Spi Paper For Epmt SKLN Web, June 2010

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Reproduction or distribution forbidden without written consent of SPI Lasers
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EPMT Conference, June 2010: Reproduction or distribution forbidden without written consent of SPI Lasers
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Amp
Seed
High control
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- -
3
High-power
output pulse with
characteristics
determined
by seed
Amp
High gain
High Gain &

High power
% 54- 5
%
%
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5 - 8
- 4- 5
-5
Square input
Seed
Non-square
output
Amp
Amp
As the pulse output energy approaches the

saturation energy the amplifier inversion (gain)
varies across the pulse duration, leading to
significant pulse distortion.
This distortion produces pulse shaping with
preferential gain at the leading edge, giving
higher peak-power
Pulse duration and gain shaping can be
tailored to application needs
Approx 20ns
Approx 200ns
Pulse Duration, Repetition Rate and Pulse Peak Power

can be independently selected and controlled
High Peak Powers can be achieved at High PRF
by deliberately shortening seed pulse duration
20W Q-Switched
Fiber laser
20W Seeded MOPA

New Waveforms 20W
16
16.0
25 kHz
14.0
15
20 kHz
30 kHz
40 kHz
60 kHz
80 lHz
14
13
12
peak power (kW)
12.0
Power (kW)
10.0
8.0
80 kHz
6.0
4.0
11
10
9
20 kHz
8
7
6
5
4
80 kHz
3
2.0
2
1
0.0
-50
50
100
150
200
250
300
Time (s)
Reducing pulse duration as PRF is

increased holds peak-power high
50
100
150
200
250
300
time (ns)
Peak-power decays
significantly as PRF is
increased
350
Marking & Micromachining with ns Pulsed Lasers
....SMART Laser.but how does it benefit my applications?
%
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%-
% 9
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--
--
SPI Pulsed MOPA Fiber Laser
Preconfigured beam source with Waveform Selection on Demand

Waveforms stored within the control FPGA
Selectable on demand and on the fly
RS232 switching or External Hardware (Digital TTL)
Average Power, Peak Power, Repetition Rate independently variable
Extensive process space from a single source
Tailored Beam Quality & Pulse Energy

The right tool for every job!
Series
SM
RM/HS
HM
M2
<1.3
<2
~3.2
Key attribute
Fine feature
<25micron
Multi purpose
35-80micron
Wider lines >60micron
Application
Scribing &
fine marking
General marking and

micro-machining
Wide marks deep

engrave area/logo
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2+
2
1.8
35kHz, wfm 11
37kHz, wfm 12
1.6
220ns pulse-on time
39kHz, wfm 13
44kHz, wfm 14
1.4
48kHz, wfm 15
0.6mJ / pulse, 35kHz

= 20W Ave power
1.2
Voltage (V)
1
0.8
7kW
peak
power
51kHz, wfm 16
55kHz, wfm 17
60kHz, wfm 18
63kHz, wfm 19
45ns FWHM
68kHz, wfm 20
72kHz, wfm 21
0.6
80kHz, wfm 22
0.4
90kHz, wfm 23
105kHz, wfm 24
0.2
125kHz, wfm 25
170kHz, wfm 26
0
-0.2
-5.00E-08
270kHz, wfm 27
290kHz, wfm 28
0.00E+00
5.00E-08
1.00E-07
1.50E-07
2.00E-07
Time (s)
2.50E-07
=" >1 "
For Applications requiring higher precision and finer lines particularly for solar
scribing
M2 < 1.3
#
"
$
:
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A
-
%
B
2
Feature Quality (Hole diameter & Depth)

Hole size 15% smaller than with M2 < 2 HS laser
Hole depth 30% deeper than with HS laser
#
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@ 10W
Entry hole
<40m
@ 20W
Entry hole
<50m
SM hole is 30% smaller than with M2 < 2 HS Laser

Images courtesy of Cambridge University
"
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5
1.8
35kHz, wfm 11
37kHz, wfm 12
1.6
39kHz, wfm 13
1.4
1.2
Voltage (V)
1
0.8
44kHz, wfm 14
25ns pulse-on time
48kHz, wfm 15
51kHz, wfm 16
80J / pulse, 250kHz

= 20W Ave power
5kW
peak
power
55kHz, wfm 17
60kHz, wfm 18
63kHz, wfm 19
68kHz, wfm 20
72kHz, wfm 21
15ns FWHM
0.6
80kHz, wfm 22
0.4
90kHz, wfm 23
105kHz, wfm 24
0.2
125kHz, wfm 25
170kHz, wfm 26
0
-0.2
-5.00E-08
270kHz, wfm 27
290kHz, wfm 28
0.00E+00
5.00E-08
1.00E-07
1.50E-07
2.00E-07
Time (s)
Each trace is a different wfm at PRF0

