce voiding.
By providing relatively precise patterning of the thermally
conductive layer (for example, using photolithographic patterning) multiple LED chips may be provided on a same
substrate as shown, for example, in FIG. 5. For example,
multiple LEDs of a same color (such as red, blue, green, or
white) may be provided on a same substrate. In an alternative,
a combination of red, blue, and green LEDs may be provided
on a same substrate. In addition, direct die attachment may
enable provision of an LED and a discrete zener diode (for
ESD protection) on a same substrate as shown in FIG. 5. Use
of thin film technology may also enable provision of a thermally conductive layer and/or thermally conductive vias that
are electrically isolated as shown, for example, in FIGS. lA,
lD, 2, and 3. Stated in other words, the thermal path may be
electrically isolated.
a thermally conductive layer (e.g., layers ll2a-k) may be
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formed by sputtering a seed layer (such as a layer of titanium)

through a stencil to provide a desired pattern of the thermally
conductive layer on the substrate (e.g., substrates 1OOa-k). A
copper may then be plated on the seed layer. The seed layer
may have a thickness, for example, in the range of about 20
micrometers to about 150 micrometers, and the copper layer
may have a thickness of about 75 micrometers.
According to some other embodiments of the present
invention, a thermally conductive layer (e.g., layers ll2a-k)
may be formed by printing a paste (including a thermally
conductive metal) through a stencil and baking to remove
organics. The resulting metal layer may be subjected to an
anneal and/or a stamping operation to reduce porosity,
increase thermal conductivity, increase planarity, etc.
According to still other embodiments of the present inventi on, a thermally conductive layer (e.g., layers ll2a-k) may be
provided as a metal perform that is pressed into place, and the
perform may then be further subjected to an anneal to
improve adhesion to the substrate. Moreover, a thermally
conductive layer formed according to any of the techniques
discussed above may be further subjected to a rolling and/or
stamping operation to further improve characteristics thereof.
As discussed above with respect to FIGS. lA-K, 2-3,
4A-C, and 5, the LED ll4a-k may be centered relative to the
respective thermally conductive layer ll2a-k according to
some embodiments of the present invention. The LED ll4ak, however, is not required to be centered relative to the
respective thermally conductive layer ll2a-k according to all
embodiments of the present invention. The LED ll4a-k, for
example, may be offset relative to a center of the respective
thermally conductive layer ll2a-k according to some
embodiments of the present invention. Moreover, the LED
ll4a-k may be provided adjacent to an edge of the respective
thermally conductive layer ll2a-k so that the thermally conductive layer does not extend significantly beyond at least one
edge of the LED ll4a-k.
In the drawings and specification, there have been disclosed typical embodiments of the invention and, although
specific terms are employed, they are used in a generic and
descriptive sense only and not for purposes of limitation, the
scope of the invention being set forth in the following claims.
3. A light emitting device assembly according to claim 1,

wherein the continuous thermally conductive layer comprises
at least one of a metal layer, a ceramic layer, and/or a semiconductor layer.
wherein the continuous thermally conductive layer comprises
a copper layer.
wherein the continuous thermally conductive layer is electrically conductive, the light emitting device assembly further
comprising:
a first electrical coupling between a first terminal of the
light emitting device and the continuous thermally conductive layer;
an electrode on the electrically insulating substrate
wherein the electrode and the continuous thermally conductive layer are electrically isolated; and
a second electrical coupling between a second terminal of
the light emitting device and the electrode.
wherein the continuous thermally conductive layer is electrically conductive and wherein the light emitting device
includes first and second terminals on a surface of the light
emitting device opposite the continuous thermally conductive
layer, the light emitting device assembly further comprising:
first and second electrodes, each of which is electrically
isolated from the continuous thermally conductive
layer;
a first electrical coupling between the first terminal of the
light emitting device and the first electrode; and
a second electrical coupling between the second terminal
of the light emitting device and the second electrode.
wherein the continuous thermally conductive layer is electrically conductive and wherein the thermally conductive layer
comprises a substantially circular thermally conductive layer.
8. A light emitting device according to claim 1 wherein the
continuous thermally conductive layer extends beyond
opposing edges of the light emitting device a distance greater
than half of a width of the light emitting device.
9. A light emitting device according to claim 1 wherein the
continuous thermally conductive layer extends beyond an
edge of the light emitting device in at least one direction a
distance that is greater than a width of the light emitting
device.
10. A light emitting device assembly according to claim 1
wherein the thermally conductive layer comprises a first thermally conductive layer, the light emitting device further comprising:
a second thermally conductive layer adjacent a surface of
the electrically insulating substrate opposite the first
thermally conductive layer wherein the electrically insulating substrate is between the light emitting device and
the second thermally conductive layer in a direction
perpendicular with respect to a surface of the electrically
insulating substrate and wherein all portions of the electrically insulating substrate between the light emitting
device and the second thermally conductive layer in the
direction perpendicular with respect to the surface of the
electrically insulating substrate are free of the thermally
conductive vias so that portions of the light emitting
device and the first and second thermally conductive
layers are aligned in the direction perpendicular with
respect to the surface of the electrically insulating substrate.
That which is claimed is:

1. A light emitting device (LED) assembly comprising:
a continuous thermally conductive layer adjacent a surface
of the electrically insulating substrate;
a light emitting device adjacent the continuous thermally
conductive layer so that the continuous thermally conductive layer is between an entirety of the light emitting
device and the electrically insulating substrate, wherein
the continuous thermally conductive layer extends
beyond an edge of the light emitting device in at least one
direction a distance greater than half of a width of the
light emitting device; and
a plurality of thermally conductive vias through the electrically insulating substrate, wherein the plurality of
thermally conductive vias are thermally and electrically
coupled to the continuous thermally conductive layer
and wherein portions of the electrically insulating substrate adjacent the light emitting device are free of the
plurality of thermally conductive vias.
wherein the plurality of thermally conductive vias extend
from the continuous thermally conductive layer through the
electrically insulating substrate.
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thermally conductive layer is electrically conductive and
wherein the electrically insulating substrate comprises a
wherein the first thermally conductive layer comprises a
ceramic substrate.
substantially circular first thermally conductive layer;
a second thermally conductive layer adjacent the second
further comprising:
surface of the electrically insulating substrate so that the
a lens on the light emitting device so that the light emitting
electrically insulating substrate is between the first and
second thermally conductive layers;
device is between the lens and the ceramic substrate.
a light emitting device adjacent the first thermally conduc13. A light emitting device assembly according to claim 1
tive layer so that portions of the first thermally conducfurther comprising:
a reflector on the ceramic substrate around the light emit- 10
tive layer are between the light emitting device and the
ting device.
electrically insulating substrate in a direction perpen14. A light emitting device (LED) assembly comprising:
dicular with respect to a surface of the electrically insulating substrate, and so that the electrically insulating
substrate is between the light emitting device and pora thermally conductive layer adjacent a surface of the electrically insulating substrate, wherein the thermally con- 15
tions of the second thermally conductive layer in the
ductive layer is electrically conductive and wherein the
thermally conductive layer comprises a substantially cirelectrically insulating substrate; and
cular thermally conductive layer wherein the substana plurality of thermally conductive vias, wherein the plurality of thermally conductive vias are thermally coupled
tially circular thermally conductive layer comprises a
plurality of notches around a perimeter thereof;
between the first and second thermally conductive layers
20
and wherein portions of the electrically insulating suba light emitting device adjacent the thermally conductive
layer so that the thermally conductive layer is between
strate between the light emitting device and the second
the light emitting device and the electrically insulating
thermally conductive layer are free of the thermally conductive vias; and
substrate, wherein the thermally conductive layer
a conductive trace on the electrically insulating substrate,
extends beyond an edge of the light emitting device in at 25
wherein the conductive trace extends from the substanleast one direction a distance greater than half of a width
tially circular first thermally conductive layer.
of the light emitting device; and
a plurality of thermally conductive vias through the elec18.A light emitting device assembly according to claim 17,
trically insulating substrate, wherein the plurality of
wherein the plurality of thermally conductive vias extend
thermally conductive vias are thermally coupled to the 30 from the first thermally conductive layer through the electrithermally conductive layer and wherein portions of the
cally insulating substrate to the second thermally conductive
electrically insulating substrate adjacent the light emitlayer.
19.A light emitting device assembly according to claim 17,
ting device are free of the plurality of thermally conductive vias.
wherein the first thermally conductive layer extends beyond
15. A light emitting device assembly according to claim 14, 35 an edge of the light emitting device in at least one direction a
distance greater than half of a width of the light emitting
wherein each of the notches extends radially from the perimeter of the thermally conductive layer toward the light emitdevice.
ting device.
40 any edge of the light emitting device in at least one direction
a thermally conductive layer adjacent a surface of the eleca distance greater than a width of the light emitting device.
trically insulating substrate, wherein the thermally con21. A light emitting device assembly according to claim 17
ductive layer is electrically conductive and wherein the
thermally conductive layer comprises a substantially ciropposing edges of the light emitting device a distance greater
45 than half of a width of the light emitting device.
cular thermally conductive layer;
a light emitting device adjacent the thermally conductive
wherein each of the first and second thermally conductive
layer so that the thermally conductive layer is between
layers comprises at least one of a metal layer, a ceramic layer,
the light emitting device and the electrically insulating
and/or a semiconductor layer.
substrate, wherein the thermally conductive layer
extends beyond an edge of the light emitting device in at 50
least one direction a distance greater than half of a width
wherein the first thermally conductive layer and/or second
of the light emitting device;
thermally conductive layer comprises a copper layer.
a plurality of thermally conductive vias through the elecwherein the first thermally conductive layer is electrically
trically insulating substrate, wherein the plurality of
thermally conductive vias are thermally coupled to the 55 isolated from first and second terminals of the LED.
thermally conductive layer and wherein portions of the
electrically insulating substrate adjacent the light emitwherein the first and second thermally conductive layers are
ting device are free of the plurality of thermally conducelectrically conductive, the light emitting device assembly
tive vias; and
further comprising:
a conductive trace on the electrically insulating substrate, 60
wherein the conductive trace extends from the substanlight emitting device and the first thermally conductive
tially circular thermally conductive layer.
layer;
17. A light emitting device assembly comprising:
an electrode on the electrically insulating substrate
an electrically insulating substrate having opposing first
wherein the terminal and the first and second thermally
65
and second surfaces;
conductive layers are electrically isolated; and
a first thermally conductive layer adjacent the first surface
of the electrically insulating substrate wherein the first
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wherein the first and second thermally conductive layers are
electrically conductive, the light emitting device assembly
further comprising:
first and second electrodes, each of which is electrically
isolated from the first and second thermally conductive
layers;
light emitting device and the first electrode; and
the light emitting device and the second electrode.
wherein all portions of the electrically insulating substrate
between the light emitting device and the second thermally
conductive layer in the direction perpendicular with respect to
the surface of the electrically insulating substrate are free of
the plurality of thermally conductive vias.
ceramic substrate.
further comprising:
further comprising:
a reflector on the ceramic substrate around the light emitting device.
31.A light emitting device assembly according to claim 17
within an area defined by a perimeter of the light emitting
device are free of the thermally conductive vias.
of the electrically insulating substrate wherein the first
thermally conductive layer is electrically conductive and
wherein the first thermally conductive layer comprises a
substantially circular first thermally conductive layer
comprising a plurality of notches around a perimeter
thereof;
a light emitting device adjacent the first thermally conductive layer so that portions of the first thermally conductive layer are between the light emitting device and the
electrically insulating substrate in a direction perpendicular with respect to a surface of the electrically insulating substrate, and so that the electrically insulating
substrate is between the light emitting device and portions of the second thermally conductive layer in the
electrically insulating substrate; and
a plurality of thermally conductive vias, wherein the plurality of thermally conductive vias are thermally coupled
and wherein portions of the electrically insulating substrate between the light emitting device and the second
thermally conductive layer are free of the thermally conductive vias.
a substantially circular thermally conductive layer adjacent
a surface of the insulating substrate; and
a light emitting device adjacent the substantially circular

thermally conductive layer so that the substantially circular thermally conductive layer is between the light
emitting device and the electrically insulating substrate,
wherein an edge of the substantially circular thermally
conductive layer extends laterally beyond an edge of the
light emitting device;
wherein the substantially circular thermally conductive
layer includes a plurality of notches around a perimeter
thereof.
wherein a first portion of the substantially circular thermally
conductive layer is electrically isolated from a second portion
of the substantially circular thermally conductive layer.
wherein each of the notches extends radially from the perimeter of the substantially circular thermally conductive layer
toward the light emitting device.
further comprising:
wherein the conductive trace extends from the substantially circular thermally conductive layer.
wherein the substantially circular thermally conductive layer
extends beyond an edge of the light emitting device a distance
extends beyond an edge of the light emitting device a distance
greater than a width of the light emitting device.
extends beyond opposing edges of the light emitting device a
distance greater than half of a width of the light emitting
device.
comprises at least one of a metal layer, a ceramic layer, and/or
a semiconductor layer.
further comprising:
a second thermally conductive layer adjacent a second
electrically insulating substrate is between the substantially circular thermally conductive layer and the second
thermally conductive layer; and
a plurality of thermally conductive vias, wherein the plurality of thermally conductive vias are thermally and
physically coupled between the substantially circular
thermally conductive layer and the second thermally
conductive layer and wherein portions of the substrate
between the light emitting device and the second thermally conductive layer are free of the plurality of thermally conductive vias.
42. A light emitting device according to claim 41 wherein
first and second terminals of the light emitting device are
electrically isolated from the substantially circular thermally
conductive layer.
further comprising:
a second thermally conductive layer adjacent a second
electrically insulating substrate is between the substantially circular thermally conductive layer and the second
thermally conductive layer; and
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a plurality of thermally conductive vias, wherein the plurality of thermally conductive vias are thermally and
physically coupled between the substantially circular
thermally conductive layer and the second thermally
conductive layer and wherein the plurality of thermally
conductive vias extend through portions of the electrically insulating substrate outside a region of the electrically insulating substrate defined by a periphery of the
light emitting device.
extends continuously from the light emitting device to portions of the perimeter between each of the notches.
conductive layer in a direction perpendicular with respect to
a surface of the electrically insulating substrate are free of the
plurality of thermally conducive vias.
conductive layer in a direction perpendicular with respect to
a surface of the electrically insulating substrate are free of the
plurality of thermally conductive vias.
ceramic substrate.
further comprising:
further comprising:
an electrically insulating ceramic substrate having opposing first and second faces;
a first thermally conductive layer on a first surface of the
ceramic substrate;
a second thermally conductive layer on the second surface
of the ceramic substrate so that the ceramic substrate is
between the first and second thermally conductive layers, wherein the second thermally conductive layer is
electrically isolated from the first thermally conductive
layer; and
a light emitting device on the first thermally conductive
layer so that the first thermally conductive layer is
between the light emitting device and the ceramic substrate, wherein portions of the light emitting device and
the first and second thermally conductive layers are
aligned in a direction perpendicular with respect to a
surface of the light emitting device wherein the first
thermally conductive layer comprises a continuous thermally conductive layer between an entirety of the light
emitting device and the ceramic substrate.
wherein the first and second thermally conductive layers
comprise respective first and second thermally conductive
metal layers.
wherein the light emitting device is a vertical light emitting
device with a first terminal on a surface of the light emitting
device adjacent the first thermally conductive metal layer and
a second terminal on a surface of the light emitting device
opposite the first thermally conductive metal layer, the light

emitting assembly further comprising:
a wire bond pad spaced apart from the first thermally conductive metal layer on the first surface of the ceramic
substrate; and
a wire bond providing an electrical connection between the
second terminal of the light emitting device and the wire
bond pad.
further comprising:
first and second electrodes on the second face of the electrically insulating ceramic substrate wherein the first and
second electrodes are spaced apart and electrically isolated from the second thermally conductive metal layer;
a first electrically conductive via providing electrical coupling between the first thermally conductive metal layer
and the first electrode through the ceramic substrate; and
a second electrically conductive via providing electrical
coupling between the wire bond pad and the second
electrode through the ceramic substrate.
wherein the ceramic substrate comprises an alumina substrate.
further comprising:
further comprising:
of the electrically insulating substrate;
a light emitting device adjacent the first thermally conductive layer so that portions of the first thermally conductive layer are between the light emitting device and the
electrically insulating substrate in a direction perpendicular with respect to a surface of the electrically insulating substrate, and so that the electrically insulating
substrate is between the light emitting device and portions of the second thermally conductive layer in the
electrically insulating substrate so that portions of the
light emitting device and the first and second thermally
conductive layers are aligned in the direction perpendicular with respect to the surface of the electrically
insulating substrate; and
a plurality of thermally conductive vias, wherein the plurality of thermally conductive vias are thermally coupled
and wherein portions of the electrically and the second
thermally conductive layer are free of the thermally conductive vias;
wherein the plurality of thermally conductive vias are outside an area of the first thermally conductive layer
defined by a perimeter of the light emitting device.
wherein the first thermally conductive layer is electrically
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conductive and wherein the first thermally conductive layer
comprises a substantially circular first thermally conductive
layer, further comprising:
wherein the conductive trace extends from the substantially circular first thermally conductive layer.
26
wherein an area of the first thermally conductive layer defined

within a perimeter of the light emitting device is free of all
thermally conductive vias.
5
* * * * *

UNITED STATES PATENT AND TRADEMARK OFFICE
CERTIFICATE OF CORRECTION
PATENT NO.
APPLICATION NO.
DATED
INVENTOR(S)
: 7,808,013 B2
: 11/590480
: October 5, 2010
: Medendorp, Jr. et al.
Page 1of1
It is certified that error appears in the above-identified patent and that said Letters Patent is hereby corrected as shown below:
On Title Page:
Item (75) Inventors: Please correct "Nicholas W. Mendendorp, Jr."
to read -- Nicholas W. Medendorp, Jr. -Item (56) References Cited, Page 2, U.S. Patent Documents: Please correct by
adding -- 6,604, 135 * 2/1997 Edmond et al. -Other Publications: Please correct by adding -- International Search Report
and Written Opinion for PCT/US2007/022576; date of
mailing 03/10/2008 -and -- U.S. Patent Application 11/336,369 filed January
20, 2006 entitled "Packages for Semiconductor Light
Emitting Devices Utilizing Dispensed Reflectors and
Methods of forming Same". -In the Claims:
Column 24, Claim 57, Line 60: Please correct "electrically and the second"
to read -- electrically insulating substrate between
the light emitting device and the second --
Signed and Sealed this

Twenty-ninth Day of March, 2011
ffa:.1 J:k~
David J. Kappos
Director of the United States Patent and Trademark Office
EXHIBIT B

US007858998B2
c12)
(54)
(10)
Negley
(45)
Patent No.:
Date of Patent:
US 7 ,858,998 B2
Dec. 28, 2010
SEMICONDUCTOR LIGHT EMITTING

DEVICES INCLUDING FLEXIBLE SILICONE
FILM HAVING A LENS THEREIN
5,027,168 A
6/1991 Edmond
5,210,051 A
5/1993 Carter, Jr.
5,277,840 A
1/1994 Osaka et al.
(75)
Inventor:
5,338,944 A
5,393,993 A
(73)
5,416,342 A
( *)
Notice:
Gerald H. Negley, Carrboro, NC (US)

U.S.C. 154(b) by 303 days.
(21)
Appl. No.: 12/031,951
(22)
Filed:
Feb.15,2008
(65)
(Continued)
JP
Jun. 19,2008
(Continued)
Related U.S. Application Data
OTHER PUBLICATIONS
(62)
Division of application No. 10/811,598, filed on Mar.

