Panasonic KX Tg1100hg

ORDER NO.
KM40607132CE
Telephone Equipment
KX-TG1100HGS
KX-TG1100HGT
KX-TG1102HGS
KX-TGA110EXS
KX-TGA110EXT
Digital Cordless Phone
Silver Version
Titanium Black Version
(for Hungary)
2006 Panasonic Communications Co., Ltd. All

rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TG1100HGS / KX-TG1100HGT / KX-TG1102HGS / KX-TGA110EXS / KX-TGA110EXT
Note:
Because section 4 of this manual is an extract from the operating instructions for this model, it is subject to change without notice.
You can download and refer to the original operating instructions on TSN Server for further information.
CONTENTS
Page Page
1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4 10 THINGS TO DO AFTER REPLACING IC 40
1.1. Suggested PbF Solder 4 10.1. Base Unit 40
1.2. How to recognize that Pb Free solder is used 5 10.2. Handset 40
2 FOR SERVICE TECHNICIANS 5 11 RF SPECIFICATION 41
3 CAUTION 5 11.1. Base Unit 41
4 OPERATING INSTRUCTIONS 6 11.2. Handset 41
4.1. Battery 6 12 HOW TO CHECK THE HANDSET SPEAKER 41
4.2. Location of Controls 7 13 FREQUENCY TABLE (MHz) 42
4.3. Connections 8 14 BLOCK DIAGRAM (BASE UNIT) 43
4.4. Guide to Settings 9 15 CIRCUIT OPERATION (BASE UNIT) 44
4.5. For Service Hint 11 15.1. Outline 44
5 DISASSEMBLY INSTRUCTIONS 13 15.2. Power Supply Circuit 45
5.1. Base Unit 13 15.3. Telephone Line Interface 46
5.2. Handset 14 15.4. Transmitter/Receiver 46
5.3. Charger Unit 15 15.5. Pulse Dialling 46
6 ASSEMBLY INSTRUCTIONS 16 16 BLOCK DIAGRAM (HANDSET) 47
6.1. Warning When Constructing the Base Unit 16 17 CIRCUIT OPERATION (HANDSET) 48
6.2. How to Replace the Handset LCD 17 17.1. Outline 48
7 TROUBLESHOOTING GUIDE 18 17.2. Power Supply Circuit/Reset Circuit 48
7.1. Check Power 19 17.3. Charge Circuit 48
7.2. Check Battery Charge 20 17.4. Battery Low/Power Down Detector 48
7.3. Check Link 21 18 CIRCUIT OPERATION (CHARGER UNIT) 49
7.4. Check Handset Transmission 23 18.1. Power Supply Circuit 49
7.5. Check Handset Reception 23 19 SIGNAL ROUTE 50
7.6. Check Caller ID 23 20 CPU DATA (BASE UNIT) 51
7.7. Bell Reception 23 20.1. IC2 (BBIC) 51
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND 21 CPU DATA (HANDSET) 53
CHARGER UNIT) 24 21.1. IC4 (BBIC) 53
8.1. Check Point (Base Unit) 24 22 ENGINEERING MODE 55
8.2. The Setting Method of JIG (Base Unit) 29 22.1. Base Unit 55
8.3. Adjustment Standard (Base Unit) 31 22.2. Handset 57
8.4. Check Point (Charger Unit) 33 23 HOW TO REPLACE THE FLAT PACKAGE IC 59
8.5. Adjustment Standard (Charger Unit) 33 23.1. Preparation 59
9 TROUBLESHOOTING BY SYMPTOM (HANDSET) 34 23.2. How to Remove the IC 59
9.1. Check Point (Handset) 34 23.3. How to Install the IC 60
9.2. The Setting Method of JIG (Handset) 37 23.4. How to Remove a Solder Bridge 60
9.3. Adjustment Standard (Handset) 39 24 CABINET AND ELECTRICAL PARTS (BASE UNIT) 61
2
25 CABINET AND ELECTRICAL PARTS (HANDSET) 62 30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT)) 71
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT) 63 30.2. Handset (SCHEMATIC DIAGRAM (HANDSET)) 71
27 ACCESSORIES AND PACKING MATERIALS 64 30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
27.1. KX-TG1100HGS/HGT 64 71
27.2. KX-TG1102HGS 65 31 SCHEMATIC DIAGRAM (BASE UNIT) 72
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES 32 SCHEMATIC DIAGRAM (HANDSET) 74
66 33 SCHEMATIC DIAGRAM (CHARGER UNIT) 76
28.1. Base Unit 66 34 CIRCUIT BOARD (BASE UNIT) 77
28.2. Handset 66 34.1. Component View 77
28.3. Charger Unit 66 34.2. Flow Solder Side View 78
29 REPLACEMENT PARTS LIST 67 35 CIRCUIT BOARD (HANDSET) 79
29.1. Base Unit 67 35.1. Component View 79
29.2. Handset 68 35.2. Flow Solder Side View 80
29.3. Charger Unit 69 36 CIRCUIT BOARD (CHARGER UNIT) 81
29.4. Accessories and Packing Materials 69 36.1. Component View 81
29.5. Fixtures and Tools 70 36.2. Flow Solder Side View 81
30 FOR SCHEMATIC DIAGRAM 71
3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50F ~70F (30C ~ 40C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700F 20F (370C 10C).
Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent
solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100F (600C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturers specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
1.2. How to recognize that Pb Free solder is used

(Example: Handset P.C.B.)
Marked
PbF
1
30 1
31 100
IC4 IC3
50 81
51 80
1 8
IC2
4 5
(Component View)
Note:
The location of the PbF mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufactures Instructions.
5
4 OPERATING INSTRUCTIONS
4.1. Battery
4.1.1. Battery Installation
Notice:
When inserting the batteries:
Wipe the battery ends ( , ) with a dry cloth.
Install the batteries without touching the battery ends ( , ) or the unit contacts.
I fully charged the batteries, but the operating time seems to be short:
Wipe the battery ends ( , ) and the unit contacts with a dry cloth.
4.1.2. Battery Charge
6
4.2. Location of Controls

4.2.1. Base Unit
4.2.2. Handset
4.2.3. Charger
7
4.3. Connections
The unit will not work during a power failure.
We recommend you connect a standard telephone on the same line for power protection.
4.3.1. Base Unit
4.3.2. Charger
Note:
Never install telephone wiring during a lightning storm.
Do not connect the AC adaptor to a ceiling-mounted AC outlet, as the weight of the adaptor may cause it to become
disconnected.
8
4.4. Guide to Settings

4.4.1. Base Unit
Cross Reference:
For Service Hint (P.11)
9
4.4.2. Handset
Cross Reference:
10
4.5. For Service Hint
4.5.1. Registering a Handset to a Base Unit
Cross Reference:
11
4.5.2. Cancelling a Handset
Cross Reference:
4.5.3. Cancelling a Base Unit
Cross Reference:
12
5 DISASSEMBLY INSTRUCTIONS
5.1. Base Unit
Shown in Fig.- To Remove Remove

1 Cabinet Cover Screws (2.6 12)..........(A) 2
2 Main P.C. Board Solders
Main P.C. Board
13
5.2. Handset

3 Cabinet Cover Screws (2 8)..........(B) 2
4 Follow the procedure.
5 Main P.C. Board Screw (2 8)..............(C) 3
Tape and Solders
Main P.C. Board
14
5.3. Charger Unit

6 Cabinet Cover Screws (2.6 14)..........(D) 2
7 Main P.C. Board Solders
Main P.C. Board
15
6 ASSEMBLY INSTRUCTIONS
6.1. Warning When Constructing the Base Unit
CHG terminal is properly fit in the cabinet.
OK
Rib
NG
CHG terminal comes out of rib by pulling black lead wire when opening the cabinet and turning
the PCB over. The terminal cannot have enough elastic force, cannot have good contact with
handset, and it will result in charge problem.
16
6.2. How to Replace the Handset LCD
17
7 TROUBLESHOOTING GUIDE
Flow Chart
Cross Reference:
Check Power (P.19)
Bell Reception (P.23)
Check Battery Charge (P.20)
Check Link (P.21)
Check Handset Transmission (P.23)
Check Handset Reception (P.23)
SIGNAL ROUTE (P.50)
Check Caller ID (P.23)
18
7.1. Check Power

7.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (Check AC Adaptors specification.)
Cross Reference Note:

Power Supply Circuit (P.45) BBIC is IC2.
7.1.2. Handset
Cross Reference Note:

Power Supply Circuit/Reset Circuit (P.48) BBIC is IC4.
19
7.2. Check Battery Charge

7.2.1. Base Unit
Cross Reference:
Power Supply Circuit (P.45)
7.2.2. Handset
Cross Reference: Note:

Check Power (P.19) BBIC is IC4.
Charge Circuit (P.48)
7.2.3. Charger Unit
Cross Reference:
20
7.3. Check Link

7.3.1. Base Unit
Cross Reference:
Check Point (Base Unit) (P.24)
Note:
(*1) Refer to TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND CHARGER UNIT) (P.24).
21
7.3.2. Handset
Cross Reference
Power Supply Circuit/Reset Circuit (P.48)
Check Point (Handset) (P.34)
Note:
(*1) Refer to TROUBLESHOOTING BY SYMPTOM (HANDSET) (P.34).
22
7.4. Check Handset Transmission
Cross Reference:
SIGNAL ROUTE (P.50)
7.5. Check Handset Reception
Cross Reference:
HOW TO CHECK THE HANDSET SPEAKER (P.41).
SIGNAL ROUTE (P.50)
7.6. Check Caller ID
Cross Reference:
SIGNAL ROUTE (P.50)
7.7. Bell Reception

7.7.1. Handset
Cross Reference: Note:

Telephone Line Interface (P.46) BBIC is IC4.
Check Link (P.21)
HOW TO CHECK THE HANDSET SPEAKER (P.41)
23
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND

CHARGER UNIT)
If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Note:
(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Base Unit) (P.24)
8.1. Check Point (Base Unit)

Please follow the items below when BBIC or EEPROM is replaced.
Note:
After the measuring, suck up the solder of TP.
*: PC Setting (P.29) is required beforehand.
The connections of simulator equipments are as shown in Adjustment Standard (Base Unit) (P.31).
Items Adjustment Procedure Check or
Point Replace Parts
(A) 2.65V Supply - 1. Confirm that the voltage between TP187 and GND is 2.65V 0.2V. IC2, Q8, C23,
Confirmation C24, C25,
C31, C26,
C27, C38,
R33, R36, D5,
C41, R41,
R42, Q9, C40,
D4, X1, C32,
C33, C36, C37
(B) 4.0V Supply - 1. Confirm that the voltage between TP91 and GND is 4.0V 0.2V. D4, C40, Q9,
Confirmation R41, R42,
C41, D5, C75,
C78, C69,
C66, C67,
C76, IC3
(C) VBACK Status - 1. Confirm that the voltage between J102 and GND is 0V 0.4V. IC2, Q8, C23,
Confirmation C24, C25,
C31, C26,
C27, C38,
R33, R36, D5,
C41, R41,
R42, Q9, C40,
D4, R33, X1,
C32, C33
24

