Internal Use Only

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Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

LED TV
SERVICE MANUAL
CHASSIS : LA57H

MODEL : 49LF5400 49LF5400-UB

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL68646508(1502-REV00) Printed in Korea

 CONTENTS

CONTENTS ............................................................................................... 2

PRODUCT SAFETY .................................................................................. 3

SPECIFICATION........................................................................................ 4

ADJUSTMENT INSTRUCTION............................................................... 10

TROUBLE SHOOTING............................................................................. 16

BLOCK DIAGRAM................................................................................... 22

EXPLODED VIEW ................................................................................... 23

SCHEMATIC CIRCUIT DIAGRAM .............................................APPENDIX

Copyright LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 M and 5.2 M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo-
sion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas-
ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors
and semiconductor chip components. The following techniques
should be used to help reduce the incidence of component dam-
age caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter-
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
Copyright LG Electronics. Inc. All rights reserved. -4-
Only for training and service purposes
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo-
sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as anti-static can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri-
cally shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-
ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity suf-
ficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the compo-
nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the cir-
cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Copyright LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec-
tions).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con-
nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
-5- LGE Internal Use Only
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range
This spec sheet is applied LED TV with LA57H chassis

2. Test condition
Each part is tested as below without special notice.

1) Temperature : 25 C 5 C(77 9 F) , CST : 40 C5 C

2) Relative Humidity: 65 % 10 %
3) Power Voltage
Market Input voltage Frequency Remark
USA 100~240V 50/60Hz Standard Voltage of each
product is marked by
models

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment

3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC: FCC, ICES, IEC specification

Copyright LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
4. General Specification
No Item Specification Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 32/42/43/49/55 inch Wide FHD / 60Hz 32LF5600-Ux
(1920 1080) 42LF5500-Ux
42LF5600-Ux
43LF5400-Ux
49LF5500-Ux
49LF5400-Ux
55LF5500-Ux
32 inch Wide (1366 768) HD / 60Hz 32LF560B-Ux
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module Direct LC320DXE-MGA3 LGD HD / 60Hz 32LF560B-Ux
HC320DXN-ABHS3 BOE HD / 60Hz 32LF560B-Ux
LC320DUE-MGA3 LGD FHD / 60Hz 32LF5600-Ux
NC320DUN-VBBP3 BOE FHD / 60Hz 32LF5600-Ux
LC420DUE-MGA3 LGD FHD / 60Hz 42LF5600-Ux
NC420DUN-VUBP5 AUO FHD / 60Hz 42LF5600-Ux
LC420DUE-MGA6 LGD FHD / 60Hz 42LF5500-Ux
NC420DUN-VUBP8 AUO FHD / 60Hz 42LF5500-Ux
LC490DUE-MGA6 LGD FHD / 60Hz 49LF5500-Ux
LC550DUE-MGA6 LGD FHD / 60Hz 55LF5500-Ux
NC430EUN-AACR1 LGD FHD / 60Hz 43LF5400-Ux
NC490EUN-AACR1 LGD FHD / 60Hz 49LF5400-Ux
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

Copyright LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
Only for training and service purposes
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.976 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 67.432 59.94 148.352 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P

Copyright LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
5.2. HDMI Input (DTV / PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
DTV
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.5 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV 480I Spec-Out.
(Just Display)
4 720*480 15.75 60.00 13.514 SDTV 480I Spec-Out.
(Just Display)
5 720*480 31.47 59.94 27.00 SDTV 480P
6 720*480 31.5 60.00 27.027 SDTV 480P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.25 HDTV 1080I
11 1920*1080 26.97 23.97 74.176 HDTV 1080P
12 1920*1080 27.00 24.00 74.25 HDTV 1080P
13 1920*1080 33.71 29.97 74.176 HDTV 1080P
14 1920*1080 33.75 30.00 74.25 HDTV 1080P
15 1920*1080 67.43 59.94 148.352 HDTV 1080P
16 1920*1080 67.5 60.00 148.50 HDTV 1080P
PC
1 640*350 @70Hz 31.46 70.09 25.17 EGA X
2 720*400 @70Hz 31.46 70.08 28.32 DOS O
3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O
4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 @60Hz 54.34 60.05 80.002 VESA O
7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O FHD only
8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O
9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O FHD only

Copyright LG Electronics. Inc. All rights reserved. -9- LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application 4. MAIN PCBA Adjustments
This spec. sheet applies to LA57H Chassis applied LED TV all * Download
models manufactured in TV factory (1) E xecute ISP program Mstar ISP Utility and then click
Config tab.
(2) Set as below, and then click Auto Detect and check OK
2. Specification message. If display Error, Check connect computer, jig, and
set.
(1) Because this is not a hot chassis, it is not necessary to use
(3) C lick Connect tab. If display Cant , Check connect
an isolation transformer. However, the use of isolation
computer, jig, and set.
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 C
(4) Click Read tab, and then load download file(XXXX.bin) by
In case of keeping module is in the circumstance of 0C, it
clicking Read
should be placed in the circumstance of above 15C for 2
hours
In case of keeping module is in the circumstance of below
-20C, it should be placed in the circumstance of above
15C for 3 hours.

Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
(5) Click Auto tab and set as below
(6) Click Run.
3. Adjustment items (7) After downloading, check OK message.
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID download: HDMI and RGB-PC

A
 bove adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value.

3.2. Final assembly adjustment 4.1. ADC Calibration

(1) White Balance adjustment
(2) RS-232C functionality check 4.1.1. Overview
(3) Factory Option setting per destination ADC adjustment is needed to find the optimum black level and
(4) Shipment mode setting (In-Stop) gain in Analog-to-Digital device and to compensate RGB
(5) GND and HI-POT test deviation
ADC adjustment is OTP (Auto ADC)

3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information

Copyright LG Electronics. Inc. All rights reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
4.2. EDID Download 2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
4.2.1. Overview
I t is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of Plug and Play.
4.2.2. Equipment
Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
Adjust by using remote controller
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.3. Download method (using DFT)
PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)

4.2.4. Download method

1) Press Adj. key on the Adj. R/C, L15_M1L EDID - AC3
2) Select EDID D/L menu. 2D / 8bit / HD
3) By pressing Enter key, EDID download will begin (1) EDID Block 0, Bytes 0-127 [00H-7FH]
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.

