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OC 6000e
Hardware Manual
GEK-114903
Version No. 2.0
These instructions do not purport to cover all details or variations in equipment, nor to
provide for every possible contingency to be met during installation, operation, and
maintenance. The information is supplied for informational purposes only, and GE makes
no warranty as to the accuracy of the information included herein. Changes,
modifications and/or improvements to equipment and specifications are made
periodically and these changes may or may not be reflected herein. It is understood that
GE may make changes, modifications, or improvements to the equipment referenced
herein or to the document itself at any time. This document is intended for trained
personnel familiar with the GE products referenced herein.
GE may have patents or pending patent applications covering subject matter in this
document. The furnishing of this document does not provide any license whatsoever to
any of these patents. All license inquiries should be directed to the address below. If
further information is desired, or if particular problems arise that are not covered
sufficiently for the purchasers purpose, the matter should be referred to:
GE Energy
Control Solutions
1800 Nelson Road
Longmont, CO 80501
energy.controlsolutions@ge.com
http://www.ge-energy.com/oc
Phone: + 1 (800) 835-5182, United State)
+ 1 (970) 461-5201 (International)
(+ indicates the international access code required when calling from outside the
USA)
This document contains proprietary information of General Electric Company, USA and
is furnished to its customer solely to assist that customer in the installation, testing,
operation, and/or maintenance of the equipment described. This document shall not be
reproduced in whole or in part nor shall its contents be disclosed to any third party
without the written approval of GE Energy.
GE provides the following document and the information included therein as is and
without warranty of any kind, express or implied, including but not limited to any implied
statutory warranty of merchantability or fitness for particular purpose.
2012 General Electric Company, USA. All rights reserved.
Safety Symbols
Tip Provides essential information that is not normally defined in regular use
but from an experienced user.
Contents
Chapter 1 UCSA Controller 1
1.1 Operation 1
1.2 Configuration 2
1.3 Installation 2
1.4 UCSA overview 2
1.5 LEDs 3
1.6 UCSA Specifications 4
Chapter 2 IO Module 5
2.1 MAI10 Analog Input with 16 channels of mA/V 5
2.2 MAI20 Analog Input with 16 channels of RTD/TC 14
2.3 MAO10 Analog Output with 8 channels 23
2.4 MDI10 Configurable Digital input /Pulse input with 16 channels 31
2.5 MDO10 16 channels of Digital Output 39
2.6 MVP10 Valve Position Control Module 46
2.7 MVP11 Valve Position Control Module 59
2.8 MSP10 Speed Measurement and Protection Module 72
2.9 TMR 2oo3 Voting & Extension Relay Module 88
2.10 MAI12 Analog Input with 16 channels of mA/V 93
2.11 MAI22 Analog Input with 16 channels of RTD/TC 102
2.12 MDI12 Configurable Digital input /Pulse input with 24 channels 111
2.13 MDO11 16 channels of Digital Output 118
Chapter 3 IO Base 125
3.1 BAI10 Analog Input base with 16 channels of mA/V 125
3.2 BAI20 Analog Input Base with 16 channels of RTD/TC 129
3.3 BAO10 Analog Output Base with 8 channels 132
3.4 BDI10 Digital input /Pulse input Base with 16 channels 135
3.5 BDO10 Digital Output Base with AC relay 140
3.6 BVP10 Valve Position Control Base 145
3.7 BSP10 Speed Measurement and Protection Base 152
3.8 BAI11 Analog Input Base with 16 channels of mA/V 155
3.9 BAI21 Analog Input Base with 16 channels of RTD/TC 157
3.10 BAO21 Analog Output Base with 8 channels 160
3.11 BDI11 Digital input /Pulse input Base with 24 channels 163
3.12 BDO11 Digital Output Base 167
3.13 BDO12 relay module with 16 DO 220VAC relays 169
3.14 BDO20 relay terminal board with 16 DO 220VDC relays 174
Chapter 4 Communication Module 178
4.1 MCI10 Communication Module with 8 Channels of RS-485 178
4.2 MCI11 Communication Module with 4 Channels of isolated RS-485 182
4.3 MCI12 Communication Module with 8 Channels of isolated RS-485 186
4.4 MCI20 Communication Module with 2 Channels of Ethernet 190
4.5 MDP Profibus-DP Communication Module 194
Chapter 5 OC 6000e input/output Module Packages 195
5.1 Module Package overview 195
5.2 Installation 195
5.3 Disconnection 198
The UCSA controller is a stand-alone computer that runs the application code. The
controller mounts in a panel, and communicates with the I/O packs through on-board
I/O network interfaces. The controller operating system (OS) is QNX Neutrino, a real
time, multitasking OS designed for high-speed, high reliability industrial applications.
Five communication ports provide links to I/O, operator, and engineering interfaces are
as follows.
Ethernet connection for the Unit Data Highway (UDH) for communication with HMIs,
and other control equipment
Ethernet connection for the R, S, and T I/O network
RS-232C connection for setup using the COM1 port
Note: The I/O networks are private special-purpose Ethernet that support only the I/O
packs and the controllers.
The stand-alone controllers offer the following advantages.
Single module
No jumper settings required
No battery
No fan
Smaller panel footprint
Easy access to Compact Flash
1.1 Operation
The controller is loaded with software specific to its application, which includes but is
not limited to, steam, gas, hydro, or balance of plant (BOP) products. The IEEE1588
protocol is used through the R, S, and T IONets to synchronize the clock of the I/O packs
and controllers to within 100 microseconds.
External data is transferred to and from the control system database in the controller
over the R, S, and T IONets.
In a simplex system, this includes process inputs/outputs to the I/O packs.
In a dual system:
Process inputs/outputs to the I/O packs
Internal state values and initialization information from the designated controller
Status and synchronization information from both controllers
1.3 Installation
The controller is contained in a single module that mounts directly to the panel sheet
metal. The following diagram shows the module envelope and mounting dimensions.
1.5 LEDs
The UCSA module has the following LEDs:
Link displays solid green if the Ethernet PHY on the UCSA has established a link with
an Ethernet switch port.
Act indicates packet traffic on an Ethernet interface. This LED may blink if the traffic
is low, but is solid green in most systems.
Power displays solid Green when the internal 5 V supply is up and regulating. The
UCSA converts the incoming 24 V dc to 5 V dc. All other internal power planes are
derived from the 5 V.
Boot displays solid red or blinking red during the boot process. The boot LED is lit
continuously during the boot process unless an error is detected. If an error is
detected, the LED blinks at a 1 Hz frequency. The LED, when blinking, is on for 500
ms and off for 500 ms. The number of blinks indicates the failed state. After the LED
Dual 24VDC
power supply
100M
8 analog input Ethernet A
with mA/V
100M
Ethernet B
AI acquisition board
with 48 pin connector
2.1.3 Installation
Securely mount the desired base BAI10.
Directly plug one MAI10 AI module into the BAI10 base. On both the BAI10 base and
the AI module, there are keyed connectors to avoid incorrect assembly. One key
accomodates a specific IO module type and another key accomodates a different
IO module. If an attempt is made to plug the MAI10 AI module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The AI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the AI module.
Configure AI module as necessary.
MAI10 AI module
Open/short circuit
EMC interface/
mA/V switch
Analog to
Processor
isolation
detection
Digital Ethernet
1 of 16 mA/V Convertor communication
24 bit
DC/DC
24V Power
Supply
2.1.4.3 ID line
During power initialization, the MAI10 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BAI10. The processor then confirms
the correct matching of the IO module to base and reports board revision status to the
system level control.
2.1.4.7 Connectors
MAI10 contains the following connectors.
A 64-pin connector on the underside of the MAI10 module connects directly to the
BAI10 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MAI10
module connects directly to the BAI10 base, which includes 16 mA/V signals and
dual 24VDC power supply
2.1.5 Specification
2.1.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on
2.1.7 Configuration
Table 2.1-2 MAI10 configuration parameters
Parameter Description Choice
-10V~10V, mA_No_Power_out,
Input Type Select input type for every AI channel
mA_Power_Out, Unused
Value of current/voltage at the low end of
Low_Value -10 to 20
scale per AI channel
Value of input in engineering units at low end
Low_Eng_Value -3.4082 e + 038 to 3.4028 e + 038
of scale per AI channel
Value of current/voltage at the high end of
High_Value -10 to 20
scale per AI channel
Value of input in engineering units at high
High_Eng_Value -3.4082 e + 038 to 3.4028 e + 038
end of scale per AI channel
2.1.8 Alarms
265 Mapper - Egd input header size mismatch XML input cfg file's input header size mismatch
266 Config - Config size mismatch Pcode config file data array size mismatch.
267 FPGA - Name mismatch detected FPGA logici name mismatch
268 FPGA - Incompatible Revision FPGA logic version mismatch
273 onet-egd Message - Illegal Version EGD exchange header version mismatch
281 FPGA not programmed due to platform FPGA logic can't be loaded
errors
316 Controller output exchange major sig Output exchange from controller major signature
mismatch mismatch
318 Controller output exchange cfg timestamp Output exchange from controller signature time
mismatch mismatch
338 SSI signals are not being updated SSI signals not updated
342 IoPack App Io Compat does not match Input xml cfg file compatible code mismatch
firmware
Dual 24VDC
power supply
100M
8 analog input Ethernet A
with RTD/TC
100M
Ethernet B
AI acquisition board
with 48 pin connector
2.2.3 Installation
Securely mount the desired base BAI20.
Directly plug one MAI20 AI module into the BAI20 base. On both the BAI20 base and
the AI module, there are keyed connectors to avoid incorrect assembly. One key
accomodates a specific IO module type and another key accomodates a different
IO module. If an attempt is made to plug the MAI20 AI module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The AI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the AI module.
Configure AI module as necessary.
MAI20 AI module
Open/short circuit
EMC interface/
RTD/TC switch
Analog to
Processor
isolation
detection
Digital Ethernet
1 of 16 Convertor communication
RTD/TC 24 bit
DC/DC
24V Power
Supply
The inputs can be individually configured as either RTD signal or TC signal, depending on
the software configuration. The acquisition board provides a 0.2mA current output
when configured for RTD inputs.
Each one of 16 RTD/TC channels has individual DC/DC convertor that powers the
various components in the AI conditioning circuit. There is an EMC interface circuit for
each one of 16 RTD/TC channels, then conductive interference from field RTD/TC signal
would be leaked to shield ground on BAI20 AI base, in addition, the interference would
be leaked to field ground. The 220VAC protection function can protect internal circuitry if
a 220VAC signal is accidently applied to the AI signal terminal.