Point Replace Parts
(D)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command getchk). IC2, X1, C32,
C33
2. Confirm the returned checksum value.
Connection of checksum value and program number is shown below.
(E)* BBIC Clock Adjustment TP1 1. Execute the command deactmac. IC2, IC3, L1,
(Important) C48, X1, C32,
2. Execute the command conttx.
C33, L5
3. Input Command rdeeprom 00 00 02, then you can confirm the current value.
4. Adjust the frequency of TP1 executing the command setfreq 00 xx (where xx
is the value) so that the reading of the frequency counter is 10.368000MHz
10Hz.
(F)* Hookswitch Check with - 1. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 IC2, R7, R8,
DC Characteristics . R9, R10, R77,
Q2, Q3, D2,
2. Set line voltage to 48V at on-hook condition and line current to 40mA at off-
C1, C2
hook condition of normal telephone.
3. Execute the command hookoff.
4. Confirm that the line current is 40mA 5mA.
5. Execute the command hookon.
6. Confirm that the line current is 0mA + 2mA.
(G)* DTMF Generator Check - 1. Connect J1 (Telephone Socket) to DTMF tester. IC2, R32, C22,
R23, C80,
2. Execute the command hookoff and dtmf_up.
C14, C13, Q6,
3. Confirm that the high frequency (1477.06Hz) group is -5 ~ -9dBm. R22, R21,
R19, R20,
4. Execute the command dtmf_lo. C12, D2, C1,
5. Confirm that the low frequency (852.05Hz) group is -8 ~ -12dBm. C2, R77, D3,
R12, Q2, R7,
R8, R9, R10,
Q3
(H)* Transmitted Power - Remove the Antenna before starting steps from 1 to 5. IC2, IC3, L1,
Confirmation 1. Configure the DECT tester (CMD60) as follows; C43, C78,
C75, C69,
<Setting>
C48, C72,
Short TP10 and GND C66, C67,
C76, C57,
(After the checking, disconnect the wiring between them.) C73, L3, DA1,
Test mode: FP R66, R67,
C55, C56,
Traffic Channel: 5 R78, R79,
Traffic Slot: 4 C54, C58,
C86, R38
Mode: Loopback
PMID: 00000
2. Execute the command testmode.
3. Initiate connection from DECT tester. (set up connect)
4. Execute the command ANT 1.
5. Confirm that the NTP value at ANT is 20dBm ~ 25dBm.
(I)* Modulation Check and ANT Follow steps 1 to 3 of (H) above. IC2, IC3, L1,
Adjustment 4. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data C43, C78,
type Fig31. C75, C69,
C48, C72,
5. Adjust the B-Field Modulation if required. (Execute the command readmod
C66, C67,
and wrtmod xx, where xx is the value.)
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
25

Point Replace Parts
(J)* Frequency Offset Check - Follow steps 1 to 3 of (H). IC2, IC3, L1,
4. Confirm that the frequency offset is -50kHz ~ +50kHz. C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
(K)* Sensitivity Receiver - Follow steps 1 to 3 of (H). IC2, IC3, L1,
Confirmation 4. Set DECT tester power to -88dBm. C43, C78,
C75, C69,
5. Confirm that the BER is < 1000ppm.
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
(L)* Timing Confirmation - Follow steps 1 to 3 of (H). IC2, IC3, L1,
4. Confirm that the Timing accuracy is < 2.0ppm. C43, C78,
C75, C69,
C48, C72,
C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
(M)* RSSI Level - Follow steps 1 to 3 of (H). IC2, IC3, L1,
Confirmation 4. Set DECT tester power to -88dBm. C43, C78,
C75, C69,
5. Execute the command readrssi.
C48, C72,
6. Confirm: 25 < returned value < 43 (hex) (34 F (hex)) C66, C67,
C76, C57,
C73, L3, DA1,
R66, R67,
C55, C56,
R78, R79,
C54, C58,
C86, R38
26

Point Replace Parts
(N)* Receive Audio Check ANT 1. Configure the DECT tester (CMD60) as follows; IC2, C21, R31,
and Adjustment J1 C20, C11,
<Setting>
R18, R16, D3,
Test mode: FP R12, Q2, R7,
R8, Q3, R9,
Mode: Low
R10, D2, C1,
PMID: 00000 C2, R77, IC3,
L1, C43, C78,
2. Execute the command testmode. C75, C69,
3. Initiate connection from DECT tester. C48, C72,
C66, C67,
4. Execute the command hookoff. C76, C57,
5. Execute the command openau. C73, L3, DA1,
R66, R67,
6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 C55, C56,
. R78, R79,
7. Set line voltage to 48V and line current to 40mA. C54, C58,
C86, R38
8. Connect DECT tester to Tel-simulator.
9. Input audio signal (200mVrms/1kHz tone) to Tel-simulator.
<DECT tester setting>
Scramble: On
AF Gen. to ADPCM: Off
AF Meter Input: ADPCM
AF Gen. Frequency: 1000Hz
AF Gen. Level: 200mVrms
10. Confirm hearing tone: 340mVrms 100mVrms
11. Adjust audio level if required. (Make sure current value using getmicgain. And
then execute the command setmicgain xx, where xx is the value.)
12. Confirm that the B-field audio distortion with DECT tester is < 5%.
(O)* Transmit Audio Check ANT 1. Configure the DECT tester (CMD60) as follows; IC2, R32, C22,
and Adjustment J1 R23, C80,
<Setting>
C14, C13,
Test mode: FP R22, R21, Q6,
R18, R19,
Mode: Low
R20, C12, D2,
PMID: 00000 C1, C2, R77,
R16, D3, R12,
2. Execute the command testmode. Q2, R7, R8,
3. Initiate connection from DECT tester. R9, R10, Q3,
IC3, L1, C43,
4. Execute the command hookoff. C78, C75,
5. Execute the command openau. C69, C48,
C72, C66,
6. Connect J1 (Telephone Socket) to Tel-simulator which is connected with 600 C67, C76,
. C57, C73, L3,
7. Set line voltage to 48V and line current to 40mA. DA1, R66,
R67, C55,
8. Input audio signal (30mVrms/1kHz tone) to DECT tester. C56, R78,
<DECT tester setting> R79, C54,
C58, C86, R38
Scramble: On
AF Gen. to ADPCM: On
AF Meter Input: AF Voltm
9. Confirm hearing tone: 360mVrms 100mVrms.
10. Adjust audio level if required. (Make sure current value using getspkrgain.
And then execute the command setspkrgain xx, where xx is the value.)
11. Confirm that the audio distortion at 600R of Tel-simulator is < 5%.
(P) Charging Check - 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. D4, R43, R44
2. Measure and confirm voltage across the resistor is 2.3V 0.2V.
27

Point Replace Parts
(Q)* Audio Check - 1. Link with Handset.
2. Set line voltage to 48V and line current to 40mA.
3. Input -45dBm/1kHz to MIC of Handset.
Measure the Level at Line I/F and distortion level.
4. Confirm that the level is -7.5 2dBm and that the distortion level is < 5% at
TEL Line (600 Load).
5. Input -20dBm/1kHz to Line I/F.
Measure the level at Receiver of Handset and distortion level
(*Receive volume set to second position from minimum).
6. Confirm that the level is -23 2dBm and that the distortion level is < 5% at
Receiver (vol = Middle, 150 Load).
28
8.2. The Setting Method of JIG (Base Unit)

8.2.1. Preparation
8.2.1.1. Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended.
Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm).
Hewlett Packard, 53131A is recommended.
DC power: it must be able to output at least 1A current under 9V.
Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope
8.2.1.2. JIGs and PC

Serial JIGs
1. I2C PCB: PQZZ1CD420BX
2. RS232C cable: PQZZ1CD705BX
3. Clip cable: PQZZ2CD705BX
4. DC cable: PQZZ3CD705BX
PC which runs in DOS mode
Batch file CD-ROM for setting: PQZZTG1100HG
8.2.2. PC Setting
8.2.2.1. Connections
Connect the AC adaptor to J2 (base unit).
Connect the RS232C cable to the Serial Port of PC.
Connect the DC cable to the DC Power.
Connect the Clip cable GND.
Connect the Clip cable SCL and SDA.
Note:
*: Com port names may vary depending on what your PC calls it.
29
8.2.2.2. Batch file Settings
Note:
***** varies depending on the country.
8.2.2.3. Commands
See the table below for frequently used commands.
Command name Function Example
rdeeprom Read the data of EEPROM Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is
read out.
readid Read ID (RFPI) Type readid, and the registered ID is read out.
writeid Write ID (RFPI) Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written.
setfreq adjust Frequency of RFIC Type setfreq nn nn.
hookoff off-hook mode on Base Type hookoff.
hookon on-hook mode on Base Type hookon.
Getchk Read checksum Type getchk.
Wreeprom write eeprom Type wreeprom 01 23 45. 01 23 is address and 45 is data to be written.
InitBsPIN.bat Initial Base PIN to 0000 Type initBsPIN
30
8.3. Adjustment Standard (Base Unit)
When connecting the simulator equipment for checking, please refer to below.
8.3.1. Component View
OSC
DECT Tester
CMD60
AF
OSC (H) (I) (J) (K) (L) (M)
AF VOLT MIC
METER
SP
R85 A201
6.3V47F
+ JMP6
JMP2 C96 R42
C81
C84
C82
JMP5 L59
150 SA1 J1 R41 C87
JMP7 D7 C5 8
C77 L5
JMP8 D8 D4 J2 C58 4
DA1
R79 C59
Q9 C70 R78 C73
Dummy L3 C71
Handset RLY1 L2 R81
C55 C57 C83 ANT
L83 L85 28 C56
R82 R53 C42 R66 1
JMP4 JMP3 JMP1
R77 C3 C74 C41 C66
C76
R54 C102
D1 C63 R1
C49 C40 C67 C86
R6 C100 C43
31
Q1 C2 C4 R5
C5 C98 C72
R4 R71 C53
R3 Q11
R2 A202
R74 L4 R38 R87
C1 R70 IC3
R72

C69
C78
R73 C68
S1 R7 D2 C60 C62
C7 C88
C93
B C E
Q2
R8 R9
L5 PbF C94 R88
R11 R12 D3 Q3 C37
C6 C101
C10 11 18
D13 R26 R10 D11 C97 C48
Q4 R91 R24 Q7
R58 C50 C47
L1
R27 R59 C36
D6 C79 R57 1 64
C9 D12 C14 D5 C38 C89
C13 R23 D10 C35 R67 C105 R43
R22 R32
R92
R13 R35 C34 R36

R14 R21 C80 C22
B 49 C106
16 R44
Q6 C
R16 C11 C33 17 IC2 48 C27
R18 R17 C32 C107
R15 C15 E R68
R90
R56 R61 R33
C30 C31 C90 C95
C51 X1
R19 R30 32 33 R52
R25 R28 R55 C29
C103 C23 5 4 D9
Q5 C19 C26
C16 R20 C12 Q8 C18 CN4
C24 R29 8 1 C92
C17 R31
KXTCD150H/KXTG1100H C20 C21 IC1
C25 C28 Q10
R89
PQUP11175W C91 B
Note:
(H) - (M) is referred to Check Point (Base Unit) (P.24)
8.3.2. Flow Solder Side View
(D) (E) (F) (G)
(H) (N) (O)
PC (C)
(*1) Digital
Digital I2C PCB Volt Meter
(A)
Volt Meter (JIG) VBACK GND
GND TP187 SDA SCL GND
+2.65V
SDA
SCL
VBACK
GND
TP82 (P)
CHARGE+
TP187 PbF CHARGE
CHARGE 12 Digital
GND 2w Volt Meter
TP97
(E)
TP1
Frequency
TP50 Counter
TP1
GND
TP10
TP45
32
TP45
Digital
TP188
Volt Meter
GND C99 TP10
TP91 (H)
TP40
TP3 4 TP2 GND
6 2 TP89
TP39
1
(G) DTMF TP101
TP5
Tester TP90
Call - ID
Simulator TP3
TP40
BELL
Simulator
600
LOOP AF VOLT
Simulator METER GND TP101 GND TP91
AF DC POWER (B) Digital
OSC OSC 6V Volt Meter
Note:
(A) - (P) is referred to Check Point (Base Unit) (P.24)
(*1) Refer to Connections (P.29)
8.4. Check Point (Charger Unit)

Point Replace Parts
(A) Charging Check - 1. Connect Charge Contact 12/2W resistor between charge+ and charge-. D1, R1, R2
2. Measure and confirm voltage across the resistor is 2.7V 0.2V.
Note:
The connection of adjustment equipment are as shown in Adjustment Standard (Charger Unit) (P.33).
8.5. Adjustment Standard (Charger Unit)

8.5.1. Flow Solder Side View
TP3
R1
R2
TP4
PbF
(A)
TP1
Digital Volt Meter 12/2W
TP2
PQUP11205Z B
Note:
(A) is referred to Check Point (Charger Unit) (P.33)
33
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)