Caution) When EDID Download, must remove RGB/HDMI

Cable.
6) EDID Write confirmation

(2) EDID Block 1, Bytes 128-255 [80H-FFH]

4.2.5. Models for EDID Data

2D
HD / 8bit FHD / 8bit
HDMI 2ea HDMI 2ea
North America 32LF560B-Ux 32/42LF5600-Ux 2D / 8bit / FHD
(PCM) 32LF550B-Ux 42/49/55LF5500-Ux (1) EDID Block 0, Bytes 0-127 [00H-7FH]
43/49LF5400-Ux

4.2.6. EDID DATA

L15_M1L EDID - PCM
2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]

(2) EDID Block 1, Bytes 128-255 [80H-FFH]

(2) EDID Block 1, Bytes 128-255 [80H-FFH]

4.2.7. Tool Option Input

Input Model Tool Option according to BOM

Copyright LG Electronics. Inc. All rights reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
5. Final Assembly Adjustment 5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
5.1. White Balance Adjustment
RS-232C COMMAND
5.1.1. Overview Explanation
5.1.1.1. W/B adj. Objective & How-it-works CMD DATA ID
(1) Objective: To reduce each Panels W/B deviation Wb 00 00 Begin White Balance adj.
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
Wb 00 ff End White Balance adj.
means the panel is at its Full Dynamic Range. In order to
(internal pattern disappears )
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
Ex) wb 00 00 -> Begin white balance auto-adj.
the desired value.
wb 00 10 -> Gain adj.
(3) Adj. condition: normal temperature
ja 00 ff -> Adj. data
- Surrounding Temperature: 255 C
jb 00 c0
- Warm-up time: About 5 Min
...
- Surrounding Humidity: 20% ~ 80%
...
- Before White balance adjustment, Keep power on status,
wb 00 1f -> Gain adj. complete
dont power off
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff ->End white balance auto adj.
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
(2) Adjustment Map
should be lower 10 lux. Try to isolate adj. area into dark
surrounding. Adj. Command Data Range Default
(2) Probe location: Color Analyzer (CA-210) probe should be item (lower case ASCII) (Hex.) (Decimal)
within 10cm and perpendicular of the module surface CMD1 CMD2 MIN MAX
(80~ 100)
Cool R Gain j g 00 C0 172
(3) Aging time
- A fter Aging Start, Keep the Power ON status during 5 G Gain j h 00 C0 172
Minutes. B Gain j i 00 C0 192
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern. R Cut 128
G Cut 128
5.1.2. Equipment B Cut 128
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
Medium R Gain j a 00 C0 192
CH14)
(2) A dj. Computer (During auto adj., RS-232C protocol is G Gain j b 00 C0 192
needed) B Gain j c 00 C0 192
(3) Adjust Remocon
R Cut 128
(4) V ideo Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49) G Cut 128
Only when internal pattern is not available B Cut 128
Color Analyzer Matrix should be calibrated using CS-1000
Warm R Gain j d 00 C0 192
5.1.3. Equipment connection G Gain j e 00 C0 192
B Gain j f 00 C0 172
R Cut 128
G Cut 128
B Cut 128

When you connect the RS232 to set Phone jack, please use
3pin phone jack cable.

Copyright LG Electronics. Inc. All rights reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
5.1.5. Adjustment method 5.1.6. Reference (White Balance Adj. coordinate and
5.1.5.1. Auto WB calibration color temperature)
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON Luminance: 204 Gray, 80IRE
key)
(2) Place optical probe on the center of the display ** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx)
- It need to check probe condition of zero calibration before S tandard color coordinate and temperature using
adjustment. CA-210(CH-14) by aging time
(3) Connect RS-232C Cable
Cool Medium Warm
(4) Select mode in ADJ Program and begin a adjustment.
Aging time
(5) When WB adjustment is completed with OK message, L15 X Y X Y X Y
(Min)
check adjustment status of pre-set mode (Cool, Medium, 271 270 286 289 313 329
Warm)
(6) Remove probe and RS-232C cable. 1 0-2 281 285 296 304 323 344
W/B Adj. must begin as start command wb 00 00 , and 2 3-5 280 284 295 303 322 343
finish as end command wb 00 ff, and Adj. offset if need 3 6-9 279 282 294 301 321 341

5.1.5.2. Manual adjustment 4 10-19 277 279 292 288 319 338
(1) Set TV in Adj. mode using POWER ON 5 20-35 275 275 290 294 317 334
(2) Zero Calibrate the probe of Color Analyzer, then place it on 6 36-49 273 273 288 292 315 332
the center of LCD module within 10cm of the surface..
(3) Press ADJ key EZ adjust using adj. R/C 6. White- 7 50-79 272 272 287 291 314 331
Balance then press the cursor to the right (KEY). 8 80-119 271 270 286 289 313 329
( When KEY() is pressed 204 Gray(80IRE) internal
9 Over 120 271 270 286 289 313 329
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
** ( Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx)
and the rest will be lowered to meet the desired value.
S tandard color coordinate and temperature using
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
CA-210(CH-14) by aging time
color temperature.
Cool Medium Warm
CASE Aging time
L15 X Y X Y X Y
First adjust the coordinate far away from the target value(x, (Min)
271 270 286 289 313 329
y).B
(1) x, y >target 1 0-5 280 285 295 304 319 340
i) Decrease the R, G. 2 6-10 276 280 291 299 315 335
(2) x, y< target
i) First decrease the B gain, 3 11-20 272 275 287 294 311 330
ii) Decrease the one of the others. 4 21-30 269 272 284 291 308 327
(3) x >target , y< target 5 31-40 267 268 282 287 306 323
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R 6 41-50 266 265 281 284 305 320
(4) x < target , y >target 7 51-80 265 263 280 282 304 318
i) F
 irst decrease B, so make x a little more than the target. 8 81-119 264 261 279 280 303 316
ii) Adjust x value by decreasing the G
9 Over 120 264 260 279 279 303 315
How to adjust
(1) Fix G gain at least 172 : ** For INX,AUO,SHARP,CSOT Module.( In the case of , the
Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation ) color temperature spec of cool mode is 13000K)
(2) When R or B Gain > 255, Release Fixed G Gain and cool med warm
Readjust L15
x y x y x y
CASE : Medium / Warm mode spec 271 270 286 289 313 329
First adjust the coordinate far away from the target value(x, y). target 276 277 291 296 318 336
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

