FACULTY OF ENGINEERING & TECHNOLOGY

LAB SHEET

SEMICONDUCTOR PACKAGING AND TEST

EEN 4206

TRIMESTER 1 (2017/2018)

PT 2 Wire Bond Laboratory

Note: Students are advised to read through this lab sheet before doing experiment.

1
PROGRAMME OUTCOMES

PO PO statement

PO1 Acquire and apply knowledge of mathematics, science and engineering

fundamentals
PO2 Acquire technical competence in specialised areas of engineering
discipline to solve complex engineering problems
PO3 Identify and analyse complex engineering problems, and formulate
solutions based on fundamental principles of science and engineering
PO4 Design solutions for complex engineering problems that meet specified
needs with relevant considerations of their impacts in society
PO5 Conduct investigation and research on complex engineering problems in
the chosen field of study
PO6 Create, select and apply appropriate techniques, resources, and modern
engineering and IT tools to complex engineering activities
PO7 Demonstrate awareness of societal, safety and health, legal, and cultural
issues relevant to professional engineering practice
PO8 Understand the importance of sustainability and cost-effectiveness in
design and development of professional engineering solutions, and their
impacts in societal and environmental contexts
PO9 Apply and commit to professional ethics and responsibilities of
engineering practice
PO10 Communicate effectively in both oral and written contexts

PO11 Function effectively as an individual, and as a member or leader in a

team
PO12 Recognise the need for, and acquire the ability to engage in self-
improvement through continuous professional development and life-
long learning
PO13 Demonstrate management, leadership and entrepreneurial skills, and
apply these to one's own work, as a member and leader in a team, to
manage projects in multidisciplinary environments

2
LEARNING OUTCOMES

LO LO statement

LO1 Explain the process flow, equipment and tools used in semiconductor packaging (Cognitive
Understanding, Level 2)

LO2 Explain the product and package characteristics in terms of physical and electrical parameters,
including reliability, failure analysis, and electrostatic discharge (Cognitive Understanding,
Level 2)

LO3 Analyze, evaluate and optimize the materials and processes for semiconductor manufacturing
(Cognitive Evaluate, Level 5)

MAPPING OF ASSESSMENTS TO LEARNING OUTCOMES & PROGRAMME OUTCOMES

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PO13
Experiment 2

LO1 LO2 LO3

Experiment 2

3
 PT2: Wire Bond Laboratory

1. Objectives
To provide the opportunity to understand the wire bonding machine and process in
relation to the process parameters and process requirements.
To understand the correlation of the input parameter in relation to the output in wire
bonding.

2. Introduction
2.1. Front End to Back End Manufacturing Processes
Students are introduced to the IC manufacturing processes including the die attach,
wire bonding, molding, plating, IC testing, failure analysis and reliability test at Infineon
plant by the engineers.

2.2. Wire Bond Process

Students are given the instructions and explanation on the machine Model ASM IHAWK
Xtreme GoCu and its capabilities in Fig. 2. Some basic operation and setup of the
machine including introduction to wire bonding materials e.g. Au/Cu and bonding tools
capillary (in Fig. 3) and explanation of lead frame and key its features.

Figure 2. Wire bond machine Model ASM IHAWK Xtreme GoCu.

Machine Description
The ASM iHawk Xtreme Gold Wire Ball Bonder machine is the evolutionary leader in
the pitch and advanced packaging bonding. It is a computer controlled machine system
for bonding gold or copper wires that interconnect the dies to the leads or the substrate
4
in an integrated circuit package. The bonder converts digital coded operating
instructions (software) into controlled machine motions.

The dialog message and graphic displays on the bonder video monitor which are the
tools created by operating software to assist the user to interact and control the
machine. The user utilizes the function on the keypad and mouse to make the selection
within operating routines and bonding process program.

Figure 3. Setup of the machine ASM GoCu

Machine Start-up Sequence

It takes two steps to start-up Eagle Xtreme as following:
Step 1: Power on machine (green button) and turn on the Window XP.
Step 2: Run wire bond system software.

5
 Power On

Emergency Stop
Power Off

Start running bonder system software by clicking on McuXPStart.exe icon followed by

login into the system.