If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester
(*1) or not.
Note:
(*1) A general repair is possible even if you dont have the DECT tester because it is for confirming the levels, such as Acoustic
level in detail.
(*2) Refer to Check Point (Handset) (P.34)
9.1. Check Point (Handset)

Please follow the items below when BBIC or EEPROM is replaced.
Note:
*: PC Setting (P.37) is required beforehand.
The connections of simulator equipments are as shown in Adjustment Standard (Handset) (P.39).
Point Replace Parts
(A) 4.0V Supply - 1. Confirm that the consumption current is < 200mA, that is, there is no short IC4, F1, R21,
Confirmation circuit. R4, C1, L2,
D1, C15, C33,
2. Confirm that the voltage between TP4V and GND is 4.1V 0.2V.
C34, C14, Q1,
R111, R2,
C26, X1, C16,
C17
(B) VBACK Status - 1. Confirm that the voltage between VBACK and GND is 0V 0.4V. IC4, F1, R21,
Confirmation R4, C1, L2,
D1, C15, C33,
C34, C14, Q1,
R111, R2,
C26, X1, C16,
C204
(C)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command getchk). IC4, X1, C16,
C204
2. Confirm the returned checksum value.
Connection of checksum value and program number is shown below.
(D) Charge Control Check & - 1. Apply 6V between TP20(+) and TP21(-) with current limit of PSU to 250mA. IC4, D2, L4,
Charge Current Monitor L5, Q2, Q3,
2. Confirm that the charge current is ON/OFF.
Check R6, C26, F1,
3. SW to decrease current limit of PSU to 100mA. R21, R4, C1
4. Confirm that the charge current is stable.
(E)* Charge Detection (OFF) - 1. Stop supplying 6V to TP20(+) and TP21(-). IC4, D2, L4,
Check L5, Q2, Q3,
2. Execute the command charge.
R6, C26, F1,
3. Confirm that the returned value is 00 (hex). R21, R4, C1
34

Point Replace Parts
(F)* Battery Monitor Check & - 1. Apply 2.3V 0.005V between TP3(+) and TP4(-) with DC power. IC4, D2, L4,
Adjustment (Important) L5, Q2, Q3,
2. Execute the command deactmac to stabilize the value.
R6, C26, F1,
3. Then, execute the command readbatt. The returned value is XX. R21, R4, C1
4. Confirm that XX is between 98 and A8.
98 < XX < A8 (Hex)
(If XX is out of range, change BBIC)
(G) Battery Low - 1. Apply 2.40V between TP3(+) and TP4(-). IC4, F1, R21,
Confirmation (Important) R4, C1, R103,
2. Confirm that there is no Speaker sound (Battery low alarm).
R110, D102,
3. Apply 2.20V between TP3(+) and TP4(-). Q104,
BUZZER
4. Confirm that there is Speaker sound (Battery low alarm).
(H)* BBIC Clock Adjustment TP19 1. Apply 2.6V between TP 3(+) and TP 4(-) with DC power. IC4, L3, C57,
(Important) IC3, X1, C16,
2. Execute the command deactmac.
C204
3. Execute the command conttx.
4. Input Command rdeeprom 00 01 01", then you can confirm the current value.
5. Adjust the frequency of TP19 executing the command setfreq 00 xx (where xx
is the value) so that the reading of the frequency counter is 10.368000MHz
10Hz.
(I)* Transmitted Power TP15 Remove the Antenna before starting steps from 1 to 5. IC4, IC3, C54,
Confirmation 1. Configure the DECT tester (CMD60) as follows; L3, C57,
R112, R18,
<Setting>
C61, C58
Test mode: PP
RFPI: 0102030405
Traffic Channel: 5
Traffic Slot: 4
Mode: Loopback
3. Execute the command regcmd60.
4. Initiate connection from DECT tester.
5. Confirm that the NTP value at A201 (TP15) is 20dBm ~ 25dBm.
(J)* Modulation Check and TP15 Follow steps 1 to 4 of (I) above. IC4, IC3, C54,
Adjustment 5. Confirm that the B-Field Modulation is 340kHz/div ~ 402kHz/div using data L3, C57,
type Fig31. R112, R18,
C61, C58
6. Adjust the B-Field Modulation if required. (Execute the command Readmod
and Writemod xx, where xx is the value.)
(K)* Frequency Offset - Follow steps 1 to 4 of (I) above. IC4, IC3, C54,
Confirmation 5. Confirm that the frequency offset is -50kHz ~ +50kHz. L3, C57,
R112, R18,
C61, C58
(L)* Sensitivity Receiver - Follow steps 1 to 4 of (I) above. IC4, IC3, C54,
Confirmation 5. Set DECT tester power to -88dBm. L3, C57,
R112, R18,
6. Confirm that the BER is < 1000ppm.
C61, C58
(M)* Timing Confirmation - Follow steps 1 to 4 of (I) above. IC4, IC3, C54,
5. Confirm that the Timing accuracy is < 2.0ppm. L3, C57,
R112, R18,
C61, C58
(N)* RSSI Level - Follow steps 1 to 4 of (I) above. IC4, IC3, C54,
Confirmation 5. Set DECT tester power to -88dBm. L3, C57,
R112, R18,
6. Execute the command readrssi.
C61, C58
7. Confirm: 25 < returned value < 43 (hex) (34 F (hex))
35

Point Replace Parts
(O)* Receive Audio Check TP15 1. Configure the DECT tester (CMD60) as follows; IC4, C67, C68,
and Confirmation D7, D6, IC3,
<Setting>
C54, L3, C57,
Test mode: PP R112, R18,
C61, C58
Mode: Normal
RFPI: 0102030405
5. Execute the command openaudio.
6. Confirm that the value of EEPROM address F3F is 02. (If the value is not
02 (by User), set 02 and power off and power on, and return to clause 2.)
7. Input audio signal (50mVrms/1kHz tone) from DECT tester.
Scramble: On
AF Gen. to ADPCM: On
AF Meter Input: AF Voltm
8. Confirm hearing tone: 50mVrms 30mVrms (Just check Audio path)
9. Confirm that the audio distortion with DECT tester is < 5%.
(P)* Transmit Audio Check TP15 1. Configure the DECT tester (CMD60) as follows; IC4, C8, R7,
and Confirmation R8, C6, C7,
<Setting>
C5, R5, R1,
Test mode: FP C4, IC3, C54,
L3, C57,
Mode: Normal
R112, R18,
RFPI: 0102030405 C61, C58
5. Execute the command openaudio.
6. Confirm that the value of EEPROM address F3F is 02. (If the value is not
02 (by User), set 02 and power off and power on, and return to clause 2.)
7. Input audio signal (30mVrms/1kHz tone) to DECT tester.
Scramble: On
AF Gen. to ADPCM: Off
AF Meter Input: ADPCM
8. Confirm hearing tone: 600mVrms 100mVrms (Just check Audio path)
9. Confirm that the audio distortion with DECT tester is < 5%.
(Q) Audio Check and - 1. Link to BASE which is connected to Line Simulator.
Confirmation
2. Set line voltage to 48V and line current to 40mA.
3. Input -45dBm/1KHz to MIC and measure Line output level.
4. Confirm that the level is -7.5 2dBm and that the distortion level is < 5% at
TEL Line (600 Load).
5. Input -20dBm/1KHz to Line I/F and measure Receiving level at SP+ and SP-.
6. Confirm that the level is -23 2dBm and that the distortion level is < 5% at
Receiver. (vol = middle, 150 Load)
36
9.2. The Setting Method of JIG (Handset)

9.2.1. Preparation
9.2.1.1. Equipment Required
DECT tester: Rohde & Schwarz, CMD 60 is recommended.
Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm).
Hewlett Packard, 53131A is recommended.
DC power: it must be able to output at least 1A current under 2.4V for Handset, 9V for JIG.
Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope
9.2.1.2. JIGs and PC

Serial JIGs
1. I2C PCB: PQZZ1CD420BX
2. RS232C cable: PQZZ1CD705BX
3. Clip cable: PQZZ2CD705BX
4. DC cable: PQZZ3CD705BX
PC which runs in DOS mode.
Batch file CD-ROM for setting: PQZZTG1100HG
9.2.2. PC Setting
9.2.2.1. Connections
Connect the DC Power or Battery to TP3 and TP4 (Handset).
Connect the RS232C cable to the Serial Port of PC.
Connect the DC cable to the DC Power.
Connect the Clip cable GND.
Connect the Clip cable SCL and SDA.
Note:
*: Com port names may vary depending on what your PC calls it.
37
9.2.2.2. Batch file Settings
Note:
***** varies depending on the country.
9.2.2.3. Commands
See the table below for frequently used commands.
Command name Function Example
rdeeprom Read the data of EEPROM Type rdeeprom 00 00 FF, and the data from address 00 00 to FF is
read out.
readid Read ID (RFPI) Type readid, and the registered ID is read out.
writeid Write ID (RFPI) Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E 98 is written.
setfreq adjust Frequency of RFIC Type setfreq nn nn.
Getchk Read checksum Type getchk.
Wreeprom write eeprom Type wreeprom 01 23 45. 01 23 is address and 45 is data to be written.
38
9.3. Adjustment Standard (Handset)
(I) (J) (K) (L)
Talk Key Power Key
(F) (G) (M) (N) (O) (P)
DC POWER Batt Low Check DECT Tester
OSC
2.30 - 2.60V 2.3V CMD60
AF
AF VOLT OSC TP22 TP23 TP17 TP16 TP15 GND
METER
LOOP BATTERY- BATTERY+ BAT GND

Simulator
600
Dummy Base
Unit
D5
KX-TG1100/KX-TGA110
A201
X1
C58
C1 TP15
PbF
TP5
C18
TP17
TP16
R19
BATT C20 L2
LED101 1
TP23
C64 C61 C56 C55

L4 R111
D4
F1 C16 C23 C32 C65
R12
D2
R113
TP5 30 1
C204 C26 C28 C29 C8

31 Q1 R17
C24 100
C108
Q2 C54
MIC-
C33
MIC- C62
D1
R110
R6
TP101
R2
R18
AF Q3
C116
R112
BUZ
IC4
39
Generator + MIC+ C4 C14 Q104 IC3
C60
C6 R102
C66
D102
TP102
C21
R1
R5
MIC+
R103
6.3V47 F
D3
Q4
C201 C203
C7 R8
81
C71
C5
50
R7 C30 51 80
C202
TP1
R21 R101

4.0V
C3
C22 R11 C27

D6 REV
C67 D7
L5 R4 TP22 C15 R27
TP6
1 8
VBACK+
VBACK
C34
TP2
GND
LED102
C68
TP19
R26
GND
DC
IC2 PQUP11406Z A
C57
L3
(D) (E)
SDA
SCL
4 5
6V TP6
SDA SCL
(D) Current
Probe
GND GND VBACK GND 4.0V
REV- REV+ GND TP19
TP1 TP2
(D) Oscilloscope Digital Digital Frequency
PC (B) (A) (H)
Volt Meter Volt Meter Counter
(C) (E) (F) (H) 150
(I) (O) (P) AF
Volt Meter
OSC
Note:
(A) - (P) is referred to Check Point (Handset) (P.34)
(*1) Refer to Connections (P.37)
10 THINGS TO DO AFTER REPLACING IC

Cautions:
Some of the content on this page may not apply to models from some countries. The contents below are the minimum
adjustments required for operation.
10.1. Base Unit