29, 2004, now Pat. No. 7,355,284.
(51)
Int. Cl.
HOJL 33156
(2010.01)
HOJL 33158
(2010.01)
U.S. Cl. ........................... 257/98; 257/99; 257/100;
257/E33.059; 257/E33.073; 313/502; 313/503;
313/511; 313/512
Field of Classification Search . ... ... ... . 257/98-100,
257/E33.059, E33.073; 313/502-503, 511,
313/512
(58)
5/1982

US 2008/0142829 Al
(52)
57076885
(56)
Notification of Transmittal of the International Search Report and the

Written Opinion of the International Searching Authority, or the
Declaration, International Search Report, and Written Opinion of the
International Searching Authority, PCT/US2005/001714, Nov. 3,
2005.
(Continued)
Primary Examiner-Jerome Jackson, Jr.
Assistant Examiner-Yu Chen
(74) Attorney, Agent, or Firm-Myers Bigel Sibley &
Sajovec, P.A.
(57)
References Cited
ABSTRACT

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Page 2
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A
A
A
A
A
A
A
A
A
A
A
A
Bl
Bl
Bl
Bl
Bl
Bl
Bl
Bl *
Bl
B2
B2
B2
B2
Bl
B2
B2
B2
B2
B2
B2 *
B2
B2
B2
B2
Bl
B2
B2
B2
B2
B2
B2
B2
B2
B2 *
B2
B2
B2
B2
B2
B2
Al
Al*
Al
Al
Al
Al
Al
Al *
Al
Al
Al
Al
Al
Al
Al
Al
Al
Al
6/1996
2/1997
5/1997
4/1998
9/1998
111999
6/1999
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12/1999
212000
512000
612000
912000
2/2001
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5/2001
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612002
1112002
12/2002
212003
212003
4/2003
6/2003
1112004
112005
212005
212005
7/2005
212006
412006
8/2006
10/2006
212007
3/2007
3/2007
5/2007
5/2007
7/2007
8/2007
9/2007
112008
4/2008
9/2008
12/2008
112009
3/2009
1112009
1112009
5/2010
5/2010
5/2010
712002
8/2002
912002
112003
1112003
412004
7/2004
1112004
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412005
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US 7,858,998 B2
Page 3
International Searching Authority, PCT/US2007/012158, Nov. 3,
2008.
Kato, Presentation "Luxeon A New World of Light", Sep. 14,
2004, 19 pp.
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* cited by examiner
U.S. Patent
Dec. 28, 2010
US 7 ,858,998 B2
Sheet 1of3
160
1100
120
15Z-p11oa\
D
110
FIG. 1
160
110a
120
llOb
FIG. 2
11Q
llOa
120
FIG. 3
110a
120
110b
FIG. 4
110
110a
120
110b
110
FIG. 5
U.S. Patent
Dec. 28, 2010
US 7 ,858,998 B2
Sheet 2 of 3
120c
120d
120
130
120c
llOb
110a
FIG. 6
110
120c
120
120c
110b
FIG. 7
110
120
110a
FIG. 8
110
930
120
110
FIG. 9
U.S. Patent
Dec. 28, 2010
Sheet 3 of 3
US 7 ,858,998 B2
FIG. 10
120
~10
llOa
170
110
170
170
FIG. 11
120
110a
FIG. 12

US 7,858,998 B2
1
SEMICONDUCTOR LIGHT EMITTING

DEVICES INCLUDING FLEXIBLE SILICONE
FILM HAVING A LENS THEREIN
the plastic shell, on the semiconductor light emitting device

and/or between the device and the shell. This technique may
be referred to as a "glob top". The phosphor coatings may also
incorporate an index matching material and/or a separate
index matching material may be provided. LEDs that employ
phosphor coatings are described, for example, in U.S. Pat.
Nos. 6,252,254; 6,069,440; 5,858,278; 5,813,753; 5,277,840;
and 5,959,316.
Unfortunately, the packaging for a semiconductor light
emitting device may be costly and, in some cases, more costly
than the semiconductor light emitting element itself. Moreover, the assembly process also may be costly, time consuming and/or subject to failures.
CROSS REFERENCE TO RELATED

APPLICATION
This application is a divisional of application Ser. No.
10/811,598, filed Mar. 29, 2004 now U.S. Pat. No. 7,355,284,
entitled Semiconductor Light Emitting Devices Including
Flexible Film Having Therein An Optical Element, assigned
to the assignee of the present application, the disclosure of
which is hereby incorporated herein by reference in its
entirety as if set forth fully herein.
10
15
SUMMARY OF THE INVENTION
FIELD OF THE INVENTION

This invention relates to semiconductor light em1ttmg
devices and fabricating methods therefor, and more particularly to packaging and packaging methods for semiconductor
light emitting devices.
20
BACKGROUND OF THE INVENTION

Semiconductor light emitting devices, such as Light Emitting Diodes (LEDs) or laser diodes, are widely used for many
applications. As is well known to those having skill in the art,
a semiconductor light emitting device includes a semiconductor light emitting element having one or more semiconductor layers that are configured to emit coherent and/or
incoherent light upon energization thereof. It is also known
that the semiconductor light emitting element generally is
packaged to provide external electrical connections, heat
sinking, lenses or waveguides, environmental protection and/
or other functions for the semiconductor light emitting
device. Packaging may be provided, at least in part, by at least
partially surrounding the semiconductor light emitting device
with a dome-shaped transparent plastic shell.
For example, it is known to provide a two-piece package
for a semiconductor light emitting device wherein the semiconductor light emitting element is mounted on a substrate of,
for example, alumina, aluminum nitride and/or other materials, which include electrical traces thereon, to provide external connections for the semiconductor light emitting element.
A second substrate, which, for example, may be silver plated
copper, is mounted on the first substrate, for example using
glue, surrounding the semiconductor light emitting element.
A lens may be placed on the second substrate over the semiconductor light emitting element. Light emitting diodes with
two-piece packages as described above are described in application Ser. No. 10/446,532 to Loh, entitled Power Surface
Mount Light Emitting Die Package, filed May 27, 2003, now
U.S. Pat. No. 7,264,378, assigned to the assignee of the
present invention, the disclosure of which is hereby incorporated herein by reference in its entirety as if set forth fully
herein.
It is often desirable to incorporate phosphor into a semiconductor light emitting device, to enhance the emitted radiation in a particular frequency band and/or to convert at least
some of the radiation to another frequency band. Phosphors
may be included in a semiconductor light emitting device
using many conventional techniques. In one technique, phosphor is coated inside and/or outside the plastic shell. In other
techniques, phosphor is coated on the semiconductor light
emitting device itself, for example using electrophoretic
deposition. In still other techniques, a drop of a material such
as epoxy that contains phosphor therein may be placed inside
25
30
35
40
45
50
55
60
65
Some embodiments of the present invention provide semiconductor light emitting devices that include a substrate having a face, a flexible film that includes therein an optical
element, on the face, and a semiconductor light emitting
element between the substrate and the flexible film and configured to emit light through the optical element. In some
embodiments, an optical coupling media, such as optical gel,
is provided between the optical element and the semiconductor light emitting element. In some embodiments, the face
includes a cavity therein, and the semiconductor light emitting element is in the cavity. The flexible film extends onto the
face beyond the cavity, and the optical element overlies the
cavity. In some embodiments, an optical coupling media is
provided in the cavity. Semiconductor light emitting devices
may be assembled, according to various embodiments of the
present invention, by mounting a semiconductor light emitting element on a substrate face, and attaching a flexible film
that includes therein an optical element to the substrate face
such that, in operation, the semiconductor light emitting element emits lights through the optical element. An optical
coupling media may be placed between the semiconductor
light emitting element and the optical coupling element.
Many different configurations of optical elements may be
provided according to various embodiments of the present
invention. In some embodiments, the optical element
includes (i.e., comprises) a lens. In other embodiments, the
optical element includes a prism. In other embodiments, the
flexible film includes a first face adjacent the substrate and a
second face remote from the substrate, and the optical element includes a first optical element on the first face, and a
second optical element on the second face, both of which are
located such that the light emitting element emits light
through the first optical element and the second optical element. In some embodiments, the optical element includes
phosphor and/or other optical emission enhancing and/or
converting elements. In still other embodiments, the optical
element includes an optical scattering element. Combinations
and subcombinations of these and/or other optical elements
also may be provided. Moreover, an optical coupling media
may be provided between the optical element and the semiconductor light emitting element in any of these embodiments.
Many configurations of the flexible film also may be provided according to various embodiments of the present invention. For example, in some embodiments, at least a portion of
the flexible film that overlies the cavity is transparent to the
light, and at least a portion of the flexible film that extends
onto the face beyond the cavity is opaque to the light. In other
embodiments, at least a portion of the flexible film that overlies the cavity includes a first material and at least a portion of
the flexible film that extends onto the face beyond the cavity

US 7,858,998 B2
3
includes a second material. In still other embodiments, the

semiconductor light emitting element includes a wire that
extends towards and contacts the flexible film in the cavity,
and the flexible film includes a transparent conductor in the
cavity that electrically connects to the wire. Combinations
and subcombinations of these and/or other configurations of
flexible film also may be provided.
In other embodiments, an attachment element also is provided that is configured to attach the flexible film and the
substrate to one another. Many conventional attachment techniques can be used to provide an attachment element.
Some embodiments of the present invention may be configured to incorporate phosphor into the semiconductor light
emitting device. In some embodiments, phosphor is provided
on the flexible film between the lens and the semiconductor
light emitting element. In other embodiments, the lens
includes a concave inner surface adjacent the semiconductor
light emitting element, and the phosphor includes a conformal phosphor layer on the concave inner surface. In yet other
embodiments, the optical element includes a lens that overlies
the cavity and protrudes away from the cavity, the flexible
film further includes a protruding element between the lens
and the light emitting element that protrudes towards the
cavity, and a conformal phosphor coating is provided on the
protruding element. Combinations and subcombinations of
these and/or other configurations of phosphor also may be
provided. Moreover, an optical coupling media may be provided between the phosphor and the semiconductor light
emitting element in any of these embodiments.
In still other embodiments of the present invention, the
semiconductor light emitting element includes a wire that
extends towards the flexible substrate. In some of these
embodiments, the optical element includes a prism that is
configured to reduce shadowing by the wire, of the light that
is emitted from the semiconductor light emitting element.
Multiple semiconductor light emitting elements and/or
optical elements may be incorporated in a semiconductor
light emitting device according to various embodiments of
the present invention. Each semiconductor light emitting element may be included in its own individual cavity and/or
multiple semiconductor light emitting elements may be
included in a single cavity. Moreover, in some embodiments,
the same phosphor may be included on the flexible film for
each optical element. In other embodiments, different phosphors may be used. For example, a first phosphor layer and a
first semiconductor light emitting element may be configured
to generate red light, a second phosphor layer and a second
semiconductor light emitting element may be configured to
generate blue light, and a third phosphor layer and a third
semiconductor light emitting element may be configured to
generate green light. Combinations and subcombinations of
these and/or other multiple semiconductor light emitting elements and/or multiple optical elements also may be provided.
Finally, combinations and subcombinations of these and/or
other optical elements, flexible films, phosphor and/or mu!tip le elements may be provided, according to various embodiments of the present invention.
Semiconductor light emitting devices according to yet
other embodiments of the present invention include a substrate comprising alumina, a light emitting diode on a face of
the substrate, and a flexible film comprising silicone on the
face of the substrate and on the light emitting diode. The
flexible film comprising silicone includes therein a lens comprising silicone adjacent the light emitting diode, such that the
light emitting diode emits light through the lens. In other
embodiments, the flexible film comprising silicone is
attached to the substrate, such that the flexible film compris-
ing silicone conforms to the light emitting diode as it expands

and contracts during operation thereof. Phosphor also may be
provided between the lens and the light emitting diode. Various embodiments of the flexible silicone film, the lens, the
phosphor and/or other elements may be provided according
to any of the other embodiments described herein.
10
15
20
25
30
35
40
45
50
55
60
65
FIG. 1 is an exploded cross-sectional view of semiconductor light emitting devices and fabrication methods therefor,
according to various embodiments of the present invention.
FIGS. 2-12 are cross-sectional views of semiconductor
light emitting devices according to various embodiments of
the present invention.
FIG. 13 is a perspective view of a semiconductor light
emitting device according to various embodiments of the
present invention.
The present invention now will be described more fully
hereinafter with reference to the accompanying drawings, in
which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and
should not be construed as limited to the embodiments set
forth herein. Rather, these embodiments are provided so that
this disclosure will be thorough and complete, and will fully
convey the scope of the invention to those skilled in the art. In
the drawings, the size and relative sizes oflayers and regions
may be exaggerated for clarity. Like numbers refer to like
elements throughout.
It will be understood that when an element such as a layer,
elements may also be present. It will be understood that if part
of an element, such as a surface, is referred to as "inner," it is
farther from the outside of the device than other parts of the
element. Furthermore, relative terms such as "beneath" or
"overlies" may be used herein to describe a relationship of
one layer or region to another layer or region relative to a
substrate or base layer as illustrated in the figures. It will be
understood that these terms are intended to encompass different orientations of the device in addition to the orientation
depicted in the figures. Finally, the term "directly" means that
there are no intervening elements. As used herein, the term
"and/or" includes any and all combinations of one or more of
the associated listed items.
It will be understood that, although the terms first, second,
etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one
element, component, region, layer or section from another
region, layer or section. Thus, a first region, layer or section
discussed below could be termed a second region, layer or
section, and, similarly, a second without departing from the
teachings of the present invention.
FIG. 1 is an exploded cross-sectional view of semiconductor light emitting devices and assembling methods therefor,
according to various embodiments of the present invention.
Referring to FIG. 1, these semiconductor light emitting
devices 100 include a substrate 110 having a face llOa, a
flexible film 120 that includes therein an optical element 130,
on the face llOa, and a semiconductor light emitting element
140 between the substrate 110 and the flexible film 120, and
configured to emit light 160 through the optical element. An

US 7,858,998 B2
5
attachment element 150 may be used to attach the flexible

film 120 and the substrate 110 to one another.
Still referring to FIG. 1, the substrate 110 may include
alumina, aluminum nitride, metal and/or other materials that
are conventionally used for mounting semiconductor light
emitting elements thereon. In other embodiments, the substrate 110 can be a solid metal block, as described in application Ser. No. 10/659,108 to Negley et al., entitled Solid
Metal Block Mounting Substrates for Semiconductor Light
Emitting Devices, and Oxidizing Methods for Fabricating
Same, filed Sep. 9, 2003, now U.S. Pat. No. 7,183,587,
assigned to the assignee of the present invention, the disclosure of which is hereby incorporated herein by reference in its
entirety as if set forth fully herein. The design of substrates
110 are well known to those having skill in the art and need
not be described further herein.
The semiconductor light emitting element 140 may include
a light emitting diode, laser diode and/or other semiconductor
device which includes one or more semiconductor layers,
which may include silicon, silicon carbide, gallium nitride
and/or other semiconductor materials, a substrate which may
include sapphire, silicon, silicon carbide and/or other microelectronic substrates, and one or more contact layers which
may include metal and/or other conductive layers. In some
embodiments, ultraviolet, blue and/or green LEDs may be
provided. The design and fabrication of semiconductor light
emitting devices 140 are well known to those having skill in
the art and need not be described in detail herein.
For example, the light emitting elements 140 may be gallium nitride-based LEDs or lasers fabricated on a silicon
carbide substrate such as those devices manufactured and
sold by Cree, Inc. of Durham, N.C. The present invention may
be suitable for use with LEDs and/or lasers as described in
U.S. Pat. Nos. 6,201,262; 6,187,606; 6,120,600; 5,912,477;
5,739,554; 5,631,190; 5,604,135; 5,523,589; 5,416,342;
5,393,993; 5,338,944; 5,210,051; 5,027,168; 5,027,168;
4,966,862 and/or 4,918,497, the disclosures of which are
incorporated herein by reference as if set forth fully herein.
Other suitable LEDs and/or lasers are described in published
U.S. Patent Publication No. US 2003/0006418 Al entitled
Group III Nitride Based Light Emitting Diode Structures
With a Quantum Well and Superlattice, Group III Nitride
Based Quantum Well Structures and Group III Nitride Based
Superlattice Structures, published Jan. 9, 2003, as well as
published U.S. Patent Publication No. US 2002/0123164 Al
entitled Light Emitting Diodes Including Modifications for
Light Extraction and Manufacturing Methods Therefor. Furthermore, phosphor coated LEDs, such as those described in
U.S. application Ser. No. 10/659,241, entitled PhosphorCoated Light Emitting Diodes Including Tapered Sidewalls
and Fabrication Methods Therefor, filed Sep. 9, 2003, now
U.S. Pat. No. 6,853,010, the disclosure of which is incorporated by reference herein as if set forth fully, may also be
suitable for use in embodiments of the present invention. The
LEDs and/or lasers may be configured to operate such that
light emission occurs through the substrate. In such embodiments, the substrate may be patterned so as to enhance light
output of the devices as is described, for example, in the
above-cited U.S. Patent Publication No. US 2002/0123164
Al.
Still referring to FIG. 1, the flexible film 120 can provide a
cover slip that can be made of a flexible material such as a
conventional Room Temperature Vulcanizing (RTV) silicone
rubber. Other silicone-based and/or flexible materials may be
used. By being made of a flexible material, the flexible film
120 can conform to the substrate 110 as it expands and contracts during operations. Moreover, the flexible film 120 can
be made by simple low-cost techniques such as transfer molding, injection molding and/or other conventional techniques
that are well known to those having skill in the art.
As described above, the flexible film 120 includes therein
an optical element 130. The optical element can include a
lens, a prism, an optical emission enhancing and/or converting element, such as a phosphor, an optical scattering element
and/or other optical element. One or more optical elements
130 also may be provided, as will be described in detail below.
Moreover, as shown in FIG. 1, an optical coupling media 170,
such as an optical coupling gel and/or other index matching
material, may be provided between the optical element 130
and the semiconductor light emitting device 140, in some
embodiments.
Still referring to FIG. 1, the attachment element 150 can be
embodied as an adhesive that may be placed around the
periphery of the substrate 110, around the periphery of the
flexible film 120 and/or at selected portions thereof, such as at
the corners thereof. In other embodiments, the substrate 110
may be coined around the flexible film 120, to provide an
attachment element 150. Other conventional attaching techniques may be used.
FIG. 1 also illustrates methods of assembling semiconductor light emitting devices 100 according to various embodiments of the present invention. As shown in FIG. 1, a semiconductor light emitting element 140 is mounted on a
substrate face llOa. A flexible film 120 that includes therein
an optical element 130 is attached to the substrate face llOa,
for example using an attachment element 150, such that, in
operation, the semiconductor light emitting element emits
light 160 through the optical element 130. In some embodiments, an optical coupling media 170 is placed between the
semiconductor light emitting element 140 and the optical
element 130.
FIG. 2 is a cross-sectional view of semiconductor light
emitting devices according to other embodiments of the
present invention. In these embodiments, the substrate face
llOa includes a cavity llOb therein. The flexible film 120
extends onto the face llOa beyond the cavity llOb. The
optical element 130 overlies the cavity llOb, and the semiconductor light emitting element 140 is in the cavity llOb,
and is configured to emit light 160 through the optical element
130. In FIG. 2, the optical element 130 includes a concave
lens. In some embodiments, an optical coupling media 170 is
provided in the cavity llOb between the optical element 130
and the semiconductor light emitting element 140. In some
embodiments, the optical coupling media 170 fills the cavity
llOb.
FIG. 3 is a cross-sectional view of other embodiments of
the present invention. As shown in FIG. 3, two optical elements 130 and 330 are included in the flexible film 120. A first
optical element 130 includes a lens and a second optical
element 330 includes a prism. Light from the semiconductor
light emitting element 140 passes through the prism 330 and
through the lens 130. An optical coupling media 170 also may
be provided. In some embodiments, the optical coupling
media 170 fills the cavity llOb. The optical coupling media
170 may have a sufficient difference in index of refraction
difference from the prism such that the prism can reduce
shadowing. As shown in FIG. 3, the semiconductor light
emitting element includes a wire 140a that extends towards
the flexible film 120, and the prism 330 is configured to
reduce shadowing by the wire 140a of the light that is emitted
from the semiconductor light emitting element 140. More
uniform light emissions thereby may be provided, with
reduced shadowing of the wire 140a. It will be understood
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that the term "wire" is used herein in a generic sense to

encompass any electrical connection for the semiconductor
light emitting element 140.
the present invention. As shown in FIG. 4, phosphor 410 is
provided on the flexible film 120 between the lens 130 and the
semiconductor light emitting element 140. The phosphor 410
can include cerium-doped Yttrium Aluminum Gamet (YAG)
and/or other conventional phosphors. In some embodiments,
the phosphor comprises Cesium doped Yttrium Aluminum
Gamet (YAG:Ce ). In other embodiments, nano-phosphors
may be used. Phosphors are well known to those having skill
in the art and need not be described further herein. An optical
coupling media 170 also may be provided that may fill the
cavity llOb.
FIG. 5 illustrates yet other embodiments of the present
invention. In these embodiments, the lens 130 includes a
concave inner surface 130a adjacent the semiconductor light
emitting element 140, and the phosphor 410 includes a conformal phosphor layer on the concave inner surface 130a. An
optical coupling media 170 also may be provided that may fill
the cavity llOb.
FIG. 6 is a cross-sectional view of other embodiments. As
shown in FIG. 6, at least a portion 120d of the flexible film 120
that overlies the cavity 11 Ob is transparent to the light. Moreover, at least a portion 120c of the flexible film 120 that
extends onto the face llOa beyond the cavity llOb is opaque
to the light, as shown by the dotted portions 120c of the
flexible film 120. The opaque regions 120c can reduce or
prevent bouncing of light rays, and thereby potentially produce a more desirable light pattern. An optical coupling
media 170 also may be provided that may fill the cavity 11 Ob.
the present invention wherein the flexible film 120 may be
fabricated of multiple materials. As shown in FIG. 7, at least
a portion 120d of the flexible film 120 that overlies the cavity
11 Ob includes a first material, and at least a portion 120c of the
flexible film 120 that extends onto the face llOa beyond the
cavity 11 Ob includes a second material. Two or more materials may be used in the flexible film 120 in some embodiments,
to provide different characteristics forthe portion of the flexible film 120 through which light is emitted and through
which light is not emitted. Multiple materials may be used for
other purposes in other embodiments. For example, an inflexible and/or flexible plastic lens may be attached to a flexible
film. Such a flexible film 120 with multiple materials may be
fabricated using conventional multiple molding techniques,
for example. In some embodiments, the first material that is
molded may not be fully cured, so as to provide a satisfactory
bond that attaches to the second material that is subsequently
molded. In other embodiments, the same material may be
used for the optical element and the flexible film, wherein the
optical element is formed and then the flexible film is formed
surrounding the optical element. An optical coupling media
170 also may be provided that may fill the cavity llOb.
the present invention. In these embodiments, the semiconductor light emitting element 140 includes a wire 140a, that
extends towards and contacts the flexible film 120 in the
cavity llOb. The flexible film 120 includes a transparent
conductor 810 which can include Indium Tin Oxide (ITO)
and/or other conventional transparent conductors. The transparent conductor 810 extends in the cavity llOb and electrically connects to the wire. Reduced shadowing by the contact
140a thereby may be provided. Moreover, a wire bond to the
substrate 110, and the potential consequent light distortion,
may be reduced or eliminated. An optical coupling media 170

