Signal & Power Integrity Course Details

1. Signal Integrity Basics/Fundamentals.

Signal Integrity Introduction
Signals & Timing.
Signal Path Characteristics.
Transmission Line.
Reflections and Termination.
Crosstalk.
Controlled Impedance
2. Power Integrity & Thermal Basics.
PI & thermal Introduction.
Design Flow.
3. A brief look on SI Simulators
What does an SI simulator do?
Algorithms used by SI simulators.
Some popular SI simulators.
SI simulators from Mentor Graphics (Hyperlynx, Hyperlynx 3D EM tools).
4. Hyperlynx Tools Basic & Hands on examples
Linesim/boardsim introduction & demo.
How to import layout from different EDA tools to Hyperlynx.
Multiboard Simulations.
Embedding Stack-up & Importing planes structures of a PCB.
IBIS models and Topology export from boardsim to Linesim.
Coupling methods, Running Interactive Simulation & Sweep Parameters.
Why Power Integrity? & parameters to be considered for simulations.
Pre-layout and Post-Layout simulations.

Explanation:
1: We have covered all the basic of SI/PI/Thermal simulations related to Hyperlynx & Basic
tool learning etc.
2: We will be covering all the simulation with real time project examples.
Will show real time project demo for the below requirement.
1. Topology Extraction.
a. Simulation parameters consideration.
b. IBIS Model assignment and model selections.
c. Eye diagram generation.
2. Crosstalk Simulation.
a. Coupling thresholds levels.
b. R/C & rise time value considerations.
c. Report generation & review using scripts.
3. EMI Interactive simulation as per standard (CISPR/IEC).
4. DDRx Wizard Simulation DDR3
a. Setting up the wizard, generating spreadsheet, result analysis.
b. Assigning IBIS models
c. Generating timing model of DDR & Processors.
5. S-Parameter extraction for High Speed Boards (up to 20 Gbps).
a. Coupling Methods.
b. Port Assignments etc.
6. SERDES Simulation / Full Channel Analysis.
a. IBIS AMI Channel Analysis & Fast Eye Channel Analysis.
7. 3D EM Simulation.
a. Via/BGA Via extraction (PTH/Blind/Buried Via), Port assignments,
reference plane selections & S-parameter extraction.
b. Stack-up planning.
c. Parasitic Extraction.
d. Considering Surface roughness parameters.
8. Power Integrity Simulations using Hyperlynx

a. DC Drop Simulations Assigning the models (DC/VRM).

b. Decoupling Analysis. Impedance plot.

9. Thermal Simulations (Board Level) - Hyperlynx

a. Component & Board Temp. Analysis.
b. Input considered for the simulation activity.