Before making the following adjustment, ensure you have carried out PC Setting (P.37) in The Setting Method of JIG (Base
Unit).
IC Necessary Adjustment
BBIC Programs for Voice processing, interface for RF and 1. Clock adjustment: Refer to Check Point (E). (*1)
(IC2) EEPROM
EEPROM Adjustment parameter data 1. Default batch file: Execute the command Default4KB.
(IC1) (country version batch file, default batch file, etc.)
2. Country version batch file: Execute the command
1100XXvYY. (*2)
3. Clock adjustment: Refer to Check Point (E). (*1)
Note:
(*1) Refer to Check Point (Base Unit) (P.24)
(*2) XX: country code, YY: revision number
XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC
(P.29).
10.2. Handset
Before making the following adjustment, ensure you have carried out PC Setting (P.37) in The Setting Method of JIG
(Handset).
IC Necessary Adjustment
BBIC Programs for Voice processing, interface for RF and 1. Clock adjustment: Refer to Check Point (H). (*3)
(IC4) EEPROM
2. 4.0 V setting and battery low detection: Refer to Check Point
(A), (F) and (G). (*3)
EEPROM Adjustment parameter data 1. Default batch file: Execute the command Default.
(IC2) (country version batch file, default batch file, etc.)
2. Melody Initialize batch file; Execute the Command D45MFA.
3. Country version batch file: Execute the command
110XXvYY. (*4)
4. Clock adjustment: Refer to Check Point (H). (*3)
5. 4.0 V setting and battery low detection: Refer to Check Point
(A), (F) and (G). (*3)
Note:
(*3) Refer to Check Point (Handset) (P.34)
(*4) XX: country code, YY: revision number
XX and YY vary depending on the country version. You can find them in the batch file, PQZZ- mentioned in JIGs and PC
(P.37).
40
11 RF SPECIFICATION
11.1. Base Unit
Item Value Refer to -. *
TX Power More than 20 dBm ~ 25 dBm Check Point (Base Unit) (H)
Modulation 340 kHz/div ~ 402 kHz/div Check Point (Base Unit) (I)
Frequency Offset -50 kHz ~ +50 kHz Check Point (Base Unit) (J)
RX Sensitivity < 1000 ppm Check Point (Base Unit) (K)
Timing Accuracy < 2.0 ppm Check Point (Base Unit) (L)
RSSI Level 34 hex F hex Check Point (Base Unit) (M)
*: Refer to Check Point (Base Unit) (P.24)
11.2. Handset
Item Value Refer to -. **
TX Power More than 20 dBm ~ 25 dBm Check Point (Handset) (I)
Modulation 340 kHz/div ~ 402 kHz/div Check Point (Handset) (J)
Frequency Offset -50 kHz ~ +50 kHz Check Point (Handset) (K)
RX Sensitivity < 1000 ppm Check Point (Handset) (L)
Timing Accuracy < 2.0 ppm Check Point (Handset) (M)
RSSI Level 34 hex F hex Check Point (Handset) (N)
**: Refer to Check Point (Handset) (P.34)
12 HOW TO CHECK THE HANDSET SPEAKER

1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
41
13 FREQUENCY TABLE (MHz)

BASE UNIT HANDSET
Channel No Transmit Frequency Receive Frequency Transmit Frequency Receive Frequency
1 1897.344 1897.344 1897.344 1897.344
2 1895.616 1895.616 1895.616 1895.616
3 1893.888 1893.888 1893.888 1893.888
4 1892.160 1892.160 1892.160 1892.160
5 1890.432 1890.432 1890.432 1890.432
6 1888.704 1888.704 1888.704 1888.704
7 1886.976 1886.976 1886.976 1886.976
8 1885.248 1885.248 1885.248 1885.248
9 1883.520 1883.520 1883.520 1883.520
10 1881.792 1881.792 1881.792 1881.792
Note:
Channel No. 10: In the Test Mode on Base Unit and Handset.
42
14 BLOCK DIAGRAM (BASE UNIT)
J1
to Tel_Line ANT1
A TXAF 28 A/D Burst Building 9 TXDA ANT2
Bridge Hook Speech Encoding 4 31
B Audio RXAF 24 5 RXDA
Rect Switch D/A 19
Speech Decoding Burst Decoding
Analog ADPCM 30 RSSI
Front End 5
Codec Filter RF 11 SYRI 12
BMC Interface 63 IC3
DSP
64
6 SYEN
HOOK 61 10
RF Module
DTXAF 26
BBIC
43
Interface DTXAF 27
Limit CHARGE XTAL

CONTACT 18
Resistor CPU
10.368
MHz
VUNREG
IC2 16
J2
to AC Adaptor 4.0V
Reg.
EEPROM SCL 41
4.0V 6
IC1 SDA 40 BBIC
5
2.65V
Reg.
2.65V
KX-TG1100/1102 BLOCK DIAGRAM (BASE UNIT)

15 CIRCUIT OPERATION (BASE UNIT)

15.1. Outline
Base Unit consists of the following ICs as shown in BLOCK DIAGRAM (BASE UNIT) (P.43).
DECT BBIC (Base Band IC): IC2
Handling all the audio, signal and data processing needed in a DECT base unit
Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
ADPCM codec filter for speech encoding and speech decoding (DSP section)
Echo-cancellation and Echo-suppression (DSP section)
Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
DTMF receiver (DSP section)
Clock Generation for RF Module
ADC, DAC, timer, and power control circuitry
All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
RF Module: IC3
PLL Oscillator
Detector
Compress/Expander
First/Second Mixer
Amplifier for transmission and reception
EEPROM: IC1
Temporary operating parameters (for RF, etc.)
Additionally,
Power Supply Circuit (+4.0V, +2.65V output)
Crystal Circuit (10.368MHz)
Charge Circuit
Telephone Line Interface Circuit
44
15.2. Power Supply Circuit

The power is supplied to the DECT BBIC, RF Module, EEPROM, Relay Coil, LED and Charge Contact from AC Adaptor (+6V)
as shown in Fig.101. The power supply is as follows:
<Fig.101>
45
15.3. Telephone Line Interface

<Function>
Bell signal detection
Clip signal detection
ON/OFF hook circuit
Audio circuits
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q2 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the TP3 (A) and TP40 (B) leads (when the telephone rings), the signal is transferred as follows;
A C4 R2 R29 IC2 (DLP) [BELL & CLIP]
B C3 R1 R30 IC2 (DLP) [BELL & CLIP]
ON/OFF hook circuit:
In the standby mode, Q2 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is
consequently in an off-hook condition.
When IC2 detects a ring signal or press the TALK Key onto the handset, Q3 turns on and then Q2 turns on, thus providing an
off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.
A D2 Q2 R8 Q6 R19 R20 D2 B [OFF HOOK]
Audio circuits:
Refer to SIGNAL ROUTE (P.50).
15.4. Transmitter/Receiver
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to SIGNAL ROUTE (P.50).
15.4.1. Transmitter Block

The voice signal input from the TEL LINE interface goes to RF Module (IC3) through DECT BBIC (IC2) as shown in BLOCK
DIAGRAM (BASE UNIT) (P.43)
The voice signal passes through the analog part of IC2 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC3, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from
antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
15.4.2. Receiver Block

The signal of 1.9 GHz band (1.881792 GHz ~ 1.897344 GHz) which is input from antenna is input to IC3 as shown in BLOCK
DIAGRAM (BASE UNIT) (P.43).
In IC3, the signal of 1.9 GHz band is demodulated, and goes to IC2 as GAP (Generic Access Profile) standard DECT frames.
It passes through the decoding section burst switch controller where it separates out the frame information and performs de-
encryption and de-scrambling as required. It then goes to the DSP section where it is turned back into analog audio. This is
amplified by the analog front end, and goes to the TEL LINE Interface.
15.5. Pulse Dialling

During pulse dialing the hookswitch (Q2, Q3) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the pause intervals between dial pulses, the PULSE_DIAL signal turns
on Q7.
46
16 BLOCK DIAGRAM (HANDSET)
ANT
42 Speech Burst
12 RXDA
EARPIECE D/A Decoding Decoding 19
41
Speech Burst 16 TXDA
46 4
Encoding Encoding RF
MIC 45 A/D
Module
48 RSSI
5
ADPCM RF 23 SYRI IC3
Codec Interface 12
Analog 13 SYEN
Filter 10
Front
End
DSP BMC
TP5 + 33 XTAL
CHARGE CHARGE CHARGE 38
CONTACTS CIRCUIT 10.368
CHARGE DETECT 27
MHz
TP6 31
6 SCL 67
EEPROM ON SWITCH
IC2 5 SDA 66 26
34
Battery+
VDDBAT 36
53~55, 59, 60
BATTERY SWITCHED
TERMINAL ROWS
SUPPLY SWITCH 28
CPU 17~21 KEYPAD
Battery- COLUMNS
4.0V
D3
VDDLR 37
4.0V
IC4
pin 2, 5~9
LCD COM 0~5 RINGER
14 Seg segment 0~29 70
Display BBIC Q104
pin1, 90~100, 87, 78~84,
72~76, 61, 62, 56~58 88
4.0V
LED101 LED102
Q4 KX-TGA110 BLOCK DIAGRAM (HANDSET)
47
17 CIRCUIT OPERATION (HANDSET)

17.1. Outline
Handset consists of the following ICs as shown in BLOCK DIAGRAM (HANDSET) (P.47).
DECT BBIC (Base Band IC): IC4
All data signals (forming/analyzing ACK or CMD signal)
All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD)
RF Module: IC3
PLL Oscillator
Detector
Compress/Expander
Amplifier for transmission and reception
EEPROM: IC2
Temporary operating parameters (for RF, etc.)
17.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY (2.2 V ~ 2.6V: TP3) 4.0V IC3 (6, 25), D3 IC4 (37) IC4 (39, 63) (2.65V)
The Reset signal generates R19, C23 and 2.65V.
17.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+ (5.5V ~ 6V) D4 R43, R44 CHARGE+ (Base) CHARGE+ (Handset) L4 Q2 F1 BATTERY+... Battery...
BATTERY- R21 GND L5 CHARGE- (Handset) CHARGE- (Base) GND DC- (GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q2 of Handset.
Refer to Fig.101 in Power Supply Circuit (P.45).
17.4. Battery Low/Power Down Detector

Circuit Operation:
Battery Low and Power Down are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
Battery Low
Battery voltage: V (Batt) < 2.3V
The BBIC detects this level and starts flashing and battery alarm starts ringing.
Power Down
Battery voltage: V (Batt) < 2.2V
The BBIC detects this level and power down.
48
18 CIRCUIT OPERATION (CHARGER UNIT)

18.1. Power Supply Circuit
The power supply is as shown.
49
19 SIGNAL ROUTE
50
20 CPU DATA (BASE UNIT)

20.1. IC2 (BBIC)
Pin Description I/O Hi Hi-z Low Remarks
1 VDD - - - - -
2 VSS - - - - -
3 PA_Driver_Amp D.O PA_ON - PA_OFF -
4 TX/RX SW D.O TX - RX -
5 RX_Data D.I Data - Data -
6 PLL_Strobe D.O Latch - Normal -
7 PLL_Data D.O - - - -
8 PLL_Clk D.O - - - -
9 TX_Data D.O - - - -
10 (NO USE) D.O - - - -
11 RF_System_Clk D.O - - - -
12 VDD - - - - -
13 VSS - - - - -
14 RESETQ A.I Normal - Reset -
15 VDDPM D.O - - - -
16 VSSO D.I - - - -
17 LOAD A.I - - - -
18 XTAL A.I - - - 10.368 MHz
19 VDDLR A.I - - - -
20 LRB A.I - - - -
21 VDDA - - - - -
22 VSSA - - - - -
23 Audio_Out_N A.O - - - -
24 Audio_Out_P A.O - - - -
25 Bandgap_Ref A.I - - - -
26 Differential_Line_P A.I - - - for Bell Clip
27 Differential_Line_N A.I - - - for Bell Clip
28 Audio_In_N A.I - - - -
29 ADC_Ref A.I - - - -
30 RSSI A.I - - - -
31 AD2(MPCINP) A.I - - - for Polarity
32 AD3 A.I - - - for Polarity
33 (NO USE) D.I (I_PU) - - -
34 (NO USE) D.I (I_PU) - - -
35 (NO USE) D.I (I_PU) - - -
36 (NO USE) D.I (I_PU) - - -
37 VDD - - - - -
38 VSS - - - - -
39 Supply_EEP D.O (Fixed) - - -
40 Serial_Data(I2C) D.I/O - - - -
41 Serial_Clk(I2C) D.O - - - -
42 MODE D.I - - (Fixed) -
43 (NO USE) D.O - - (Fixed) -
44 (NO USE) D.O - - - -
45 VBACK A.I - - - -
46 (NO USE) - - - (I_PD) -
47 (NO USE) D.I - - (Fixed) -
48 VDD - - - - -
50 (NO USE) D.I (Fixed) - - -
53 VSS - - - - -
54 VDD - - - - -
55 KEY_IN D.I No Key - Key -
56 (NO USE) D.I/O - - (I_PD) -
57 PULSE_CTRL D.I/O Q7_ON - Q7_OFF -
58 (NO USE) D.I/O - - (I_PD) -
59 (NO USE) D.I/O - - (I_PD) -
60 (NO USE) D.I/O - - (I_PD) -
61 HOOK_CTRL D.O Make - Break -
62 (NO USE) D.I/O - - (I_PD) -
51