also may be provided that may fill the cavity llOb.
the present invention. As shown in FIG. 9, the optical element
130 includes a lens that overlies the cavity llOb and protrudes
away from the cavity llOb. The flexible film 120 further
includes a protruding element 930 between the lens 130 and
the light emitting element 140 that protrudes towards the
cavity llOb. As shown in FIG. 9, a conformal phosphor layer
410 is provided on the protruding element 930. By providing
the protruding element 930 on the back of the lens 130,
optical coupling media 170 in the device may be displaced.
Arrangements of FIG. 9 may thus provide more uniform
phosphor coating at desired distances from the light emitting
element 140, so as to provide more uniform illumination. The
optical coupling media 170 may fill the cavity 11 Ob.
FIGS. 10 and 11 illustrate semiconductor light emitting
devices including multiple semiconductor light emitting elements and/or multiple optical elements according to various
embodiments of the present invention. For example, as shown
in FIG. 10, the optical element 130 is a first optical element,
and the semiconductor light emitting element 140 is a first
semiconductor light emitting element. The flexible film 120
also includes therein a second optical element 130' that is
spaced apart from the first optical element 130, and the device
further includes a second semiconductor light emitting element 140' between the substrate 110 and the flexible film 120,
and configured to emit light through the second optical element 130'. Moreover, a third optical element 130" and a third
semiconductor light emitting element 140" also may be provided. The optical elements 130, 130' and 130" may be the
same and/or different from one another, and the semiconductor light emitting elements 140, 140' and 140" may be the
same and/or different from one another. Moreover, in
embodiments of FIG. 10, the cavity llOb is a first cavity, and
second and third cavities llOb', llOb", respectively, are provided for the second and third semiconductor light emitting
elements 140', 140", respectively. The cavities llOb, llOb'
and llOb" may be the same and/or may have different configurations from one another. An optical coupling media 170
also may be provided that may fill the cavity or cavities.
As also shown in FIG. 10, the phosphor 410 may be a first
phosphor layer, and second and/or third phosphor layers 410'
and 410", respectively, may be provided on the flexible film
120 between the second optical element 130' and the second
semiconductor light emitting element 140', and between the
third optical element 130" and the third semiconductor light
emitting element 140", respectively. The phosphor layers
410, 410', 410" may be the same, may be different and/or may
be eliminated. In particular, in some embodiments of the
present invention, the first phosphor layer 410 and the first
semiconductor light emitting element 140 are configured to
generate red light, the second phosphor layer 410' and the
second semiconductor light emitting element 140' are configured to generate blue light, and the third phosphor layer 410"
and the third semiconductor light emitting element 140" are
configured to generate green light. A Red, Green, Blue (RGB)
light emitting element that can emit white light thereby may
be provided in some embodiments.
the present invention. In these embodiments, a single cavity
1100 is provided for the first, second and third semiconductor
light emitting elements 140, 140' and 140", respectively. An
optical coupling media 170 also may be provided that may fill
the cavity 1100.
FIG.12 is a cross-sectional view of yet other embodiments
of the present invention. In FIG. 12, the optical element 1230
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US 7,858,998 B2
9
10
comprises a lens having phosphor dispersed therein. Lenses

filled region including a phosphor and/or an optical coupling
including phosphor dispersed therein are described, for
media 170 may be incorporated to give the features of a
paint-on lens for making white light. A paint-on lens for
example, in application Ser. No. 10/659,240 to Negley et al.,
making white light is described in application Ser. No.
entitled Transmissive Optical Elements Including Transpar10/666,399 to Michael Leung, entitled Molded Chip Fabrient Plastic Shell Having a Phosphor Dispersed Therein, and
Methods of Fabricating Same, filed Sep. 9, 2003, now U.S.
cation Method and Apparatus, filed Sep. 18, 2003, now U.S.
Pat. No. 7,029,935, assigned to the assignee of the present
Patent Application Publication 2005/0062140, assigned to
invention, the disclosure of which is hereby incorporated
the assignee of the present invention, the disclosure of which
herein by reference in its entirety as if set forth fully herein.
is hereby incorporated herein by reference in its entirety as if
An optical coupling media 170 also may be provided that may 1o set forth fully herein.
Some embodiments of the present invention can reduce or
fill the cavity 11 Ob.
In still other embodiments of the present invention, an
minimize the volume of optical coupling media 170, by prooptical scattering element may be embedded in the lens as
viding a protrusion such as was described, for example, in
shown in FIG. 12, and/or provided as a separating layer as
FIG. 9. By reducing the amount of optical coupling media
shown, for example, in FIG. 9, in addition or instead of 15 170, a more uniform light emission may be provided. Thus,
these and/or other embodiments of the present invention can
phosphor.
FIG. 13 is a perspective view of semiconductor light emitreduce or eliminate angular-dependent radiation patterns of
light output from the light emitting device, such as angular
ting devices according to other embodiments of the present
invention. The substrate 110 is attached to a conventional
dependence of Color Correlated Temperature (CCT). Thus,
package 1310. An optical coupling media 170 also may be 20 light intensity and the x, y chromaticity values/coordinates
from all surfaces of the device can remain relatively constant
provided.
It will be understood by those having skill in the art that
in some embodiments. This may be advantageous when used
various embodiments of the invention have been described
for illumination applications, such as in a room, where a
individually in connection with FIGS. 1-13. However, comspotlight effect is not desirable.
In the drawings and specification, there have been disbinations and subcombinations of the embodiments of FIGS. 25
1-13 may be provided according to various embodiments of
closed embodiments of the invention and, although specific
the present invention.
terms are employed, they are used in a generic and descriptive
Additional discussion of various embodiments of the
sense only and not for purposes oflimitation, the scope of the
present invention now will be provided. In particular, in some
invention being set forth in the following claims.
embodiments, the flexible film 120 that was described above 30
What is claimed is:
may be made of a flexible material such as RTV, GE RTV 615
1. A semiconductor light emitting device comprising:
marketed by GE, UR 234 marketed by Thermo set/Lord Corp.
and/or other conventional flexible materials, and in some
a light emitting diode on a face of the solid alumina block;
and
embodiment may be between about 25 m and about 500 m
thick. The flexible film 120 incorporates one or more optical 35
a flexible unitary film comprising silicone that extends
conformally on the face of the solid alumina block outelements 130 to achieve a desired optical design. Being made
of a flexible material, the flexible film 120 can conform to the
side the light emitting diode and that also extends on the
semiconductor light emitting device as it expands and conlight emitting diode, the flexible unitary film comprising
tracts. Moreover, in some embodiments, the flexible film can
silicone including therein a lens comprising silicone
adjacent the light emitting diode, such that the light
be fabricated by simple low cost techniques such as transfer 40
molding, injection molding and/or other techniques, and may
emitting diode emits light through the lens.
2. A semiconductor light emitting device according to
include multiple optical elements and/or other features on
claim 1 wherein the flexible unitary film comprising silicone
either side of the flexible film membrane. This may permit a
"single" placement of a complex optical element upon a
is attached to the solid alumina block such that the flexible
package (or substrate to a package) that can include multiple 45 unitary film comprising silicone conforms to the light emitting diode as it expands and contracts during operation
LED emitters.
thereof.
Conventionally, LED packages use a lens molded from
3. A device according to claim 2 further comprising phosrigid plastic or glass. Either a hard encapsulant is used to
phor between the lens and the light emitting diode.
encapsulate the chip and form the optical element, or a lens is
applied upon an optical coupling media, such as an optical 50
4. A device according to claim 3 wherein the lens includes
gel, for example Nye optical gel. The hard encapsulant may
a concave inner surface adjacent the light emitting diode and
be plagued by optical degradation and high stress on LED
wherein the phosphor comprises a conformal phosphor layer
chips, and power LED chips in particular, and the optical
on the concave inner surface.
coupling media may also potentially create problems because
5. A device according to claim 3 further comprising an
this gel may be exposed on the surface of the part which may 55 optical coupling media between the phosphor and the light
result in trapping of dust/debris on the exposed material due
emitting diode.
to the stickiness of the gel. In contrast, flexible films 120
according to some embodiments of the present invention can
attachment element that is configured to attach the flexible
be the terminating surface of the package using an optical
unitary film and the solid alumina block to one another such
coupling media 170, and also includes the optical elements 60 that the flexible unitary film comprising silicone conforms to
130, such as one or more optical lens. The ability to place one
the light emitting diode as it expands and contracts during
unit (the flexible film with multiple optical elements) can
operation thereof.
potentially provide a benefit when using a package that has
multiple LEDs in it. Instead of placing a lens for each LED,
a substrate comprising alumina;
the single placement of a flexible film 130 can be provided. 65
a light emitting diode on a face of the substrate; and
Still other features can be incorporated into the flexible film
a flexible film comprising silicone that extends confor130. For example, on the opposing side of the optical lens, a
mally onto the face of the substrate beyond the light

US 7,858,998 B2
11
12
emitting diode and that also extends on the light emitting

diode, the flexible film comprising silicone including
therein a lens comprising silicone adjacent the light
emitting diode, such that the light emitting diode emits
light through the lens;
wherein at least a portion of the flexible film comprising
silicone that overlies the light emitting diode is transparent to the light and wherein at least a portion of the
flexible film comprising silicone that extends conformally onto the face beyond the light emitting diode is
opaque to the light.
claim 7 wherein the flexible film comprising silicone is
attached to the substrate such that the flexible film comprising
silicone conforms to the light emitting diode as it expands and
contracts during operation thereof.
9. A device according to claim 8 further comprising phosphor between the lens and the light emitting diode.
10. A device according to claim 9 wherein the lens includes
a concave inner surface adjacent the light emitting diode and
wherein the phosphor comprises a conformal phosphor layer
on the concave inner surface.
optical coupling media between the phosphor and the light
emitting diode.
film and the substrate to one another such that the flexible film
comprising silicone conforms to the light emitting diode as it
expands and contracts during operation thereof.
a substrate comprising alumina;
a light emitting diode on a face of the substrate; and
a flexible film comprising silicone that extends conformally onto the face of the substrate beyond the light
emitting diode and that also extends on the light emitting
diode, the flexible film comprising silicone including
therein a lens comprising silicone adjacent the light
emitting diode, such that the light emitting diode emits
light through the lens;
wherein at least a portion of the flexible film comprising
silicone that overlies the light emitting diode comprises
a first material and wherein at least a portion of the
flexible film comprising silicone that extends conformally onto the face beyond the light emitting diode
comprises a second material that is different from the
first material.
claim 13 wherein the flexible film comprising silicone is
attached to the substrate such that the flexible film comprising
silicone conforms to the light emitting diode as it expands and
contracts during operation thereof.
15. A device according to claim 14 further comprising
phosphor between the lens and the light emitting diode.
16. A device according to claim 15 wherein the lens
includes a concave inner surface adjacent the light emitting
diode and wherein the phosphor comprises a conformal phosphor layer on the concave inner surface.
optical coupling media between the phosphor and the light
emitting diode.
film and the substrate to one another such that the flexible film
comprising silicone conforms to the light emitting diode as it
expands and contracts during operation thereof.
10
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30
* * * * *
EXHIBIT C

US008167463B2
c12)
(IO)
Loh
(45)
(54)
POWER SURFACE MOUNT LIGHT

EMITTING DIE PACKAGE
(75)
Inventor:
(73)
( *)
Notice:
Patent No.:
Date of Patent:
(56)
US 8,167,463 B2
May 1, 2012
References Cited
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Appl. No.: 13/023,268

Filed:
A
A
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A
A
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10""
Primary Examiner - Ali Alavi

(74) Attorney, Agent, or Firm -Jenkins, Wilson, Taylor &
Hunt, P.A.
(57)
ABSTRACT
A light emitting die package includes a substrate, a reflector
plate, and a lens. The substrate has traces for connecting an
external electrical power source to a light emitting diode
(LED) at amounting pad. The reflector plate is coupled to the
substrate and substantially surrounds the mounting pad, and
includes a reflective surface to direct light from the LED in a
desired direction. The lens is free to move relative to the
reflector plate and is capable of being raised or lowered by the
encapsulant that wets and adheres to it and is placed at an
optimal distance from the LED chip(s ). Heat generated by the
LED during operation is drawn away from the LED by both
the substrate (acting as a bottom heat sink) and the reflector
plate (acting as a top heat sink).
~so
42
----20

US 8,167,463 B2
Page 2
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19945919
0965493
1059678
1087447 Al
1179858
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09274454
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556364
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* cited by examiner
U.S. Patent
May 1, 2012
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US 8,167,463 B2
1

to temperature cycles, its rigid plastic body that adheres to the

metal leads experiences high degree of thermal stresses in
many directions. This potentially leads to various undesirable
results such as cracking of the plastic body, separation of the
plastic body from the LED chip, breaking of the bond wires,
delaminating of the plastic body at the interfaces where it
bonds to various parts, or resulting in a combination of these
outcomes. In addition, the extended leads increase the package size and its footprint. For this reason, it is difficult to
populate these LED packages in a dense cluster on a printed
circuit board (PCB) to generate brighter light.
Another disadvantage of conventional leadframe design is
that the thick lead cannot be made or stamped into a fine
circuit for flip-chip mounting of a LED-which is commonly
used by some manufacturers for cost-effective manufacturing
and device performance.

APPLICATIONS
This application is a divisional of and claims priority to
U.S. patent application Ser. No. 12/856,320, filed Aug. 13,
2010, now U.S. Pat. No. 7,976,186, which is a divisional of
U.S. patent application Ser. No. 11/703,721, filed Feb. 8,
U.S. patent application Ser. No. 10/446,532, filed May 27,
2003, now U.S. Pat. No. 7,264,378, which claims the benefit
of U.S. Provisional Application Ser. No. 60/408,254 filed
Sep. 4, 2002. The entire contents of the above applications
and patents are hereby incorporated by reference herein.
10
15
BACKGROUND
Example embodiments in general relate to packaging
semiconductor devices which include light emitting diodes.
Light emitting diodes (LEDS) are often packaged within
leadframe packages. A leadframe package typically includes
a molded or cast plastic body that encapsulates an LED, a lens
portion, and thin metal leads connected to the LED and
extending outside the body. The metal leads of the leadframe
package serve as the conduit to supply the LED with electrical
power and, at the same time, may act to draw heat away from
the LED. Heat is generated by the LED when power is applied
to the LED to produce light. A portion of the leads extends out
from the package body for connection to circuits external to
the leadframe package.
Some of the heat generated by the LED is dissipated by the
plastic package body; however, most of the heat is drawn
away from the LED via the metal components of the package.
The metal leads are typically very thin and has a small cross
section. For this reason, capacity of the metal leads to remove
heat from the LED is limited. This limits the amount of power
that can be sent to the LED thereby limiting the amount of
light that can be generated by the LED.
To increase the capacity of an LED package to dissipate
heat, in one LED package design, a heat sink slug is introduced into the package. The heat sink slug draws heat from
the LED chip. Hence, it increases the capacity of the LED
package to dissipate heat. However, this design introduces
empty spaces within the package that is be filled with an
encapsulant to protect the LED chip. Furthermore, due to
significant differences in CTE (coefficient of thermal expansion) between various components inside the LED package,
bubbles tend to form inside the encapsulant or the encapsulant
tends to delaminate from various portions within the package.
This adversely affects the light output and reliability of the
product. In addition, this design includes a pair of flimsy leads
which are typically soldered by a hot-iron. This manufacturing process is incompatible with convenient surface mounting technology (SMT) that is popular in the art of electronic
board assembly.
In another LED package design, the leads of the leadframe
package have differing thicknesses extended (in various
shapes and configurations) beyond the immediate edge of the
LED package body. A thicker lead is utilized as a heatspreader and the LED chip is mounted on it. This arrangement
allows heat generated by the LED chip to dissipate through
the thicker lead which is often connected to an external heat
sink. This design is inherently unreliable due to significant
difference in coefficient of thermal expansion (CTE) between
the plastic body and the leadframe material. When subjected
SUMMARY
20
25
30
35
40
An example embodiment of the present invention is

directed to a semiconductor die package including a substrate
having conductive traces on a top surface thereof, and a light
emitting diode (LED) mounted to the top surface of the substrate via a mounting pad. The mounting pad is electrically
connected to the conductive traces on the substrate top surface. The package includes a reflector plate mechanically
coupled to the substrate and substantially surrounding the
mounting pad and LED, the reflector plate defining a reflection surface, and a lens substantially covering the mounting
pad and LED.
Another example embodiment is directed to a semiconductor die package having a substrate, a light emitting diode
(LED) mounted on the substrate via a mounting pad so that
the LED is electrically connected to a top surface of the
substrate, and a reflector plate coupled to the substrate and
substantially surrounding the mounting pad and LED. The
reflector plate has an opening there through. A lens is placed
in the opening to substantially cover the mounting pad, LED
and opening. The package includes an encapsulant covering
the LED within at least part of the opening. The lens adheres
to the encapsulant so that the lens floats on the encapsulant
within the opening.
45
50
55
60
65
FIG. lA is a perspective view of a semiconductor die

package according to one embodiment of the present invention;
FIG. lB is an exploded perspective view of the semiconductor package of FIG. lA;
FIG. 2A is a top view of a portion of the semiconductor
package of FIG. lA;
FIG. 2B is a side view of a portion of the semiconductor
package of FIG. lA;
FIG. 2C is a front view of a portion of the semiconductor
package of FIG. lA;
FIG. 2D is a bottom view of a portion of the semiconductor
package of FIG. lA;
FIG. 3 is a cut-away side view of portions of the semiconductor package of FIG. lA;
FIG. 4 is a side view of the semiconductor package of FIG.
lA with additional elements;
FIG. 5 an exploded perspective view of a semiconductor
die package according to another embodiment of the present
invention;
package of FIG. 5;