The initialize sequence flow for the system software as: System Initialization, Initialize
PGM, Initialize Bond & PRS, Calibrate BQM and display GUI.

6
Program Management
It allows the user to load/save/clear the bond program from local hard disk. It contains
the Bond Control Menu, Load Program Flow, Save Program Flow and Clear Program
Flow.

Program Teaching
This menu allows the user to teach a bond on its respective die pad and leads
according to the bonding diagram. It is necessary to conform to the procedure in order
to eliminate any wrong bond at real time bonding.
The functions include the Setup Pattern Recognition (PR) System, Indexing PR Setup,
Lead Manual Alignments Teaching, Lead PR Alignments Teaching, Teach Lead
Boundary, Specific Number of Die, Die Manual Alignments Teaching, Die PR
Alignments Teaching, Die Boundary and Teach Wire.
Bond Assistant Setup contains the Lead Contact Level, Die Contact Level, Bond Tip
Offset and USG Power (transducer calibration) in the system.

Bond Base/Loop Parameters

The limited base/loop parameter allow to access/change under user access right. The
dialog page components for normal wire 1st, 2nd, with bond parameters (Standby
Power, Contact Power, Contact Time (ms), Contact Force (g), Power Delay, Base Time
(ms), Base Power, Base Force (g), Power Factor and Force Factor (g)).

7
Loop General Parameters
Loop Height
This sets desired loop height. After user had selected the desired loop profile, once a
loop height is set, the machine will automatically calculate the best parameters suitable
for the loop height setting. It is recommendable to select Yes if the machine prompts
automatically calculate settings.

Span Length
It defines in length or as a percentage of total wire length. This is the location where a
bend is formed in the wire for a square type loop or penta type loop. This is generally
used for low and long loops to add stiffness to the loop and reduce wire sway.
Other parameters are 2nd Kink Height Factor and Loop Height Correction.

Loop height

Loop parameters
Under normal user access level, only few parameters are allow to access by user.

8
Auto Bond
Under Auto mode, this page will display all the parameters/status/setting that allow user
to control, set and manipulate the flow of auto bonding. Depend on the level user is
restrict to make illegal changes on the setting that can affect the quality and yield of the
bonding.

Schedule Bond
This function allows user start and stop bonding according to their schedule.

Start Wire and Stop Wire

Input the wire to start/stop schedule bond action on the particular sub-unit.

9
Define the wire to start and stop the schedule bond action

Wire Measurement
This advance function is advantage for user can use command in machine to do
measurement. Measurements are support to measure wire length, wire bend and loop
height.

2.3. ESD Control at Infineon Laboratory

Students are given the briefing on ESD attires, classes (10K and 100K) of cleanroom
and ESD control procedures by the Infineon engineers before they enter into the
laboratory.

10
3. Experiment Procedures:
Wire Bond Measurements
Briefing on processes involve in wire bonding at Infineon workstations. The
demonstration and data collection on ball size and ball height measurements in relation
to the machine input parameters. The students are required to do the analysis on these
parameters related to wire bond. The wire bonding mechanisms, failures and
optimization processes are shown to the students during the laboratory session.

4. Data Analysis and Discussion

Basic instruction and explanation on Lab equipment Dage 4000 and High Power Scope
(Olympus and Nikon) with case study: attach with the two wire bond (ball size & ball
height) data sheets (Exercise I and II) collected from Infineon laboratory for the
calculation, analysis and discussion. Exercise III Destructive test Wire Pull Test
collected from Infineon laboratory for the result calculation, analysis and discussion.

5. Laboratory Report Format and Submission

The report should contain the following format:
i. Objectives and motivations
ii. Introduction (to the work on wire bond process)
iii. Theory of the related process, material, equipment, etc.
iv. Procedures of the experiment/process (operation of machine and data collection)
v. Results and Analysis/Discussion (including the calculation, graphs etc.)
vi. Conclusion.
The individual lab report PT2: Wire Bond Laboratory must be submitted on/before 25
September 2017. Please submit the report into Dr. Yous pigeonhole at FET dean office.

11