63 ANT1 D.O ANT1_ON - ANT1_OFF -
64 ANT2 D.O ANT2_ON - ANT2_OFF -
Note:
I_PU; Internal Pull-Up, I_PD; Internal Pull-Down
52
21 CPU DATA (HANDSET)

21.1. IC4 (BBIC)
1 LCD_SEGMENT D.O - - - -
2 LCD_COMMON D.O - - - -
3 VDD - - - - -
4 VSS - - - - -
10 PA_SW D.O PA ON - PA OFF -
11 T/R SW D.O Transmit - Recieve -
12 RX_DATA D.I - - - -
13 SYEN D.O - - - -
14 SYDA D.O - - - -
15 SYCL D.O - - - -
16 TX_DATA A.O - - - -
17 KEY_IN D.I No Key - Key_In -
22 (NO USE) D.O - - - -
23 Reference clock D.O - - - -
24 VDD - - - - -
25 VSS - - - - -
26 POWER_SW A.I SW OFF - SW_ON -
27 CHARGE_DET A.I Charge - No_charge -
28 DCDCDRV D.O - - - -
29 DCDCCMR A.I - - - -
30 RESET A.I Non Active - Active -
31 VSSO - - - - -
32 LOAD A.I - - - -
33 XTAL A.I - - - -
34 VDDPM A.O - - - -
35 VDDLO A.O - - - -
36 VDDBAT A.I - - - -
37 VDDLR - - - - -
38 CHARGE_START A.O - - - for charge
39 VDDA - - - - -
40 VSSA - - - - -
41 LSRN A.O - - - -
42 LSRP A.O - - - -
43 BANDGAP_REF A.O - - - -
44 MICS A.O - - - -
45 MICP A.I - - - -
46 MICN A.I - - - -
47 Reference Voltage A.O - - - -
48 RSSI A.I - - - -
49 P0.4 D.I - - - -
50 AD4N A.I - - - -
51 AD4P A.I - - - -
52 (NO USE) D.I - - - -
53 KEY_STRB D.O Active - - -
54 KEY_STRB D.O Active - Non_Active -
53

63 VDD - - - - -
64 VSS - - - - -
65 VDD for EEPROM D.O - - - -
66 I2DAT D.I/O - - - -
67 I2CLK D.I/O - - - -
68 MODE D.I - - - -
69 R2 D.I - - - -
70 RINGER D.O RINGER_ON - RINGER_OFF -
71 VBACK/P0.7 D.I - - - -
77 VDDLI - - - - -
85 VSS - - - - -
86 VDD - - - - -
88 LED_ON D.O LED_ON - LED_OFF -
89 Power Select D.O Low Power - High Power -
54
22 ENGINEERING MODE
22.1. Base Unit
Note:
(*1) Refer to For Service Hint (P.11).
55
Note:
*: When you enter the address, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [R] + 0
1 1 B [R] + 1
. . C [R] + 2
. . D [R] + 3
. . E [R] + 4
9 9 F [R] + 5
ex.)
Items (*2) Address Default Data New Data Remarks
C-ID (FSK) 0A1D~0A1E 00 6D (3dB up) (6dB up) When hex changes from 006D to 00A4 or
sensitivity 00 A4 00 E7 00E7, gain increases by 3dB or 6dB.
C-ID (DTMF) 0A 2D 34 (3dB up) (6dB up) When hex changes from 34 to 38 or 3C, gain
sensitivity 38 3C increases by 3dB or 6dB.
Frequency 00 00~00 01 00 60 - - Use these items in a READ-ONLY mode to confirm
ID 00 20~00 24 Given value - - the contents. Careless rewriting may cause serious
damage to the computer system.
Bell length 0F 12 64 (10sec) (*1) 1E (3sec) 14 (2sec) This is time until bell stops ringing. (Unit: 100ms)
PULSE Dial speed 0F 06 21 (33msec) (*1) 14 (20msec) - This is pulse make time. (Unit:1ms)
(10PPS -> 20PPS) 0F 07 43 (67msec) (*1) 1E (30msec) - This is pulse break time. (Unit:1ms)
0F 0A 4A (740msec) (*1) 2C (440msec) - This is inter-digit time in pulse mode. (Unit:10ms)
(*1)
Bell length 64 (hex) = 100 (dec) 100 100msec = 10000msec (10sec)
PULSE Dial speed 21 (hex) = 33 (dec) 33 1msec = 33msec
(10PPS -> 20PPS) 43 (hex) = 67 (dec) 67 1msec = 67msec
4A (hex) = 74 (dec) 74 10msec = 740msec
(*2)
Items Description
C-ID (FSK) sensitivity FSKGain_shiftgain
C-ID (DTMF) sensitivity Foutgains:HPFilter Foutgains
Frequency Setting value of FREQ_TRIM_REG
ID ID
Bell length Time until it stops bell.
PULSE Dial speed Pulse MakeTime and BreakTime.
(10PPS -> 20PPS) bMakeTime:Pulse MakeTime Unit: 1ms
bBreakTime:Pulse Break Time Unit: 1ms
Inter-digit time in Pulse mode.
Unit:10ms
56
22.2. Handset
Note:
(*1) Refer to For Service Hint (P.11).
57
Note:
*: When you enter the address, please refer to the table in Note: (P.56) of ENGINEERING MODE.
ex.)
Items (*4) Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Sending level 0F 35 Adjusted value Given value 30 00 (*1)
Receiving level 0F 37 Adjusted value Given value 70 40 (*2)
Battery Low 0F 04 9A - - -
Frequency 00 00~00 01 00 60 - - - (*3)
ID 00 30~00 34 Given value - - -
(*1) When adding 01 (hex) to default value, sending level (*2) When reducing 01 (hex) from default value, receiving
increases by 1.0dB. level increases by 1.0dB.
ex.) ex.)
Item Default Data New Data Item Default Data New Data
1C 1D 1B 5B 5A 5C
Sending level -7.5dBm -6.5dBm -8.5dBm Receiving level -23dBm -24dBm -22dBm
(*3) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
Handset.
(*4)
Items Description
Sending level Analog Front End MIC Setting for Handset Mode
Receiving level Analog Front End LSR Setting for Handset Mode
Battery Low ADC value for battery low detection
Frequency Setting value of FREQ_TRIM_REG
ID International Portable Part Equipment Identities
58
23 HOW TO REPLACE THE FLAT PACKAGE IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),
a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
23.1. Preparation
PbF (: Pb free) Solder
Soldering Iron
Tip Temperature of 700F 20F (370C 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.4).
23.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder
is left at the joint on the board, the new IC will not be attached properly.
59
23.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering

foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
23.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
60
24 CABINET AND ELECTRICAL PARTS (BASE UNIT)
61
25 CABINET AND ELECTRICAL PARTS (HANDSET)
Note:
(*1) The rechargeable Ni-MH battery P03P (HHR-4EPT, Capacity: up to 750 mAh) is available through sales route of
Panasonic.
(*2) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.17).
(*3) Attach the spacer (No. 117) to the exact location described above.
62
26 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
63
27 ACCESSORIES AND PACKING MATERIALS

27.1. KX-TG1100HGS/HGT
Note:
(*1) This pad is a piece of Ref No. P3 (GIFT BOX).
(*2) These pads are pieces of Ref No. P4 (CUSHION).
64
27.2. KX-TG1102HGS
Note:
(*1) These pads are pieces of Ref No. P4 (GIFT BOX).
(*2) These pads are pieces of Ref No. P5 (CUSHION).
65
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND

DIODES
28.1. Base Unit
28.2. Handset
28.3. Charger Unit
66
29 REPLACEMENT PARTS LIST

1. RTL (Retention Time Limited) Ref. Part No. Part Name & Description Remarks
No.
Note: 5 PQKE10356Z2 GUIDE, CHARGE TERMINAL POM-HB
The marking (RTL) indicates that the Retention Time is 6 PQKF10581Z3 CABINET COVER (for KX- PS-HB
TG1100HGS) (for KX-TG1102HGS)
limited for this item. 6 PQKF10581Z2 CABINET COVER (for KX- PS-HB
After the discontinuation of this assembly in production, TG1100HGT)
7 PQHA10023Z RUBBER PSRTS, FOOT CUSHION
the item will continue to be available for a specific period
8 PQGT18836Z NAME PLATE (for KX-TG1100HGS)
of time. The retention period of availability is dependant (for KX-TG1102HGS)
on the type of assembly, and in accordance with the 8 PQGT18836X NAME PLATE (for KX-TG1100HGT)
laws governing part and product retention. After the end
of this period, the assembly will no longer be available. 29.1.2. Main P.C.Board Parts
2. Important safety notice Note:
Components identified by the mark indicates special (*1) When replacing IC1 and IC2, data needs to be written
characteristics important for safety. When replacing any of to it with PQZZTG1100HG.
these components, only use specified manufactures parts.
Ref. Part No. Part Name & Description Remarks
3. The S mark means the part is one of some identical parts. No.
For that reason, it may be different from the installed part. PCB1 PQWPG1100HGH MAIN P.C.BOARD ASSY (RTL)
(ICs)
4. ISO code (Example: ABS-94HB) of the remarks column IC1 PQWICD150EH IC (EEPROM) (*1)
shows quality of the material and a flame resisting grade IC2 C2HBAK000012 IC (BBIC) (*1)
about plastics. Q9 C0CBAYF00016 IC
(TRANSISTORS)
5. RESISTORS & CAPACITORS Q2 B1ACGP000007 TRANSISTOR(SI)
Unless otherwise specified; Q3 PQVTBF822T7 TRANSISTOR(SI)
Q6 2SD1994A TRANSISTOR(SI)
All resistors are in ohms () K=1000, M=1000k Q7 B1ABCE000009 TRANSISTOR(SI)
All capacitors are in MICRO FARADS (F)P=F Q8 B1ADGE000004 TRANSISTOR(SI)
(DIODES)
*Type & Wattage of Resistor D2 B0EDER000009 DIODE(SI)
D3 PQVDRLZ20A DIODE(SI) S
D4 B0JAME000095 DIODE(SI)
D5 MA2Z74800L DIODE(SI)
D7 PQVDRLZ3R9A DIODE(SI) S
D8 PQVDRLZ3R9A DIODE(SI) S
DA1 B0DDCM000001 DIODE(SI)
(JACKS)
J1 K2LB102B0053 JACK, MODULATOR
J2 PQJJ1B4Y JACK, DC S
(COILS)
L1 PQLQR4D4R7K COIL S
L3 G1C4N7Z00007 COIL
(RESISTORS)
R1 ERJ3GEYJ155 1.5M
R2 ERJ3GEYJ155 1.5M
R3 ERJ3GEYJ224 220K
R4 ERJ3GEYJ184 180K
R5 ERJ3GEYJ224 220K
R6 ERJ3GEYJ184 180K
R7 ERJ3GEYJ104 100K
R8 ERJ3GEYJ272 2.7K
R9 ERJ3GEYJ103 10K
R10 ERJ3GEYJ222 2.2K
R16 ERJ3GEYJ133 13K
R18 ERJ3GEYJ392 3.9K
29.1. Base Unit R19