US 8,167,463 B2

package of FIG. 5;
package of FIG. 5; and
package of FIG. 5.
also shows an LED assembly 60 in addition to the front view

of the bottom heat sink 20. The LED assembly 60 is also
illustrated in FIG. lB. Referring to FIGS. lA through 2D, the
bottom heat sink 20 provides support for electrical traces 22
and 24; for solder pads 26, 32, and 34; and for the LED
assembly 60. For this reason, the bottom heat sink 20 is also
referred to as a substrate 20. In the Figures, to avoid clutter,
only representative solder pads 26, 32, and 34 are indicated
with reference numbers. The traces 22 and 24 and the solder
pads 32, 34, and 36 can be fabricated using conductive material. Further, additional traces and connections can be fabricated on the top, side, or bottom of the substrate 20, or layered
within the substrate 20. The traces 22 and 24, the solder pads
32, 34, and 36, and any other connections can be interconnected to each other in any combination using known methods, for example via holes.
The substrate 20 is made of material having high thermal
conductivity but is electrically insulating, for example, aluminum nitride (AlN) or alumina (Al.sub.20.sub.3). Dimensions of the substrate 20 can vary widely depending on application and processes used to manufacture the die package 10.
For example, in the illustrated embodiment, the substrate 20
may have dimensions ranging from fractions of millimeters
(mm) to tens of millimeters.Although the present invention is
not limited to particular dimensions, one specific embodiment of the die package 10 of the present invention is illustrated in Figures with the dimensions denoted therein. All
dimensions shown in the Figures are in millimeters (for
lengths, widths, heights, and radii) and degrees (for angles)
except as otherwise designated in the Figures, in the Specification herein, or both.
The substrate 20 has a top surface 21, the top surface 21
including the electrical traces 22 and 24. The traces 22 and 24
provide electrical connections from the solder pads (for
example top solder pads 26) to a mounting pad 28. The top
solder pads 26 are portions of the traces 22 and 24 generally
proximal to sides of the substrate 20. The top solder pads 26
are electrically connected to side solder pads 32. The mounting pad 28 is a portion of the top surface (including portions
of the trace 22, the trace 24, or both) where the LED assembly
60 is mounted. Typically the mounting pad 28 is generally
located proximal to center of the top surface 21. In alternative
embodiments of the present invention, the LED assembly 60
can be replaced by other semiconductor circuits or chips.
The traces 22 and 24 provide electrical routes to allow the
LED assembly 60 to electrically connect to the solder pads
26, 32, or 34. Accordingly, some of the traces are referred to
as first traces 22 while other traces are referred to as second
traces 24. In the illustrated embodiment, the mounting pad 28
includes portions of both the first traces 22 and the second
traces 24. In the illustrated example, the LED assembly 60 is
placed on the first trace 22 portion of the mounting pad 28
thereby making contact with the first trace 22. In the illustrated embodiment, a top of the LED assembly 60 and the
second traces 24 are connected to each other via a bond wire
62. Depending on the construction and orientation of LED
assembly 60, first traces 22 may provide anode (positive)
connections and second traces 24 may comprise cathode
(negative) connections for the LED assembly 60 (or vice
versa).
The LED assembly 60 can include additional elements. For
example, in FIGS. lB and 2C, the LED assembly 60 is illustrated including an LED bond wire 62, an LED subassembly
64, and a light emitting diode (LED) 66. Such an LED subassembly 64 is known in the art and is illustrated for the
purposes of discussing the invention and is not meant to be a
limitation of the present invention. In the Figures, the LED
Example embodiments will now be described with reference to the FIGS. 1through6D. As illustrated in the Figures,
the sizes of layers or regions are exaggerated for illustrative
purposes and, thus, are provided to illustrate the general structures of the present invention. Furthermore, various aspects in
the example embodiments are described with reference to a
layer or structure being formed on a substrate or other layer or
structure. As will be appreciated by those of skill in the art,
references to a layer being formed "on" another layer or
substrate contemplates that additional layers may intervene.
References to a layer being formed on another layer or substrate without an intervening layer are described herein as
being formed "directly on" the layer or substrate.
Furthermore, relative terms such as beneath may be used
herein to describe one layer or regions relationship to another
layer or region as illustrated in the Figures. It will be understood that these terms are intended to encompass different
orientations of the device in addition to the orientation
depicted in the Figures. For example, if the device in the
Figures is turned over, layers or regions described as
"beneath" other layers or regions would now be oriented
"above" these other layers or regions. The term "beneath" is
intended to encompass both above and beneath in this situation. Like numbers refer to like elements throughout.
As shown in the figures for the purposes of illustration,
example embodiments of the present invention are exemplified by a light emitting die package including a bottom heat
sink (substrate) having traces for connecting to a light emitting diode at a mounting pad and a top heat sink (reflector
plate) substantially surrounding the mounting pad. A lens
covers the mounting pad. In effect, an example die package
comprises a two part heat sink with the bottom heat sink
utilized (in addition to its utility for drawing and dissipating
heat) as the substrate on which the LED is mounted and
connected, and with the top heat sink utilized (in addition to
its utility for drawing and dissipating heat) as a reflector plate
to direct light produced by the LED. Because both the bottom
and the top heat sinks draw heat away from the LED, more
power can be delivered to the LED, and the LED can thereby
produce more light.
Further, the body of the die package itself may act as the
heat sink removing heat from the LED and dissipating it. For
this reason, the example LED die package may not require
separate heat sink slugs or leads that extend away from the
package. Accordingly, the LED die package may be more
compact, more reliable, and less costly to manufacture than
die packages of the prior art.
package 10 according to one embodiment of the present
invention and FIG. lB is an exploded perspective view of the
semiconductor package of FIG. lA. Referring to FIGS. lA
and lB, the light emitting die package 10 of the present
invention includes a bottom heat sink 20, a top heat sink 40,
and a lens 50.
The bottom heat sink 20 is illustrated in more detail in
FIGS. 2A through 2D. FIGS. 2A, 2B, 2C, and 2D provide,
respectively, a top view, a side view, a front view, and a bottom
view of the bottom heat sink 20 of FIG. lA. Further, FIG. 2C
10
15
20
25
30
35
40
45
50
55
60
65

US 8,167,463 B2
5
assembly 60 is shown die-attached to the substrate 20. In

alternative embodiments, the mounting pad 28 can be configured to allow flip-chip attachment of the LED assembly 60.
Additionally, multiple LED assemblies can be mounted on
the mounting pad 28. In alternative embodiments, the LED
assembly 60 can be mounted over multiple traces. This is
especially true if flip-chip technology is used.
The topology of the traces 22 and 24 can vary widely from
the topology illustrated in the Figures while still remaining
within the scope of the example embodiments of the present
invention. In the Figures, three separate cathode (negative)
traces 24 are shown to illustrate that three LED assemblies
can be placed on the mounting pad 28, each connected to a
different cathode (negative) trace; thus, the three LED assemblies may be separately electrically controllable. The traces
22 and 24 are made of conductive material such as gold,
silver, tin, or other metals. The traces 22 and 24 can have
dimensions as illustrated in the Figures and are of a thickness
on the order of microns or tens of microns, depending on
application. In an example, the traces 22 and 24 can be 15
microns thick. FIGS. lA and 2A illustrate an orientation
marking 27. Such markings can be used to identify the proper
orientation of the die package 10 even after assembling the
die package 10. The traces 22 and 24, as illustrated, can
extend from the mounting pad 28 to sides of the substrate 20.
Continuing to refer to FIGS. lA through 2D, the substrate
20 defines semi-cylindrical spaces 23 and quarter-cylindrical
spaces 25 proximal to its sides. In the Figures, to avoid clutter,
only representative spaces 23 and 25 are indicated with reference numbers. The semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25 provide spaces for solder to flowthrough and solidify-in when the die package 10 is attached to
a printed circuit board (PCB) or another apparatus (not
shown) to which the die package 10 is a component thereof.
Moreover, the semi-cylindrical spaces 23 and the quartercylindrical spaces 25 provide convenient delineation and
break points during the manufacturing process.
The substrate 20 can be manufactured as one individual
section of a strip or a plate having a plurality of adjacent
sections, each section being a substrate 20. Alternatively, the
substrate 20 can be manufactured as one individual section of
an array of sections, the array having multiple rows and
columns of adjacent sections. In this configuration, the semicylindrical spaces 23 and quarter-cylindrical spaces 25 can be
utilized as tooling holes for the strip, the plate, or the array
during the manufacturing process.
Furthermore, the semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25, combined with scribed grooves or
other etchings between the sections, assist in separating each
individual substrate from the strip, the plate, or the wafer. The
separation can be accomplished by introducing physical
stress to the perforation (semi through holes at a close pitch)
or scribe lines made by laser, or premolded, or etched lines
(crossing the semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25) by bending the strip, the plate, or the
wafer. These features simplify the manufacturing process and
thus reduce costs by eliminating the need for special carrier
fixtures to handle individual unit of the substrate 20 during the
manufacturing process. Furthermore, the semi-cylindrical
spaces 23 and the quarter-cylindrical spaces 25 serve as via
holes connecting the top solder pads 26, the side solder pads
32, and the bottom solder pads 34.
The substrate 20 has a bottom surface 29 including a thermal contact pad 36. The thermal contact pad 36 can be fabricated using a material having a high thermally and electrically conductive properties such as gold, silver, tin, or another
material including but not limited to precious metals.
FIG. 3 illustrates a cut-away side view of portions of the

semiconductor package ofFIGS. lA and lB. In particular, the
FIG. 3 illustrates a cut-away side view of the top heat sink 40
and the lens 50. Referring to FIGS. lA, lB, and 3, the top heat
sink 40 is made from a material having high thermal conductivity such as aluminum, copper, ceramics, plastics, composites, or a combination of these materials. A high temperature,
mechanically tough, dielectric material can be used to overcoat the traces 22 and 24 (with the exception of the central
die-attach area) to seal the traces 22 and 24 and provide
protection from physical and environmental harm such as
scratches and oxidation. The overcoating process can be a
part of the substrate manufacturing process. The overcoat,
when used, may insulate the substrate 20 from the top heat
sink 40. The overcoat may then be covered with a high temperature adhesive such as thermal interface material manufactured by THERMOSET that bonds the substrate 20 to the
top heat sink 40.
The top heat sink 40 may include a reflective surface 42
substantially surrounding the LED assembly 60 mounted on
the mounting pad 28 (of FI GS. 2A and 2C). When the top heat
sink 40 is used to dissipate heat generated by the LED in the
die package 10, it can be "top-mounted" directly onto an
external heat sink by an adhesive or solder joint to dissipate
heat efficiently. In another embodiment, if heat has to be
dissipated by either a compressible or non-compressible
medium such as air or cooling fluid, the top heat sink 40 may
be equipped with cooling fins or any feature that will enhance
heat transfer between the top heat sink 40 and the cooling
medium. In both of these embodiments, the electrical terminals and the bottom heat sink 20 of the die package 10 can still
be connected to its application printed circuit board (PCB)
using, for example, the normal surface-mount-technology
(SMT) method.
The reflective surface 42 reflects portions oflight from the
LED assembly 60 as illustrated by sample light rays 63. Other
portions of the light are not reflected by the reflective surface
42 as illustrated by sample light ray 61. Illustrative light rays
61 and 63 are not meant to represent light traces often use in
the optical arts. For efficient reflection of the light, the top heat
sink 40 is preferably made from material that can be polished,
coined, molded, or any combination of these. Alternatively, to
achieve high reflectivity, the optical reflective surface 42 or
the entire heat sink 40 can be plated or deposited with high
reflective material such as silver, aluminum, or any substance
that serves the purpose. For this reason, the top heat sink 40 is
also referred to as a reflector plate 40. The reflector plate 40 is
made of material having high thermal conductivity if and
when required by the thermal performance of the package 10.
In the illustrated embodiment, the reflective surface 42 is
illustrated as a flat surface at an angle, for example 45 degrees,
relative to the reflective plate's horizontal plane. The example
embodiments are not limited to the illustrated embodiment.
For example, the reflective surface 42 can be at a different
angle relative to the reflective plate's horizontal plane. Alternatively, the reflective plate can have a parabolic, toroid or
any other shape that helps to meet the desired spectral luminous performance of the package.
The reflective plate 40 includes a ledge 44 for supporting
and coupling with the lens 50. The LED assembly 60 is
encapsulated within the die package 10 (of FIGS. lA and lB)
using encapsulation material 46 such as, for example only,
soft and elastic silicones or polymers. The encapsulation
material 46 can be a high temperature polymer with high light
transmissivity and refractive index that matches or closely
matches refractive index of the lens 50, for example. The
10
15
20
25
30
35
40
45
50
55
60
65

US 8,167,463 B2
encapsulant 46 is not affected by most wavelengths that alter

its light transmissivity or clarity.
The lens 50 is made from material having high light transmissivity such as, for example only, glass, quartz, high temperature and transparent plastic, or a combination of these
materials. The lens 50 is placed on top of and adheres to the
encapsulation material 46. The lens 50 is not rigidly bonded
to the reflector 40. This "floating lens" design enables the
encapsulant 46 to expand and contract under high and low
temperature conditions without difficulty. For instance, when
the die package 10 is operating or being subjected to a high
temperature environment, the encapsulant 46 experiences
greater volumetric expansion than the cavity space that contains it. By allowing the lens 50 to float up somewhat freely on
top of the encapsulant 46, no encapsulant will be squeezed out
of its cavity space. Likewise, when the die package 10 is
subjected to a cold temperature, the encapsulant 46 will contract more than the other components that make up the cavity
space for the encapsulant 46; the lens will float freely on top
of the encapsulant 46 as the latter shrinks and its level drops.
Hence, the reliability of the die package 10 is maintained over
relatively large temperature ranges as the thermal stresses
induced on the encapsulant 46 is reduced by the floating lens
design.
In some embodiments, the lens 50 defines a recess 52 (See
FIG. 3) having a curved, hemispherical, or other geometry,
which can be filled with optical materials intended to influence or change the nature of the light emitted by the LED
chip(s) before it leaves the die package 10. Examples ofone
type of optical materials include luminescence converting
phosphors, dyes, fluorescent polymers or other materials
which absorb some of the light emitted by the chip(s) and
re-emit light of different wavelengths. Examples of another
type of optical materials include light diffusants such as calcium carbonate, scattering particles (such as Titanium
oxides) or voids which disperse or scatter light. Any one or a
combination of the above materials can be applied on the lens
50 to obtain certain spectral luminous performance.
FIG. 4 illustrates the die package 10 coupled to an external
heat sink 70. Referring to FIG. 4, the thermal contact pad 36
can be attached to the external heat sink 70 using epoxy,
solder, or any other thermally conductive adhesive, electrically conductive adhesive, or thermally and electrically conductive adhesive 7 4. The external heat sink 70 can be a printed
circuit board (PCB) or other structure that draws heat from the
die package 10. The external heat sink can include circuit
elements (not shown) or heat dissipation fins 72 in various
configurations.
An example embodiment having an alternate configuration
is shown in FIGS. 5 through 6D. Portions of this second
embodiment are similar to corresponding portions of the first
embodiment illustrated in FIGS. lA through 4. For convenience, portions of the second embodiment as illustrated in
FIGS. 5 through 6D that are similar to portions of the first
embodiment are assigned the same reference numerals,
analogous but changed portions are assigned the same reference numerals accompanied by letter "a," and different portions are assigned different reference numerals.
FIG. 5 is an exploded perspective view of an LED die
package lOa in accordance with other embodiments of the
present invention. Referring to FIG. 5, the light emitting die
package lOa of the present invention includes a bottom heat
sink (substrate) 20a, a top heat sink (reflector plate) 40a, and
a lens 50.
FIGS. 6A, 6B, 6C, and 6D, provide, respectively, a top
view, a side view, a front view, and a bottom view of the
substrate 20a of FIG. 5. Referring to FIGS. 5 through 6D, the
substrate 20a includes one first trace 22a and four second
traces 24a. Traces 22a and 24a are configured differently than
traces 22 and 24 of FIG. 2A. The substrate 20a includes
flanges 31 that define latch spaces 33 for reception oflegs 35
of the reflector plate 40a, thereby mechanically engaging the
reflector plate 40a with the substrate 20a.
The example embodiments of the present invention being
thus described, it will be obvious that the same may be varied
in many ways. Such variations are not to be regarded as a
departure from the exemplary embodiments of the present
invention, and all such modifications as would be obvious to
one skilled in the art are intended to be included within the
scope of the following claims.
What is claimed is:
1. A light emitting die package, comprising:
a substrate comprising a top surface, a bottom surface and
a plurality of sides;
a thermal pad disposed in a middle portion of the bottom
surface of the substrate; and
a plurality of traces disposed on opposing sides of and
isolated from the thermal pad on the bottom surface of
the substrate.
2. The package of claim 1, wherein the plurality of traces
are also disposed on the top surface of the substrate and
extend to a side of the plurality of sides and around the side to
the opposing sides of the thermal pad of the bottom surface.
3. The package of claim 2, further comprising a light emitting diode (LED) mounted on the top surface of the substrate
and connected to the plurality of traces.
4. The package of claim 2, wherein the portion of the
plurality of traces extending around the side of the substrate
comprises solder pads.
5. The package of claim 4, wherein the portion of the
plurality of traces extending around the side of the substrate
has spaces formed therein.
6. The package of claim 5, wherein the spaces comprise
quarter-cylindrical spaces.
7. The package of claim 5, wherein the spaces comprise
semi-cylindrical spaces.
8. The package of claim 1, wherein the thermal pad comprises a metal.
9. The package of claim 1, further comprising a reflector
LED, the reflector plate defining a reflection surface.
10. The package of claim 9, wherein the reflector is composed of a material having high thermal conductivity.
11. The package of claim 9, wherein the reflector plate and
substrate serve as heat sinks for dissipating heat generated by
the LED.
12. The package of claim 9, further comprising an encapsulant covering the LED is disposed within the reflector.
13. The package of claim 12, wherein the encapsulant is
composed of an optically clear polymer material.
14. The package of claim 12, further comprising a lens
covering the LED.
15. The package of claim 14, wherein the lens sits on and
adheres to the encapsulant, the lens free to move as the encapsulant expands and contracts.
16. The package of claim 14, wherein the lens is formed by
the encapsulant.
17. The package of claim 12, wherein the encapsulant
comprises silicon.
18. The package of claim 1, wherein a lens sits on and
adheres to the encapsulant and the lens is free to move relative
to the substrate.
19. The package of claim 1, wherein the substrate is electrically insulating.
10
15
20
25
30
35
40
45
50
55
60
65

US 8,167,463 B2
9
20. The package of claim 19, wherein the electrically insulating substrate has a high thermal conductivity.
21. The package of claim 19, wherein the electrically insulating substrate comprises aluminum nitride.
22. The package of claim 1, wherein an encapsulant covering the LED.
covering the LED.
25. The package of claim 24, wherein the lens sits on and
adheres to the encapsulant, the lens free to move as the encapsulant expands and contracts.
10
26. The package of claim 24, wherein a lens sits on and
10
adheres to the encapsulant and the lens is free to move relative

to the substrate.
the encapsulant.
28. The package of claim 22, wherein the encapsulant
comprises silicon.
disposed on opposing sides of and isolated from the thermal
pad are disposed on opposing ends of the bottom surface of
the substrate.
* * * * *
EXHIBIT D

US008622582B2
c12)
(IO)
Loh
(45)
(54)

(75)
Inventor:
(73)
( *)
Notice:
Patent No.:
Date of Patent:
(56)
US 8,622,582 B2
*Jan. 7, 2014
References Cited
Ban P. Loh, Durham, NC (US)
3,443,140 A
3,760,237 A
5/1969 Jensen
9/1973 Jaffe
(Continued)
This patent is subject to a terminal disclaimer.
(21)
Appl. No.: 13/023,273
(22)
Filed:
(65)
8/2008
3/2011
(Continued)
(Continued)
Aug. 4, 2011
Division of application No. 12/856,320, filed on Aug.

13, 2010, now Pat. No. 7,976,186, which is a division
of application No. 11/703,721, filed on Feb. 8, 2007,
now Pat. No. 7,775,685, which is a division of
application No. 10/446,532, filed on May 27, 2003,
now Pat. No. 7,264,378.
(60)
Provisional application No. 60/408,254, filed on Sep.

4, 2002.
(51)
Int. Cl.
F21V29/00
(2006.01)
U.S. Cl.
USPC ........ 362/294; 362/311.01; 362/800; 257/98;
257/100; 2571712
Field of Classification Search
USPC ............... 362/311.01-311.05, 294, 245, 341,
362/346; 257/98, 100, 712
( 58)
03820849
200480030943 .3
Japanese Notice of Allowance for JP Appl. 2004-534428 dated Mar.

29, 2011.
(52)
CN
CN
OTHER PUBLICATIONS
Feb.8,2011
US 2011/0186897 Al
(62)
Primary Examiner - Ali Alavi

(74) Attorney, Agent, or Firm -Jenkins, Wilson, Taylor &
Hunt, P.A.
(57)
ABSTRACT
A light emitting die package includes a substrate, a reflector

plate, and a lens. The substrate has traces for connecting an
external electrical power source to a light emitting diode
(LED) at amounting pad. The reflector plate is coupled to the
substrate and substantially surrounds the mounting pad, and
includes a reflective surface to direct light from the LED in a
desired direction. The lens is free to move relative to the
reflector plate and is capable of being raised or lowered by the
encapsulant that wets and adheres to it and is placed at an
optimal distance from the LED chip(s ). Heat generated by the
LED during operation is drawn away from the LED by both
the substrate (acting as a bottom heat sink) and the reflector
plate (acting as a top heat sink).
o~so
42
y--10
~40
._,__20

US 8,622,582 B2
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* cited by examiner
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to temperature cycles, its rigid plastic body that adheres to the

metal leads experiences high degree of thermal stresses in
many directions. This potentially leads to various undesirable
results such as cracking of the plastic body, separation of the
plastic body from the LED chip, breaking of the bond wires,
delaminating of the plastic body at the interfaces where it
bonds to various parts, or resulting in a combination of these
outcomes. In addition, the extended leads increase the package size and its footprint. For this reason, it is difficult to
populate these LED packages in a dense cluster on a printed
circuit board (PCB) to generate brighter light.
Another disadvantage of conventional leadframe design is
that the thick lead cannot be made or stamped into a fine
circuit for flip-chip mounting of a LED-which is commonly
used by some manufacturers for cost-effective manufacturing
and device performance.