Copyright LG Electronics. Inc. All rights reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
5.2. Option selection per country 6. GND and HI-POT Test
5.2.1. Overview 6.1. GND & HI-POT auto-check preparation
(1) Tool option selection is only done for models in Non-USA (1) Check the POWER CABLE and SIGNAL CABE insertion
North America due to rating condition
(2) Applied model: LA57H Chassis applied to CANADA and
MEXICO
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
5.2.2. Country Group selection tightly inserted)
(1) Press ADJ key on the Adj. R/C, and then select Country (2) Connect the AV JACK Tester.
Group Menu (3) Controller (GWS103-4) on.
(2) Depending on destination, select US, then on the lower (4) GND Test (Auto)
Country option, select US, CA, MX. - If Test is failed, Buzzer operates.
Selection is done using +, - KEY - If Test is passed, execute next process (Hi-pot test).
(3) Using DFT(Auto) (Remove A/V CORD from A/V JACK BOX)
PC (for communication through RS-232C) -> UART Baud (5) HI-POT test (Auto)
rate : 115200 bps - If Test is failed, Buzzer operates.
Command : ah 00 00 DATA(Area Number(hexadecimal)) - If Test is passed, GOOD Lamp on and move to next process
ITEM DATA(Area Number) AREA automatically.
AREA OPTION1 0 USA
1 CANADA
6.3. Checkpoint
(1) Test voltage
2 MEXICO - GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
5.2.3. Tool Option inspection (2) TEST time: 1 second
Press Adj. key on the Adj. R/C, then select Tool option. (3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
2,3th 4th GND.
Model Module Tool 1 Tool 2 Tool 3 Tool 4
Suffix Suffix
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
32LF560B - M Sharp 13074 13314 41036 28768 (4) LEAKAGE CURRENT: At 0.5mArms
-Ux
32LF550B CC/US M Sharp 13074 17410 53324 24672
-Ux
WM M Sharp 13074 17410 53316 24672 7. AUDIO output check
CC/US F BOE 21266 17410 53324 24672 7.1. Audio input condition
WM F BOE 21266 17410 53316 24672 (1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
CC/US Y LGD 785 17410 49228 24672 (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
WM Y LGD 785 17410 49220 24672
32LF5600 CC/US Y LGD 785 1030 45132 28768
-Ux 7.2. Specification
WM Y LGD 785 1030 45124 28768
No Item Min Typ Max Unit Remark
32LF5600 CC/US F BOE 21264 1030 49228 20576
-Ux 1 Audio practical 4.5 5.0 6.0 W (1) Measurement
WM F BOE 21264 1030 49220 20576 max Output, 6.0 6.3 6.9 Vrms condition
42LF5600 CC/US Y LGD 1553 1030 49228 28768 L/R -E Q/AVL/Clear
-Ux (Distor- Voice: Off
WM Y LGD 1553 1030 49220 28768 tion=10% max (2) S peaker (8
CC/US D AUO 9744 1030 49228 24672 Output) Impedance)
(3) LF55 Series
WM D AUO 9744 1030 49220 24672
2 Audio practical 9.0 10.0 12.0 W (1) Measurement
42LF5500 CC/US Y LGD 1553 5126 49228 28768 max Output, 8.5 8.9 9.8 Vrms condition
-Ux L/R -E Q/AVL/Clear
WM Y LGD 1553 5126 49220 28768
(Distor- Voice: Off
CC/US D AUO 9744 5126 49228 24672 tion=10% max (2) S peaker (8
WM D AUO 9744 5126 49220 24672 Output) Impedance)
(3) LF56 Series
49LF5500 CC/US Y LGD 2321 5126 49228 24672
-Ux
WM Y LGD 2321 5126 49220 24672
55LF5500 CC/US Y LGD 2833 5126 53324 24672
-Ux
WM Y LGD 2833 5126 53316 24672

Tool option can be reconstructed by Software

Copyright LG Electronics. Inc. All rights reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didnt work. Otherwise USB data is
automatically detected.
(3) Show the message Copying files from memory

(4) Updating is staring.

(5) Updating Completed, The TV will restart automatically

(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didnt have a DTV/
ATV test on production line.

* After downloading, TOOL OPTION setting is needed again.

(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push OK button.
(3) Punch in the number. (Each model has their number.)

Copyright LG Electronics. Inc. All rights reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
 TROUBLE SHOOTING
1. Power-up boot check

Check PSU DC Voltage NO Check 12pin OK Main B/D 13.2V Line OK Replace PSU
P401_5,6,7,8 pin : 13.2V Power connector Short Check
OK

Check stand-by Voltage NO Main B/D 3.3V Line OK Replace IC201

L202 : +3.3V Short Check (DCDC)
OK

Check X100 clock NO Replace X100

24 MHz
OK

Check P200 PWR_ON. NO Re-download software. NO Replace Mstar(IC102)

1pin : 3.3V or Main board
OK

Check IC402/3/4 Output

Voltage NO Replace IC402, IC403,
IC202 : 1.15V & 5V
IC404, Q403
IC200 : 1.8V
Q204 : 3.3V
OK

Check TCON(Module)
NO Replace Q205
Panel_VCC
Q205 : 13.2V

OK

Check Mstar LV D S NO Replace Mstar(IC102) or

Output Main Board
OK

Check DRV ON Control NO Check PSU

P200 11pin : High
OK

Change Module

Copyright LG Electronics. Inc. All rights reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
2. Digital / Analog TV Video

Check RF Cable & Signal

OK

Check Tuner 3.3V Power NO Replace L500

L500
OK

Check IF_P/N Signal NO B a d Tu n e r. R e p l a c e

TU501 6,7 Pin Tuner.
OK

Check Mstar LVDS Output NO Replace Mstar(IC102)

or Main Board.

3. AV Video

Check input signal format.

Is it supported?
OK

Check AV Cable for damage

for damage or open
conductor

OK

Check JK401,
CVBS Signal Line NO Replace Jack
R120

OK

Check CVBS_DET Signal NO Replace AR401 or R110

OK

Check Mstar LV D S NO Replace Mstar(IC102)

Output or Main Board.

Copyright LG Electronics. Inc. All rights reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
4. Component Video

Check input signal format.

Is it supported?
OK

Check Component Cable

for damage or open
conductor.

OK

Check JK401 NO Replace Jack

Y/PB/PR signal Line
OK

Check COMP_DET NO Replace AR401or R109

Signal
OK

Check Mstar LV D S NO Replace Mstar(IC101) or

Output Main Board.

Copyright LG Electronics. Inc. All rights reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
5. HDMI Video

Check input signal format.

Is it supported?
OK

Check HDMI Cable conductors

for damage or open conductor.
OK

Check EDID
NO Replace the defective IC or
AR102, AR101, AR410, AR411 I2C
Signal re-download EDID data

OK

Check JK403, JK404 NO Replace Jack

OK

Check HDMI_DET (HPD) NO Replace R418, R410,

Q400, R419
OK

Check HDMI Signal NO Check other set NO Replace Main Board

If no problem, check signal line
OK

Check Mstar LV D S NO Replace Mstar(IC101) or

Output Main Board.

Copyright LG Electronics. Inc. All rights reserved. - 19 - LGE Internal Use Only
Only for training and service purposes
6. All Source Audio

Check the TV Speaker Menu OFF Toggle the Menu

(Menu -> Audio -> TV Speaker)
ON

Check AMP IC(IC5600) Power NO Main B/D 3.3V Line

24V, 3.3V Short Check
OK

Check Mstar AUDIO_MASTER_CLK NO Replace Mstar(IC101)

R148 or Main Board.
OK

Check AMP I2C Line NO Check signal line.

R140, R141 Or replace Mstar(IC101)
OK

Check Mstar I2S Output NO Check signal line.