2.50E-07
%
6
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, 4
Array of spots with SM Laser

6W Average Power
Mark geometry and uniformity

evidence pulse stability
4-
5-5
Line scan, 250kHz PRF

50 m line spacing, 2m/s scan
On
Off
On
20W M2 < 2 HS & 40W M2 ~ 3.2 HM Pulses

20W HS
40W HM
16.0
25kHz
15.0
26kHz
14.0
12.0
11.0
29kHz
32kHz
M2 < 2
9.0
Peak Power
>12kW @ 25kHz
7.0
6.0
20
41kHz
15
45kHz
50kHz
5.0
57kHz
4.0
66kHz
78kHz
3.0
97kHz
2.0
1.25mJ/pulse
@ 30kHz
M2 ~ 3.2
33.5kHz
38kHz
8.0
25
28kHz
30.5kHz
10.0
Power (kW)
27kHz
0.8mJ/pulse
@ 25kHz
13.0
10
Peak Power >20kW

& >10kW at 200kHz
135kHz
1.0
35.5kHz
0.0
-50
50
100
150
200
250
300
Time (ns)
Higher Pulse Energy and Peak Power

from Low-Moded Fibers traded against increased M2
"
B 2C
Marking of ferritic stainless steel engineering parts

Part numbers
Single pass
Filled fonts
Outline fonts
"
"
*
!"
No Spot Overlap
visible mark
poor resolution
dotted-line
!(
&
-F@ G
<5% Spot Overlap

improved mark
low resolution
scallop edge
>60% Spot Overlap

desired mark
high resolution
smooth line edge
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1
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* Image courtesy of Miyachi Unitek
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* Image courtesy of LMco
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* Image courtesy of A&P Instruments Co Ltd
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* Image courtesy of Electrox
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Sample courtesy of Electrox Ltd
At high magnification the line scan

base of the image can be seen.
Fill patterns and edging to enhance
strong colour block definition is
employed.
%
,23!45
Requirement for absolute removal of thin film

from coated display glass for subsequent metallisation
- High repetition rate, high peak-power, high-speed scan
provides reliable cost-effective solution
1
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6
1
5
/
4
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Detailed stamp engraved with 20W HS

Image courtesy of ACSYS GmbH
Multi pass engrave with 30W

HM utilising 2 high pulse
energy passes and a 3rd
smoothing pass at high reprate (top line of image only)
H2)
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10mm
-5
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6
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Images courtesy of Miyachi Unitek
Copper
Aluminium
Stainless
IN SUMMARY
FLEXIBLE TOOL, DIVERSE

APPLICATIONS!
Tailored Pulse characteristics give
processing flexibility for multiple
application / materials / targeted
features
Images and samples courtesy of: Miyachi Unitek, Electrox, LMCo & Orotig

Spi Paper For Epmt SKLN Web, June 2010

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!

Reproduction or distribution forbidden without written consent of SPI Lasers

High Gain &

As the pulse output energy approaches the

Pulse Duration, Repetition Rate and Pulse Peak Power

20W Seeded MOPA

peak power (kW)

Reducing pulse duration as PRF is

Marking & Micromachining with ns Pulsed Lasers

....SMART Laser.but how does it benefit my applications?

Reproduction or distribution forbidden without written consent of SPI Lasers

SPI Pulsed MOPA Fiber Laser

Preconfigured beam source with Waveform Selection on Demand

Tailored Beam Quality & Pulse Energy

Wider lines >60micron

General marking and

Wide marks deep

Reproduction or distribution forbidden without written consent of SPI Lasers

220ns pulse-on time

0.6mJ / pulse, 35kHz

=" >1 "

Reproduction or distribution forbidden without written consent of SPI Lasers

Feature Quality (Hole diameter & Depth)

SM hole is 30% smaller than with M2 < 2 HS Laser

25ns pulse-on time

80J / pulse, 250kHz

Each trace is a different wfm at PRF0

Array of spots with SM Laser

Mark geometry and uniformity

Line scan, 250kHz PRF

20W M2 < 2 HS & 40W M2 ~ 3.2 HM Pulses

Peak Power >20kW

Higher Pulse Energy and Peak Power

Marking of ferritic stainless steel engineering parts

Reproduction or distribution forbidden without written consent of SPI Lasers

<5% Spot Overlap

>60% Spot Overlap

* Image courtesy of Miyachi Unitek

* Image courtesy of LMco

* Image courtesy of A&P Instruments Co Ltd

* Image courtesy of Electrox

Sample courtesy of Electrox Ltd

At high magnification the line scan

Requirement for absolute removal of thin film

Detailed stamp engraved with 20W HS

Multi pass engrave with 30W

Images courtesy of Miyachi Unitek

FLEXIBLE TOOL, DIVERSE

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