Heat Transfer in Vacuum

Methods of protecting components from heat sources in

vacuum chamber
How to predict temperature of the components
Simple 1D heat transfer models for quick design
evaluation
Project example

Igor Fidelman 9/23/10

What needs to be protected:
O-rings, plastic parts (limited service temperature)
Mechanisms ( thermal expansion )
Chamber walls ( preventing deposition )
Feedthroughs ( proper function )
Modes of heat transfer: radiation and conduction
(convection: low pressure chambers and frequent pumping/venting )

Methods of protection:
water cooled chamber walls or baffles,
increased thermal conductive path
use of low thermal conductivity materials (quartz,
opaque quartz, ceramics, SST)
radiation shields
gas assisted cooling
 Opaque quartz Heat source
O-ring

Clear quartz
Wafer
Water
channel Cooling gas

Chamber wall
Radiation Thin wall:
shields Increased thermal
path
Thermal radiation.
Wavelength: 0.1 100 micrometers
Black body emits E=s*T^4 (W/m^2)
Stefan-Boltzmann constant s=5.66e-8 (W/m^2*K^4)

Real body emits E= e*s*T^4 (W/m^2)

e emissivity (0-1)
Emissivity
Depends on material and surface conditions
SST, polished 0.27-0.29
SST, oxidized 0.53-0.87
Aluminum, polished 0.04-0.09
Aluminum, anodized 0.4-0.6
Opaque quartz 0.92
Alumina 0.9
 Absorptivity, reflectivity, transmissivity
a+r+t=1
More complications:
Dependence of optical properties on wavelength

Transmittance of 1mm thick clear fused quartz

More complications:
Dependence of optical properties on temperature

Emissivity of 0.725mm Si wafer

More complications:
Spectral distribution of radiation energy.
Maximum energy is emitted at: 2897.6/T(K) microns
More complications:
Reflection specular, diffusive
Approximation for engineering calculations
all surfaces are gray: absorptivity = emissivity, does not
depend on wavelength ( rarely exist in real life, many
materials are gray over certain wavelength ranges )
all surfaces are opaque
all surfaces are diffusive
all surfaces are at uniform temperature

T1
4 4
Q :=
( ) ( )
T2

1 e 1 1 e 2
+ 1
+

e A A F e A
1 1 1 12 2 2
View Factors
Fraction of energy leaving surface 1 which reaches surface 2
Simple 1D Model Tw = const

Liner (top)-Chamber wall

Tl = f (Cv,m) Qr=f (e,T,F,A )

Qr Wafer-Liner
Wafer Qr=f (e,T,F,A )
Liner (bottom)-
Chamber wall Tw = f (Cv,m)
Chamber wall
Qr=f (e,T,F,A ) Heater-Wafer Qr=f (e,T,F,A )
Qr=f (e,T,F,A )

Th = const
Simple 1D model -results

650
600
550
500
450
400
350
T,C

300
250
200
150
100
50
0
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
time,sec

wafer liner
Taking it a step further

Q radiation Q convection/conduction

Q radiation Q convection/conduction

Q conduction

Q radiation Q convection/conduction

Q radiation Q convection/conduction
1D Model - Results
850
840
830
820
810
800
790
780
770
760
temperature, C 750
740
730
720
710
700
690
680
670
660
650
base plate
heater 640
susc. bottom 630
susceptor 2 620
susceptor 3 610
susceptor 4
susc. top 600
4990 5000 5010 5020 5030 5040 5050 5060 5070 5080 5090 5100
shower head
wafer time, sec
1D Model - Results
850
840
830
820
810
800
790
780
770
760
750
temperature, C 740
730
720
710
700
690
680
670
660
650
640
630
620
610
base plate
600
heater
590
susc. bottom
580
susceptor 2
570
susceptor 3
susceptor 4 560
susc. top 550
5000 5100 5200 5300 5400 5500 5600
shower head
wafer time, sec
1D Model - Results

940

920
900

880

860

840

820
temperature, C

800

780

760

740
720

700
680
base plate 660
heater
susc. bottom 640
susceptor 2
susceptor 3 620
susceptor 4
susc. top 600
4900 5000 5100 5200 5300 5400 5500 5600
shower head
wafer time, sec
Project example
Problem:
protect chamber from high energy ion beam
keep temperature of the shields below 150 deg C

Solution:
Use pure aluminum shields bolted to water cooled Al6061
supports
Project example

SHIELDS
Project example
shield
Cooling
channels
 temperature, C

0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150

0
30
60
90
120
150
180
210

240
270
300

330
360
Project example

390

sac.plate
420
450
480
510
cool.plate
tim e, sec

540
570
600
630
w ater exit T

660
690
720
750
780
810
840
870
900
930
960
Conclusions

Thermal behavior of the chamber components have to be

carefully evaluated when designing a vacuum chamber with a
heat source.
A simple 1D model allows to quickly estimate steady state and
transient temperature of the parts.