IC5600 20,21,22 Pin Or replace Mstar(IC101)
OK

Check Output Signal

NO Replace Audio AMP
P5600
1, 2, 3, 4 pin. IC(IC5600)

OK

Check Connector & NO Replace connector

P5600 if found to be damaged.
OK

Check speaker resistance NO Replace speaker.

and connector damage.

Copyright LG Electronics. Inc. All rights reserved. - 20 - LGE Internal Use Only
Only for training and service purposes
7. Digital / Analog TV Audio

Check RF Cable & Signal

OK

Check Tuner 3.3V Power NO Replace L500

L500
OK

Check Tuner I2C NO Replace AR500, R502,

AR500, R502, R503 R503
OK

Check IF_P/N Signal NO B a d Tu n e r. R e p l a c e

TU501 6/7 Pin Tuner.
OK

Follow procedure
7. All source audio
trouble shooting guide.

8. AV Audio

Check AV Cable for damage

for damage or open conductor
OK

Check JK401 Signal Line NO Replace Jack

R409 ,R406
OK

Follow procedure
7. All source audio
trouble shooting guide.

9. Component Audio

Check Component Cable

for damage or open conductor.
OK

Check JK401 Signal Line NO Replace Jack

R409 ,R406
OK

Follow procedure
7. All source audio
trouble shooting guide.

Copyright LG Electronics. Inc. All rights reserved. - 21 - LGE Internal Use Only
Only for training and service purposes
Copyright
IR Board
Power Board(LPB) Module
P300/301 P304
3, 4, 7, 8 P200 4 2 1
Panel_Vcc
Q204

IR
ST_3.5V

Only for training and service purposes

DMP2130L
LED

USB_DN
KEY2
Panel_12V KEY1
USB_DP

PWM
RL_on

INV_on
124 123 110 100 101 106 105 79 ~ 89
114 113 112 111

P_13.2V
IC201
TI (TBD) SPI_CLK USB_5V
EEP SDA
2BUCK 1OCP VDDC_1.15V SPI_DI
EEP SCL USB_DN
SPI_CZ 67 ~ 78
USB_DP
SPI_DO
IC101
JK605

LG Electronics. Inc. All rights reserved.

Serial Flash
8Mbytes MHL_5V
IC100 HDMI2
EEPROM
24C512 54
IC202
JK603

24Mhz
BD9D321EFJ AVDD_ST_3.5V

- 22 -
21 33 51 52 87 127 53
LGE8220 / M1L
IR TU701
KEY1/2 59
32 57 131 144
3 Tuner SCL
LED IC101 58 4 Tuner SDA
N_3.3V DDR_1.8V IF_N
IC200 56 132
Q204 50 10 TDSS-H701F
AZ1117EH IF_P
DMP2130L 63
49 11
64
BLOCK DIAGRAM

48 9 IF_AGC
65
66 94 95 134,135,145~152 139,140,1~4,153~156 22,24,26,34,35 29,34,35 62 116 117
S_AMP_24V
13 B+ 5
I2S_MCLK
15 I2S_WS TUNER
3 4
20 I2S_SCK
33 34 HDMI2 TU_3.3V
AV1 In

Sound AMP 21 I2S_SDO

Y,Pb,Pr In

22
Comp. R/L In

(( 1
TAS5733 M_3.3V
LPF
46 Audio_SDA HDMI1
36 23 24 Tx, Rx
LPF
IC301 Audio_SCL SPDIF Debug
39
(( JK602 JK601 JK608 JK607/P601/P602
P305

LGE Internal Use Only

 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

900

410

901
400
LV1

401
521

540
200

120

Set + Stand
A10
A2
530

Copyright LG Electronics. Inc. All rights reserved. - 23 - LGE Internal Use Only
Only for training and service purposes
 <SOC_RESET>

POWER_ON/OFF
SIDE_USB_DP

SIDE_USB_DM
<MAIN SoC Vcc>

SOC_RESET

POWER_DET

/FLASH_WP

PANEL_CTL

AMP_RESET
MODEL_OPT
+3.3V_ST

PWM_DIM2

AMP_MUTE

USB_CTL
USB_OCD

AVDD_MOD
SPI_SCK

SPI_SDO

PWM_DIM
/SPI_CS
SPI_SDI

INV_CTL

AMP_SCL
AMP_SDA
I2C_SCL

I2C_SDA
PM_RXD
PM_TXD
OPT

RXBCK-
RXBCK+
RL_ON

RXB3+

RXB3-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-
R103
470

IR
POWER_DET_RESET L102 +3.3V_ST
PZ1608U121-2R0TF AVDD_MOD
L105
PZ1608U121-2R0TF AVDD_DADC
+3.3V_ST

1K

1K
+3.3V_ST
OPT
AR105 C131 C132
4.7K C121 0.1uF 0.1uF C147
OPT 10uF C127 16V C139 0.1uF

R112

R115
16V

AR111

1/16W
C100 C101 6.3V 1uF 0.1uF C140 16V
4.7uF 4.7uF 10V 16V 0.1uF
L108

33
10V 10V 16V
PZ1608U121-2R0TF AVDD_AU33
<Chip config.>

AR110
1/16W

AR112

1/16W
SOC_RESET 4.7K

100

100
1/16W AR108
+1.15V_VDDC C146
0.1uF
Closed to SoC as possible 16V

R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6-
R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+
R104 C103
470K 0.1uF R117 C130
16V Closed to SoC as possible 10K C138 L107
0.1uF

R_ODD[1]/LVBCLK-/RLV5-/EPI4-
R_ODD[0]/LVBCLK+/RLV5+/EPI4+
C120 0.1uF PZ1608U121-2R0TF AVDD_DMPLL
C126 C129 16V

1/16W
100
AR104
AR107 10uF 0.1uF 16V
1uF C137

LVSYNC/GPIO16/RLV0-/GPIO16
LHSYNC/GPIO17/RLV0+/GPIO17

R_ODD[7]/LVB0-/RLV2-/EPI7-
R_ODD[6]/LVB0+/RLV2+/EPI7+

R_ODD[3]/LVB2-/RLV4-/EPI5-
R_ODD[2]/LVB2+/RLV4+/EPI5+

G_ODD[7]/LVB3-/RLV6-/EPI3-
G_ODD[6]/LVB3+/RLV6+/EPI3+
G_ODD[5]/LVB4-/LLV0-/EPI2-
G_ODD[4]/LVB4+/LLV0+/EPI2+
33 6.3V 10V 16V 0.1uF

5V_DET_HDMI_1

HPD1
1/16W 16V C145
0.1uF

LDE/GPIO18/RLV1-/GPIO18
LCK/GPIO19/RLV1+/GPIO19
16V

INT/GPIO64/I2S_OUT_MCK

AR106
1/16W
L106
<HW_OPTION>

33
PZ1608U121-2R0TF AVDD_VIDEO

GPIO10/TCON10
R114
10K DDR_CMD DDR_DATA

PWM0/GPIO15
PWM1/GPIO14

GPIO0/TCON0
GPIO1/TCON1
GPIO2/TCON2
GPIO3/TCON3
GPIO4/TCON4
GPIO5/TCON5
GPIO6/TCON6
GPIO7/TCON7
GPIO8/TCON8
GPIO9/TCON9
+3.3V_NORMAL C144
+1.8V_DDR +1.8V_DDR 0.1uF