Through the HMI interface, RTD input or TC input can be configured for each one of 16
channels. Otherwise, there is function circuitry to detect open and short circuit. The
MAI20 AI module will generate an alarm report to the HMI via the controller.
2.2.4.5 ID line
During power initialization, the MAI20 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BAI20. The processor then confirms
the correct matching of the IO module to base and reports board revision status to the
system level control.
2.2.4.10 Connectors
MAI20 contains the following connectors.
A 64-pin connector on the underside of the MAI20 module connects directly to the
BAI20 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MAI20
module connects directly to the BAI20 base, which includes 16 RTD/TC signals and
dual 24VDC power supply
2.2.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED is solid on.
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125ON and
0.125 OFF. IO Module stops sending and receiving IONET exchange data when no
configuration parameters exist.
There is continuous monitoring of the internal power supply. When a failure
happens, the IO module will send an alarm to the controller and the Internal Error
LED blinks fast with 0.125ON and 0.125 OFF.
There is continuous monitoring of temperature. When temperature goes out of
range or the difference between two IO acquisition boards is over 5C, the IO module
will send an alarm to the controller and the Internal Error LED will blink fast with
0.125ON and 0.125 OFF.
There is continuous monitoring of proper function of RAM, EEPROM, Flash, set value
in RAM and EEPROM. When a failure happens, the IO module will send an alarm to
the controller and will stop sending and receiving IONET exchange data. Internal
LED is Solid on.
2.2.7 Configuration
2.2.8 Alarms
Through a 64-pin connector and two 48-pin connectors, the module connects directly
with the associated base, where the 64-pin connector is used to connect the processor
board and the 48-pin connector is used to connect the acquisition board. On the base,
signal wires of 2 Ethernet ports from dual RJ45 Ethernet connectors and 4-pin power
supply wires are connected directly to the 64-pin connector, and 4 analog output
signals are connected directly to the terminal from the 48-pin connector. Visual
diagnostics are provided through indicator LEDs, which are shown as follows.
Power
Run
Internal Error
External Error
Tx/Rx A
Tx/Rx B
Dual 24VDC
power supply
8 analog output
100M
Ethernet A
100M
Ethernet B
AO acquisition board
with 48 pin connector
2.3.3 Installation
Securely mount the desired base BAO10.
Directly plug one MAO10 AO module into the BAO10 base. On both the BAO10 base
and the AO module, there are keyed connectors to avoid incorrect assembly. One
key accomodates the IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MAO10 AO module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The AO
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the AO module.
Configure AO module as necessary.
MAO10 AO module
isolation
mA/V switch
Digital to
Processor
Analog Ethernet
1 of 8 AO Converter communication
12 bit
DC/DC
24V Power
Supply
2.3.4.7 Connectors
MAO10 contains the following connectors.
A 64-pin connector on the underside of the MAO10 module connects directly to the
BAO10 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MAO10
module connects directly to the BAO10 base, which includes 8 Analog output
signals and dual 24VDC power supply
2.3.5 Specification
2.3.8 Alarms
Dual 24VDC
power supply
100M
8 digital input Ethernet A
& pulse input
100M
Ethernet B
DI acquisition board
with 48 pin connector
2.4.3 Installation
Securely mount the desired base BDI10.
Directly plug one MDI10 DI/PI module into the BDI10 base. On both the BDI10 base
and the DI/PI module, there are keyed connectors to avoid incorrect assembly. One
key accomodates the IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MDI10 DI/PI module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The DI/PI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the DI/PI
module.
Configure DI/PI module as necessary.
MDI10 DI module
couple
EMC interface/
Processor
Ethernet
1 of 16 DI communication
Open
detection
Opto-
couple
DC/DC
sink/source 24V Power
switch Supply
2.4.4.3 ID line
During power initialization, the MDI10 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BDI10. The processor then confirms
2.4.4.7 Connectors
MDI10 contains the following connectors.
A 64-pin connector on the underside of the MDI10 module connects directly to the
BDI10 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MDI10
module connects directly to the BDI10 base, which includes 16 digital input signals
and dual 24VDC power supply
2.4.5 Specification
2.4.6 Diagnostics
The IO module performs the following self-diagnostic tests:
2.4.7 Configuration
Table 2.4-2 MDI10 configuration parameters
Parameters Description Choice
InputType Select input type for every channel Normal_DI, Used_as _PI
ContactInput Set the channel used or not Unused, Used
SignalInvert Inversion makes signal true if contact is open Invert, Normal
SeqOfEvents Record contact transitions in sequence of events Disable, Enable
Open State Alarm Enabled Set the channel alarm when signal open Disable, Enable
InputType A/B Each board A or B work condition Sink, Source
SignalFilter ms 24~50
32~47 Input channel[ ] open Open circuit when external resistor is available
Dual 24VDC
power supply
4 DO output
100M
Ethernet A
100M
Ethernet B
4 DO output
DO acquisition board
with 48 pin connector
2.5.3 Installation
Securely mount the desired base BDO10.
2.5.4 Operation
2.5.4.1 Processor subsystem
The processor board in the IO module contains the following:
High-speed processor with RAM and flash memory
Two fully independent 100Mbps Ethernet ports
Hardware watchdog timer and reset circuit
Status indication LED
Electronic ID and the ability to read IDs on other boards
Substantial programmable logic supporting the acquisition board
Capability of hot plug in and pull out/current limiter
Local dual power supplies, including monitoring function
Ability to download firmware and logic by IONET
Ability to download the boot loader through RS232 ports
System time synchronization with 100s of precision is accomplished by IEEE1588
high precision timing protocol
The processor board connects to two acquisition boards specific to the I/O module
function, by the connector on the top side of processor board, and connects to the base
board with a 64-pin connector. When power is applied, the soft-start circuit ramps up
the voltage available on the processor board. The local power supplies are sequenced
on, and the processor reset is removed. The firmware reads board ID information
through the FPGA. The processor attempts to establish Ethernet communications,
starting with a request for network address. The address request uses the industry
standard dynamic host configuration protocol (DHCP). If the processor board was
installed without firmware and FPGA logic, you will need to download correct firmware
and FPGA logic through the Ethernet. If there is FPGA logic and firmware, then the
firmware reads FPGA logic specific to the IO module from flash memory and writes it to
the FPGA. After initializing the FPGA clock and completing self-diagnostics of RAM, Flash,
EEPROM and set point in RAM and EEPROM, then the firmware checks the firmware type,
base board type, IO acquisition board type and FPGA type to ensure correct matching.
After Ethernet initialization, the processor programs the on-board logic, runs the
application, and enables the acquisition board to begin operation.
Power DO Opto-
AC relay
driver couple
Processor
Ethernet
1 of 16 DO communication
state
detection Channel
Opto- State LED
couple
2.5.4.3 ID line
During power initialization, the MDO10 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BDO10. The processor then
confirms the correct matching of the IO module to base and reports board revision
status to the system level control.
2.5.4.7 Connectors
MDO10 contains the following connectors,
A 64-pin connector on the underside of the MDO10 module connects directly to the
BDO10 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MDO10
module connects directly to the BDO10 base, which includes 16 digital output
signals and dual 24VDC power supply
Another type of DO base has the same connectors and pin definition to MDO10.
2.5.5 Specification
2.5.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on.
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125ON and
2.5.7 Configuration
2.5.8 Alarms
Dual 24VDC
power supply
100M
Ethernet B
2.6.3 Installation
Securely mount the desired base BVP10.
Directly plug one MVP10 module into the BVP10 base. On both the BVP10 base and
the MVP10 module, there are keyed connectors to avoid incorrect assembly. One
key accomodates a specific IO module type and another key accomodates a
different IO module. If an attempt is made to plug the MVP10 module into the wrong
base, the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The
MVP10 module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the MVP10
module.
Configure MVP10 module as necessary.
isolation
EMC interface
Large Current
driver block
Processor
2 channels of Ethernet
16 bits
DAC
servo control communication
output
DC/DC
24V Power
Supply
EMC interface
isolation
16 bits
DAC
2 AO
DC/DC
24V Power
Supply
Photo MOS relay
isolation
output
1 DO
voting
High
24V Power
Supply
Figure 2.6-2 Valve Control +/-40mA Output Board
Processor
calibration
2 lvdt Ethernet
isolation
16bits communication
ADC
DC/DC
24V Power
Supply
Open/short circuit
EMC interface
16 bits ADC
mA/V switch
isolation
detection
2 AI
DC/DC
Hysteresis
interface
isolation
Circuit
EMC
2 DI
DC/DC
2.6.4.9 Connectors
MVP10 contains the following connectors.
A 64-pin connector on the underside of the MVP10 module connect directly to the
BVP10 base, which includes ID signals and dual 24VDC power supply
Two 64-pin connectors for either acquisition board on the underside of the MVP10
module connect directly to the BVP10 base, which includes 2 LVDT signals/2 mA/V
signals/2 DI signals and 2 AO signal/2 servo output signal/1 DO output signal and
dual 24VDC power supply
Power consumption
Heat dissipation
Physical
Size 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
2 LVDT input 1D
4B
2 AI 1E
4C
24vGnd
2 DI 1F
24VA Dual 24VDC
5A
2A
24VB
power supply
5B
2B
6A 24VGnd
2C
6B
2D
2E
2F
1 100M
9A Ethernet A
7A
9B
7B
10A
2 Servo output 7C
10B 100M
2 AO 7D
Ethernet B
1 DO 8A
8B
8C
8D
11A
LVDT /AI acquisition Board
11B
with 64 pins connectors
11C
11D
Valve Control +/-40mA Output
Board with 64 pins connectors
Figure 2.7-1 MVP11 Valve Position Control Module with Large Servo Current Output
2.7.3 Installation
Securely mount the desired base BVP10.
Directly plug one MVP11 module into the BVP10 base. On both the BVP10 base and
the MVP11 module, there are keyed connectors to avoid incorrect assembly. One
key accomodates a specific IO module type and another key accomodates a
different IO module. If an attempt is made to plug the MVP11 module into the wrong
base, the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The
MVP11 module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the MVP11
module.