R20
ERJ12YJ220
ERJ12YJ560
22
56
R21 ERJ3GEYJ104 100K
29.1.1. Cabinet and Electrical Parts R22 ERJ3GEYJ333 33K
R23 ERJ3GEYJ680 68
R24 PQ4R18XJ100 10 S
No.
R25 ERJ3GEYJ151 150
1 PQGG10245U7 GRILLE (for KX-TG1100HGS) ABS-HB
(for KX-TG1102HGS) R26 ERJ3GEYJ103 10K
1 PQGG10245U9 GRILLE (for KX-TG1100HGT) ABS-HB R27 ERJ3GEYJ681 680
2 PQQT23167Z LABEL, ATTENTION R28 ERJ3GEYJ751 750
3 PQKM10586W3 CABINET BODY (for KX- PS-HB R29 ERJ3GEYJ101 100
TG1100HGS) (for KX-TG1102HGS) R30 ERJ3GEYJ101 100
3 PQKM10586W2 CABINET BODY (for KX- PS-HB R31 ERJ3GEYJ101 100
TG1100HGT) R32 ERJ3GEY0R00 0
4 PQJT10203Z CHARGE TERMINAL R38 ERJ3GEYJ330 33
67
Ref. Part No. Part Name & Description Remarks Ref. Part No. Part Name & Description Remarks
No. No.
R41 ERJ3GEYJ101 100 IC3 PQLP10268Z RF UNIT
R42 ERJ3GEYJ221 220 S1 K0H1BB000018 SPECIAL SWITCH, TACTILE
R43 ERJ1WYJ330 33 SA1 J0LF00000026 VARISTOR (SURGE ABSORBER)
R44 ERJ1WYJ330 33 X1 H0D103500003 CRYSTAL OSCILLATOR
R57
R59
ERJ3GEYJ103
ERJ3GEYJ471
10K
470
29.2. Handset
R61 ERJ2GEJ470 47
R66 ERJ3GEYJ180 18 29.2.1. Cabinet and Electrical Parts
R67 ERJ3GEYJ151 150
R78 ERJ3GEYJ151 150 No.
R79 ERJ3GEYJ180 18 101 PQGP10311Z1 PANEL, LCD (for KX-TGA110EXS) AS-HB
101 PQGP10311Z3 PANEL, LCD (for KX-TGA110EXT) AS-HB
R85 PQ4R18XJ102 1K S 102 PQHS10737Z TAPE, DOUBLE SIDE
L5 ERJ2GE0R00 0 103 PQKM10722Z1 CABINET BODY (for KX- ABS-HB
(CAPACITORS) TGA110EXS)
C1 ECKD2H681KB 680P S 103 PQKM10722Z3 CABINET BODY (for KX- ABS-HB
C2 ECKD2H681KB 680P S TGA110EXT)
C3 ECQE2223KF 0.022 104 PQHS10738Z SPACER, LCD
C4 ECQE2223KF 0.022 105 PQBC10375Z1 BUTTON, NAVIGATOR KEY ABS-HB
C11 ECUV1C223KBV 0.022 106 PQSX10310W KEYBOARD SWITCH (for KX-
C12 PQCUV1C474KB 0.47 TGA110EXS)
C13 ECUV1A105KBV 1 106 PQSX10310Z KEYBOARD SWITCH (for KX-
TGA110EXT)
C14 PQCUV1C474KB 0.47
107 PQJT10204Z TERMINAL (L)
C15 ECEA1HKA100 10
108 PQJT10205Z TERMINAL (R)
C18 ECUV1H100DCV 10P
109 PQHG10684Z RUBBER PARTS, RINGER
110 L0DACD000002 BUZZER
C20 ECUV1C104KBV 0.1
111 PQKF10582YE CABINET COVER (for KX- ABS-HB
TGA110EXS)
111 PQKF10582Y8 CABINET COVER (for KX- ABS-HB
C24 ECUV1C104KBV 0.1 TGA110EXT)
C25 ECEA1CKS100 10 S 112 PQJC10056X BATTERY TERMINAL
C26 ECUV1C104KBV 0.1 113 PQJC10077Z BATTERY TERMINAL (-)
C27 ECUV1C104KBV 0.1 114 PQJC10076Y BATTERY TERMINAL (+)
C28 ECUV1C683KBV 0.068 115 PQGT18532Z NAME PLATE (for KX-TGA110EXS)
C29 ECUV1C683KBV 0.068 115 PQGT18532X NAME PLATE (for KX-TGA110EXT)
C30 ECJ0EB1E182K 0.0018 116 PQHX11393Z COVER, BATTERY COVER SHEET
C31 ECJ0EB1A104K 0.1 117 PQHS10561Y SPACER, BATTERY COVER
C32 ECUV1H270JCV 27P 118 PQKK10134XP LID, BATTERY COVER (for KX- ABS-HB
C33 ECUV1H1R0CCV 1 TGA110EXS)
C34 ECUV1C104KBV 0.1 118 PQKK10134XD LID, BATTERY COVER (for KX- ABS-HB
C35 ECUV1C333KBV 0.033 TGA110EXT)
C37 ECUV1C104KBV 0.1 29.2.2. Main P.C.Board Parts
C40 ECEA1CK101 100 S Note:
C41 ECEA0JKA101 100
C42 ECUV1H030CCV 3P
(*1) When replacing IC2 and IC4, data needs to be written
C48 ECUV1H330JCV 33P to it with PQZZTG1100HG.
C53 ECUV1H100DCV 10P (*2) When replacing the Handset LCD, see How to
C54 ECUV1H060DCV 6P S
Replace the Handset LCD (P.17).
C58 ECUV1H100DCV 10P Ref. Part No. Part Name & Description Remarks
C59 ECUV1H100DCV 10P No.
C66 ECUV1H020CCV 2P PCB100 PQWPGA110HGR MAIN P.C.BOARD ASSY (RTL)
C67 ECUV1A475KB 4.7 (ICs)
C69 ECUV1H100DCV 10P IC2 PQWICA115EXR IC (EEPROM) (*1)
C72 ECUV1H0R5CCV 0.5P IC4 C2HBAY000005 IC (BBIC) (*1)
C73 ECUV1H100DCV 10P (TRANSISTORS)
C77 F0C2E105A146 1 S Q1 B1CFMC000010 TRANSISTOR(SI)
C83 ECJ1VC1H1R5C 1.5P Q2 B1ADGE000004 TRANSISTOR(SI)
C94 ECUV1H0R5CCV 0.5P Q3 UNR9216J0L TRANSISTOR(SI)
C96 ECUV1H100DCV 10P Q4 PSVTDTC143X TRANSISTOR(SI) S
C97 ECUV1H100DCV 10P Q104 B1ABGE000006 TRANSISTOR(SI)
C98 PQCUV1H0R5CC 0.5P (DIODES)
C100 ECUV1H100DCV 10P D1 B0JCME000035 DIODE(SI)
C101 ECUV1H100DCV 10P D3 MA2Z74800L DIODE(SI)
C105 ECUV1H030CCV 3P D6 MA8047 DIODE(SI) S
C106 ECUV1H030CCV 3P D7 MA8047 DIODE(SI) S
L58 ECUV1H020CCV 2P D102 MA111 DIODE(SI) S
(OTHERS) LED101 B3ADB0000064 LED
E1 PQSA10132Z ANTENNA, SUB LED102 B3ADB0000064 LED
E2 PQSA10182Z ANTENNA, MAIN (COILS)
68
29.3. Charger Unit

No.
L2 G1C470M00025 COIL
L3 PQLQR4D4R7K COIL S 29.3.1. Cabinet and Electrical Parts
L4 G1C100MA0072 COIL
L5 G1C100MA0072 COIL Ref. Part No. Part Name & Description Remarks
F1 PQLQR2M5N6K COIL S No.
(RESISTORS) 200 PQLV30018ZS4 CHARGER UNIT
R1 ERJ2GEJ222 2.2K 200-1 PQGG10155YJ GRILLE ABS-HB
R2 ERJ8BQJR30 0.3 200-2 PQKM10591YC CABINET BODY PS-HB
R4 ERJ3GEYJ103 10K 200-3 PQKE10356Z2 GUIDE, CHARGE TERMINAL CASE POM-HB
R5 ERJ2GEJ331 330 200-4 PQJT10206Z CHARGE TERMINAL
R6 ERJ3GEYJ332 3.3K 200-5 PQHX10991Z CUSHION, URETHANE FORM
R7 ERJ2GEJ331 330 200-6 PQMH10426X WEIGHT
R8 ERJ2GEJ331 330 200-7 PQKF10586Z2 CABINET COVER PS-HB
R18 ERJ2GEJ330 33 200-8 PQGT18766W NAME PLATE
R19 ERJ2GEJ153 15K 200-9 PQHA10023Z RUBBER PARTS, FOOT CUSHION
R21 ERJ6RSJR10V 0.1
R101 ERJ2GEJ820 82 29.3.2. Main P.C.Board Parts
R102 ERJ2GEJ103 10K
R103 ERJ2GEJ102 1K Ref. Part No. Part Name & Description Remarks
R110 PQ4R18XJ150 15 S No.
R111 ERJ2GEJ560X 56 PCB200 PQWPA142ESCH MAIN P.C.BOARD ASSY (RTL)
R112 ERJ3GEYJ2R2 2.2 (DIODE)
(CAPACITORS) D1 B0JAME000085 DIODE(SI)
C1 F1K1C2250005 2.2 (JACK)
C3 ECJ0EB1A104K 0.1 CN1 PQJJ1B4Y JACK S
C4 ECJ0EB1A104K 0.1 (RESISTORS)
C5 PQCUV0J475MB 4.7 R1 ERJ1WYJ220 22
C6 ECJ0EC1H100D 10P R2 ERJ1WYJ270 27
C7 ECJ0EB1A104K 0.1
C8
C14
ECJ0EC1H100D
EEE0JA331P
10P
330
29.4. Accessories and Packing
C15 EEE0JA331P 330 Materials
C16 ECJ0EC1H010C 1P S
C18 ECJ0EB1A104K 0.1 Note:
C20 ECJ0EB1A104K 0.1
(*1) You can download and refer to the Operating
Instructions (Instruction book) on TSN Server.
29.4.1. KX-TG1100HGS/HGT
C26 ECJ0EB0J105K 1
C27 ECJ0EB1A104K 0.1 No.
C28 ECJ0EB1A104K 0.1 A1 PQLV19CEX AC ADAPTOR
C29 ECJ0EB1A104K 0.1 A2 PQJA10075Z CORD, TELEPHONE
C30 ECJ0EB1A104K 0.1 A3 PQQT23002Z LABEL, WEEE
C32 ECJ0EB1H101K 100P A4 PQQX15259Z INSTRUCTION BOOK (*1)
C33 F1K0J1060020 10 A5 PQQW15437Z LEAFLET, BATTERY
C34 F1K0J1060020 10 P1 PQPP10100Z PROTECTION COVER (for Base
C54 ECJ0EC1H220J 22P Unit)
C57 ECJ0EC1H330J 33P P2 PQPP10084Z PROTECTION COVER (for
C58 F1G1HR75A561 0.75P Handset)
C61 ECUV1A105KBV 1 P3 PQPK15242Z GIFT BOX
C67 ECJ0EC1H100D 10P P4 PQPD10726Y CUSHION
C68 ECJ0EC1H100D 10P
C204 ECJ0EC1H180J 18P 29.4.2. KX-TG1102HGS
(OTHERS)
MIC L0CBAY000006 MICROPHONE Ref. Part No. Part Name & Description Remarks
E101 PQHS10467Z COVER, SP NET No.
E102 L0AD02A00021 SPEAKER A1 PQLV19CEX AC ADAPTOR (for Base Unit)
E103 L5ACAYY00002 LIQUID CRYSTAL DISPLAY (*2) A2 PQLV200CEX AC ADAPTOR (for Charger Unit)
E104 PQHS10740Z TAPE, DOUBLE SIDE A3 PQJA10075Z CORD, TELEPHONE
E105 PQHX11388Z COVER, LCD COVER SHEET A4 PQQT23002Z LABEL, WEEE
E106 PQHR11226Z TRANSPARENT PLATE, LCD PLATE PMMA-HB A5 PQQX15259Z INSTRUCTION BOOK (*1)
E107 PQHR11225Z GUIDE, LCD HOLDER ABS-HB A6 PQQW15437Z LEAFLET, BATTERY
E108 PQSA10193Z ANTENNA P1 PQPP10100Z PROTECTION COVER (for Base
IC3 PQLP10268Z RF UNIT Unit)
D2 D4ED1270A014 VARISTOR (SURGE ABSORBER) P2 PQPP10084Z PROTECTION COVER (for
Handset)
X1 H0D103500006 CRYSTAL OSCILLATOR
P3 PQPP10086Z PROTECTION COVER (for Charger
Unit)
P4 PQPK15253Z GIFT BOX
P5 PQPD10667Z CUSHION
69
29.5. Fixtures and Tools