ARC/GPIO87

AVDD_MOD_3
L101 L104 16V

HOTPLUG_A
HOTPLUG_D
PZ1608U121-2R0TF PZ1608U121-2R0TF

DDCA_CK
DDCA_DA

SPI_CK
SPI_CZ
SPI_DI
SPI_DO
C119 C136
FHD C118 0.1uF OPT 0.1uF OPT
DP_P0
DM_P0
RESET
R102 10uF 16V C125 C135
10uF 16V C141
4.7K 6.3V
IRIN

TEST
0.1uF 6.3V 0.1uF
16V 16V

MODEL_OPT CEC Closed to Main SoC Each Pin

124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
HD
R101
4.7K
78 G_ODD[3]/LVA0-/LLV1-/EPI1-
DM_P1 125
77 G_ODD[2]/LVA0+/LLV1+/EPI1+
DP_P1 126
76 G_ODD[1]/LVA1-/LLV2-/EPI0-
AVDD_MOD_4 127
RXA3+
AVDD_MOD
AR103 75 G_ODD[0]/LVA1+/LLV2+/EPI0+
100
1/16W
SAR0/GPIO75 128
RXA3-

74 B_ODD[7]/LVA2-/LLV3(CLK)-
KEY1 SAR1/GPIO74 RXACK+
Closed to SoC as possible

129
KEY2
73 B_ODD[6]/LVA2+/LLV3(CLK)+
R111 1K SAR2/GPIO73 130
RXACK-
LED_RED
72 B_ODD[5]/LVACLK-/LLV4- RXA2+
VDDC_3 131
+1.15V_VDDC
71 B_ODD[4]/LVACLK+/LLV4+ RXA2-
VDDIO_DATA 132
DDR_DATA
70 B_ODD[3]/LVA3-/LLV5- RXA1+
R110 1K GPIO54 133
AV_DET
AR102 69 B_ODD[2]/LVA3+/LLV5+ RXA1-
100
1/16W DDCDD_CL 134
DDC_SCL_1
68 B_ODD[1]/LVA4-/LLV6- RXA0+
DDCDD_DA 135
DDC_SDA_1
67 B_ODD[0]/LVA4+/LLV6+ RXA0-
COMP_DET
R109 1K DDCDA_CL 136 GPIO53/I2S_OUT_SD
5V_DET_HDMI_2
R108 10K DDCDA_DA 137 IC102 66
65 GPIO52/I2S_OUT_BCK
AUD_LRCH

R128 10K MHL_DET/GPIO86 138 AUD_SCK

GPIO51/I2S_OUT_MCK
MHL Disable

AR101 100
DDCDB_DA 139 LGE8220(MSD8220LBM) 64
63 GPIO50/I2S_OUT_WS
AUD_MASTER_CLK

DDC_SDA_2 AUD_LRCK
DDC_SCL_2
DDCDB_CL 140 GPIO49/SPDIF_OUT
62 SPDIF
SUB_NVRAM_ROHM
IC100-*1
HPD2
1/16W
HOTPLUG_B 141 [M1L] 61 GPIO47
R126
100
SPDIF_OUT

BR24G512FJ-3
HDMI2_5V
AVDD_5V_MHL 142 VCOM_SDA

60 GPIO46/MHL_VBUS VCOM_SCL
A0 VCC GND_EFUSE 143
1 8
59 GPIO45/I2C_SCLM/UART_RX1
A1 WP
+1.15V_VDDC VDDC_4 144 TU_SCL
2 7
58 GPIO44/I2C_SDAM/UART_TX1
A2
3 6
SCL
CK-_HDMI1
RXCN_D 145 TU_SDA

57 VDDC_2 +1.15V_VDDC
GND
4 5
SDA
CK+_HDMI1
RXCP_D 146
56 VDDIO_CMD DDR_CMD
D0-_HDMI1
RX0N_D 147
55 AVDD_MOD_2 AVDD_MOD
D0+_HDMI1
RX0P_D 148
54 XOUT C143 15pF
D1-_HDMI1 RX1N_D 149 R127 X100
EEPROM(512KB) 53 XIN 1M 24MHz
C142 15pF
NVRAM_ATMEL D1+_HDMI1 RX1P_D 150
IC100 52 AVDD3P3_DMPLL AVDD_DMPLL
AT24C512C-SSHD-T D2-_HDMI1
RX2N_D 151 Closed to SoC
+3.3V_ST 51 AVDD3P3_DADC AVDD_DADC
D2+_HDMI1
RX2P_D 152
A0
1 8
VCC 50 VIFM R122 0 C123
IF_N_MSTAR
THERMAL

CK-_HDMI2
RXCN_B 153 0.1uF
16V
C105
0.1uF 49 VIFP R123 0 C124
157

A1 WP R106 R107 IF_P_MSTAR

2 7 16V
2.2K 2.2K CK+_HDMI2
RXCP_B 154 0.1uF
16V
48 IFAGC
OPT
A2
3 6
SCL AR100
33 D0-_HDMI2
RX0N_B 155 OPT
C128 C134
1/16W 47 LINEOUTR0 100pF 100pF
GND SDA
I2C_SCL
D0+_HDMI2
RX0P_B 156 Closed to SoC
4 5 I2C_SDA
E-PAD
10
11
12
13
14
15
16
17
18
19
20
AVDD3P3_ADC 21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
OPT OPT
1
2
3
4
5
6
7
8
9

C102 C104
8pF 8pF
RX1N_B
RX1P_B
RX2N_B
RX2P_B
AVDD_MOD_1
RXCN_A
RXCP_A
RX0N_A
RX0P_A
RX1N_A
RX1P_A
RX2N_A
RX2P_A
HSYNC0
BIN0P
SOGIN0
GIN0P
GIN0M
RIN0P
VSYNC0

BIN1P
SOGIN1
GIN1P
GIN1M
RIN1P
VSYNC1
CVBS1
CVBS0
VCOM
CVBS_OUT1
VDDC_1
AVDD_AU33
AUR0
AUL0
AUR1
AUL1
AUR2
AUL2
AUR3
AUL3
VAG
VRM
LINEOUTL3
LINEOUTR3
LINEOUTL0
+3.3V_NORMAL