Configure MVP11 module as necessary.
isolation
EMC interface
Large Current
driver block
Processor
2 channels of Ethernet
16 bits
DAC
servo control communication
output
DC/DC
24V Power 24V Power
PWM
Supply Supply
EMC interface
isolation
16 bits
DAC
2 AO
DC/DC
24V Power
Supply
Photo MOS relay
isolation
output
1 DO
voting
High
24V Power
Supply
Figure 2.7-2 Valve Control +/-400mA Output Board
Processor
calibration
2 lvdt Ethernet
isolation
16bits communication
ADC
DC/DC
24V Power
Supply
Open/short circuit
EMC interface
16 bits ADC
mA/V switch
isolation
detection
2 AI
DC/DC
Hysteresis
interface
isolation
Circuit
EMC
2 DI
DC/DC
2.7.4.9 Connectors
MVP11 contains the following connectors,
A 64-pin connector on the underside of the MVP11 module connects directly to the
BVP10 base, which includes ID signals and dual 24VDC power supply
Two 64-pin connectors for either acquisition board on the underside of the MVP11
module connects directly to the BVP10 base, which includes 2 LVDT signals/2 mA/V
signals/2 DI signals and 2 AO signal/2 servo output signal/1 DO output signal and
dual 24VDC power supply
Power consumption
Heat dissipation
Physical
Size 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
Dual 24VDC
power supply
100M
Emulator D-sub Ethernet A
interface
100M
Ethernet B
Figure 2.8-1 MSP10 Speed Measure and Protection Module schematic diagram
Visual diagnostics are provided through indicator LED, which are shown as follows.
Power
Run
Internal Error
External Error
Tx/Rx A
Tx/Rx B
LEDs labelled with 1~8 are corresponding to the following status,
1 - ASL
2 - BR
3 - OPC
4 - AST
5 - Relay output
6 - OPC readback
7 - AST readback
8 - Emulator actived
25 Pin D-SUB
For Emulator
ASL2
BR2
9 Pin
WS2
D-SUB
M MW2
S IEP2
AST2 / OPC2
P 5 x DI
25 Pin D-SUB
1 OPC For Emulator
ASL3
1 AST 9 Pin BR3
D-SUB
M WS3
MW3
1 OPC S IEP3
AST3 / OPC3
1 AST P 5 x DI
1 OPC 25 Pin D-SUB
1 AST For Emulator
OPC1
OPC2
E OPC3
T
S AST1
25 Pin Relay AST2
D-SUB AST3
2.8.3 Installation
Securely mount the desired base BSP10.
Directly plug one MSP10 module into the BSP10 base. On both the BSP10 base and
the IO module, there are keyed connectors to avoid incorrect assembly. One key
accomodates the IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MSP10 module into the wrong base, the
connector keys will not match up.
2.8.4 Operation
2.8.4.1 Processor subsystem
The processor board in the IO module contains the following:
High-speed processor with RAM and flash memory
Two fully independent 100Mbps Ethernet ports
Hardware watchdog timer and reset circuit
Status indication LED
Electronic ID and the ability to read IDs on other boards
Substantial programmable logic supporting the acquisition board
Capability of hot plug in and pull out/current limiter
Local dual power supplies, including monitoring function
Ability to download firmware and logic by IONET
Ability to download the boot loader through RS232 ports
System time synchronization with 100s of precision is accomplished by IEEE1588
high precision timing protocol
The processor board connects to two acquisition boards specific to the I/O module
function, by the connector on the top side of processor board, and connects to the base
with a 64-pin connector. When power is applied, the soft-start circuit ramps up the
voltage available on the processor board. The local power supplies are sequenced on,
and the processor reset is removed. The firmware reads board ID information through
the FPGA. The processor attempts to establish Ethernet communications, starting with a
request for network address. The address request uses the industry standard dynamic
host configuration protocol (DHCP). If the processor board was installed without
firmware and FPGA logic, you will need to download correct firmware and FPGA logic
through the Ethernet. If there is FPGA logic and firmware, then the firmware reads FPGA
logic specific to the IO module from flash memory and writes it to the FPGA. After
initializing the FPGA clock and completing self-diagnostics of RAM, Flash, EEPROM and
set point in RAM and EEPROM, then the firmware checks the firmware type, base type, IO
acquisition board type and FPGA type to ensure correct matching. After Ethernet
initialization, the processor programs the on-board logic, runs the application, and
enables the acquisition board to begin operation.
The processor firmware contains all the logic necessary to allow the IO module to
operate from one or two Ethernet inputs. When operated from two Ethernet inputs, both
network paths are active all the time. A failure of either network will not result in an
interruption of the I/O module operation, and the failure will be indicated through the
working network connection. This arrangement is more tolerant of faults than a classic
MSP10 AI channel
BSP10 base
board
(Left) Emulator
interface
Open/short circuit
EMC protection
mA/V switch
Analog to
Processor
interface/
isolation
detection
Digital
1 of 2 mA/V Convertor
16 bit
DC/DC
Amplify
B uffed output
Rem ove
Amplify
DC from
ws
signal
FPG A Logic
R +/-15V DC
W heel speed
signal sensor O pen & Short
circuit ADC
detection
2.8.4.4 DI channel
The DI Channel has one TVS with Peak Power Dissipation up to 600W to eliminate the
surge pulse. The comparator, MOSFET and three resistors build up the hysteresis circuit.
The high and low hysteresis voltage is set at 15V and 5V. Photo-couple is applied for
isolation between DI channel & CPU card. DI is powered by a DC to DC converter. The
figure below shows the Digital Input Channel.
24V
FPGA Logic
2.8.4.5 DO channel
The DO circuit is shown below, The DO signal from the CPU board drives the photo-mos.
The Inverter provides enough power to drive the photo-mos.
Also the Cable Broken Detection Circuit is shown below. There is a diagnostic circuit to
detect 5V power supply for detection of broken cable, 5V power supply failure or the
Cable transpose. The diagnostic result will be feedback to CPU board and can be
indicated by a LED indicator.
The DO channel schematic is below:
24V
FPGA
Logic
readback
FPGA
Logic
readback
2.8.4.8 ID line
During power initialization, the MSP10 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BSP10. The processor then confirms
the correct matching of the IO module to base and reports board revision status to the
system level control.
2.8.4.13 Connectors
MSP10 contains following connectors,
A 64-pin connector on the underside of the MSP10 module connects directly to the
BSP10 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MSP10
module connect directly to the BSP10 base
2.8.5 Specification
2.8.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on.
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125ON and
0.125 OFF. IO Module stops sending and receiving IONET exchange data when no
configuration parameters exist.
There is continuous monitoring of the internal power supply. When a failure
happens, the IO module will send an alarm to the controller and the Internal Error
LED blinks fast with 0.125ON and 0.125 OFF.
There is continuous monitoring of temperature. When temperature goes out of
range or difference between two IO acquisition boards is over 5C, the IO module will
send an alarm to the controller and the Internal Error LED will blink fast with
0.125ON and 0.125 OFF.
There is continuous monitoring of proper function of RAM, EEPROM, Flash, set value
in RAM and EEPROM. When a failure happens, the IO module will send an alarm to
the controller and will stop sending and receiving IONET exchange data. Internal
LED is Solid on.
There is continuous monitoring of Ethernet communication. When connection with
Ethernet is lost, the corresponding Tx/Rx LED will turn off and stay in OFF status.
When recovery occurs, Tx/Rx LED should shine normally
There is continuous monitoring of connection cable status for external relay
extended module. When there is no cable or cable is broken, the IO module will send
an alarm to the controller which the red indicator OPC or AST is solid on.
When analog input is voltage signal and there is no cable or cable is broken, the IO
module will send an alarm to the controller.
When the speed sensor fails, the IO module will send an alarm to the controller.
2.8.7 Configuration
2.8.7.1 Configuration parameters
2.8.8 Alarms
Table 2.8-4 MSP10 specific alarms
Fault Fault Description Possible Cause
48 AI0 (IEP) cable break Cable break
49 AI1 (MW) cable break Cable break
50 DO0 (OPC) cable break Cable break
50 DO1 (AST) cable break Cable break
53 Lost SOE record Because of fifo buffer full (Single Shot)
54 SOE init fault, Logic configuration fault in FPGA
60 hw configuration fault Logic configuration fault in FPGA
61 SDP logic configuration Logic configuration fault in FPGA
65 Write the over limit module fault Logic configuration fault in FPGA
66 Write the over speed module Logic configuration fault in FPGA
67 High level limit alarm of AI0 (IEP) Analog input is above the high level limit
68 low level limit alarm of AI0(IEP) Analog input is below the low level limit
69 High level limit alarm of AI1 (MW) Analog input is above the high level limit
70 low level limit alarm of AI1(MW) Analog input is below the low level limit
71 WS sensor fail WS sensor type is wrong or cable break
with m A/V 2A
10B
2B
10C
X 24V G ND Internal &
2C
11A X 24V External
3A
24V
24V DC
11B
3B
24V GN D
power supply
11C
3C
12A
4A
12B
4B
12C
4C
1 100M
13A Ethernet A
5A
13B
5B
13C
5C
14A 100M
8 analog input 6A
Ethernet B
14B
with m A/V 6B
14C
6C
15A
7A
15B
7B
15C AI acquisition board
7C
16A
with 48 pin connector
8A
16B
8B
16C
8C
2.10.3 Installation
Securely mount the desired base BAI11.
Directly plug one MAI12 AI module into the BAI11 base. On both the BAI11 base and
the AI module, there are keyed connectors to avoid incorrect assembly. One key
accommodates a specific IO module type and another key accomodates a different
IO module. If an attempt is made to plug the MAI12 AI module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The AI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the AI module.
Configure AI module as necessary.
2.10.4 Operation
Processor subsystem
The processor board in the IO module contains the following:
High-speed processor with RAM and flash memory
Two fully independent 100Mbps Ethernet ports
Hardware watchdog timer and reset circuit
Status indication LED
Electronic ID and the ability to read IDs on other boards
Substantial programmable logic supporting the acquisition board
Capability of hot plug in and pull out/current limiter
Local power supply decoupled from dual power supplies in system, including
monitoring function
Independent system power supply and IO power supply
Ability to download firmware and logic by IONET
Ability to download the bootloader through RS232 ports
System time synchronization with 100s of precision is accomplished by IEEE1588
high precision timing protocol
The processor board connects to two acquisition boards specific to the I/O module
function, by the connector on the topside of processor board, and connects to the base
with a 64-pin connector. When power is applied, the soft-start circuit ramps up the
voltage available on the processor board. The local power supplies are sequenced on,
and the processor reset is removed. The firmware reads board ID information through
the FPGA. The processor attempts to establish Ethernet communications, starting with a
MAI11 AI module
Analog
mA/V switch
Processor
isolation
detection
to Digital Ethernet
1 of 16 mA/V Converto communication
r
16 bit
DC/DC
24V Power
Supply
2.10.4.2 Connectors
MAI12 contains the following connectors,
A 64-pin connector on the underside of the MAI12 module connects directly to the
BAI11 base, which includes redundant Ethernet signals, ID signals and one 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MAI12
module connects directly to the BAI11 base, which includes 16 mA/V signals and
dual 24VDC power supply.