Note:
(*1) See The Setting Method of JIG (Base Unit) (P.29),
and The Setting Method of JIG (Handset) (P.37).
(*2) When replacing the Handset LCD, see How to
Replace the Handset LCD (P.17).
Part No. Part Name & Description Remarks
PQZZ1CD420BX I2C PCB (*1)
PQZZ1CD705BX RS232C CABLE (*1)
PQZZ2CD705BX CLIP CABLE (*1)
PQZZ3CD705BX DC CABLE (*1)
PQZZTG1100HG BATCH FILE CD-ROM (*1)
PQZZ430PIR TIP OF SOLDERING IRON (*2)
PQZZ430PRB RUBBER OF SOLDERING IRON (*2)
70
30 FOR SCHEMATIC DIAGRAM

30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagram may be modified at any time with the development of new technology.
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
30.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
71
31 SCHEMATIC DIAGRAM (BASE UNIT)
L2 +60V DC ON-HOOK
TP3 TP39
TP2 TP5
LINE VOLTAGE 60V DC NC +10V DC OFF-HOOK
JMP1 C63
NC NC 0V ON-HOOK
250V1.0
R77
+0.7V DC OFF-HOOK
680P/500V
C77
J1
C1
JMP6
NC
1 NC
TP45
2
R85
60v
1K
D2
3 Q2
(1)
SA1
4 DC R7
3.9V
D7
5
JMP7
NC
100K
C60
680P/500V
NC
6
C2
2.7K
R8
NC
C6
3.9V
D8
TP40
R70
NC
R73
NC
JMP2
Q3
NC +2.65V
JMP3 R10
JMP8
JMP5
NC
NC
R74
NC
NC
C62
NC 2.2K
C7 10K
R9
JMP4
NC
NC
220K
220K
NC
C5
R5
R3
Q11
OPTION4 R72
NC
C3 R1
RLY1
NC
NC
R71
NC
9 K0.022 1.5M
8 C4 R2
7
2
3 K0.022 1.5M
180K
180K
4
R4
R6
1 10
D1
R53
NC
NC
(2)
180K
C49
NC
R54
Q1
NC
D10P
D10P
C18
C19
(3)
R29
R30
100
100
(4)
R81
NC
(5)
180K
R82
C74
NC
(6)
(7)
(8)
+2.65V
J101 IC1
1
1 8
A0 VCC
J102
1
2
A1 WP
7
(9)
SDA
J103
1
3
A2 SCL
6
(10)
J104
4
GND SDA
5
(11)
SCL 1
J105
32K_EEPROM (12)
1
TP101 +4.0V DC
TP90 +5.5V Q9 TP91 +4.0V
J2
D4
1
LM1117
2
(13)
DC_PLUG 2 VIN VOUT
(14)
6.3V100
3 4
D10P
D10P
C100
C96
C41
C99
16V100
NC
ADJ VOUT
R41
GND 1
100
R59
C40
470
TP89
+5.5V
R42
220
C89
R68
R90
NC
NC
NC
NC
C3P
C42
CN4
1
N.M
C90 NC
D9
NC
2
C95
NC
C106
C3P
R89
C92
NC
R43
C91
NC
NC
Q10
33 NC
R44
2 CHARGE+
C107
33
NC
1 CHARGE-
, NC: No Components
72
(14)
(13)
(12)
(11)
(10)
(9)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
(1)
C23
K0.1
C24
K0.1
C26 C25
6.3V10
K0.1
C27
+2.65V
NC
R33
K0.1
R52 C28
NC K0.068
+2.65V DC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
TP187
R36
R1
R2
VSS
VDD
VDD
PX.3
PX.2
PX.1
PX.0
NC
I2CLK
I2DAT
MODE
2
3
NC
49 DSPIN/P1.0 AD3 32
SUPEEP
R11
TP97
Q4
50 DSPOUT/P1.1 AD2(MPCINP) 31
S1
NC
51 DSPCLK/P1.2 ADRSSI 30
1
4
52 DSPFRM/P1.3 ADREF 29
R31 C20
C38 53 VSS AIN 28
C50 54 VDD DLN 27 C29 TP82 100 K0.1
55 P0.0 DLP 26 C9 R13
K0.1 K0.068
56 P0.1 BREF 25
NC
NC
C21
R12
D10P
57 P0.2 AOP 24
IC2
NC NC
BBIC
58 P0.3 AON 23 C30
C31
NC
59 P0.4 VSSA 22
R58
47:P1.4(TONE)
K1800P
45:VBACK/P1.5
60 P0.5 VDDA 21
46:VSS(DSPCLK)
K0.1
Q8
61 P0.6 LRB 20
Q5
NC
62 P0.7 VDDLR 19
R61 47
+2.65V
63 ANT1 XTAL 18
NC
NC
64 ANT2 LOAD 17
R15
R14
1V
TX-AF
VDD
VSS
DRON
RXDSG
RXDA
SYEN
SYDA
SYCL
TXDA
PAON
SYRI
VDD
VSS
RESETQ
VDDPM
VSSO
0
R32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TP50
D10P
C32
C101
C33
C103
C10
C1P J27P C22
X1 NC
C37
C97 NC
K0.1 10.368MHz D11 NC NC C11 D3
D10P C36 R35
NC K0.022
K0.1 D10
C35 R57 NC R17 R16
D5
K0.033 10K NC 13K
+2.65V
C12
C34
0V ON-HOOK
FREQ 10.368MHz
K0.1 K0.47
R18
3.9K
R20 R19
68
R23
56 22
Q6
+9.8V DC OFF-HOOK
0
L5
R21
100K
NC
R55
R22
NC
73
R56
C80
NC 33K
NC
C79
C51 R92 R91
NC NC NC
C14 C13 D12 D13 NC

1
2
K0.47 K1.0 NC NC
1608size D6
R24
10
Q7
R26
0V ON-HOOK
C53
RX-AF
150
10K
R25
C98
TP188
D10P
680
R27
C0.5P
+3.9V DC OFF-HOOK
C43
NC
150
C15 R28
R67
L4
33
NC
R38
C94
50V10 750
C68 C105 C3P C16
C0.5P
RX-DATA
C102
NC C93 NC
C69 NC
C17
NC
18
D10P C81
R66
NC
1
TX-DATA
A201
NC
C78
TP10
C56 D10P C55 NC

C54
C6P
NC C47 C82
8
7
6
5
4
3
2
1
C59 C58
NC
L83
NC NC
GND
GND
GND
GND
RSSI D10P R78
SYCL
D10P
TXDA
9 SYDA GND 32
L1
VCC_OC
10 SYEN A_1 31 C71 NC
4.7uH
NC C70 150
C48 11 RXDSG GND 30 C83
12
C57
SYRI GND 29
J33P 13 GND GND 28
DA1
IC3
14 GND GND 27
NC C1.5P R79
RF_UNIT
15 GND GND 26
16 GND VCC_PA 25 18
TP1
NC
L85
NC
R88
L3
GND
GND
RXDA
GND
GND
PSEL
PAON
GND
17
18
19
20
21
22
23
24
C88 4.7nH C84

L58
C2P
NC NC
R87
C87 L59 C86
peak
C73
1
10.368MHz burst
+3.1V
NC
A202
C72 NC NC NC
C66 D10P
C0.5P ANT
C2P
C67
K4.7
NC C76
, NC: No Components
KX-TG1100/1102HG SCHEMATIC DIAGRAM (BASE UNIT)
32 SCHEMATIC DIAGRAM (HANDSET)

Frequency 324kHz
4.3V
4.1V DC
2.4V 0V 4.0V 4.0V
BATT
F1 L2 D1
1 2
5.6n
(1)
47u
3216size
3216size
330u
330u
C15
C33
C14
10u
C34
6.3
10u
6.3
10
BATTERY+ S G G G G
G R111 56
D (2)
BATTERY- Q1
(3)
R2 0.3
10k
100m
G
R4
R21
G
R6 3.3k
(4)
TP5
L4 Q2
2
10u
(5)
CHARGE+ (6)
2
A
2.2u
2.65V
NC
D2
C1
D4
CHARGE- L5
K
1
E
K
NC
B
D5
Q3 SDA
C IC2
A
SCL 1 8
TP6 G A0 VCC
GND 2 7
G A1 WP G
3 6
A2 SCL
4 5
0V VSS SDA
G (7)
EEPROM
TP22
PX4
PX3
PX2
PX1
PX0
G
PL12
PL11
PL10
PL9
PL8
PL7
PL6
PL5
PL4
PL3
PL2
PL1
PL0
R11 NC
LCD Back Light LED G
VBACK+ G
100n
C22
10
100n
C27
4.0V VBACK
10
C3
100n G
G 10
LED102
LED101
1
1
2
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PL12/P1.0
PL11/A9/MTSR
PL10/A8/MRST
VDDLI
PL9/A13
PL8/A14
PL7/BSEL1
PL6/BSEL0
PL5/A15
VBACK/P0.7
R1/P1.6
R2/P1.7
MODE
I2CLK
I2DAT
SUPEEP
VSS3
VDD3
PL4/A12
PL3/A7
PX4
PX3
PL2/A6
PL1/A5
PL0/A4
PX2
PX1
PX0
P0.3/DSPIN
P0.6/AD4P/
DSPOUT
G
PL13 81 50
PL13/P1.1 P0.5/AD4N/DSPFR
82
PL14 82 49
PL14/P1.2 P0.4/ADBAT/DSPCLK
PL15 83 48
PL15/A11/SCLK 0V 2.65V ADRSSI (8)
R101
PL16 84 47
85
PL16/A10
0V ADREF
46 (9)
C21 100n VSS4 MICN (10)
G
86 45
VDD4 MICP (11)
87 2.65V 44
G
3 PL17 10 PL17/CSRAQ MICS (12)

1 88 43
89
P0.0/RXD/BMCTEST1 BREF
42 (13)
2 P0.1/TXD/BMCTEST0
0V HOP (14)
R102 10k
Q4 PL18 90 41
91
PL18 HON
40 (15)
G
IC4
G
PL19 PL19 VSSA
PL20 92 2.65V 39
PL21 93
PL20/OERAQ
BBIC VDDA
38 (16)
G PL21/WRRAQ CHARGE_START/P0.2 (17)
PX4
PX3
PX2
PX1
PX0
PL22 94 37
PL23 95
PL22/CSRAQ/PWM VDDLR
36 (18)
PL35
PY4 PY4
PL24 96
PL23/BSEL2 VDDBAT
35 (19)
1 CN2 PL24/D7 VDDLO
2 1 1 2 1 2 1 2 1 2 PL25 97 34
2 CN2
PL34
PL26 98
PL25/D6 VDDPM
33 (20)
PL33 S8 S14 S19 S24 S7 PL27 99
PL26/D5
2.65V 0V XTAL
32 (21)
PAON/TXSWON
3 CN2 2 8 1 9 CANCEL PL28 100

PL27/D4 LOAD
31 (22)
PL32 PY3 PL28/D3 VSSO (23)
DCDCCMR
DCDCDRV
4 CN2
RESETQ
PL29/D2
PL30/D1
PL31/D0
PL32/A0
PL33/A1
PL34/A2
PL35/A3
RXDSG
PL31 1 2 1 2 1 2 1 2
ONSW
DRON
RXDA
SYEN
CN2
SYDA
VDD1
VDD2
TXDA
SYCL
5
VSS1
VSS2
SYRI
CDT
PY0
PY1
PY2
PY3
PY4
PL30 S13 S15 S20 S18

