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2SD2255
Silicon NPN triple diffusion planar type Darlington
For power amplification
Complementary to 2SB1493
Unit: mm
15.00.5
15.00.2
20.00.3
19.00.3
16.20.5
2.00.1
3.20.1
3.5
12.5
10.50.5
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4.00.1
4.00.1
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Features
4.50.2
13.00.5
(TC=25C)
Parameter
Symbol
Ratings
Unit
VCBO
160
VCEO
140
VEBO
ICP
12
Collector current
IC
70
PC
Ta=25C
Junction temperature
Tj
Storage temperature
Tstg
2.5
ICEO
IEBO
int
en
VCEO
hFE1
Ma
hFE2*
VCE(sat)
VBE(sat)
Transition frequency
fT
Turn-on time
ton
Storage time
tstg
Fall time
tf
FE2
Symbol
*h
55 to +150
ce
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on
tin
5.450.3
0.60.2
10.90.5
1:Base
2:Collector
3:Emitter
EIAJ:SC65(a)
TOP3 Package(a)
Internal Connection
(TC=25C)
ICBO
an
150
1.40.3
1.10.1
ue
Electrical Characteristics
Parameter
2.00.2
Solder Dip
max
Unit
VCB = 160V, IE = 0
100
VCE = 140V, IB = 0
100
VEB = 5V, IC = 0
100
Conditions
min
IC = 30mA, IB = 0
140
VCE = 5V, IC = 1A
2000
VCE = 5V, IC = 6A
5000
typ
30000
IC = 6A, IB = 6mA
2.5
IC = 6A, IB = 6mA
3.0
V
V
20
MHz
2.5
5.0
2.5
Rank classification
Rank
hFE2
Power Transistors
2SD2255
PC Ta
50
40
60
VBE(sat) IC
100
TC=25C
10
(1) TC=Ta
(2) With a 100 100 2mm
Al heat sink
(3) Without heat sink
(PC=2.5W)
(1)
70
IC VCE
12
IB=5mA
1mA
0.9mA
0.8mA
0.7mA
0.6mA
0.5mA
0.4mA
IC/IB=1000
30
10
3
TC=25C
M
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80
30
20
(2)
0.1mA
60
VCE(sat) IC
100
10
VCE=5V
10
30000
3000 TC=100C
TC=100C
1000
25C
25C
0.3
10
30
100
25C
300
30
10
0.01 0.03
ce
/D
isc
on
tin
ton, tstg, tf IC
100
tf
an
int
Ma
ton
0.3
10
1
0.3
0.1
0.03
ICP
10
t=1ms
10ms
IC
DC
3
1
0.3
0.1
0.03
0.01
0.01
0
12
16
10
30
100
Cob VCB
IE=0
f=1MHz
TC=25C
300
100
30
10
10
30
100
300
10
30
100
30
en
tstg
10
0.1
100
Pulsed tw=1ms
Duty cycle=1%
IC/IB=1000 (IB1=IB2)
VCC=50V
TC=25C
30
25C
100
ue
1000
10000
0.3
0.3
hFE IC
30
0.1
0.1
0.3
100000
IC/IB=1000
100C
25C
0.1
0.1
12
40
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0
20
0.2mA
(3)
0.3mA
10
0
1000
103
102
101
Time t (s)
10
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104
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Power Transistors
2SD2255
1000
Rth(t) t
100
(1)
10
(2)
102
103
104
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.