APPLICATIONS
This application is a divisional of and claims priority to
U.S. patent application Ser. No. 12/856,320, filed Aug. 13,
2010 now U.S. Pat. No. 7,976,186, which is a divisional of
U.S. patent application Ser. No. 11/703,721, filed Feb. 8,
U.S. patent application Ser. No. 10/446,532, filed May 27,
2003, now U.S. Pat. No. 7,264,378, which claims the benefit
of U.S. Provisional Application Ser. No. 60/408,254 filed
Sep. 4, 2002. The entire contents of the above applications
and patents are hereby incorporated by reference herein.
10
15
BACKGROUND
Example embodiments in general relate to packaging
semiconductor devices which include light emitting diodes.
Light emitting diodes (LEDS) are often packaged within
leadframe packages. A leadframe package typically includes
a molded or cast plastic body that encapsulates an LED, a lens
portion, and thin metal leads connected to the LED and
extending outside the body. The metal leads of the leadframe
package serve as the conduit to supply the LED with electrical
power and, at the same time, may act to draw heat away from
the LED. Heat is generated by the LED when power is applied
to the LED to produce light. A portion of the leads extends out
from the package body for connection to circuits external to
the leadframe package.
Some of the heat generated by the LED is dissipated by the
plastic package body; however, most of the heat is drawn
away from the LED via the metal components of the package.
The metal leads are typically very thin and has a small cross
section. For this reason, capacity of the metal leads to remove
heat from the LED is limited. This limits the amount of power
that can be sent to the LED thereby limiting the amount of
light that can be generated by the LED.
To increase the capacity of an LED package to dissipate
heat, in one LED package design, a heat sink slug is introduced into the package. The heat sink slug draws heat from
the LED chip. Hence, it increases the capacity of the LED
package to dissipate heat. However, this design introduces
empty spaces within the package that is be filled with an
encapsulant to protect the LED chip. Furthermore, due to
significant differences in CTE (coefficient of thermal expansion) between various components inside the LED package,
bubbles tend to form inside the encapsulant or the encapsulant
tends to delaminate from various portions within the package.
This adversely affects the light output and reliability of the
product. In addition, this design includes a pair of flimsy leads
which are typically soldered by a hot-iron. This manufacturing process is incompatible with convenient surface mounting technology (SMT) that is popular in the art of electronic
board assembly.
In another LED package design, the leads of the leadframe
package have differing thicknesses extended (in various
shapes and configurations) beyond the immediate edge of the
LED package body. A thicker lead is utilized as a heatspreader and the LED chip is mounted on it. This arrangement
allows heat generated by the LED chip to dissipate through
the thicker lead which is often connected to an external heat
sink. This design is inherently unreliable due to significant
difference in coefficient of thermal expansion (CTE) between
the plastic body and the leadframe material. When subjected
SUMMARY
20
25
30
An example embodiment of the present invention is

directed to a semiconductor die package including a substrate
having conductive traces on a top surface thereof, and a light
emitting diode (LED) mounted to the top surface of the substrate via a mounting pad. The mounting pad is electrically
connected to the conductive traces on the substrate top surface. The package includes a reflector plate mechanically
mounting pad and LED, the reflector plate defining a reflection surface, and a lens substantially covering the mounting
pad and LED.
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package according to one embodiment of the present inventi on;
FIG. lB is an exploded perspective view of the semiconductor package of FIG. lA;
package of FIG. lA;
package of FIG. lA;
package of FIG. lA;
package of FIG. lA;
FIG. 3 is a cut-away side view of portions of the semiconductor package of FIG. lA;
FIG. 4 is a side view of the semiconductor package of FIG.
lA with additional elements;
FIG. 5 an exploded perspective view of a semiconductor
die package according to another embodiment of the present
invention;
package of FIG. 5;
package of FIG. 5;
package of FIG. 5; and
FIG. 6D is a bottom view ofa portion of the semiconductor
package of FIG. 5.
65
Example embodiments will now be described with reference to the FIGS. 1 through 6D. As illustrated in the Figures,
the sizes of layers or regions are exaggerated for illustrative

US 8,622,582 B2
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purposes and, thus, are provided to illustrate the general structures of the present invention. Furthermore, various aspects in
the example embodiments are described with reference to a
layer or structure being formed on a substrate or other layer or
structure. As will be appreciated by those of skill in the art,
references to a layer being formed "on" another layer or
substrate contemplates that additional layers may intervene.
References to a layer being formed on another layer or substrate without an intervening layer are described herein as
being formed "directly on" the layer or substrate.
Furthermore, relative terms such as beneath may be used
herein to describe one layer or regions relationship to another
layer or region as illustrated in the Figures. It will be understood that these terms are intended to encompass different
orientations of the device in addition to the orientation
depicted in the Figures. For example, if the device in the
Figures is turned over, layers or regions described as
"beneath" other layers or regions would now be oriented
"above" these other layers or regions. The term "beneath" is
intended to encompass both above and beneath in this situation. Like numbers refer to like elements throughout.
As shown in the figures for the purposes of illustration,
example embodiments of the present invention are exemplified by a light emitting die package including a bottom heat
sink (substrate) having traces for connecting to a light emitting diode at a mounting pad and a top heat sink (reflector
plate) substantially surrounding the mounting pad. A lens
covers the mounting pad. In effect, an example die package
comprises a two part heat sink with the bottom heat sink
utilized (in addition to its utility for drawing and dissipating
heat) as the substrate on which the LED is mounted and
connected, and with the top heat sink utilized (in addition to
its utility for drawing and dissipating heat) as a reflector plate
to direct light produced by the LED. Because both the bottom
and the top heat sinks draw heat away from the LED, more
power can be delivered to the LED, and the LED can thereby
produce more light.
Further, the body of the die package itself may act as the
heat sink removing heat from the LED and dissipating it. For
this reason, the example LED die package may not require
separate heat sink slugs or leads that extend away from the
package. Accordingly, the LED die package may be more
compact, more reliable, and less costly to manufacture than
die packages of the prior art.
package 10 according to one embodiment of the present
invention and FIG. lB is an exploded perspective view of the
semiconductor package of FIG. lA. Referring to FIGS. lA
and lB, the light emitting die package 10 of the present
invention includes a bottom heat sink 20, a top heat sink 40,
and a lens 50.
The bottom heat sink 20 is illustrated in more detail in
FIGS. 2A through 2D. FIGS. 2A, 2B, 2C, and 2D provide,
respectively, a top view, a side view, a front view, and a bottom
view of the bottom heat sink 20 of FIG. lA. Further, FIG. 2C
also shows an LED assembly 60 in addition to the front view
of the bottom heat sink 20. The LED assembly 60 is also
illustrated in FIG. lB. Referring to FIGS. lA through 2D, the
bottom heat sink 20 provides support for electrical traces 22
and 24; for solder pads 26, 32, and 34; and for the LED
assembly 60. For this reason, the bottom heat sink 20 is also
referred to as a substrate 20. In the Figures, to avoid clutter,
only representative solder pads 26, 32, and 34 are indicated
with reference numbers. The traces 22 and 24 and the solder
pads 32, 34, and 36 can be fabricated using conductive material. Further, additional traces and connections can be fabricated on the top, side, or bottom of the substrate 20, or layered
within the substrate 20. The traces 22 and 24, the solder pads
32, 34, and 36, and any other connections can be interconnected to each other in any combination using known methods, for example via holes.
The substrate 20 is made of material having high thermal
conductivity but is electrically insulating, for example, aluminum nitride (AlN) or alumina (Al 2 0 3 ). Dimensions of the
substrate 20 can vary widely depending on application and
processes used to manufacture the die package 10. For
example, in the illustrated embodiment, the substrate 20 may
have dimensions ranging from fractions of millimeters (mm)
to tens of millimeters. Although the present invention is not
limited to particular dimensions, one specific embodiment of
the die package 10 of the present invention is illustrated in
Figures with the dimensions denoted therein. All dimensions
shown in the Figures are in millimeters (for lengths, widths,
heights, and radii) and degrees (for angles) except as otherwise designated in the Figures, in the Specification herein, or
both.
The substrate 20 has a top surface 21, the top surface 21
including the electrical traces 22 and 24. The traces 22 and 24
provide electrical connections from the solder pads (for
example top solder pads 26) to a mounting pad 28. The top
solder pads 26 are portions of the traces 22 and 24 generally
proximal to sides of the substrate 20. The top solder pads 26
are electrically connected to side solder pads 32. The mounting pad 28 is a portion of the top surface (including portions
of the trace 22, the trace 24, or both) where the LED assembly
60 is mounted. Typically the mounting pad 28 is generally
located proximal to center of the top surface 21. In alternative
embodiments of the present invention, the LED assembly 60
can be replaced by other semiconductor circuits or chips.
The traces 22 and 24 provide electrical routes to allow the
LED assembly 60 to electrically connect to the solder pads
26, 32, or 34. Accordingly, some of the traces are referred to
as first traces 22 while other traces are referred to as second
traces 24. In the illustrated embodiment, the mounting pad 28
includes portions of both the first traces 22 and the second
traces 24. In the illustrated example, the LED assembly 60 is
placed on the first trace 22 portion of the mounting pad 28,
thereby making contact with the first trace 22. In the illustrated embodiment, a top of the LED assembly 60 and the
second traces 24 are connected to each other via a bond wire
62. Depending on the construction and orientation of LED
assembly 60, first traces 22 may provide anode (positive)
connections and second traces 24 may comprise cathode
(negative) connections for the LED assembly 60 (or vice
versa).
The LED assembly 60 can include additional elements. For
example, in FIGS. lB and 2C, the LED assembly 60 is illustrated including an LED bond wire 62, an LED subassembly
64, and a light emitting diode (LED) 66. Such an LED subassembly 64 is known in the art and is illustrated for the
purposes of discussing the invention and is not meant to be a
limitation of the present invention. In the Figures, the LED
assembly 60 is shown die-attached to the substrate 20. In
alternative embodiments, the mounting pad 28 can be configured to allow flip-chip attachment of the LED assembly 60.
Additionally, multiple LED assemblies can be mounted on
the mounting pad 28. In alternative embodiments, the LED
assembly 60 can be mounted over multiple traces. This is
especially true if flip-chip technology is used.
The topology of the traces 22 and 24 can vary widely from
the topology illustrated in the Figures while still remaining
within the scope of the example embodiments of the present
invention. In the Figures, three separate cathode (negative)
traces 24 are shown to illustrate that three LED assemblies
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US 8,622,582 B2
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can be placed on the mounting pad 28, each connected to a

different cathode (negative) trace; thus, the three LED assemblies may be separately electrically controllable. The traces
22 and 24 are made of conductive material such as gold,
silver, tin, or other metals. The traces 22 and 24 can have
dimensions as illustrated in the Figures and are of a thickness
on the order of microns or tens of microns, depending on
application. In an example, the traces 22 and 24 can be 15
microns thick. FIGS. lA and 2A illustrate an orientation
marking 27. Such markings can be used to identify the proper
orientation of the die package 10 even after assembling the
die package 10. The traces 22 and 24, as illustrated, can
extend from the mounting pad 28 to sides of the substrate 20.
Continuing to refer to FIGS. lA through 2D, the substrate
20 defines semi-cylindrical spaces 23 and quarter-cylindrical
spaces 25 proximal to its sides. In the Figures, to avoid clutter,
only representative spaces 23 and 25 are indicated with reference numbers. The semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25 provide spaces for solder to flowthrough and solidify-in when the die package 10 is attached to
a printed circuit board (PCB) or another apparatus (not
shown) to which the die package 10 is a component thereof.
Moreover, the semi-cylindrical spaces 23 and the quartercylindrical spaces 25 provide convenient delineation and
break points during the manufacturing process.
The substrate 20 can be manufactured as one individual
section of a strip or a plate having a plurality of adjacent
sections, each section being a substrate 20. Alternatively, the
substrate 20 can be manufactured as one individual section of
an array of sections, the array having multiple rows and
columns of adjacent sections. In this configuration, the semicylindrical spaces 23 and quarter-cylindrical spaces 25 can be
utilized as tooling holes for the strip, the plate, or the array
during the manufacturing process.
Furthermore, the semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25, combined with scribed grooves or
other etchings between the sections, assist in separating each
individual substrate from the strip, the plate, or the wafer. The
separation can be accomplished by introducing physical
stress to the perforation (semi through holes at a close pitch)
or scribe lines made by laser, or premolded, or etched lines
(crossing the semi-cylindrical spaces 23 and the quarter-cylindrical spaces 25) by bending the strip, the plate, or the
wafer. These features simplify the manufacturing process and
thus reduce costs by eliminating the need for special carrier
fixtures to handle individual unit of the substrate 20 during the
manufacturing process. Furthermore, the semi-cylindrical
spaces 23 and the quarter-cylindrical spaces 25 serve as via
holes connecting the top solder pads 26, the side solder pads
32, and the bottom solder pads 34.
The substrate 20 has a bottom surface 29 including a thermal contact pad 36. The thermal contact pad 36 can be fabricated using a material having a high thermally and electrically conductive properties such as gold, silver, tin, or another
material including but not limited to precious metals.
FIG. 3 illustrates a cut-away side view of portions of the
semiconductor package ofFIGS. lA and lB. In particular, the
FIG. 3 illustrates a cut-away side view of the top heat sink 40
and the lens 50. Referring to FIGS. lA, lB, and 3, the top heat
sink 40 is made from a material having high thermal conductivity such as aluminum, copper, ceramics, plastics, composites, or a combination of these materials. A high temperature,
mechanically tough, dielectric material can be used to overcoat the traces 22 and 24 (with the exception of the central
die-attach area) to seal the traces 22 and 24 and provide
protection from physical and environmental harm such as
scratches and oxidation. The overcoating process can be a
part of the substrate manufacturing process. The overcoat,

when used, may insulate the substrate 20 from the top heat
sink 40. The overcoat may then be covered with a high temperature adhesive such as thermal interface material manufactured by THERMOSET that bonds the substrate 20 to the
top heat sink 40.
The top heat sink 40 may include a reflective surface 42
substantially surrounding the LED assembly 60 mounted on
the mounting pad 28 (of FI GS. 2A and 2C). When the top heat
sink 40 is used to dissipate heat generated by the LED in the
die package 10, it can be "top-mounted" directly onto an
external heat sink by an adhesive or solder joint to dissipate
heat efficiently. In another embodiment, if heat has to be
dissipated by either a compressible or non-compressible
medium such as air or cooling fluid, the top heat sink 40 may
be equipped with cooling fins or any feature that will enhance
heat transfer between the top heat sink 40 and the cooling
medium. In both of these embodiments, the electrical terminals and the bottom heat sink 20 of the die package 10 can still
be connected to its application printed circuit board (PCB)
using, for example, the normal surface-mount-technology
(SMT) method.
The reflective surface 42 reflects portions oflight from the
LED assembly 60 as illustrated by sample light rays 63. Other
portions of the light are not reflected by the reflective surface
42 as illustrated by sample light ray 61. Illustrative light rays
61 and 63 are not meant to represent light traces often use in
the optical arts. For efficient reflection of the light, the top heat
sink 40 is preferably made from material that can be polished,
coined, molded, or any combination of these. Alternatively, to
achieve high reflectivity, the optical reflective surface 42 or
the entire heat sink 40 can be plated or deposited with high
reflective material such as silver, aluminum, or any substance
that serves the purpose. For this reason, the top heat sink 40 is
also referred to as a reflector plate 40. The reflector plate 40 is
made of material having high thermal conductivity if and
when required by the thermal performance of the package 10.
In the illustrated embodiment, the reflective surface 42 is
illustrated as a flat surface at an angle, for example 45 degrees,
relative to the reflective plate's horizontal plane. The example
embodiments are not limited to the illustrated embodiment.
For example, the reflective surface 42 can be at a different
angle relative to the reflective plate's horizontal plane. Alternatively, the reflective plate can have a parabolic, toroid or
any other shape that helps to meet the desired spectral luminous performance of the package.
The reflective plate 40 includes a ledge 44 for supporting
and coupling with the lens 50. The LED assembly 60 is
encapsulated within the die package 10 (of FIGS. lA and lB)
using encapsulation material 46 such as, for example only,
soft and elastic silicones or polymers. The encapsulation
material 46 can be a high temperature polymer with high light
transmissivity and refractive index that matches or closely
matches refractive index of the lens 50, for example. The
encapsulant 46 is not affected by most wavelengths that alter
its light transmissivity or clarity.
The lens 50 is made from material having high light transmissivity such as, for example only, glass, quartz, high temperature and transparent plastic, or a combination of these
materials. The lens 50 is placed on top of and adheres to the
encapsulation material 46. The lens 50 is not rigidly bonded
to the reflector 40. This "floating lens" design enables the
encapsulant 46 to expand and contract under high and low
temperature conditions without difficulty. For instance, when
the die package 10 is operating or being subjected to a high
temperature environment, the encapsulant 46 experiences
greater volumetric expansion than the cavity space that con-
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US 8,622,582 B2
tains it. By allowing the lens 50 to float up somewhat freely on

top of the encapsulant 46, no encapsulant will be squeezed out
of its cavity space. Likewise, when the die package 10 is
subjected to a cold temperature, the encapsulant 46 will contract more than the other components that make up the cavity
space for the encapsulant 46; the lens will float freely on top
of the encapsulant 46 as the latter shrinks and its level drops.
Hence, the reliability of the die package 10 is maintained over
relatively large temperature ranges as the thermal stresses
induced on the encapsulant 46 is reduced by the floating lens
design.
In some embodiments, the lens 50 defines a recess 52 (See
FIG. 3) having a curved, hemispherical, or other geometry,
which can be filled with optical materials intended to influence or change the nature of the light emitted by the LED
chip(s) before it leaves the die package 10. Examples ofone
type of optical materials include luminescence converting
phosphors, dyes, fluorescent polymers or other materials
which absorb some of the light emitted by the chip(s) and
re-emit light of different wavelengths. Examples of another
type of optical materials include light diffusants such as calcium carbonate, scattering particles (such as Titanium
oxides) or voids which disperse or scatter light. Any one or a
combination of the above materials can be applied on the lens
50 to obtain certain spectral luminous performance.
FIG. 4 illustrates the die package 10 coupled to an external
heat sink 70. Referring to FIG. 4, the thermal contact pad 36
can be attached to the external heat sink 70 using epoxy,
solder, or any other thermally conductive adhesive, electrically conductive adhesive, or thermally and electrically conductive adhesive 7 4. The external heat sink 70 can be a printed
circuit board (PCB) or other structure that draws heat from the
die package 10. The external heat sink can include circuit
elements (not shown) or heat dissipation fins 72 in various
configurations.
An example embodiment having an alternate configuration
is shown in FIGS. 5 through 6D. Portions of this second
embodiment are similar to corresponding portions of the first
embodiment illustrated in FIGS. lA through 4. For convenience, portions of the second embodiment as illustrated in
FIGS. 5 through 6D that are similar to portions of the first
embodiment are assigned the same reference numerals,
analogous but changed portions are assigned the same reference numerals accompanied by letter "a," and different portions are assigned different reference numerals.
FIG. 5 is an exploded perspective view of an LED die
package lOa in accordance with other embodiments of the
present invention. Referring to FIG. 5, the light emitting die
package lOa of the present invention includes a bottom heat
sink (substrate) 20a, a top heat sink (reflector plate) 40a, and
a lens 50.
FIGS. 6A, 6B, 6C, and 6D, provide, respectively, a top
view, a side view, a front view, and a bottom view of the
substrate 20a of FIG. 5. Referring to FIGS. 5 through 6D, the
substrate 20a includes one first trace 22a and four second
traces 24a. Traces 22a and 24a are configured differently than
traces 22 and 24 of FIG. 2A. The substrate 20a includes
flanges 31 that define latch spaces 33 for reception oflegs 35
of the reflector plate 40a, thereby mechanically engaging the
reflector plate 40a with the substrate 20a.
The example embodiments of the present invention being
thus described, it will be obvious that the same may be varied
in many ways. Such variations are not to be regarded as a
departure from the exemplary embodiments of the present
invention, and all such modifications as would be obvious to
one skilled in the art are intended to be included within the
scope of the following claims.
What is claimed is:

an electrically insulating substrate comprising a substantially planar top surface and a substantially planar bottom surface;
a plurality of traces disposed on the top surface of the
substrate;
a light emitting diode (LED) mounted on the top surface of
the substrate and proximate a center of the substrate, and
the LED being connected to one or more traces of the
plurality of traces; and
a thermal contact pad disposed on the bottom surface of the
substrate.
extend to at least one side of the substrate.
3. The package of claim 2, wherein the substrate and the
portion of the plurality of traces extending around the side to
an end portion of the bottom surface have spaces formed
therein.
4. The package of claim 1, wherein the electrically insulating substrate has a high thermal conductivity.
5. The package of claim 1, wherein the electrically insulating substrate comprises aluminum nitride.
6. The package of claim 1, further comprising a plurality of
connection pads disposed on the bottom surface of the substrate, the plurality of connection pads being electrically connected to the plurality of traces.
7. The package of claim 6, wherein the plurality of connection pads are positioned at edges of the bottom surface.
8. The package of claim 1, wherein the thermal pad is
isolated from the plurality of connection pads on the bottom
surface.
9. The package of claim 1, wherein an encapsulant covering the LED.
covering the LED.
the encapsulant.
13. The package of claim 9, wherein the encapsulant comprises silicon.
14. A light emitting die package comprising:
an electrically insulating substrate comprising a top surface, a bottom surface, and a substantially uniform
thickness;
substrate;
the substrate, proximate a center of the substrate, and the
LED being connected to at least one trace of the plurality
of traces;
substrate; and
a reflector coupled to the substrate and substantially surrounding the LED, the reflector defining a reflection
surface.
15. The package of claim 14, wherein the reflector comprises a material having high thermal conductivity.
16. The package of claim 14, wherein the reflector plate
and the substrate serve as heat sinks for dissipating heat
generated by the LED.
covering the LED.
an electrically insulating substrate comprising a top surface and a bottom surface;
10
15
20
25
30
35
40
45
50
55
60
65