PZ1608U121-2R0TF
SERIAL FLASH(64MB) +3.3V_ST

L103
0.047uF

0.047uF

0.047uF
0.047uF

0.047uF

0.047uF
1000pF

2.2uF

2.2uF
25V

50V

25V

25V

25V

10V

10V
25V

25V

OPT IC101
R105 W25Q64FVSSIG
4.7K C122
C116 0.1uF
C107

C108

C109

C111

C112

C113

C114

C115
C110

0.1uF 16V R124

CS VCC 10K
R100 1 8 16V
/SPI_CS
10K
C106
180
150
33

33

68

0.1uF
33

DO[IO1] %HOLD[IO3] IF_AGC_MAIN

2 7 16V C117 R125
SPI_SDO C133
10uF 100
PZ1608U121-2R0TF

6.3V 0.047uF
AR109

25V
R113

R118

R120

R121
R119

/FLASH_WP WP[IO2] CLK

3 6 SPI_SCK
L100

GND DI[IO0]
AVDD_MOD

4 5 SPI_SDI Close to MSTAR

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

AVDD_VIDEO

+1.15V_VDDC

AVDD_AU33
COMP_Pb+

TP1
COMP_Pr+

COMP_Y+

COMP_R_IN

COMP_L_IN
COMP_Y+

Not USe Macronix (EAN63146601)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1L 140822
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MAIN 1 5

Copyright 2015 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 L15 NA POWER BLOCK

FROM LIPS or POWER B/D

PANEL_Vcc Power_DET +13.2V --> 3.56V

M13.2V

+3.3V_ST TR_NXP TR_KEC

MMBT3906(NXP) Q201-*1 PANEL_VCC
PANEL_VCC
Q201 2N3906S-RTK +3.3V_ST
E C L203
Q205 +3.3V_ST
UBW2012-121F R241
1 3 SSM3J332R 100K
OPT
OPT R215 S D
R201 33K B OPT Reset_IC_KEC R246
10K 2 Panel_Cgs_0.22uF R236
R205 OPT C213 R232 IC203 4.7K
C212 R219 10% OPT 14K 0
RL_ON 10K 33K 0.22uF KIC7529M2
0.1uF 1608 G R224 R225 1%
25V 3.3K 3.3K
25V R245
R202 POWER_DET
VCC OUT 300
10K 3 2
Panel_Cgs_0.1uF
OPT R220 C213-*1 OPT 1
120K 10%
R207 1608 0.1uF R233 R237 C238
C224 0 GND
0 50V 5.6K 0.1uF
To make high at RL_ON 0.1uF
P200 C C 1%
when AC On TR_NXP 16V
OPT SMAW200-H12S5K(BK)(LTR) TR_KEC
VR200 PANEL_CTL B Q202 B Q202-*1 POWER_DET_RESET
ICVS0518150FR_ MMBT3904(NXP) 2N3904S
+3.3V_NORMAL RESET_IC_DIODES
PWR_ON 1 2 PDIM#2 E E IC203-*1
PWM_DIM2
+3.3V_ST GND D13.2V APX803E29
R206 R209 3 4
1K 100 D13.2V D13.2V
5 6 VCC 3 2 RESET
R200 C A13.2V 7 8 A13.2V
R203 1
10K TR_NXP GND GND
10K B 9 10 GND
INV_CTL Q200 DRV_ON PDIM#1
MMBT3904(NXP) 11 12 PWM_DIM
C
E L208
TR_KEC
Q200-*1 B 13
2N3904S MLB-201209-0120P-N2
.

L201 OPT
E
MLB-201209-0120P-N2
M13.2V
SUB_FET_3.3V_AOS
C203 C205
+3.3V_Normal

AO3435
S

D
Q204-*1
10uF 0.1uF A13.2V
25V 25V C241
+3.3V_ST
0.1uF FET_3.3V_TOSHIBA +3.3V_NORMAL

G
25V Q204 L204
SSM3J332R PZ1608U121-2R0TF

D
S
OPT
C215 C218 ZD202

G
C214 0.1uF 10uF 5V
R221 4.7uF 16V
12K 6.3V
10V

OPT
R216
10K

R222
1.8K

R218 C C
TR_NXP TR_KEC
+1.8V_DDR POWER_ON/OFF

OPT
10K B Q203
MMBT3904(NXP)
B Q203-*1
2N3904S

R217 E E
10K
+3.3V_NORMAL
+1.8V_DDR
IC200
AZ1117EH-ADJTRG1

IN OUT

R1 R214
C201 0
10uF ADJ/GND 1% OPT
6.3V R212 ZD200 ZD205
3.9K 2.5V 5.1v
C208
10uF

R2 1%
R213
6.3V
+5V_Normal & +1.15V_VDDC
1.6K
Check ESR!!

Vout=1.25*(1+R2/R1)+I(ADJ)XR2

Vout=0.6(R1/R2)+0.6
+1.15V_VDDC
M13.2V
L206
4.7uH

R1 OPT OPT

0.047uF
C231 OPT C234 OPT

25V
L205 R238 C237 C240
82pF 10uF ZD204

C226
4.7K ZD203 22uF 22uF
CB2012PK501T 50V 6.3V 5.1v
1% 2.5V 6.3V 6.3V

C219 C220 R2

C223
+3.3V_STANDBY

1uF
10V
10uF 10uF 0
25V 25V R230 R239
5.1K
1%

PGND1
C233
+3.3V_NORMAL +3.3V_ST OPT

[EP]

VIN1

BST1
M13.2V 22pF

SS1

V7V

LX1
C221 50V
2200pF
+3.3V_ST 50V
C232

24

23

22

21

20

19
R240 3300pF
L200 R223 R226 SS2 COMP1 10K 50V R242
50V OPT
10K 10K C222 1 18 200
BLM18PG121SN1D THERMAL
2200pF EN1 FB1 1%
2 25 17
EN2 AGND R243 R2

R234
3 IC202 16 5.1K

15K
OPT R229
OPT OPT OPT OPT 91K ROSC/SYNC RSET 1%
C200 C202 C216 R249
C217 R250 +3.3V_NORMAL 4 SN1406035RGER 15
10uF 0.1uF 4700pF 300K 4700pF 300K
25V 50V SW_EN FB2
25V IC201 50V 5 14 C230
22pF
R210 BD9D321EFJ [EP] R227 NFAULT COMP2 50V
100K R244
OPT 4.7K 6 13 C235
39K

10

11

12
ZD201 OPT C229 1% 47pF

9
5V R235 3300pF 50V
R248 EN VIN USB_CTL 20K 50V
33K 1 8 SD05 +3.3V_NORMAL

SW_OUT

SW_IN

VIN2

PGND2

LX2

BST2
R247 R1 +5V_NORMAL
16V
THERMAL

R204 R208 0.1uF 3.3K

6.2K 68K R1 FB BOOT C209 R231 C228 L207
R228
9

2 7
10K

0.047uF 4.7uH
0 25V
1/16W 1/16W L202
1% 1% VREG SW 2uH USB_OCD
3 6 C236 C239
C204 22uF 22uF
100pF +5V_NORMAL 16V 16V
50V
SS GND 3216 3216
R2 4
3A 5 C210
22uF
C211
22uF 85C 85C
1/16W