2.10.5 Specification
Table 2.10-1 MAI12 specification
Item Specification
Number of channel 16 channels
Input span 10V, 0-20mA, or 0-20mA with power out per channel
Input resolution 14 bit
Scan time Normal 125 ms for all channels
Measurement accuracy Better than 0.1% full scale range
Common Mode Rejection Ratio 120db at 250VAC common mode voltage
Normal Mode Rejection Ratio 60db at 50/60Hz with amplitude of half of full scale
Isolation between IO channels 400VDC at 50/60Hz
Isolation between input and ground 500VAC at 50/60Hz
Power consumption 3.45W
Heat dissipation 1.50W
Physical Size(L*W*H) 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
2.10.7 Configuration
Table 2.10-2 MAI12 configuration parameters
Parameter Description Choice
Configuration
System limits Enable or disable system limits Enable, Disable
Min Input Select minimum mA/V input for healthy 0~20mA/10V
Max Input Select maximum mA/V input for healthy 0~20mA/10V
System Limit 1 Input limit in engineering units -3.4082 e + 038 to 3.4028 e + 038
System Limit 1
Input fault check Enable, disable
Enable
System Limit 1
Input fault latch Latch, unlatch
Latch
System Limit 1 Greater than or equal. Less than or
Input fault type
Type equal
System Limit 2 Input limit in engineering units -3.4082 e + 038 to 3.4028 e + 038
System Limit 2
Input fault check Enable, disable
Enable
System Limit 2
Input fault latch Latch, unlatch
Latch
System Limit 2 Greater than or equal. Less than or
Input fault type
Type equal
DiagHighEnab Enable high input limit Enable, disable
DiagLowEnab Enable low input limit Enable, disable
2.10.8 Alarms
2.10.8.1 MAI12 specific alarms
266 Config - Config size mismatch Pcode config file data array size mismatch.
267 FPGA - Name mismatch detected FPGA logic name mismatch
268 FPGA - Incompatible Revision FPGA logic version mismatch
273 onet-EGD Message - Illegal Version EGD exchange header version mismatch
316 Controller output exchange major sig mismatch Output exchange from controller major
signature mismatch
318 Controller output exchange cfg timestamp Output exchange from controller signature time
mismatch mismatch
338 SSI signals are not being updated SSI signals not updated
342 IoPack App Io Compat does not match firmware Input xml cfg file compatible code mismatch
Internal
24VDC power
supply
100M
8 analog input Ethernet A
with RTD/TC
100M
Ethernet B
AI acquisition board
with 48 pin connector
2.11.3 Installation
Securely mount the desired base BAI21.
Directly plug one MAI22 AI module into the BAI21 base. On both the BAI21 base and
the AI module, there are keyed connectors to avoid incorrect assembly. One key
accomodates an IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MAI22 AI module into the wrong base, the
connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The AI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the AI module.
Configure AI module as necessary.
2.11.4 Operation
Processor subsystem
The processor board in the IO module contains the following:
High-speed processor with RAM and flash memory
Two fully independent 100Mbps Ethernet ports
Hardware watchdog timer and reset circuit
Status indication LED
Electronic ID and the ability to read IDs on other boards
Substantial programmable logic supporting the acquisition board
Capability of hot plug in and pull out/current limiter
Local power supply decouple from dual power supplies in system, including
monitoring function
Ability to download firmware and logic by IONET
Ability to download the bootloader through RS232 ports
System time synchronization with 100s of precision is accomplished by IEEE1588
high precision timing protocol
The processor board connects to two acquisition boards specific to the I/O module
function, by the connector on the top side of processor board, and connects to the base
with a 64-pin connector. When power is applied, the soft-start circuit ramps up the
voltage available on the processor board. The local power supplies are sequenced on,
and the processor reset is removed. The firmware reads board ID information through
the FPGA. The processor attempts to establish Ethernet communications, starting with a
MAI22 AI module
Open/short circuit
EMC interface/
RTD/TC switch
Analog to
Processor
isolation
detection
Digital Ethernet
8 of 16 Convertor communication
RTD/TC 24 bit
DC/DC
24V Power
Supply
Each input can be individually configured as either RTD signal or TC signal, depending
on the software configuration. The acquisition board provides a 1mA current output
when configured for RTD inputs.
There are two groups of input channels. Group1 is from channel 1 to 8, and group2 is
from channel 9 to 16. Each group shares individual ADC and DC/DC convertors that
ID line
During power initialization, the MAI22 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BAI21. The processor then confirms
the correct matching of the IO module to base and reports board revision status to the
system level control.
Power management and monitor
The MAI22 includes power management in the 24V input circuit. The management
function provides soft start to control current spikes during power application. After
applying power, the circuit provides a fast current limit function to prevent a module or
base failure from propagating back onto the 24V power system. When power is present
and working properly, the green PWR indicator will light. The MAI22 module includes
power monitoring for the single 24V input used in internal system. If the 24V power
supply fails, the processor can detect this, and will report an alarm to the HMI via the
controller.
Module temperature monitor
There is a temperature sensor on acquisition board A and the processor reads
temperature data. Processor reports an alarm to the HMI via the controller when inside
temperature exceeds the allowable temperature range.
2.11.5 Specification
Table 2.11-3 MAI22 specification
Item Specification
Number of channel 16 channels
Input span RTD of Pt100/Pt10/Cu100/Cu50 or TC of T/J/E/K/N/B/R/S per channel
Input resolution 13 bits for TC, 15 bits for RTD
Scan time Normal 500 ms for all channels
Measurement accuracy Better than 0.2% full scale range
Common Mode Rejection Ratio 120db at 250VAC common mode voltage
Normal Mode Rejection Ratio 60db at 50/60Hz with amplitude of half of full scale
Isolation between IO channels 500VAC at 50/60Hz
Isolation between input and ground 500VAC at 50/60Hz
IO Channel protection 220VAC
Power consumption 6.45W
Heat dissipation 2.50W
Physical Size(L*W*H) 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
2.11.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on.
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125ON and
0.125 OFF. IO Module stops sending and receiving IONET exchange data when no
configuration parameters exist.
There is continuous monitoring of the internal power supply. When a failure
happens, the IO module will send an alarm to the controller and the Internal Error
LED blinks fast with 0.125ON and 0.125 OFF.
There is continuous monitoring of temperature. When temperature goes out of
range, the IO module will send an alarm to the controller and the Internal Error LED
will blink fast with 0.125ON and 0.125 OFF.
2.11.7 Configuration
Table 2.11-4 MAI22 configuration parameters
Parameter Description Choice
Configuration
System limits Enable or disable system limits Enable, Disable
Min_Input Select minimum RTD/TC input for healthy 18.52~390.84 ohm /-8.825~76.373mV
Max_Input Select maximum RTD/TC input for healthy 18.52~390.84 ohm /-8.825~76.373mV
System Limit 1 Input limit in engineering units -3.4082 e + 038 to 3.4028 e + 038
System Limit 1
Input fault check Enable, disable
Enable
System Limit 1
Input fault latch Latch, unlatch
Latch
System Limit 1 Greater than or equal. Less than or
Input fault type
Type equal
System Limit 2
Input fault check Enable, disable
Enable
System Limit 2
Input fault latch Latch, unlatch
Latch
System Limit 2 Greater than or equal. Less than or
Input fault type
Type equal
DiagHighEnab Enable high input limit Enable, disable
DiagLowEnab Enable low input limit Enable, disable
2.11.8 Alarms
2.11.8.1 MAI22 specific alarms
Table 2.11-5 MAI22 specific alarms
266 Config - Config size mismatch Pcode config file data array size mismatch.
267 FPGA - Name mismatch detected FPGA logic name mismatch
268 FPGA - Incompatible Revision FPGA logic version mismatch
273 onet-EGD Message - Illegal Version EGD exchange header version mismatch
281 FPGA not programmed due to platform errors FPGA logic can't be loaded
316 Controller output exchange major sig Output exchange from controller major signature
mismatch mismatch
318 Controller output exchange cfg timestamp Output exchange from controller signature time
mismatch mismatch
338 SSI signals are not being updated SSI signals not updated
342 IoPack App Io Compat does not match Input xml cfg file compatible code mismatch
firmware
Internal &
External
24V DC
power supply
100M
12 digital input Ethernet A
& pulse input
100M
Ethernet B
DI acquisition board
with 48 pin connector
2.12.3 Installation
Securely mount the desired base BDI11.
Directly plug one MDI12 DI/PI module into the BDI11 base. On both the BDI11 base
and the DI/PI module, there are keyed connectors to avoid incorrect assembly. One
key accomodates the IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MDI12 DI/PI module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The DI/PI
module will operate over either port.
Apply power to the pack by plugging in the connector on the side of the DI/PI
module.
Configure DI/PI module as necessary.
2.12.4 Operation
2.12.4.1 Processor subsystem
The processor board in the IO module contains the following:
High-speed processor with RAM and flash memory
Led
Indicator
220VAC Protection
Hysteresis Circuit
EMC Interface/
DSP Processor
Isolation
Dual 10/100M
Circuit
1 of 24 Digital Ethernet
Schmitt-
Input Channel
Trigger
Inverter
2.12.4.3 ID line
During power initialization, the MDI12 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BDI11. The processor then confirms
the correct matching of the IO module to base and reports board revision status to the
system level control.
2.12.4.7 Connectors
MDI12 contains the following connectors.
A 64-pin connector on the underside of the MDI12 module connects directly to the
BDI11 base , which includes redundant Ethernet signals, ID signals and dual 24VDC
power supply
Two 48-pin connectors for two acquisition boards on the underside of the MDI12
module connect directly to the BDI11 base, which includes 24 digital input signals
and dual 24VDC power supply
2.12.5 Specification
Table 2.12-1 MDI12 specification
Item Specification
24 configurable PI/DI channels, DI configured with sink current mode
Number of channel or source current mode per BDI11 base;
DI: 0~30VDC, nominal 24VDC ;
Input signal PI: Signal frequency: 05kHz The minimum pulse width: 80us
AC test signal of 500V AC 50/60Hz for 1
Isolation of Input to ground minute while leak current is less than 10mA;
SOE 1ms (No SOE for PI)
IO Channel protection 220VAC
Power consumption 3.6W
Heat dissipation 3.6W
Physical Size(L*W*H) 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
2.12.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on.