US 8,622,582 B2
10
9
substrate;
the substrate and connected to the plurality of traces;
substrate; and
a lens over the LED, the lens sitting on and adhering
adheres to the encapsulant, the lens free to move as the
encapsulant expands and contracts.
an electrically insulating substrate comprising a top surface and a bottom surface;
substrate;
the substrate and connected to the plurality of traces;
substrate; and
a lens over the LED, the lens sitting on and adhering
adheres to the encapsulant and the lens being, free to
move relative to the substrate.
* * * * *
10
15
20
EXHIBIT E

US009070850B2
c12)
(10)
Keller et al.
(45)
(54)
LIGHT EMITTING DIODE PACKAGE AND

METHOD FOR FABRICATING SAME
(75)
Inventors: Bernd Keller, Santa Barbara, CA (US);

Nicholas Medendorp, Jr., Raleigh, NC
(US); Thomas Cheng-Hsin Yuan,
Ventura, CA (US)
(73)
Assignee: Cree, Inc., Goleta, CA (US)
( *)
Notice:
Appl. No.: 11/982,275
(22)
Filed:
(58)

CN
CN
1274906 A
2498694
11/2000
712002
(Continued)
OTHER PUBLICATIONS
Office Action from related U.S. Appl. No. 11/600,617, dated: Dec.
22, 2009.
(Continued)

US 2009/0108281 Al
(52)
12/1981 Groff
3/1982 Sadamasa et al.
(Continued)
Oct. 31, 2007
(65)
(51)
4,307,297 A
4,322,735 A

U.S.C. 154(b) by 432 days.
(21)
Patent No.:
US 9,070,850 B2
Date of Patent:
Jun.30,2015
Primary Examiner - Allison P Bernstein

(74) Attorney, Agent, or Firm - Koppel, Patrick, Heybl &
Philpott
Apr. 30, 2009
Int. Cl.
HOJL33/62
(2010.01)
(2010.01)
HOJL33/64
(2010.01)
HOlL 33154
U.S. Cl.
CPC ................. HOJL 33162 (2013.01); HOlL 33154
(2013.01); HOJL 33164 (2013.01); HOlL
331647 (2013.01); HOlL 2224148091 (2013.01);
HOlL 2224148227 (2013.01); HOlL 2224148247
(2013.01); HOlL 2224173265 (2013.01); HOlL
2224132245 (2013.01); HOlL 2924101019
(2013.01); HOlL 2924101087 (2013.01)
Field of Classification Search
CPC ........ H01L 33/647; HOlL 33/64; HOlL 33/62
USPC ............... 257/79, 98-100, E33.066, E33.075
(57)
bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is
included on one of the top elements such that an electrical
signal applied to the top elements causes the LED to emit
light. The electrically conductive elements also spread heat
from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on
the bottom surface of said submount and spreads heat from
the submount, and a lens is formed directly over the LED. A
method for fabricating LED packages includes providing a
submount panel sized to be separated into a plurality of LED
package submounts. Top conductive elements are formed on
one surface of the submount panel for a plurality of LED
packages, and LEDs are attached to the top elements. Lenses
are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
References Cited
(56)

3,760,237 A
4,152,044 A
ABSTRACT
An LED package includes a submount having a top and
911973 Jaffe ............................... 257 /98

5/1979 Liu
r30
32
40

US 9,070,850 B2
Page 2
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U.S. Appl. No. 11/614,180, filed Dec. 21, 2006, Negley.
U.S. Appl. No. 11/624,811, filed Jan. 19, 2007, Negley et al.
U.S. Appl. No. 11/743,754, filed May 3, 2007, Van de Ven.
U.S. Appl. No. 11/751,982, filed May 22, 2007, Negley et al.
U.S. Appl. No. 11/753, 103, filed May 24, 2007, Negley et al.
U.S. Appl. No. 11/751,990, filed May 22, 2007, Negley.
U.S. Appl. No. 11/755, 153, filed May 30, 2007, Negley et al.
U.S. Appl. No. 11/856,421, filed Sep. 17, 2007, Van de Ven.
U.S. Appl. No. 11/859,048, filed Sep. 21, 2007, Van de Ven et al.
U.S. Appl. No. 11/939,047, filed Nov. 13, 2007, Negley.
U.S. Appl. No. 11/936,163, filed Nov. 7, 2007, Van de Ven et al.
U.S. Appl. No. 11/843,243, filed Aug. 22, 2007, Van de Ven et al.
U.S. Appl. No. 11/939,052, filed Nov. 13, 2007, Pickard et al.
U.S. Appl. No. 11/736,799, filed Apr. 18, 2007, Van de Ven et al.
U.S. Appl. No. 11/877,038, filed Oct. 23, 2007, Trott et al.
U.S. Appl. No. 11/870,679, filed Oct. 11, 2007, Negley.
U.S. Appl. No. 11/948,041, filed Nov. 30, 2007, Trott et al.
U.S. Appl. No. 11/949,222, filed Dec. 3, 2007, Negley.
U.S. Appl. No. 12/174,053, filed Jul. 16, 2008, Negley et al.
U.S. Appl. No. 12/002,429, filed Dec. 4, 2007, Loh et al.
U.S. Appl. No. 12/045,729, filed Mar. 11, 2008, Roberts et al.
U.S. Appl. No. 11/818,818, filed Jun. 14, 2007, Chakraborty et al.
Notification of Reexamination from Chinese Appl. No.
2010101673462, dated Jan. 12. 2015.
Third Office Action from Chinese Appl. No. 2008800092557, dated
Dec. 29, 2014.
Examination Report from EU Application No. 07 789 665.2. dated
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Office Action from Japanese Patent Appl. No. 2013-18883. dated
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* cited by examiner
U.S. Patent
Jun.30,2015
US 9,070,850 B2
Sheet 1of9
~10
FIG. 1a
PRIOR ART
11
13
15A
FIG. 1b
PRIOR ART
~20
22
24
23
25B
30~
58
46
74
32
52
FIG. 2g
60
U.S. Patent
Jun.30,2015
Sheet 2of9
FIG. 2a
US 9,070,850 B2
~30
69
32
48
40
46
38
65
2g
60
2g
~30
74
32
50
34
62
FIG. 2b
30""
50
66
56
56
FIG. 2c
0
32
U.S. Patent
Jun.30,2015
70
US 9,070,850 B2
Sheet 3of9
44
60
~30
60
32
40
30""
32
FIG. 2e
FIG. 2d
U.S. Patent
Jun.30,2015
Sheet 4of9
US 9,070,850 B2
FIG. 2f
30""'
62
46
U.S. Patent
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US 9,070,850 B2
Sheet 5of9
FIG. 3a
40
32
FIG. 3b
106
64
65
104
~100
40
32
100""
FIG. 3c
114
110
112
54
32
116
U.S. Patent
Jun.30,2015
Sheet 6of9
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70
32
104
FIG. 3d
32
FIG. 3e
U.S. Patent
Jun.30,2015
Sheet 7of9
US 9,070,850 B2
r150
32
56
FIG. 4a
150~
32
FIG. 4b
U.S. Patent
Jun.30,2015
US 9,070,850 B2
Sheet 8of9
200~
FIG. 5
202
SUBSTRATE
PANEL
206
208
210
DIE
ATTACH
FLUX
CLEAN
WIRE
BOND
WHITE
CHIP
204
-----------
I_ -
PACK&
SHIP
TEST
220
: PHOSPHOR :- - - - - -
_.........._
DICING
218
216
212
SILICONE
MOLDING
214
250
252
FIG. 6a
250
252
FIG. 6b
U.S. Patent
Jun.30,2015
US 9,070,850 B2
Sheet 9of9
FIG. la
....--...lb
0
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
0000000000000000000000
000 000000000000000000
I
258
......-....7b
256
258
258
256
FIG. lb

US 9,070,850 B2
1
LIGHT EMITTING DIODE PACKAGE AND

METHOD FOR FABRICATING SAME
required to carefully align and mount the reflector, which may

add to the expense and complexity of the manufacturing
process for such packages.
For higher powered operation it may also be difficult to
transfer dissipate heat generated by the LED chip 22. Submounts can be made of materials such as ceramics that are
robust but do not efficiently conduct heat. Heat from the LED
chip passes into the submount below the LED chip, but does
not efficiently spread outward from below the LED where it
can then dissipate. Heat from the LED tends to localize below
the LED and can increase as operation of the LED package.
This increased heat can result is reduced lifetime or failure of
the package.
BACKGROUND OF THE INVENTION

5
1. Field of the Invention

This invention relates to light emitting diodes, and in particular to light emitting diode packages having a molded lens.
2. Description of the Related Art
Light emitting diodes (LED or LEDs) are solid state
devices that convert electric energy to light, and generally
comprise one or more active layers of semiconductor material
sandwiched between oppositely doped layers. When a bias is
applied across the doped layers, holes and electrons are
injected into the active layer where they recombine to generate light. Light is emitted from the active layer and from all
surfaces of the LED.
In order to use an LED chip in a circuit or other like
arrangement, it is known to enclose an LED chip in a package
to provide environmental and/or mechanical protection, color
selection, focusing and the like. An LED package also
includes electrical leads, contacts or traces for electrically
connecting the LED package to an external circuit. In a typical LED package 10 illustrated in FIG. lA, an LED chip 12 is
mounted on a reflective cup 13 by means of a solder bond or
conductive epoxy. One or more wire bonds 11 connect the
ohmic contacts of the LED chip 12 to leads 15A and/or 15B,
which may be attached to or integral with the reflective cup
13. The reflective cup may be filled with an encapsulant
material 16 containing a wavelength conversion material such
as a phosphor. Light emitted by the LED at a first wavelength
may be absorbed by the phosphor, which may responsively
emit light at a second wavelength. The entire assembly is then
encapsulated in a clear protective resin 14, which may be
molded in the shape of a lens to collimate the light emitted
from the LED chip 12. While the reflective cup 13 may direct
light in an upward direction, optical losses may occur when
the light is reflected (i.e. some light may be absorbed by the
reflector cup instead of being reflected). In addition, heat
retention may be an issue for a package such as the package
10 shown in FIG. lA, since it may be difficult to extract heat
through the leads 15A, 15B.
A conventional LED package 20 illustrated in FIG. lB may
be more suited for high power operations which may generate
more heat. In the LED package 20, one or more LED chips 22
are mounted onto a carrier such as a printed circuit board
(PCB) carrier, substrate or submount 23. A metal reflector 24
mounted on the submount 23 surrounds the LED chip(s) 22
and reflects light emitted by the LED chips 22 away from the
package 20. The reflector 24 also provides mechanical protection to the LED chips 22. One or more wirebond connections 11 are made between ohmic contacts on the LED chips
22 and electrical traces 25A, 25B on the carrier 23. The
mounted LED chips 22 are then covered with an encapsulant
26, which may provide environmental and mechanical protection to the chips while also acting as a lens. The metal
reflector 24 is typically attached to the carrier by means of a
solder or epoxy bond.
While a package such as the package 20 illustrated in FIG.
lB may have certain advantages for high power operation,
there may be a number of potential problems associated with
using a separate metal piece as a metal reflector. For example,
small metal parts may be difficult to manufacture repeatable
with a high degree of precision at a reasonable expense. In
addition, since the reflector is typically affixed to a carrier
using an adhesive, several manufacturing steps may be
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SUMMARY OF THE INVENTION

One embodiment of an LED package according to the
present invention comprises a submount having a top and
bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is
included on one of the top elements such that an electrical
signal applied to the top elements causes the LED to emit
light. The electrically conductive elements also spread heat
from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on
the bottom surface of said submount and conducts heat from
the submount. A lens is formed directly over the LED.
Another embodiment of an LED package according to the
present invention comprises a submount having a top and
bottom surface with an attach pad on the top surface, a first
contact pad on the top surface is integral to the attach pad, and
a second contact pad on the top surface. An LED is mounted
to the attach pad, and when an electrical signal is applied to
the first and second contact pads causing the LED to emit
light. The pads also comprise thermally conductive layers
covering most of the top surface to spread heat from the LED
to the majority of the top surface. An optical element is
formed directly over said LED.
Another embodiment of an LED package according to the
present invention comprises, a submount having a top and
bottom surface, with an LED mounted on the top surface. A
lens is formed directly on the LED and a portion of the top
surface. A top heat spreading element on the top surface
spreads heat from the LED across the majority of the top
surface, and a bottom heat spreading element on the bottom
surface of the submount that conducts heat from the submount.
One embodiment of a method for fabricating LED packages according to the present invention, comprises providing
a submount panel sized to be separated into a plurality of LED
package submounts. Top conductive elements are formed on
one surface of the submount panel for a plurality of LED
packages. LEDs are attached to the top elements with the
LEDs electrically connected to the top conductive elements.
Lenses are molded over the LEDs and the substrate panel is
singulated to separate it into a plurality of LED packages.
A method for fabricating a plurality of surface mount LED
packages according to the present invention, comprises providing a submount panel sized to accommodate formation of
a plurality of LED packages. Sets of attach pads and contact
pads are formed on one surface of the submount panel, with
each of the sets corresponding to one of the LED packages to
be formed from said submount panel. A plurality of LEDs are
attached to the submount panel with each of the LEDs
attached and electrically connected to one of the sets of attach
pads and contact pads. A plurality oflenses are molded on the
submount panel with each of the lenses over one of the LEDs.

US 9,070,850 B2
3
Sets of surface mount contacts are formed on the surface of

the submount panel opposite the sets of attach pads and contact pads, each of the sets of surface mount contacts corresponding to a respective one of the sets of attach pads and
contact pads. The substrate panel is singulated to separate it
into a plurality of LED packages.
These and other aspects and advantages of the invention
will become apparent from the following detailed description
and the accompanying drawings which illustrate by way of
example the features of the invention.
one or more LEDs to protect the LED while still allowing for
efficient emission characteristics.
The present invention is also directed to methods for fabricating LED packages using processing steps that allow for
the simultaneous formation of a plurality of packages. This
can reduce the manufacturing complexity and cost of LED
package fabrication.
The present invention provides low cost, relatively small
size LED packages that provide an efficient but small light
source. The packages according to the present invention are
particularly adapted to surface mount technologies and provide features that allow for the good thermal dissipation,
allowing the packages to operate at elevated power levels
without overheating.
It is understood that when an element such as a layer,
elements may also be present. Furthermore, relative terms
such as "inner", "outer", "upper", "above", "lower",
"beneath", and "below", and similar terms, may be used
herein to describe a relationship of one layer or another
region. It is understood that these terms are intended to
encompass different orientations of the device in addition to
the orientation depicted in the figures.
Although the terms first, second, etc. maybe used herein to
describe various elements, components, regions, layers and/
or sections, these elements, components, regions, layers and/
or sections should not be limited by these terms. These terms
are only used to distinguish one element, component, region,
layer or section from another region, layer or section. Thus, a
first element, component, region, layer or section discussed
below could be termed a second element, component, region,
layer or section without departing from the teachings of the
present invention.
Embodiments of the invention are described herein with
reference to cross-sectional view illustrations that are schematic illustrations ofidealized embodiments of the invention.
As such, variations from the shapes of the illustrations as a
result, for example, of manufacturing techniques and/or tolerances are expected. Embodiments of the invention should
not be construed as limited to the particular shapes of the
regions illustrated herein but are to include deviations in
shapes that result, for example, from manufacturing. A region
illustrated or described as square or rectangular will typically
have rounded or curved features due to normal manufacturing
tolerances. Thus, the regions illustrated in the figures are
schematic in nature and their shapes are not intended to illustrate the precise shape of a region of a device and are not
intended to limit the scope of the invention.
The present invention can be used in with many different
solid state emitters with the embodiments of the invention
below being described in relation to LEDs, and in particular to
white emitting LEDs and LED packages. It is understood that
the present invention can also use other solid state emitter
packages beyond the embodiment shown. The present invention can also be used with multiple emitter packages, such as
LED packages having more than one LED. The present invention can be used in any application wherein a conversion
material is used to down-convert the wavelength oflight from
an emitter, and the discussion of the present invention with
reference to the following embodiment should not be construed as limiting to the that particular embodiment or similar
embodiments.
FIGS. 2a through 2g show one embodiment of an LED
package 30 according to the present invention generally comprising a substrate/submount ("submount'') 32 with one or
more LEDs emitting the same or different colors. In the
10

FIG. lA is a sectional view of a prior art LED package;
FIG. lB is a sectional view of another prior art LED package;
FIG. 2a is a top view of one embodiment of an LED
package according to the present invention;
FIG. 2b is a side view of the LED package shown in FIG.
2a;
FIG. 2c is a bottom view of the LED package shown in FIG.
2a;
FIG. 2d is an upper perspective view of the LED package
shown in FIG. 2a;
FIG. 2e is a bottom perspective view of the LED package
shown in FIG. 2a;
FIG. 2/is an exploded view of the LED package shown in
FIG. 2a;
FIG. 2g is a sectional view of the LED package shown in
FIG. 2a, taken along section lines 2g-2g;
FIG. 3a is a side view of another embodiment of an LED
package according to the present invention;
FIG. 3b is top view of the LED package shown in FIG. 3a;
FIG. 3c is a bottom view of the LED package shown in FIG.
3a;
FIG. 3d is an upper perspective view of the LED package
shown in FIG. 3a;
FIG. 3e is a bottom perspective view of the LED package
shown in FIG. 3a;
FIG. 4a is an upper perspective view of another embodiment of an LED package according to the present invention;
FIG. 4b is a bottom perspective view of the LED package
shown in FIG. 2a;
FIG. 5 is a flow diagram for one embodiment of a fabrication method according to the present invention;
FIG. 6a is a sectional view of one embodiment of a lens
mold according to the present invention;
FIG. 6b is another sectional view of the lens mold shown in
FIG. 6a;
FIG. 7a is a plan view of one embodiment of a submount
panel with lenses arranged according to the present invention;
and
FIG. 7b is a sectional view of the submount panel taken in
FIG. 7 a taken along section lines 7 b-7b.
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DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to compact, simple and
efficient LED packages and methods for manufacturing
same. Different embodiments can comprise one or more high
power LEDs that typically operate at elevated temperatures.
Packages according to the present invention can include features to provide for improved thermal management by
spreading the heat from the LED. The heat can then dissipate
into the ambient. The packages according to the present
invention can also comprise a lens molded directly over the
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US 9,070,850 B2
5
embodiment shown, a single LED 34 is mounted on the