6 CN2
PL29 5 7 4 #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
7 CN2 PY2
R19
PL28
100n
C23
8 CN2 1 2 1 2 1 2 1 2 1 2
10
PL27 G G
9 CN2 G
15k
S6 S17 S2 S4 S11
PL26 LEFT 0 TALK 3 UP
10 CN2 PY1
PL25 (24)
100n
C20
11 CN2
100p
C32
10
1 2 1 2 1 2 1 2
50
PL24
12 CN2 G
PL23 S25 S22 S23 S9 G G (25)
13 CN2
100n
R BOOK INT PROG (26)

C18
PL22
10
14 CN2 PY0
PL21
PL29
PL30
PL31
PL32
PL33
PL34
PL35
15 CN2 1 2 1 2 1 2 1 2 1 2 (27)
TP23
PL20
16 CN2 S1 S16 S5 S3 S21
PL19 DOWN * REDIAL 6 RIGHT
17 CN2
PL18
18 CN2
PL17
PY0
PY1
PY2
PY3
PY4
19 CN2
PL16
20 CN2
PL15
21 CN2
PL14
22 CN2
PL13
23 CN2
PL12
24 CN2
PL11
25 CN2
PL10
26 CN2
PL9
RXDSG
27 CN2
RXDA
SYEN
PAON
SYDA
TXDA
SYCL
PSEL
SYRI
PL8
28 CN2
PL7
29 CN2 (28)
PL6
30 CN2
PL5
31 CN2
PL4
32 CN2
PL3
33 CN2
PL2
34 CN2
PL1
35 CN2
PL0
36 CN2
NC: No Components
74
(1)
1
D3
2
(2)
(3)
4.0V
(4)
C108
NC
(5)
R110 15
(6) G
TP101
C116
D102
2
NC
TP102
1
R103 1k 3
1
(7)
2
Q104
TX-AF
(8) 100n MIC+
C4
G
(9) C30 100n C8 10p R8 C7 10

330 100n MIC
(10) C6 10p R5 330 10 1
(11)
G
2
(12)
G
(13) C29 100n R7 330 R1 2.2k

2125size
4.7u
MIC-
C5
(14) G
(15) G
G
C28 100n
(16) 1.8V DC IN TALK MODE
(17)
(18)
(19) R26 NC
TP1
C26
6.3
1u
C68
C67
10p
10p
50
50
(20) R27 NC A201

(21) G TP2
100n
C24
C16 C204
(22)
K
0.75p
D6
D7
C58
(23)
50
1p 18p
G RX-AF TP15 4.0V
A
G G
G
C62 NC
R12 NC
3 1
4.0V
X1 G
32
31
30
29
28
27
TP16 TP17
R113 NC
2
GND19
A_1
GND18
GND17
GND16
GND15
G
1 2
R112 2.2
TX-DATA
(24) 1
GND1 GND14
26
S10
C64 NC
C65 NC
C61 1u
2 25
POWER GND2 VCC_PA
(25) 3 24
GND3 GND13
(26) TXDA R17 NC 4 23
TXDA PAON
C56 NC
RSSI R18 33 5 22
(27) RSSI PSEL
C55 NC
6
VCC_OC
IC3 GND12
21 G
7
RF_UNIT 20 G
GND4 GND11
1V SYCL 8 19
SYCL RXDA
SYDA 9 18
SYDA GND10
C71 NC
Frequency 10.368MHz SYEN 10

SYEN GND9
17
C201 NC
C202 NC
C203 NC
C54 22p
C60 NC
C66 NC
RXDSG
GND5
GND6
GND7
GND8
G
SYRI
11
12
13
14
15
16
G
RXDSG
G
L3 TP19
SYRI
4.7u
C57
33p
50
RXDA
PAON
PSEL
RSSI
G
(28)
NC: No Components
KX-TGA110 SCHEMATIC DIAGRAM (HANDSET)
75
33 SCHEMATIC DIAGRAM (CHARGER UNIT)

R1
TP3
TP4 22
D1
DC_PLUG 2 R2
TP1 Charge_plus
27
pinL 1 TP2 Charge_minus
J1
SCHEMATIC DIAGRAM (CHARGER UNIT)
76
34 CIRCUIT BOARD (BASE UNIT)
34.1. Component View
X1
(BBIC: 18 RESET Q9 Q9
10.368MHz) (BBIC: 14) (5.5V)(4.0V)
R85 A201
JMP2 C96 C81

JMP6 R42
C84
C82
JMP5 L59
SA1 J1 R41 C87
JMP7 D7 C5
C77 58
JMP8 D8 D4 J2 C58 DA1
4 L
R79 C59
Q9 R78
C70 C73
L3 C71
RLY1 L2 R81
C55 C57 C83 ANT
L83 L85 28 C56
R82 R53 C42 R66 1
JMP4 JMP3 JMP1
R77 C3 C74 C41 C66
C76
R54 C102 (4.0V)
D1 C63 R1
C49 C40 C67 C86
R6 C100 C43
Q1 C2 C4 R5
C5 C98 C72
R4 R71 C53
R3 Q11
R2 A202
R74 L4 R38 R87
C1 R70 IC3 IC3
R72
C69
C78
R73 C68 (RF Module)
S1 R7 D2 C60 C62
C88
77
C7 C93
B C E
Q2
R8 R9
L5 PbF C94 R88
R11 R12 D3 Q3 C37
C6 C101
C10 11 18

D13 R26 R10 D11 C97 C48
Q4 R91 R24 Q7
R58 C50 C47
L1
R27 R59 C36
D6 C79 R57 1 64 RF VOLTAGE
C9 D12 C14 D5 C38 C89
C13 R23 D10 C35 R67 C105 R43
R22 R32
R92
R13 R35 C34 R36

R14 R21 C80 C22
B 49 C106
16 R44
Q6 C
R16 C11 C33 17 IC2 48 C27
R18 R17 C32 C107
R15 C15 E R68
R90
R56 R61 R33
C30 C31 C90 C95
C51 X1
R19 R30 32 33 R52
R25 R28 R55 C29
C103 C23 5 4 D9
Q5 C19 C26
C16 R20 C12 Q8 C18 CN4
C24 R29 8 1 C92
C17 R31
KXTCD150H/KXTG1100H C20 C21 IC1
C25 C28 Q10
R89
PQUP11175W C91 B
Q8 Collector IC2
(2.65V) (BBIC)
KX-TG1100/1102 CIRCUIT BOARD (BASE UNIT) Component View

34.2. Flow Solder Side View
RF clock
(BBIC: 11 10.368MHz)
+2.65V
SDA
SCL
VBACK
GND
TP82 TP187
PbF CHARGE
CHARGE
TP97
TP50
TP1
TP10
TP45
78
TP188
C99
TP91
TP89
4 TP2
TP40 6 2
TP39 TP3
1
TP90 TP101
TP5
Q9 input Q9 output
(5.5V) (4V)
KX-TG1100/1102 CIRCUIT BOARD (BASE UNIT) Flow Solder Side View
35 CIRCUIT BOARD (HANDSET)
TP3 IC3
BATTERY+ BATT (RF Module)
D5
BATT TP15
KX-TG1100/KX-TGA110
A201
X1
C58
C1
PbF
TP5
C18
TP17
TP16
R19
C20 L2
LED101 1
TP23
C64 C61 C56 C55

L4 R111
D4
C16 C23 C32 C65

F1
R12
R113
30 1
C204 C26 C28 C29 C8
31 Q1 R17
D2 C24 100
C108
Q2 C54
79
C33
C62
D1
R110
MIC- MIC+
R6
TP101
R2
R18
Q3
C116
R112
BUZ
C4 IC4 C14 IC3
Q104
C60
C6 R102
C66
D102
TP102
C21

R1
R5
R103
D3
Q4
C201 C203
C7 R8
81
C71
C5
50
R7 C30 51 80
C202
TP1
R21 R101
4.0V
C3
C22 R11 C27

TP22
D6 REV
C67 D7
L5 R4 C15 R27
TP6
VBACK+
VBACK
1 8
C34
TP2
GND
LED102
C68
TP19
R26
GND
IC2 PQUP11406Z A
C57
L3
SDA
SCL
4 5
TP4 GND IC4 VDD 4V TP1: SP1 TP2: SP+ GND

BATTERY- (BBIC) (2.65V) (BBIC: 42) (BBIC: 41)
KX-TGA110 CIRCUIT BOARD (HANDSET) Component View
36
TALK
REDIAL
7 4 1 BOOK
PbF
R
LEFT
MIC 0 8 5 2 DOWN UP
80
RIGHT
INT
PROG
# 9 6 3 CANCEL
POWER
1
KX-TGA110 CIRCUIT BOARD (HANDSET) Flow Solder Side View
36 CIRCUIT BOARD (CHARGER UNIT)

J1
D1
PbF
PQUP11205Z
B
CIRCUIT BOARD (CHARGER UNIT) Component View
TP3
R1
R2
TP4
PbF
TP1
TP2
PQUP11205Z B
CIRCUIT BOARD (CHARGER UNIT) Flow Solder Side View
S/I
KXTG1100HGS
KXTG1100HGT
KXTG1102HGS
KXTGA110EXS
81 KXTGA110EXT

Panasonic KX Tg1100hg

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Panasonic KX Tg1100hg

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2006 Panasonic Communications Co., Ltd. All

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

1.1. Suggested PbF Solder

1.2. How to recognize that Pb Free solder is used

2 FOR SERVICE TECHNICIANS

4.1.2. Battery Charge

4.2. Location of Controls

4.3.1. Base Unit

4.4. Guide to Settings

4.5. For Service Hint

4.5.1. Registering a Handset to a Base Unit

4.5.2. Cancelling a Handset

Shown in Fig.- To Remove Remove

Shown in Fig.- To Remove Remove

5.3. Charger Unit

Shown in Fig.- To Remove Remove

6.2. How to Replace the Handset LCD

7.1. Check Power

Cross Reference Note:

Cross Reference Note:

7.2. Check Battery Charge

Cross Reference: Note:

7.2.3. Charger Unit

7.3. Check Link

7.4. Check Handset Transmission

7.5. Check Handset Reception

7.6. Check Caller ID

7.7. Bell Reception

Cross Reference: Note:

8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND

8.1. Check Point (Base Unit)

Items Adjustment Procedure Check or

Items Adjustment Procedure Check or

Items Adjustment Procedure Check or

Items Adjustment Procedure Check or

8.2. The Setting Method of JIG (Base Unit)

8.2.1.2. JIGs and PC

8.2.2.2. Batch file Settings

8.3.1. Component View

KX-TG1100HGS / KX-TG1100HGT / KX-TG1102HGS / KX-TGA110EXS / KX-TGA110EXT

R13 R35 C34 R36

8.4. Check Point (Charger Unit)

8.5. Adjustment Standard (Charger Unit)

8.5.1. Flow Solder Side View

9 TROUBLESHOOTING BY SYMPTOM (HANDSET)

9.1. Check Point (Handset)

Items Adjustment Procedure Check or

Items Adjustment Procedure Check or

9.2. The Setting Method of JIG (Handset)

9.2.1.2. JIGs and PC

9.2.2.2. Batch file Settings

LOOP BATTERY- BATTERY+ BAT GND

C64 C61 C56 C55

C204 C26 C28 C29 C8

Generator + MIC+ C4 C14 Q104 IC3

KX-TG1100HGS / KX-TG1100HGT / KX-TG1102HGS / KX-TGA110EXS / KX-TGA110EXT

C22 R11 C27

10 THINGS TO DO AFTER REPLACING IC

10.1. Base Unit

*: Refer to Check Point (Base Unit) (P.24)

**: Refer to Check Point (Handset) (P.34)

12 HOW TO CHECK THE HANDSET SPEAKER