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125s ON and
0.125s OFF. IO Module stops sending and receiving IONET exchange data when no
configuration parameters exist.
There is continuous monitoring of the internal power supply. When a failure
happens, the IO module will send an alarm to the controller and the Internal Error
LED blinks fast with 0.125s ON and 0.125s OFF.
2.12.7 Configuration
Table 2.12-2 MDI12 configuration parameters
Parameters Description Choice
InputType Select input type for every channel Normal_DI, Used_as _PI
ContactInput Set the channel used or not Unused, Used
SignalInvert Inversion makes signal true if contact is open Invert, Normal
SeqOfEvents Record contact transitions in sequence of events Disable, Enable
SignalFilter ms 24~50
2.12.8 Alarms
Table 2.12-3 MDI12 specific alarms
Fault Fault Description Possible Cause
100M
Ethernet B
2.13.3 Installation
Securely mount the desired base BDO11.
Directly plug one MDO11 DO module into the BDO11 base. On both the BDO11 base
and the DO module, there are keyed connectors to avoid incorrect assembly. One
key accomodates the IO module type and another key accomodates a different IO
module. If an attempt is made to plug the MDO11 DO module into the wrong base,
the connector keys will not match up.
Plug in one or two Ethernet cables depending on the system configuration. The DO
module will operate over either port.
Connect BDO11 with BDO12 or BDO20 board by a 25-pin D-sub cable.
Apply power to the pack by plugging in the connector on the side of the DO module.
Configure DO module as necessary.
If there is another type of DO base, the installation is the same as above.
Power DO Opto-
DC relay
driver couple
Processor
Ethernet
1 of 16 DO communication
BDO12 DO relay
board
1 of 16 DO
The DO output signal controls the power driver circuit through the DO output opto-
couple to drive the relay on the BDO12 or BDO20. There is a channel state detection
circuit to monitor the proper function of DO output circuit while visual indicator LED is
available.
2.13.4.3 ID line
During power initialization, the MDO11 reads electric ID parts of processor board and
acquisition board, and reads the base type from the BDO11. The processor then
confirms the correct matching of the IO module to base and reports board revision
status to the system level control.
2.13.5 Specification
Table 2.13-1 MDO11 specification
Item Specification
Number of channel 16 digital output channels
Frame rate 50Hz on all 16 channels
Isolation between IO channels 500VAC at 50/60Hz
Isolation between input and ground 500VAC at 50/60Hz
Power consumption 11.25W
Heat dissipation 11.25W
Physical Size(L*W*H) 152.6mm*70.7mm*131.9mm
Temperature -30 to 65C (-22 to +149 F)
2.13.6 Diagnostics
The IO module performs the following self-diagnostic tests:
A power-up self-test that includes check of RAM, EEPROM, flash memory, set value
in RAM and EEPROM and board type match. When a failure happens, the IO module
will stay in initialization phase, and doesn't advance. No alarm is sent to the
controller. The internal Error LED stays solid on
When downloaded Configuration parameters dont exist, the IO Module will send an
alarm to the controller and the Internal Error LED blinks quickly with 0.125s ON and
0.125s OFF. IO Module stops sending and receiving IONET exchange data when no
configuration parameters exist.
There is continuous monitoring of the internal power supply. When a failure
happens, the IO module will send an alarm to the controller and the Internal Error
LED blinks fast with 0.125s ON and 0.125s OFF.
There is continuous monitoring of temperature. When temperature goes out of
range or difference between two IO acquisition boards is over 5C, the IO module will
send an alarm to the controller and the Internal Error LED will blink fast with 0.125s
ON and 0.125s OFF.
There is continuous monitoring of proper function of RAM, EEPROM, Flash, set value
in RAM and EEPROM. When a failure happens, the IO module will send an alarm to
the controller and will stop sending and receiving IONET exchange data. The
Internal Error LED is solid on.
2.13.7 Configuration
Table 2.13-2 MDO11 configuration parameters
Parameters Description Choice
RelayOutput Set the channel used or not Unused, Used
SignalInvert Inversion makes relay closed if signal is false Normal, Invert
Record relay command transitions in sequence of
SeqOfEvents events Disable, Enable
When offline with the controller, output the selected
Output_State value HoldLastValue, Output_Value
Default Output value Default output value for DO is Output-State Off, On
2.13.8 Alarms
Table 2.13-3 MDO11 specific alarms
Fault Fault description Possible cause
32 Conditioning board power failure. External Power Down
33 Baseboard and Relay board unconnected
34-49 DO Channel[] Does Not Match Requested State The Digital Output[ ] has an error.
with mA/V 2A
10B
2B
24vGnd
10C
2C
11A
24VA Dual 24VDC
3A
24VB
power supply
11B
3B
11C 24VGnd
3C
12A
4A
12B
4B
12C
4C
1 100M
13A Ethernet A
5A
13B
5B
13C
5C
14A 100M
8 analog input 6A
Ethernet B
14B
with mA/V 6B
14C
6C
15A
7A
15B
7B
15C AI acquisition board
7C
16A
with 48 pin connector
8A
16B
8B
16C
8C
9A Input 9 (24V)
Input 1 (24V) 1A
9B Input 9 (20mA/V)
Input 1 (20mA/V) 1B
9C Input 9 (Return)
Input 1 (Return) 1C
10A Input 10 (24V)
Input 2 (24V) 2A
10B Input 10 (20mA/V)
Input 2 (20mA/V) 2B
24vGnd 24V GND
10C Input 10 (Return)
Input 2 (Return) 2C
24VA 24V A
11A Input 11 (24V)
Input 3 (24V) 3A
24VB 24V B
11B Input 11 (20mA/V)
Input 3 (20mA/V) 3B
11C Input 11 (Return) 24VGnd 24V GND
Input 3 (Return) 3C
12A Input 12 (24V)
Input 4 (24V) 4A
12B Input 12 (20mA/V)
Input 4 (20mA/V) 4B
12C Input 12 (Return)
Input 4 (Return) 4C
1 100M
Ethernet A
13A Input 13 (24V)
Input 5 (24V) 5A
13B Input 13 (20mA/V)
Input 5 (20mA/V) 5B
13C Input 13 (Return)
Input 5 (Return) 5C
14A Input 14 (24V) 100M
Input 6 (24V) 6A Ethernet B
14B Input 14 (20mA/V)
Input 6 (20mA/V) 6B
14C Input 14 (Return)
Input 6 (Return) 6C
15A Input 15 (24V)
Input 7 (24V) 7A
15B Input 15 (20mA/V)
Input 7 (20mA/V) 7B
15C Input 15 (Return)
Input 7 (Return) 7C
16A Input 16 (24V)
Input 8 (24V) 8A
16B Input 16 (20mA/V)
Input 8 (20mA/V) 8B
16C Input 16 (Return)
Input 8 (Return) 8C
+24Vdc A +24Vdc A
T
Two-wire B Three-wire B
4~20mA 4~20mA
transmitter wiring transmitter wiring T
4~20mA 4~20mA
Return C Return C
+24Vdc A +24Vdc A
Externally powered
transmitter wiring
4~20mA
4~20mA B Voltage Input B
+
Power +
T -
supply
- Return C Return C
3.1.3 Operation
The 16 analog inputs can be individually configured as 0~20mA current loop inputs or
5 V/10 V inputs by operator with HMI. The following table shows the input capability
of BAI10 base.
3.1.4 Specification
3.1.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAI10 AI module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAI10 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1 100M
Ethernet A
13A
5A
13B
5B
13C
5C 100M
8 analog input 14A
Ethernet B
6A
with RTD/TC 14B
6B
14C
6C
15A
7A
15B
7B AI acquisition board
15C
7C with 48 pin connector
16A
8A
16B
8B
16C
8C
9A Input 9 (Excit)
Input 1 (Excit) 1A
9B Input 9 (Sig)
Input 1 (Sig) 1B
9C Input 9 (Return)
Input 1 (Return) 1C
10A Input 10 (Excit)
Input 2 (Excit) 2A
10B Input 10 (Sig)
Input 2 (Sig) 2B
24vGnd 24V GND
10C Input 10 (Return)
Input 2 (Return) 2C
24VA 24V A
11A Input 11 (Excit)
Input 3 (Excit) 3A
24VB 24V B
11B Input 11 (Sig)
Input 3 (Sig) 3B
11C Input 11 (Return) 24VGnd 24V GND
Input 3 (Return) 3C
12A Input 12 (Excit)
Input 4 (Excit) 4A
12B Input 12 (Sig)
Input 4 (Sig) 4B
12C Input 12 (Return)
Input 4 (Return) 4C
1 100M
Ethernet A
13A Input 13 (Excit)
Input 5 (Excit) 5A
13B Input 13 (Sig)
Input 5 (Sig) 5B
13C Input 13 (Return)
Input 5 (Return) 5C
14A Input 14 (Excit) 100M
Input 6 (Excit) 6A Ethernet B
14B Input 14 (Sig)
Input 6 (Sig) 6B
14C Input 14 (Return)
Input 6 (Return) 6C
15A Input 15 (Excit)
Input 7 (Excit) 7A
15B Input 15 (Sig)
Input 7 (Sig) 7B
15C Input 15 (Return)
Input 7 (Return) 7C
16A Input 16 (Excit)
Input 8 (Excit) 8A
16B Input 16 (Sig)
Input 8 (Sig) 8B
16C Input 16 (Return)
Input 8 (Return) 8C
A
Excitation A
B
Signal B
+
TC -
C
Three-wire RTD
Return C
In acquisition board of MAI20 AI module, there is a 200A excitation current to each RTD,
which is not available for TC mode. All RTD/TC signal has a high frequency decoupling to
ground at signal entry.