submount 32. The LED 34 can have many different semiconductor layers arranged in different ways. LED structures and
their fabrication and operation are generally known in the art
and only briefly discussed herein. The layers of the LED 34
can be fabricated using known processes with a suitable process being fabrication using metal organic chemical vapor
deposition (MOCVD). The layers of the LEDs 34 generally
comprise an active layer/region sandwiched between first and
second oppositely doped epitaxial layers all of which are
formed successively on a growth substrate. LEDs can be
formed on a wafer and then singulated for mounting in a
package. It is understood that the growth substrate can remain
as part of the final singulated LED or the growth substrate can
be fully or partially removed.
It is also understood that additional layers and elements can
also be included in the LED 34, including but not limited to
buffer, nucleation, contact and current spreading layers as
well as light extraction layers and elements. The active region
can comprise single quantum well (SQW), multiple quantum
well (MQW), double heterostructure or super lattice structures. The active region and doped layers may be fabricated
from different material systems, with preferred material systems being Group-III nitride based material systems. GroupIII nitrides refer to those semiconductor compounds formed
between nitrogen and the elements in the Group III of the
periodic table, usually aluminum (Al), gallium (Ga), and
indium (In). The term also refers to ternary and quaternary
compounds such as aluminum gallium nitride (AlGaN) and
aluminum indium gallium nitride (A!InGaN). In a preferred
embodiment, the doped layers are gallium nitride (GaN) and
the active region is InGaN. In alternative embodiments the
doped layers may be AlGaN, aluminum gallium arsenide
(AlGaAs) or aluminum gallium indium arsenide phosphide
(AlGainAsP).
The growth substrate can be made of many materials such
at sapphire, silicon carbide, aluminum nitride (AlN), GaN,
with a suitable substrate being a 4H polytype of silicon carbide, although other silicon carbide polytypes can also be
used including 3C, 6H and 15R polytypes. Silicon carbide has
certain advantages, such as a closer crystal lattice match to
Group III nitrides than sapphire and results in Group III
nitride films of higher quality. Silicon carbide also has a very
high thermal conductivity so that the total output power of
Group-III nitride devices on silicon carbide are typically not
limited by the thermal dissipation of the substrate (as may be
the case with some devices formed on sapphire). SiC substrates are available from Cree Research, Inc., of Durham,
N.C. and methods for producing them are set forth in the
scientific literature as well as in a U.S. Pat. Nos. Re. 34,861;
4,946,547; and 5,200,022.
The LED 34 can also comprise a conductive current
spreading structure 36 and wire bond pads 38 on its top
surface, both of which are made of a conductive material and
can be deposited using known methods. Some materials that
can be used for these elements include Au, Cu, Ni, In, Al, Ag
or combinations thereof and conducting oxides and transparent conducting oxides. The current spreading structure 36
generally comprises conductive fingers 37 arranged in a grid
on the LED 34 with the fingers spaced to enhance current
spreading from the pads 38 into the LED's top surface. In
operation, an electrical signal is applied to the pads 38, such
as through a wire bond as described below, and the electrical
signal spreads through the fingers 37 of the current spreading
structure 36 and the top surface into the LED 34. Current
spreading structures are often used in LEDs where the top
surface is p-type, but can also be used for n-type materials.
The LED can be coated with one or more phosphors with

the phosphors absorbing at least some of the LED light and
emitting a different wavelength of light such that the LED
emits a combination oflight from the LED and the phosphor.
In a preferred embodiment the LED emits a white light combination of LED and phosphor light. The LED can be coated
and fabricated using many different methods, with one suitable method being described in U.S. patent application Ser.
Nos. 11/656,759 and 11/899,790, both entitled "Wafer Level
Phosphor Coating Method and Devices Fabricated Utilizing
Method", and both of which are incorporated herein by reference. Alternatively the LEDs can be coated using other
methods such an electrophoretic deposition (EPD), with a
suitable EPD method described in U.S. patent application Ser.
No. 111473,089 entitled "Close Loop Electrophoretic Deposition of Semiconductor Devices", which is also incorporated
herein by reference. It is understood that LED packages
according to the present invention can also have multiple
LEDs of different colors, one or more of which may be white
emitting.
The submount 32 can be formed of many different materials with a preferred material being electrically insulating.
Suitable materials include, but are not limited to ceramic
materials such as aluminum oxide, aluminum nitride or
organic insulators like polyimide (PI) and polyphthalamide
(PPA). In other embodiments the submount 32 can comprise
a printed circuit board (PCB), sapphire or silicon or any other
suitable material, such as T-Clad thermal clad insulated substrate material, available from The Bergquist Company of
Chanhassen, Minn. For PCB embodiments different PCB
types can be used such as standard FR-4 PCB, metal core
PCB, or any other type of printed circuit board. As more fully
described below, LED packages according to the present
invention can be fabricated using a method that utilizes a
submount panel sized to accommodate a plurality of sumbmounts. Multiple LED packages can be formed on the panel,
with the individual packages being singulated from the panel.
The submount 3 2 has a top surface 40 comprising patterned
conductive features that can include a die attach pad 42 with
an integral first contact pad 44. A second contact pad 46 is also
included on the submount's top surface 40 with the LED 34
mounted approximately at the center of the attach pad 42.
These patterned conductive features provide conductive
paths for electrical connection to the LED 34 using known
contacting methods. The LED can be mounted to the attach
pad 42 using known methods and material mounting such as
using conventional solder materials that may or may not
contain a flux material or dispensed polymeric materials that
may be thermally and electrically conductive.
The size of the submount 32 in package 30 can vary
depending on different factors, with one being the size of the
LED. For example, the size of the package 30 can be essentially of the same dimension as the effective heat spreading
area in the attach pad, and first and second contact pads 42, 44,
and 46. In a package having a 1 mm LED, the submount can
be approximately 3 .5 mm by 3 .5 mm; with a package having
a 0.7 mm chip it can be 3.2 mm by 3.2 mm and generally of
square shape in both cases. It is further understood that the
submount can have other shapes including circular, rectangular or other multiple sided shapes.
The attach pad 42 and first and second contact pads 44, 46
can comprise much different material such as metals or other
conductive materials. In one embodiment the pads 42, 44, 46
comprise copper deposited using known techniques such as
plating. In typical plating process a titanium adhesion layer
and copper seed layer are sequentially sputtered onto a substrate. Then, approximately 75 microns of copper is plated
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US 9,070,850 B2
7
onto the copper seed layer. The resulting copper layer being
deposited can then be patterned using standard lithographic
processes. In other embodiments the layer can be sputtered
using a mask to form the desired pattern.
In some embodiments according to the present invention
some of the conductive features can include only copper, with
others of the features including additional materials. For
example, the attach pad 42 can be plated or coated with
additional metals or materials to the make the attach pad 42
more suitable for mounting an LED 34. For example, the
attach pad 42 can be plated with adhesive or bonding materials, or reflective and barrier layers.
A gap 48 (best shown in FIGS. 2a and 2d) is included
between the second pad 46 and the attach pad 42 down to the
surface of the submount 32 that, with the gap providing electrical isolation between the attach pad 42 and second pad 46.
As more further described below, an electrical signal is
applied to the LED 34 through the second pad 46 and the first
pad 44, with the electrical signal on the first pad 44 passing
directly to the LED 34 through the attach pad 42 and the
signal from the second pad passing into the LED 34 through
wire bonds. The gap 48 provides electrical isolation between
the second pad 46 and attach pad to prevent shorting of the
signal applied to the LED 34.
In some embodiments an electrical signal can be applied to
the package 30 by providing external electrical contact to the
first and second bond pads 44, 46 such as by solder contacts or
other conductive paths to a PCB. In the embodiment shown
the LED package 30 is arranged for mounting using surface
mount technology and having internal conductive paths. The
LED 30 comprises first and second surface mount pads 50, 52
(best shown in FIGS. 2c and 2e) that can be formed on the
submount's back surface 54, at least partially in alignment
with the first and second contact pads 44, 46, respectfully.
Conductive vias 56 are formed through the submount 32
between the first mounting pad 50 and the first contact pad 44,
such that when a signal is applied to the first mounting pad 50
is conducted to first contact pad 44. Similarly, conductive vias
56 are formed between the second mounting pad 52 and
second contact pad 46 to conduct an electrical signal between
the two. The first and second mounting pads 50, 52 allow for
surface mounting of the LED package 30 with the electrical
signal to be applied to the LED 34 applied across the first and
second mounting pads 50, 52. The vi as 56 and mounting pads
50,52 can made of many different materials deposited using
different techniques, such as those used for the attach and
contact pads 42, 44, 46.
It is understood that the mounting pads 50, 52 and vias 56
can be arranged in many different ways and can have many
different shapes and sizes. It is also understood that instead of
vias, one or more conductive traces can be provided on the
surface of the submount between the mounting pads and
contact pads, such as along the side surface of the submount.
A solder mask 58 made of conventional materials can be
included on the submount's top surface 40, at least partially
covering the attach pad 42 and the first and second contact
pads 44, 46, and at least partially covering the gap 48. The
solder mask 58 protects these features during subsequent
processing steps and in particular mounting the LED 34 to the
attach pad 42 and wire bonding. During these steps there can
be a danger of solder or other materials depositing in undesired areas, which can result in damage to the areas or result in
electrical shorting. The solder mask serves as an insulating
and protective material that can reduce or prevent these dangers. The solder mask comprises an opening for mounting the
LED 34 to the attach pad 42 and for attaching wire bonds to
the second contact pad 46. It also comprises side openings 60
to allow convenient electrical access to the contact pads 44, 46

for testing the package 30 during fabrication. The solder mask
58 also has alignment holes that provide for alignment during
fabrication of the package 30 and also allow for alignment
when mounted in place by the end user.
In some embodiments the solder mask can be provided
with a symbol or indicator 69 to illustrate which side of the
LED package 30 should be coupled to the plus or minus of the
signal to be applied to the package. This can ensure accurate
mounting of the LED package 30 to a PCB or other fixture,
whether by machine or hand. In the embodiment shown the
symbol 69 comprises a plus (+) sign over the first contact pad
44, indicating that the package 30 should be mounted with the
positive of the signal coupled to the first mounting pad 50.
The minus of the signal would then be coupled to the second
mounting pad 52. It is understood that many different symbol
types can be used and that a symbol can also be included over
the second conductive pad 46. It is also understood that the
symbols can be placed in other locations other than the solder
mask58.
The package 30 can also comprise elements to protect
against damage from electrostatic discharge (ESD). In the
embodiment shown the elements are on-chip, and different
elements can be used such as various vertical silicon (Si)
Zener diodes, different LEDs arranged in parallel and reverse
biased to the LED 34, surface mount varistors and lateral Si
diodes. In the embodiment shown a Zener diode 62 is utilized
and is mounted to the attach pad 42 using known mounting
techniques. The diode is relatively small so that it does not
cover an excessive area on the surface of the submount 32.
It is noted that the solder mask 58 includes and opening for
the ESD diode 62 so that it can be mounted to the attach pad
42. Different mounting materials and methods can be used
such as those used to mount the LED 34 to the attach pad 42.
An ESD wire bond 64 is included between the second contact
pad 46 at the solder mask opening and the ESD diode 62. Two
LED wire bonds 65 are also included between the solder mask
opening in the second contact pad 46 and wire bond pads 38
on the LED 34. In other embodiments only one wire bond can
be included between the LED 34 and second contact pad. This
LED 34 and ESD diode 62 arrangement allows excessive
voltage and/or current passing through the LED package 30
from an ESD event to pass through the diode 62 instead of the
LED 34, protecting the LED 34 from damage. The wire bonds
64 and 65 can be applied using known methods and can
comprise known conductive materials, with a suitable material being gold (Au). It is understood that in other embodiments of an LED package according to the present invention
can be provided without an ESD element/diode or with an
ESD element/diode that is external to the LED package 30.
As mentioned above, heat typically does not spread efficiently into the submount 32, particularly those made of
materials such as ceramic. When an LED is provided on an
attach pad that extends generally only under the LED, heat
does not spread through most of the submount, and is generally concentrated to the area just below the LED. This can
cause overheating of the LED which can limit the operating
power level for the LED package.
To improve heat dissipation in the LED package 30 the
pads 42, 44, 46 provide extending thermally conductive paths
to laterally conduct heat away from the LED 34 such that it
can spread to other areas of the submount beyond the areas
just below the LED 34. The attach pad 42 covers more of the
surface of the submount 32 than the LED 34, with the attach
pad extending from the edges of the LED 34 toward the edges
of the submount 32. In the embodiment shown, the attach pad
42 is generally circular and extending radially from LED 34
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toward the edges of the submount 32. A portion of the attach

pad 42 intersects with the first and second contact pads 44, 46,
with the gap 48 separating part of the attach pad adjacent to
the second contact pad 46. It is understood that the contact
pad 42 can be many other shapes and in some embodiments it
can extend to the edge of the submount 32.
The contact pads 44, 46 also cover the surface of the submount 32 extending out from the vias, and covering the area
between the vias 56, and the area between the vias 56 and the
edges of the submount 32. By extending the pads 42, 44 and
46 this way, the heat spreading from the LED 34 is improved.
This improves thermal dissipation of heat generated in the
LED 34, which improves its operating life and allows for
higher operating power. The pads 42, 44, and 46 can cover
different percentages of the top surface 40 of the submount
32, with a typical coverage area being greater than 50%. In the
LED package 30, the pads 42, 44 and 46 can cover approximately 70% of the submount. In other embodiments the coverage area can be greater than 75%.
The LED package 30 can further comprise a metalized area
66 on the back surface 54 of the submount, between the first
and second mounting pads 50, 52. The metalized area is
preferably made of a heat conductive material and is preferably in at least partial vertical aligmnent with the LED 34. In
one embodiment, the metalized area is not in electrical contact with the elements on top surface of the submount 32 or
the first and second mounting pads on the back surface of the
submount 32. Although heat from the LED is laterally spread
over the top surface of the submount by the attach pad 42 and
the pads 44, 46 more heat will pass into the submount 32
directly below and around the LED 34. The metalized area
can assist with this dissipation by allowing this heat to spread
into the metalized area where it can dissipate more readily. It
is also noted that the heat can conduct from the top surface of
the submount 32, through the vias 56, where the heat can
spread into the first and second mounting pads 50, 52 where
it can also dissipate. For the package 30 used in surface
mounting, the thickness of the metalized area 66 (best shown
in FIGS. 2c and2e) and the first and second pads 50, 52 should
be approximately the same such that all three make contact to
a lateral surface such as a PCB.
Three solder dams 67 can be included around the area of
the attach pad 42 for mounting of the LED 34, with the solder
dams serving to help center the LED and to reduce movement
of the LED from the mounting area during while the mounting solder is in liquid form. When the liquid solder encounters
any one of the dams, movement is slowed or stopped. This
helps reduce the movement of the LED until the solder hardens.
An optical element or lens 70 is formed on the top surface
40 of the submount 32, over the LED 34, to provide both
environmental and/or mechanical protection. The lens 70 can
be in different locations on the top surface 40 with the lens
located as shown with the LED 34 at approximately the center
of the lens base. In some embodiments the lens can be formed
in direct contact with the LED 34 and the submount's top
surface 40. In other embodiments there may be an intervening
material or layer between the LED 34 and/or top surface 40.
Direct contact to the LED 34 provides certain advantages
such as improved light extraction and ease of fabricating.
As further described below, the lens 70 can be molded
using different molding techniques and the lens can be many
different shapes depending on the desired shape of the light
output. One suitable shape as shown is hemispheric, with
some examples of alternative shapes being ellipsoid bullet,
flat, hex-shaped and square. Many different materials can be
used for the lens such as silicones, plastics, epoxies or glass,
with a suitable material being compatible with molding processes. Silicone is suitable for molding and provides suitable
optical transmission properties. It can also withstand subsequent reflow processes and does not significantly degrade
overtime. It is understood that the lens 70 can also be textured
to improve light extraction or can contain materials such as
phosphors or scattering particles.
The LED package 30 can also comprise a protective layer
74 covering the submount's top surface 40 between the lens
70 and edge of the submount 32. The layer 74 provides
additional protection to the elements on the top surface to
reduce damage and contamination during subsequent processing steps and use. Protective layer 74 can be formed
during formation of the lens 70 and can comprise the same
material as the lens 70. It is understood, however, that the
LED package 30 can also be provided without the protective
layer 74.
The lens 70 should also be able to withstand certain sheer
forces before being displaced from the submount 32. In one
embodiment, the lens can withstand a 1 kilogram (kg) or more
sheer force. In embodiments of the LED package using silicones that are harder after curing and have a higher durometer
reading, such as Shore A 70 or higher, tend to better withstand
sheer forces. Properties such as high adhesion and high tensile strength may also contribute to the ability of the lens to
withstand sheer forces.
The lens arrangement of the LED package 30 is also easily
adapted for use with secondary lens or optics that can be
includes over the lens by the end user to facilitate beam
shaping. These secondary lenses are generally known in the
art, with many of them being commercially available.
FIGS. 3a to 3e show another embodiment of an LED package 100 according to the present invention having similar
features to those in LED package 30. For similar features the
same reference numbers are used herein and in FIGS. 4a and
4b below with the understanding that the description above
applies equally to this embodiment. The LED package 100
comprises a submount 32, and LED 34, a lens 70 and wire
bonds 64 and 65. Like the LED package 30, LED package 100
is arranged for surface mounting but has a different arrangement for its conductive pads that provides for contacting at
one side of the submount 32.
The LED package comprises an attach pad 102 with an
integral first contact pad 104, separated by a gap 108 from a
second contact pad 106. A gap 108 provides electrical isolation as described above. The LED 34 is mounted to the attach
pad using the methods described above, and the wire bond 65
runs between the second contact pad 106 to conduct the
electrical signal at the second contact pad 106 to the LED 34.
The first and second contact pads 104, 106 are not on opposite
sides of the submount 32, but are instead on the same side.
The attach pad 102 covers most of the submount's top surface
40 to provide improved heat spreading as described above.
The first and second contact pads 104, 106 also cover portions
of the top surface to assist in current spreading.
First and second surface mount contact 110, 112 are
included on the submount' s back surface 54, at least in partial
vertical alignment with the first and second contact pads 104,
106, respectively. Conductive vias 114 run through the submount between the first surface mount contact 110 and the
first contact pad 104, and the second surface mount contact
112 and the second contact pad 106, so that an electrical
signal on the surface mount contacts 110, 112 is conducted
through the vias to the contact pads 104, 106. The signal is
then conducted to the LED 34. The LED package 100 also
comprises a metalized area 116 to further improve heat
spreading from the LED 34 and submount 32. The metalized
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US 9,070,850 B2
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area 116, however, is not between the surface mount contacts

110, 112 but covers an area of the back surface 54 opposite
them.
The LED package 100 as shown does not have a protective
layer covering the submount's top surface 40 between the
edge of the lens 70 and the edge of the top surface 40,
although such a protective layer can be included in other
embodiments. The LED package 100 can also be provided
with an ESD protection element 62 and solder mask 58 as
described above. The LED package 100 provides for
improved thermal management as in LED package 30, but
allows for surface mount contacting along one side of the
submount instead of opposite sides. The LED package can
also include symbols 118 to assist in aligmnent by the end
user.
FIGS. 4a and 4b show still another embodiment of an LED
package 150 according to the present invention generally
comprising a submount 32, LED 34, first and second contact
pads 50, 52, vias 56, ESD diode 62, wire bonds 64, 65,
metalized area 66, lens 70 and protective layer 74. In this
embodiment, however, the attach pad is not circular, but in
combination with the first contact pad, comprises a rectangular shaped first conductive layer 152 on and covering the
majority the submount 32. Vias 56 run between the first layer
152 and the first contact pad 50 on one side of the first layer
152, with the LED and ESD diode mounted to a attach pad
area on the opposing side.
A second conductive layer 154 covers most of the remainder of the submount's top surface, with a gap 156 between the
first and second layers 152, 154. Vias 56 run between the
second layer 154 and the second contact pad 52, with the wire
bonds 64, 65 running between the second layer 154 and the
LED 43 and ESD diode 62. Like the embodiments above, an
electrical signal applied to the first and second contact pads
50, 52 is conducted to the LED 34, causing it to emit light.
In this embodiment, the first and second layers 152, 154
cover substantially all of the submount's top surface, providing the capability for broad lateral heat spreading from the
LED 34. This arrangement, however, presents a minimal pattern for pattern recognition during assembly. By comparison,
the shaped pad arrangement shown in FIGS. 2a-2g provides
for greater pattern recognition for assembly, while at the same
time providing suitable lateral current spreading.
The present invention also provides for improved methods
for fabricating LED packages wherein multiple packages can
be fabricated simultaneously. This reduces cost and complexity in fabrication, and allows for fabrication of devices with
controlled features and emission characteristics. FIG. 5
shows one embodiment of an LED package fabrication
method 200 according to the present invention. In 202 a
substrate (submount) panel that can be diced in subsequent
manufacturing steps to provide a plurality of individual submounts. A panel is provided to allow for the simultaneous
fabrication of a plurality of packages. It is understood that a
separate processing step is required for providing the LED
package conductive features on the panel. These features can
include the attach pad, contact pads, surface mount pads, vias
and metalized area, all of which can be arranged to assist in
dissipating heat generated by the LED. The panel will comprise a plurality of these features arranged in sets, each of the
sets corresponding to one of the plurality of packages to be
formed from the panel. Many different panel sizes can be used
such as for example, 3 inches by 4 inches, 2 inches by 4
inches, and 4 inches by 4 inches.
In 204 a plurality of LEDs are provided, each of which is to
be mounted to a respective one of the attach pads on the
substrate panel. In one embodiment, the plurality of LEDs
comprise white emitting LEDs chips, and many different

white chips can be used with a suitable white chip being
described in the patent applications mentioned above and
incorporated herein. In other embodiments more than one
LED can be provided for mounting to each of the attach pads.
In this step a plurality ofESD protection elements can also be
provided, each of which can be mounted in conjunction with
one of the attach pads to provide ESD protection for its LED
package.
In 206 each of the LEDs is die attached to the one of the
attach pads, and as mentioned above, many different mounting methods and materials can be used, with a suitable
method being mounting using conventional solder materials
and methods. In this step each of the ESD elements can also
be mounted to a respective attach pad using the same mounting method and material. It is understood that the ESD element can also be mounted in other locations using other
methods.
In 208 the panel undergoes a solder flux clean to remove
any flux that may have accumulated during previous processing steps. In 210 wire bonds are formed on the for each of the
LEDs and ESD elements electrically connecting them to the
appropriate one of their respective contact pads. As described
above, each of the LEDs and their accompanying ESD element can be wire bonded to the second contact pad. The wire
bonds can be formed using known processes and can be made
of known conductive materials such as gold.
In some embodiments the LEDs can be provided and
mounted to the panel without the desired conversion material.
In these embodiments the conversion material can be deposited on the LED after wire bonding. In optional 212 the
conversion material or phosphor is deposited on the LED and
many different known phosphor deposition methods can be
used such as electrophoretic deposition or EPD. Many different phosphor deposition processes can be used with a suitable
EPD process described in the patent application described
above.
In 214 a lens is molded over each of the LEDs and many
different molding methods can be used. In one embodiment a
molding process is used that simultaneously forms lenses
over the LEDs in the submount panel. One such molding
process is referred to as compression molding processes.
Referring now to FIGS. 6a and 6b one embodiment of compression molding is shown wherein a mold 250 is provided
having a plurality of cavities 252 each of which has an
inverted shape of the lens, wherein each cavity 252 is
arranged to align with a respective one of the LEDs 254 on a
substrate panel 256. The mold 250 is loaded with a lens
material 257 in liquid form filling the cavities 252, with the
preferred material being liquid curable silicone. Referring to
Sb, the panel 256 is moved toward the cavity with each of the
LEDs 254 being embedded in the liquid silicone within one a
respective one of the cavities 252. In one embodiment a layer
of silicone can also remain between adjacent lenses that provides a protective layer over the top surface of the submount.
The liquid silicone can then be cured using known curing
processes. The panel can then be removed from the mold and
as shown in FIGS. 7a and 7b the panel can comprise a plurality oflenses 258, each of which is over a respective one of
the LEDs 254. The individual LED packages can then be
separated from the panel, such as along dashed lines shown.
Referring again to FIG. 5, in 216 the panel can then diced/
singulated to separate the individual LED packages and different methods can be used such as known saw singulation
methods. When using this method a tape can be attached to
the panel prior to singulation to hold and stabilize the panel
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US 9,070,850 B2
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and individual LED packages. Following singulation, the

