Screen Printing for MEMS Packaging

and Wafer bonding

1. Screen Printing
As a patterning technology screen printing at
Fraunhofer ENAS is mainly used for selective
deposition of intermediate layers for wafer
bonding. With a typical micro structured stencils
paste-like materials could be transferred to an
electronic or semiconductor substrate. The
specifications depend typically on the stencil
openings, stencil thickness, and the mesh size
as well as on the paste ingredients like particle
size and binder material. Actual research is
Fig. 2: Cross section SEM of glass frit bonded wafers and
done to the minimal printable feature sizes
top view of printed glass frame
lateral and vertical.
With the fully automatic high precision in-line
screen printers R29 Spectrum and MV100 3. Substrates:
usually glass frit pastes for wafer bonding but Lead frame
also other materials like solder pastes and
Silicon Wafer
adhesives could be clean room-like printed on
substrates up to 250 mm x 250 mm Glass Wafer
(Frame R29: 736 mm x 736 mm). Ceramics
Special Substrates

4. Application Examples:
Hermetical wafer bonding
Electrical feed throughs
MEMS Packaging
Chip bonding / Flip-Chip bonding
Assembly / Mounting

Fig. 1: Screen printed glass paste on Si wafer

after bonding and cutting

2. Main Features:
736 x 736mm (29" x 29") standard frame
Unique vision alignment system
Closed loop servo control of all moving
platforms
Automatic stencil loading, positioning and Fig. 3: Schematically view of glass frit bonded MEMS with
ejection system bond frame crossing electrical feed throughs
Vertical motion control for
stencil/substrate separation
Heavy board handling system
5. Contact:
Fully automatic vision system for precise,
Dr.-Ing. Maik Wiemer
repeatable printing
Phone: +49 371 45001-233
Lateral: 190 m - 150 mm Fax: +49 371 45001-333
Vertical: 10 m - 1 mm Email: maik.wiemer@enas.fraunhofer.de