3.2.4 Specification
3.2.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAI20 AI module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAI20 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1A
1B
24vGnd
2A
24VA Dual 24VDC
2B
24VB
power supply
3A
8 analog output 24VGnd
3B
4A
4B
5A
1
5B
6A 100M
6B Ethernet A
7A
7B
8A 100M
8B Ethernet B
AO acquisition board
with 48 pin connector
Output 1 (Signal) 1A
Output 1 (Return) 1B
24vGnd 24V GND
Output 2 (Signal) 2A
24VA 24V A
Output 2 (Return) 2B
24VB 24V B
Output 3 (Signal) 3A
24VGnd 24V GND
Output 3 (Return) 3B
Output 4 (Signal) 4A
Output 4 (Return) 4B
Output 5 (Signal) 5A 1
Output 5 (Return) 5B
Output 7 (Signal) 7A
Output 7 (Return) 7B
Signal A Signal A
Current source Voltage source
output 0~20mA/ output 0~10V
4~20mA
Return B Return B
3.3.4 Specification
3.3.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAO10 AO module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAO10 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1 100M
13A Ethernet A
5A
13B
5B
13C
5C
14A 100M
6A
8 digital input 14B Ethernet B
6B
14C
6C
15A
7A
15B
7B
15C DI acquisition board
7C
16A
with 48 pin connector
8A
16B
8B
16C
8C
9A Input 9 (24V)
Input 1 (24V) 1A
9B Input 9 (Signal)
Input 1 (Signal) 1B
9C Input 9 (Return)
Input 1 (Return) 1C
10A Input 10 (24V)
Input 2 (24V) 2A
10B Input 10 (Signal)
Input 2 (Signal) 2B
24vGnd 24V GND
10C Input 10 (Return)
Input 2 (Return) 2C
24VA 24V A
11A Input 11 (24V)
Input 3 (24V) 3A
24VB 24V B
11B Input 11 (Signal)
Input 3 (Signal) 3B
11C Input 11 (Return) 24VGnd 24V GND
Input 3 (Return) 3C
12A Input 12 (24V)
Input 4 (24V) 4A
12B Input 12 (Signal)
Input 4 (Signal) 4B
12C Input 12 (Return)
Input 4 (Return) 4C
1 100M
Ethernet A
13A Input 13 (24V)
Input 5 (24V) 5A
13B Input 13 (Signal)
Input 5 (Signal) 5B
13C Input 13 (Return)
Input 5 (Return) 5C
14A Input 14 (24V) 100M
Input 6 (24V) 6A Ethernet B
14B Input 14 (Signal)
Input 6 (Signal) 6B
14C Input 14 (Return)
Input 6 (Return) 6C
15A Input 15 (24V)
Input 7 (24V) 7A
15B Input 15 (Signal)
Input 7 (Signal) 7B
15C Input 15 (Return)
Input 7 (Return) 7C
16A Input 16 (24V)
Input 8 (24V) 8A
16B Input 16 (Signal)
Input 8 (Signal) 8B
16C Input 16 (Return)
Input 8 (Return) 8C
Signal B Signal B
Return C Return C
A Approximator: +24V A
Sink current mode
(DC PNP)
Signal B Signal B
+24V
Return C Return C
9A NC
NC 1A
9B Input 9 (Signal)
Input 1 (Signal) 1B
9C Input 9 (Return)
Input 1 (Return) 1C
10A NC
NC 2A
10B Input 10 (Signal)
Input 2 (Signal) 2B
24vGnd 24V GND
10C Input 10 (Return)
Input 2 (Return) 2C
24VA 24V A
11A NC
NC 3A
24VB 24V B
11B Input 11 (Signal)
Input 3 (Signal) 3B
11C Input 11 (Return) 24VGnd 24V GND
Input 3 (Return) 3C
12A NC
NC 4A
12B Input 12 (Signal)
Input 4 (Signal) 4B
12C Input 12 (Return)
Input 4 (Return) 4C
1 100M
Ethernet A
13A NC
NC 5A
13B Input 13 (Signal)
Input 5 (Signal) 5B
13C Input 13 (Return)
Input 5 (Return) 5C
14A NC 100M
NC 6A Ethernet B
14B Input 14 (Signal)
Input 6 (Signal) 6B
14C Input 14 (Return)
Input 6 (Return) 6C
15A NC
NC 7A
15B Input 15 (Signal)
Input 7 (Signal) 7B
15C Input 15 (Return)
Input 7 (Return) 7C
16A NC
NC 8A
16B Input 16 (Signal)
Input 8 (Signal) 8B
16C Input 16 (Return)
Input 8 (Return) 8C
3.4.3 Operation
All 16 digital inputs can be configured as sink current mode and source current mode by
operator with HMI. Meanwhile, each channel can be configured by HMI. The following
table shows the input capability of the BDI10 base.
Table 3.4-1 BDI10 input type
Quantity Types
Digital input 0~30VDC (rated 24VDC) per channel
16 Pulse input
3.4.4 Specification
Table 3.4-2 BDI10 specification
Item Specification
16 configurable PI/DI channels, DI configured with sink current mode or source
Number of channel current mode per BDI10 base;
DI: 0~30VDC, nominal 24VDC ;
Input signal
PI: Signal frequency: 0200Hz The minimum pulse width: 2ms
Ethernet port 2 Ethernet ports with 100M and full duplex
24VDC Power supply 24VDC 5%
Physical Size(L*W*H) 175mm*127mm*63.4mm
Temperature -30 to 65C (-22 to +149 F)
1B
1C
4 DO output 2A
2B
24vGnd
2C
24VA Dual 24VDC
3A
24VB
power supply
3B
24VGnd
3C
4A
4B
4C
5A
100M
5B
Ethernet A
5C
6A
4 DO output 100M
6B
6C
Ethernet B
7A
7B
7C
8A
DO acquisition board
with 48 pin connector
8B
8C
9A
9B
9C
4 DO output 10A
10B
10C
11A
11B
AC relay AC relay AC relay AC relay
11C
12A
13C
AC relay AC relay AC relay AC relay
14A
4 DO output
14B
14C
15A
15B
15C
16A
16B
16C
Output 1 (NO) 1A
Output 1 (COM) 1B
Output 1 (NC) 1C
Output 2 (NO) 2A
Output 2 (COM) 2B
24vGnd 24V GND
Output 2 (NC) 2C
24VA 24V A
Output 3 (NO) 3A
24VB 24V B
Output 3 (COM) 3B
24VGnd 24V GND
Output 3 (NC) 3C
Output 4 (NO) 4A
Output 4 (COM) 4B
Output 4 (NC) 4C
Output 5 (NC) 5C
Output 6 (NO) 6A
Output 7 (NO) 7A
Output 7 (COM) 7B
Output 7 (NC) 7C
Output 8 (NO) 8A
Output 8 (COM) 8B
Output 8 (NC) 8C
Output 9 (NO) 9A
Output 9 (COM) 9B
Output 9 (NC) 9C
NO A
COM B
NC C
3.5.3 Operation
3.5.4 Specification
3.5.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MDO10 DO module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by the MDO10 module and a mismatch is encountered, a hardware
incompatibility fault is created.
2 LVDT input 1D
4B
2 AI 1E
4C
24vGnd
2 DI 1F
24VA Dual 24VDC
5A
2A
24VB
power supply
5B
2B
6A 24VGnd
2C
6B
2D
2E
2F
1 100M
9A Ethernet A
7A
9B
7B
10A
2 Servo output 7C
10B 100M
2 AO 7D
Ethernet B
1 DO 8A
8B
8C
8D
11A
LVDT /AI acquisition Board
11B
with 64 pins connectors
11C
11D
Valve Control +/-40mA Output
Board with 64 pins connectors
3A AI1_POWER
LV1_EXC_OUT+
1A
3B AI1_AIN+
LV1_EXC_OUT-
1B
3C AI1_AIN-
INLV1_SENSE_IN+
1C
4A AI2_POWER
INLV1_SENSE_IN-
1D
4B AI2_AIN+
LV1_COM
1E
24vGnd 24V GND
4C AI2_AIN-
LV1_AGND 1F
24VA 24V A
5A DI_DI1
LV2_EXC_OUT+
2A
DI_COM1 24VB 24V B
5B
LV2_EXC_OUT-
2B
6A DI_DI2 24VGnd 24V GND
LV2_SENSE_IN+
2C
6B DI_COM2
LV2_SENSE_IN-
2D
N/A
LV2_COM
2E
N/A
LV2_AGND 2F
1
100M
Ethernet A
9A AO1_AO
7A
N/A
9B AO1_AGND
N/A 7B
10A AO2_AO
SERVO1_OUTPUT+ 7C
10B AO2_AGND
100M
SERVO1_OUTPUT- 7D Ethernet B
N/A
8A
N/A
N/A
N/A 8B
N/A
SERVO2_OUTPUT+ 8C
N/A
8D
SERVO2_OUTPUT-
11A
N-
N/A
11B
L+/OUT
N/A
11C
L+/IN
N/A
11D N-
N/A
3A AI1_POWER
LV1_EXC_OUT+
1A
3B AI1_AIN+
LV1_EXC_OUT-
1B
3C AI1_AIN-
INLV1_SENSE_IN+
1C
4A AI2_POWER
INLV1_SENSE_IN-
1D
4B AI2_AIN+
LV1_COM
1E
24V GND
4C AI2_AIN-
LV1_AGND 24vGnd
1F
24V A
5A DI_DI1
LV2_EXC_OUT+ 24VA
2A
DI_COM1 24V B
5B
LV2_EXC_OUT- 24VB
2B
6A DI_DI2 24V GND
LV2_SENSE_IN+ 24VGnd
2C
6B DI_COM2
LV2_SENSE_IN-
2D
N/A
LV2_COM
2E
N/A
LV2_AGND
2F
1
100M
Ethernet A
9A AO1_AO
7A
N/A
9B AO1_AGND
N/A 7B
10A AO2_AO
SERVO1_OUTPUT+ 7C
10B AO2_AGND
100M
SERVO1_OUTPUT- 7D Ethernet B
N/A
8A
N/A
N/A
N/A 8B
N/A
SERVO2_OUTPUT+ 8C
N/A
8D
SERVO2_OUTPUT-
11A
N-
N/A
11B
L+/OUT
N/A
11C
L+/IN
N/A
11D N-
N/A
3A AI1_POWER
LV1_EXC_OUT+
1A
3B AI1_AIN+
1B
3C AI1_AIN-
1C
4A AI2_POWER
1D
4B AI2_AIN+
LV1_COM
1E
4C
24vGnd 24V GND
AI2_AIN-
LV1_AGND
1F
24VA 24V A
5A
DI_DI1
LV2_EXC_OUT+
2A
6B
DI_COM2
LV2_SENSE_IN- 2D
N/A
LV2_COM
2E
N/A
LV2_AGND
2F
1
100M
Ethernet A
9A
AO1_AO
7A
N/A
9B
AO1_AGND
7B
N/A
10A
AO2_AO
SERVO1_OUTPUT+ 7C
10B
AO2_AGND
100M
SERVO1_OUTPUT- 7D Ethernet B
N/A
8A
N/A
N/A
8B
N/A
N/A
8C
SERVO2_OUTPUT+
N/A
8D
SERVO2_OUTPUT-
11A
N-
N/A
11B
L+/OUT
N/A
11C
L+/IN
N/A
11D N-
N/A
3A AL1_POWER
LV1_EXC_OUT+ 1A
3B AL1_AIN+
LV1_EXC_OUT- 1B
3C AL1_AIN-
INLV1_SENSE_IN+ 1C
4A AL2_POWER
INLV1_SENSE_IN- 1D
4B AL2_AIN+
LV1_COM 1E
24vGnd 24V GND
4C AL2_AIN-
LV1_AGND 1F
24VA 24V A
5A DI_DI1
LV2_EXC_OUT+ 2A
24VB 24V B
5B DI_COM1
LV2_EXC_OUT- 2B
6A DI_DI2 24VGnd 24V GND
LV2_SENSE_IN+ 2C
6B DI_COM2
LV2_SENSE_IN- 2D
N/A
LV2_COM 2E
N/A
LV2_AGND 2F
1 100M
Ethernet
9A OT1_AO
N/A 7A
9B OT1_AGND
N/A 7B
10A OT2_AO
OL1_IOUT_L+ 7C
10B OT2_AGND 100M
OL1_IOUT_L- 7D Ethernet
N/A
N/A 8A
N/A
N/A 8B
N/A
OL1_IOUT_L+ 8C
N/A
OL1_IOUT_L- 8D
11A N/A
N/A
11B DO_220V_IN
N/A
11C DO_220V_OUT
N/A
11D 220_IN-
N/A
DI signal T
b Two-wire b Three-wire b
Signal 4~20mA 4~20mA
transmitter wiring transmitter wiring T
4~20mA 4~20mA
Return c Return c
AI signal AI signal
3.6.4 Specification
Table 3.6-2 BVP10 specification
Item Specification
Servo control output
Number of channel 2 channels
Output span Output capacity: +/-40mA or +/-400mA
AO
Number of channel 2 channels
Output span 0~5V
Relay output
Number of channel 1 channel
Type NO
Contact capacity 220V/1A
AI signal
Number of channel 2 channels of AI signal
0-5V/1-5V/5V (input impedance 500K ohm)
Input span or 0-20mA/4-20mA per channel
DI signal
Number of channel 2 channels of DI signal
Input signal 0~30VDC, nominal 24VDC ;
LVDT signal
Number of channel 2 channel of LVDT signal
Input type 3/4/5/6 wires
24vGnd
100M
Emulator D-sub Ethernet A
interface
100M
Ethernet B
3.7.2 Installation
The I/O inputs are wired directly to one I/O terminal block mounted on the base board.