R211

10V
3216
10V
3216
+5V_USB
22K

C206 C207
1%

125C 125C
1uF 2200pF
10V 50V
CST Check!!
C227
Vout=0.6(R1/R2)+0.6
16V
22uF
C225

1uF
16V

Vout=0.765*(1+R1/R2)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1L 141020
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER 2 5

Copyright 2015 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 AUDIO AMP(TI)/LVDS/IR IR
+3.3V_ST

[51Pin LVDS Connector] [30Pin LVDS Connector]

(For FHD 60Hz) (For HD 60Hz_Normal) AR303
10K
HD 1/16W

P301 KEY1
10031HR-30
FHD OPT
C338
P300 VR302 0.1uF OPT
SP14-11592-01-51Pin 16V P302 P303
1
12507WR-08L 12507WR-10L
2
1
3 VCOM_SCL_M
V-COM I2C or GPIO(Tuner) KEY2 1 1
2 OPT
4 VCOM_SDA_M +3.3V_NORMAL OPT
LVDS_SEL C337
3 VR301 0.1uF
5 2 2
16V
4 +3.3V_NORMAL
VCOM_SDA_M 6 RXA0-
5 VCOM_SCL_M +3.3V_ST 3 3
7 RXA0+ V_COM V_COM
OPT L307
6 R302 R316 R317
PZ1608U121-2R0TF
3.3K 8 2K 2K
4 4
7
9 RXA1- AR302
OPT C335 C336
8 0 0.1uF 1000pF
R301 10 16V 50V 5 5
RXA1+
9 10K VCOM_SCL_M VCOM_SCL
11
VCOM_SDA_M VCOM_SDA
10 LED_RED 6 6
12 RXA2- V_COM
11 OPT OPT OPT
13 R323 R324 VR300 +3.3V_ST
RXA2+ 7 7
12 2K 2K
RXA0- 14
OPT
13 R322
RXA0+ 15 8 8
RXACK- 3.3K
14
RXA1- 16 RXACK+ IR 9
15 9
RXA1+ 17 C339
100pF OPT
16 LVDS_SEL 50V VR303
RXA2- 18 RXA3- 10
17 +3.3V_NORMAL
RXA2+ 19 RXA3+
18 11
20
19 OPT
RXACK- 21 R307
3.3K
20
RXACK+ 22
21 PANEL_VCC
23 OPT
R306
22 10K
RXA3- 24 HD
23 L302
RXA3+ 25 120OHM
24 UBW2012-121F
26
25
27
R300 0
26 FHD_GND_26 HD
28 HD_VCC_Cap
R320 0 C306
27 FHD_GND_27 C303
29 10uF 0.1uF
28 25V 25V
RXB0- 30
29
RXB0+
31
30
RXB1-
31
RXB1+
32
RXB2-
33
RXB2+
34

35
RXBCK-
36
RXBCK+
37

38
RXB3-
39
RXB3+
40

41

42 FHD_GND_42_43 A13.2V +13.2V_AMP

AUDIO AMP(TI)
AR300 This parts are Located
43 0 R303
PANEL_VCC
0 on AVSS area.
44 L301
1/16W
45 FHD 120OHM OPT R311
470
L300 C307
46 UBW2012-121F 0.1uF
Close to Speaker
50V C313 C318
47 4700pF C314 0.033uF L304
0.047uF 50V
48
Separate DGND AND AVSS SPK_L+
C311 R312
10.0uH
FHD 1/16W NRS6045T100MMGK
4700pF +13.2V_AMP
49 FHD_VCC_Cap 18 1%
C301
C300
10uF 0.1uF
C310 C315
50 R310 2200pF C326 OPT
25V 25V +3.3V_NORMAL
+3.3V_NORMAL 50V 330pF C332 C341
51 0.047uF 470 C322 50V 0.1uF 2200pF
C320 50V 50V
0.1uF 10uF
50V
SPEAKER_L
SSTIMER

25V
PVDD_AB_2
PVDD_AB_1
VR_ANA
PLL_FLTP
PLL_FLTM

52 C330
BST_A

OUT_A

0.33uF
AVSS
PBTL
NC_2

NC_1

C327 OPT
50V C342
330pF C333 2200pF
R305 C305 50V 0.1uF 50V
[EP]
12
11
10
9
8
7
6
5
4
3
2
1

4.7K 0.1uF 50V P304

16V AVDD 13 48 PGND_AB_2 R313 1/16W
R309 A_SEL_FAULT PGND_AB_1 18 1% 250A1-WR-H04M
THERMAL

14 47
MCLK OUT_B L306
2.2K 46
49

AUD_MASTER_CLK 15 SPK_L-
Need to Check. R308 OSC_RES NC_6
16 45 10.0uH
C324 NRS6045T100MMGK SPK_L+
18K 1% DVSSO 17 44 NC_5 0.033uF 4
VR_DIG BST_B 50V
AMP_MUTE 18 IC300 43
PDN 19 42 BST_C SPK_L-
TAS5733 3
OPT OPT LRCLK 20 41 NC_4
R304 C302 C325
1000pF C309 SCLK 21 40 NC_3 0.033uF
0 0.1uF L303 SPK_R+
POWER_DET 50V 16V SDIN 22 39 OUT_C 50V 2
SPK_R+
SDA 23 38 PGND_CD_2 10.0uH
SCL 24 37 PGND_CD_1 NRS6045T100MMGK SPK_R-
+3.3V_NORMAL R314 1
1/16W
25
26
27
28
29
30
31
32
33
34
35
36

AUD_LRCK 18 1% OPT
AUD_SCK C343
C334 2200pF
PVDD_CD_1
PVDD_CD_2
RESET
STEST
DVDD
DVSS
GND
AGND
VREG
GVDD_OUT
BST_D

OUT_D
AR301
1/16W

AUD_LRCH C328 0.1uF 50V

SPK Wafer Box Type
4.7K

330pF 50V
+13.2V_AMP 50V C331
AMP_SDA OPT
0.33uF C344
AMP_SCL C329 50V 2200pF SPEAKER_R
330pF C340 50V
AMP_RESET 50V 0.1uF
C321 C323 50V
0.1uF 10uF
+3.3V_NORMAL 50V 25V
C316 R315 1/16W
C308 0.1uF 18 1%
0.1uF 16V
16V L305
SPK_R-
C317 C319 10.0uH
OPT 1uF 0.033uF NRS6045T100MMGK
ZD300 16V 50V
5V C312
0.1uF
16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1L 140828
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS/S_AMP/IR 3 5

Copyright 2015 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 EXTERNAL INTERFACE
HDMI_1(REAR)
OPT
R414