12. The LED package of claim 1 wherein the lens is formed
LED packages can be cleaned and dried.
by use of a molding method.
In 218 each of the LED packages can be tested to be sure
13. The LED package of claim 1 wherein the lens is hemithey are operating correctly and to measure each device outspheric.
put light characteristics. It is understood that the packages can
14. The LED package of claim 1, further comprising a
also be tested at different points in this method by probing the
wavelength conversion material.
submount panel. In 220 the LED packages can be binned
15. The LED package of claim 1, wherein said lens is
according to their output characteristics, packaged according
directly on said LED.
to each bin, and shipped to the customer.
One embodiment of a method is described herein, but it is 10
formed separately from the rest of said LED package.
understood that different embodiments of methods according
17. The LED package of claim 1, wherein said lens and said
to the present invention can use the same steps in different
protective layer comprise the same material.
order or can have different steps. Regarding the LED pack18. The LED package of claim 1, wherein said lens is
ages, the present invention has been described in detail with
reference to certain preferred configurations thereof, other 15 hemispheric.
19. An LED package, comprising:
versions are possible. Therefore, the spirit and scope of the
invention should not be limited to the versions described
an attach pad on said top surface;
above.
a first contact pad on said top surface and integral to said
We claim:
attach pad;
20
a second contact pad on said top surface;
a plurality of top electrically and thermally conductive
an LED on said attach pad, an electrical signal applied to
elements on said top surface of said submount;
said first and second contact pads causing said LED to
an LED on one of said top electrically and thermally conemit light, wherein said attach pad, said first contact pad
ductive elements, an electrical signal applied to said top 25
and said second contact pad comprise thermally conducelectrically and thermally conductive elements causing
tive materials, wherein said attach pad and said first
said LED to emit light, said top electrically and thercontact pad cover at least 75% of said top surface to
mally conductive elements spreading heat from said
spread heat from said LED to the majority of said top
LED across the majority of said submount top surface;
surface;
a bottom thermally conductive element on said bottom 30
a protective layer extending to the edges of said top surface
surface not in electrical contact with said top electrically
of said submount; and
and thermally conductive elements and conducting heat
a hemispheric optical element over said LED and with said
from said submount;
LED approximately at the center of the base of said
hemispheric
optical element, wherein said protective
a protective layer in direct contact with and extending from 35
layer is in direct contact with a portion of said hemia bottom of said lens;
spheric optical element.
wherein at least a portion of said lens is above a top surface
20. The LED package of claim 19, further comprising first
of said protective layer.
and second surface mount contacts on said bottom surface
2. The LED package of claim 1, wherein said top elements
comprise an attach pad comprising an integral first contact 40 and in electrical contact with said first and second contact
pads, respectively.
pad, and a second contact pad.
21. The LED package of claim 19 wherein the single hemi3. The LED package of claim 2, wherein said LED is on
spherical optical element comprises a single hemispherical
said attach pad, with said attach pad extending beyond the
optical element directly over said LED.
edge of said LED on the top surface of said submount.
4. The LED package of claim 3, wherein said attach pad 45
22. The LED package of claim 21 wherein the single hemiextends radial beyond the edge of said LED on said top
spherical optical element is also directly over said top surface
of said submount.
surface.
5. The LED package of claim 1, wherein said top elements
23. The LED package of claim 19 wherein said single
cover more than 50% of said top surface.
hemispherical optical element is formed by use of a molding
6. The LED package of claim 1, further comprising first 50 method.
and second mounting pads on said bottom surface and a
24. The LED package of claim 19 wherein said single
plurality of conductive vias running through said submount.
hemispherical optical element comprises a single hemi7. The LED package of claim 6, wherein said first and
spherical lens.
second mounting pads are at least partially aligned with said
25. The LED package of claim 19, further comprising an
first and second contact pads, respectively, said vias running 55 electrostatic discharge (ESD) element to protect said LED
between and providing an electrical path between said
from electrostatic discharge.
mounting pads and said contact pads.
solder mask covering at least a portion of said top surface.
electrostatic discharge (ESD) element to protect said LED
60
9. The LED package of claim 1, further comprising a solder
an LED on said top surface;
mask covering at least a portion of said top elements.
a hemispheric lens directly on said LED and a portion of
10. The LED package of claim 1, wherein said protective
said top surface;
layer extends to the edges of said top surface of said submount
a protective layer extending to the edges of said top surface
65
of said submount;
and covers said top elements.
a top heat spreading element on said top surface to spread
11. The LED package of claim 1 wherein the lens comprises a single lens formed directly over said LED.
heat from said LED across the majority of said top

US 9,070,850 B2
15
surface, said top spreading element extending radially
on said top surface from said LED toward the edges of
said submount; and
a bottom heat conducting element on said bottom surface to
conduct heat from said submount, wherein said bottom
heat conducting element is not in electrical contact with
said top heat spreading element.
28. The LED package of claim 27 wherein the lens comprises a single lens directly over said LED.
29. The LED package of claim 27 wherein the lens is
formed by use of a molding method.
30. The LED package of claim 27 wherein the lens comprises a molded hemispherical lens.
electrostatic discharge (ESD) element to protect said LED
solder mask covering at least a portion of said top surface.
formed separately from the rest of said LED package.
34. The LED package of claim 27, wherein said lens and
said protective layer comprise the same material.
* * * * *
16
10
15
20
EXHIBIT F
Illlll llllllll Ill lllll llllll llll lllll lllll 111111111111111111111111111111111

USOOD615504S
c12)
United States Design Patent
(10)
Keller et al.
(45)
(54)
EMITTER PACKAGE
(75)
Inventors: Bernd Keller, Santa Barbara, CA (US);

Nicholas Medendorp, Jr., Raleigh, NC
(US); Thomas Cheng-Hsin Yuan,
Ventura, CA (US)
(73)
Assignee: Cree, Inc., Goleta, CA (US)
(**)
Term:
(21)
Appl. No.: 29/292,900
14 Years
(22)
Filed:
Oct. 31, 2007
( 51)
(52)
(58)
LOC (9) Cl. . ... ... ... ... .. ... ... ... ... ... .. ... ... ... ... .. ... . 13-03
U.S. Cl. ..................................................... D13/180
Field of Classification Search ................ D13/180;
D26/2; 257/79, 80, 81, 88, 89, 95, 98, 99,
257/100; 313/483, 498, 500; 362/555, 800
(56)
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712006
10/2006
1112007
3/2008
Li
Ruhnau
Arndt
Leu et al.
Kamiya et al.
Fung et al.
Wait!
Arndt
Iwasaki et al.
Sorg
Yu et al.
Leatherdale
Yano et al.

CN
CN
CN
CN
EP
EP
EP
EP
EP
JP
JP
WO
WO
WO
WO
WO
WO
WO
WO
1581527
1591924
1679168
1744335
1005085
1187226
1187227
1187228
1521313
8139257
2000223752
WO 9931737
W00217405
WO 04027882
W004044877
W005043627
WO 05104247
WO 06054228
WO 06054228
A
A
A
A
A2
Al
Al
A2
A3
212005
3/2005
10/2005
8/2006
512000
3/2002
3/2002
3/2002
412005
5/1996
11/2000
6/1999
212002
412004
512004
512005
11/2005
512006
512006
OTHER PUBLICATIONS
JP 2001 060072A, Abstract, Matsushita Electric Ind. Co Ltd., March
6, 222001.
Nichia Corp. White LED Part No. NSPW300BS, Specification for
Nichia White LED, Model NSPW300BS., Jan. 14, 2004.
Nicha Corp., White LED Part No. NSPW312BS, Specification for
Nichia White Led, Model NSPW312BS. Jan. 14, 2004.
Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GalnN
White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics,
Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan.
1, 2005 XP-001236966, pp. 649-651.
* cited by examiner
Primary Examiner-Selina Sikder
(74) Attorney, Agent, or Firm-Koppel, Patrick, Heybl &
Dawson
(57)
CLAIM
The ornamental design for an emitter package, as shown and

described.
DESCRIPTION
FIG. 1 is a perspective view of the first embodiment of an

emitter package showing our design;
FIG. 2 is a top plan view of the emitter package shown in FIG.
1;
FIG. 5 is a right side elevation view of the emitter package

shown in FIG. 1, with the left side elevation view being a
mirror image thereof;
FIG. 6 is a bottom perspective view of the emitter package
shown in FIG. 1;
FIG. 7 is a top perspective view of the second embodiment of
an emitter package showing our design;
FIG. 8 is a top plan view of the emitter package shown in FIG.
7;
FIG. 9 is a bottom plan view of the emitter package shown in

FIG. 7;
FIG. 10 is front elevation view of the emitter package shown
in FIG. 7, with the back elevation view being a mirror thereof;
shown in FIG. 7;
FIG. 13 is a perspective view of the third embodiment of an
FIG. 14 is a top plan view of the emitter package shown in
FIG.13;
FIG.13;
in FIG. 13, with the back elevation view being a mirror image
thereof;
shown in FIG. 13;
FIG. 19 is a perspective view of the fourth embodiment of an
FIG. 19;
FIG. 19;
thereof;
shown in FIG. 19;
FIG. 25 is a perspective view of the fifth embodiment of an
FIG. 25;
FIG. 25;

FIG.1;

thereof;
FIG. 4 is front elevation view of the emitter package shown in

FIG. 1, with the back elevation view being a mirror image
thereof;


US D615,504 S
Page 3
shown in FIG. 25;

shown in FIG. 31.
FIG. 31 is a perspective view of the sixth embodiment of an


thereof;
The broken line showing in the embodiments of FIGS. 1-6,

13-18, 19-24 and 25-30 are for illustrative purposes only and
forms no part of the claimed design. The external surface
having stippling or irregular lines in the embodiments of
FI GS. 25-30 and 31-36 indicate a rough visual appearance of
the side surfaces of the emitter package. The top layer can
have be visually transparent or translucent as shown in the
embodiments ofFIGS.1-6, 13-18, 19-24 and 25-30, and in
some embodiments can optically distort the layer below.

mirror image thereof; and,
1 Claim, 12 Drawing Sheets

FIG. 31;
FIG. 31;
U.S. Patent
May 11, 2010
Sheet 1of12
FIG. 1
FIG. 6
US D615,504 S
U.S. Patent
May 11, 2010
US D615,504 S
Sheet 2of12
FIG. 2
,-:.
I
,- I
_,
FIG. 3
FIG. 4
FIG. 5
U.S. Patent
May 11, 2010
Sheet 3of12
FIG. 7
FIG. 12
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 4 of 12
FIG. 8
FIG. 9
FIG. 10
FIG. 11
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 5of12
FIG. 13
FIG. 18
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 6 of 12
FIG. 14
:,'
FIG. 15
1 ~1 : : '" '
FIG. 16
FIG. 17
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 7of12
FIG. 19
FIG. 24
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 8 of 12
FIG. 20
'l
I
'=..'
FIG. 21
FIG. 22
FIG. 23
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 9of12
FIG. 25
FIG. 30
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 10 of 12
FIG. 26
r~,'
FIG. 27
; t.
.f.
,,...
..~...
FIG. 28
FIG. 29
US D615,504 S
U.S. Patent
May 11, 2010
Sheet 11 of 12
FIG. 31
FIG. 36
US D615,504 S
U.S. Patent
May 11, 2010
US D615,504 S
Sheet 12 of 12
FIG. 32
,.
I
FIG. 33
:; .~.~~~
. _.,.,
~:.':-:~
- .......
. ,:.~:.i~: : ...:.
FIG. 34
.. -.......;..
~~_;
.: ,,.:1
FIG. 35
EXHIBIT G
EXHIBIT H
Tac Light
ULTRA BRIGHT LEDS

LIGHT UP THE
DARKEST SPACES
BUY NOW
COMPACT AND LIGHTWEIGHT
WORKS IN BOILING WATER
SURVIVES BEING FROZEN
http://www.emsoninc.com/tac-light/
BRIGHTENS UP THE NIGHT
BUY NOW
E. Mishan & Sons, Inc.
http://www.emsoninc.com/tac-light/
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Tac Light - Military Grade, High Performance Tactical Flashlight
22x brighter than regular flashlights

Can be seen 2 nautical miles away
Tactical strobe to stun attackers or intruders
Compact and lightweight
Works when frozen or even under water
Guaranteed for life
https://www.trytaclight.com/[11/3/2016 12:58:03 PM]
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EXHIBIT I
I-1
US 7,808,013
1.
1
TACLIGHT product
A light emitting device (LED) assembly comprising:

a continuous thermally conductive layer adjacent a
surface of the electrically insulating substrate;
a light emitting device adjacent the continuous
thermally conductive layer so that the continuous
thermally conductive layer is between an entirety of the
light emitting device and the electrically insulating
substrate, wherein the continuous thermally conductive
layer extends beyond an edge of the light emitting
device in at least one direction a distance greater than
half of a width of the light emitting device; and
a plurality of thermally conductive vias through the
electrically insulating substrate, wherein the plurality of
thermally conductive vias are thermally and electrically
coupled to the continuous thermally conductive layer
and wherein portions of the electrically insulating
substrate adjacent the light emitting device are free of
the plurality of thermally conductive vias.
CREE CONFIDENTIAL AND PROPRIETARY :: 2016 Cree, Inc. All rights reserved
Note: internal vias

connect top metal
to bottom metal
I-2
US 7,858,998
1.
A semiconductor light emitting device comprising:

a light emitting diode on a face of the solid alumina
block; and
a flexible unitary film comprising silicone that extends
conformally on the face of the solid alumina block
outside the light emitting diode and that also extends on
the light emitting diode, the flexible unitary film
comprising silicone including therein a lens comprising
silicone adjacent the light emitting diode, such that the
light emitting diode emits light through the lens.
2
TACLIGHT product
I-3
US 8,167,463
1.
a substrate comprising a top surface, a bottom surface

and a plurality of sides;
a thermal pad disposed in a middle portion of the
bottom surface of the substrate; and
a plurality of traces disposed on opposing sides of and
isolated from the thermal pad on the bottom surface of
the substrate.
3
TACLIGHT product
I-4
US 8,622,582
1.
an electrically insulating substrate comprising a

substantially planar top surface and a substantially
planar bottom surface;
substrate;
a light emitting diode (LED) mounted on the top surface
of the substrate and proximate a center of the
substrate, and the LED being connected to one or more
traces of the plurality of traces; and
a thermal contact pad disposed on the bottom surface
of the substrate.
4
TACLIGHT product
I-5
US 9,070,850
1.
An LED package, comprising:
a submount comprising a top surface and a bottom

surface;
a plurality of top electrically and thermally conductive
elements on said top surface of said submount;
an LED on one of said top electrically and thermally
conductive elements, an electrical signal applied to said
top electrically and thermally conductive elements
causing said LED to emit light, said top electrically and
thermally conductive elements spreading heat from said
LED across the majority of said submount top surface;
a bottom thermally conductive element on said bottom
surface not in electrical contact with said top electrically
and thermally conductive elements and conducting heat
from said submount;
a protective layer in direct contact with and extending
from a bottom of said lens;
wherein at least a portion of said lens is above a top
surface of said protective layer.
5
TACLIGHT product
I-6
USD615,504
6
TACLIGHT product
EXHIBIT J

Cree v. E. Mishan &amp; Sons - Complaint

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Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 1 of 24

UNITED STATES DISTRICT COURT

Civil Action No. 16-CV-12275

E. MISHAN & SONS, INC.,

JURY TRIAL DEMANDED

On information and belief, Emson regularly transacts and/or solicits business

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 2 of 24

On information and belief, Emson has committed acts of infringement in this

Accordingly, this Court has personal jurisdiction over Emson.

LEDs provide environmentally friendly and energy-efficient alternatives to

traditional light sources such as incandescent light bulbs.

According to Emson s website, Emson is an importer of promotional products,

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 3 of 24

According to Emson s website, building brands such as Bell+Howell has

This action arises out of Emson s infringement of six Cree patents.

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 4 of 24

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 5 of 24

According to TACLIGHTs product packaging (see Exh. G), TACLIGHT is a

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 6 of 24

Bell+Howell TACLIGHT flashlight distributed by Emson. The product packaging also

On information and belief, Emson offers infringing flashlight or lighting products,

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 7 of 24

though fully set forth herein.

States, 35 U.S.C. 271.

The 013 patent is valid and enforceable.

Representative claim 1 of the 013 patent recites:

a continuous thermally conductive layer adjacent a surface of the electrically

As shown in Exhibit I-1, the TACLIGHT flashlight incorporates a light emitting

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 8 of 24

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 9 of 24

As a direct and proximate cause of Emsons infringement, as alleged above, Cree

though fully set forth herein.

States, 35 U.S.C. 271.

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 10 of 24

The 998 patent is valid and enforceable.

Representative claim 1 of the 998 patent recites:

As shown in Exhibit I-2, the TACLIGHT flashlight incorporates a light emitting

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 11 of 24

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 12 of 24

As a direct and proximate cause of Emsons infringement, as alleged above, Cree

though fully set forth herein.

States, 35 U.S.C. 271.

The 463 patent is valid and enforceable.

Representative claim 1 of the 463 patent recites:

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 13 of 24

A light emitting die package, comprising:

As shown in Exhibit I-3, the TACLIGHT flashlight incorporates a light emitting

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 14 of 24

As a direct and proximate cause of Emsons infringement, as alleged above, Cree

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 15 of 24

COUNT 4 PATENT INFRINGEMENT OF U.S. PAT. NO. 8,622,582

though fully set forth herein.

States, 35 U.S.C. 271.

The 582 patent is valid and enforceable.

Representative claim 1 of the 582 patent recites:

A light emitting die package, comprising:

As shown in Exhibit I-4, the TACLIGHT flashlight incorporates each recited

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 16 of 24

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 17 of 24

As a direct and proximate cause of Emsons infringement, as alleged above, Cree

though fully set forth herein.

States, 35 U.S.C. 271.

The 850 patent is valid and enforceable.

Case 1:16-cv-12275 Document 1 Filed 11/11/16 Page 18 of 24

Cree v. E. Mishan & Sons - Complaint

Cree v. E. Mishan & Sons - Complaint