The block is held down with two screws and has 24 terminals accepting up to #12 AWG
BR+/DI1 (24VDC) 2A
8B Relay output N
BR-/DI1 com 2B
9A WS+
DI2 (24VDC) 3A
24vGnd 24V GND
9B WS-
DI2 com 3B
24VA 24V A
10A MW (24V)
DI3 (24VDC) 4A
24VB 24V B
10B MW (20mA/V)
DI3 com 4B
10C MW (Return) 24VGnd 24V GND
DI4 (24VDC) 5A
11A IEP (24V)
DI4 com 5B
11B IEP (20mA/V)
DI5 (24VDC) 6A
11C IEP (Return) 1
DI5 com 6B
100M
Ethernet A
50 Sw1+_simu 17 ASL+_simu
33 ASL-simu
49 Sw1-_simu 16 BR+_simu
32 BR-_simu
48 MW+_simu 15 DI2+_simu
31 DI2-_simu
47 MW-_simu 14 DI3+_simu
30 DI3-_simu
46 IEP+_simu
29 DI4-_simu
13 DI4+_simu 100M
45 IEP-_simu 12 DI5+_simu
44 Sw2+_simu
28 DI5-_simu
11 WS+_simu
Ethernet B
27 WS-_simu
43 Sw2-_simu 10
26
42 9
25
41 8
24
40 7
23
39 6
22 WS+_inter
38 5 WS-_inter
21 ASL+_inter
37 MW+_inter 4 ASL-inter
20 BR+_inter
36 MW-_inter 3 BR-_inter
19 OPC+_inter
35 IEP+_inter 2 OPC-_inter
18 AST+_inter
34 IEP-_inter 1 OPC-_inter
DI signal T
B Two-wire B Three-wire B
Signal 4~20mA 4~20mA
transmitter wiring transmitter wiring T
4~20mA 4~20mA
Return C Return C
3.7.3 Operation
The following table shows the input capability of BSP10 base.
3.7.4 Specification
3.7.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MSP10 module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by the MSP10 module and a mismatch is encountered, a hardware
incompatibility fault is created.
with mA/V 2A
10B
2B External 24VDC
X24V GND
10C
2C
power supply
X 24V
11A
3A
11B 24V
Internal 24VDC
3B
11C 24VGN D power supply
3C
12A
4A
12B
4B
12C
4C
1 100M
13A Ethernet A
5A
13B
5B
13C
5C
14A 100M
8 analog input 6A
Ethernet B
14B
with mA/V 6B
14C
6C
15A
7A
15B
7B
15C AI acquisition board
7C
16A
with 48 pin connector
8A
16B
8B
16C
8C
3.8.3 Operation
The 16 analog inputs can be individually configured as 0~20mA current loop inputs or
10 V inputs by operator with HMI. The following table shows the input capability of
BAI11 base.
Table 3.8-1 BAI11 input type
Quatity Analog Input Types
16 10V, 0-20mA, or 0-20mA with power out per channel
3.8.4 Specification
Table 3.8-2 BAI11 specification
Item Specification
Number of channel 16 channels per BAI11 base
Input span 10V, 0-20mA, or 0-20mA with power out per channel
Fault detection Provide 21mA per channel
24VDC Power supply 24VDC 5%
Ethernet port 2 Ethernet ports with 100M and full duplex
Physical Size(L*W*H) 175mm*127mm*63.4mm
Temperature -30 to 65C (-22 to +149 F)
3.8.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAI12 AI module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAI12 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1 100M
Ethernet A
13A
5A
13B
5B
13C
5C 100M
8 analog input 14A
Ethernet B
6A
with RTD/TC 14B
6B
14C
6C
15A
7A
15B
7B AI acquisition board
15C
7C with 48 pin connector
16A
8A
16B
8B
16C
8C
9A Input 9 (Excit)
Input 1 (Excit) 1A
9B Input 9 (Sig)
Input 1 (Sig) 1B
9C Input 9 (Return)
Input 1 (Return) 1C
10A Input 10 (Excit)
Input 2 (Excit) 2A
10B Input 10 (Sig)
Input 2 (Sig) 2B
10C Input 10 (Return)
Input 2 (Return) 2C
11A Input 11 (Excit)
Input 3 (Excit) 3A
24V 24V
11B Input 11 (Sig)
Input 3 (Sig) 3B
11C Input 11 (Return) 24VGnd 24V GND
Input 3 (Return) 3C
12A Input 12 (Excit)
Input 4 (Excit) 4A
12B Input 12 (Sig)
Input 4 (Sig) 4B
12C Input 12 (Return)
Input 4 (Return) 4C
1 100M
Ethernet A
13A Input 13 (Excit)
Input 5 (Excit) 5A
13B Input 13 (Sig)
Input 5 (Sig) 5B
13C Input 13 (Return)
Input 5 (Return) 5C
14A Input 14 (Excit) 100M
Input 6 (Excit) 6A Ethernet B
14B Input 14 (Sig)
Input 6 (Sig) 6B
14C Input 14 (Return)
Input 6 (Return) 6C
15A Input 15 (Excit)
Input 7 (Excit) 7A
15B Input 15 (Sig)
Input 7 (Sig) 7B
15C Input 15 (Return)
Input 7 (Return) 7C
16A Input 16 (Excit)
Input 8 (Excit) 8A
16B Input 16 (Sig)
Input 8 (Sig) 8B
16C Input 16 (Return)
Input 8 (Return) 8C
A
Excitation A
B
Signal B
+
TC -
C
Three-wire RTD
Return C
In acquisition board of MAI22 AI module, there is a 1mA excitation current to each RTD,
which is not available for TC mode. All RTD/TC signal has a high frequency decoupling to
ground at signal entry.
3.9.4 Specification
Table 3.9-2 BAI21 specification
Item Specification
Number of channel 16 channels per BAI21 base
Input span RTD of Pt100/Pt10/Cu100/Cu50 or TC of T/J/E/K/N/B/R/S per channel
Fault detection Check connector ID chip for hardware incompatibility
24VDC Power supply 24VDC 5%
Ethernet port 2 Ethernet ports with 100M and full duplex
Physical Size(L*W*H) 175mm*127mm*63.4mm
Temperature -30 to 65C (-22 to +149 F)
3.9.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAI22 AI module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAI22 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1A
1B
2A
Internal
2B
24VDC power
24V
8 analog output 3A supply
24VGND
3B
4A
4B
5A
1
5B
6A 100M
6B Ethernet A
7A
7B
8A 100M
8B Ethernet B
AO acquisition board
with 48 pin connector
Output 1 (Signal) 1A
Output 1 (Return) 1B
Output 2 (Signal) 2A
Output 2 (Return) 2B
24V 24V
Output 3 (Signal) 3A
24VGND 24V GND
Output 3 (Return) 3B
Output 4 (Signal) 4A
Output 4 (Return) 4B
Output 5 (Signal) 5A 1
Output 5 (Return) 5B
Output 7 (Signal) 7A
Output 7 (Return) 7B
Signal A Signal A
Current source Voltage source
output 0~20mA/ output 0~10V
4~20mA
Return B Return B
3.10.3 Operation
The 8 analog outputs can be individually configured as current source output with
range of 0~20mA or voltage source output with range of 0~10V by operator with HMI.
The following table shows the output capability of BAO21 base.
3.10.4 Specification
3.10.5 Diagnostic
Diagnostic tests are made on the base as follows:
Each base has its own ID device that is interrogated by the MAO10 AO module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by MAO10 module and a mismatch is encountered, a hardware
incompatibility fault is created.