AV/COMPONENT 10K

C
R410 TR_NXP R418
JK401 1K Q400
MMBT3904(NXP)
B 10K
HPD1

PPJ245N2-01 JK404 OPT

VR408
E C
TR_KEC
+5V_NORMAL

B Q400-*1 AR410

6E [RD2]E-LUG R409
10K
GND SHIELD
R413
5V_DET_HDMI_1
E
2N3904S 4.7K
1/16W
20 2.7K
COMP_R_IN
HP_DET DDC_SDA_1
19 VR409 R416
VR403 R402 OPT 5V DDC_SCL_1
C402 R408 OPT 4.7K
OPT

5E [RD2]O-SPRING 470K 1000pF

50V
12K 18
GND
VR404 OPT
OPT OPT
17 VR410 VR412
DDC_DATA
16
DDC_CLK
15

4E [RD2]CONTACT R406
10K 14
NC

COMP_L_IN CE_REMOTE
13

EAG59023302
CK-
R401 OPT +3.3V_NORMAL
VR401 470K 12 5.1
C401 R407 L401
OPT

5D [WH]O-SPRING 1000pF
50V
12K
11
CK_GND
CK+
DLP11SA900HL2L
4 3
AR406 1/16W CK-_HDMI1

AR401 10 1 2
CK+_HDMI1
10K D0- 5.1
1/16W 9 L402
DLP11SA900HL2L AR407 1/16W
D0_GND D0-_HDMI1
COMP_DET 8 4 3

4C [RD1]CONTACT OPT 7
D0+ 1 2 D0+_HDMI1

VR402 D1-
6
D1_GND L403
5.1
5 DLP11SA900HL2L AR408 1/16W
D1-_HDMI1
[RD1]O-SPRING
4 3

D1+
4
5C D2-
1 2 D1+_HDMI1
COMP_Pr+ 3 5.1
L404
DLP11SA900HL2L AR409 1/16W
D2_GND D2-_HDMI1
2 4 3

ZD404 OPT
D2+ D2+_HDMI1
[RD1]E-LUG-S R405 1 2

VA402 1
75 1%
7C ZD405 ICVS0518150FR_ comp-shape=1005
HDMI_EMI_Filter

5B [BL]O-SPRING
COMP_Pb+

ZD402
OPT

4A [GN/YL]CONTACT ZD403
VA401
ICVS0518150FR_
R404
75 1%
comp-shape=1005

HDMI_2(SIDE)
5A [GN/YL]O-SPRING
AV_DET

OPT
VR400 Check!!
HPD2 Pull-Up R419

6A [GN/YL]E-LUG 33
HPD2
HDMI2_5V
OPT
GND VR406
OPT +5V_NORMAL
JK403 BODY_SHIELD R420 R411
COMP_Y+ 10 1K
AR411
20 R412 5V_DET_HDMI_2 4.7K
2.7K 1/16W
ZD401 OPT R403 HP_DET
19
VA400 75 DDC_SDA_2
1% 18 5V VR407 R415
ZD400 ICVS0518150FR_ comp-shape=3216 VR405 DDC_SCL_2
OPT 4.7K
GND OPT
17

16 DDC_DATA
OPT OPT
VR411 VR413
15 DDC_CLK

14 NC

UART For DEBUG USB(SIDE) 13 CE_REMOTE OPT

D401

EAG62611204
CK- IP4283CZ10-TBA
+3.3V_ST +5V_USB 12 5.1
CK_GND AR404 1/16W
11 1 10
CK-_HDMI2
CK+
JK400 OPT 10
2 9
CK+_HDMI2
KJA-PH-1-0177 D0- 5.1 3 8
R400 1/16W
0 5% OPT OPT OPT
9 AR405 1/16W
IC400 C407 C409 C417 C418 D0_GND
4 7 D0-_HDMI2
6 M6 MAX3232CDR P401 OPT 8
C400 3AU04S-305-ZC-(LG) ZD406 22uF 22uF 22uF 22uF 5 6 D0+_HDMI2
0.1uF D0+
5V 16V 16V 10V 10V 7
1 M1 3216 3216 2012 2012
D1-
1

VCC C1+ 6
16 1 5.1
USB DOWN STREAM

3 M3_DETECT C406
D1_GND AR402 1/16W
5 1 10 D1-_HDMI2
0.1uF
2

GND V+ SIDE_USB_DM D1+

AR400 15 2 4
2 9 D1+_HDMI2
4 M4
100
1/16W C405 D2- 5.1 3 8
3 AR403
3

5 M5_GND
DOUT1 C1- 0.1uF SIDE_USB_DP 1/16W
14 3 D2_GND
4 7 D2-_HDMI2
OPT OPT 2
RCLAMP0502BA C413
5 6 D2+_HDMI2
C414 D2+
4

RIN1 C2+ OPT

13 4 5pF 5pF 1
D400
50V 50V D402
5

C404 IP4283CZ10-TBA
ROUT1 C2- 0.1uF OPT
12 5

DIN1 V-
11 6

C403
DIN2 DOUT2 0.1uF
10 7

ROUT2 RIN2
P400 9 8
12507WS-04L
EAN41348201 SPDIF OPTIC JACK
+3.3V_NORMAL
1

SPDIF
2 JK402
JST1223-001

3 GND
1

Fiber Optic

4 VCC
2

JP422

JP423

JP424

JP425
VINPUT
3

SPDIF_OUT
4

SPDIF
C408 C412
FIX_POLE

OPT 1uF 18pF

10V 50V
PM_TXD
PM_RXD

ESD Ready

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1L 141020
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. COMP/USB/SPDIF 4 5

Copyright 2015 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes
 3.3V_NORMAL -> 3.3V_TU
TUNER for ATSC W/O Isolator
+3.3V_NORMAL
+3.3V_TU

L500
PZ1608U121-2R0TF

C507 C508 C510

0.1uF 22uF C509
22uF 0.1uF
16V 6.3V
6.3V 16V

+3.3V_TU

TU501 C503
C500
100pF 0.1uF
TDJH-H301F 50V 16V

close to the tuner pin

IF_AGC_MAIN
+3.3V should be guarded by ground
1 C502
0.1uF
16V
NC_1 +3.3V_TU
2
DIF_AGC
3
SCL_RF AR500
R502 R503
1.8K
4 33
1.8K
1/16W
SDA_RF TU_SCL
5 TU_SDA

DIF[P] C501 C504

OPT
C505
OPT
C506
6 15pF 15pF 20pF 20pF
50V 50V 50V 50V
DIF[N]
7
SIF R501
33 IF_P_MSTAR
8
1/16W
5%
CVBS
9
R500
33
IF_N_MSTAR
1/16W
5%

A1 B1
A1 B1 Close to the tuner

47

SHIELD

1. should be guarded by ground

2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
TU_GND_A

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS L15_M1L 140822
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
TUNER 5 5
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

Copyright 2015 LG Electronics. Inc. All right reserved. LGE Internal Use Only
Only for training and service purposes