1 100M
Ethernet
19A Input 19 (Signal) A
Input 7 (Signal) 7A
19B Input 19 (Return)
Input 7 (Return) 7B
20A Input 20 (Signal)
Input 8 (Signal) 8A 100M
20B Input 20 (Return)
Input 8 (Return) 8B
Ethernet
21A Input 21 (Signal) B
Input 9 (Signal) 9A
21B Input 21 (Return)
Input 9 (Return) 9B
22A Input 22 (Signal)
Input 10 (Signal) 10A
22B Input 22 (Return)
Input 10 (Return) 10B
23A Input 23 (Signal)
Input 11 (Signal) 11A
23B Input 23 (Return)
Input 11 (Return) 11B
24A Input 24 (Signal)
Input 12 (Signal) 12A
24B Input 24 (Return)
Input 12 (Return) 12B
1 100M
Ethernet
19A Input 19 (Signal) A
Input 7 (Signal) 7A
19B Input 19 (Return)
Input 7 (Return) 7B
20A Input 20 (Signal)
Input 8 (Signal) 8A 100M
20B Input 20 (Return)
Input 8 (Return) 8B
Ethernet
21A Input 21 (Signal) B
Input 9 (Signal) 9A
21B Input 21 (Return)
Input 9 (Return) 9B
22A Input 22 (Signal)
Input 10 (Signal) 10A
22B Input 22 (Return)
Input 10 (Return) 10B
23A Input 23 (Signal)
Input 11 (Signal) 11A
23B Input 23 (Return)
Input 11 (Return) 11B
24A Input 24 (Signal)
Input 12 (Signal) 12A
24B Input 24 (Return)
Input 12 (Return) 12B
1 100M
Ethernet
19A Input 19 (Signal) A
Input 7 (Signal) 7A
19B Input 19 (Return)
Input 7 (Return) 7B
20A Input 20 (Signal)
Input 8 (Signal) 8A 100M
20B Input 20 (Return)
Input 8 (Return) 8B
Ethernet
21A Input 21 (Signal) B
Input 9 (Signal) 9A
21B Input 21 (Return)
Input 9 (Return) 9B
22A Input 22 (Signal)
Input 10 (Signal) 10A
22B Input 22 (Return)
Input 10 (Return) 10B
23A Input 23 (Signal)
Input 11 (Signal) 11A
23B Input 23 (Return)
Input 11 (Return) 11B
24A Input 24 (Signal)
Input 12 (Signal) 12A
24B Input 24 (Return)
Input 12 (Return) 12B
3.11.3 Operation
Each channel can be configured by HMI. The following table shows the input capability
of the BDI11 base.
Table 3.11-1 BDI11 input type
Quantity Types
Digital input 0~30VDC (rated 24VDC) per channel
24 Pulse input
3.11.4 Specification
Table 3.11-2 BDI11 specification
Item Specification
Number of channel 24 configurable PI/DI channels,;
DI: 0~30VDC, nominal 24VDC ;
Input signal
PI: Signal frequency: 0200Hz The minimum pulse width: 2ms
Ethernet port 2 Ethernet ports with 100M and full duplex
24VDC Power supply 24VDC 5%
Physical Size(L*W*H) 175mm*127mm*63.4mm
Temperature -30 to 65C (-22 to +149 F)
3.12.2 Installation
Connect the BDO11 with different relay modules by a 25-pin D-sub cable.
The internal 24VDC provides power supply to the CPU board of MDO11. The external
24VDC provides power to IO boards of MDO11 and driving current for the relay coil on
the relay boards. Both internal and external power supply should be provided by diode
coupler and redundant 24VDC power supply.
The following figure shows the details wiring and cabling of BDO11.
External
24VDC power
X24VGND
supply
X24V
24V
24VGN
Internal
D
24VDC power
supply
25-pin female D-sub
100M
Ethernet
A
100M
Ethernet
B
3.12.4 Specification
Table 3.12-2 BDO11 specification
Item Specification
Ethernet port 2 Ethernet ports with 100M and full duplex
24VDC Power supply 24VDC 5%
Physical Size(L*W*H) 351.9mm*127mm*60.9mm
Temperature -30 to 65C (-22 to +149 F)
3.12.5 Diagnostic
Each base has its own ID device that is matched with the MDO11 DO module. The ID
device is a writable/readable chip coded with the base type and serial number. When
the chip is read by the MDO11 module and a mismatch is encountered, a hardware
incompatibility error occurs.
NO0 NO8
COM0 COM8
NC0 NC8
NO1
COM1
NC1
......
NO7
COM7
......
NO15
COM15
NC7 NC15
3.13.2 Installation
The following steps describe how to install and uninstall the BDO12 module. The
following diagram shows the steps.
Align the four 4.0mm holes of the bottom plate with the four corresponding holes
of backplane plate, and then use four appropriate screws to fix it securely.
Remove the four screws. Then the module can be removed.
There is a 25-pin D-Sub P1 used to connect BDO12 and output control module.
The following diagram shows details of the D-Sub:
3.13.4 Specification
Table 3.13-3 BDO12 specification
Item Specification
Number of channels 16
Output Contact
Resistor load capacity 10A/250VAC; 10A/30VDC
Inductor load capacity 7.5A/250VAC; 6A/30VDC
Isolation between IO channels 1000VAC at 50/60Hz
Power supply 24VDC10%
Power consumption 10W Maximum
Size (L x W x H) 174mm x 127mm x 46mm
Temperature -20C to 60C
Humidity 5~95% (without condensation)
3.13.5 Diagnostic
Diagnostic tests are made on BDO12 as follows:
1) Connect the cable to a digital output module. If HMI still shows low voltage alarm, the
cable is broken.
2) Connect the relay output to DI module. Make sure the DI and DO module is OK. In HMI
output all channels of DO to 1 and check if DI inputs are 1. Then output all channels of
3.14.2 Installation
The following steps describe how to install and uninstall the BDO20 module. The
following diagram shows the steps.
Align the six 4.5mm holes of the bottom plate with the six corresponding holes of
backplane plate, and then use six appropriate screws to fix it securely.
Remove the six screws. Then the module can be removed.
3.14.3 Terminals
There is a 25-pin D-Sub P1 used to connect BDO12 and output control module.
The following diagram shows details of the D-Sub:
3.14.4 Specification
Table 3.14-3 BDO20 specification
Item Specification
Number of channels 16
Output Contact
Resistor load capacity 16A/500VAC; 10A/220VDC
Inductor load capacity 3.6A/110VDC; 2A/220VDC;
Isolation between IO channels 1000VAC at 50/60Hz
Power supply Dual 24VDC10%
Power consumption 0W typical, 22W Maximum
Size (L x W x H) 352mm x 127mm x 90mm
Temperature -20C to 60C
Humidity 5~95% (without condensation)
3.14.5 Diagnostic
Diagnostic tests are made on BDO20 as follows:
1) Connect the cable to a digital output module. If HMI still shows low voltage alarm, the
cable is broken.
The RJ45 Ethernet connector with LED named Net A is the primary system interface.
The RJ45 Ethernet connector with LED named Net B is the redundant or secondary
system interface.
The 29-pin connector on the bottom of the module is directly connected to the other
system and provides 1 port RS-232C, 7 port RS-485 and 1 port RS-422/485.
4.1.4 Configuration
Refer to GEK-114905 OC 6000e Engineer Software Manual.
The chapter 2.9 Virtual Device shows how to configure the communication parameters
of 8 serial ports. Take care of the point that physical serial port 1~8 correspond to virtual
ports 5~12 in parameter setting.
4.2.2 Operation
4.2.2.1 Processor subsystem
The mother board in the module contains the following:
4.2.2.3 Connectors
MCI11 contains the following connectors:
4.2.3 Specification
The following table gives an information spec for MCI11 serial communication module,
4.2.4 Configuration
Refer to GEK-114905 OC 6000e Engineer Software Manual.
The chapter 2.9 Virtual Device shows how to configure the communication parameters
of 4 serial ports. Note that physical serial port 1~4 correspond to virtual ports 5~8 in
parameter setting.
4.3.2 Operation
4.3.2.1 Processor subsystem
The mother board in the module contains the following:
4.3.2.3 Connectors
MCI12 contains the following connectors:
4.3.3 Specification
The following table gives an information spec for MCI12 serial communication module,
4.3.4 Configuration
Refer to GEK-114905 OC 6000e Engineer Software Manual.
The chapter 2.9 Virtual Device shows how to configure the communication parameters
of 8 serial ports. Note that physical serial port 1~8 correspond to virtual ports 5~12 in
parameter setting.
4.4.2 Operation
4.4.2.1 Processor subsystem
The mother board in the module contains the following:
4.4.2.3 Connectors
MCI20 contains the following connectors:
4.4.3 Specification
The following table gives an information spec for MCI20 serial communication module.
Table 4.4-3 MCI20 specification
Item Specification
Ethernet ports to DCS Dual 10M/100M Base-T Ethernet
Ethernet ports to other system Dual 10M/100M Base-T Ethernet
3 port RS-232C
COM ports to other system
9600bps, 19200bps at 3000 points
1 port RS-232C
COM ports for diagnosis
115200bps
Internal bus PC/104 plus
Software system QNX
Protocol to other system MODBUS or IEC60870-5-104
Power supply Dual 24VDC
Power consumption 13W
4.4.4 Configuration
Refer to GEK-114905 OC 6000e Engineer Software Manual.
The chapter 2.9 Virtual Device shows how to configure the communication parameters
of 2 Ethernet and 3 serial ports. Note that physical serial port 2~4 correspond to virtual
ports 2~4 in parameter setting. Physical Ethernet ports Net1~2 correspond to virtual
ports 192.168.1~2.xxx in parameter setting.
Two types of MDP module are available for PROFIBUS-DP communication, MDP10 &
MDP11. The former has 2 PROFIBUS-DP expansion boards, which means it can interface
with 2 PROFIBUS-DP networks, max 125 slave devices per network with repeater. And
MDP11 only has one PROFIBUS-DP expansion board.
For detail product information, please refer to GEK-118580 MDP Profibus-DP Master
Module Manual.
Notes: The mechanical parts are not the same for mounting with screw compared to
mounting with 35mm DIN rail.
5.2 Installation
The following steps describe how to install the IO module.
Align the four 5.3mm holes of the bottom plate assembly with the four
corresponding holes of backplane plate for mounting, then using four appropriate
screws to secure. Refer to "Figure 5.2-1" for illustration.